CN114325349A - Temperature calibration method, instrument and system based on laser test - Google Patents
Temperature calibration method, instrument and system based on laser test Download PDFInfo
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- CN114325349A CN114325349A CN202210244333.3A CN202210244333A CN114325349A CN 114325349 A CN114325349 A CN 114325349A CN 202210244333 A CN202210244333 A CN 202210244333A CN 114325349 A CN114325349 A CN 114325349A
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Abstract
The embodiment of the application discloses temperature calibration method, instrument and system based on laser instrument test, and the temperature calibration method provided by the application can be applied to the temperature calibration instrument, wherein a temperature control port of the temperature calibration instrument is electrically connected with a heating element inside a clamp, the clamp clamps a laser instrument chip to be tested, a specially-made alloy object is placed at a preset position of the laser instrument chip to be tested, and the method comprises the following steps: acquiring a test temperature to be calibrated of the laser chip to be calibrated, wherein the test temperature to be calibrated is a preset test temperature to be reached when the laser chip to be calibrated is tested, and the test temperature to be calibrated is the same as the melting point of a special alloy object; outputting temperature control information to a heating element inside the clamp through a temperature control port to heat the clamp; detecting whether the specially-made alloy object is molten or not; and when the special alloy object is detected to be melted, acquiring the current temperature of the clamp. The embodiment of the application aims to improve the accuracy of temperature measurement of the laser chip to be measured during aging test.
Description
Technical Field
The application relates to the technical field of chip testing, in particular to a temperature calibration method, instrument and system based on laser testing.
Background
In order to ensure the quality and reliability of a chip, an early failure chip is usually screened out through an aging test after the chip is manufactured, the chip aging test usually adopts high-temperature power to age the chip, temperature stress and electrical stress in the chip aging process are key indexes of the aging test, and the data must be guaranteed to be real and reliable.
Chip-on-ceramic (COC) packaging stage on a ceramic substrate, when laser chip aging test is carried out, because the laser chip size is very small, the traditional temperature probe is larger than the laser chip itself and can not directly measure the temperature of the laser chip, therefore, the temperature in the aging process of the laser chip is often monitored indirectly through the temperature of a test fixture, but because in the aging test process, the laser chip itself is an electrified heating body, heat can be transferred from the laser chip to the fixture, certain temperature difference can exist between the fixture and the laser chip, therefore, the temperature measurement value of the fixture needs to be calibrated, and the temperature difference is compensated.
The temperature difference between the fixture and the laser chip is influenced by many factors such as the material of the fixture, the material of the substrate of the laser chip, the temperature of the fixture and the like, and data obtained by theoretical derivation and experience is unreliable.
Disclosure of Invention
The embodiment of the application provides a temperature calibration method, an instrument and a system based on laser testing, and the temperature calibration method is convenient for improving the accuracy of temperature measurement of a laser chip to be tested during aging testing.
On the one hand, the application provides a temperature calibration method based on laser instrument test, is applied to the temperature calibration instrument, the control by temperature change port and the inside heating element electricity of anchor clamps of temperature calibration instrument are connected, the laser instrument chip that awaits measuring of anchor clamps centre gripping, purpose-built alloy article has been placed to the preset position of the laser instrument chip that awaits measuring, the method includes: obtaining a test temperature to be calibrated of the laser chip to be calibrated, wherein the test temperature to be calibrated is a preset test temperature to be reached when the laser chip to be calibrated is tested, and the test temperature to be calibrated is the same as the melting point of the special alloy object; outputting temperature control information to a heating element inside the clamp through the temperature control port to heat the clamp; detecting whether the specially-made alloy object is melted; when the specially-made alloy object is detected to be melted, acquiring the current temperature of the clamp; and obtaining the temperature difference to be calibrated through the current temperature and the melting point of the specially-made alloy object, wherein the temperature difference to be calibrated is the temperature difference between the clamp and the laser chip to be calibrated when the laser chip to be calibrated reaches the test temperature.
In some embodiments of the present application, the detection port of the temperature calibration instrument is electrically connected to a test probe, the tip of which is suspended a predetermined distance above the specially-made alloy article; the detecting whether the specially-made alloy object is molten comprises: detecting whether a level signal is present on the test probe through the detection port; if a level signal is detected to exist on the test probe, the purpose-made alloy object is judged to be melted; and if no level signal exists on the test probe, judging that the specially-made alloy object is not melted. The embodiment of the application makes full use of the characteristic of solid-liquid phase conversion of the metal alloy, the metal alloy can form spherical liquid drops under the action of surface tension after being converted into the liquid state, and the solid-liquid phase conversion of the metal alloy is sensed by obtaining level signals through the contact of the test probe and the liquid drops.
In some embodiments of the present application, before outputting temperature control information to the heat-generating element inside the clamp through the temperature control port, the method further comprises: acquiring a heating configuration strategy; and generating temperature control information according to the configuration strategy.
In some embodiments of the present application, the positive electrode powered probe is in contact with the positive electrode of the laser chip to be tested, the negative electrode powered probe is in contact with the negative electrode of the laser chip to be tested, and the positive electrode powered probe and the negative electrode powered probe are respectively electrically connected to the chip driving port of the temperature calibration instrument; prior to said detecting whether said tailored alloy article is molten, said method further comprising: and controlling the positive electrode energizing probe and the negative electrode energizing probe to apply preset driving current to the laser chip to be tested through the chip driving port. The embodiment of the application applies the driving current to the laser chip to be tested, and further simulates the test environment of the chip to be tested under the current, so that the calculated temperature difference is more accurate.
In some embodiments of the present application, a calibration port of the temperature calibration instrument is electrically connected to a memory chip inside the fixture; after said obtaining a temperature difference to be calibrated by said current temperature and a melting point of said tailored alloy article, said method further comprising: generating calibration data, the calibration data comprising at least one of: the temperature difference to be calibrated, the test temperature to be calibrated, the type of the laser chip to be calibrated, the preset driving current and the current temperature of the clamp; and transmitting the calibration data to the clamp through the calibration port so that a memory chip of the clamp stores the calibration data. The embodiment of the application can realize the automatic input of the calibration data, so that when the laser chip to be tested is subjected to the aging test, the data are directly called from the clamp used by the aging test, and the calibration is carried out.
In another aspect, the present application provides a temperature calibration instrument based on laser testing, the temperature calibration instrument comprising: the acquisition module is used for acquiring the test temperature to be calibrated of the laser chip to be tested; a special alloy object is placed at a preset position of the laser chip to be calibrated, the temperature to be calibrated is a preset testing temperature to be reached when the laser chip to be calibrated is tested, and the melting point of the testing temperature to be calibrated is the same as that of the special alloy object; the temperature control module is used for outputting temperature control information to a heating element in the clamp through a temperature control port of the temperature calibration instrument so as to heat the clamp; the temperature control port of the temperature calibration instrument is used for being electrically connected with a heating element in the clamp, and the clamp is used for clamping the laser chip to be tested; the detection module is used for detecting whether the specially-made alloy object is molten or not; the recording module is used for acquiring the current temperature of the clamp when the specially-made alloy object is detected to be molten; and the calibration module is used for obtaining a temperature difference to be calibrated through the current temperature and the melting point of the specially-made alloy object, wherein the temperature difference to be calibrated is the temperature difference between the clamp and the laser chip to be calibrated when the laser chip to be calibrated reaches the test temperature.
In some embodiments of the present application, the temperature calibration instrument further comprises: the drive module is used for controlling the anode energizing probe and the cathode energizing probe to apply preset drive current to the chip through a chip drive port of the temperature calibration instrument, wherein the chip drive port of the temperature calibration instrument is used for being respectively electrically connected with the anode energizing probe and the cathode energizing probe, the anode energizing probe is in contact with the anode of the laser chip to be tested, and the cathode energizing probe is in contact with the cathode of the laser chip to be tested.
In some embodiments of the present application, a detection module is used to detect whether a level signal is present on the test probe through a detection port of the temperature calibration instrument; if a level signal is detected to exist on the test probe, the purpose-made alloy object is judged to be melted; if no level signal exists on the test probe, judging that the specially-made alloy object is not melted; the detection port is used for being connected with a test probe, and the needle point of the test probe is suspended above the specially-made alloy object for a preset distance.
In some embodiments of the present application, the temperature calibration instrument further comprises: calibration means for generating calibration data comprising at least one of: the temperature difference to be calibrated, the test temperature to be calibrated, the type of the laser chip to be calibrated, the preset driving current and the current temperature of the clamp are transmitted to the clamp through a calibration port of the temperature calibration instrument, so that a storage chip of the clamp stores the calibration data; wherein the calibration port is used for electrically connecting with a memory chip inside the clamp.
In the embodiment of the application, the clamp is used for clamping the laser chip to be tested so as to simulate the test environment of the laser chip to be tested in the test process, the specially-made alloy object is placed at the preset position of the chip, the specially-made alloy object is contacted with the chip, so that the temperature of the laser chip to be measured is equal to the melting point of the special alloy object when the special alloy object melts, because the melting point of the special alloy object is the testing temperature to be calibrated, when the special alloy object melts, the laser chip to be tested reaches the testing temperature, therefore, the temperature difference to be calibrated can be obtained through the temperature of the current clamp and the melting point of the special alloy object, therefore, the temperature difference which needs to be compensated by the clamp when the laser chip to be tested is tested in the actual test environment is accurately obtained, and the accuracy of monitoring the temperature of the laser chip during the aging test is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram illustrating a partial connection of each probe with respect to a laser chip to be tested according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of the connection of the temperature calibration instrument, the fixture, and the probes in the temperature calibration method based on laser testing provided in the embodiments of the present application;
FIG. 3 is a schematic flow chart diagram illustrating an embodiment of a temperature calibration method based on laser testing according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a temperature calibration instrument based on laser testing in an embodiment of the present application;
fig. 5 is a schematic structural diagram of a single chip microcomputer integrated on a temperature calibration instrument based on laser testing in the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be considered as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the application. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present application may be practiced without these specific details. In other instances, well-known structures and processes are not set forth in detail in order to avoid obscuring the description of the present application with unnecessary detail. Thus, the present application is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
It should be noted that, since the method in the embodiment of the present application is executed in the temperature calibration apparatus, the processing objects of each temperature calibration apparatus exist in the form of data or information, for example, time, which is substantially time information, it can be understood that, if the size, the number, the position, and the like are mentioned in the following embodiments, all corresponding data exist, so that the electronic device performs processing, and details are not described herein.
Embodiments of the present application provide a temperature calibration method, an apparatus and a system, which are described in detail below.
Firstly, an embodiment of the present application provides a temperature calibration method based on laser test, where an execution main body of the temperature calibration method is a temperature calibration instrument, a temperature control port of the temperature calibration instrument is electrically connected to a heating element inside a fixture, the fixture clamps a laser chip to be tested, a specially-made alloy object is placed at a preset position of the laser chip to be tested, and the temperature calibration method includes: obtaining a test temperature to be calibrated of the laser chip to be calibrated, wherein the test temperature to be calibrated is a preset test temperature to be reached when the laser chip to be calibrated is tested, and the test temperature to be calibrated is the same as the melting point of the special alloy object; outputting temperature control information to a heating element inside the clamp through a temperature control port to heat the clamp; detecting whether the specially-made alloy object is melted; when the specially-made alloy object is detected to be melted, acquiring the current temperature of the clamp; and obtaining the temperature difference to be calibrated through the current temperature and the melting point of the specially-made alloy object, wherein the temperature difference to be calibrated is the temperature difference between the clamp and the laser chip to be calibrated when the laser chip to be calibrated reaches the test temperature.
In the embodiment of the application, the clamp is used for clamping the laser chip to be tested so as to simulate the test environment of the laser chip to be tested in the test process, the specially-made alloy object is placed at the preset position of the chip and is contacted with the chip, so that the temperature of the laser chip to be tested is equal to the melting point of the specially-made alloy object when the specially-made alloy object melts, and the melting point of the specially-made alloy object is the test temperature to be calibrated, so that when the specially-made alloy object melts, the laser chip to be tested reaches the test temperature, the temperature difference to be calibrated can be obtained through the temperature of the current clamp and the melting point of the specially-made alloy object, and the temperature difference to be compensated for the clamp can be accurately obtained when the laser chip to be tested is in the test environment which is actually tested.
As shown in fig. 1 to 2, fig. 1 is a schematic view of a local connection of each probe with respect to a laser chip to be tested when the clamp clamps the laser chip to be tested, and fig. 2 is a schematic view of a connection between a temperature calibration instrument and the clamp and between each probe in the temperature calibration method according to the embodiment of the present application.
The temperature control port 13 of the temperature calibration instrument 10 of the embodiment of the present application is connected to the heating element 7 inside the fixture 3, the laser chip 1 to be measured is mounted on the fixture 3, and the specially-made alloy object 2 is clamped to a preset position of the chip, where the preset position can also be referred to as a temperature measuring point. The temperature measuring point can be a negative PAD position of the substrate of the laser chip to be measured.
To facilitate the temperature calibration instrument to obtain the temperature of the fixture 3, a temperature controlled probe 8 for measuring the temperature of the fixture 3 may also be connected to a temperature controlled port 13 of the temperature calibration instrument 10.
The melting point of the specially-made alloy object 2 is the same as the testing temperature to be calibrated, the testing temperature to be calibrated is the temperature which needs to be reached by the laser chip to be tested and is preset when the laser chip to be tested is tested, for example, the testing is specifically aging testing, and if the testing temperature which needs to be reached by the laser chip is set to be 50 ℃ during the aging testing, the specially-made alloy object 2 can be designed to have the melting point of 50 ℃.
The tailored alloy article 2 may be a tiny disc of alloy. In particular, a special die can be designed, with which the alloy particles of the melting point can be pressed into small alloy disks.
After the connection, the temperature calibration instrument may enter a temperature calibration process, which may be shown in fig. 3, where fig. 3 is a schematic flow chart of an embodiment of a temperature calibration method in an embodiment of the present application, and the temperature calibration method includes:
The user can configure the test temperature to be calibrated on the provided visual interface, and can also write the test temperature in the logic of the software in the software writing process of the temperature calibration instrument.
And step 302, outputting temperature control information to a heating element inside the clamp through the temperature control port to heat the clamp.
In some embodiments, the temperature calibration instrument 10 may acquire a configuration strategy of heating before transmitting temperature control information to the heating element 7 inside the fixture 3; and generating temperature control information according to the configuration strategy. In order to meet the temperature control requirements for the clamp 3.
Exemplary, the heating configuration strategy may include: the set temperature initial value and the step value. For example, after starting auto-calibration, the temperature calibration instrument 10 will gradually increase the temperature by a set initial value and step value, and a temperature value per liter will stabilize for a period of time.
In some embodiments, the temperature may be controlled by a Proportional Integral Differential (PID) algorithm. And a PID algorithm is used for conveniently finishing accurate control on the temperature.
In some embodiments, in the temperature calibration method, a positive power-up probe 4 and a negative power-up probe 5 may also be provided, the probe station is adjusted so that the positive power-up probe 4 contacts with the positive electrode of the laser chip 1 to be tested, the negative power-up probe 5 contacts with the negative electrode of the laser chip 1 to be tested, the positive power-up probe 4 and the negative power-up probe 5 are respectively electrically connected with a chip driving port 11 of the temperature calibration apparatus 10, and the temperature calibration apparatus 10 controls the positive power-up probe and the negative power-up probe to apply a preset driving current to the laser chip to be tested through the chip driving port 11, so as to provide constant-current or constant-voltage driving for the laser chip to be tested. In the aging test process, the current value of the driving current applied to the laser chip to be tested can be the same as the preset driving current so as to simulate a more real test environment, eliminate the influence of the chip driving current on the temperature difference to be calibrated and improve the accuracy of the obtained temperature difference to be calibrated.
It should be noted that the negative powered probe needs to avoid the predetermined position where the special alloy object 2 is placed.
In some embodiments, in the temperature calibration method, a test probe 6 may be further provided, a tip of the test probe 6 is suspended above the tailored alloy object 2 by a predetermined distance, and the detection port 12 of the temperature calibration apparatus 10 is electrically connected to the test probe 6. The preset distance may be about 10 μm, and when the tailored alloy article is melted, the distance that the test probe 6 may contact the melted tailored alloy article 2 may be the preset distance, which is not limited in this embodiment.
The position of the test probe 6 may be adjusted by tapping and then releasing the test probe, for example, adjusting the test probe 6 such that the tip of the test probe 6 is suspended about 10 microns above the alloy wafer, indicating that the test probe is released from contact with the specially-made alloy article 2, such as the alloy wafer, when the negative powered probe 5 is not in electrical communication with the test probe 6.
In some embodiments, the presence or absence of a level signal on the test probe 6 is detected through the detection port 12; if a level signal is detected to exist on the test probe 6, the purpose-made alloy object 2 is judged to be melted; if no level signal is detected on the test probe 6, it is determined that the tailored alloy article 2 is not melted.
When the temperature of the temperature measuring point reaches the melting point of a specially-made alloy object 2, such as an alloy wafer, the alloy wafer is melted into a liquid state and forms a liquid ball under the action of surface tension, the test probe 6 is in contact with the liquid ball at the moment, the test probe 6 is conducted with the negative electrode power-on probe 5 of the laser chip to be measured, and the detection port 12 of the temperature calibration instrument detects a low-level signal at the moment.
According to the solid-liquid phase transition property of the metal alloy, the metal alloy can form spherical liquid drops under the action of surface tension after being converted into the liquid state, and the solid-liquid phase transition of the metal alloy is sensed by obtaining the low level through the contact of the test probe and the liquid drops.
Upon detecting a low signal, i.e., upon detecting melting of the tailored alloy article, step 304 may be performed.
And step 304, when the specially-made alloy object is detected to be melted, acquiring the current temperature of the clamp.
The current temperature of the clamp can be obtained by the temperature control probe 8, and if a thermistor exists, the current temperature can also be obtained by the thermistor.
When the special alloy object 2 is melted, the temperature measuring point is represented, that is, the temperature of the preset position on the laser chip 1 to be measured, where the special alloy object 2 is placed, reaches the melting point, which indicates that the temperature of the laser chip 1 to be measured at this time is the same as the melting point of the special alloy object 2.
According to the embodiment of the application, whether the laser chip to be tested reaches the specified test temperature to be calibrated or not is sensed through solid-liquid phase transition of the metal alloy at the melting point.
After acquiring the current temperature of the fixture, step 305 may be performed.
The temperature difference to be calibrated is the temperature difference between the clamp and the laser chip to be tested when the laser chip to be tested reaches the testing temperature.
In some embodiments, the temperature calibration instrument further comprises: a calibration port 14, the calibration port 14 being electrically connectable to the memory chip 9 inside the fixture. After said obtaining a temperature difference to be calibrated by said current temperature and said melting point of said tailored alloy article: generating calibration data, the calibration data comprising at least one of: the temperature difference to be calibrated, the type of the laser chip to be calibrated, the preset driving current and the current temperature of the clamp; and transmitting the calibration data to the clamp so that a memory chip of the clamp stores the calibration data. The embodiment of the application can realize automatic input of the calibration data so as to directly transfer the relevant data from the clamp when the laser chip to be tested is subjected to aging test.
Illustratively, calibration data can be optionally added or overwritten on the temperature calibration instrument 10, and then current calibration data, such as the model of the laser chip to be tested, the temperature difference to be calibrated, the test temperature to be calibrated, the preset drive current for power-up, the current temperature of the fixture, and the like, is written into the memory chip inside the fixture, and when the aging test is performed, the aging device can directly call the calibration data inside the fixture 3 through the memory chip 9 inside the fixture.
The temperature calibration during the aging test can be realized by storing any two data of the temperature difference to be calibrated, the test temperature to be calibrated and the current temperature of the clamp by the clamp.
In the embodiment of the present application, the temperature calibration apparatus may be an integrated apparatus to implement automatic driving and automatic calibration, and may include a temperature control circuit supported by a PID algorithm to generate temperature control information, one or more constant current and constant voltage driving sources to provide a preset driving current to a chip, one or more input/output IO ports to transmit respective numbers, one or more Electrically Erasable Programmable Read Only Memory (EEPROM) interfaces and control circuits, and the EEPROM interfaces and control circuits are connected to a Memory chip (EEPROM) inside a fixture to automatically record calibration data into the fixture, so as to facilitate the aging equipment in an aging test to retrieve related data.
Because the laser chip to be tested is limited by the size of the laser chip, the traditional thermistor cannot test the temperature of a micro area, the temperature difference between the chip and the test fixture is indirectly obtained through the melting of the metal alloy, and the aging temperature of the chip is indirectly controlled by calibrating the temperature of the fixture.
For the temperature control of the clamp, the temperature deviation in the aging test and the temperature calibration can be caused due to the position difference of the probe, the assembly of the probe and the precision of the probe, and the error of a test circuit, but the temperature calibration method of the embodiment of the application can reuse the same set of heating configuration strategy and a temperature control system with equipment for aging test, so that the test environment of the aging test can be further simulated, the error of the temperature control can be eliminated, and the embodiment of the application can reflect the test temperature of the chip during the aging test by the melting point of a special alloy object, and can eliminate the interference of other factors on the temperature measurement.
The temperature calibration instrument that this application embodiment has adopted the integrated form can realize overall process automatic control, also can build similar environment through a plurality of instruments, and compare in putting anchor clamps under the thermal infrared imager, utilizes the temperature of thermal infrared imaging mode measurement laser instrument chip that awaits measuring, and the used equipment input cost of this application embodiment is less.
That is to say, this application embodiment takes place solid-liquid phase transition through purpose-made alloy article at the melting point and perceives the chip whether to reach the test temperature of waiting to calibrate to realize the calibration of temperature, be convenient for improve the precision of laser chip temperature measurement that awaits measuring when ageing tests, in addition, can reduce temperature measurement's equipment input cost through this application embodiment.
The embodiment of the present application further provides a temperature calibration instrument based on laser test, which can be shown in fig. 4, and the temperature calibration instrument based on laser test according to the embodiment of the present application includes:
an obtaining module 401, configured to obtain a test temperature to be calibrated of a laser chip to be tested; a special alloy object is placed at a preset position of the laser chip to be calibrated, the temperature to be calibrated is a preset testing temperature to be reached when the laser chip to be calibrated is tested, and the melting point of the testing temperature to be calibrated is the same as that of the special alloy object;
a temperature control module 402, configured to output temperature control information to a heating element inside the fixture through a temperature control port of the temperature calibration instrument, so as to heat the fixture; the temperature control port of the temperature calibration instrument is used for being connected with a heating element in the clamp, and the clamp is used for clamping the laser chip to be tested;
a detection module 403, configured to detect whether the specially-made alloy object is melted;
a recording module 404, configured to obtain a current temperature of the fixture when the tailored alloy article is detected to be melted;
the calibration module 405 is configured to obtain a temperature difference to be calibrated through the current temperature and the melting point of the specially-made alloy object, where the temperature difference to be calibrated is the temperature difference between the clamp and the laser chip to be calibrated when the laser chip to be calibrated reaches the test temperature.
In some embodiments of the present application, the temperature calibration instrument further comprises: the drive module is used for controlling the anode energizing probe and the cathode energizing probe to apply preset drive current to the chip through a chip drive port of the temperature calibration instrument, wherein the chip drive port of the temperature calibration instrument is used for being respectively electrically connected with the anode energizing probe and the cathode energizing probe, the anode energizing probe is in contact with the anode of the laser chip to be tested, and the cathode energizing probe is in contact with the cathode of the laser chip to be tested.
In some embodiments of the present application, the detection module 403 is further configured to detect whether a level signal is present on the test probe through a detection port of the temperature calibration instrument; if a level signal is detected to exist on the test probe, the purpose-made alloy object is judged to be melted; if no level signal exists on the test probe, judging that the specially-made alloy object is not melted; the detection port is used for being connected with a test probe, and the needle point of the test probe is suspended above the specially-made alloy object for a preset distance.
In some embodiments of the present application, the temperature calibration instrument further comprises: calibration means for generating calibration data comprising at least one of: the temperature difference to be calibrated, the test temperature to be calibrated, the type of the laser chip to be calibrated, the preset driving current and the current temperature of the clamp are transmitted to the clamp through a calibration port of the temperature calibration instrument, so that a storage chip of the clamp stores the calibration data; wherein the calibration port is used for electrically connecting with a memory chip inside the clamp.
The embodiment of the application also provides a temperature calibration system, which comprises the temperature calibrator, the special alloy object and the clamp in the embodiment.
The embodiment of the present application still provides a singlechip, can refer to fig. 5 and show, install this singlechip in the temperature calibration instrument based on laser instrument test, this singlechip includes:
one or more processors 501;
a memory 502; and
one or more application programs, wherein the one or more application programs are stored in the memory and configured to be executed by the processor for performing the steps of the temperature calibration method described in any of the above embodiments of the temperature calibration method.
Where the memory and processor are connected by a bus, the bus may comprise any number of interconnected buses and bridges, the buses connecting together one or more of the various circuits of the processor and the memory. The bus may also connect various other circuits such as peripherals, voltage regulators, power management circuits, and the like, which are well known in the art, and therefore, will not be described any further herein. A bus interface provides an interface between the bus and the transceiver. The transceiver may be one element or a plurality of elements, such as a plurality of receivers and transmitters, providing a means for communicating with various other apparatus over a transmission medium.
The processor is responsible for managing the bus and general processing and may also provide various functions including timing, peripheral interfaces, voltage regulation, power management, and other control functions. And the memory may be used to store data used by the processor in performing operations.
It will be understood by those skilled in the art that all or part of the steps of the methods of the above embodiments may be performed by instructions or by associated hardware controlled by the instructions, which may be stored in a computer readable storage medium and loaded and executed by a processor.
To this end, an embodiment of the present application provides a computer-readable storage medium, which may include: read Only Memory (ROM), Random Access Memory (RAM), and the like. Stored thereon, is a computer program, which is loaded by a processor to perform the steps of any one of the temperature calibration methods provided by the embodiments of the present application.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, and are not described herein again.
In a specific implementation, each unit or structure may be implemented as an independent entity, or may be combined arbitrarily to be implemented as one or several entities, and the specific implementation of each unit or structure may refer to the foregoing method embodiment, which is not described herein again.
The above operations can be implemented in the foregoing embodiments, and are not described in detail herein.
The temperature calibration method, the temperature calibration instrument, the temperature calibration system, the temperature calibration singlechip and the storage medium provided by the embodiment of the application are introduced in detail, a specific example is applied in the description to explain the principle and the implementation mode of the application, and the description of the embodiment is only used for helping to understand the method and the core idea of the application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. The temperature calibration method based on laser testing is characterized by being applied to a temperature calibration instrument, wherein a temperature control port of the temperature calibration instrument is electrically connected with a heating element inside a clamp, the clamp clamps a laser chip to be tested, a specially-made alloy object is placed at a preset position of the laser chip to be tested, and the method comprises the following steps:
obtaining a test temperature to be calibrated of the laser chip to be calibrated, wherein the test temperature to be calibrated is a preset test temperature to be reached when the laser chip to be calibrated is tested, and the test temperature to be calibrated is the same as the melting point of the special alloy object;
outputting temperature control information to a heating element inside the clamp through the temperature control port to heat the clamp;
detecting whether the specially-made alloy object is melted;
when the specially-made alloy object is detected to be melted, acquiring the current temperature of the clamp;
and obtaining the temperature difference to be calibrated through the current temperature and the melting point of the specially-made alloy object, wherein the temperature difference to be calibrated is the temperature difference between the clamp and the laser chip to be calibrated when the laser chip to be calibrated reaches the test temperature.
2. The method of claim 1, wherein the detection port of the temperature calibration instrument is electrically connected to a test probe, and the tip of the test probe is suspended above the specially-made alloy object by a predetermined distance;
the detecting whether the specially-made alloy object is molten comprises:
detecting whether a level signal is present on the test probe through the detection port;
if a level signal is detected to exist on the test probe, the purpose-made alloy object is judged to be melted;
and if no level signal exists on the test probe, judging that the specially-made alloy object is not melted.
3. The method of claim 1, wherein prior to said outputting temperature control information via said temperature control port to a heat generating element inside said fixture, said method further comprises:
acquiring a heating configuration strategy;
and generating temperature control information according to the configuration strategy.
4. The laser test-based temperature calibration method according to any one of claims 1 to 3, wherein a positive power-up probe is in contact with a positive electrode of the laser chip to be tested, a negative power-up probe is in contact with a negative electrode of the laser chip to be tested, and the positive power-up probe and the negative power-up probe are respectively and electrically connected with a chip driving port of the temperature calibration instrument;
prior to said detecting whether said tailored alloy article is molten, said method further comprising:
and controlling the positive electrode energizing probe and the negative electrode energizing probe to apply preset driving current to the laser chip to be tested through the chip driving port.
5. The laser test based temperature calibration method according to claim 4, wherein the calibration port of the temperature calibration instrument is electrically connected to a memory chip inside the fixture;
after said obtaining a temperature difference to be calibrated by said current temperature and a melting point of said tailored alloy article, said method further comprising:
generating calibration data, the calibration data comprising at least one of: the temperature difference to be calibrated, the test temperature to be calibrated, the type of the laser chip to be calibrated, the preset driving current and the current temperature of the clamp;
and transmitting the calibration data to the clamp through the calibration port so that a memory chip of the clamp stores the calibration data.
6. A temperature calibration instrument based on laser testing, comprising:
the acquisition module is used for acquiring the test temperature to be calibrated of the laser chip to be tested; a special alloy object is placed at a preset position of the laser chip to be calibrated, the test temperature to be calibrated is a preset test temperature to be reached when the laser chip to be calibrated is tested, and the melting point of the test temperature to be calibrated is the same as that of the special alloy object;
the temperature control module is used for outputting temperature control information to a heating element in the clamp through a temperature control port of the temperature calibration instrument so as to heat the clamp; the clamp is used for clamping the laser chip to be tested, and the temperature control port of the temperature calibration instrument is used for being electrically connected with a heating element in the clamp;
the detection module is used for detecting whether the specially-made alloy object is molten or not;
the recording module is used for acquiring the current temperature of the clamp when the specially-made alloy object is detected to be molten;
and the calibration module is used for obtaining a temperature difference to be calibrated through the current temperature and the melting point of the specially-made alloy object, wherein the temperature difference to be calibrated is the temperature difference between the clamp and the laser chip to be calibrated when the laser chip to be calibrated reaches the test temperature.
7. The laser-test-based temperature calibration instrument of claim 6, wherein the detection module is configured to detect whether a level signal is present on a test probe through a detection port of the temperature calibration instrument; if a level signal is detected to exist on the test probe, the purpose-made alloy object is judged to be melted; if no level signal exists on the test probe, judging that the specially-made alloy object is not melted;
the detection port is used for being electrically connected with the test probe, and the needle point of the test probe is suspended above the specially-made alloy object for a preset distance.
8. The laser test based temperature calibration instrument according to claim 6 or 7, further comprising:
the drive module is used for controlling the anode power-on probe and the cathode power-on probe to be applied to the laser chip to be detected through the chip drive port of the temperature calibration instrument to apply preset drive current, wherein the chip drive port of the temperature calibration instrument is used for respectively being connected with the anode power-on probe and the cathode power-on probe electrically, the anode power-on probe is in contact with the anode of the laser chip to be detected, and the cathode power-on probe is in contact with the cathode of the laser chip to be detected.
9. The laser test based temperature calibration instrument of claim 8, further comprising:
calibration means for generating calibration data comprising at least one of: the temperature difference to be calibrated, the test temperature to be calibrated, the type of the laser chip to be calibrated, the preset driving current and the current temperature of the clamp are transmitted to the clamp through a calibration port of the temperature calibration instrument, so that a storage chip of the clamp stores the calibration data;
wherein the calibration port is used for electrically connecting with a memory chip inside the clamp.
10. A temperature calibration system based on laser testing, the temperature calibration system comprising: a laser test based temperature calibration instrument according to any one of claims 7 to 9, and specially made alloy articles and fixtures.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1471150A (en) * | 2002-07-24 | 2004-01-28 | δ����ҵ��ʽ���� | Apparatus for compensatnig deviation of test temperature is semiconductor device processing machine |
| CN103471622A (en) * | 2013-09-22 | 2013-12-25 | 广东生益科技股份有限公司 | Method and device for correcting temperature of thermal mechanical analyzer tensile fixture |
| CN104316210A (en) * | 2010-10-04 | 2015-01-28 | 株式会社理光 | Electric element, integrated element and electronic circuit |
| CN111780892A (en) * | 2020-07-10 | 2020-10-16 | 中国计量科学研究院 | Calibration method and device of temperature detection equipment |
| CN112147490A (en) * | 2020-11-26 | 2020-12-29 | 上海菲莱测试技术有限公司 | Method and system for laser chip integration test |
| CN113740699A (en) * | 2020-05-14 | 2021-12-03 | 中山市江波龙电子有限公司 | Test socket, control method thereof, test device and storage medium |
-
2022
- 2022-03-14 CN CN202210244333.3A patent/CN114325349A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1471150A (en) * | 2002-07-24 | 2004-01-28 | δ����ҵ��ʽ���� | Apparatus for compensatnig deviation of test temperature is semiconductor device processing machine |
| CN104316210A (en) * | 2010-10-04 | 2015-01-28 | 株式会社理光 | Electric element, integrated element and electronic circuit |
| CN103471622A (en) * | 2013-09-22 | 2013-12-25 | 广东生益科技股份有限公司 | Method and device for correcting temperature of thermal mechanical analyzer tensile fixture |
| CN113740699A (en) * | 2020-05-14 | 2021-12-03 | 中山市江波龙电子有限公司 | Test socket, control method thereof, test device and storage medium |
| CN111780892A (en) * | 2020-07-10 | 2020-10-16 | 中国计量科学研究院 | Calibration method and device of temperature detection equipment |
| CN112147490A (en) * | 2020-11-26 | 2020-12-29 | 上海菲莱测试技术有限公司 | Method and system for laser chip integration test |
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