CN114325322A - Chip super-low cooling device and chip testing system - Google Patents
Chip super-low cooling device and chip testing system Download PDFInfo
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- CN114325322A CN114325322A CN202111624701.9A CN202111624701A CN114325322A CN 114325322 A CN114325322 A CN 114325322A CN 202111624701 A CN202111624701 A CN 202111624701A CN 114325322 A CN114325322 A CN 114325322A
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Abstract
The invention discloses a chip ultra-low temperature cooling device and a chip testing system, and relates to the technical field of chip testing, wherein the chip ultra-low temperature cooling device comprises a liquid nitrogen pump, and the liquid nitrogen pump is configured to be started according to a control instruction of a control module so as to inject liquid nitrogen of a liquid nitrogen tank into a first Dewar through a first liquid conveying pipe; one end of the first liquid conveying pipe is arranged at the outlet of the liquid nitrogen pump, and the other end of the first liquid conveying pipe extends into the first Dewar flask; the first Dewar is communicated with the second Dewar through a second infusion tube; the second Dewar is not sealed and is communicated with the first Dewar through a second infusion tube, and a wafer bearing table is arranged in the second Dewar and is used for bearing a chip to be tested; and the control module is configured to send a control instruction to the liquid nitrogen pump according to user requirements or based on the received temperature signal or liquid level signal so as to control the start and stop of the liquid nitrogen pump. The chip testing system can realize the automatic filling of liquid nitrogen and the almost constant liquid level height in the chip testing process, and ensure the accuracy of chip testing data.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a chip ultra-low temperature cooling device and a chip testing system.
Background
In the chip testing process, a controlled testing environment needs to be provided for the tested device, and the testing of the electrical performance parameters of the chip is realized through the physical contact between the probe tip and the chip bonding pad. The test process requirement for the chip to be submerged in the liquid nitrogen fluid determines that the liquid nitrogen container is of an open structure. When the chip test is executed, the chip to be tested is placed on a wafer bearing table arranged in a liquid nitrogen container, the liquid nitrogen inevitably suffers continuous descending phenomenon of the liquid level due to continuous gasification under the influence of heat, the liquid nitrogen liquid level in the liquid nitrogen container is manually monitored in real time according to the process requirements, and the liquid nitrogen is filled at certain intervals.
When the chip is tested in an ultralow temperature environment, the liquid nitrogen filling amount is controlled by manually filling liquid nitrogen by means of visual inspection, the liquid level height consistency required by the chip testing process is difficult to ensure, the workload of operators is increased, and the testing efficiency is reduced. On the other hand, liquid nitrogen is easy to overheat and splash, which can cause a small amount of filled fluid to overflow to the environment, even cause accidents such as low-temperature frostbite of operators and the like.
Disclosure of Invention
The invention aims to provide a chip ultra-low temperature cooling device, which aims to solve the technical problems of large liquid level error and low safety of the chip ultra-low temperature cooling device in the prior art caused by filling liquid nitrogen manually, realize automatic liquid nitrogen filling and almost constant liquid level height in the chip testing process and ensure the accuracy of chip testing data.
The invention provides a chip ultralow-temperature cooling device which comprises a liquid nitrogen tank, a liquid nitrogen pump, a control module, a first liquid conveying pipe, a second liquid conveying pipe, a first Dewar, a liquid level meter and a second Dewar, wherein the liquid nitrogen pump is connected with the liquid nitrogen tank;
the liquid nitrogen tank stores liquid nitrogen;
the liquid nitrogen pump is configured to be started according to a control instruction of the control module so as to inject liquid nitrogen of the liquid nitrogen tank into the first Dewar through the first liquid conveying pipe;
one end of the first liquid conveying pipe is arranged at the outlet of the liquid nitrogen pump, and the other end of the first liquid conveying pipe extends into the first Dewar flask;
the first Dewar is communicated with the second Dewar through a second infusion tube and sealed through an end cover, and an exhaust hole and a liquid level meter are arranged on the end cover and used for exhausting gaseous nitrogen; the liquid level meter is used for uploading the collected liquid level signal of the first Dewar to the control module;
the second Dewar is not sealed and is communicated with the first Dewar through a second infusion tube, and the second Dewar is internally provided with the wafer bearing table which is used for bearing a chip to be tested;
the control module is configured to send a control instruction to the liquid nitrogen pump according to user requirements or based on a received liquid level signal so as to control the start and stop of the liquid nitrogen pump.
Further, the connection mode of the end cover and the first Dewar is fixed or movable.
Further, still include: the temperature sensor is arranged on the end cover, a probe of the temperature sensor is positioned in the first Dewar and used for uploading collected temperature signals to the control module, the probe of the temperature sensor is higher than the upper surface of the bearing platform in the second Dewar and lower than the upper surface of the second Dewar, and the control module controls the start and stop of the liquid nitrogen pump according to the received temperature signals.
Further, still include: and the low-temperature electromagnetic valve is arranged on the first infusion tube, is connected with the control module and is opened or closed based on a control instruction of the control module.
Furthermore, the side wall of the first Dewar is also provided with a spillway hole;
further comprising: and the liquid nitrogen barrel is connected with the overflow hole through a third liquid conveying pipe so as to collect overflow liquid nitrogen through the liquid nitrogen barrel under the condition that the liquid level of the liquid nitrogen in the first Dewar is higher than the probe of the temperature sensor.
Further, the height of the overflow hole is higher than the probe of the temperature sensor.
Furthermore, the first infusion tube, the second infusion tube and the third infusion tube respectively comprise an inner tube, an outer tube, a first heat preservation layer and a first protective layer which are arranged from inside to outside;
the outer pipe is fixedly connected with the inner pipe, a first air exhaust hole is formed in the outer pipe, and the first air exhaust hole is used for exhausting air after the outer pipe is fixedly connected with the inner pipe so as to form a first vacuum layer between the outer pipe and the inner pipe.
Furthermore, the first dewar and the second dewar respectively comprise an inner container, an outer container, a second heat insulation layer and a second protection layer which are arranged from inside to outside;
the surface of the inner container opposite to the outer container is further coated with a heat insulation coating, the outer container is fixedly connected with the inner container, a second air exhaust hole is formed in the outer container, and the second air exhaust hole is used for exhausting air after the outer container is fixedly connected with the inner container so as to form a second vacuum layer between the outer container and the inner container.
Further, the inner container of the second dewar is fixedly connected with the wafer bearing table.
The invention also provides a chip testing system comprising the chip ultra-low temperature cooling device.
According to the chip ultra-low temperature cooling device, the liquid nitrogen pump, the control module, the first liquid conveying pipe, the second liquid conveying pipe, the first Dewar, the liquid level meter, the second Dewar and the like are arranged to form the chip ultra-low temperature cooling device, the liquid nitrogen pump in the liquid nitrogen tank is controlled by the control module to inject the liquid nitrogen into the first Dewar according to a liquid level signal monitored by the liquid level meter in real time, the liquid supplementing work of the second Dewar is further completed through the communicating device structure formed by the second liquid conveying pipe between the first Dewar and the second Dewar, a liquid nitrogen environment with almost constant liquid level can be provided for a tested chip when a chip testing system carries out chip electrical performance testing, the defect that the liquid level height error is large due to the fact that the liquid nitrogen filling amount is controlled by means of visual inspection when liquid nitrogen is manually filled is overcome, and the accuracy of chip testing data is guaranteed; on the other hand, the automatic liquid nitrogen filling device realizes the automatic liquid nitrogen filling, reduces the workload of frequent liquid nitrogen filling of operators, ensures the operation safety and improves the test efficiency.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a schematic diagram of a basic structure of an ultra-low temperature cooling apparatus for a chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an infusion tube according to an embodiment of the present invention;
fig. 3 is a schematic diagram of basic structures of a first dewar and a second dewar according to an embodiment of the present invention.
Reference numerals:
1-a liquid nitrogen tank, 2-a liquid nitrogen pump, 3-a low-temperature electromagnetic valve, 4-a first liquid conveying pipe, 5-a control module, 6-an end cover, 7-a first Dewar, 8-a second liquid conveying pipe, 9-a bearing platform, 10-a second Dewar, 11-a liquid level meter, 12-a temperature sensor, 13-a liquid nitrogen barrel and 14-a third liquid conveying pipe;
801-inner tube, 802-first vacuum layer, 803-outer tube, 804-first heat preservation layer, 805-first protective layer;
1001-inner container, 1002-heat insulation coating, 1003-second vacuum layer, 1004-outer container, 1005-second heat insulation layer and 1006-second protective layer.
Detailed Description
Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The embodiment of the invention provides a chip ultra-low temperature cooling device, which comprises a liquid nitrogen tank 1, a liquid nitrogen pump 2, a control module 5, a first liquid conveying pipe 4, a second liquid conveying pipe 8, a first Dewar 7, a liquid level meter 11 and a second Dewar 10, as shown in figure 1.
The liquid nitrogen tank 1 stores liquid nitrogen therein. The specific liquid nitrogen tank 1 may be closed, and the closed state of the liquid nitrogen tank 1 may be maintained by a liquid nitrogen pump 2, for example.
The liquid nitrogen pump 2 is configured to be activated according to a control instruction of the control module 5 to inject liquid nitrogen of the liquid nitrogen tank 1 into the first dewar 7 through the first liquid conveying pipe 4. The input end of the liquid nitrogen pump 2 is connected with a guide pipe which extends into the bottom of the liquid nitrogen tank 1, so that liquid nitrogen can be input from the liquid nitrogen tank 1 after the liquid nitrogen pump 2 is started, and the liquid nitrogen is injected into the first Dewar 7 through a first liquid conveying pipe 4.
One end of the first infusion tube 4 is arranged at the outlet of the liquid nitrogen pump 2, and the other end of the first infusion tube extends into the first Dewar flask 7.
First dewar 7, with second dewar 10 passes through second transfer line 8 intercommunication, seals through end cover 6, just be provided with exhaust hole (not shown in the figure) and level gauge 11 on the end cover 6, the exhaust hole is arranged in discharging gaseous nitrogen in first dewar 7 to the atmospheric pressure that maintains in first dewar 7 is in presetting the scope. The input end (conduit) of the liquid level meter 11 is located in the first dewar 7, and is used for uploading the collected liquid level signal of the first dewar 7 to the control module 5.
According to the invention, the volatilization of liquid nitrogen in the first Dewar 7 can be reduced through the structure of the end cover 6, and the utilization efficiency of the liquid nitrogen is improved. The end cover 6 is connected with the first Dewar 7 in a fixed or movable mode.
The second Dewar 10 is not sealed, is communicated with the first Dewar 7 through a second infusion tube 8, and is internally provided with the wafer bearing table 9, and the wafer bearing table 9 is used for bearing a chip to be tested. The solution of the invention uses the principle of communicating vessels, the level of the first dewar 7 being the same as the level of the second dewar 10.
The temperature sensor 12 is arranged on the end cover 6, is connected with the control module 5 through a lead and is used for monitoring the temperature above liquid nitrogen fluid in the first Dewar 7 in real time, and when the liquid level is unexpectedly raised due to failure of the liquid level meter 11 and other reasons, the control module 5 sends out an alarm signal, and simultaneously closes the low-temperature electromagnetic valve 3 and stops the liquid nitrogen pump 2 from running;
the installation position of the temperature sensor 12 on the end cover 6 can be adjusted as required, the position of a probe of the temperature sensor 12 is ensured to be higher than the upper surface of the bearing platform 9 and lower than the upper surface of the second Dewar 10, and the overflow of liquid nitrogen to the environment can be effectively prevented through the control module 5.
The liquid level of the liquid nitrogen in the first dewar 7 is monitored by the temperature sensor 12 and the liquid level meter 11, so that the liquid level of the second dewar 10 can be directly determined. The temperature sensor 12 arranged in the invention can monitor the unexpected working condition of automatic filling of liquid nitrogen in real time, prevent the liquid nitrogen from overflowing to the environment and improve the working reliability and safety of the chip testing system; the first Dewar 7, the third infusion tube 14 and the liquid nitrogen barrel 13 which are provided with overflow holes further ensure that liquid nitrogen does not overflow to the environment under the unexpected working condition of liquid nitrogen automatic filling, further improve the working reliability and safety of the chip testing system, and also improve the utilization efficiency of the liquid nitrogen.
The control module 5 is configured to send a control instruction to the liquid nitrogen pump 2 according to a user demand or based on a received temperature signal or liquid level signal, so as to control the start and stop of the liquid nitrogen pump 2. For example, in some embodiments, the control module 5 controls the start and stop of the liquid nitrogen pump 2 according to the liquid level of the liquid level meter 11, so as to maintain the liquid nitrogen level in the second dewar 10 within a preset height range. In some embodiments, the probe of the temperature sensor 12 is higher than the upper surface of the stage 9 of the second dewar 10 and lower than the upper surface of the second dewar 10, so that in the case of a liquid level that is too high, the temperature value collected by the temperature sensor 12 appears to be lower than a preset value, so that the control module 5 can be used to issue a warning and control the liquid nitrogen pump 2 to be turned off.
According to the embodiment of the invention, the liquid nitrogen pump 2, the control module 5, the first infusion tube 4, the second infusion tube 8, the first Dewar 7, the liquid level meter 11 and the second Dewar 10 are arranged, the liquid nitrogen pump 2 is controlled by the control module 5 to inject the liquid nitrogen in the liquid nitrogen tank 1 into the first Dewar 7 according to a liquid level signal monitored by the liquid level meter 11 in real time, and further the liquid supplementing work for the second Dewar 10 is completed by forming a communicating device structure through the second infusion tube 8 between the first Dewar 7 and the second Dewar 10.
In some embodiments, further comprising: and the low-temperature electromagnetic valve 3 is arranged on the first infusion tube 4, and the low-temperature electromagnetic valve 3 is connected with the control module 5 so as to be opened or closed based on a control instruction of the control module 5. Namely, the invention further arranges the low-temperature electromagnetic valve 3 to execute or stop the action of supplementing liquid nitrogen, thereby ensuring that the whole liquid supplementing process is controllable.
In some embodiments, the first dewar 7 is further provided with an overflow hole (not shown) on a sidewall thereof. The chip ultra-low temperature cooling device further comprises: and the liquid nitrogen barrel 13 is connected with the overflow hole through a third liquid conveying pipe 14 so as to collect overflow liquid nitrogen through the liquid nitrogen barrel 13 under the condition that the liquid level of the liquid nitrogen in the first Dewar 7 is higher than the probe of the temperature sensor 12. In some embodiments, the height of the weep hole is higher than the probe of the temperature sensor 12. The chip ultra-low temperature cooling device disclosed by the invention is matched with the liquid nitrogen barrel 13 through a liquid overflow hole structure, and when the liquid level is unexpectedly increased due to the reasons of failure of the liquid level meter 11 and the like, the control module 5 can send out an alarm signal, and simultaneously, the low-temperature electromagnetic valve 3 is closed and the operation of the liquid nitrogen pump 2 is stopped. That is to say, first dewar 7 is last to be provided with the overflow hole, and liquid nitrogen bucket 13 links to each other at the overflow hole department with first dewar 7 through third transfer line 14, and the overflow hole position is higher than temperature sensor 12's probe position is less than the upper surface of second dewar 10, and under unexpected operating mode such as control module 5 communication trouble, liquid nitrogen bucket 13 is used for the holding of excessive liquid nitrogen, has both effectively prevented that liquid nitrogen excessive from causing the chip test system to damage in the environment, can realize the reutilization of liquid nitrogen again.
In some embodiments, as shown in fig. 2, the first infusion tube 4, the second infusion tube 8, and the third infusion tube 14 each comprise an inner tube 801, an outer tube 803, a first insulating layer 804, and a first protective layer 805 disposed from the inside to the outside; the outer tube 803 is fixedly connected to the inner tube 801, and a first pumping hole (not shown) is disposed on the outer tube 803, and the first pumping hole is used for pumping air after the outer tube 803 is fixedly connected to the inner tube 801, so as to form a first vacuum layer 802 between the outer tube 803 and the inner tube 801. That is, the first infusion tube 4, the second infusion tube 8 and the third infusion tube 14 can be realized by the same structure, and each of the first infusion tube, the second infusion tube and the third infusion tube includes an inner tube 801, an outer tube 803, a first heat preservation layer 804 and a first protection layer 805 which are arranged from inside to outside, and a first vacuum layer 802 structure is formed between the inner tube 801 and the outer tube 803. According to the invention, the first vacuum layer 802 and the first heat preservation layer 804 are used for preventing liquid nitrogen from exchanging heat with the environment through the pipe wall of the inner pipe 801, so that the liquid nitrogen gasification is reduced to improve the utilization efficiency of the liquid nitrogen, and the first protection layer 805 is used for preventing the first heat preservation layer 804 from absorbing moisture to reduce the heat preservation performance.
In some embodiments, as shown in fig. 3, each of the first dewar 7 and the second dewar 10 includes an inner vessel 1001, an outer vessel 1004, a second insulating layer 1005, and a second protective layer 1006 disposed from the inside to the outside.
The surface of the inner container 1001 opposite to the outer container 1004 is further coated with a heat insulation coating 1002, the outer container 1004 is fixedly connected with the inner container 1001, and a second air exhaust hole (not shown in the figure) is arranged on the outer container 1004 and is used for exhausting air after the outer container 1004 is fixedly connected with the inner container 1001 so as to form a second vacuum layer 1003 between the outer container 1004 and the inner container 1001.
Specifically, in the present invention, the inner space of the inner container 1001 and the outer container 1004 after being fixedly connected is vacuumized to form the second vacuum layer 1003, and the outer surface of the outer container 1004 is sequentially provided with the second insulating layer 1005 and the second protective layer 1006. The inner container 1001 and the outer container 1004 have high rigidity and strength.
In some embodiments, the second dewar bladder 1001 is fixedly connected to the stage 9. That is, the inner container 1001 stores liquid nitrogen fluid for immersing the chip and is fixedly connected with the wafer bearing table 9, and the outer container 1004 is fixedly connected with the frame of the chip testing system. The heat insulation coating 1002, the second vacuum layer 1003 and the second heat insulation layer 1005 are used for preventing liquid nitrogen from exchanging heat with the environment through the bottom surface and the side surface of the second dewar 10 and the first dewar 7, and reducing vaporization of the liquid nitrogen to improve utilization efficiency of the liquid nitrogen. The second protective layer 1006 serves to prevent the second insulating layer 1005 from absorbing moisture to deteriorate the insulating property.
In summary, the invention is provided with the first dewar 7, the second dewar 10, the wafer stage 9, the liquid level meter 11, the control module 5, the infusion tube and the like to form the chip ultra-low temperature cooling device, the liquid level signal monitored by the liquid level meter 11 in real time is used for realizing automatic liquid nitrogen filling by the control module 5 through the liquid nitrogen tank 1, the liquid nitrogen pump 2, the low temperature electromagnetic valve 3 and the like, a liquid nitrogen environment with almost constant liquid level can be provided for the tested chip when the chip testing system tests the electrical performance of the chip, the defect of larger liquid level height error caused by controlling the liquid nitrogen filling amount by means of visual inspection when the chip testing system is used for manually filling liquid nitrogen is overcome, and the accuracy of chip testing data is ensured.
On the other hand, the automatic liquid nitrogen filling device realizes the automatic liquid nitrogen filling, reduces the workload of frequent liquid nitrogen filling of operators, ensures the operation safety and improves the test efficiency.
The temperature sensor 12 is arranged, so that the unexpected working condition of automatic filling of liquid nitrogen can be monitored in real time, the liquid nitrogen is prevented from overflowing to the environment, and the working reliability and safety of the chip testing system are improved. The first Dewar 7, the third infusion tube 14 and the liquid nitrogen barrel 13 which are provided with the overflow holes ensure that liquid nitrogen does not overflow to the environment under the unexpected working condition of automatic liquid nitrogen filling, improve the working reliability and safety of the chip testing system and improve the utilization efficiency of the liquid nitrogen.
The embodiment of the invention also provides a chip testing system (not shown in the figure), which comprises the above-mentioned chip ultra-low temperature cooling device. And all the implementation manners of the ultra-low temperature cooling device for the chip are applicable to the embodiment of the chip testing system, and the same technical effect can be achieved, which is not described herein again.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art can clearly understand that the method of the above embodiments can be implemented by software plus a necessary hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. With such an understanding, the portions of the technical solutions of the present invention that contribute to the prior art can be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for causing a terminal (which may be a computer or a network device) to execute the methods according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A chip ultra-low temperature cooling device is characterized by comprising a liquid nitrogen tank, a liquid nitrogen pump, a control module, a first liquid conveying pipe, a second liquid conveying pipe, a first Dewar, a liquid level meter and a second Dewar;
the liquid nitrogen tank stores liquid nitrogen;
the liquid nitrogen pump is configured to be started according to a control instruction of the control module so as to inject liquid nitrogen of the liquid nitrogen tank into the first Dewar through the first liquid conveying pipe;
one end of the first liquid conveying pipe is arranged at the outlet of the liquid nitrogen pump, and the other end of the first liquid conveying pipe extends into the first Dewar flask;
the first Dewar is communicated with the second Dewar through a second infusion tube and sealed through an end cover, and an exhaust hole and a liquid level meter are arranged on the end cover and used for exhausting gaseous nitrogen; the liquid level meter is used for uploading the collected liquid level signal of the first Dewar to the control module;
the second Dewar is not sealed and is communicated with the first Dewar through a second infusion tube, and the second Dewar is internally provided with the wafer bearing table which is used for bearing a chip to be tested;
the control module is configured to send a control instruction to the liquid nitrogen pump according to user requirements or based on a received liquid level signal so as to control the start and stop of the liquid nitrogen pump.
2. The ultra-low temperature cooling apparatus for chips of claim 1, wherein the end cap is connected to the first dewar in a fixed or movable manner.
3. The ultra-low temperature cooling apparatus for chips as claimed in claim 1, further comprising: the temperature sensor is arranged on the end cover, a probe of the temperature sensor is positioned in the first Dewar and used for uploading acquired temperature signals to the control module, and the probe of the temperature sensor is higher than the upper surface of the bearing table in the second Dewar and lower than the upper surface of the second Dewar.
4. The ultra-low temperature cooling apparatus for chips as claimed in claim 1, further comprising:
and the low-temperature electromagnetic valve is arranged on the first infusion tube, is connected with the control module and is opened or closed based on a control instruction of the control module.
5. The ultra-low temperature cooling apparatus for chips as claimed in claim 1, wherein the sidewall of the first dewar is further provided with an overflow hole;
further comprising:
and the liquid nitrogen barrel is connected with the overflow hole through a third liquid conveying pipe so as to collect overflow liquid nitrogen through the liquid nitrogen barrel under the condition that the liquid level of the liquid nitrogen in the first Dewar is higher than the probe of the temperature sensor.
6. The ultra-low temperature cooling apparatus for chips as set forth in claim 5, wherein the height of said overflow hole is higher than the height of the probe of said temperature sensor.
7. The chip ultra-low temperature cooling device of claim 5, wherein the first infusion tube, the second infusion tube and the third infusion tube each comprise an inner tube, an outer tube, a first heat preservation layer and a first protection layer arranged from inside to outside;
the outer pipe is fixedly connected with the inner pipe, a first air exhaust hole is formed in the outer pipe, and the first air exhaust hole is used for exhausting air after the outer pipe is fixedly connected with the inner pipe so as to form a first vacuum layer between the outer pipe and the inner pipe.
8. The ultra-low temperature cooling device for chips of claim 1, wherein the first dewar and the second dewar each comprise an inner container, an outer container, a second insulating layer and a second protective layer disposed from inside to outside;
the surface of the inner container opposite to the outer container is further coated with a heat insulation coating, the outer container is fixedly connected with the inner container, a second air exhaust hole is formed in the outer container, and the second air exhaust hole is used for exhausting air after the outer container is fixedly connected with the inner container so as to form a second vacuum layer between the outer container and the inner container.
9. The ultra-low temperature cooling apparatus for chips of claim 8, wherein the inner container of the second dewar is fixedly connected to the stage.
10. A chip testing system comprising the ultra-low temperature cooling apparatus for chip as claimed in any one of claims 1 to 9.
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| CN116255767A (en) * | 2023-03-27 | 2023-06-13 | 无锡爱思科仪器有限公司 | Liquid nitrogen freezing box for chip test |
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