CN114300423A - Packaging structure for preventing diffusion of bonding material and preparation method thereof - Google Patents
Packaging structure for preventing diffusion of bonding material and preparation method thereof Download PDFInfo
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- CN114300423A CN114300423A CN202111574230.5A CN202111574230A CN114300423A CN 114300423 A CN114300423 A CN 114300423A CN 202111574230 A CN202111574230 A CN 202111574230A CN 114300423 A CN114300423 A CN 114300423A
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Abstract
The invention discloses a packaging structure for preventing bonding material diffusion and a preparation method thereof, belonging to the field of microelectronics. The packaging structure comprises a packaging shell, a chip mounting adhesive material, a chip, a bonding wire, a packaging cover plate and an anti-diffusion channel. The chip is fixed in the packaging shell through a mounting bonding material; the bonding pad of the chip is connected with the packaging shell through a bonding wire, and the bonding point on the packaging shell is connected with the pin. The diffusion-proof channel is etched on the periphery of the chip mounting area in the packaging shell, is close to the chip and is far away from the bonding wire, and the bonding wire is avoided. And the front surface of the packaging shell is fixedly provided with a packaging cover plate through bonding, tin-gold solder welding or parallel sealing welding. The invention utilizes the laser etching mode to etch the channel for preventing the diffusion of the chip mounting bonding material on the surface of the chip mounting area, and then packages the chip in a conventional mode, has simple operation, effectively enhances the performance of preventing the diffusion of the chip mounting bonding material, and is greatly helpful for improving the packaging yield of the chip.
Description
Technical Field
The invention relates to the technical field of microelectronic packaging, in particular to a packaging structure for preventing bonding material diffusion and a preparation method thereof.
Background
The packaging means that the chip is sealed in a shell in a certain mode, and then the chip is interconnected with structures such as a PCB (printed circuit board) through pins of a packaging shell, so that the function of the chip is realized.
With the rapid development of the microelectronic field, the size of the packaged circuit is smaller and smaller, which requires the circuit to be packaged in the smallest space as possible, which brings a series of difficulties to the packaging process. Such as a small die-bonding cavity, a die-bonding region and a bonding region in the same layer, etc., it is important to control the diffusion of the bonding material during the die-bonding process.
At present, the diffusion of the bonding material for chip mounting is mainly controlled by the chip mounting process and the replacement of the bonding material, such as the change of dispensing amount, the change of dispensing pattern, and the like. However, these control methods cannot well control the diffusion of the bonding material, and cannot be simply popularized as a universal method, and particularly, for a circuit with a narrow die-bonding cavity and die-bonding area on the same layer as the bonding finger, the problem of the diffusion of the die-bonding material is often difficult to overcome, and the subsequent bonding process is often affected, so that the packaging yield is greatly reduced.
Disclosure of Invention
The invention aims to provide a packaging structure for preventing bonding material diffusion and a preparation method thereof, and aims to solve the problem that the diffusion of the bonding material in the mounting cannot be well controlled by the conventional control method.
In order to solve the above technical problem, the present invention provides an anti-adhesion material diffusion package structure, including:
a package housing;
the chip is fixed in the packaging shell through a mounting bonding material;
and the anti-diffusion channel is etched at the periphery of the chip mounting area of the packaging shell.
Optionally, the pad of the chip is connected to the package housing through a bonding wire, and the bonding point on the package housing is connected to a lead.
Optionally, the diffusion preventing channel is located inside the package housing, near the chip and far away from the bonding wire.
Optionally, the anti-diffusion channel is formed by laser etching, and the width of the anti-diffusion channel is 10-50 μm.
Optionally, the bonding wire is a gold wire, an aluminum wire, or a copper wire.
Optionally, the die bonding material is conductive, insulating, thermally conductive, or corrosion-resistant.
Optionally, a package cover plate is fixed to the front surface of the package housing by bonding, tin-gold solder welding or parallel seal welding.
Optionally, the material of the package cover plate is ceramic, metal or plastic resin.
The invention also provides a preparation method of the packaging structure for preventing the diffusion of the bonding material, which comprises the following steps:
in the packaging shell, setting the position of a diffusion-proof channel according to the size of an area covered by a chip pre-assembly;
coating a chip mounting adhesive material on the back surface of the chip, and then bonding the chip in the packaging shell, so that the chip is mounted according to a specified position to ensure that the diffusion-proof channel smoothly plays a diffusion-proof role;
connecting a bonding pad of a chip with a bonding point of the packaging shell through a bonding wire;
and fixing the packaging cover plate on the front surface of the packaging shell, thereby completing the whole packaging method.
Optionally, the distance from the diffusion preventing channel to the edge of the chip for completing the mounting is 30 μm.
According to the packaging structure for preventing the diffusion of the bonding material and the preparation method thereof, provided by the invention, the laser etching mode is utilized to etch the channel for preventing the diffusion of the bonding material of the chip mounting on the surface of the chip mounting area, and then the chip is packaged in a conventional mode, so that the operation is simple, the performance of preventing the diffusion of the bonding material of the chip mounting is effectively enhanced, and great help is brought to the improvement of the packaging yield of the chip.
Drawings
Fig. 1 is a schematic view of a package structure for preventing diffusion of bonding material according to the present invention.
Detailed Description
The following provides a package structure for preventing diffusion of bonding material and a method for manufacturing the same, which are provided by the present invention, with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
The invention provides a packaging structure for preventing bonding material from diffusing, which is structurally shown in figure 1 and comprises a packaging shell 1, a mounting bonding material 2, a chip 3, a bonding wire 4, a packaging cover plate 5 and a diffusion-preventing channel 6.
The chip 3 is fixed in the packaging shell 1 through a mounting bonding material 2; the mounting adhesive material 2 is conductive, insulating, heat-conductive or corrosion-resistant. The bonding pad of the chip 3 is connected with the package housing 1 through the bonding wire 4, and the bonding point on the package housing 1 is connected with a lead. The bonding wire 4 is a gold wire, an aluminum wire or a copper wire.
The anti-diffusion channel 6 is etched on the periphery of a chip mounting area in the package shell 1, is close to the chip 3 and is far away from the bonding wire 4, and avoids the bonding wire 4. The anti-diffusion channel 6 is formed in a laser etching mode, and the width of the anti-diffusion channel is 10-50 microns.
The front surface of the packaging shell 1 is fixedly provided with a packaging cover plate 5 through bonding, tin-gold solder welding or parallel sealing welding, and the packaging cover plate 5 is made of ceramic, metal or plastic resin.
Example 1
Fig. 1 shows a package structure for preventing diffusion of bonding material, which includes a package housing 1, a die bonding material 2, a chip 3, a bonding wire 4, a package cover plate 5 and a diffusion-preventing channel 6;
the packaging shell 1 is etched to form a circle of diffusion-proof channel 6 outside the chip mounting area through laser etching, so that the chip mounting bonding material 2 is prevented from diffusing to the bonding area, the subsequent bonding process is influenced, and the packaging yield is further influenced. Then the back of the chip 3 is fixed in the packaging shell 1 through the mounting adhesive material 2, the bonding pad of the chip 3 is connected with the bonding point on the packaging shell 1 through the bonding wire 4, the bonding point on the packaging shell 1 is connected with the lead, and the packaging cover plate 5 is fixed on the front of the packaging shell 1.
The width of the anti-diffusion channel 6 is 10 micrometers, the mounting bonding material 2 is high-temperature conductive adhesive JM7000, the bonding wire 4 is a gold wire, and the packaging cover plate 5 is made of a ceramic cover plate.
The preparation method of the packaging structure for preventing the diffusion of the bonding material comprises the following steps:
s1, performing incoming material inspection on the packaging shell/cover plate, setting the position of a laser etching channel according to the size of a chip pre-packaged area after the inspection is completed, wherein the width of the anti-diffusion channel 6 is 10 micrometers, and the distance from the anti-diffusion channel to the edge of a chip to be packaged is 30 micrometers, so that the effective overflow of the chip-packaged bonding material can be ensured, and the further diffusion of the chip-packaged bonding material can be prevented;
s2, coating JM7000 sheet mounting glue on the back surface of the chip 3, and then bonding the chip 3 in the package shell 1, so that the chip 3 is mounted according to the specified position, namely, the distance from the edge of the chip to the diffusion-proof channel 6 is ensured to be 30 μm, and the diffusion-proof channel 6 is ensured to smoothly play a diffusion-proof role;
s4, connecting the bonding pad of the chip 3 with the bonding point on the packaging shell 1 through a bonding wire 4 made of a gold wire material;
and S5, fixing the packaging cover plate 5 on the front surface of the packaging shell 1 in an adhesion mode, thereby completing the whole packaging method.
Example 2
Fig. 1 shows a package structure for preventing diffusion of bonding material, which includes a package housing 1, a die bonding material 2, a chip 3, a bonding wire 4, a package cover plate 5 and a diffusion-preventing channel 6;
the packaging shell 1 is etched to form a circle of diffusion-proof channel 6 outside the chip mounting area through laser etching, so that the chip mounting bonding material 2 is prevented from diffusing to the bonding area, the subsequent bonding process is influenced, and the packaging yield is further influenced. Then the back of the chip 3 is fixed in the packaging shell 1 through the mounting adhesive material 2, the bonding pad of the chip 3 is connected with the bonding point on the packaging shell 1 through the bonding wire 4, the bonding point on the packaging shell 1 is connected with the lead, and the packaging cover plate 5 is fixed on the front of the packaging shell 1.
The width of the anti-diffusion channel 6 is 30 micrometers, the chip mounting bonding material 2 is gold-tin solder, the bonding wire 4 is an aluminum wire, and the packaging cover plate 5 is made of a metal cover plate.
The preparation method of the packaging structure for preventing the diffusion of the bonding material comprises the following steps:
s1, performing incoming material inspection on the packaging shell/cover plate, setting the position of a laser etching channel according to the size of a chip pre-packaged area after the inspection is completed, wherein the width of the anti-diffusion channel 6 is 30 micrometers, and the distance from the anti-diffusion channel to the edge of a chip to be packaged is 30 micrometers, so that the effective overflow of the chip-packaged bonding material can be ensured, and the further diffusion of the chip-packaged bonding material can be prevented;
s2, placing the gold-tin solder in the packaging shell 1 according to a set position, and enabling the chip 3 to be subjected to eutectic soldering according to the set position, namely ensuring that the distance from the edge of the chip 3 to the diffusion-proof channel 6 is 30 mu m so as to ensure that the diffusion-proof channel 6 can smoothly play a diffusion-proof role;
s4, connecting a bonding pad of the chip 3 with a bonding point on the packaging shell 1 through a bonding wire 4 made of an aluminum wire material;
and S5, fixing the package cover plate 5 on the front surface of the package shell 1 in a tin-gold welding mode, thereby completing the whole packaging method.
Example 3
Fig. 1 shows a package structure for preventing diffusion of bonding material, which includes a package housing 1, a die bonding material 2, a chip 3, a bonding wire 4, a package cover plate 5 and a diffusion-preventing channel 6;
the packaging shell 1 is etched to form a circle of diffusion-proof channel 6 outside the chip mounting area through laser etching, so that the chip mounting bonding material 2 is prevented from diffusing to the bonding area, the subsequent bonding process is influenced, and the packaging yield is further influenced. Then the back of the chip 3 is fixed in the packaging shell 1 through the mounting adhesive material 2, the bonding pad of the chip 3 is connected with the bonding point on the packaging shell 1 through the bonding wire 4, the bonding point on the packaging shell 1 is connected with the lead, and the packaging cover plate 5 is fixed on the front of the packaging shell 1.
The width of the anti-diffusion channel 6 is 40 micrometers, the mounting bonding material 2 is conductive adhesive 84-1LMISR4, the bonding wire 4 is a copper wire, and the packaging cover plate 5 is made of a plastic resin cover plate.
The preparation method of the packaging structure for preventing the diffusion of the bonding material comprises the following steps:
s1, performing incoming material inspection on the packaging shell/cover plate, setting the position of a laser etching channel according to the size of a chip pre-packaged area after the inspection is completed, wherein the width of the anti-diffusion channel 6 is 40 mu m, and the distance from the anti-diffusion channel to the edge of a chip to be packaged is 30 mu m, so that the effective overflow of the chip-packaged bonding material can be ensured, and the further diffusion of the chip-packaged bonding material can be prevented;
s2, coating 84-1LMISR4 piece mounting glue on the back surface of the chip 3, and then bonding the chip in the packaging shell 1, so that the chip 3 is mounted according to the specified position, namely, the distance from the edge of the chip to the diffusion-proof channel 6 is ensured to be 30 mu m, and the diffusion-proof channel 6 is ensured to smoothly play a diffusion-proof role;
s4, connecting a bonding pad of the chip 3 with a bonding point on the packaging shell 1 through a bonding wire 4 made of a copper wire material;
and S5, fixing the packaging cover plate 5 on the front surface of the packaging shell 1 in a parallel sealing and welding mode, thereby completing the whole packaging method.
Example 4
Fig. 1 shows a package structure for preventing diffusion of bonding material, which includes a package housing 1, a die bonding material 2, a chip 3, a bonding wire 4, a package cover plate 5 and a diffusion-preventing channel 6;
the packaging shell 1 is etched to form a circle of diffusion-proof channel 6 outside the chip mounting area through laser etching, so that the chip mounting bonding material 2 is prevented from diffusing to the bonding area, the subsequent bonding process is influenced, and the packaging yield is further influenced. Then the back of the chip 3 is fixed in the packaging shell 1 through the mounting adhesive material 2, the bonding pad of the chip 3 is connected with the bonding point on the packaging shell 1 through the bonding wire 4, the bonding point on the packaging shell 1 is connected with the lead, and the packaging cover plate 5 is fixed on the front of the packaging shell 1.
The width of the anti-diffusion channel 6 is 50 micrometers, the chip mounting bonding material 2 is nano sintered silver, the bonding wire 4 is a gold wire, and the packaging cover plate 5 is made of a ceramic cover plate.
The preparation method of the packaging structure for preventing the diffusion of the bonding material comprises the following steps:
s1, performing incoming material inspection on the packaging shell/cover plate, setting the position of a laser etching channel according to the size of a chip pre-packaged area after the inspection is completed, wherein the width of the anti-diffusion channel 6 is 50 microns, and the distance from the anti-diffusion channel to the edge of a chip to be packaged is 30 microns, so that the effective overflow of the chip-packaged bonding material can be ensured, and the further diffusion of the chip-packaged bonding material can be prevented;
s2, coating the back of the chip 3 with nano sintered silver mounting glue and then bonding the chip in the packaging shell 1, so that the chip is mounted according to the specified position, namely, the distance from the edge of the chip to the diffusion-proof channel 6 is ensured to be 30 mu m, and the diffusion-proof channel 6 is ensured to smoothly play a diffusion-proof role;
s4, connecting the bonding pad of the chip 3 with the bonding point on the packaging shell 1 through a bonding wire 4 made of a gold wire material;
and S5, fixing the packaging cover plate 5 on the front surface of the packaging shell 1 in an adhesion mode, thereby completing the whole packaging method.
The working principle of the invention is as follows: a circle of diffusion-proof channels are etched around the chip mounting area in a laser etching mode, the surface wetting characteristic of the packaging shell is changed by the laser etching channels, and the chip mounting bonding materials are prevented from further diffusing.
The die attach adhesive 2 may be any known adhesive or an adhesive to be applied, in addition to embodiments 1 to 4.
The bond wire 4 may also be any known lead material, or lead material to be applied.
The material of the sealing cover 5 may be any known or to be present sealing material.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (10)
1. A diffusion resistant material package comprising:
a package housing (1);
the chip (3) is fixed in the packaging shell (1) through a mounting bonding material (2);
and the anti-diffusion channel (6) is etched at the periphery of the chip mounting area of the packaging shell (1).
2. The package structure for preventing spreading of bonding material according to claim 1, wherein the bonding pads of the chip (3) are connected to the package housing (1) by bonding wires (4), and the bonding pads on the package housing (1) are connected to leads.
3. The encapsulation structure for preventing the diffusion of bonding material according to claim 2, characterized in that the diffusion-preventing channel (6) is located inside the encapsulation housing (1) close to the chip (3) and far from the bonding wire (4).
4. The packaging structure for preventing diffusion of bonding material according to claim 1, wherein the diffusion-preventing channel (6) is formed by laser etching and has a width of 10-50 μm.
5. The encapsulation structure for preventing diffusion of bonding material according to claim 2, characterized in that the bonding wires (4) are gold, aluminum or copper wires.
6. The bonding material diffusion prevention package structure of claim 1, wherein the die attach material (2) is conductive, insulative, thermally conductive, or corrosion resistant.
7. A package arrangement for preventing diffusion of bonding material according to any of claims 1-6, characterized in that the package cover plate (5) is fixed to the front side of the package housing (1) by means of gluing, tin-gold solder welding or parallel sealing.
8. The package for preventing diffusion of bonding material according to claim 7, wherein the material of the package cover plate (5) is ceramic, metal or plastic resin.
9. A preparation method of a packaging structure for preventing diffusion of bonding materials is characterized by comprising the following steps:
setting the position of a diffusion-proof channel (6) in the packaging shell (1) according to the size of the area covered by the chip pre-assembly;
coating a chip mounting adhesive material (2) on the back surface of the chip (3), and then bonding the chip in the packaging shell (1) to mount the chip (3) according to a specified position so as to ensure that the anti-diffusion channel (6) smoothly plays a role in preventing diffusion;
connecting a bonding pad of a chip (3) with a bonding point of the packaging shell (1) through a bonding wire (4);
and fixing the packaging cover plate (5) on the front surface of the packaging shell (1) so as to complete the whole packaging method.
10. The method for manufacturing a package structure in which diffusion of a bonding material is prevented according to claim 9, wherein the distance from the diffusion preventing channel (6) to the edge of the chip (3) where mounting is completed is 30 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111574230.5A CN114300423A (en) | 2021-12-21 | 2021-12-21 | Packaging structure for preventing diffusion of bonding material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111574230.5A CN114300423A (en) | 2021-12-21 | 2021-12-21 | Packaging structure for preventing diffusion of bonding material and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN114300423A true CN114300423A (en) | 2022-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111574230.5A Pending CN114300423A (en) | 2021-12-21 | 2021-12-21 | Packaging structure for preventing diffusion of bonding material and preparation method thereof |
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| CN (1) | CN114300423A (en) |
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2021
- 2021-12-21 CN CN202111574230.5A patent/CN114300423A/en active Pending
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