CN114333975B - Automatic test method, device, system and electronic equipment - Google Patents
Automatic test method, device, system and electronic equipment Download PDFInfo
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Abstract
The application discloses an automatic test method, an automatic test device, an automatic test system and electronic equipment, which are applied to a controller of the automatic test system, wherein the controller is connected with a DDR5 connector arranged on a Memory card to be tested, and the automatic test system also comprises a signal generator, a precise digital ammeter, an electronic load instrument and an oscilloscope; the method comprises the following steps: controlling the electronic load instrument to respond to the pulling load operation and controlling the oscilloscope to perform parameter initialization setting; controlling a precision digital ammeter to acquire PIN foot voltage values of a plurality of Memory cards to be tested at each side through a DDR5 connector, and determining a target Memory card to be tested corresponding to a worst voltage value according to the acquired PIN foot voltage values; controlling the signal generator to carry out dynamic current value pulling on the driving end of the target Memory card to be tested and sweep frequency operation, and controlling the oscilloscope to acquire a voltage value in the sweep frequency operation process; and determining a frequency value and a duty ratio corresponding to the worst voltage value according to the voltage value, and controlling the oscilloscope to perform screen capture and save operation.
Description
Technical Field
The application relates to the technical field of automatic testing, in particular to an automatic testing method, an automatic testing device, an automatic testing system and electronic equipment.
Background
With the continuous development of the internet industry, the demand for servers is increasing. The stability of the supply voltage of the direct current power supply has an important influence on the performance of the server. In the prior art, DDR5 test technology is adopted to measure the power supply stability of the Memory card, but in the existing test process of using DDR5 test technology to measure the power supply stability of the Memory card, the voltage of the worst voltage PIN of the Memory card needs to be manually measured through a precise digital ammeter, then the worst voltage PIN is manually swept through a signal generator to obtain the worst frequency point and the duty ratio, finally an oscilloscope is configured to manually capture the picture and save the test result, and the whole test process is long in time consumption and low in efficiency.
Disclosure of Invention
Therefore, the application aims to overcome the defects of long time consumption and low efficiency of the existing test mode for the power supply stability of the Memory card by adopting the DDR5 test technology, thereby providing an automatic test method, an automatic test device, an automatic test system and electronic equipment.
According to a first aspect, an embodiment of the present application discloses an automatic test method, applied to a controller of an automatic test system, where the controller is connected to a DDR5 connector installed on a Memory card to be tested, the automatic test system further includes a signal generator, a precision digital ammeter, an electronic load meter, and an oscilloscope, where the signal generator, the precision digital ammeter, the electronic load meter, and the oscilloscope are respectively connected to the DDR5 connector and the controller; the method comprises the following steps: controlling the electronic load instrument to respond to the pulling load operation and controlling the oscilloscope to perform parameter initialization setting; controlling a precision digital ammeter to acquire PIN foot voltage values of a plurality of Memory cards to be tested at each side through a DDR5 connector, and determining a target Memory card to be tested corresponding to a worst voltage value according to the acquired PIN foot voltage values; controlling the signal generator to carry out dynamic current value pulling on the driving end of the target Memory card to be tested and sweep frequency operation, and controlling the oscilloscope to acquire a voltage value in the sweep frequency operation process; and determining a frequency value and a duty ratio corresponding to the worst voltage value according to the voltage value, and controlling the oscilloscope to perform screen capture and save operation.
Optionally, before the controlling electronic load instrument responds to the pulling load operation and controls the oscilloscope to perform parameter initialization setting, the method further includes: and acquiring a test report and reading initialization data of the test report.
Optionally, the controlling the precision digital ammeter obtains PIN voltage values of a plurality of Memory cards to be tested at each side through the DDR5 connector, and determines a target Memory card to be tested corresponding to a worst voltage value according to the obtained PIN voltage values, including: recording all the obtained PIN voltage values; acquiring PIN information corresponding to the worst voltage value; and filling the worst voltage value and the PIN information corresponding to the worst voltage value into the appointed position of the test report.
Optionally, the method further comprises: controlling ch1 of the oscilloscope to be connected with a PIN PIN corresponding to the worst voltage value; and controlling the electronic load instrument to pull the constant current value, acquiring the rip value measured on the oscilloscope, and filling the rip value into a designated position of a report.
Optionally, the controlling the signal generator to carry out a dynamic current value on the driving end of the target Memory card to be tested and perform a sweep operation, and controlling the oscilloscope to obtain a voltage value in a sweep operation process includes: according to a preset duty ratio interval and a preset frequency interval, controlling the signal generator to carry out sweep operation according to a preset sweep interval and controlling the oscilloscope to record a voltage value in the sweep operation process; and generating a sweep operation test report.
Optionally, the determining, according to the voltage value, a frequency value and a duty ratio corresponding to the worst voltage value, and controlling the oscilloscope to perform a screen capture and save operation includes: reading the sweep operation test report; sequencing the voltage values in the sweep operation test report to obtain a frequency value and a duty ratio corresponding to the worst voltage value; controlling the oscilloscope to read the voltage value in the sweep operation test report, and controlling the oscilloscope to respond to screen capture and save operation after the waveform is accumulated for a preset number of times; and filling the voltage value read by the oscilloscope to a designated position of a report.
According to a second aspect, the embodiment of the application also discloses an automatic testing device, which is applied to a controller of an automatic testing system, wherein the controller is connected with a DDR5 connector arranged on a Memory card to be tested, the automatic testing system also comprises a signal generator, a precision digital ammeter, an electronic load instrument and an oscilloscope, and the signal generator, the precision digital ammeter, the electronic load instrument and the oscilloscope are respectively connected with the DDR5 connector and the controller; the device comprises: the first control module is used for controlling the electronic load instrument to respond to the load pulling operation and controlling the oscilloscope to perform parameter initialization setting; the second control module is used for controlling the precision digital ammeter to acquire PIN foot voltage values of a plurality of Memory cards to be tested at each side through the DDR5 connector, and determining a target Memory card to be tested corresponding to the worst voltage value according to the acquired PIN foot voltage values; the third control module is used for controlling the signal generator to carry out dynamic current value on the driving end of the target Memory card to be tested and sweep frequency operation, and controlling the oscilloscope to acquire a voltage value in the sweep frequency operation process; and the fourth control module is used for determining a frequency value and a duty ratio corresponding to the worst voltage value according to the voltage value and controlling the oscilloscope to perform screen capture and save operation.
According to a third aspect, the embodiment of the application also discloses an automatic test system, which comprises: the DDR5 connector is used for being installed on a Memory card to be tested; the controller is connected with the DDR5 connector; the signal generator, the precise digital ammeter, the electronic load instrument and the oscilloscope are respectively connected with the DDR5 connector and the controller; the controller is configured to perform the steps of the automatic test method according to the first aspect or any of the alternative embodiments of the first aspect.
According to a fourth aspect, an embodiment of the present application further discloses an electronic device, including: at least one processor; and a memory communicatively coupled to the at least one processor; wherein the memory stores instructions executable by the at least one processor to cause the at least one processor to perform the steps of the automatic test method of the first aspect or any alternative implementation of the first aspect.
According to a fifth aspect, an embodiment of the present application also discloses a computer-readable storage medium, on which a computer program is stored, which computer program, when being executed by a processor, implements the steps of the automatic test method according to the first aspect or any of the alternative embodiments of the first aspect.
The technical scheme of the application has the following advantages:
the application provides an automatic test method/device, which is applied to a controller of an automatic test system, wherein the controller is connected with a DDR5 connector arranged on a Memory card to be tested, a signal generator, a precision digital ammeter, an electronic load meter and an oscilloscope which are arranged in the automatic test system are respectively connected with the DDR5 connector and the controller, the controller controls the electronic load meter to respond to a pulling load operation and controls the oscilloscope to perform parameter initialization setting, the precision digital ammeter obtains PIN foot voltage values of a plurality of Memory cards to be tested at each side through the DDR5 connector, a target Memory card to be tested corresponding to the worst voltage value is determined according to the obtained PIN foot voltage values, the control signal generator pulls the dynamic current value of the driving end of the target Memory card to be tested and performs sweep operation, the oscilloscope is controlled to obtain the voltage value in the sweep operation process, and the frequency value and the duty ratio corresponding to the worst voltage value are determined according to the voltage value and the oscilloscope is controlled to perform screen capture and save operation; compared with the prior art that the power supply stability of the Memory card is tested in a manual mode, the test mode provided by the application has the advantages that the controller is connected with each test component and controls the corresponding test component to complete the test of the Memory card to be tested, so that the automatic test of the Memory card is realized, the test time is saved, and the test efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a specific example of a prior art test system;
FIG. 2 is a flowchart of a specific example of an automatic test method in an embodiment of the present application;
FIG. 3 is a schematic diagram of an exemplary configuration of an automatic test system according to an embodiment of the present application;
FIG. 4 is a functional block diagram of one specific example of an automatic test equipment in an embodiment of the present application;
fig. 5 is a schematic diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the application are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or can be communicated inside the two components, or can be connected wirelessly or in a wired way. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present application described below may be combined with each other as long as they do not collide with each other.
As shown in fig. 1, the conventional Memory card power supply stability test method comprises the following steps:
1. the single CPU has two sets of Memory card slots, requiring two sets of DDR5 test tools. The DDR5 LoadCards are respectively arranged on a Memory card slot, 8 LoadCards with the same number are required to be arranged on the same side as much as possible, one side is a master card, and the other side is a slave card; then 2 MCBs (Main Control Board, a main control board) are respectively connected with Load Cards at two sides, a signal generator outputs Input J2 connected to the master side MCB, the master side 12V Isense J3 is connected to an oscilloscope ch2, and the oscilloscope ch1 is a high-voltage differential probe;
2. the method comprises the steps that 11 pairs of Load lines are led to an electronic Load instrument at the Memory card slots on two sides, load Cards are connected with the electronic Load instrument, load Cards are evenly pulled and loaded on each side, and 11 Load Cards need to be pulled and loaded by one CPU, and positive and negative inaugurable errors need to be noted in the connection process;
3. checking whether a short circuit exists or not and connecting a place with a fault, powering up an electronic load instrument after the checking is finished, powering up 2 VR boards after the checking is finished, and turning on a switch on the VR boards, wherein a green light of the VR boards is on at the moment; the motherboard is then powered up, 2 MCBs are powered up, the dial switch sw2.4=on, sw2.1=off, the 12V channel is on, low gain. The Load Cards are all selected on corresponding to the Card Enable dial switch;
4. after connection is completed, firstly, loading DC Current by using an electronic load instrument, respectively measuring the voltages of a master pin and a slave pin of 12V Vsense by using a precision digital ammeter, recording the pin of the measured minimum voltage, and then measuring and recording the voltage mean value and the pk-pk value of the test point of the minimum voltage by using a high-voltage differential probe (connected to an oscilloscope ch 1).
5. Loading Starting Current with E-load by an electronic load instrument, using a precision digital ammeter, and using the same method in the step 4), finding test points of the minimum voltage and the maximum voltage, and recording the minimum voltage and the maximum voltage respectively;
6. electronic loaders load Starting Current with E-load, 0A using signal generators ～ (cutting Current-Starting Current) A Current, placing a high-voltage differential probe at a test point for measuring the minimum voltage to sweep, measuring V_droop, and recording frequency points, duty ratio and voltage value; and then the high-voltage differential probe is placed at a test point where the maximum voltage is measured for frequency sweep, and V_overshoot is measured and recorded to a report.
7. After the manual recording is completed, the signal generator is turned off, the load instrument is off, all the Card Enable dial switches are selected to be off, the SW 2.4=off, the main Board is powered off, the power switch on the VR Board is turned off, and the VR Board is powered off at 12V. And after the discharge is completed, the Load Cards are dismantled.
The existing test method is complicated in wiring process in the test process, particularly when a plurality of Memory cards are required to be tested simultaneously, and when the worst voltage point is judged, the voltage value of the PIN PINs corresponding to 8 cards at each side is required to be manually measured, so that the efficiency is low; after the corresponding PIN of the worst voltage point is determined, a signal generator is required to be used for carrying out manual frequency sweep, so that the corresponding frequency and duty ratio are determined, the labor hour and the labor are consumed, and the oscilloscope is configured to store the screenshot and the test result cannot be automatically stored. Therefore, in order to solve the above technical problems, the embodiment of the application provides an automatic test method, which specifically comprises the following steps:
the embodiment of the application discloses an automatic test method which is applied to a controller of an automatic test system, wherein the controller is connected with a DDR5 connector arranged on a Memory card to be tested, the automatic test system also comprises a signal generator, a precision digital ammeter, an electronic load instrument and an oscilloscope, wherein the signal generator, the precision digital ammeter, the electronic load instrument and the oscilloscope are respectively connected with the DDR5 connector and the controller; specifically, the automatic test system in the embodiment of the application may include a controller, an oscilloscope, a PCB Board with VRTT, an electronic Load meter, a precision digital ammeter, a high voltage differential probe, DDR5 Load Cards 16, main Control Board x 2, a Regulator Board 2, I2C Cables 1, 10-pin Power Cables 2, SMA to SMA cable, BNC to SMA cable, and the like.
In the automatic test system shown in fig. 3, the controller is respectively in communication connection with the electronic load instrument, the signal generator, the DDR5 connector, the precision digital ammeter and the oscilloscope through the USB-GPIB, the electronic load instrument is connected with the Memory card to be tested through a load line, and the oscilloscope is connected with the Memory card to be tested through a probe. Before automatic testing, preparing a PCB board of a VRTT to be tested, installing 16 Memory cards on the board to be tested according to specifications to form Memory cards to be tested, respectively installing MCB and DRR5 connectors on each 8 Memory cards to be tested, and installing DDR5 connectors on the MCB, wherein the DDR5 connectors are connected with all PIN PINs of 12V and 3V3 on the MCB. All automatic control programs needed in the test process are integrated in the controller of the automatic test system in advance, and corresponding components are controlled to respond to the automatic test operation through the controller through the communication connection relation in the system which is built in advance.
As shown in fig. 2, the method comprises the steps of:
step 201, controlling an electronic load instrument to respond to a pulling load operation and controlling an oscilloscope to perform parameter initialization setting;
the controller controls the electronic load instrument to carry a specified constant current value through the USB-GPIB, the size of the constant current value is not limited, and a person skilled in the art can determine the constant current value according to actual testing requirements.
As an optional embodiment of the present application, before step 201, the method further includes: and acquiring a test report and reading initialization data of the test report. The test report may be uploaded by the user through an interactive system of the automatic test system or a pre-stored test report may be directly read from a memory of the automatic test system, which is not limited by the method of acquiring the test report according to the embodiment of the present application.
Step 202, controlling a precision digital ammeter to acquire PIN foot voltage values of a plurality of Memory cards to be tested on each side through a DDR5 connector, and determining a target Memory card to be tested corresponding to a worst voltage value according to the acquired PIN foot voltage values;
the controller controls the precision digital ammeter to measure the voltages of all the connection PINs through the DDR5 connector, records the obtained voltage values, and then compares the voltage values of the 12V PIN with the voltage values of the 3V PIN to obtain the worst voltage value and the corresponding PIN information, wherein the worst voltage value is the maximum voltage value and/or the minimum voltage value exceeding the Memory card power supply stability voltage range.
Step 203, a control signal generator pulls a dynamic current value to a driving end of a target Memory card to be tested and carries out sweep operation, and an oscilloscope is controlled to acquire a voltage value in the sweep operation process;
illustratively, when the control signal generator pulls the designated dynamic current value, the current value is read by the oscilloscope, and RiseTime and FallTime are adjusted, so that the pulling precision is ensured. After the pulling load current value is determined, the controller controls the signal generator to carry out automatic sweep frequency of the worst voltage point, the duty ratio of the sweep frequency in the embodiment of the application is from 10% to 90%, the frequency is from 1KHz to 1MHz, the frequency sweep interval is 0.5KHz, and the voltage values corresponding to 1K,1.5K and 2K to 1MHz are recorded.
And 204, determining a frequency value and a duty ratio corresponding to the worst voltage value according to the voltage value, and controlling the oscilloscope to perform screen capture and save operation.
The electronic loader is used for carrying the Memory card to be tested, the carrying of the Memory card to be tested is involved in the testing process, the worst voltage value is obtained, and meanwhile, a static current value is also carried by the Memory card to be tested in the frequency sweeping process, and the carrying process is controlled by the controller through the USB-GPIB; after the worst voltage value and the corresponding Memory card to be tested are determined, the control signal generator pulls the dynamic current value at the driving end of the Memory card to be tested, and the pulling process is controlled by the controller through the USB-GPIB. The signal generator carries out frequency sweep after pulling the dynamic current value, the duty ratio is from 10% to 90%, and the frequency range is from 1KHz to 1MHz; the oscilloscope acquires a pulling load current value and feeds back the pulling load current value to the controller, meanwhile, in the process of carrying out frequency sweeping by the signal generator, the measured voltage value is acquired and fed back to the controller, the process is controlled by the controller, and after the worst frequency point and the duty ratio are finally determined, the controller captures and stores the test result through the oscilloscope.
The application provides an automatic test method, which is applied to a controller of an automatic test system, wherein the controller is connected with a DDR5 connector arranged on a Memory card to be tested, a signal generator, a precision digital ammeter, an electronic load meter and an oscilloscope which are arranged in the automatic test system are respectively connected with the DDR5 connector and the controller, the controller controls the electronic load meter to respond to a pulling load operation and controls the oscilloscope to perform parameter initialization setting, the precision digital ammeter is controlled to acquire PIN foot voltage values of a plurality of Memory cards to be tested at each side through the DDR5 connector, a target Memory card to be tested corresponding to the worst voltage value is determined according to the acquired PIN foot voltage values, the signal generator is controlled to pull the dynamic current value of the driving end of the target Memory card to be tested and perform sweep operation, the oscilloscope is controlled to acquire the voltage value in the sweep operation process, and the frequency value and the duty ratio corresponding to the worst voltage value are determined according to the voltage value, and the oscilloscope is controlled to perform screen saving operation; compared with the prior art that the power supply stability of the Memory card is tested manually, the method provided by the application has the advantages that the controller is connected with each test component and controls the corresponding test component to complete the test of the Memory card to be tested, so that the automatic test of the Memory card is realized, the test time is saved, and the test efficiency is improved.
As an alternative embodiment of the present application, step 202 includes: recording all the obtained PIN voltage values; acquiring PIN information corresponding to the worst voltage value; filling the worst voltage value and the PIN information corresponding to the worst voltage value into the appointed position of the test report.
As an alternative embodiment of the present application, the method further comprises: the ch1 of the control oscilloscope is connected with a PIN PIN corresponding to the worst voltage value; and controlling the electronic load instrument to pull the constant current value, acquiring the rip value measured on the oscilloscope, and filling the rip value into the appointed position of the report.
Illustratively, the controller obtains the worst voltage value and automatically fills out the worst voltage value to the report designated position; meanwhile, the oscilloscope ch1 is controlled to be connected with a PIN PIN with minimum and/or maximum voltage values, a load meter pulls a constant current value, and a rip value measured on the oscilloscope is obtained and filled in a report designated position.
As an alternative embodiment of the present application, step 203 includes: according to a preset duty ratio interval and a preset frequency interval, controlling a signal generator to perform frequency sweep operation according to a preset frequency sweep interval and controlling an oscilloscope to record a voltage value in the frequency sweep operation process; and generating a sweep operation test report.
As an alternative embodiment of the present application, step 204 includes: reading a sweep operation test report; sequencing the voltage values in the sweep frequency operation test report to obtain a frequency value and a duty ratio corresponding to the worst voltage value; the control oscilloscope reads the voltage value in the sweep frequency operation test report, and controls the oscilloscope to respond to screen capture and save operation after the waveform is accumulated for a preset number of times; and filling the voltage value read by the oscilloscope to the appointed position of the report. By way of example, in the embodiment of the application, the preset times are 500 times of waveform accumulation and then the screen capture storage operation is responded, and the pull-load stabilizing time is reserved by responding to the screen capture operation after the waveform accumulation reaches 500 times, so that the accuracy of the captured waveform is ensured; and filling out the maximum and minimum voltage values read by the oscilloscope to the appointed position of the report. After the screen capture preservation is finished, the controller controls the electronic load instrument to unload, the signal generator to unload, and the test is finished.
As a specific embodiment of the application, the test mode of the automatic test system combined with the design is as follows:
1. connecting a PCB board of the VRTT to be tested with the DDR5 jig by a connecting method of the prior art, and installing a DDR5 connector on the MCB, wherein the DDR5 connector is connected with all PIN PINs of 12V and 3V3 on the MCB;
2. the controller controls the electronic load instrument to carry a specified constant current value through the USB-GPIB;
3. the controller controls the precise digital ammeter to quantitatively acquire the voltages of all PIN PINs through the DDR5 connector, acquires and records voltage values, and then compares the voltage values of 12V and 3V3 respectively to acquire worst voltage values and corresponding PIN PIN information;
4. the controller acquires the worst voltage value and automatically fills the worst voltage value to a report appointed position; simultaneously controlling an oscilloscope ch1 to be connected with a PIN (personal identification number) PIN of a minimum and/or maximum voltage value, pulling and loading a constant current value by a load meter, acquiring a rip value measured on the oscilloscope, and filling the rip value into a report designated position;
5. the controller controls the electronic load instrument to pull and load a designated constant current value, and simultaneously controls the signal generator to pull and load a designated dynamic response, and the current value is read through the oscilloscope during pulling and loading, so that RiseTime and FallTime are adjusted, and pulling and loading precision is ensured;
6. after the pulling load current value is determined, the controller controls the signal generator to perform automatic frequency sweeping of the worst voltage point. The duty ratio of the sweep frequency is from 10% to 90%, the frequency is from 1KHz to 1MHz, the frequency sweep frequency interval is 0.5KHz, the voltage value of the change interval from 1K to 1MHz is recorded, and an Excel test data report is generated;
7. the controller reads the sweep frequency test data report, sorts the voltage values, and obtains the frequency and the duty ratio corresponding to the minimum and/or maximum voltage value;
8. the controller controls the signal generator to set the frequency and the duty ratio obtained in the step 7, simultaneously controls the oscilloscope to read the corresponding voltage value, stores the screenshot after the waveform is accumulated for 500 times, and fills the voltage value read by the oscilloscope to the appointed position of the report;
9. the controller controls the load instrument to unload, the signal generator to unload, and the test is finished.
According to the automatic test method provided by the embodiment of the application, automatic comparison is realized through the designed automatic test system, and after the worst voltage point is determined, the frequency sweep of the worst frequency and the duty ratio is automatically carried out, the screenshot of the test result is automatically completed, and the test data report is stored and synchronously generated.
The embodiment of the application also discloses an automatic testing device, as shown in fig. 4, which is applied to a controller of an automatic testing system, wherein the controller is connected with a DDR5 connector arranged on a Memory card to be tested, and the automatic testing system also comprises a signal generator, a precision digital ammeter, an electronic load instrument and an oscilloscope, wherein the signal generator, the precision digital ammeter, the electronic load instrument and the oscilloscope are respectively connected with the DDR5 connector and the controller; the device comprises:
the first control module 301 is configured to control the electronic load meter to respond to the load pulling operation and control the oscilloscope to perform parameter initialization setting;
the second control module 302 is configured to control the precision digital ammeter to obtain PIN voltage values of a plurality of Memory cards to be tested on each side through the DDR5 connector, and determine a target Memory card to be tested corresponding to a worst voltage value according to the obtained PIN voltage values;
the third control module 303 is configured to control the signal generator to carry a dynamic current value on the driving end of the target Memory card to be tested and perform a frequency sweep operation, and control the oscilloscope to obtain a voltage value in the frequency sweep operation process;
and the fourth control module 304 is configured to determine a frequency value and a duty ratio corresponding to the worst voltage value according to the voltage value, and control the oscilloscope to perform screen capture and save operation.
The application provides an automatic testing device, which is applied to a controller of an automatic testing system, wherein the controller is connected with a DDR5 connector arranged on a Memory card to be tested, a signal generator, a precision digital ammeter, an electronic load meter and an oscilloscope which are arranged in the automatic testing system are respectively connected with the DDR5 connector and the controller, the controller controls the electronic load meter to respond to a pulling load operation and controls the oscilloscope to perform parameter initialization setting, the precision digital ammeter to acquire PIN foot voltage values of a plurality of Memory cards to be tested at each side through the DDR5 connector, a target Memory card to be tested corresponding to the worst voltage value is determined according to the acquired PIN foot voltage values, the signal generator is controlled to pull the dynamic current value of the driving end of the target Memory card to be tested and perform sweep operation, the oscilloscope is controlled to acquire the voltage value in the sweep operation process, and the frequency value and the duty ratio corresponding to the worst voltage value are determined according to the voltage value, and the oscilloscope is controlled to perform screen interception and preservation operation; compared with the prior art that the power supply stability of the Memory card is tested manually, the testing mode provided by the embodiment of the application has the advantages that the controller is connected with each testing component and controls the corresponding testing component to complete the testing of the Memory card to be tested, so that the automatic testing of the Memory card is realized, the testing time is saved, and the testing efficiency is improved.
As an alternative embodiment of the present application, the method further comprises: the first acquisition module is used for acquiring the test report and reading the initialization data of the test report.
As an alternative embodiment of the present application, the second control module includes: the recording submodule is used for recording all the acquired PIN voltage values; the acquisition sub-module is used for acquiring PIN information corresponding to the worst voltage value; and the first filling sub-module is used for filling the worst voltage value and the PIN information corresponding to the worst voltage value to the designated position of the test report.
As an alternative embodiment of the present application, the apparatus further comprises: the fifth control module is used for controlling the connection of the ch1 of the oscilloscope and the PIN corresponding to the worst voltage value; and the sixth control module is used for controlling the electronic load instrument to pull the constant current value, acquiring the rip value measured on the oscilloscope and filling the rip value into the appointed position of the report.
As an alternative embodiment of the present application, the third control module includes: the first control submodule is used for controlling the signal generator to perform sweep operation according to a preset frequency sweep interval and controlling the oscilloscope to record a voltage value in the sweep operation process according to a preset duty cycle interval and a preset frequency interval; and the generating sub-module is used for generating a sweep frequency operation test report.
As an alternative embodiment of the present application, the fourth control module includes: the reading sub-module is used for reading the sweep frequency operation test report; the frequency sweep sub-module is used for sequencing the voltage values in the frequency sweep operation test report to obtain a frequency value and a duty ratio corresponding to the worst voltage value; the second control submodule is used for controlling the oscilloscope to read the voltage value in the sweep frequency operation test report, and controlling the oscilloscope to respond to screen capture and save operation after the waveform is accumulated for a preset number of times; and the second filling sub-module is used for filling the voltage value read by the oscilloscope to the appointed position of the report.
The embodiment of the application also provides an automatic test system, as shown in fig. 3, comprising:
the DDR5 connector is used for being installed on a Memory card to be tested;
the controller is connected with the DDR5 connector;
the system comprises a signal generator, a precision digital ammeter, an electronic load instrument and an oscilloscope, wherein the signal generator, the precision digital ammeter, the electronic load instrument and the oscilloscope are respectively connected with a DDR5 connector and a controller;
the controller is configured to perform the steps of the automatic test method as in the above embodiments. With specific reference to the foregoing embodiments, details are not repeated herein.
According to the automatic test system provided by the embodiment of the application, an electronic load meter is controlled by a controller to respond to a pulling load operation and an oscilloscope is controlled to perform parameter initialization setting, a precise digital ammeter is controlled to acquire PIN foot voltage values of a plurality of Memory cards to be tested at each side through a DDR5 connector, a target Memory card to be tested corresponding to a worst voltage value is determined according to the acquired PIN foot voltage values, a signal generator is controlled to pull a dynamic current value to a driving end of the target Memory card to be tested and perform a sweep operation, the oscilloscope is controlled to acquire a voltage value in the sweep operation process, a frequency value and a duty ratio corresponding to the worst voltage value are determined according to the voltage value, and the oscilloscope is controlled to perform screen capture and save operation; compared with the prior art that the power supply stability of the Memory card is tested manually, the testing mode provided by the embodiment of the application has the advantages that the controller is connected with each testing component and controls the corresponding testing component to complete the testing of the Memory card to be tested, so that the automatic testing of the Memory card is realized, the testing time is saved, and the testing efficiency is improved.
The embodiment of the present application further provides an electronic device, as shown in fig. 5, where the electronic device may include a processor 401 and a memory 402, where the processor 401 and the memory 402 may be connected by a bus or other means, and in fig. 5, the connection is exemplified by a bus.
The processor 401 may be a central processing unit (Central Processing Unit, CPU). The processor 401 may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), field programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or combinations thereof.
The memory 402 is used as a non-transitory computer readable storage medium for storing non-transitory software programs, non-transitory computer executable programs, and modules, such as program instructions/modules corresponding to the automatic test method in the embodiments of the present application. The processor 401 executes various functional applications of the processor and data processing by running non-transitory software programs, instructions and modules stored in the memory 402, i.e., implementing the automatic test method in the method embodiments described above.
Memory 402 may include a storage program area that may store an operating system, at least one application program required for functionality, and a storage data area; the storage data area may store data created by the processor 401, or the like. In addition, memory 402 may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, memory 402 may optionally include memory located remotely from processor 401, such remote memory being connectable to processor 401 through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The one or more modules are stored in the memory 402 and when executed by the processor 401, perform the automatic test method in the embodiment shown in fig. 1.
The specific details of the electronic device may be understood correspondingly with respect to the corresponding related descriptions and effects in the embodiment shown in fig. 1, which are not repeated herein.
It will be appreciated by those skilled in the art that implementing all or part of the above-described embodiment method may be implemented by a computer program to instruct related hardware, where the program may be stored in a computer readable storage medium, and the program may include the above-described embodiment method when executed. Wherein the storage medium may be a magnetic Disk, an optical Disk, a Read-Only Memory (ROM), a random access Memory (RandomAccessMemory, RAM), a Flash Memory (Flash Memory), a Hard Disk (HDD), a Solid State Drive (SSD), or the like; the storage medium may also comprise a combination of memories of the kind described above.
Although embodiments of the present application have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the application, and such modifications and variations are within the scope of the application as defined by the appended claims.
Claims (10)
1. The automatic test method is characterized by being applied to a controller of an automatic test system, wherein the controller is connected with a DDR5 connector arranged on a Memory card to be tested, the automatic test system further comprises a signal generator, a precision digital ammeter, an electronic load instrument and an oscilloscope, and the signal generator, the precision digital ammeter, the electronic load instrument and the oscilloscope are respectively connected with the DDR5 connector and the controller; the method comprises the following steps:
controlling the electronic load instrument to respond to the pulling load operation and controlling the oscilloscope to perform parameter initialization setting;
controlling a precision digital ammeter to acquire PIN foot voltage values of a plurality of Memory cards to be detected at each side through a DDR5 connector, and determining a target Memory card to be detected corresponding to a worst voltage value according to the acquired PIN foot voltage values, wherein the worst voltage value is a maximum voltage value and/or a minimum voltage value exceeding a Memory card power supply stability voltage range;
controlling the signal generator to carry out dynamic current value pulling on the driving end of the target Memory card to be tested and sweep frequency operation, and controlling the oscilloscope to acquire a voltage value in the sweep frequency operation process;
and determining a frequency value and a duty ratio corresponding to the worst voltage value according to the voltage value, and controlling the oscilloscope to perform screen capture and save operation.
2. The method of claim 1, wherein before controlling the electronic load meter to respond to the load operation and controlling the oscilloscope to perform the parameter initialization setting, the method further comprises:
and acquiring a test report and reading initialization data of the test report, wherein the test report is uploaded by a user through an interactive system of the automatic test system or is directly read from a memory of the automatic test system.
3. The method according to claim 2, wherein the controlling the precision digital ammeter obtains PIN voltage values of a plurality of Memory cards to be tested on each side through the DDR5 connector, and determines a target Memory card to be tested corresponding to a worst voltage value according to the obtained PIN voltage values, including:
recording all the obtained PIN voltage values;
acquiring PIN information corresponding to the worst voltage value;
and filling the worst voltage value and the PIN information corresponding to the worst voltage value into the appointed position of the test report.
4. A method according to claim 3, further comprising:
controlling ch1 of the oscilloscope to be connected with a PIN PIN corresponding to the worst voltage value;
and controlling the electronic load instrument to pull the constant current value, acquiring the rip value measured on the oscilloscope, and filling the rip value into a designated position of a report.
5. The method of claim 1, wherein the controlling the signal generator to carry the dynamic current value on the driving end of the target Memory card to be measured and perform the sweep operation, and controlling the oscilloscope to obtain the voltage value in the sweep operation process, includes:
according to a preset duty ratio interval and a preset frequency interval, controlling the signal generator to carry out sweep operation according to a preset sweep interval and controlling the oscilloscope to record a voltage value in the sweep operation process;
and generating a sweep operation test report.
6. The method of claim 5, wherein determining a frequency value and a duty cycle corresponding to a worst voltage value according to the voltage value and controlling the oscilloscope to perform a screen capture saving operation comprises:
reading the sweep operation test report;
sequencing the voltage values in the sweep operation test report to obtain a frequency value and a duty ratio corresponding to the worst voltage value;
controlling the oscilloscope to read the voltage value in the sweep operation test report, and controlling the oscilloscope to respond to screen capture and save operation after the waveform is accumulated for a preset number of times;
and filling the voltage value read by the oscilloscope to a designated position of a report.
7. The automatic testing device is characterized by being applied to a controller of an automatic testing system, wherein the controller is connected with a DDR5 connector arranged on a Memory card to be tested, the automatic testing system further comprises a signal generator, a precision digital ammeter, an electronic load instrument and an oscilloscope, and the signal generator, the precision digital ammeter, the electronic load instrument and the oscilloscope are respectively connected with the DDR5 connector and the controller; the device comprises:
the first control module is used for controlling the electronic load instrument to respond to the load pulling operation and controlling the oscilloscope to perform parameter initialization setting;
the second control module is used for controlling the precision digital ammeter to acquire PIN foot voltage values of a plurality of Memory cards to be tested at each side through the DDR5 connector, and determining a target Memory card to be tested corresponding to a worst voltage value according to the acquired PIN foot voltage values, wherein the worst voltage value is a maximum voltage value and/or a minimum voltage value exceeding a Memory card power supply stability voltage range;
the third control module is used for controlling the signal generator to carry out dynamic current value on the driving end of the target Memory card to be tested and sweep frequency operation, and controlling the oscilloscope to acquire a voltage value in the sweep frequency operation process;
and the fourth control module is used for determining a frequency value and a duty ratio corresponding to the worst voltage value according to the voltage value and controlling the oscilloscope to perform screen capture and save operation.
8. An automatic test system comprising:
the DDR5 connector is used for being installed on a Memory card to be tested;
the controller is connected with the DDR5 connector;
the signal generator, the precise digital ammeter, the electronic load instrument and the oscilloscope are respectively connected with the DDR5 connector and the controller;
the controller is adapted to perform the steps of the automatic test method according to any one of claims 1-6.
9. An electronic device, comprising: at least one processor; and a memory communicatively coupled to the at least one processor; wherein the memory stores instructions executable by the at least one processor to cause the at least one processor to perform the steps of the automatic test method of any of claims 1-6.
10. A computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the steps of the automatic test method according to any one of claims 1-6.
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| CN112904254A (en) * | 2021-01-22 | 2021-06-04 | 苏州浪潮智能科技有限公司 | Upper computer system for Memory VRTT dynamic response test and working method thereof |
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| US11624780B2 (en) * | 2018-02-21 | 2023-04-11 | Huawei Technologies Co., Ltd. | System and method for receiver equalization and stressed eye testing methodology for DDR5 memory controller |
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| CN112485700A (en) * | 2020-11-24 | 2021-03-12 | 苏州浪潮智能科技有限公司 | Automatic testing system and method for server power conversion module |
| CN112904254A (en) * | 2021-01-22 | 2021-06-04 | 苏州浪潮智能科技有限公司 | Upper computer system for Memory VRTT dynamic response test and working method thereof |
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