CN114346473A - Laser cutting method for optical filter - Google Patents
Laser cutting method for optical filter Download PDFInfo
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- CN114346473A CN114346473A CN202210030604.5A CN202210030604A CN114346473A CN 114346473 A CN114346473 A CN 114346473A CN 202210030604 A CN202210030604 A CN 202210030604A CN 114346473 A CN114346473 A CN 114346473A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 200
- 238000003698 laser cutting Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000005520 cutting process Methods 0.000 claims abstract description 183
- 238000003384 imaging method Methods 0.000 claims description 17
- 238000005259 measurement Methods 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 12
- 230000010287 polarization Effects 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000013001 point bending Methods 0.000 description 2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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Abstract
The invention discloses a laser cutting method for cutting an optical filter, which comprises the following steps: s1, pasting a UV film on the carrier on the carrying platform and pasting and covering the optical filter to be cut; s2, adjusting the relative position of the focusing head and the optical filter to enable the laser emitted by the focusing head to be focused on the upper surface of the optical filter; s3, acquiring a transverse thickness compensation curve of the optical filter on a transverse cutting path; s4, controlling the optical box to emit laser and move the carrier along the transverse cutting path to start cutting, and driving the focusing head to perform height compensation according to the transverse thickness compensation curve until transverse cutting is completed; s5, acquiring a longitudinal thickness compensation curve of the optical filter on a longitudinal cutting path; and S6, controlling the optical box beside the focusing head to emit laser and move the carrier along the longitudinal cutting path to start cutting, and driving the focusing head to perform height compensation according to the longitudinal thickness compensation curve until the longitudinal cutting is completed. The cutting depth is ensured to be consistent with the thickness of the optical filter all the time, so that the cutting effect is improved.
Description
Technical Field
The invention relates to the technical field of laser cutting, in particular to a laser cutting method for an optical filter.
Background
The most key technology for processing the ultrathin and ultra-brittle coated glass is a laser scribing technology, and in recent years, due to the gradual hardening of industrial competition, the requirements on the efficiency and the precision of scribing equipment are higher and higher, the requirements on microcracks of the ultrathin and ultra-brittle coated glass are changed from uncontrolled mode to the mode that the current stable mass production is less than or equal to 10um, the SD layer difference is less than 30um, the stress is more than 150MPA, the strain is more than 3000u, and the strain difference is less than 30%.
When the optical filter is cut by using laser, a laser focus is usually focused on the upper surface of the optical filter and the optical filter is cut according to a preset cutting path. It will be readily appreciated that each filter will have a different thickness. The thickness of the laser beam changes, and the cutting depth of the laser beam needs to be correspondingly changed. A laser cutting method and a laser cutting system with application number "201810294061.1" provide a cutting method for obtaining the thickness of an optical filter through a sensor so as to correspondingly adjust the laser cutting depth.
However, the above laser cutting method still has the following problems:
1. the surface of the filter is not a perfectly flat plane and its thickness varies along the cutting path. If the cutting is focused according to the same height, the cutting depth is not stable enough, namely the utilization rate of the laser beam is low when the part with small cutting thickness (the thickness of the workpiece to be cut is smaller than the preset cutting depth) is cut, and when the part with thick cutting thickness (the actual thickness of the workpiece to be cut is larger than the preset cutting depth), the optical filter is not completely cut due to the fact that the cutting depth is smaller than the actual thickness, the cutting effect is poor, the problems of NG abnormity and the like of the luminous brightness occur, and the yield of the product is reduced.
2. The actual thickness of the optical filter during the transverse cutting and the longitudinal cutting is also different, and if the optical filter is longitudinally cut, the compensation is performed according to the cutting thickness of the optical filter on the transverse cutting path, the cutting depth is not stable enough, and the yield of the product is reduced.
Disclosure of Invention
The invention overcomes the defects in the prior art, and provides a laser cutting method for cutting an optical filter, which obtains the actual thickness error of the optical filter on a transverse cutting path through the measurement of a height gauge, obtains a transverse thickness compensation curve according to the actual thickness error, drives a focusing head to move along the thickness direction of the optical filter for height compensation through the transverse thickness compensation curve in the transverse cutting process, obtains the actual thickness error of the optical filter on a longitudinal cutting path through the measurement of the height gauge, obtains a longitudinal thickness compensation curve according to the actual thickness error, and drives the focusing head to move along the thickness direction of the optical filter for height compensation through the longitudinal thickness compensation curve in the longitudinal cutting process, so that the cutting depth is always consistent with the actual thickness of the optical filter, and the cutting effect is improved.
The technical scheme of the invention is realized as follows:
a laser cutting method for an optical filter comprises the following steps:
s1, pasting a UV film on a carrier table, pasting a filter to be cut on the UV film, and marking off a transverse cutting path on the filter according to the actual edge-coiling path;
s2, adjusting the relative position of the focusing head and the optical filter above the carrier to make the laser emitted by the focusing head focused on the upper surface of the optical filter; meanwhile, the reading of the height indicator beside the focusing head is cleared according to the Z-axis value of the focus position at the moment;
s3, acquiring an actual sheet thickness error of the optical filter on a transverse cutting path and obtaining a transverse thickness compensation curve according to the actual sheet thickness error;
s4, controlling an optical box beside the focusing head to emit laser, focusing the laser through the focusing head to fall on the upper surface of the optical filter or to a set cutting depth, and moving the carrier along a transverse cutting path to start cutting; a driving motor acting on the focusing head in the cutting process drives the focusing head to move along the thickness direction of the optical filter according to the transverse thickness compensation curve to perform height compensation, so that the laser focus emitted by the focusing head always falls on the upper surface of the optical filter or is focused to a set cutting depth until the transverse cutting on the optical filter is completed;
s5, dividing a longitudinal cutting path on the optical filter, repeating the step S2, obtaining an actual thickness error of the optical filter on the longitudinal cutting path, and obtaining a longitudinal thickness compensation curve according to the actual thickness error;
s6, controlling an optical box beside the focusing head to emit laser, focusing the laser through the focusing head to fall on the upper surface of the optical filter or to a set cutting depth, and moving the carrier along a longitudinal cutting path to start cutting; and the driving motor acting on the focusing head in the cutting process drives the focusing head to move along the thickness direction of the optical filter according to the longitudinal thickness compensation curve to perform height compensation, so that the laser focus emitted by the focusing head always falls on the upper surface of the optical filter or is focused to a set cutting depth until the longitudinal cutting on the optical filter is completed.
In a further embodiment, the specific steps of S3 are as follows: transversely moving the carrier to enable the focus of the light beam emitted by the focusing head to fall on the part, which is not covered with the optical filter, of the UV film, and measuring the height by using a height measuring instrument to obtain an actual sheet thickness error; and moving the carrier transversely along the transverse cutting path, continuously measuring the actual thickness error by the height gauge, and obtaining a transverse thickness compensation curve according to the actual thickness error.
Because the actual thickness error of the optical filter on the transverse cutting path is obtained in S3, a transverse thickness compensation curve is obtained according to the actual thickness error, and the driving motor acting on the focusing head in the subsequent S4 cutting process drives the focusing head to move along the thickness direction of the optical filter according to the transverse thickness compensation curve for height compensation, the cutting depth can be ensured to be consistent with the corresponding thickness of the optical filter, and the cutting effect is improved.
In a further embodiment, the specific steps of S5 are as follows: dividing a longitudinal cutting path on the optical filter, repeating the step S2, longitudinally moving the carrier to enable the focus of the light beam emitted by the focusing head to fall on the part, which is not covered with the optical filter, of the UV film, and measuring the height by using a height measuring instrument to obtain an actual thickness error of the optical filter; and moving the carrier along the longitudinal cutting path, and continuously measuring the actual thickness error by the height gauge and obtaining a longitudinal thickness compensation curve according to the actual thickness error.
Because the actual thickness error of the optical filter on the longitudinal cutting path is obtained in the S5, the transverse thickness compensation curve is obtained according to the actual thickness error, and the driving motor acting on the focusing head in the subsequent S6 cutting process drives the focusing head to move along the thickness direction of the optical filter according to the longitudinal thickness compensation curve for height compensation, the cutting depth can be ensured to be consistent with the corresponding thickness of the optical filter, and the cutting effect is improved.
In a further scheme, the specific step of obtaining the actual sheet thickness error by the height measurement of the height indicator is to substitute a numerical value obtained by the height measurement of the height indicator into a formula to obtain the actual sheet thickness error, wherein the formula is as follows: (A + B)/2/C = D, wherein A is a sheet thickness difference value which is a numerical value obtained by adding a focus error value and a zero point error value on a film to a value measured by a height gauge when a light beam focus emitted by a focusing head falls on a part of a UV film which is not covered by a light filter; b is the value measured by the height gauge, C is the refractive index of the optical filter, and D is the actual sheet thickness error.
And (4) clearing the reading of the height indicator beside the focusing head in S2, so that the focus of the light beam emitted by the focusing head falls on the part of the UV film which is not covered by the optical filter, and the height of the height indicator is measured to obtain a value B. However, it is easy to understand that the heights of the positions of the stage are different, and when the filter thickness is measured, the height difference of each position of the stage is calculated by adding the height difference of each position of the stage, which is a fixed value, and a value can be measured before the filter thickness is calculated. Similarly, the focal positions of the UV film and the filter are different, and the difference is a fixed value, which needs to be introduced for calculation when measuring the thickness of the filter. Meanwhile, the optical filter has a certain reflectivity C, the value C is also a fixed value, and the value C needs to be added for calculation when the thickness of the optical filter is measured, so that the accuracy of the actual thickness error of the optical filter is ensured, the cutting depth on a cutting path can be ensured to be consistent with the corresponding thickness of the optical filter, and the cutting effect is improved.
In a further embodiment, the specific steps of S2 are as follows: the coaxial focus light source above the light gathering head is controlled to emit light beams, so that the light beams pass through a target lens arranged below the coaxial focus light source and fall on the optical filter for imaging after being focused by the focusing head, then the imaging on the optical filter is observed through a coaxial observation device above the light gathering head, the relative position of the focusing head above the carrier and the optical filter is adjusted until the imaging on the optical filter is observed clearly, the laser emitted by the focusing head can be focused on the upper surface of the optical filter, and meanwhile, the reading of a height measuring instrument beside the focusing head is cleared.
The coaxial focus light source emits light beams, so that the light beams pass through the target lens arranged below the coaxial focus light source and fall on the optical filter for imaging after being focused by the focusing head, an operator can judge whether the laser emitted by the focusing head can be focused on the upper surface of the optical filter or not by observing whether the imaging on the optical filter is clear or not, and the operation is more convenient and accurate.
In a further scheme, the outgoing laser of the optical box beside the focusing head is controlled to be annular light beams in S4 and S6, the optical box is provided with a laser light source, a cone lens and a plano-convex lens, the laser light source is used for emitting light beams, the cone lens is used for receiving the light beams emitted by the laser light source and adjusting the light beams to be annular light beams, and the plano-convex lens is used for receiving the annular light beams adjusted by the cone lens and enabling the light beams emitted by the plano-convex lens to be focused on the focusing head.
The light beam emitted by the laser light source is adjusted through the cone lens to obtain the annular light beam, the annular light beam has higher focal depth and smaller divergence angle under the same light beam diameter, the three-point bending strength and the stress difference after the optical filter is cut can be improved when the annular light beam is used for subsequent laser cutting, and the section extension lines can reach the state without microcracks.
In a further aspect, in S4, before controlling the optical box beside the focusing head to emit the laser, and focusing the laser via the focusing head onto the upper surface of the optical filter and moving the carrier along the transverse cutting path to start cutting, the method further includes adjusting the beam power of the laser emitted from the optical box beside the focusing head to meet the requirement of the width of the modified layer of the cut optical filter.
In a further scheme, the specific steps of adjusting the beam power of the laser emitted by the optical box beside the focusing head are as follows: and adjusting the aperture size of an iris diaphragm positioned between the conical lens and the plano-convex lens in the optical box so as to adjust the beam power of the laser transmitted by the plano-convex lens.
In a further scheme, the specific steps of adjusting the beam power of the laser emitted by the optical box beside the focusing head are as follows: and adjusting the distance between the iris diaphragm and the conical lens so as to adjust the beam power of the laser transmitted by the plano-convex lens.
In a further scheme, a second moving seat and a first moving seat are arranged on the carrying platform, the second moving seat is arranged on the carrying platform and can move along the longitudinal direction, the first moving seat is arranged on the second moving seat and can move in the transverse direction, the carrier is arranged on the first moving seat, a rotary driving component is arranged on the first moving seat, the rotary driving component acts on the carrier and is used for driving the carrier to rotate around the center of the carrier, and the transverse cutting path is the same as the feeding path of the first moving seat; the step of S5 further comprises the following steps before repeating the step of S2: and controlling the rotary driving assembly to drive the carrier to rotate, so that the longitudinal cutting path rotates to be overlapped with the preset transverse cutting path.
Because the weight of first removal seat and carrier all acts on the second removes on the seat, only bear the weight of carrier on the first removal seat, the load that first removal seat so is lighter than the second certainly, the first removal seat moving speed will be faster than the second certainly, after rotating the carrier through the rotary driving subassembly then, subsequent thick error of measuring piece and cutting all drive the carrier through first removal seat and remove, its moving speed is faster, has just shortened man-hour, has improved work efficiency.
The design starting point, the idea and the beneficial effects of the invention adopting the technical scheme are as follows:
1. since the UV film is attached to the carrier and the filter is further disposed in the carrier in S1, the carrier can be reused.
2. Because the actual thickness error of the optical filter on the transverse cutting path is obtained in S3, a transverse thickness compensation curve is obtained according to the actual thickness error, and the driving motor acting on the focusing head in the subsequent S4 cutting process drives the focusing head to move along the thickness direction of the optical filter according to the transverse thickness compensation curve for height compensation, the cutting depth can be ensured to be consistent with the corresponding thickness of the optical filter, and the cutting effect is improved.
3. And in S5, the actual thickness error of the optical filter in the longitudinal cutting path is obtained again and a longitudinal thickness compensation curve is obtained according to the actual thickness error. It is easy to understand that the transverse cutting path and the longitudinal cutting path are not the same path, and the actual sheet thickness error of the optical filter on the longitudinal cutting path is obtained again for compensation, so that the cutting depth on the longitudinal cutting path can be ensured to be consistent with the corresponding thickness of the optical filter, and the cutting effect is improved.
4. And (4) clearing the reading of the height indicator beside the focusing head in S2, so that the focus of the light beam emitted by the focusing head falls on the part of the UV film which is not covered by the optical filter, and the height of the height indicator is measured to obtain a value A. However, it is easy to understand that the thicknesses of the UV parts are different, when the thickness of the filter is measured, the thickness difference B of the UV is added for calculation, the thickness difference B of the UV is a fixed value, and the value B can be measured before the thickness of the filter is calculated. Meanwhile, the optical filter has a certain reflectivity C, the value C is also a fixed value, and the value C needs to be added for calculation when the thickness of the optical filter is measured, so that the accuracy of the actual thickness error of the optical filter is ensured, the cutting depth on a cutting path can be ensured to be consistent with the corresponding thickness of the optical filter, and the cutting effect is improved.
Drawings
FIG. 1 is a schematic structural diagram of a light-emitting device;
FIG. 2 is a top view of a light extraction device;
FIG. 3 is a cross-sectional view A-A of FIG. 2;
FIG. 4 is a front view and a partial enlarged view of the cutting apparatus;
FIG. 5 is a schematic view of the cutting device;
FIG. 6 is a schematic view of the cutting apparatus;
FIG. 7 is a partial schematic view of a cutting apparatus;
fig. 8 is a flowchart of a laser cutting method for an optical filter.
The figures are numbered: 1-a carrier, 2-a frame, 3-a base, 4-a focusing head, 5-a first reflector group, 6-a beam expander, 7-a second reflector group, 8-a power adjusting mechanism, 801-a glass slide component, 802-a polarization beam splitter prism, 9-a cone lens, 10-an iris diaphragm, 11-a plano-convex lens, 12-a loading seat, 13-a first sliding table, 14-a second sliding table, 15-a third sliding table, 16-a third reflector group, 17-a second movable seat, 18-a first movable seat, 19-a carrier, 20-a rotary driving component, 21-a mounting seat, 22-a fixed seat, 23-a loading seat, 24-a height indicator, 25-a coaxial focal light source, 26-a target lens, 27-a fourth reflector group, 28-coaxial observation device, 29-vertical driving motor, 30-guide rail, 31-diaphragm ruler.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
The specific embodiment of the invention is as follows:
example (b): as shown in fig. 1 to 7, the present invention provides a cutting apparatus for laser cutting of an optical filter, which includes a carrier 1, wherein a frame 2 is disposed on the carrier 1, and the frame 2 is provided with the light emitting device and a cutting device for cutting in cooperation with the light emitting device.
Referring to fig. 1 and 2, the light-emitting device includes a base 3, and the base 3 is provided with a laser source, a first reflector group 5, a beam expander 6, a second reflector group 7, a power adjusting mechanism 8, a cone lens 9, a light beam adjusting assembly, and a plano-convex lens 11.
The laser light source is used for reflecting a laser beam. The first mirror group 5 includes a plurality of first mirrors, and the light beams emitted from the laser beams are incident on the first mirrors in the first mirror group 5 and are sequentially reflected by the plurality of first mirrors, so that the light beams can be incident into the beam expander 6 in a collimated state. Since the number of the first reflectors and the positions and angles at which the first reflectors are disposed are different, the relative positional relationship among the laser source, the first reflector group 5 and the beam expander 6 changes, and the positional relationship is not the key point of the invention, so the positional relationship is not described, as long as the light beam reflected by the first reflector can be emitted into the beam expander 6 in a collimated state. The light beam incident on the beam expander 6 is collimated and expanded by the beam expander 6 to obtain parallel light. And the beam expander 6 is also used for primarily adjusting the diameter of the light beam, so that the diameter of the light beam is zoomed in and out in a multiplying power mode.
And the collimated light obtained by the beam expansion by the beam expander 6 is incident on the second mirror group 7. The second mirror group 7 includes a plurality of second mirrors that sequentially reflect the light beam so that the light beam can be incident into the power adjustment mechanism 8 in a collimated state.
The power adjusting mechanism 8 in this embodiment includes a slide assembly 801 and a polarization splitting prism 802. Slide assembly 801 includes a half-wave plate and a drive assembly. The half-wave plate is used for receiving the light beam emitted after being reflected by the second reflecting mirror group 7 and changing the polarization direction of the incident light beam. The polarization beam splitter prism 802 is located behind the half-wave plate along the exit direction of the light beam, and the polarization beam splitter prism 802 is used for receiving the light beam adjusted by the half-wave plate and filtering the light beam, thereby realizing the adjustment of the light beam power. As will be readily understood, in the power adjustment mechanism 8, the polarization direction of light is changed by the half-wave plate, and due to the characteristics of the polarization splitting prism 802, P-polarized light among light incident to the polarization splitting prism 802 is transmitted, while S-polarized light is reflected. The driving component acts on the half-wave plate and is used for driving the half-wave plate to deflect so as to change the transmission quantity of the P-polarized light, and therefore the power of the light beam is changed by matching with the polarization beam splitter prism 802. Specifically, the driving assembly is an electric module. More specifically, the electric module can be an electric rotating table, and the half-wave plate is mounted on the electric module and biases itself to change the transmission quantity of the P-polarized light through the action of the electric module, so as to adjust the power of the light beam.
The light beam adjusted by the power adjustment mechanism 8 enters the axicon lens 9. The above-mentioned axicon lens 9, the light beam adjusting assembly and the plano-convex lens 11 are arranged in order along the outgoing direction of the light beam emitted from the power adjusting mechanism 8. The light beam incident on the axicon lens 9 is adjusted into an annular light beam by the axicon lens 9 and then emitted. The annular light beam has higher focal depth and smaller divergence angle under the same light beam diameter, the three-point bending strength and stress difference after the optical filter is cut can be improved when the annular light beam is used for subsequent laser cutting, and the cross section extension lines can reach the state without microcracks.
The beam adjusting component can receive the annular beam adjusted by the cone lens 9 and change the beam diameter of the annular beam. Specifically, the light beam adjusting assembly comprises an iris diaphragm 10, and an aperture on the iris diaphragm 10 is opposite to the cone lens 9. The beam diameter of the annular beam can be changed by only changing the size of the aperture on the iris diaphragm 10, which is convenient and fast. And the aperture adjustment precision of the iris diaphragm 10 is relatively high. For example, the beam diameter can be adjusted by an optical path element such as the beam expander 6, but the adjustment can be performed only at a magnification of 1 time, 2 times, or 3 times. The iris diaphragm 10 can be adjusted with a finer precision like 2.5 times. The obtained beam diameter is more in line with the subsequent cutting requirements, and the subsequent cutting effect is relatively better. Since the depth of focus of the cutting beam is in direct proportion to the diameter of the laser beam incident on the beam shaping element. This iris diaphragm 10 cooperates above-mentioned beam expander 6 to constitute the secondary regulation of beam diameter, and in the regulation through beam expander 6, the rethread iris diaphragm 10 carries out the fine tuning for beam diameter accords with the cutting demand more.
The plano-convex lens 11 receives the ring-shaped light beam adjusted by the light beam adjusting assembly and makes the light beam emitted through the plano-convex lens 11 focused. The cutting device comprises a focusing head 4, and laser emission power of the focusing head 4 is opposite to the lower carrying platform 1. The light beam emitted from the plano-convex lens 11 enters the focusing head 4 to be focused and cuts the optical filter on the stage 1. And the light beam emitted from the plano-convex lens 11 can be incident into the focusing head 4. The cutting device further comprises a third reflector group 16, the third reflector group 16 comprises a plurality of third reflectors, and the light beams emitted from the plano-convex lens 11 enter the third reflector group 16, are reflected one by the plurality of third reflectors and finally enter the focusing head 4.
In the present embodiment, the axicon lens 9, the iris diaphragm 10 and the planoconvex lens 11 are all slidably disposed on the base 3, and each of the axicon lens 9, the iris diaphragm 10 and the planoconvex lens 11 can move toward or away from the other two components.
As a specific implementation manner, as shown in fig. 3, in this scheme, a loading seat 12 is disposed on a base 3, a first sliding table 13, a second sliding table 14 and a third sliding table 15 are sequentially disposed on the loading seat 12 along a length direction of the loading seat, and the first sliding table 13, the second sliding table 14 and the third sliding table 15 can all slide along the length direction of the loading seat 12 and stay at a designated position. And the axicon lens 9 is arranged on a first sliding table 13, the iris diaphragm 10 is arranged on a second sliding table 14, and the plano-convex lens 11 is arranged on a third sliding table 15. In order to enable the first sliding table 13, the second sliding table 14 and the third sliding table 15 to slide along the length direction of the loading base 12 and stay at a specified position, jackscrews are mounted on the first sliding table 13, the second sliding table 14 and the third sliding table 15.
In the scheme, the cone lens 9, the iris diaphragm 10 and the plano-convex lens 11 can be arranged on the base 3 in a sliding manner, so that the light beams can be adjusted by moving the elements. When the axicon lens 9 or the iris diaphragm 10 is moved, the distance between the axicon lens 9 and the iris diaphragm 10 is changed. It is easy to understand that the light is dispersed, and the closer the cone lens 9 is to the variable diaphragm 10, the less the light is dispersed, and the larger the power of the adjusted light beam. When the distance between the cone lens 9 and the flat lens is changed by moving the cone lens 9 or the plano-convex lens 11, the width of the modified layer after cutting can be changed, so that the cutting effect is improved.
As shown in fig. 6, the cutting apparatus further comprises a second mobile station 17 and a first mobile station 18. Wherein the second movable base 17 is arranged on the carrier 1 and can move along the longitudinal direction, the first movable base 18 is arranged on the second movable base 17 and can move along the transverse direction, and the first movable base 18 is provided with a carrier 19 for fixing the optical filter. And the first movable seat 18 is further provided with a rotary driving assembly 20, and the rotary driving assembly 20 acts on the carrier 19 for driving the carrier 19 to rotate around the center thereof. Specifically, the second movable base 17 and the first movable base 18 are linear motor modules. The rotary driving assembly 20 includes a rotary driving motor and a rotary driving platform, the carrier 19 is mounted on the rotary driving platform, and the rotary driving motor is connected with the rotary driving platform to drive the carrier 19 to rotate around its center.
As shown in fig. 4 and 5, the frame 2 is further provided with a mounting seat 21, and the mounting seat 21 is provided with a fixing seat 22 and a bearing seat 23. The focusing head 4 is mounted on a carrier 23, and the third mirror group 16 is mounted on the fixed base 22. The fixed seat 22 and the mounting seat 21 are both fixed relative to the frame 2, so that the positional relationship between the third mirror group 16 on the fixed seat 22 and the mirror group on the base 3 is always fixed. And the bearing seat 23 is also provided with a height indicator 24 and a focus observation assembly. The focus observation assembly comprises a coaxial focus light source 25, the coaxial focus light source 25 and the focus observation assembly are positioned on one side of the focusing head 4, and the light emitting device is positioned on the opposite side of the focusing head 4. The focus observation assembly further includes a target lens 26 and a fourth mirror group 27, the target lens 26 is installed below the coaxial focus light source 25, and the fourth mirror group 27 is installed on the bearing seat 23 and is used for receiving the light beam emitted from the coaxial focus light source 25 and passing through the target lens 26, and refracting the light beam for multiple times, so that the light beam can be incident to the focusing head 4, and fall on the optical filter for imaging after being focused by the focusing head 4.
The cutting apparatus also includes a coaxial viewing device 28. Specifically, the coaxial observation device 28 is a coaxial illumination observation device, and the specific model adopted by the coaxial illumination observation device in the embodiment is OUCI-F100-XY. A coaxial viewing device 28 is mounted on the carrier 23 above the focusing head 4.
In addition, a vertical moving assembly is further disposed on the fixing base 22, and acts on the bearing seat 23 to drive the bearing seat 23 to move along a vertical direction (i.e., a Z-axis direction). Specifically, as shown in fig. 7, the vertical moving assembly includes a vertical driving motor 29, a lead screw is connected to the vertical driving motor 29, the lead screw extends in the vertical direction, a nut is screwed onto the lead screw, and the nut is fixedly connected to the bearing seat 23. And the side of the lead screw on the fixed seat 22 is also provided with a guide rail 30, the guide rail 30 extends along the length direction of the lead screw, and a sliding block is slidably arranged on the guide rail 30 and is fixedly connected with the bearing seat 23. Bear the seat 23 simultaneously and still be equipped with the sensor that is used for detecting focus head 4 height on the Z axle, this sensor is diaphragm chi 31 in this scheme.
When the optical filter is to be cut, the carrier 19 is first pasted with the UV film, and the optical filter to be cut is pasted on the UV film to avoid the damage of the carrier 19. The carrier 19 is then moved to the position to be cut under the focusing head 4 by the second movable base 17 and the first movable base 18. And then dividing a transverse cutting path on the filter according to the actual circle edge path. The focusing head 4 and the altimeter 24 are both located on the transverse cutting path. Then, the relative position of the focusing head 4 above the stage 1 and the optical filter is adjusted, so that the laser emitted by the focusing head 4 can be focused on the upper surface of the optical filter.
Specifically, at this time, the light beam is emitted from the coaxial focus light source 25, passes through the target lens 26, is reflected by the fourth mirror group 27, is incident on the focusing head 4, is focused by the focusing head 4, and falls on the optical filter for imaging. The on-axis viewing device 28 is then used to observe whether the image on the filter is clear. If the imaging is sharp, no adjustment is required. If the image is not clear, the vertical driving assembly drives the bearing seat 23 to move on the Z axis, so that the coaxial observation device 28 can observe the image on the filter clearly. And then, the reading of the height indicator 24 beside the focusing head 4 is cleared according to the Z-axis value of the focus position at the moment.
Then, the carrier 19 is transversely moved through the first moving seat 18, so that the focus of the light beam emitted by the focusing head 4 falls on the part, which is not covered with the optical filter, of the UV film, and the height of the height measuring instrument 24 is measured to obtain an actual sheet thickness error; and the carrier 19 is moved transversely along the transverse cutting path, the height gauge 24 continuously measures the actual sheet thickness error and obtains a transverse thickness compensation curve according to the actual sheet thickness error. It should be noted that, here, the specific way in which the altimeter 24 continuously measures the actual sheet thickness error and obtains the lateral thickness compensation curve according to the actual sheet thickness error is as follows: (a + B) ÷ 2 ÷ C = D, wherein a is a sheet thickness difference value obtained by adding an on-film focus measurement error value and a zero point error value to a value measured by the height gauge 24 when the focal point of the light beam emitted from the focusing head 4 falls on a portion of the UV film not covered with the optical filter; b is the value measured by the height gauge 24, C is the refractive index of the optical filter, and D is the actual sheet thickness error. Since the height gauge 24 continuously measures the actual sheet thickness error, which is the actual sheet thickness error at a certain point on the optical filter, a lateral thickness compensation curve can be formed because a large number of actual sheet thickness errors at a certain point are obtained by measurement.
Since the reading of the height indicator 24 beside the focusing head 4 is cleared in S2, the focus of the light beam emitted from the focusing head 4 falls on the part of the UV film not covered by the filter, and the height of the height indicator 24 is measured to obtain a value B. However, it is easy to understand that the heights of the positions of the stage 1 are different, and when the filter thickness is measured, the height difference of each position of the stage 1 is calculated by adding the height difference of each position of the stage 1, which is a fixed value, and a value can be measured before the filter thickness is calculated. Similarly, the focal positions of the UV film and the filter are different, and the difference is a fixed value, which needs to be introduced for calculation when measuring the thickness of the filter. Meanwhile, the optical filter has a certain reflectivity C, the value C is also a fixed value, and the value C needs to be added for calculation when the thickness of the optical filter is measured, so that the accuracy of the actual thickness error of the optical filter is ensured, the cutting depth on a cutting path can be ensured to be consistent with the corresponding thickness of the optical filter, and the cutting effect is improved.
And then, controlling the optical box beside the focusing head 4 to emit laser, focusing the laser through the focusing head 4 to fall on the upper surface of the optical filter or to fall to a set cutting depth, and moving the carrier 19 along a transverse cutting path to start cutting. And the vertical moving component acting on the focusing head 4 in the cutting process drives the focusing head 4 to move along the thickness direction of the optical filter according to the transverse thickness compensation curve to perform height compensation, so that the laser focus emitted by the focusing head 4 always falls on the upper surface of the optical filter or is focused to a set cutting depth until the transverse cutting on the optical filter is completed.
Since the filter needs to be cut into a cross shape. The carrier 19 is now rotated by the rotational drive assembly 20, rotating the carrier 19 by 90 °. And dividing a longitudinal cutting path on the optical filter. Since the carrier 19 is rotated by 90 °, the longitudinal cutting path at this point is in fact coincident with the longitudinal cutting path described above. And then, the steps are repeated to measure a longitudinal thickness compensation curve, and the optical box beside the focusing head 4 is controlled to emit laser, and the laser is focused by the focusing head 4 to fall on the upper surface of the optical filter or is focused to a set cutting depth, and the carrier 19 is moved along a longitudinal cutting path to start cutting. And the vertical moving component acting on the focusing head 4 in the cutting process drives the focusing head 4 to move along the thickness direction of the optical filter according to the longitudinal thickness compensation curve to perform height compensation, so that the laser focus emitted by the focusing head 4 always falls on the upper surface of the optical filter or is focused to a set cutting depth until the longitudinal cutting on the optical filter is completed. And finally, cutting the optical filter.
Based on the above cutting apparatus, as shown in fig. 8, the present embodiment also provides a laser cutting method for cutting an optical filter, which includes the following steps:
s1, pasting a UV film on the carrier 19 on the carrier 1, pasting a filter to be cut on the UV film, and marking out a transverse cutting path on the filter according to the actual circle edge path;
s2, adjusting the relative position of the focusing head 4 and the optical filter above the carrier 1, so that the laser emitted by the focusing head 4 can be focused on the upper surface of the optical filter; meanwhile, the reading of the height indicator 24 beside the focusing head 4 is cleared according to the Z-axis value of the focus position;
s3, acquiring an actual sheet thickness error of the optical filter on a transverse cutting path and obtaining a transverse thickness compensation curve according to the actual sheet thickness error;
s4, controlling an optical box beside the focusing head 4 to emit laser, focusing the laser through the focusing head 4 to fall on the upper surface of the optical filter or to a set cutting depth, and moving the carrier 19 along a transverse cutting path to start cutting; in the cutting process, a driving motor acting on the focusing head 4 drives the focusing head 4 to move along the thickness direction of the optical filter according to the transverse thickness compensation curve to perform height compensation, so that a laser focus emitted by the focusing head 4 always falls on the upper surface of the optical filter or is focused to a set cutting depth until transverse cutting on the optical filter is completed;
s5, dividing a longitudinal cutting path on the optical filter, repeating the step S2, obtaining an actual thickness error of the optical filter on the longitudinal cutting path, and obtaining a longitudinal thickness compensation curve according to the actual thickness error;
s6, controlling an optical box beside the focusing head 4 to emit laser, focusing the laser through the focusing head 4 to fall on the upper surface of the optical filter or to a set cutting depth, and moving the carrier 19 along a longitudinal cutting path to start cutting; and the driving motor acting on the focusing head 4 in the cutting process drives the focusing head 4 to move along the thickness direction of the optical filter according to the longitudinal thickness compensation curve to perform height compensation, so that the laser focus emitted by the focusing head 4 always falls on the upper surface of the optical filter or is focused to a set cutting depth until the longitudinal cutting on the optical filter is completed.
The specific steps of S2 are as follows: controlling a coaxial focus light source 25 above the focusing head to emit light beams, enabling the light beams to pass through a target lens 26 arranged below the coaxial focus light source 25, enabling the light beams to be focused by the focusing head 4 and then fall on an optical filter for imaging, then observing the imaging on the optical filter through a coaxial observation device above the focusing head, and adjusting the relative position of the focusing head 4 above the carrier 1 and the optical filter until the imaging on the optical filter is observed clearly, so that the laser emitted by the focusing head 4 can be focused on the upper surface of the optical filter, and meanwhile, clearing the reading of a height measuring instrument 24 beside the focusing head 4. The coaxial focus light source 25 emits light beams, so that the light beams pass through the target lens 26 arranged below the coaxial focus light source 25 and are focused by the focusing head 4 and then fall on the optical filter for imaging, and an operator can judge whether the laser emitted by the focusing head 4 can be focused on the upper surface of the optical filter by observing whether the imaging on the optical filter is clear or not, so that the laser imaging device is more convenient and accurate.
The specific steps of S3 are as follows: moving the carrier 19 transversely to make the focus of the light beam emitted by the focusing head 4 fall on the part of the UV film which is not covered by the optical filter, measuring the height by the height measuring instrument 24 to obtain a numerical value, and substituting the numerical value obtained by measuring the height by the height measuring instrument 24 into a formula to obtain an actual sheet thickness error, wherein the formula is as follows: (a + B) ÷ 2 ÷ C = D, wherein a is a sheet thickness difference value obtained by adding an on-film focus measurement error value and a zero point error value to a value measured by the height gauge 24 when the focal point of the light beam emitted from the focusing head 4 falls on a portion of the UV film not covered with the optical filter; b is the value measured by the height gauge 24, C is the refractive index of the optical filter, and D is the actual sheet thickness error. And then, the carrier 19 is transversely moved along the transverse cutting path, the height measuring instrument 24 continuously measures the actual thickness error of the sheet and obtains a transverse thickness compensation curve according to the actual thickness error of the sheet.
The specific steps of S5 are as follows: the longitudinal cutting path is marked on the optical filter. The rotary driving assembly 20 is controlled to drive the carrier 19 to rotate, so that the longitudinal cutting path is rotated to be coincident with the preset transverse cutting path. And repeating the step S2, and moving the carrier 19 longitudinally so that the focus of the light beam emitted from the focusing head 4 falls on the part of the UV film not covered by the optical filter, measuring the height by the height gauge 24 to obtain a numerical value, and substituting the numerical value obtained by measuring the height by the height gauge 24 into a formula to obtain an actual sheet thickness error, where the formula is: (a + B) ÷ 2 ÷ C = D, wherein a is a sheet thickness difference value obtained by adding an on-film focus measurement error value and a zero point error value to a value measured by the height gauge 24 when the focal point of the light beam emitted from the focusing head 4 falls on a portion of the UV film not covered with the optical filter; b is the value measured by the height gauge 24, C is the refractive index of the optical filter, and D is the actual sheet thickness error. Subsequently, the carrier 19 is moved along the longitudinal cutting path, and the height gauge 24 continuously measures the actual thickness error and obtains a longitudinal thickness compensation curve according to the actual thickness error.
In this embodiment, the laser beams emitted from the optical box beside the control focusing head 4 in S4 and S6 are annular beams, the optical box is provided with a laser source, an axicon lens 9 and a plano-convex lens 11, wherein the laser source is configured to emit a light beam, the axicon lens 9 is configured to receive the light beam emitted from the laser source and adjust the light beam into an annular beam, and then emit the annular beam, and the plano-convex lens 11 is configured to receive the annular beam adjusted by the axicon lens 9 and enable the light beam emitted through the plano-convex lens 11 to be focused by the focusing head 4. In S4, before controlling the optical box beside the focusing head 4 to emit laser, and focusing the laser via the focusing head 4 onto the upper surface of the optical filter and moving the carrier 19 along the transverse cutting path to start cutting, the method further includes adjusting the beam power of the laser emitted from the optical box beside the focusing head 4 to meet the requirement of the width of the modified layer of the cut optical filter.
In this embodiment, the specific steps of adjusting the beam power of the laser beam emitted from the optical box beside the focusing head 4 are as follows: the aperture size of an iris diaphragm 10 positioned between an axicon lens 9 and a plano-convex lens 11 in the optical box is adjusted so as to adjust the beam power of the laser light transmitted by the plano-convex lens 11. Of course, the distance between the iris diaphragm 10 and the axicon lens 9 may be adjusted to adjust the beam power of the laser light transmitted by the planoconvex lens 11.
In addition, the power of the emergent light beam of the laser light source can be adjusted. Or the beam expander 6 can be adjusted at first and then fine-tuned by the iris diaphragm 10, so that the beam diameter is more in line with the cutting requirement. Or the rotation angle of the half-wave plate is adjusted to match the polarization beam splitter prism 802 for adjusting the beam power.
The present invention and its embodiments have been described above schematically, without limitation, and what is shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if the person skilled in the art receives the teaching, without departing from the spirit of the invention, the person skilled in the art shall not inventively design the similar structural modes and embodiments to the technical solution, but shall fall within the scope of the invention.
Claims (10)
1. A laser cutting method for cutting an optical filter is characterized by comprising the following steps: s1, pasting a UV film on a carrier table, pasting a filter to be cut on the UV film, and marking off a transverse cutting path on the filter according to the actual edge-coiling path; s2, adjusting the relative position of the focusing head and the optical filter above the carrier to make the laser emitted by the focusing head focused on the upper surface of the optical filter; meanwhile, the reading of the height indicator beside the focusing head is cleared according to the Z-axis value of the focus position at the moment; s3, acquiring an actual sheet thickness error of the optical filter on a transverse cutting path and obtaining a transverse thickness compensation curve according to the actual sheet thickness error; s4, controlling an optical box beside the focusing head to emit laser, focusing the laser through the focusing head to fall on the upper surface of the optical filter or to a set cutting depth, and moving the carrier along a transverse cutting path to start cutting; a driving motor acting on the focusing head in the cutting process drives the focusing head to move along the thickness direction of the optical filter according to the transverse thickness compensation curve to perform height compensation, so that the laser focus emitted by the focusing head always falls on the upper surface of the optical filter or is focused to a set cutting depth until the transverse cutting on the optical filter is completed; s5, dividing a longitudinal cutting path on the optical filter, repeating the step S2, obtaining an actual thickness error of the optical filter on the longitudinal cutting path, and obtaining a longitudinal thickness compensation curve according to the actual thickness error; s6, controlling an optical box beside the focusing head to emit laser, focusing the laser through the focusing head to fall on the upper surface of the optical filter or to a set cutting depth, and moving the carrier along a longitudinal cutting path to start cutting; and the driving motor acting on the focusing head in the cutting process drives the focusing head to move along the thickness direction of the optical filter according to the longitudinal thickness compensation curve to perform height compensation, so that the laser focus emitted by the focusing head always falls on the upper surface of the optical filter or is focused to a set cutting depth until the longitudinal cutting on the optical filter is completed.
2. The laser cutting method for cutting an optical filter according to claim 1, wherein the specific steps of S3 are as follows: transversely moving the carrier to enable the focus of the light beam emitted by the focusing head to fall on the part, which is not covered with the optical filter, of the UV film, and measuring the height by using a height measuring instrument to obtain an actual sheet thickness error; and moving the carrier transversely along the transverse cutting path, continuously measuring the actual thickness error by the height gauge, and obtaining a transverse thickness compensation curve according to the actual thickness error.
3. The laser cutting method for cutting an optical filter according to claim 1, wherein the specific steps of S5 are as follows: dividing a longitudinal cutting path on the optical filter, repeating the step S2, longitudinally moving the carrier to enable the focus of the light beam emitted by the focusing head to fall on the part, which is not covered with the optical filter, of the UV film, and measuring the height by using a height measuring instrument to obtain an actual thickness error of the optical filter; and moving the carrier along the longitudinal cutting path, and continuously measuring the actual thickness error by the height gauge and obtaining a longitudinal thickness compensation curve according to the actual thickness error.
4. The laser cutting method for cutting the optical filter according to claim 2 or 3, wherein the step of obtaining the actual sheet thickness error by the height measurement of the height gauge is to obtain the actual sheet thickness error by substituting a numerical value obtained by the height measurement of the height gauge into a formula: (A + B)/2/C = D, wherein A is a sheet thickness difference value which is a numerical value obtained by adding a focus error value and a zero point error value on a film to a value measured by a height gauge when a light beam focus emitted by a focusing head falls on a part of a UV film which is not covered by a light filter; b is the value measured by the height gauge, C is the refractive index of the optical filter, and D is the actual sheet thickness error.
5. The laser cutting method for cutting an optical filter according to claim 1, wherein the specific steps of S2 are as follows: the coaxial focus light source above the light gathering head is controlled to emit light beams, so that the light beams pass through a target lens arranged below the coaxial focus light source and fall on the optical filter for imaging after being focused by the focusing head, then the imaging on the optical filter is observed through a coaxial observation device above the light gathering head, the relative position of the focusing head above the carrier and the optical filter is adjusted until the imaging on the optical filter is observed clearly, the laser emitted by the focusing head can be focused on the upper surface of the optical filter, and meanwhile, the reading of a height measuring instrument beside the focusing head is cleared.
6. The laser cutting method for cutting optical filter as claimed in claim 1, wherein the optical box beside the control focusing head in S4 and S6 emits laser beams as annular beams, the optical box is provided therein with a laser source for emitting a laser beam, an axicon lens for receiving the laser beam emitted from the laser source and adjusting the laser beam into an annular beam, and a plano-convex lens for receiving the annular beam adjusted by the axicon lens and focusing the laser beam emitted from the plano-convex lens on the focusing head.
7. The method as claimed in claim 6, wherein the step S4, before controlling the optical box beside the focusing head to emit the laser, and focusing the laser through the focusing head to fall on the upper surface of the optical filter and moving the carrier along the transverse cutting path to start cutting, further comprises adjusting a beam power of the laser emitted from the optical box beside the focusing head to meet a requirement of a width of a modified layer of the optical filter after cutting.
8. The laser cutting method for cutting an optical filter according to claim 7, wherein the step of adjusting the beam power of the laser beam emitted from the optical box beside the focusing head comprises: and adjusting the aperture size of an iris diaphragm positioned between the conical lens and the plano-convex lens in the optical box so as to adjust the beam power of the laser transmitted by the plano-convex lens.
9. The laser cutting method for cutting an optical filter according to claim 7, wherein the step of adjusting the beam power of the laser beam emitted from the optical box beside the focusing head comprises: and adjusting the distance between the iris diaphragm and the conical lens so as to adjust the beam power of the laser transmitted by the plano-convex lens.
10. The laser cutting method according to claim 1, wherein a second movable base and a first movable base are provided on the stage, the second movable base is provided on the stage and is movable in a longitudinal direction, the first movable base is provided on the second movable base and is movable in a transverse direction, the carrier is provided on the first movable base, and the first movable base is provided with a rotary driving component acting on the carrier for driving the carrier to rotate around its center, and the transverse cutting path is the same as a feeding path of the first movable base; the step of S5 further comprises the following steps before repeating the step of S2: and controlling the rotary driving assembly to drive the carrier to rotate, so that the longitudinal cutting path rotates to be overlapped with the preset transverse cutting path.
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| CN202210030604.5A CN114346473A (en) | 2022-01-12 | 2022-01-12 | Laser cutting method for optical filter |
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