CN105187596A - Automatic temperature rise testing device and method - Google Patents

Automatic temperature rise testing device and method Download PDF

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Publication number
CN105187596A
CN105187596A CN201510659420.5A CN201510659420A CN105187596A CN 105187596 A CN105187596 A CN 105187596A CN 201510659420 A CN201510659420 A CN 201510659420A CN 105187596 A CN105187596 A CN 105187596A
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temperature
test
temperature rise
testing
operational module
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CN201510659420.5A
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CN105187596B (en
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孙旺泉
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Huzhou YingLie Intellectual Property Operation Co.,Ltd.
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Shanghai Feixun Data Communication Technology Co Ltd
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Abstract

The invention is suitable for the field of automatic detection, and provides an automatic temperature rise testing device. The device is used for performing a temperature rise test on each working module of electronic equipment, and includes a microcontroller and a temperature sensor and a thermal imager which are electrically connected with the microcontroller. The temperature sensor senses current environment temperature. The thermal imager performs testing on working temperature of each working module once at predetermined intervals under control of the microcontroller. The microcontroller reads the current environment temperature sensed by the temperature sensor, and judges whether the current environment temperature is optimal test temperature, and if yes, reads test data of the thermal imager, and a temperature variation diagram of each working module are made according to the test data. The automatic temperature rise testing device does not need human participation, can automatically perform a temperature rise test, and is convenient and rapid, and the test data are accurate. The invention also relates to an automatic temperature rise testing method.

Description

A kind of device for testing temperature rise and method automatically
Technical field
The invention belongs to Aulomatizeted Detect field, particularly relate to a kind of device for testing temperature rise and method automatically.
Background technology
Mobile phone thermal design is mobile phone development very important stage.If mobile phone thermal design is bad, operationally temperature is too high to make mobile phone.First, too high temperature can cause central processing unit (CentralProcessingUnit, CPU) the frequency reducing work of mobile phone, is embodied in mobile phone and blocks in use time, react slow etc.; Secondly, too high temperature also can cause mobile phone in use to crash, and affects Consumer's Experience; Finally, the extreme case etc. such as battery of mobile phone blast also has much relations with mobile phone excessive heating.
Current development is all engineer's manual test for the test of mobile phone heat.First test pattern (as game mode, limit mode etc.) must be selected in the condition of a constant temperature, then mobile phone is allowed to run 45 minutes or one hour, engineer observes the heat condition of mobile phone during this period with thermal imaging system timing, temperature as which which operational module of moment is how many, complete machine temperature is how many, and just looks at the source etc. of complete machine maximum temperature heat.In whole test process, all need engineer's whole process on duty like this and moment maintenance data recording, greatly increase the workload of engineer, and in manual recording process, because the reasons such as the module of mobile phone is many, time point is inconsistent are easy to cause record to occur error.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of device for testing temperature rise automatically, is intended to convenient and swift and test data is accurate.
The present invention is achieved in that a kind of device for testing temperature rise automatically, for carrying out temperature rise test to each operational module of an electronic equipment.This automatic device for testing temperature rise comprises a microcontroller and the temperature sensor be electrically connected with this microcontroller, a thermal imaging system.This temperature sensor is for sensing current environmental temperature.The working temperature that this thermal imaging system is used for every a scheduled time to this each operational module under the control of this microcontroller is once tested.The current environmental temperature that this microcontroller senses for reading this temperature sensor, and judge whether this current environmental temperature is best probe temperature, if this current environmental temperature is best probe temperature, then read the test data of this thermal imaging system, and make the temperature variation of this each operational module according to this test data.
Present invention also offers a kind of method for testing temperature rise automatically, for carrying out temperature rise test to each operational module of an electronic equipment.This automatic method for testing temperature rise comprises the steps: to sense current environmental temperature; Judge whether this current environmental temperature is best probe temperature; If this current environmental temperature is best probe temperature, then test once the working temperature of this each operational module every a scheduled time, and record test data; And the temperature variation of this each operational module is made according to this test data.
Compared with prior art, beneficial effect is in the present invention: this automatic device for testing temperature rise and method do not need artificial participation, automatically can carry out temperature rise test to electronic equipment, convenient and swift and test data is accurate.
Accompanying drawing explanation
Fig. 1 is the functional block diagram of the automatic device for testing temperature rise that the embodiment of the present invention provides.
Fig. 2 is the temperature variation of the automatic device for testing temperature rise of Fig. 1.
Fig. 3 is the flow chart of the automatic method for testing temperature rise that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
As shown in Figure 1, the automatic device for testing temperature rise 100 that the embodiment of the present invention provides, for testing the temperature variations of an electronic equipment (such as mobile phone) each operational module in the course of the work.This automatic device for testing temperature rise 100 comprises a microcontroller 10 and a temperature sensor 20, mode selection module 30 of being electrically connected with this microcontroller 10 and a thermal imaging system 40.
This temperature sensor 20 is for sensing current environmental temperature.Owing to carrying out in the process of temperature rise test at this electronic equipment, the too high or too low accuracy that all can have influence on test data of current environmental temperature.Best current environmental temperature is 25 degrees Celsius.
This mode selection module 30 is for selecting the test pattern of this electronic equipment.Because the test pattern in temperature rise test has game mode and limit mode etc., under different test pattern, the operating state of this each operational module is different, and heat condition is also different.Game mode imitates user when normal this electronic equipment of use, the heat condition of this each operational module.Limit mode imitates this electronic device works under maximum power dissipation and maximum febrile state, the maximum heat condition that this each operational module can bear.
This thermal imaging system 40 for once testing the working temperature of this each operational module under the test pattern selected every a scheduled time under the control of this microcontroller 10.The heat that this thermal imaging system 40 operationally can produce according to this each operational module and the ultrared wavelength sent calculate the temperature of this each operational module.In the present embodiment, the working temperature of each operational module determined by this thermal imaging system 40 by the mode of taking pictures.
The current environmental temperature that this microcontroller 10 senses for reading this temperature sensor 20, and judge whether this current environmental temperature is best probe temperature, if not best probe temperature, then controls this mode selection module 30 and this thermal imaging system 40 quits work; If best probe temperature, then read the model selection result of this mode selection module 30 and the test data of this thermal imaging system 40, and make the temperature variation of this each operational module under different test pattern according to this test data.In the present embodiment, this microcontroller 10 is intercomed with this thermal imaging system 40 phase by a serial communication modular.Due to operationally the produced heat of this electronic equipment along with increasing progressively of time increases gradually, therefore the temperature variation of this each operational module is showed by the form of curve chart, with the heat condition facilitating research and development engineer to be learnt this each operational module fast by this temperature variation.As shown in Figure 2, the transverse axis of this temperature variation is the time, the longitudinal axis is temperature, many curves in this temperature variation are the temperature variation curve of this each operational module respectively, such as curve T1 is the temperature variation curve of the first operational module, and curve T2 is the temperature variation curve of the second operational module.
The course of work of this automatic device for testing temperature rise 100 is as follows: this microcontroller 10 senses current environmental temperature by this temperature sensor 20, and judge whether this current environmental temperature is best probe temperature (such as 25 degrees Celsius), if not best probe temperature, then directly terminate; If best probe temperature, then this microcontroller 10 is selected by the test pattern of this mode selection module 20 to this electronic equipment, then this microcontroller 10 controls this thermal imaging system 30 every the scheduled time test once working temperature of this each operational module under the test pattern selected, and this microcontroller 10 records the test data of this thermal imaging system and makes the temperature variation of this each operational module under different test pattern according to this test data.
As shown in Figure 3, the automatic method for testing temperature rise that the embodiment of the present invention provides, for carrying out temperature rise test to an electronic equipment.This automatic method for testing temperature rise comprises the steps:
S1: test current environmental temperature.
S2: judge whether this current environmental temperature is best probe temperature.In the present embodiment, this best probe temperature is 25 degrees Celsius.
S3: if this current environmental temperature is not best probe temperature, then directly terminate.
S4: if this current environmental temperature is best probe temperature, then select the test pattern of this electronic equipment.
S5: every the scheduled time test once working temperature of this each operational module under the test pattern selected, and record this test data.
S6: make the temperature variation of this each operational module under different test pattern according to the test data under different test pattern.
Compared with prior art, automatic device for testing temperature rise of the present invention, can automatically carry out temperature rise test to electronic equipment when not needing manually on duty and make temperature variation, convenient and swift and test data accurate, can effectively help engineer rationally to carry out the thermal design of electronic equipment.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. an automatic device for testing temperature rise, for carrying out temperature rise test to each operational module of an electronic equipment, the temperature sensor that this automatic device for testing temperature rise comprises a microcontroller and is electrically connected with this microcontroller, a thermal imaging system, this temperature sensor is for sensing current environmental temperature, the working temperature that this thermal imaging system is used for every a scheduled time to this each operational module under the control of this microcontroller is once tested, the current environmental temperature that this microcontroller senses for reading this temperature sensor, and judge whether this current environmental temperature is best probe temperature, if this current environmental temperature is best probe temperature, then read the test data of this thermal imaging system, and the temperature variation of this each operational module is made according to this test data.
2. automatic device for testing temperature rise as claimed in claim 1, it is characterized in that, this microcontroller, also for when judging that this current environmental temperature is not best probe temperature, controlling this thermal imaging system and quitting work.
3. automatic device for testing temperature rise as claimed in claim 1, it is characterized in that, this best probe temperature is 25 degrees Celsius.
4. automatic device for testing temperature rise as claimed in claim 1, it is characterized in that, this temperature variation is curve chart, and the transverse axis of this temperature variation is the time, the longitudinal axis is temperature, and many curves in this temperature variation are the temperature variation curve of this each operational module respectively.
5. automatic device for testing temperature rise as claimed in claim 1, it is characterized in that, this automatic device for testing temperature rise also comprises a mode selection module, this mode selection module is used for selecting the test pattern of this electronic equipment, this microcontroller also for reading selection result and the temperature data of this thermal imaging system under different test pattern of this mode selection module, and makes the temperature variation of this each operational module under different test pattern.
6. automatic device for testing temperature rise as claimed in claim 5, it is characterized in that, this test pattern comprises game mode and limit mode.
7. an automatic method for testing temperature rise, for carrying out temperature rise test to each operational module of an electronic equipment, this automatic method for testing temperature rise comprises the steps: to test current environmental temperature; Judge whether this current environmental temperature is best probe temperature; If this current environmental temperature is best probe temperature, then test once the working temperature of this each operational module every a scheduled time, and record test data; And the temperature variation of this each operational module is made according to this test data.
8. automatic method for testing temperature rise as claimed in claim 7, it is characterized in that, this step " if this current environmental temperature is best probe temperature; then every the working temperature of scheduled time test once this each operational module; and record test data " step in also comprise the step of " test pattern selecting this electronic equipment ", first select the test pattern of this electronic equipment, then every the scheduled time test once working temperature of this each operational module under the test pattern selected, and record test data.
9. automatic method for testing temperature rise as claimed in claim 8, it is characterized in that, in this step " makes the temperature variation of this each operational module " according to this test data, need to make the temperature variation of this each operational module under different test pattern according to the test data under different test pattern.
10. automatic method for testing temperature rise as claimed in claim 7, is characterized in that, if this current environmental temperature is not best probe temperature, then directly terminate.
CN201510659420.5A 2015-10-13 2015-10-13 A kind of automatic device for testing temperature rise and method Active CN105187596B (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106371001A (en) * 2016-09-27 2017-02-01 上海华岭集成电路技术股份有限公司 Device and method for controlling test temperature of chip to be tested
CN108414854A (en) * 2018-02-07 2018-08-17 上海康斐信息技术有限公司 A kind of test method and system of the maximum temperature-rise of wireless routing device
CN109238468A (en) * 2018-07-27 2019-01-18 上海与德通讯技术有限公司 Temperature rise automatic test device and method
CN110398999A (en) * 2019-07-29 2019-11-01 深圳市华检检测技术有限公司 A kind of temperature data acquisition device and temperature data acquisition method
CN111736026A (en) * 2020-06-29 2020-10-02 深圳市京泉华科技股份有限公司 Temperature rise test system and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102279058A (en) * 2011-06-21 2011-12-14 惠州Tcl移动通信有限公司 Testing system and testing method for working temperature of mobile terminal
WO2012097596A1 (en) * 2011-01-20 2012-07-26 国电南瑞科技股份有限公司 Temperature rise testing system of electric vehicle conduction type charging interface
CN104767855A (en) * 2015-04-02 2015-07-08 工业和信息化部电信研究院 Mobile phone power consumption detection experiment system based on constant-temperature box and detection method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012097596A1 (en) * 2011-01-20 2012-07-26 国电南瑞科技股份有限公司 Temperature rise testing system of electric vehicle conduction type charging interface
CN102279058A (en) * 2011-06-21 2011-12-14 惠州Tcl移动通信有限公司 Testing system and testing method for working temperature of mobile terminal
CN104767855A (en) * 2015-04-02 2015-07-08 工业和信息化部电信研究院 Mobile phone power consumption detection experiment system based on constant-temperature box and detection method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106371001A (en) * 2016-09-27 2017-02-01 上海华岭集成电路技术股份有限公司 Device and method for controlling test temperature of chip to be tested
CN108414854A (en) * 2018-02-07 2018-08-17 上海康斐信息技术有限公司 A kind of test method and system of the maximum temperature-rise of wireless routing device
CN109238468A (en) * 2018-07-27 2019-01-18 上海与德通讯技术有限公司 Temperature rise automatic test device and method
CN110398999A (en) * 2019-07-29 2019-11-01 深圳市华检检测技术有限公司 A kind of temperature data acquisition device and temperature data acquisition method
CN111736026A (en) * 2020-06-29 2020-10-02 深圳市京泉华科技股份有限公司 Temperature rise test system and method

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