CN111736026A - Temperature rise test system and method - Google Patents
Temperature rise test system and method Download PDFInfo
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- CN111736026A CN111736026A CN202010612124.0A CN202010612124A CN111736026A CN 111736026 A CN111736026 A CN 111736026A CN 202010612124 A CN202010612124 A CN 202010612124A CN 111736026 A CN111736026 A CN 111736026A
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- 238000001816 cooling Methods 0.000 claims description 18
- 230000002159 abnormal effect Effects 0.000 claims description 16
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- 238000013522 software testing Methods 0.000 abstract 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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Abstract
The embodiment of the application provides a temperature rise test system for carry out the temperature rise test to the device under test, the temperature rise test system includes current source, electronic load, temperature-sensing unit and temperature collection appearance, the output electricity of current source connect in the input of the device under test for different electric currents of time quantum output give the input of the device under test, the input electricity of electronic load connect in the output of the device under test, the temperature-sensing unit is used for the sensing the temperature of the device under test, the temperature collection appearance electricity connect in the temperature-sensing unit, in order to be used for gathering the temperature that the temperature-sensing unit is to the sensing in different time quantums. The embodiment of the application also provides a temperature rise test method. From this, can move more loaded down with trivial details temperature rise tests in less time, promote temperature rise efficiency of software testing.
Description
Technical Field
The application relates to the technical field of temperature testing, in particular to a temperature rise testing system and method.
Background
In the prior art, the temperature rise test of the device to be tested usually adopts fixed loading current, and the temperature rise condition of the device to be tested is recorded by a manual card meter. However, such inaccuracy of temperature versus time is obvious, and more importantly, only one set of temperature rise records can be tested at a time, i.e., the testing efficiency is very low.
Disclosure of Invention
In view of this, it is necessary to provide a temperature rise test system and method, and the temperature rise test system and method provided in the embodiments of the present application can run more and more complicated temperature rise tests in less time, thereby improving the temperature rise test efficiency.
The embodiment of the application provides a temperature rise test system, which is used for carrying out temperature rise test on a device to be tested and comprises a current source, an electronic load, a temperature sensing unit and a temperature acquisition instrument;
the output end of the current source is electrically connected with the input end of the device to be tested and is used for outputting different currents to the input end of the device to be tested at different time periods;
the input end of the electronic load is electrically connected with the output end of the device to be tested;
the temperature sensing unit is used for sensing the temperature of the device to be tested; and
the temperature acquisition instrument is electrically connected with the temperature sensing unit and is used for acquiring the temperatures sensed by the temperature sensing unit in different time periods.
According to some embodiments of the application, temperature rise test system still includes the computer, the temperature acquisition appearance pass through the RS232 interface with the interface connection of computer, the computer is used for acquireing the temperature data that the temperature acquisition appearance was gathered, and the record the temperature data of device under test.
According to some embodiments of the application, the temperature data comprises a plurality of temperature values of the device under test at different time periods when different currents are input, and the computer is configured to mark an abnormal temperature value when the temperature data is abnormal.
According to some embodiments of the present application, the temperature rise test system further comprises a controller electrically connected to the current source, the controller being configured to control the current source to output different currents at different time periods.
According to some embodiments of the present application, the controller is further electrically connected to the temperature acquisition instrument, and the controller is further configured to acquire temperature data acquired by the temperature acquisition instrument and control the current source to stop working when the temperature data is abnormal.
According to some embodiments of the present application, the temperature rise test system includes a plurality of current sources and a plurality of electronic loads, the number of the current sources is the same as the number of the electronic loads, and the temperature sensing units are disposed at different positions of the device under test.
According to some embodiments of the present application, the temperature rise test system further comprises a detection unit for measuring an operation parameter of the temperature rise test system.
According to some embodiments of the present application, the temperature rise test system further comprises a test cabinet, and the current source, the electronic load, the temperature sensing unit, the temperature acquisition instrument and the controller are all disposed in the test cabinet.
According to some embodiments of the application, the temperature rise test system further comprises a water cooling device and an air cooling device, wherein the water cooling device and the air cooling device are used for providing a temperature rise test environment for the device to be tested.
The embodiment of the present application further provides a temperature rise test method, which is used for performing a temperature rise test on a device to be tested, and the temperature rise test method includes:
the current source outputs different currents to the input end of the device to be tested at different time periods; the output end of the device to be tested is electrically connected with the input end of the electronic load;
the temperature sensing unit senses the temperature of the device to be tested; and
and acquiring the temperatures sensed by the temperature sensing unit in different time periods.
The temperature rise test system and the temperature rise test method provided by the embodiment of the application control the current source to output different currents in different time periods through the controller, and the temperature acquisition instrument acquires the temperature of the device to be tested in different time periods to obtain multiple groups of temperature rise records. Therefore, the temperature rise test system and the temperature rise test method in the embodiment of the application can automatically record and automatically judge the temperature rise of the device according to the set interval time, can run more and more complicated temperature rise tests in less time, and improve the temperature rise test efficiency.
Drawings
FIG. 1 is a block diagram of a preferred embodiment of a temperature rise test system according to the present application.
FIG. 2 is a schematic diagram of another embodiment of the temperature rise test system of FIG. 1.
FIG. 3 is a flow chart of a preferred embodiment of a temperature rise test method according to the present application.
Description of the main elements
Device under test 200
The following detailed description will explain the present application in further detail in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application.
All other embodiments that can be obtained by a person skilled in the art without inventive step based on the embodiments in this application are within the scope of protection of this application.
Referring to fig. 1, an embodiment of the present application provides a temperature rise test system. The temperature rise test system is used for carrying out temperature rise test on the device to be tested 200.
In the embodiment of the present application, the temperature rise test system includes a current source 10, an electronic load 20, a temperature collector 30, a computer 40, and a controller 50.
Referring to fig. 2, the current source 10, the electronic load 20, the temperature collector 30, the computer 40 and the controller 50 may be disposed in a test cabinet 60. In the embodiment of the present application, a water cooling device 70 and an air cooling device 80 may be disposed on the right side or the left side of the test cabinet 60. The air cooling device 80 can be used for air cooling, hot air heating and the like of the device to be tested, the water cooling device 70 can be used for water cooling and the like of the device to be tested, and therefore the water cooling device 70 and the air cooling device 80 can be used for providing a good temperature rise test environment for the device to be tested 200.
The output terminal of the current source 10 is electrically connected to the input terminal of the device under test 200, and is used for outputting different currents to the input terminal of the device under test 200 at different time periods.
The input terminal of the electronic load 20 is electrically connected to the output terminal of the device under test 200. The temperature collector 30 collects the temperature of the dut 200 at different time periods through a temperature sensing unit (not shown) to obtain temperature data. It is understood that the temperature acquiring instrument 30 in the embodiment of the present application is electrically connected to the temperature sensing unit.
In the embodiment of the present application, the temperature rise test system may include a plurality of current sources 10 and a plurality of electronic loads 20, so that a plurality of devices under test 200 may be subjected to temperature rise test. Specifically, the number of the current sources 10 is the same as the number of the electronic loads 20, and corresponds to one.
In the embodiment of the present application, only 4 current sources 10, 4 devices under test 200 and 4 electronic loads 20 are shown in fig. 1, and in other preferred embodiments, the numbers of the current sources 10, the electronic loads 20 and the devices under test 200 may be adjusted accordingly according to actual needs. For example, each two current sources 10 and two electronic loads 20 correspond to one device under test 200.
It is understood that in the 4 devices under test 200 in the embodiment of the present application, a plurality of temperature sensing units, for example, 6 temperature sensing units, may be disposed at different positions in each device under test 200, and these sensing units may be disposed inside or on the surface of the device under test 200 to sense the temperature of the device under test 200 at different positions. Therefore, the temperature collector 30 in the embodiment of the present application can simultaneously detect and collect 24 sets of temperature data to test and obtain 24 sets of temperature rise records.
It is to be understood that the electronic loads 20 in the embodiments of the present application are all dc electronic loads. The direct current electronic load can dynamically load the device to be tested according to power setting.
It is understood that, in the embodiments of the present application, the current source 10 may include a high voltage dc source and a low voltage dc source. The output power of the high-voltage direct current source and the low-voltage direct current source is 12V/120A, and any output current between 0 and 120A can be set according to requirements.
In the embodiment of the present application, the computer 40 is also electrically connected to the electronic load 20 through a network port.
In the embodiment of the present application, the temperature collecting instrument 30 is electrically connected to the interface of the computer 40 through an RS232 interface. The controller 50 is electrically connected to the current source 10 and the temperature collector 30.
The computer 40 is used for acquiring the temperature data acquired by the temperature acquisition instrument 30 and recording the temperature data of the device to be tested. The controller 50 is used for controlling the current source 10 to output different currents at different time periods.
Specifically, the temperature data may include a plurality of temperature values of the device under test 200 when different currents are input at different time periods, and the computer 40 is configured to mark an abnormal temperature value when the temperature data is abnormal.
For example, the controller 50 controls the current source 10 to output a first current (e.g., 1A) to the device under test 200 according to the program setting during a first time period (e.g., 1 st minute to 10 th minute) of the test period, where the temperature of the device under test 200 may be a first temperature (e.g., 40 degrees), and the controller 50 controls the current source 10 to output a second current (e.g., 2A) to the device under test 200 during a second time period (e.g., 10 th minute to 15 th minute) of the test period, where the temperature of the device under test 200 may be a second temperature (e.g., 65 degrees). Therefore, the temperature data is transmitted to the computer 40 by the temperature acquisition instrument 30, the computer 40 can form a temperature rise test data table according to the temperature data to display, and then the computer 40 can judge the abnormal temperature in the temperature rise test data table, if the temperature is 65 degrees, the abnormal temperature is the abnormal temperature, that is, the computer 40 can mark the abnormal temperature value of 65 degrees in the temperature rise test data table by red. The temperature rise test data table can include information such as test time, test temperature, serial numbers of the devices to be tested and the like.
The controller 50 can also control the test cabinet to automatically stop, and perform functions such as stop protection when the temperature rise is overloaded. Specifically, the controller 50 may also be configured to obtain temperature data collected by the temperature collector 30, and control the current source 10 to stop operating when the temperature data is abnormal. In the embodiment of the present application, the internal program setting of the controller 50 can automatically record the temperature rise data and automatically determine the temperature rise of the device under test according to the set interval time.
In the embodiment of the present application, the temperature rise test system further includes a detection unit (not shown in the figure), and the detection unit is used for measuring the operation parameters in the temperature rise test system. In particular, the detection unit may be a multimeter for measuring output voltage and current variation in the system.
The operation principle of the temperature rise test system according to the embodiment of the present application will be described with reference to fig. 1 and 2.
In use, the controller 50 controls the current source 10 to output a first current (e.g., 1A) to the device under test 200 for a first time period (e.g., 1 st to 10 th minutes) according to the program setting. At this time, the temperature collector 30 senses the temperatures of the devices 200 through the temperature sensing units, and transmits the temperature data to the computer 40 and the controller 50, and the computer 40 records the temperature rise of the devices 200. Then, the current source 10 will output a second current (e.g. 2A) in the next time period under the control of the controller 50, and the temperature collector 30 will transmit the collected temperature data to the computer 40 and the controller 50 in real time. Therefore, the computer 40 can test and obtain a plurality of sets of temperature rise records according to the temperature data transmitted by the temperature collector 30, and display the temperature rise records on a computer screen. When the computer 40 judges that the abnormal temperature exists in the temperature data, the computer 40 marks the abnormal temperature value in the temperature rise test data table on the computer screen by red. In addition, the controller 50 will also control the test cabinet to automatically stop, i.e. control the current source 10 to stop working, thereby realizing the functions of performing shutdown protection and the like when the temperature rise is overloaded.
Therefore, the temperature rise test system provided by the application can automatically measure 24 groups of temperature rise records for a long time under the unattended condition, and complete the automatic recording and setting discrimination functions.
The temperature rise test system can run more and more tedious tests in less time. The test is consistent and repeatable. Because the test is automatically executed, the consistency of the result of each test and the executed content can be guaranteed, and the repeatable effect of the test can be achieved. Because the automatic test usually adopts the script technology, only a small amount of modification or even no modification is needed, and the same use case can be used in different test processes.
The temperature rise test system can increase the software trust, and because the test is automatically executed, negligence and errors in the execution process do not exist, and the test completely depends on the design quality of the test. Once the software passes the powerful automatic test, the trust level of the software naturally increases.
Referring to fig. 3, fig. 3 is a flowchart illustrating a temperature rise testing method according to an embodiment of the present disclosure. The temperature rise test method comprises the following steps:
step S31: the current source outputs different currents to the input end of the device to be tested at different time periods.
In an embodiment of the present application, the output terminal of the dut is electrically connected to the input terminal of the electronic load. It is to be understood that the electronic loads 20 in the embodiments of the present application are all dc electronic loads. The direct current electronic load can dynamically load the device to be tested according to power setting. In the embodiment of the present application, the current source 10 may include a high voltage dc source and a low voltage dc source. The output power of the high-voltage direct current source and the low-voltage direct current source is 12V/120A, and any output current between 0 and 120A can be set according to requirements.
Step S32: the temperature sensing unit senses the temperature of the device to be tested.
In the embodiment of the application, through the different positions at the device to be measured, can place temperature sensing unit in the inside or the surface of device to be measured, come real-time ground sensing the temperature of device to be measured.
Step S33: and acquiring the temperatures sensed by the temperature sensing unit in different time periods.
In the embodiment of the application, the temperature sensed by the temperature sensing unit in different time periods is collected through the temperature collecting instrument so as to obtain temperature data.
The temperature collector also transmits the temperature data from the tests to the computer and the controller. Therefore, the computer displays and records the temperature data of the devices to be tested. The computer will also mark the abnormal temperature with red color and the controller will control the test cabinet to stop working to form overload protection.
Therefore, according to the temperature rise test system and the temperature rise test method, the controller is used for controlling the current source to output different currents in different time periods, and the temperature acquisition instrument is used for acquiring the temperature of the device to be tested in different time periods, so that multiple groups of temperature rise records can be obtained. Therefore, the temperature rise test system and the temperature rise test method in the embodiment of the application can automatically record and automatically judge the temperature rise of the device according to the set interval time, can run more and more complicated temperature rise tests in less time, and improve the temperature rise test efficiency.
It should be understood by those skilled in the art that the above embodiments are only for illustrating the present application and are not used as limitations of the present application, and that suitable modifications and changes of the above embodiments are within the scope of the claims of the present application as long as they are within the spirit and scope of the present application.
Claims (10)
1. A temperature rise test system is used for carrying out temperature rise test on a device to be tested and is characterized by comprising a current source, an electronic load, a temperature sensing unit and a temperature acquisition instrument;
the output end of the current source is electrically connected with the input end of the device to be tested and is used for outputting different currents to the input end of the device to be tested at different time periods;
the input end of the electronic load is electrically connected with the output end of the device to be tested;
the temperature sensing unit is used for sensing the temperature of the device to be tested; and
the temperature acquisition instrument is electrically connected with the temperature sensing unit and is used for acquiring the temperatures sensed by the temperature sensing unit in different time periods.
2. The temperature rise test system of claim 1, further comprising a computer, wherein the temperature collector is connected to an interface of the computer through an RS232 interface, and the computer is configured to obtain the temperature data collected by the temperature collector and record the temperature data of the device under test.
3. The temperature rise test system of claim 2 wherein the temperature data includes a plurality of temperature values for the device under test at different time periods when different currents are input, the computer being configured to flag an abnormal temperature value when the temperature data is abnormal.
4. The temperature rise test system of claim 1 further comprising a controller electrically connected to the current source, the controller for controlling the current source to output different currents at different time periods.
5. The temperature rise test system of claim 4, wherein the controller is further electrically connected to the temperature collector, and the controller is further configured to obtain temperature data collected by the temperature collector and control the current source to stop working when the temperature data is abnormal.
6. The temperature-rise test system of claim 1, comprising a plurality of current sources and a plurality of electronic loads, wherein the number of the current sources is the same as the number of the electronic loads, and the temperature sensing units are arranged at different positions of the device to be tested.
7. The temperature rise test system of claim 1, further comprising a detection unit for measuring an operating parameter of the temperature rise test system.
8. The temperature rise test system of claim 4, further comprising a test cabinet, wherein the current source, the electronic load, the temperature sensing unit, the temperature collector, and the controller are all disposed within the test cabinet.
9. The temperature rise test system of claim 1, further comprising a water cooling device and an air cooling device, wherein the water cooling device and the air cooling device are used for providing a temperature rise test environment for the device under test.
10. A temperature rise test method is used for carrying out temperature rise test on a device to be tested and is characterized by comprising the following steps:
the current source outputs different currents to the input end of the device to be tested at different time periods; the output end of the device to be tested is electrically connected with the input end of the electronic load;
the temperature sensing unit senses the temperature of the device to be tested; and
and acquiring the temperatures sensed by the temperature sensing unit in different time periods.
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| CN202010612124.0A CN111736026A (en) | 2020-06-29 | 2020-06-29 | Temperature rise test system and method |
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| CN202010612124.0A CN111736026A (en) | 2020-06-29 | 2020-06-29 | Temperature rise test system and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112556871A (en) * | 2020-12-12 | 2021-03-26 | 江西昌河汽车有限责任公司 | Temperature acquisition system for automobile and acquisition method thereof |
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| CN2519255Y (en) * | 2001-12-17 | 2002-10-30 | 中国科学院长春地理研究所 | Multi wave band microwave radiation meter signal source temperature control apparatus |
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Application publication date: 20201002 |