CN101875078A - Circuit board stamping mould - Google Patents
Circuit board stamping mould Download PDFInfo
- Publication number
- CN101875078A CN101875078A CN 201010133120 CN201010133120A CN101875078A CN 101875078 A CN101875078 A CN 101875078A CN 201010133120 CN201010133120 CN 201010133120 CN 201010133120 A CN201010133120 A CN 201010133120A CN 101875078 A CN101875078 A CN 101875078A
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- CN
- China
- Prior art keywords
- circuit board
- mould
- membrane module
- die
- reclaiming plate
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Abstract
The invention discloses a circuit board stamping mould which comprises an upper mould assembly and a lower mould assembly, wherein the upper surface of the lower mould assembly is provided with a circuit board external form, the bottom of the lower mould assembly is provided with mould feet for increasing the mould stability, the circuit board stamping mould also comprises a ball guide post sleeve, an electromagnet, a discharging plate and a reset spring, and the electromagnet is positioned inside the lower mould assembly and connected with the lower surface of the discharging plate through the reset spring; the discharging plate is positioned between the upper mould assembly and the lower mould assembly, the guide post sleeve is fixed on the upper mould assembly, and the discharging plate is provided with a circuit board punching positioning hole. The invention increases the stability of the mould and the performance of the mould, avoids the inconvenience of directly taking a flexible circuit board out by hands, and ensures that the flexible circuit board is not easy to damage and the operation time is shortened in the process of taking the flexible circuit board out, thereby having the advantages of simple operation, time and labor saving, difficult drop and damage of the flexible circuit board and high working efficiency.
Description
Technical field
The present invention relates to a kind of diel, what be specifically related to is a kind of circuit board stamping mould.
Background technology
Flexible printed circuit board (Flexible Printed Circuit Board, be called for short FPC or FPC) be the printed circuit made from flexible insulating substrate, has the advantage that many rigid printed circuit boards do not possess, for example it can free bend, coiling, folding, can require to arrange arbitrarily according to space layout, and mobile arbitrarily and flexible, thereby reach integrated that the components and parts assembling is connected with lead at three dimensions.Utilize FPC can dwindle the volume of electronic product greatly, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.
Along with developing rapidly of international and domestic electronics industry, new product especially, newfashioned continuous development as products such as mobile phone, notebook computer, computers, all needs integrated FPC as parts.Each parts all needs mould to carry out punching, blanking and shearing in manufacturing process just to finish, and to each growth enterprise, this parts of hundreds of kind is arranged all.
FPC also has good thermal diffusivity and solderability and is easy to advantages such as load, integrated cost be lower, and the design of soft or hard combination has also remedied flexible parent metal not enough slightly on the element bearing capacity to a certain extent.Flexible print circuit board has the branch of single face, two-sided and multi-layer sheet.The base material that is adopted is based on poly-phthalimide copper-clad plate, and this kind material thermal resistance height, dimensional stability are good, form final products with the coverlay that has mechanical protection and good electrical insulating properties concurrently by compacting.Top layer and inner conductor two-sided, multilayer printed wiring board are realized being electrically connected of ectonexine circuit by metallization.
Die-cut being absolutely necessary a step in the production process of FPC, this production process are utilized diel and are undertaken by stamping machine.Structurally there is deficiency in existing diel, and troublesome poeration when causing FPC to take out in die-cut back drops easily and damages inefficiency.
Summary of the invention
At the deficiency that exists on the prior art, the present invention seeks to be to provide a kind of FPC to be difficult for dropping and damage, simple to operate, flexible PCB diel that efficient is high.
To achieve these goals, the present invention realizes by the following technical solutions:
Circuit board stamping mould, comprise upper die component, following membrane module, the described upper surface of membrane module down is provided with the circuit board profile, it is characterized in that, the mould pin that increases the mould steadiness is installed in bottom at described membrane module down, described circuit board stamping mould also comprises guide pillar guide pin bushing, electromagnet, reclaiming plate and the back-moving spring of ball-type, and described electromagnet is positioned at described membrane module down and is connected with the lower surface of described reclaiming plate by described back-moving spring; Described reclaiming plate is at described upper die component and described down between the membrane module, described guide pillar guide pin bushing is fixed on the upper die component, described reclaiming plate is provided with the die-cut locating hole of circuit board, the die-cut locating hole of described circuit board is enclosed within the periphery of described circuit board profile, the front portion of described reclaiming plate rotate with described down membrane module by connector is connected, side that the rear portion stretches out in described time membrane module.
Described upper die component comprises die shank, upper mould fixed plate, the patrix sideboard that from up to down connects successively; membrane module comprises lower bolster, die shoe under the above; described circuit board profile is positioned at the upper surface of described lower bolster; described lower bolster is that die is cut oralia; described mould pin is fixed on the lower surface of die shoe, and described guide pillar is installed on the upper mould fixed plate.
According to the above-mentioned circuit board stamping mould of stating, wherein, described connector is for connecting flexible glue or hinge.
The present invention has increased the stability of mould and the performance of mould by increasing the guide pillar guide pin bushing of mould pin and ball-type, and it is easy to operate, time saving and energy saving; And since reclaiming plate between described upper die component and described time membrane module, on reclaiming plate, be provided with the die-cut locating hole of circuit board, avoided directly taking out the inconvenience of FPC with hand, make FPC not fragile, the process of make taking out FPC has simultaneously shortened the operating time, so the present invention is simple to operate, FPC is difficult for dropping and damage, high efficiency.
Description of drawings
Describe the present invention in detail below in conjunction with the drawings and specific embodiments;
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a vertical view of the present invention;
Fig. 3 is one embodiment of the invention.
The specific embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect is easy to understand, below in conjunction with the specific embodiment, further set forth the present invention.
Embodiment:
Referring to Fig. 1 to Fig. 3, the present invention includes upper die component 10, electromagnet 70, back-moving spring 6, following membrane module 20 and reclaiming plate 30; The described upper surface of membrane module 20 down is provided with circuit board profile 21, described reclaiming plate 30 is at described upper die component 10 and described down between the membrane module 20, described reclaiming plate 30 is provided with the die-cut locating hole 31 of circuit board, the die-cut locating hole 31 of described circuit board is enclosed within the periphery of described circuit board profile 21, the front portion of described reclaiming plate 30 rotate with described down membrane module 20 by connector 50 is connected, side that the rear portion stretches out in described time membrane module 20.
In the present embodiment, described upper die component 10 comprises die shank 11, cope match-plate pattern 12, the upper mould fixed plate 13 that has guide pillar guide pin bushing 14, the patrix portable plate 15 that from up to down connects successively, and described membrane module 20 down comprises lower bolster 22, die shoe 23; Lower surface at die shoe has 6 mould legs 40 by screw or bolting, the stability when having increased mould extruding work; Described guide pillar guide pin bushing 14 has adopted the guide pillar guide pin bushing of ball-type, has improved the Mould operation performance, makes its operation convenient.Described circuit board profile 21 is positioned at the upper surface of described lower bolster 22, and described lower bolster 22 is cut oralia for die, and described connector 50 is for connecting flexible glue or hinge.
Referring to Fig. 3, in the present embodiment, described electromagnet 70 is positioned at described membrane module 20 down and is connected with the lower surface of described reclaiming plate 30 by described back-moving spring 60; Can realize flicking the automation control of the process of described reclaiming plate 30 by described electromagnet 70 and described back-moving spring 60, reduce artificial more.
In the present embodiment, the spacing between the upper and lower template 12,22 is not too big, in use, cooperate between the guide pillar guide pin bushing and will easily draw back, thereby change the needed mould of punching, blanking and cutting operation, it is easy to use, replacing is quick, has improved the production efficiency of enterprise.
When die-cut, described reclaiming plate 30 is placed on the described membrane module 20 down, to treat that then die-cut wiring board is placed on the described reclaiming plate 30, after die-cut, the rear portion of described reclaiming plate 30 is upwards lifted, wiring board after die-cut just breaks away from from described membrane module down 20, avoided directly taking out the inconvenience of FPC with hand, make FPC not fragile, the process of make taking out FPC has simultaneously shortened the operating time, so the present invention is simple to operate, FPC is difficult for dropping and damage, high efficiency.The present invention can be widely used in the FPC field.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that describes in the foregoing description and the specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (3)
1. circuit board stamping mould, comprise upper die component, following membrane module, the described upper surface of membrane module down is provided with the circuit board profile, it is characterized in that, the mould pin that increases the mould steadiness is installed in bottom at described membrane module down, described circuit board stamping mould also comprises guide pillar guide pin bushing, electromagnet, reclaiming plate and the back-moving spring of ball-type, and described electromagnet is positioned at described membrane module down and is connected with the lower surface of described reclaiming plate by described back-moving spring; Described reclaiming plate is at described upper die component and described down between the membrane module, described guide pillar guide pin bushing is fixed on the upper die component, described reclaiming plate is provided with the die-cut locating hole of circuit board, the die-cut locating hole of described circuit board is enclosed within the periphery of described circuit board profile, the front portion of described reclaiming plate rotate with described down membrane module by connector is connected, side that the rear portion stretches out in described time membrane module.
2. circuit board stamping mould according to claim 1; it is characterized in that; described upper die component comprises die shank, upper mould fixed plate, the patrix sideboard that from up to down connects successively; membrane module comprises lower bolster, die shoe under the above; described circuit board profile is positioned at the upper surface of described lower bolster; described lower bolster is that die is cut oralia, and described guide pillar guide pin bushing is installed on the upper mould fixed plate, and described mould pin is fixed on the lower surface of die shoe.
3. circuit board stamping mould according to claim 1 is characterized in that, described connector is for connecting flexible glue or hinge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010133120 CN101875078A (en) | 2010-03-25 | 2010-03-25 | Circuit board stamping mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010133120 CN101875078A (en) | 2010-03-25 | 2010-03-25 | Circuit board stamping mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101875078A true CN101875078A (en) | 2010-11-03 |
Family
ID=43017820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010133120 Pending CN101875078A (en) | 2010-03-25 | 2010-03-25 | Circuit board stamping mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101875078A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102672759A (en) * | 2012-05-10 | 2012-09-19 | 苏州市飞莱克斯电路电子有限公司 | Mould frame structure of punching mould for punching flexible circuit board |
| CN102672757A (en) * | 2012-05-10 | 2012-09-19 | 苏州市飞莱克斯电路电子有限公司 | Die frame structure of punching die for punching flexible circuit board |
| CN103846967A (en) * | 2012-11-30 | 2014-06-11 | 富葵精密组件(深圳)有限公司 | Blanking die |
| CN103990711A (en) * | 2014-06-05 | 2014-08-20 | 昆山电子羽电业制品有限公司 | Edge folding die for U-shaped steel plate |
| CN106903922A (en) * | 2017-04-20 | 2017-06-30 | 广西贺州市金海乐器有限公司 | Guitar sound beam fixing device |
| CN107413922A (en) * | 2017-06-20 | 2017-12-01 | 林春芳 | A kind of diel of flexible PCB |
| CN113210495A (en) * | 2021-04-28 | 2021-08-06 | 殷海欣 | Punching device for die production and processing |
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| US4495546A (en) * | 1981-05-18 | 1985-01-22 | Matsushita Electric Industrial Co., Ltd. | Hybrid integrated circuit component and printed circuit board mounting said component |
| JPH08186350A (en) * | 1994-12-28 | 1996-07-16 | Nec Toyama Ltd | Manufacture of printed wiring board |
| KR20020060675A (en) * | 2002-07-04 | 2002-07-18 | 최무송 | Routing machine for PCB |
| CN2542360Y (en) * | 2002-03-18 | 2003-04-02 | 浙江精工科技股份有限公司 | Punching device capable of single-punching multiple louver |
| CN2763030Y (en) * | 2005-02-02 | 2006-03-08 | 扬州锻压机床有限公司 | Means for guiding slider of press machine |
| CN201063972Y (en) * | 2007-05-10 | 2008-05-21 | 张承权 | Automatic punching machine of flexible circuit board |
| CN201157868Y (en) * | 2007-12-27 | 2008-12-03 | 珠海市科盈电子有限公司 | Flexible circuit board stamping die |
| CN101472393A (en) * | 2007-12-27 | 2009-07-01 | 珠海市科盈电子有限公司 | Stamping mold for flexible circuit board |
| CN201361661Y (en) * | 2009-03-04 | 2009-12-16 | 阳江市亿利模具有限公司 | Compound fine-blanking forming die for precise pliers tooth parts |
| CN201676946U (en) * | 2010-03-25 | 2010-12-22 | 昆山凯意工模具配套有限公司 | Punching die of circuit board |
-
2010
- 2010-03-25 CN CN 201010133120 patent/CN101875078A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4495546A (en) * | 1981-05-18 | 1985-01-22 | Matsushita Electric Industrial Co., Ltd. | Hybrid integrated circuit component and printed circuit board mounting said component |
| JPH08186350A (en) * | 1994-12-28 | 1996-07-16 | Nec Toyama Ltd | Manufacture of printed wiring board |
| CN2542360Y (en) * | 2002-03-18 | 2003-04-02 | 浙江精工科技股份有限公司 | Punching device capable of single-punching multiple louver |
| KR20020060675A (en) * | 2002-07-04 | 2002-07-18 | 최무송 | Routing machine for PCB |
| CN2763030Y (en) * | 2005-02-02 | 2006-03-08 | 扬州锻压机床有限公司 | Means for guiding slider of press machine |
| CN201063972Y (en) * | 2007-05-10 | 2008-05-21 | 张承权 | Automatic punching machine of flexible circuit board |
| CN201157868Y (en) * | 2007-12-27 | 2008-12-03 | 珠海市科盈电子有限公司 | Flexible circuit board stamping die |
| CN101472393A (en) * | 2007-12-27 | 2009-07-01 | 珠海市科盈电子有限公司 | Stamping mold for flexible circuit board |
| CN201361661Y (en) * | 2009-03-04 | 2009-12-16 | 阳江市亿利模具有限公司 | Compound fine-blanking forming die for precise pliers tooth parts |
| CN201676946U (en) * | 2010-03-25 | 2010-12-22 | 昆山凯意工模具配套有限公司 | Punching die of circuit board |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102672759A (en) * | 2012-05-10 | 2012-09-19 | 苏州市飞莱克斯电路电子有限公司 | Mould frame structure of punching mould for punching flexible circuit board |
| CN102672757A (en) * | 2012-05-10 | 2012-09-19 | 苏州市飞莱克斯电路电子有限公司 | Die frame structure of punching die for punching flexible circuit board |
| CN103846967A (en) * | 2012-11-30 | 2014-06-11 | 富葵精密组件(深圳)有限公司 | Blanking die |
| CN103846967B (en) * | 2012-11-30 | 2016-01-06 | 富葵精密组件(深圳)有限公司 | Blanking die |
| CN103990711A (en) * | 2014-06-05 | 2014-08-20 | 昆山电子羽电业制品有限公司 | Edge folding die for U-shaped steel plate |
| CN106903922A (en) * | 2017-04-20 | 2017-06-30 | 广西贺州市金海乐器有限公司 | Guitar sound beam fixing device |
| CN106903922B (en) * | 2017-04-20 | 2019-07-23 | 广西贺州市金海乐器有限公司 | Guitar sound beam fixes device |
| CN107413922A (en) * | 2017-06-20 | 2017-12-01 | 林春芳 | A kind of diel of flexible PCB |
| CN107413922B (en) * | 2017-06-20 | 2019-01-18 | 永盛恒基(惠州)电路板有限公司 | A kind of stamping die of flexible circuit board |
| CN113210495A (en) * | 2021-04-28 | 2021-08-06 | 殷海欣 | Punching device for die production and processing |
| CN113210495B (en) * | 2021-04-28 | 2023-04-21 | 永大精密模具（东莞）有限公司 | Punching device for die production and processing |
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Application publication date: 20101103 |