CN114286517A - Novel plastic circuit board manufacturing method - Google Patents
Novel plastic circuit board manufacturing method Download PDFInfo
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- CN114286517A CN114286517A CN202111527255.XA CN202111527255A CN114286517A CN 114286517 A CN114286517 A CN 114286517A CN 202111527255 A CN202111527255 A CN 202111527255A CN 114286517 A CN114286517 A CN 114286517A
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- Prior art keywords
- chain belt
- circuit board
- manufacturing
- molding
- stamping die
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 claims abstract description 27
- 238000001746 injection moulding Methods 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 238000004806 packaging method and process Methods 0.000 claims abstract description 7
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims description 26
- 238000002347 injection Methods 0.000 claims description 18
- 239000007924 injection Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 abstract description 3
- 238000007689 inspection Methods 0.000 abstract description 3
- 238000009740 moulding (composite fabrication) Methods 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
A novel plastic circuit board manufacturing method comprises the following steps: designing a mold, manufacturing the mold, debugging the mold, matching adjustment, parameter adjustment, matching adjustment, chain belt punch forming, surface treatment, injection molding, chain belt scrap removal, inspection, arrangement and arrangement, element mounting, inspection, packaging and warehousing. By introducing a new manufacturing process, the circuit board which needs to be produced in large batch or in additional order can be produced only by the production steps, a standardized die structure is formed, standardized production is achieved, a plurality of production procedures of the original printed circuit board can be effectively reduced, the time and cost for manufacturing the printed circuit board are reduced, the labor requirement is reduced, and the production efficiency is improved; the alternate-insertion type structure on the metal chain belt is connected with the external functional component and the external power line, so that tin-free, high-temperature and consumable-free connection is realized, the stability of the circuit board is improved, the cost of manual materials is greatly reduced, and the possibility of realizing full-automatic connection is improved.
Description
Technical Field
The invention belongs to the field of circuit board manufacturing, and particularly relates to a novel plastic circuit board production process and a manufacturing method of a novel connecting structure on a plastic circuit board.
Background
The traditional circuit board is generally composed of a Printed Circuit Board (PCB), an externally-attached component and a welding accessory, has the functions of high integration, simple structure and strong customization, along with the continuous development of electronic informatization, people have higher and higher requirements on the attractiveness, functionality, flexibility and the like of finished products of electronic and electric appliances, more and more electronic and electric appliance products are changed into a circuit board integration mode, and the Printed Circuit Board (PCB) becomes more and more a necessity for the production of the electronic and electric appliances. Printed Circuit Boards (PCBs) and components in the existing market are generally fixed by surface mount machine surface mount soldering tin, and external strip line accessories are generally fixed by manual soldering or machine equipment soldering tin. Therefore, in the manufacturing process of the existing Printed Circuit Board (PCB), a drawing is designed and typeset firstly, and then materials are cut, drilling is carried out, copper is deposited, pattern transfer is carried out, pattern electroplating is carried out, a film is removed, etching is carried out, green oil, characters and gold-plated fingers are formed, testing is carried out, and final inspection is carried out to form the PCB, the PCB is manufactured by thirteen procedures, no matter large-batch production or small-batch trial production, a time period of about 10 to 15 days is needed, the time cost cannot be saved by reducing the procedures, a large amount of equipment and manpower and material resources costs are needed to be invested in complicated procedures, a large amount of auxiliary materials are consumed in the production process, and the production efficiency is low.
The main material of the existing Printed Circuit Board (PCB) is a copper-clad plate, and the copper-clad plate (copper-clad plate) is composed of a substrate, copper foil and an adhesive. The substrate is an insulating laminate composed of polymer synthetic resin and a reinforcing material; the surface of the substrate is covered with a pure copper foil with high conductivity and good weldability. A Printed Circuit Board (PCB) is finished through multiple processes such as silk-screen etching and the like, and then split cutting is carried out, so that the production process is complex, the period is long, the pollution is large, and the loss is serious; the external wires or other accessories of the existing Printed Circuit Board (PCB) need to be connected by a tin soldering process, the accessories or power wires need to be subjected to tin immersion treatment in the production process, and then manual or automatic soldering iron is adopted for welding, so that the process is complex, the pollution is large, the production speed is low, and the automation degree is low.
Disclosure of Invention
According to the defects in the prior art, the invention provides the novel circuit board manufacturing method suitable for mass production.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a novel plastic circuit board manufacturing method comprises the following steps:
1. designing a mold: designing a pair of chain belt molding stamping dies, a pair of injection molding dies and a pair of chain belt scrap removing stamping dies;
2. manufacturing a mold: manufacturing a designed chain belt molding stamping die, an injection mold and a chain belt scrap removing stamping die;
3. debugging the mold: repeatedly adjusting and testing the manufactured die, and then carrying out the next step of installation after the manufactured die reaches the standard;
4. matching and adjusting: installing the debugged chain belt molding stamping die on a stamping machine table for adjustment, and adjusting the adjusted chain belt molding stamping die to be matched with the injection mold and the chain belt scrap removing stamping die to the required parameter;
5. parameter adjustment: installing the debugged injection mold on an injection molding machine table for parameter adjustment, and adjusting to the required parameter size of the punched chain belt and the injection mold;
6. matching and adjusting: installing a chain belt scrap removing stamping die on a stamping machine table for adjustment, and adjusting to the size of parameters required by matching with the injection molded forming chain belt;
7. and (3) chain belt punch forming: connecting the purchased complete chain belt to a chain belt molding stamping die to stamp out a required molding chain belt;
8. surface treatment: selecting whether to carry out surface electroplating or other process treatment on the punched and formed chain belt according to the production requirement;
9. injection molding: connecting the molded chain belt which is molded by punching into an injection molding machine, and fixing by injection molding and sealing;
10. removing the edge materials of the chain belt: connecting the molding chain belt fixed by the injection molding glue to a chain belt rim material removing stamping die for stamping rim material of the chain belt, and separating a single finished plastic circuit board;
11. and (4) checking: checking whether the separated single finished plastic circuit board is qualified or not;
12. arranging and finishing: arranging and flatly paving a plurality of separated single plastic circuit boards into a fixing clamp;
13. component pasting: carrying out functional component surface mounting welding on a plurality of plastic circuit boards in a fixing clamp in a surface mounting machine;
14. and (4) checking: carrying out power-on detection on the single plastic circuit board with the attached components by using circuit board power-on detection equipment;
15. packaging and warehousing: and packaging and warehousing the qualified finished products.
Connecting alternate-inserting type structure modeling is carried out on positions of components needing soldering or soldering connection function in the subsequent process in the chain belt modeling stamping die in the step 1, and each alternate-inserting type structure is designed to be completely matched with the pin components and the single strand or the stranded wire;
the chain belt needing punch forming in the step 1 is a metal chain belt;
the metal chain belt is a copper chain belt, the copper chain belt is adopted, an integrated injection molding process is adopted, the circuit board is directly finished through integrated injection molding, then component mounting or other processes can be directly carried out after material removal, stamping and separation, other redundant and complicated processes are not needed, the production period is short, the cost is low, and the environment is protected and safe;
the connecting alternate structure modeling and the additional components or the single-stranded wires and the stranded wires on the chain belt in the step 1 are fixedly connected in an inserting and clamping mode and can be adaptively connected with any functional components with pins or the single-stranded wires and the stranded wires; the copper chain belt is provided with the penetrating structure to replace an extra welding penetrating terminal, the copper chain belt can be directly externally connected with a switch or penetrated and connected with other electric wires, and the penetrating structure of the pin or the power wire of the accessory is fastened and fixed without welding, so that the process is simple, the production speed is high, no pollution is caused, and no extra material consumption is caused;
the debugging mould in the step 3 is to carry out mould adjustment and test on the chain belt molding stamping mould, the injection mould and the chain belt scrap removing stamping mould one by one;
the invention has the beneficial effects that: by introducing a new manufacturing process, the circuit board which needs to be produced in large batch or in additional order can be produced only by the production steps, a standardized die structure is formed, standardized production is achieved, a plurality of production procedures of the original Printed Circuit Board (PCB) can be effectively reduced, the time and cost for manufacturing the Printed Circuit Board (PCB) are reduced, the production cost is reduced, the manual demand is reduced, the production efficiency is improved, and meanwhile, the loss of raw materials and auxiliary materials can also be reduced; the alternate-insertion type structure on the metal chain belt is connected with the external functional component and the external power line, so that tin-free, high-temperature and consumable-free connection is realized, the stability of the circuit board is improved, the cost of manual materials is greatly reduced, and the possibility of realizing full-automatic connection is improved.
Drawings
FIG. 1 is a schematic structural diagram of a circuit board according to the present invention;
Detailed Description
A novel plastic circuit board manufacturing method comprises the following steps:
1. designing a mold: designing a pair of chain belt molding stamping dies, a pair of injection molding dies and a pair of chain belt scrap removing stamping dies;
2. manufacturing a mold: manufacturing a designed chain belt molding stamping die, an injection mold and a chain belt scrap removing stamping die;
3. debugging the mold: repeatedly adjusting and testing the manufactured die, and then carrying out the next step of installation after the manufactured die reaches the standard;
4. matching and adjusting: installing the debugged chain belt molding stamping die on a stamping machine table for adjustment, and adjusting the adjusted chain belt molding stamping die to be matched with the injection mold and the chain belt scrap removing stamping die to the required parameter;
5. parameter adjustment: installing the debugged injection mold on an injection molding machine table for parameter adjustment, and adjusting to the required parameter size of the punched chain belt and the injection mold;
6. matching and adjusting: installing a chain belt scrap removing stamping die on a stamping machine table for adjustment, and adjusting to the size of parameters required by matching with the injection molded forming chain belt;
7. and (3) chain belt punch forming: connecting the purchased complete chain belt with a chain belt molding stamping die to stamp a required molding chain belt;
8. surface treatment: performing surface electroplating or other processes on the punched and formed chain belt according to production requirements;
9. injection molding: connecting the molded chain belt which is molded by punching into an injection molding machine, and fixing by injection molding and sealing;
10. removing the edge materials of the chain belt: connecting the molding chain belt fixed by the injection molding glue to a chain belt rim material removing stamping die for stamping rim material of the chain belt, and separating a single finished plastic circuit board;
11. and (4) checking: checking whether the separated single finished plastic circuit board is qualified or not;
12. arranging and finishing: arranging and flatly paving a plurality of separated single plastic circuit boards into a fixing clamp;
13. component pasting: carrying out functional component surface mounting welding on a plurality of plastic circuit boards in a fixing clamp in a surface mounting machine;
14. and (4) checking: carrying out power-on detection on the single plastic circuit board with the attached components by using circuit board power-on detection equipment;
15. packaging and warehousing: and packaging and warehousing the qualified finished products.
Connecting alternate structures 1 in the chain belt molding stamping die in the step 1 for positions of components needing soldering or soldering connection function in the subsequent process, wherein each alternate structure 1 is designed to be completely matched with a pin component and a single strand or a stranded wire;
the chain belt needing punch forming in the step 1 is a metal chain belt;
the metal chain belt is a copper chain belt, the copper chain belt is adopted, an integrated injection molding process is adopted, the circuit board is directly finished through integrated injection molding, then component mounting or other processes can be directly carried out after material removal, stamping and separation, other redundant and complicated processes are not needed, the production period is short, the cost is low, and the environment is protected and safe;
the shape of the connecting alternate type structure 1 on the chain belt in the step 1 and the additional components or the single-stranded wires and the stranded wires are fixedly connected in an inserting and clamping mode, and any functional component with pins or the single-stranded wires and the stranded wires can be adaptively connected; the copper chain belt is provided with the penetrating structure 1 to replace an extra welding penetrating terminal, so that a switch can be directly externally connected or other wires can be penetrated and connected, the fixing can be realized by penetrating, the welding is not needed, the process is simple, the production speed is high, the pollution is avoided, and extra consumables are avoided;
the debugging mould in the step 3 is to carry out mould adjustment and test on the chain belt molding stamping mould, the injection mould and the chain belt scrap removing stamping mould one by one;
the invention has the beneficial effects that: by introducing a new manufacturing process, the circuit board which needs to be produced in large batch or in additional order can be produced only by the production steps, a standardized die structure is formed, standardized production is achieved, a plurality of production procedures of the original Printed Circuit Board (PCB) can be effectively reduced, the investment of time and cost for manufacturing the Printed Circuit Board (PCB) is reduced, the production cost is reduced, the manual demand is reduced, the production efficiency is improved, and a plurality of raw materials can be reduced; the alternate-insertion type structure on the metal chain belt is connected with the external functional component and the external power line, so that tin-free, high-temperature and consumable-free connection is realized, the stability of the circuit board is improved, the cost of manual materials is greatly reduced, and the possibility of realizing full-automatic connection is improved.
Claims (6)
1. A novel plastic circuit board manufacturing method comprises the following steps:
1. designing a mold: designing a pair of chain belt molding stamping dies, a pair of injection molding dies and a pair of chain belt scrap removing stamping dies;
2. manufacturing a mold: manufacturing a designed chain belt molding stamping die, an injection mold and a chain belt scrap removing stamping die;
3. debugging the mold: repeatedly adjusting and testing the manufactured die, and then carrying out the next step of installation after the manufactured die reaches the standard;
4. matching and adjusting: installing the debugged chain belt molding stamping die on a stamping machine table for adjustment, and adjusting the adjusted chain belt molding stamping die to be matched with the injection mold and the chain belt scrap removing stamping die to the required parameter;
5. parameter adjustment: installing the debugged injection mold on an injection molding machine table for parameter adjustment, and adjusting to the required parameter size of the punched chain belt and the injection mold;
6. matching and adjusting: installing a chain belt scrap removing stamping die on a stamping machine table for adjustment, and adjusting to the size of parameters required by matching with the injection molded forming chain belt;
7. and (3) chain belt punch forming: connecting the purchased complete chain belt with a chain belt molding stamping die to stamp a required molding chain belt;
8. surface treatment: performing surface electroplating or other processes on the punched and formed chain belt according to production requirements;
9. injection molding: connecting the molded chain belt which is molded by punching into an injection molding machine, and fixing by injection molding and sealing;
10. removing the edge materials of the chain belt: connecting the molding chain belt fixed by the injection molding glue to a chain belt rim material removing stamping die for stamping rim material of the chain belt, and separating a single finished plastic circuit board;
11. and (4) checking: checking whether the separated single finished plastic circuit board is qualified or not;
12. arranging and finishing: arranging and flatly paving a plurality of separated single plastic circuit boards into a fixing clamp;
13. component pasting: carrying out functional component surface mounting welding on a plurality of plastic circuit boards in a fixing clamp in a surface mounting machine;
14. and (4) checking: carrying out power-on detection on the single plastic circuit board with the attached components by using circuit board power-on detection equipment;
15. packaging and warehousing: and packaging and warehousing the qualified finished products.
2. The method for manufacturing a novel plastic circuit board according to claim 1, wherein the method comprises the following steps: and (2) in the chain belt molding stamping die in the step (1), connecting alternate structures (1) are molded at positions of components needing soldering or soldering connection function in the subsequent process, and each alternate structure (1) is designed to be completely matched with a pin component and a single strand or a stranded wire.
3. The method for manufacturing a novel plastic circuit board according to claim 2, wherein: and (2) the chain belt to be subjected to punch forming in the step (1) is a metal chain belt.
4. The method for manufacturing a novel plastic circuit board according to claim 3, wherein: the metal chain belt is a copper chain belt.
5. The method for manufacturing a novel plastic circuit board according to claim 4, wherein: and (3) the shape of the connecting alternate-inserting type structure (1) on the chain belt in the step (1) and additional components or single wires and stranded wires are fixedly connected in an inserting and clamping mode.
6. The method for manufacturing a novel plastic circuit board according to claim 5, wherein: and 3, adjusting and testing the chain belt molding stamping die, the injection mold and the chain belt scrap removing stamping die one by one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111527255.XA CN114286517A (en) | 2021-12-12 | 2021-12-12 | Novel plastic circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111527255.XA CN114286517A (en) | 2021-12-12 | 2021-12-12 | Novel plastic circuit board manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| CN114286517A true CN114286517A (en) | 2022-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111527255.XA Pending CN114286517A (en) | 2021-12-12 | 2021-12-12 | Novel plastic circuit board manufacturing method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1102908A (en) * | 1976-05-13 | 1981-06-09 | Helmut Eppich | Modular housing for electronic apparatus |
| US6436517B1 (en) * | 2000-05-08 | 2002-08-20 | Irwin Zahn | Continuous molded electronic circuits |
| KR20060069088A (en) * | 2004-12-17 | 2006-06-21 | 유성희 | Protection device for a pcb reflow system |
| CN101815409A (en) * | 2010-04-23 | 2010-08-25 | 陈国富 | Method for manufacturing circuit board through injection molding |
| CN101875078A (en) * | 2010-03-25 | 2010-11-03 | 昆山凯意工模具配套有限公司 | Circuit board stamping mould |
| CN109732845A (en) * | 2018-12-26 | 2019-05-10 | 美智光电科技有限公司 | Manufacturing method, light source board and the light source assembly of light source board |
-
2021
- 2021-12-12 CN CN202111527255.XA patent/CN114286517A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1102908A (en) * | 1976-05-13 | 1981-06-09 | Helmut Eppich | Modular housing for electronic apparatus |
| US6436517B1 (en) * | 2000-05-08 | 2002-08-20 | Irwin Zahn | Continuous molded electronic circuits |
| KR20060069088A (en) * | 2004-12-17 | 2006-06-21 | 유성희 | Protection device for a pcb reflow system |
| CN101875078A (en) * | 2010-03-25 | 2010-11-03 | 昆山凯意工模具配套有限公司 | Circuit board stamping mould |
| CN101815409A (en) * | 2010-04-23 | 2010-08-25 | 陈国富 | Method for manufacturing circuit board through injection molding |
| CN109732845A (en) * | 2018-12-26 | 2019-05-10 | 美智光电科技有限公司 | Manufacturing method, light source board and the light source assembly of light source board |
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