CN115723025A - Ultra-precise polishing device and polishing method for hemispherical harmonic oscillator - Google Patents
Ultra-precise polishing device and polishing method for hemispherical harmonic oscillator Download PDFInfo
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- CN115723025A CN115723025A CN202211457882.5A CN202211457882A CN115723025A CN 115723025 A CN115723025 A CN 115723025A CN 202211457882 A CN202211457882 A CN 202211457882A CN 115723025 A CN115723025 A CN 115723025A
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Abstract
The invention relates to an ultra-precise polishing device and a polishing method for a hemispherical harmonic oscillator, wherein the device comprises an outer polishing module, an inner polishing module, a liquid inlet block, two locking blocks and a base; the outer polishing module is used for polishing an outer spherical surface and an excircle corner of the workpiece; the inner polishing module is used for polishing the inner spherical surface, the inner cylindrical surface, the inner fillet, the end surface of the inner cylindrical surface and the end surface of the lip edge of the workpiece; the liquid inlet block, the inner polishing module and the outer polishing module are sequentially in parallel contact, two ends of the liquid inlet block, the inner polishing module and the outer polishing module are aligned and arranged at the upper end of the base, the two locking blocks are symmetrically sleeved outside the liquid inlet block, the inner polishing module and the outer polishing module from two sides, and the liquid inlet block, the inner polishing module and the outer polishing module are fixedly connected through locking screws for connecting the locking blocks and the base; the convex polishing surface of the inner polishing module extends into the concave polishing surface of the outer polishing module; the liquid inlet buffer area on the liquid inlet block is positioned on one side close to the inner polishing module and is aligned and communicated with the liquid inlet through hole on the inner polishing module. The invention realizes high-efficiency and high-quality polishing of workpieces.
Description
Technical Field
The invention belongs to the technical field of ultra-precise polishing of quartz hemispherical harmonic oscillators, and particularly relates to an ultra-precise polishing device and a polishing method for a hemispherical harmonic oscillator.
Background
The hemispherical resonator gyroscope is a coriolis effect gyroscope without rotating parts, and compared with the traditional mechanical gyroscope and optical gyroscope, the hemispherical resonator gyroscope has the advantages of impact resistance, strong radiation resistance, quick start, small size, light weight, low energy consumption, high working reliability, long service life and the like.
The working principle of the hemispherical resonator gyroscope is that when the hemispherical resonator vibrates continuously at a certain frequency, four-wave-amplitude patterns are formed on the edge of a spherical shell of the resonator, so that the hemispherical resonator is a core and a sensitive component of the hemispherical resonator gyroscope, and the working performance of the hemispherical resonator gyroscope is directly influenced by the processing quality of the hemispherical resonator. The hemispherical harmonic oscillator uses high-purity fused quartz glass as a material, the material is a hard and brittle material, the hardness is high, the processing is difficult, and the requirement of polishing processing is provided for further improving the processing precision of the hemispherical harmonic oscillator so as to meet the performance requirement of a high-precision hemispherical resonant gyroscope. According to the actual process requirements, a set of special polishing device and a polishing method need to be designed.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides an ultra-precise polishing device and a polishing method for a hemispherical harmonic oscillator.
One of the above objects of the present invention is achieved by the following technical solutions:
the utility model provides a hemisphere harmonic oscillator ultra-precision burnishing device which characterized in that: comprises an outer polishing module, an inner polishing module, a liquid inlet block, two locking blocks and a base;
the outer polishing module is of a module structure that a rectangular block is provided with an inner concave polishing surface, the inner concave polishing surface is composed of a hemispherical concave surface and a fillet surface connected with the small end of the hemispherical concave surface, the hemispherical concave surface and the fillet surface respectively form an outer spherical surface polishing operation surface and an outer fillet polishing action surface, and a plurality of liquid guide grooves are uniformly distributed on the inner concave polishing surface;
the inner polishing module is of a module structure that one side of the rectangular block is provided with an outer convex polishing surface, and the outer convex polishing surface consists of a hemispherical convex surface, a semi-cylindrical surface arranged in the center of the hemispherical convex surface and a round corner surface connecting the hemispherical convex surface and the semi-cylindrical surface; the inner spherical surface polishing operation surface, the inner cylindrical polishing action surface, the inner fillet polishing action surface, the inner cylindrical end surface polishing operation surface and the lip edge end surface polishing action surface are respectively formed by the hemispherical convex surface, the semi-cylindrical surface, the fillet surface of the inner polishing module, the bottom surface of the semi-cylindrical surface and the side surface of one side of the rectangular block of the inner polishing module; a plurality of liquid guide grooves are uniformly distributed on the outer convex polishing surface, and liquid inlet through holes are communicated with the positions, corresponding to each liquid guide groove, on the rectangular block of the inner polishing module;
the liquid inlet block is a rectangular block, countersunk holes are respectively formed in the positions, close to the two ends, of the liquid inlet block along the vertical direction, a groove is formed in one side of the liquid inlet block, a liquid inlet buffer area is formed by the groove, and a liquid inlet hole communicated with the groove is formed in the other side of the liquid inlet block;
the two locking blocks are U-shaped blocks with the same shape, and threaded holes for locking are arranged on two parallel edges of each locking block;
the base is a square column base, and two threaded holes are formed in the position, close to one side, of the upper end of the base;
the liquid inlet block, the inner polishing module and the outer polishing module are sequentially in parallel contact with each other and are arranged at the upper end of the base in an aligned mode; the two locking blocks are symmetrically sleeved outside the liquid inlet block, the inner polishing module and the outer polishing module from two sides, and the liquid inlet block, the inner polishing module and the outer polishing module are fixedly connected through locking screws in locking threaded holes arranged on the two locking blocks; the liquid inlet block is fixedly connected with the base through screws arranged in the counter bores and the corresponding threaded holes in the base; the outer convex polishing surface of the inner polishing module extends into the inner concave polishing surface of the outer polishing module; and the liquid inlet buffer area on the liquid inlet block is positioned at one side close to the inner polishing module and is aligned and communicated with the liquid inlet through hole on the inner polishing module.
Further: the outer polishing module and the inner polishing module are made of polyurethane.
The second objective of the present invention is achieved by the following technical solutions:
the ultra-precise polishing method for the hemispherical harmonic oscillator is characterized in that the ultra-precise polishing device for the hemispherical harmonic oscillator is adopted and is matched with an external polishing liquid circulating device, and the polishing liquid circulating device is provided with three outlets;
the polishing method comprises the following steps:
step 4, placing the inner polishing module at the upper end of the base and attaching the inner polishing module to the interior of the hemispherical harmonic oscillator, so that the polishing operation surface of the inner cylindrical end surface of the inner polishing module is attached to the inner cylindrical end surface of the workpiece, the action surface of the lip edge end surface of the inner polishing module is attached to the lip edge end surface of the workpiece, the polishing action surface of the inner cylindrical end surface of the inner polishing module is attached to the inner cylindrical surface of the workpiece, the polishing action surface of the inner fillet of the inner polishing module is attached to the inner fillet of the workpiece, and the polishing action surface of the inner spherical surface is attached to the inner spherical surface of the workpiece;
step 7, screwing two screws into the two threaded holes on the base through the two counter bores on the liquid inlet block respectively, and connecting and fixing the liquid inlet block and the base;
step 8, after the steps are finished, fixing the base on a workbench of polishing equipment;
step 8, adding the prepared polishing solution into a polishing solution circulating device, pouring the polishing solution into the outer spherical surface part and the inner spherical surface part of the workpiece through two outlets respectively, and inputting the polishing solution into a liquid inlet orifice of a liquid inlet block through the other outlet;
step 9, after the polishing solution is circulated and stabilized, starting polishing equipment to drive the hemispherical harmonic oscillator to rotate, and performing polishing operation until polishing is finished; the rotation speed of the hemispherical resonator is preferably 60rpm.
Further: the adopted polishing solution is prepared from cerium oxide polishing powder: sodium hydroxide powder: pure water is prepared according to the following steps of 1:0.5: the ratio of 20 is configured.
Further: in step 9, the rotation speed of the hemispherical harmonic oscillator is 60rpm.
The invention has the advantages and positive effects that:
1. according to the invention, through the combination of the outer polishing module and the inner polishing module, the one-time polishing forming of all the surfaces of the hemispherical harmonic oscillator after one-time clamping is realized, the polishing efficiency and the polishing precision are greatly improved, the outer polishing module and the inner polishing module are preferably made of polyurethane materials, have certain elasticity and strength, can be designed into shapes beneficial to polishing, are provided with hole structures, are beneficial to the attachment of polishing liquid, and can effectively promote the polishing work.
2. The liquid inlet block is provided with the liquid inlet hole and the liquid inlet buffer area, and the outer polishing module and the inner polishing module are provided with the plurality of liquid guide grooves to form liquid guide communication, so that the polishing liquid can be conveyed to each polishing part, and in addition, the polishing liquid is directly poured on the outer spherical surface and the inner spherical surface of the workpiece, so that the polishing quality of the surface of the polishing resonator can be better ensured.
3. The polishing device has few components, and three key components, namely the outer polishing module, the inner polishing module and the liquid inlet block, are connected by the two locking blocks in a clamping manner, so that the polishing device has the advantages of convenience in use, rapidness in disassembly and convenience in turnover.
Drawings
FIG. 1 is a schematic diagram of a hemispherical resonator workpiece to be polished according to the present invention;
FIG. 2 is a schematic view of the overall construction of the polishing apparatus of the present invention;
FIG. 3a is a perspective view of the outer polishing module of the present invention;
FIG. 3b is a front view of the outer polishing module of the present invention;
FIG. 3c is a side cross-sectional view of the outer polishing module of the present invention;
FIG. 4a is a perspective view of an inner polishing module of the present invention;
FIG. 4b is a front view of the inner polishing module of the present invention;
FIG. 4c is a side cross-sectional view of the inner polishing module of the present invention;
FIG. 5a is a perspective view of the liquid inlet block of the present invention;
FIG. 5b is a front view of the liquid inlet block of the present invention;
FIG. 5c is a side cross-sectional view of the liquid inlet block of the present invention;
FIG. 6 is a schematic view of the base of the present invention;
fig. 7 is a schematic structural view of the locking block of the present invention.
Detailed Description
The structure of the present invention will be further described by way of examples with reference to the accompanying drawings. It is to be understood that this embodiment is illustrative and not restrictive.
An ultra-precise polishing device for hemispherical harmonic oscillators is shown in fig. 1-7, and the invention points are as follows: comprises an outer polishing module 2, an inner polishing module 3, a liquid inlet block 4, two locking blocks 6 and a base 5.
The outer polishing module is used for polishing the outer spherical surface and the outer circular angle of the hemispherical harmonic oscillator workpiece. The outer polishing module is of a module structure that a rectangular block is provided with an inner concave polishing surface 2.1, the inner concave polishing surface is composed of a hemispherical concave surface 2.1.3 and a fillet surface 2.1.2 connected with the small end of the hemispherical concave surface, the hemispherical surface is matched with an outer spherical surface 1.3 of a hemispherical harmonic oscillator to form an outer spherical surface polishing operation surface, the fillet surface is matched with an outer fillet 1.2 of a hemispherical harmonic oscillator workpiece to form an outer fillet polishing action surface, and a plurality of liquid guide grooves 2.1.1 are uniformly distributed on the inner concave polishing surface.
The inner polishing module is used for polishing the inner spherical surface, the inner cylindrical surface, the inner fillet, the end surface of the inner cylindrical surface and the end surface of the lip edge of the hemispherical harmonic oscillator workpiece. The inner polishing module is of a module structure that a convex polishing surface 3.1 is arranged on one side of a rectangular block 3.2, and the convex polishing surface consists of a hemispherical convex surface 3.1.6, a semi-cylindrical surface 3.1.4 arranged at the center of the hemispherical convex surface and a fillet surface 3.1.5 connecting the hemispherical convex surface and the semi-cylindrical surface. The convex surface of the hemisphere is matched with the inner spherical surface 1.5 of the hemispherical resonant workpiece to form an inner spherical surface polishing operation surface; the semi-cylindrical surface is matched with the inner cylindrical surface 1.7 of the hemispherical harmonic oscillator to form an inner cylindrical polishing action surface; the fillet surface is matched with an inner fillet 1.8 of the hemispherical harmonic oscillator to form an inner fillet polishing action surface; the bottom surface 3.1.1 of the semi-cylindrical surface is matched with the end surface 1.6 of the inner cylinder of the semi-cylindrical harmonic oscillator to form an inner cylinder end surface polishing operation surface, and in addition, the side surface of one side of the rectangular block of the inner polishing module forms a lip edge end surface polishing action surface; a plurality of liquid guide grooves 3.1.3 are uniformly distributed on the outer convex polishing surface, and liquid inlet through holes 3.1.2 are communicated with the positions, corresponding to each liquid guide groove, on the rectangular block of the inner polishing module.
The liquid inlet block is used for inputting polishing liquid. The shape of the liquid inlet block is a rectangular block. And the positions of the upper edge of the liquid inlet block, which are close to the two ends in the vertical direction, are respectively provided with a counter bore 4.1 for mounting a screw, so that the fixed connection with the base is realized. One side of the liquid inlet block is provided with a groove 4.3 which is not limited to a rectangular groove shown in the attached drawing, the groove plays a liquid inlet buffering role, and a liquid inlet hole 4.2 communicated with the groove is formed in the other side of the liquid inlet block and used for inputting polishing liquid.
The outer polishing module, the inner polishing module and the liquid inlet block are isometric blocks, and the outer polishing module, the inner polishing module and the liquid inlet block are conveniently clamped and fixed through the two locking blocks.
The two locking blocks are used for integrally locking and fixing the outer polishing module, the inner polishing module and the liquid inlet block. The locking block is a U-shaped block, and threaded holes 6.1 are formed in two parallel edges of the locking block and used for installing locking screws oppositely to clamp and fix the outer polishing module, the inner polishing module and the liquid inlet block.
The base is a base member and is used for supporting the outer polishing module, the inner polishing module and the liquid inlet block. The base adopts square column base, and the position that is close to one side in the upper end of base is provided with two screw holes 5.1, and these two screw holes correspond the cooperation respectively with two counter bores on the feed liquor piece, through wearing the dress screw, realize the fixed connection of feed liquor piece and base.
The liquid inlet block, the inner polishing module and the outer polishing module are sequentially in parallel contact, and the two ends of the liquid inlet block, the inner polishing module and the outer polishing module are aligned and arranged at the upper end of the base, the two locking blocks are symmetrically sleeved outside the liquid inlet block, the inner polishing module and the outer polishing module from two sides, and the liquid inlet block, the inner polishing module and the outer polishing module are fixedly connected through locking screws arranged on the locking blocks. The outer convex polishing surface of the inner polishing module extends into the inner concave polishing surface of the outer polishing module; the liquid inlet buffer area on the liquid inlet block is positioned on one side close to the inner polishing module and is aligned and communicated with the liquid inlet through hole on the inner polishing module.
The outer polishing module and the inner polishing module are made of polyurethane. Because the plasticity of the polyurethane material is strong and has certain elasticity and strength, the polyurethane material can be designed into a shape beneficial to polishing, and meanwhile, the polyurethane material is provided with a hole structure, so that the polyurethane material is beneficial to the attachment of polishing solution and can effectively promote the polishing work to be carried out.
In addition to the above main structural features, the polishing apparatus needs to be equipped with a polishing liquid circulating device, in this embodiment, the polishing liquid circulating device has 3 outlets, wherein the first outlet is cast above the outer spherical surface of the hemispherical resonator, the second outlet is cast inside the inner spherical surface of the hemispherical resonator, and the third outlet is connected to the liquid inlet hole of the liquid inlet block. When the circulation is started, in addition to the polishing liquid from the inner spherical surface and the outer spherical surface, in order to ensure the smooth polishing, the polishing liquid entering from the liquid inlet hole of the liquid inlet block flows into the liquid inlet hole of the inner polishing module through the liquid inlet buffer area, sequentially passes through the liquid guide groove on the inner polishing module and the liquid guide groove on the outer polishing module, and the redundant polishing liquid is discharged from the outer end of the outer polishing module, is recycled after backflow filtration, thereby providing sufficient polishing liquid guarantee for the polishing of the hemispherical harmonic oscillator.
The polishing solution used in the present embodiment is preferably, but not limited to: cerium oxide polishing powder: sodium hydroxide powder: pure water =1:0.5: the ratio of 20 is configured. Cerium oxide in the polishing solution mainly plays a role in generating a chemical mechanical polishing effect with quartz glass, and sodium hydroxide plays a role in adjusting the polishing solution to be alkaline, so that the reaction of the cerium oxide and the surface of the quartz glass is promoted, and the polishing efficiency is improved.
A polishing method based on the hemispherical harmonic oscillator ultra-precision polishing device comprises the following steps:
step 4, placing the inner polishing module at the upper end of the base and attaching the inner polishing module to the interior of the hemispherical harmonic oscillator, so that the polishing operation surface of the inner cylindrical end surface of the inner polishing module is attached to the inner cylindrical end surface of the workpiece, the action surface of the lip edge end surface of the inner polishing module is attached to the lip edge end surface of the workpiece, the polishing action surface of the inner cylindrical end surface of the inner polishing module is attached to the inner cylindrical surface of the workpiece, the polishing action surface of the inner fillet of the inner polishing module is attached to the inner fillet of the workpiece, and the polishing action surface of the inner spherical surface is attached to the inner spherical surface of the workpiece;
step 7, screwing two screws into the two threaded holes on the base through the two counter bores on the liquid inlet block respectively, and connecting and fixing the liquid inlet block and the base;
step 8, after the steps are completed, fixing the base on a workbench of the polishing equipment, and fixing the base by mounting a small vice on the workbench for clamping or mounting a jacking block on the workbench and performing screw pre-tightening and the like;
step 8, adding the prepared polishing solution into a polishing solution circulating device, pouring the polishing solution into the outer spherical surface part and the inner spherical surface part of the workpiece through two outlets respectively, and inputting the polishing solution into a liquid inlet orifice of a liquid inlet block through the other outlet;
and 9, after the polishing solution is circularly stabilized, starting polishing equipment to drive the hemispherical harmonic oscillator to rotate, and performing polishing operation until polishing is finished. The rotation speed of the hemispherical resonator is preferably 60rpm.
Although the embodiments of the present invention and the accompanying drawings are disclosed for illustrative purposes, those skilled in the art will appreciate that: various substitutions, changes and modifications are possible without departing from the spirit of the invention and the scope of the appended claims, and therefore the scope of the invention is not limited to the disclosure of the embodiments and drawings.
Claims (5)
1. The utility model provides a hemisphere harmonic oscillator ultra-precision burnishing device which characterized in that: comprises an outer polishing module, an inner polishing module, a liquid inlet block, two locking blocks and a base;
the outer polishing module is of a module structure that a rectangular block is provided with an inner concave polishing surface, the inner concave polishing surface consists of a hemispherical concave surface and a fillet surface connected with the small end of the hemispherical concave surface, the hemispherical concave surface and the fillet surface respectively form an outer spherical surface polishing operation surface and an outer fillet polishing action surface, and a plurality of liquid guide grooves are uniformly distributed on the inner concave polishing surface;
the inner polishing module is of a module structure that one side of the rectangular block is provided with an outer convex polishing surface, and the outer convex polishing surface consists of a hemispherical convex surface, a semi-cylindrical surface arranged in the center of the hemispherical convex surface and a round corner surface connecting the hemispherical convex surface and the semi-cylindrical surface; the inner spherical surface polishing operation surface, the inner cylindrical polishing action surface, the inner fillet polishing action surface, the inner cylindrical end surface polishing operation surface and the lip edge end surface polishing action surface are respectively formed on the hemispherical convex surface, the semi-cylindrical surface, the fillet surface of the inner polishing module, the bottom surface of the semi-cylindrical surface and the side surface of one side of the rectangular block of the inner polishing module; a plurality of liquid guide grooves are uniformly distributed on the outer convex polishing surface, and liquid inlet through holes are communicated with the positions, corresponding to each liquid guide groove, on the rectangular block of the inner polishing module;
the liquid inlet block is a rectangular block, countersunk holes are respectively formed in the positions, close to the two ends, of the liquid inlet block in the vertical direction, a groove is formed in one side of the liquid inlet block, a liquid inlet buffer area is formed by the grooves, and a liquid inlet hole communicated with the grooves is formed in the other side of the liquid inlet block;
the two locking blocks are U-shaped blocks with the same shape, and two parallel edges of the locking blocks are provided with threaded holes for locking;
the base is a square column base, and two threaded holes are formed in the position, close to one side, of the upper end of the base;
the liquid inlet block, the inner polishing module and the outer polishing module are sequentially in parallel contact with each other and are arranged at the upper end of the base in an aligned mode; the two locking blocks are symmetrically sleeved outside the liquid inlet block, the inner polishing module and the outer polishing module from two sides, and the liquid inlet block, the inner polishing module and the outer polishing module are fixedly connected through locking screws in locking threaded holes arranged on the two locking blocks; the liquid inlet block is fixedly connected with the base through screws arranged in the counter bores and the corresponding threaded holes in the base; the convex polishing surface of the inner polishing module extends into the concave polishing surface of the outer polishing module; the liquid inlet buffer area on the liquid inlet block is positioned on one side close to the inner polishing module and is aligned and communicated with the liquid inlet through hole on the inner polishing module.
2. The ultra-precise polishing device for the hemispherical harmonic oscillator of claim 1, wherein: the outer polishing module and the inner polishing module are made of polyurethane.
3. An ultra-precise polishing method for a hemispherical harmonic oscillator, which is characterized in that the ultra-precise polishing device for the hemispherical harmonic oscillator as claimed in claim 1 or 2 is adopted and is matched with an external polishing liquid circulating device, and the polishing liquid circulating device is provided with three outlets;
the polishing method comprises the following steps:
step 1, horizontally installing a hemispherical harmonic oscillator on a main shaft of polishing equipment;
step 2, placing the base on polishing equipment;
step 3, placing the outer polishing module at the upper end of the base and attaching the outer polishing module to the outer part of the hemispherical harmonic oscillator, so that the polishing action surface of the outer fillet is attached to the outer fillet of the workpiece, and the polishing operation surface of the outer spherical surface is attached to the outer spherical surface of the workpiece;
step 4, placing the inner polishing module at the upper end of the base and attaching the inner polishing module to the interior of the hemispherical harmonic oscillator, so that the polishing operation surface of the inner cylindrical end surface of the inner polishing module is attached to the inner cylindrical end surface of the workpiece, the action surface of the lip edge end surface of the inner polishing module is attached to the lip edge end surface of the workpiece, the polishing action surface of the inner cylindrical end surface of the inner polishing module is attached to the inner cylindrical surface of the workpiece, the polishing action surface of the inner fillet of the inner polishing module is attached to the inner fillet of the workpiece, and the polishing action surface of the inner spherical surface is attached to the inner spherical surface of the workpiece;
step 5, placing the liquid inlet block on the base, and adjusting the position of the liquid inlet block under the condition of ensuring that the positions of the inner polishing module and the outer polishing module are not changed, so that the liquid inlet buffer area of the liquid inlet block is opposite to the liquid inlet through hole on the inner polishing module, and the edge of the liquid inlet block is aligned with the inner polishing module;
step 6, utilizing the two locking blocks, sleeving the outer polishing module, the inner polishing module and the liquid inlet block from the two sides in a surrounding manner, and fixing the relative positions of the two locking blocks to form tight connection by installing locking screws on the two sides of the two locking blocks;
step 7, screwing two screws into the two threaded holes on the base through the two counter bores on the liquid inlet block respectively, and connecting and fixing the liquid inlet block and the base;
step 8, after the steps are completed, fixing the base on a workbench of polishing equipment;
step 8, adding the prepared polishing solution into a polishing solution circulating device, pouring the polishing solution into the outer spherical surface part and the inner spherical surface part of the workpiece through two outlets respectively, and inputting the polishing solution into a liquid inlet orifice of a liquid inlet block through the other outlet;
step 9, after the polishing solution is circularly stabilized, starting polishing equipment to drive the hemispherical harmonic oscillator to rotate, and performing polishing operation until the polishing is finished; the rotation speed of the hemispherical resonator is preferably 60rpm.
4. The ultra-precise polishing method for hemispherical harmonic oscillators according to claim 3, characterized in that: the adopted polishing solution is prepared from cerium oxide polishing powder: sodium hydroxide powder: pure water is prepared according to the following steps of 1:0.5: the ratio of 20 is configured.
5. The ultra-precise polishing method for hemispherical harmonic oscillators according to claim 3, wherein: in step 9, the rotation speed of the hemispherical harmonic oscillator is 60rpm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211457882.5A CN115723025A (en) | 2022-11-21 | 2022-11-21 | Ultra-precise polishing device and polishing method for hemispherical harmonic oscillator |
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| CN202211457882.5A CN115723025A (en) | 2022-11-21 | 2022-11-21 | Ultra-precise polishing device and polishing method for hemispherical harmonic oscillator |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117182720A (en) * | 2023-11-06 | 2023-12-08 | 四川图林科技有限责任公司 | Precision machining equipment and machining method for hemispherical resonant gyroscope harmonic oscillator |
| CN117226440A (en) * | 2023-11-15 | 2023-12-15 | 四川图林科技有限责任公司 | Harmonic oscillator configuration of two-piece hemispherical resonator gyroscope and processing method thereof |
-
2022
- 2022-11-21 CN CN202211457882.5A patent/CN115723025A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117182720A (en) * | 2023-11-06 | 2023-12-08 | 四川图林科技有限责任公司 | Precision machining equipment and machining method for hemispherical resonant gyroscope harmonic oscillator |
| CN117182720B (en) * | 2023-11-06 | 2024-01-19 | 四川图林科技有限责任公司 | Precision machining equipment and machining method for hemispherical resonant gyroscope harmonic oscillator |
| CN117226440A (en) * | 2023-11-15 | 2023-12-15 | 四川图林科技有限责任公司 | Harmonic oscillator configuration of two-piece hemispherical resonator gyroscope and processing method thereof |
| CN117226440B (en) * | 2023-11-15 | 2024-02-02 | 四川图林科技有限责任公司 | Harmonic oscillator configuration of two-piece hemispherical resonator gyroscope and processing method thereof |
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