CN114310640A - Polishing method for hemispherical harmonic oscillator - Google Patents
Polishing method for hemispherical harmonic oscillator Download PDFInfo
- Publication number
- CN114310640A CN114310640A CN202111417233.8A CN202111417233A CN114310640A CN 114310640 A CN114310640 A CN 114310640A CN 202111417233 A CN202111417233 A CN 202111417233A CN 114310640 A CN114310640 A CN 114310640A
- Authority
- CN
- China
- Prior art keywords
- polishing
- harmonic oscillator
- spherical
- spherical surface
- hemispherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 192
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000010985 leather Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 239000005060 rubber Substances 0.000 claims description 6
- 238000013016 damping Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000010426 asphalt Substances 0.000 claims description 3
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 230000010355 oscillation Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a polishing method of a hemispherical harmonic oscillator, which comprises the following steps: s1, providing a polishing die, wherein the polishing die is provided with a spherical polishing surface matched with the spherical surface of the harmonic oscillator; s2, configuring a polishing die and a harmonic oscillator to be polished, and enabling the spherical surface of the harmonic oscillator and the spherical polishing surface to be concentrically arranged, wherein the spherical polishing surface is attached to the spherical surface of the harmonic oscillator; s3, providing polishing liquid to the joint of the spherical polishing surface and the hemispherical harmonic oscillator; s4, the hemispherical harmonic oscillator is driven to rotate to polish, the harmonic oscillator is polished by the polishing die with the spherical polishing surface, the polishing time is short, the polishing effect is obvious, the technical problems of low polishing efficiency and low surface shape precision of the inner spherical surface and the outer spherical surface of the harmonic oscillator are successfully solved, and the spherical surface of the harmonic oscillator is polished.
Description
Technical Field
The invention relates to the field of optical device processing, in particular to a hemispherical harmonic oscillator polishing method.
Background
The hemisphere harmonic oscillator is used as a core and a sensitive part of the hemisphere resonance gyroscope, generally adopts hard and brittle quartz glass materials, has the shape of a hemisphere thin wall such as a fish fork shape, an umbrella shape, a mushroom shape and the like, and has a crack layer after the harmonic oscillator is subjected to precision grinding processing, so that the Q value and the frequency cracking of quality factors are not high. Therefore, precision polishing is needed after the harmonic oscillator is precisely ground, so that on one hand, a crack layer on the surface of the harmonic oscillator is removed, the quality factor Q value of the harmonic oscillator is improved, and frequency cracking is reduced; on the other hand, the surface shape accuracy of the harmonic oscillator is ensured, and the quality defects of frequency cracking, uneven damping, vibration mode deviation and the like are reduced.
At present, the precision polishing of the domestic hemispherical harmonic oscillator mainly adopts a magnetorheological technology and a flow channel restriction-shear rheological polishing technology. The magnetorheological polishing technology adopts a polishing wheel which can not realize chamfer polishing of the inner spherical surface of the harmonic oscillator and the root part of the inner supporting rod, adopts a permanent magnet ball head for polishing, and is difficult to realize the polishing uniformity of the spherical surface of the harmonic oscillator and ensure the surface shape precision of the spherical surface; the problems of long polishing time, surface shape accuracy consistency and the like exist in flow channel constraint-shear rheological polishing, and engineering application of the hemispherical harmonic oscillator is difficult to realize. In a word, the engineering application of the domestic hemisphere harmonic oscillator polishing technology is not mature, and the problems of low surface shape precision and low polishing efficiency exist.
Disclosure of Invention
Based on the above description, the invention provides a hemispherical resonator polishing method, so as to solve the technical problems of low surface shape precision and low polishing efficiency in the hemispherical resonator polishing technology in the prior art.
The technical scheme for solving the technical problems is as follows:
a polishing method of a hemispherical harmonic oscillator comprises the following steps:
s1, providing a polishing die, wherein the polishing die is provided with a spherical polishing surface matched with the spherical surface of the harmonic oscillator;
s2, configuring a polishing die and a harmonic oscillator to be polished, and enabling the spherical surface of the harmonic oscillator and the spherical polishing surface to be concentrically arranged, wherein the spherical polishing surface is attached to the spherical surface of the harmonic oscillator;
s3, providing polishing liquid to the joint of the spherical polishing surface and the hemispherical harmonic oscillator;
and S4, driving the hemispherical harmonic oscillator to rotate for polishing.
Compared with the prior art, the technical scheme of the application has the following beneficial technical effects:
the harmonic oscillator is polished by the polishing die with the spherical polishing surface, the polishing time is short, the polishing effect is obvious, the technical problems of low polishing efficiency and low surface shape precision of the inner spherical surface and the outer spherical surface of the harmonic oscillator are successfully solved, and the spherical surface of the harmonic oscillator is polished.
On the basis of the technical scheme, the invention can be further improved as follows.
Further, the providing a polishing mold includes:
s11, manufacturing a polishing die base body, wherein the polishing die base body is provided with a working end, the working end is provided with a spherical mounting surface, and the end surface of the working end is provided with a central hole;
s12, cutting the polishing leather;
and S13, sticking the polishing leather to the spherical mounting surface.
Further, the polishing mold base material is any one of polishing foam, rubber, polyurethane or silica gel.
Further, the polishing leather material is any one of polyurethane, damping cloth, flannelette, felt, asphalt or polishing rubber.
Further, the specific shape is any one of a petal shape, a triangle shape, a prism shape or a strip shape.
Further, the configuring of the polishing mold and the harmonic oscillator to be polished is specifically that the polishing mold and the harmonic oscillator to be polished are respectively installed on a tool shaft and a workpiece shaft of the polishing machine.
Further, the polishing die comprises an inner spherical surface polishing die and an outer spherical surface polishing die, the spherical polishing surface of the inner spherical surface polishing die is an outer spherical surface matched with the inner spherical surface of the harmonic oscillator, and the spherical polishing surface of the outer spherical surface polishing die is an inner spherical surface matched with the outer spherical surface of the harmonic oscillator; and the central hole axis of the inner spherical surface polishing die and the support rod axis of the harmonic oscillator are coaxially arranged during polishing, and the central hole axis of the outer spherical surface polishing die and the support rod axis of the harmonic oscillator are vertically arranged.
Further, the providing the polishing solution includes:
s31, mixing the cerium oxide polishing powder and pure water according to the proportion of 1:20 to prepare polishing solution;
s32, adding the polishing solution into a polishing solution circulating device;
and S33, aligning the liquid outlet of the polishing liquid to the joint of the spherical polishing surface and the hemispherical harmonic oscillator.
Further, the polishing die rotates and swings with the center of sphere as a reference in the polishing process.
Further, the swing angle of the polishing die is +/-15 degrees.
Drawings
Fig. 1 is a schematic structural diagram of a harmonic oscillator to be polished in an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an insert polishing mold according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an inner sphere polishing mold according to an embodiment of the present invention;
fig. 4 is a schematic polishing diagram of an inner spherical surface of a harmonic oscillator in an embodiment of the present invention;
fig. 5 is a schematic polishing diagram of an outer spherical surface of a harmonic oscillator in an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that spatial relationship terms, such as "under", "below", "beneath", "below", "over", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. The "connection" in the following embodiments is understood as "electrical connection", "communication connection", or the like if the connected circuits, modules, units, or the like have electrical signals or data transmission therebetween.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
Example one
In this embodiment, as shown in fig. 1, physical dimensions of the harmonic oscillator to be polished are as follows: the curvature radius D of the outer spherical surface is 16mm, the curvature radius D of the inner spherical surface is 15mm, and the diameter L of the support rod is 8 mm.
The polishing method comprises the following steps:
a first step S1 of providing a polishing die, wherein the polishing die is provided with a spherical polishing surface matched with the spherical surface of the harmonic oscillator;
in this embodiment, the polishing die includes an inner spherical surface polishing die 12 and an outer spherical surface polishing die 11, the spherical polishing surface of the inner spherical surface polishing die 11 is an outer spherical surface matched with the inner spherical surface of the harmonic oscillator, and the spherical polishing surface of the outer spherical surface polishing die 12 is an inner spherical surface matched with the outer spherical surface of the harmonic oscillator.
In this embodiment, the polishing mold is provided in a self-made form, and with reference to fig. 2 and 3, the preparation of the internal spherical polishing mold 12 includes:
s11, manufacturing a polishing die base body 121 by using polishing foam, wherein the polishing die base body 121 is provided with a working end, the working end is provided with a spherical mounting surface, and the end surface of the working end is provided with a central hole;
wherein, the spherical mounting surface is an outward convex spherical surface, the curvature radius is 14.2mm, the diameter of the central hole is 20mm, and the depth of the central hole is 10 mm.
S12, cutting and forming a polishing skin 122 in a petal shape by using 0.8mm polyurethane;
s13, adhering the polishing skin 122 with the shape of a petal to the spherical installation surface.
It is understood that the material of the polishing mold base 121 may also be any one of rubber, polyurethane or silicone; the polishing leather 122 can also be made of any one of damping cloth, flannelette, felt, asphalt or polishing rubber; polishing skin 122 can also be cut into any of a triangle, a prism, or a strip.
Similarly, the manufacturing of the outer spherical surface polishing mold 11 is similar to the above steps, and will not be described herein again, wherein the spherical mounting surface of the polishing mold base 111 of the outer spherical surface polishing mold is a concave spherical surface, the curvature radius thereof is 15.8mm, the polishing skin 112 thereof is consistent with the above, the diameter of the central hole is 20mm, and the depth of the central hole is 10 mm.
And then, performing a second step S2, configuring a polishing die and the harmonic oscillator to be polished, so that the spherical surface of the harmonic oscillator and the spherical polishing surface are concentrically arranged, and the spherical polishing surface is attached to the spherical surface of the harmonic oscillator.
Specifically, the polishing die and the harmonic oscillator to be polished are respectively installed on a tool shaft and a workpiece shaft of the polishing machine.
During installation, the axis of the central hole of the inner spherical polishing die is coaxially arranged with the axis of the support rod of the harmonic oscillator, and the axis of the central hole of the outer spherical polishing die is perpendicular to the axis of the support rod of the harmonic oscillator.
Then, carrying out a third step S3, and providing polishing liquid to the joint of the spherical polishing surface and the hemispherical harmonic oscillator;
the method specifically comprises the following steps:
s31, mixing the cerium oxide polishing powder and pure water according to the proportion of 1:20 to prepare polishing solution;
s32, adding the polishing solution into a polishing solution circulating device;
and S33, aligning the liquid outlet of the polishing liquid to the joint of the spherical polishing surface and the hemispherical harmonic oscillator.
It should be noted that S31 and S32 may be performed at any time before the polishing work is started, and are not necessarily limited to after S1 and S2.
Then, the polishing operation is started, i.e. the fourth step S4, the hemispherical resonator is driven to rotate for polishing.
In the present embodiment, the harmonic oscillator rotation speed is 66 rpm.
In some embodiments, the polishing mold is in a stationary state, and in order to enhance the polishing effect and shorten the polishing time, the polishing mold also rotates with a rotation speed of 500rpm, and further swings with the center of a sphere as a reference, and the swing may be a reciprocating swing in a one-dimensional direction or a reciprocating swing in a two-dimensional direction.
As shown in fig. 4, which is a schematic diagram of the internal spherical surface polishing of the harmonic oscillator, the harmonic oscillator 6 rotates in the direction a in fig. 4, the support rod of the harmonic oscillator is vertically inserted into the central hole of the internal spherical surface polishing mold 12, the internal spherical surface polishing mold 12 rotates in the direction b opposite to the harmonic oscillator, and the internal spherical surface polishing mold 12 can swing back and forth in the left-right direction or in the left-right direction and in the front-back direction.
As shown in fig. 5, which is a schematic diagram of the outer spherical surface polishing of the harmonic oscillator, the harmonic oscillator 6 rotates in the direction a shown in fig. 5, the support rod of the harmonic oscillator 6 is vertically disposed, one side of the harmonic oscillator 6 extends into the central hole of the outer spherical surface polishing mold 11, the inner spherical surface polishing mold 11 rotates in the direction c shown in fig. 5, and further, the inner spherical surface polishing mold 12 can swing back and forth in the up-down direction, and also can swing back and forth in the up-down direction and the front-back direction.
In the embodiment, the inner spherical surface and the outer spherical surface of the harmonic oscillator are respectively polished for 2 hours, and the sand surface on the spherical surface of the harmonic oscillator is completely removed, so that the roundness of the spherical surface is maintained, and the roughness of the surface is also reduced. Wherein, the roundness of the inner spherical surface and the outer spherical surface after polishing is better than 0.5 μm, the surface roughness is better than 20nm, and the polishing effect is greatly enhanced while the polishing period is reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A polishing method of a hemispherical harmonic oscillator comprises the following steps:
s1, providing a polishing die, wherein the polishing die is provided with a spherical polishing surface matched with the spherical surface of the harmonic oscillator;
s2, configuring a polishing die and a harmonic oscillator to be polished, and enabling the spherical surface of the harmonic oscillator and the spherical polishing surface to be concentrically arranged, wherein the spherical polishing surface is attached to the spherical surface of the harmonic oscillator;
s3, providing polishing liquid to the joint of the spherical polishing surface and the hemispherical harmonic oscillator;
and S4, driving the hemispherical harmonic oscillator to rotate for polishing.
2. The method for polishing a hemispherical resonator according to claim 1, wherein the providing a polishing mold comprises:
s11, manufacturing a polishing die base body, wherein the polishing die base body is provided with a working end, the working end is provided with a spherical mounting surface, and the end surface of the working end is provided with a central hole;
s12, cutting the polishing leather;
and S13, sticking the polishing leather to the spherical mounting surface.
3. The method for polishing a hemispherical resonator according to claim 2, wherein the polishing mold base material is any one of polishing foam, rubber, polyurethane, or silicone.
4. The method for polishing a hemispherical resonator mirror according to claim 2, wherein the polishing skin material is any one of polyurethane, damping cloth, flannelette, felt, asphalt, or polishing rubber.
5. The method for polishing a hemispherical resonator according to claim 2, wherein the specific shape is any one of a petal shape, a triangular shape, a prismatic shape, or a bar shape.
6. The method for polishing a hemispherical resonator mirror according to claim 1, wherein the step of configuring the polishing mold and the resonator mirror to be polished is to mount the polishing mold and the resonator mirror to be polished on a tool shaft and a workpiece shaft of a polishing machine, respectively.
7. The method for polishing a hemispherical resonator according to claim 6, wherein the polishing mold comprises an inner spherical surface polishing mold and an outer spherical surface polishing mold, the spherical polishing surface of the inner spherical surface polishing mold is an outer spherical surface matching the inner spherical surface of the resonator, and the spherical polishing surface of the outer spherical surface polishing mold is an inner spherical surface matching the outer spherical surface of the resonator; and the central hole axis of the inner spherical surface polishing die and the support rod axis of the harmonic oscillator are coaxially arranged during polishing, and the central hole axis of the outer spherical surface polishing die and the support rod axis of the harmonic oscillator are vertically arranged.
8. The method for polishing a hemispherical resonator mirror according to claim 1, wherein the supplying of the polishing liquid comprises:
s31, mixing the cerium oxide polishing powder and pure water according to the proportion of 1:20 to prepare polishing solution;
s32, adding the polishing solution into a polishing solution circulating device;
and S33, aligning the liquid outlet of the polishing liquid to the joint of the spherical polishing surface and the hemispherical harmonic oscillator.
9. The method for polishing a hemispherical resonator mirror according to claim 1, wherein the polishing mold rotates and swings with respect to a center of a sphere thereof during polishing.
10. The method for polishing a hemispherical resonator according to claim 6, wherein the angle of oscillation of the polishing mold is ± 15 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111417233.8A CN114310640A (en) | 2021-11-26 | 2021-11-26 | Polishing method for hemispherical harmonic oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111417233.8A CN114310640A (en) | 2021-11-26 | 2021-11-26 | Polishing method for hemispherical harmonic oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114310640A true CN114310640A (en) | 2022-04-12 |
Family
ID=81046877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111417233.8A Pending CN114310640A (en) | 2021-11-26 | 2021-11-26 | Polishing method for hemispherical harmonic oscillator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114310640A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001121391A (en) * | 1999-10-28 | 2001-05-08 | Canon Inc | Polishing plate combining method |
| US20160008944A1 (en) * | 2013-03-19 | 2016-01-14 | Jun Zha | Polishing device for optical elements and method thereof |
| CN109483394A (en) * | 2018-09-13 | 2019-03-19 | 西安航晨机电科技股份有限公司 | Hemispherical resonator ultraprecise device for machining spherical surface and processing method |
| CN111300160A (en) * | 2020-02-24 | 2020-06-19 | 大连理工大学 | Ultraprecise processing method and device for quartz harmonic oscillator |
| CN111843634A (en) * | 2020-07-28 | 2020-10-30 | 大连理工大学 | Quartz hemispherical harmonic oscillator processing tool and method |
| CN112621538A (en) * | 2020-12-15 | 2021-04-09 | 中国建筑材料科学研究总院有限公司 | Polishing method for harmonic oscillator shell end face |
-
2021
- 2021-11-26 CN CN202111417233.8A patent/CN114310640A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001121391A (en) * | 1999-10-28 | 2001-05-08 | Canon Inc | Polishing plate combining method |
| US20160008944A1 (en) * | 2013-03-19 | 2016-01-14 | Jun Zha | Polishing device for optical elements and method thereof |
| CN109483394A (en) * | 2018-09-13 | 2019-03-19 | 西安航晨机电科技股份有限公司 | Hemispherical resonator ultraprecise device for machining spherical surface and processing method |
| CN111300160A (en) * | 2020-02-24 | 2020-06-19 | 大连理工大学 | Ultraprecise processing method and device for quartz harmonic oscillator |
| CN111843634A (en) * | 2020-07-28 | 2020-10-30 | 大连理工大学 | Quartz hemispherical harmonic oscillator processing tool and method |
| CN112621538A (en) * | 2020-12-15 | 2021-04-09 | 中国建筑材料科学研究总院有限公司 | Polishing method for harmonic oscillator shell end face |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109483394B (en) | Ultra-precise spherical surface machining device and method for hemispherical harmonic oscillator | |
| CN111238461B (en) | Harmonic oscillator and preparation method thereof | |
| US20240123567A1 (en) | Double-sided polishing method for optical lens | |
| CN112108944A (en) | Hemispherical harmonic oscillator flow channel constraint-shear rheological polishing method and device | |
| CN115972073A (en) | Double-side polishing method for quartz hemispherical harmonic oscillator | |
| CN115723025A (en) | Ultra-precise polishing device and polishing method for hemispherical harmonic oscillator | |
| CN114310640A (en) | Polishing method for hemispherical harmonic oscillator | |
| CN109396966B (en) | Method for processing concave spherical crown or concave spherical ring surface by multi-magnet arrangement annular magneto-rheological polishing tool | |
| CN103846630A (en) | Method for manufacturing thin-wall metal semi-spherical shell with seam allowance | |
| CN212444365U (en) | A high-efficient automatic burnishing device for fused quartz glass processing | |
| CN116900930A (en) | Quartz hemispherical harmonic oscillator spherical polishing cutter and polishing method | |
| CN117283379A (en) | Hemispherical harmonic oscillator force rheological polishing equipment and force rheological polishing method | |
| CN111266939A (en) | Processing technology of crystal ball handicraft | |
| CN211029614U (en) | Device for trimming spherical diamond grinding wheel | |
| CN1472040A (en) | Micro-hole grinding process for ceramic inserting core | |
| US3449198A (en) | Lens blank | |
| JP2000317782A (en) | Piezoelectric element and its machining method | |
| JP2950791B2 (en) | Polishing tool | |
| JP2000317815A (en) | Piezoelectric element and machining method therefor | |
| JP2000317781A (en) | Piezo electric element and its machining method | |
| CN111002116A (en) | Automatic fluid grinding process | |
| KR101591569B1 (en) | Polishing apparatus for the aspheric lens | |
| KR20160054120A (en) | Polishing device using magneto-rheological fluid | |
| CN213615994U (en) | Magnetic fluid polishing device for hemispherical harmonic oscillator | |
| CN214080672U (en) | Round lens chamfering die |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220412 |