CN105187596B - A kind of automatic device for testing temperature rise and method - Google Patents
A kind of automatic device for testing temperature rise and method Download PDFInfo
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- CN105187596B CN105187596B CN201510659420.5A CN201510659420A CN105187596B CN 105187596 B CN105187596 B CN 105187596B CN 201510659420 A CN201510659420 A CN 201510659420A CN 105187596 B CN105187596 B CN 105187596B
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Abstract
The present invention is suitable for automatic detection field, provides a kind of automatic device for testing temperature rise, and carrying out temperature for each operational module to an electronic equipment rises test comprising microcontroller and the temperature sensor being electrically connected with microcontroller, thermal imaging system.Temperature sensor senses current environmental temperature.Thermal imaging system under the control of the micro-controller once tests the operating temperature of each operational module every a predetermined time.Microcontroller reads the current environmental temperature that temperature sensor is sensed, and judge whether current environmental temperature is best test temperature, if best test temperature, then the test data of thermal imaging system is read, and the temperature variation of each operational module is made according to test data.Automatic device for testing temperature rise need not be participated in manually, can be carried out temperature automatically and be risen test, convenient and efficient and test data is accurate.The invention further relates to a kind of automatic method for testing temperature rise.
Description
Technical field
The invention belongs to automatic detection field more particularly to a kind of automatic device for testing temperature rise and methods.
Background technology
Mobile phone thermal design is a critically important stage of mobile phone development phase.If mobile phone thermal design is bad, can make to go smoothly
Temperature is excessively high at work for machine.First, excessively high temperature can lead to central processing unit (the Central Processing of mobile phone
Unit, CPU) frequency reducing work, being embodied in mobile phone, interim card, reaction are slow etc. when in use；Secondly, excessively high temperature also results in
Mobile phone crashes in use, influences user experience；Finally, extreme cases such as battery of mobile phone explosion etc. are also excessively sent out with mobile phone
Heat has much relations.
Development phase is all engineer's manual test for the test of mobile phone heat at present.It is had to first in constant temperature
Test pattern (such as game mode, limit mode) is selected in condition, and mobile phone is then allowed to run 45 minutes or a hour, engineering
Teacher observes the heat condition of mobile phone with thermal imaging system timing during this period, if the temperature of which operational module of which is more at moment
Few, complete machine temperature is how many, and just looks at the source etc. of complete machine maximum temperature heat.In this way engineering is required in entire test process
Shi Quancheng is on duty and the moment keeps data recording, greatly increases the workload of engineer, and during manually recorded, by
In the module of mobile phone is more, time point is inconsistent etc., reasons easily lead to record error occurs.
Invention content
Technical problem to be solved by the present invention lies in provide a kind of automatic device for testing temperature rise, it is intended to convenient and efficient and survey
It is accurate to try data.
The invention is realized in this way a kind of automatic device for testing temperature rise, for each work to an electronic equipment
Module carries out temperature and rises test.The automatic device for testing temperature rise includes a microcontroller and be electrically connected with the microcontroller one
Temperature sensor, a thermal imaging system.The temperature sensor is for sensing current environmental temperature.The thermal imaging system is used for micro- at this
The operating temperature of each operational module is once tested every a predetermined time under the control of controller.The microcontroller
The current environmental temperature sensed for reading the temperature sensor, and judge whether the current environmental temperature is best test temperature
Degree, if the current environmental temperature is best test temperature, reads the test data of the thermal imaging system, and according to the test data
The temperature variation of each operational module is made.
The present invention also provides a kind of automatic method for testing temperature rise, for each operational module to an electronic equipment into
Row temperature rises test.The automatic method for testing temperature rise includes the following steps：Sense current environmental temperature；Judge the current environmental temperature
Whether it is best test temperature；If the current environmental temperature is best test temperature, every a predetermined time, test once should
The operating temperature of each operational module, and record test data；And the temperature of each operational module is made according to the test data
Spend variation diagram.
Compared with prior art, the present invention advantageous effect is：The automatic device for testing temperature rise and method need not be artificial
It participates in, can temperature be carried out to electronic equipment automatically and rise test, convenient and efficient and test data is accurate.
Description of the drawings
Fig. 1 is the functional block diagram of automatic device for testing temperature rise provided in an embodiment of the present invention.
Fig. 2 is the temperature variation of the automatic device for testing temperature rise of Fig. 1.
Fig. 3 is the flow chart of automatic method for testing temperature rise provided in an embodiment of the present invention.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
As shown in Figure 1, automatic device for testing temperature rise 100 provided in an embodiment of the present invention, for testing an electronic equipment
The temperature variations of (such as mobile phone) each operational module during the work time.The automatic device for testing temperature rise 100 includes one
A microcontroller 10 and the 20, mode selection modules 30 of a temperature sensor being electrically connected with the microcontroller 10 and one
Thermal imaging system 40.
The temperature sensor 20 is for sensing current environmental temperature.Due to carrying out the process that temperature rises test in the electronic equipment
In, current environmental temperature is excessively high or the too low accuracy that can all influence test data.Best current environmental temperature is 25
Degree Celsius.
The mode selection module 30 is used to select the test pattern of the electronic equipment.Due to the test mould in rising test in temperature
Formula has game mode and limit mode etc., and under different test patterns, the working condition of each operational module is different, feelings of generating heat
Condition is also different.Game mode is to imitate user in the case of the normal use electronic equipment, the fever of each operational module
Situation.Limit mode is to imitate the electronic device works under maximum power dissipation and maximum febrile state, each operational module institute
The maximum heat condition that can be born.
The thermal imaging system 40 is used under the control of the microcontroller 10 every a predetermined time to each operational module
Operating temperature under the test pattern selected is once tested.The thermal imaging system 40 can be according to each operational module
The heat generated at work and the wavelength of infrared ray that sends out calculate the temperature of each operational module.In the present embodiment
In, which determines the operating temperature of each operational module by way of taking pictures.
The microcontroller 10 judges to deserve front ring for reading the current environmental temperature that the temperature sensor 20 is sensed
Whether border temperature is best test temperature, if not best test temperature, then control the mode selection module 30 and the thermal imaging
Instrument 40 is stopped；If best test temperature, then model selection result and the thermal imaging of the mode selection module 30 are read
The test data of instrument 40, and the temperature change of each operational module under different test patterns is made according to the test data
Figure.In the present embodiment, which is in communication with each other by a serial communication modular and the thermal imaging system 40.Due to this
Electronic equipment at work caused by heat gradually increase with being incremented by for time, therefore the temperature of each operational module becomes
Change figure is showed by the form of curve graph, to facilitate research and development engineer that can quickly learn each work by the temperature variation
Make the heat condition of module.As shown in Fig. 2, the horizontal axis of the temperature variation is the time, the longitudinal axis is temperature, in the temperature variation
A plurality of curve be respectively each operational module temperature variation curve, such as curve T1 be the first operational module temperature become
Change curve, curve T2 is the temperature variation curve of the second operational module.
The course of work of the automatic device for testing temperature rise 100 is as follows：The microcontroller 10 is felt by the temperature sensor 20
Current environmental temperature is surveyed, and judges whether the current environmental temperature is best test temperature (such as 25 degrees Celsius), if not most
Good test temperature, then directly terminate；If best test temperature, then the microcontroller 10 by the mode selection module 20 to this
The test pattern of electronic equipment is selected, and then the microcontroller 10 controls the thermal imaging system 30 and tested every a predetermined time
The primary operating temperature of each operational module under the test pattern selected, the microcontroller 10 record the thermal imaging system
Simultaneously the temperature variation of each operational module under different test patterns is made according to the test data in test data.
As shown in figure 3, automatic method for testing temperature rise provided in an embodiment of the present invention, for carrying out Wen Sheng to an electronic equipment
Test.The automatic method for testing temperature rise includes the following steps：
S1：Test current environmental temperature.
S2：Judge whether the current environmental temperature is best test temperature.In the present embodiment, which is
25 degrees Celsius.
S3：If the current environmental temperature is not best test temperature, directly terminate.
S4：If the current environmental temperature is best test temperature, the test pattern of the electronic equipment is selected.
S5：Primary work temperature of each operational module under the test pattern selected is tested every a predetermined time
Degree, and record the test data.
S6：The temperature of each operational module under different test patterns is made according to the test data under different test patterns
Spend variation diagram.
Compared with prior art, automatic device for testing temperature rise of the invention can not need artificial situation on duty
The test of temperature liter is carried out to electronic equipment automatically down and temperature variation is made, convenient and efficient and test data is accurate, can effectively help
Engineer is helped rationally to carry out the thermal design of electronic equipment.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (8)
- It, should be certainly 1. a kind of automatic device for testing temperature rise rises test for each operational module progress temperature to an electronic equipment Dynamic device for testing temperature rise includes a microcontroller and a temperature sensor being electrically connected with the microcontroller, a thermal imaging Instrument, for sensing current environmental temperature, which is used under the control of the microcontroller every one the temperature sensor Predetermined time once tests the operating temperature of each operational module, and the microcontroller is for reading the temperature sensor The current environmental temperature sensed, and judge whether the current environmental temperature is best test temperature, if the current environmental temperature It is best test temperature, then reads the test data of the thermal imaging system, and each operational module is made according to the test data Temperature variation；The automatic device for testing temperature rise further includes a mode selection module, which is used for the electronic equipment Test pattern is selected, which is additionally operable to read the selection result of the mode selection module and the thermal imaging system not With the temperature data under test pattern, and the temperature variation of each operational module under different test patterns is made.
- 2. automatic device for testing temperature rise as described in claim 1, which is characterized in that the microcontroller, which is additionally operable to work as, judges that this is current When environment temperature is not best test temperature, controls the thermal imaging system and be stopped.
- 3. automatic device for testing temperature rise as described in claim 1, which is characterized in that the best test temperature is 25 degrees Celsius.
- 4. automatic device for testing temperature rise as described in claim 1, which is characterized in that the temperature variation is curve graph, the temperature The horizontal axis of variation diagram is the time, and the longitudinal axis is temperature, and a plurality of curve in the temperature variation is each operational module respectively Temperature variation curve.
- 5. automatic device for testing temperature rise as described in claim 1, which is characterized in that the test pattern includes game mode and the limit Pattern.
- It, should be certainly 6. a kind of automatic method for testing temperature rise rises test for each operational module progress temperature to an electronic equipment Dynamic method for testing temperature rise includes the following steps：Test current environmental temperature；Judge whether the current environmental temperature is most preferably to test Temperature；If the current environmental temperature is best test temperature, primary each operational module is tested every a predetermined time Operating temperature, and record test data；And the temperature variation of each operational module is made according to the test data；" if the current environmental temperature is best test temperature, primary each work is tested every a predetermined time in the step Make the operating temperature of module, and record test data " the step of in further include " test pattern for selecting the electronic equipment " step Suddenly, the test pattern of the electronic equipment is first selected, then primary each operational module is tested every a predetermined time and is selecting Operating temperature under the test pattern selected, and record test data.
- 7. automatic method for testing temperature rise as claimed in claim 6, which is characterized in that " be made according to the test data in the step In the temperature variation of each operational module ", need that each work is made according to the test data under different test patterns Temperature variation of the module under different test patterns.
- 8. automatic method for testing temperature rise as claimed in claim 6, which is characterized in that if the current environmental temperature is not most preferably to test Temperature then directly terminates.
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106371001A (en) * | 2016-09-27 | 2017-02-01 | 上海华岭集成电路技术股份有限公司 | Device and method for controlling test temperature of chip to be tested |
| CN108414854A (en) * | 2018-02-07 | 2018-08-17 | 上海康斐信息技术有限公司 | A kind of test method and system of the maximum temperature-rise of wireless routing device |
| CN109238468A (en) * | 2018-07-27 | 2019-01-18 | 上海与德通讯技术有限公司 | Temperature rise automatic test device and method |
| CN110398999A (en) * | 2019-07-29 | 2019-11-01 | 深圳市华检检测技术有限公司 | A kind of temperature data acquisition device and temperature data acquisition method |
| CN111736026A (en) * | 2020-06-29 | 2020-10-02 | 深圳市京泉华科技股份有限公司 | Temperature rise test system and method |
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| CN102279058A (en) * | 2011-06-21 | 2011-12-14 | 惠州Tcl移动通信有限公司 | Testing system and testing method for working temperature of mobile terminal |
| WO2012097596A1 (en) * | 2011-01-20 | 2012-07-26 | 国电南瑞科技股份有限公司 | Temperature rise testing system of electric vehicle conduction type charging interface |
| CN104767855A (en) * | 2015-04-02 | 2015-07-08 | 工业和信息化部电信研究院 | Mobile phone power consumption detection experiment system based on constant-temperature box and detection method thereof |
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2015
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2012097596A1 (en) * | 2011-01-20 | 2012-07-26 | 国电南瑞科技股份有限公司 | Temperature rise testing system of electric vehicle conduction type charging interface |
| CN102279058A (en) * | 2011-06-21 | 2011-12-14 | 惠州Tcl移动通信有限公司 | Testing system and testing method for working temperature of mobile terminal |
| CN104767855A (en) * | 2015-04-02 | 2015-07-08 | 工业和信息化部电信研究院 | Mobile phone power consumption detection experiment system based on constant-temperature box and detection method thereof |
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