CN114269141A

CN114269141A - LED chip mounting device with bulk material classification structure and implementation method thereof

Info

Publication number: CN114269141A
Application number: CN202111529274.6A
Authority: CN
Inventors: 段瑶; 陈继红
Original assignee: Shenzhen Henglitai Technology Co ltd
Current assignee: Shenzhen Henglitai Technology Co ltd
Priority date: 2021-12-14
Filing date: 2021-12-14
Publication date: 2022-04-01

Abstract

An LED chip mounting device with a bulk material classification structure and an implementation method thereof belong to the technical field of LED chip mounting, and aim to solve the problem that the size of an LED chip cannot be detected when the conventional LED chip mounting device carries out rubber cake chip mounting, so that unqualified chips are sorted out; the problem that when the conventional LED chip mounting device carries out rubber cake chip mounting, the processed LED chip mounting lamp is not timely discharged, and the working position is occupied, so that the uninterrupted chip mounting efficiency is influenced is solved; the LED chip mounting device drives the rotating disc and the distributing tray to rotate through the driving motor and the rotating shaft, the rotating shaft drives the kick-out device at the top of the distributing tray to centrifugally rotate to stir LED chips to be mounted, so that qualified chips enter a chip mounting groove in the rotating disc from a sorting port in the side wall of the distributing tray through the inclined slide way and are intercepted by chips with over specifications, and meanwhile, the chip mounting component sequentially carries out chip mounting, adsorption and feeding and finished adsorption and discharging at two ends under the pushing of the lever; the invention can fully sort the LED chips to be pasted and realize the uninterrupted circulating operation of the pasting.

Description

LED chip mounting device with bulk material classification structure and implementation method thereof

Technical Field

The invention relates to the technical field of LED (light-emitting diode) chip mounting, in particular to an LED chip mounting device with a bulk material classification structure and an implementation method thereof.

Background

The LED Surface Mounted Device (SMD) lamp is made of an FPC circuit board, an LED lamp and a high-quality silica gel sleeve. Waterproof performance, safe and convenient use of low-voltage direct current power supply, various light-emitting colors and bright colors; the product has the advantages of UV aging resistance, yellowing resistance, high temperature resistance and the like when used outdoors, and can be widely applied to the fields of building contour lamps, quasi-decorative lighting in entertainment places, advertisement decorative lighting and illuminating lamps. The packaging process of the surface mount type LED is that the fluorescent powder and the epoxy resin are prepared to be made into a mold, then the epoxy resin with the fluorescent powder is made into a rubber cake, the rubber cake is attached to the chip, and the periphery of the rubber cake is filled with the epoxy resin, so that the SMD packaged LED is manufactured. The LED chip has large and small sizes during processing and production, and is a qualified product as long as the LED chip is within an allowable deviation range. However, when the conventional LED chip mounting device is used for mounting the adhesive cakes, whether the specification and the size of the LED chip are qualified or not can not be effectively checked, so that unqualified chips are sorted out in a classified mode, and especially some chips exceeding the production standard can influence the chip mounting package of the LED; and there is certain limitation in current LED paster device when carrying out the paster, is difficult to guarantee during the paster that the LED paster lamp that processing net was accomplished carries out timely unloading, and the linking of material loading and unloading is not smooth to be difficult to incessant continuously carry out the paster, and paster efficiency receives the influence.

Therefore, an LED chip mounting device with a bulk material sorting structure and an implementation method thereof are provided.

Disclosure of Invention

The invention aims to provide an LED chip mounting device with a bulk material classification structure and an implementation method thereof, and aims to solve the problems that the existing LED chip mounting device cannot check whether the specification and the size of an LED chip are qualified or not when a rubber cake is mounted, so that the unqualified chips are classified and selected, and the existing LED chip mounting device cannot timely discharge an LED chip mounting lamp processed when the rubber cake is mounted, and occupies a station, so that the uninterrupted chip mounting efficiency is influenced in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: a light-emitting diode (LED) chip mounting device with a bulk sorting structure comprises a base and a support column arranged on the side wall of one end of the base, wherein a dispensing part is arranged at the top of the support column, one end of the dispensing part is suspended above the base, a sorting component is arranged at the top of the base at the position adjacent to the dispensing part, the top of the base is provided with a lower end communicated with a feeding channel arranged in the base, a discharging hopper is arranged on the outer wall of the base at one side of the feeding channel, a U-shaped support plate is arranged at the top of the base at the position adjacent to the sorting component, a chip mounting component is arranged at the top of the U-shaped support plate, and a transmission part is arranged at the top of the base at the position adjacent to the chip mounting component;

the sorting component comprises a bottom barrel arranged at the top of the machine base, the bottom barrel is communicated with the feeding channel, a transverse supporting plate is arranged between the inner walls at the port of the bottom barrel, a driving motor is arranged at the bottom of the transverse supporting plate, the transverse supporting plate at the outer side of the driving motor is of a hollow structure, the output end at the top of the driving motor is fixedly connected with a rotating shaft, the upper end of the rotating shaft penetrates and extends to the port of the top of the bottom barrel, the rotary disc is fixedly connected to the top of the rotary disc, the lower end of the rotary disc is in contact with the bottom barrel, a material distribution tray is arranged at the upper end of the rotary disc, a kicker is arranged at the middle of the upper end of the material distribution tray and connected with the top end of the rotating shaft, sorting ports are formed in the peripheral side walls of the material distribution tray, close to the bottom, of the material distribution tray at even intervals, oblique slideways are arranged on the outer walls of the ports of the sorting ports, the tail ends of the oblique slideways extend to the upper end of the rotary disc, and patch slots are formed in the tops of the rotary discs at the tail ends of the oblique slideways.

Further, the protruding pole of top fixedly connected with of pivot, pivot fixed connection is when the rotary disk bottom, protruding pole runs through and extends to the top of dividing the material tray, and protruding pole top fixedly connected with gear, the gear cup joints in the fixed sleeve inner chamber of setting gauge, fixed sleeve's inside is provided with the ring gear, the rodent on the ring gear inner wall meshes with the gear mutually, fixedly connected with switch-plate on the outer wall of fixed sleeve's both sides, the switch-plate sets up about fixed sleeve central bilateral symmetry, and the end of switch-plate is the arc structure, its cambered surface inner wall is towards sorting opening setting.

Further, be provided with the bolster on the end section of thick bamboo inner wall of horizontal backup pad lower extreme, the bolster includes the first solid fixed ring of fixed connection on end section of thick bamboo inner wall, the top of first solid fixed ring is provided with the solid fixed ring of second through the fixed block, the solid fixed ring of second and the coaxial setting of first solid fixed ring, and all be provided with through the dead lever between the solid fixed ring of first solid fixed ring and second and keep off the inner ring, evenly be provided with the buffer beam on the solid fixed ring inner wall of first solid fixed ring and the second in the fender inner ring outside.

Further, the buffer rod includes the rubber sleeve of fixed connection on solid fixed ring inner wall, and the inner chamber of rubber sleeve evenly is provided with the buffering ball, is provided with the buffering air cushion on the outer wall of buffering ball, and the setting of buffering air cushion laminating rubber sleeve inner wall, and swing joint has the movable rod on the relative lateral wall of adjacent buffering ball, and the terminal swing joint of movable rod is on the outer wall of ejector pin one end, and the rubber sleeve inner wall setting is pressed close to the other end of ejector pin, and relative ejector pin passes through that elastomeric element is fixed continuous.

Further, divide material tray upper end to be close to sorting gate department and be provided with the bin outlet, the bin outlet extends to the rotary disk bottom, be provided with the shutoff board through swing joint spare on the port outer wall of bin outlet one side, it is provided with the arch to correspond bin outlet department on one side outer wall of shutoff board, the shutoff board closing cap is when the bin outlet bottom, protruding block is in the bin outlet, and protruding upper end and bin outlet port looks parallel and level, one side bottom of shutoff board expansion end is provided with spacing push rod, spacing push rod's other end swing joint is in the rotary disk lower extreme.

Further, spacing push rod includes the U type connecting strip that is connected with shutoff board expansion end bottom, two arms of U type connecting strip are long one and short to set up, and the end of the short arm of U type connecting strip links to each other with the one end activity of electric telescopic push rod, electric telescopic push rod's other end fixedly connected with fixed strip, the terminal swing joint of fixed strip is in the rotary disk bottom of shutoff board stiff end one side, and the shutoff board closing cap is when the bin outlet bottom, electric telescopic push rod is the extension state, the long support arm laminating shutoff board bottom plate of U type connecting strip.

Further, the glue dispensing part comprises a supporting plate fixedly connected to the top of the supporting column, a glue dispensing box is arranged on the top of the supporting plate, a first lifting rod is arranged on the outer wall, close to one side of the distributing tray, of the glue dispensing box, a connecting rod is fixedly connected to the bottom of the first lifting rod, a limiting ring is arranged at the tail end of the connecting rod, a glue dispensing head is sleeved in an inner cavity of the limiting ring, the glue dispensing head is correspondingly suspended above the patch groove, a glue outlet pipe is arranged at the top of the glue dispensing head, and the glue outlet pipe is communicated with the glue dispensing box.

Further, the paster subassembly includes fixed column fixed connection in U type backup pad upper end, the installation section of thick bamboo has been cup jointed in the top activity of fixed column, the top fixedly connected with lever of installation section of thick bamboo, respectively fixedly connected with second lifter on the both ends outer wall of lever, the bottom of second lifter is provided with the sucking disc, swing joint has the movable connecting rod on the second lifter upper portion lateral wall of lever one end, the terminal swing joint of movable connecting rod has the spinning rod, spinning rod fixed connection is on the terminal outer wall of rotating electrical machines transmission shaft, the rotating electrical machines is installed in transmission top one side.

Further, the transmission piece includes the frame of fixed connection in frame top both sides, the one end of frame extends to U type backup pad lower extreme, be provided with the conveyer belt between the inner wall of frame, the frame upper end of the adjacent department of U type backup pad is provided with the support swash plate, the support swash plate leans on U type backup pad to set up to one side, and it is provided with and connects the hopper to support the swash plate top, it presses close to the rotary disk setting to connect the hopper, it is provided with and connects the material swash plate to connect the support swash plate inner wall of hopper lower extreme to press close to between, connect the material swash plate lower extreme to press close to the suspension in the conveyer belt top, and evenly be provided with the fixed axle on the top inclined plane that connects the material swash plate, the change has been cup jointed in the activity on the outer wall of fixed axle, even interval is provided with on the outer wall of change connects the material blend stop.

The invention provides another technical scheme: an implementation method of an LED chip mounting device with a bulk material classification structure comprises the following steps:

s1: placing a certain number of LED chips with patches in a distribution tray, starting a driving motor to drive the distribution tray to rotate in cooperation with a rotating shaft, poking the chips to the edge of the distribution tray by using centrifugal force when the distribution tray rotates, simultaneously meshing a gear on the outer wall of a protruding rod at the top of the rotating shaft with a toothed ring in a fixed sleeve, poking the chips by using poking plates on two sides of the fixed sleeve in cooperation with the centrifugal force, discharging the chips from a sorting port on the side wall of the distribution tray and sliding the chips into patch grooves at the top of a rotating disc by means of an inclined slideway, and intercepting the chips with sizes beyond the range in the distribution tray;

s2: then controlling the first lifting rod to descend to drive a dispensing head inside the limiting ring to be close to the LED chips inside the film slot, conveying the colloid inside the dispensing box to the dispensing head through a glue outlet pipe, and sequentially and intermittently dispensing the LED chips inside the film slot by using the dispensing head when the rotating disc rotates;

s3: after dispensing of the LED chips in the chip grooves is completed, the LED chips are conveyed to be close to the chip mounting assembly in a rotating mode, a second lifting rod at one end of the lever descends and adsorbs rubber cakes by using a sucker at the bottom of the second lifting rod, then the rotating motor is started to be matched with the rotating push rod to drive the movable connecting rod to rotate the pushing lever, the second lifting rod adsorbing the rubber cakes is suspended above the rotating disk, then the second lifting rod descends to adhere the rubber cakes to the upper ends of the dispensed LED chips, then the rotating motor is started reversely to be matched with the rotating push rod to drive the movable connecting rod to rotate the reverse pulling lever, and the second lifting rod connected with the movable connecting rod is reset and then continues to adsorb the rubber cakes;

s4: the second lifting rod connected with the movable connecting rod adsorbs the rubber cake again and then continues to pull the lever reversely, so that the second lifting rod at the other end of the lever descends to adsorb the LED chip which is already pasted with the surface by using the sucker after approaching the rotating disc, the LED chip which is pasted with the surface is put into the receiving hopper after the rotating motor rotates reversely again, and slides to the upper part of the conveying belt along the receiving inclined plate to be conveyed, and meanwhile, the second lifting rod connected with the movable connecting rod continues to paste with the surface, and the process is repeated;

s5: the spacing push rod of start rotary disk bottom after the paster ends for electronic flexible push rod shrink drives U type connecting strip and deflects, make the short armed of U type connecting strip press close to the shutoff board, the drive shutoff board breaks away from the bin outlet on dividing the material tray bottom plate, divide the material tray when rotatory, the inside ring gear of gear engagement fixed sleeve on the protruding pole outer wall of pivot drive, the surplus super specification chip is stirred to the switch-plate of cooperation centrifugal force drive fixed sleeve both sides, drop it from the bin outlet department and get into the pay-off passageway and discharge from the discharge hopper department of its one side.

Compared with the prior art, the invention has the following beneficial effects:

1. the invention provides an LED chip mounting device with a bulk material classification structure and an implementation method thereof, wherein a bottom cylinder is communicated with a feeding channel, a transverse supporting plate is arranged between the inner walls at the port of the bottom cylinder, the bottom of the transverse supporting plate is provided with a driving motor, the output end at the top of the driving motor is fixedly connected with a rotating shaft, the upper end of the rotating shaft penetrates and extends to the port of the top of the bottom cylinder, the top of the rotating shaft is fixedly connected with a rotating disc, the lower end of the rotating disc is contacted with the bottom cylinder, the upper end of the rotating disc is provided with a material distribution tray, the top of the rotating shaft is fixedly connected with a protruding rod, when the rotating shaft is fixedly connected to the bottom of the rotating disc, the protruding rod penetrates and extends to the upper part of the material distribution tray, the top of the protruding rod is fixedly connected with a gear, the gear is sleeved in the inner cavity of a fixing sleeve of a material poking device, a gear ring is arranged in the fixing sleeve, the inner wall of the gear ring is meshed with the gear, the poking plates are fixedly connected on the outer walls at two sides of the fixing sleeve, sorting ports are evenly arranged on the side wall of the periphery of the material distribution tray at intervals close to the bottom, oblique slide ways are arranged on the outer wall of the port of each sorting port, the tail ends of the oblique slide ways extend to the upper end of the rotating disc, patch grooves are arranged at the tops of the rotating discs at the tail ends of the oblique slide ways, a certain number of LED chips with patches are placed in the material distribution tray, a driving motor is started to be matched with a rotating shaft to drive the material distribution tray to rotate, the chips are poked to the edge by centrifugal force when the material distribution tray rotates, meanwhile, gears on the outer wall of a protruding rod at the top of the rotating shaft are meshed with toothed rings inside a fixing sleeve, poking plates on two sides of the fixing sleeve are driven to poke the chips by matching with the centrifugal force, the chips are discharged from the sorting ports on the side wall of the material distribution tray and slide into the patch grooves at the top of the rotating discs by virtue of the oblique slide ways, the chips with the sizes out of the range are retained in the material distribution tray, and after the patches, a blocking plate at the bottom of the rotating disc is started to expose the discharge ports on the bottom of the material distribution tray, the super-specification LED chip falls from the discharge opening, enters the feeding channel and is discharged from the discharge hopper on one side of the feeding channel, automatic classification treatment of the LED chips to be attached with the paster is achieved, automatic separation and discharge of the super-specification LED chips are achieved, and the super-specification LED chip feeding device is convenient and practical.

2. The invention provides an LED chip mounting device with a bulk material classification structure and an implementation method thereof, wherein a first fixing ring is arranged on the inner wall of a bottom cylinder, a second fixing ring is arranged at the top of the first fixing ring through a fixing block, a baffle inner ring is arranged between the inner walls of the first fixing ring and the second fixing ring through a fixing rod, buffer rods are uniformly arranged on the inner walls of the first fixing ring and the second fixing ring outside the baffle inner ring, buffer balls are uniformly arranged in the inner cavity of a rubber sleeve of the buffer rods, buffer air cushions are arranged on the outer walls of the buffer balls and are attached to the inner walls of the rubber sleeve, movable rods are movably connected on the opposite side walls of the adjacent buffer balls, the tail ends of the movable rods are movably connected to the outer wall of one end of a mandril, the other end of the mandril is arranged close to the inner wall of the rubber sleeve, the opposite mandril is fixedly connected through an elastic part, when an LED chip with an over-specification falls into the inner cavity of the bottom cylinder from a discharge port at the bottom of a feed tray, buffer rod through the inside range upon range of setting of the solid fixed ring of first solid fixed ring and second, the rubber sleeve of buffer rod receives impact deformation, the tenesmus of LED chip is strikeed and is pushed away and caves in to the rubber sleeve top, extrusion ejector pin cooperation movable rod removes adjacent buffering ball to both sides separation when the rubber sleeve caves in, compress the elastomeric element between the ejector pin simultaneously, utilize the invagination deformation of rubber sleeve and elastomeric element's compression to cushion the speed reduction to the LED chip, so that it slowly drops to follow the discharge hopper discharge after in the pay-off passageway of the adjacent department of end section of thick bamboo lower extreme, effectively prevent LED's tenesmus damage, so that carry out recovery processing to the LED chip that surpasss the specification.

3. The invention provides an LED chip mounting device with a bulk material classification structure and an implementation method thereof, wherein a fixed column is arranged at the upper end of a U-shaped support plate, the top of the fixed column is movably sleeved with an installation cylinder, the top of the installation cylinder is fixedly connected with a lever, the outer walls of the two ends of the lever are respectively and fixedly connected with a second lifting rod, the bottom of the second lifting rod is provided with a sucker, the side wall of the upper part of the second lifting rod at one end of the lever is movably connected with a movable connecting rod, the tail end of the movable connecting rod is movably connected with a rotary push rod, the rotary push rod is fixedly connected with the outer wall of the tail end of a transmission shaft of a rotary motor, the rotary motor is arranged at one side of the top of a transmission part, an LED chip in a chip slot is subjected to glue dispensing and then is conveyed to be close to a chip mounting component in a rotating way, the second lifting rod at one end of the lever descends and then utilizes the sucker at the bottom to adsorb a rubber cake to be matched with the rotary push rod to rotate, so that the movable connecting rod is driven to rotate and push the lever to suspend the second lifting rod adsorbing the rubber cake above a rotating disk, then the second lifting rod descends to attach the rubber cake to the upper end of the LED chip subjected to dispensing, and then the rotating motor is started reversely to cooperate with the rotating push rod to drive the movable connecting rod to rotate the reverse pull lever, so that the second lifting rod connected with the movable connecting rod is reset to continuously adsorb the rubber cake; the second lifting rod connected with the movable connecting rod adsorbs the rubber cakes again and then continues to pull the lever reversely, the second lifting rod at the other end of the lever is made to descend after approaching the rotating disc and adsorb the LED chips which are already pasted with the rubber cakes by utilizing the suckers, the LED chips which are pasted with the rubber cakes are thrown into the receiving hopper after the rotating motor rotates reversely again, the LED chips slide to the upper part of the conveying belt along the receiving inclined plate to be conveyed, and meanwhile, the second lifting rod connected with the movable connecting rod continues to be pasted with the rubber cakes, so that the synchronous operation of the loading and unloading of the paster and the pasted LED chips is realized, the uninterrupted circulating paster processing of the LED chips is realized, and the paster efficiency of the LED chips is accelerated.

Drawings

FIG. 1 is a schematic view of the overall structure of an LED chip mounting device with a bulk sorting structure according to the present invention;

FIG. 2 is a schematic structural diagram of a sorting assembly of the LED chip mounting device with a bulk sorting structure according to the present invention;

FIG. 3 is an exploded view of a sorting module of the LED chip mounting device with a bulk sorting structure according to the present invention;

FIG. 4 is a schematic view of the mounting structure of the kick-out device and the rotating shaft of the LED chip mounting device with a bulk material sorting structure according to the present invention;

FIG. 5 is a bottom view of a rotating disk of the LED chip mounting device with bulk sorting structure of the present invention;

FIG. 6 is a structural diagram illustrating an open state of a bottom blocking plate of a rotating disk of the LED chip mounting device with a bulk material sorting structure according to the present invention;

FIG. 7 is a schematic structural view of a limiting push rod of the LED chip mounting device with a bulk sorting structure according to the present invention;

FIG. 8 is a schematic view of a buffer structure of the LED chip mounting device with a bulk sorting structure according to the present invention;

FIG. 9 is a schematic view of a buffer rod structure of the LED chip mounting device with a bulk sorting structure according to the present invention;

fig. 10 is a schematic view of a dispensing member of the LED chip mounting device with a bulk sorting structure according to the present invention;

fig. 11 is a schematic view of a mounting structure of a chip mounting component and a transmission member of the LED chip mounting device with a bulk sorting structure according to the present invention;

FIG. 12 is a schematic structural diagram of a chip mounting assembly of the LED chip mounting device with a bulk sorting structure according to the present invention;

fig. 13 is an enlarged schematic structural diagram of a portion a in fig. 11 of the LED chip mounting device with a bulk material sorting structure according to the present invention.

In the figure: 1. a machine base; 2. a support pillar; 3. dispensing a glue piece; 31. a support plate; 32. dispensing a glue box; 33. a first lifting rod; 34. a connecting rod; 35. a limiting ring; 36. dispensing a glue head; 37. discharging the rubber tube; 4. a sorting assembly; 41. a bottom cylinder; 42. a transverse support plate; 43. a drive motor; 44. a rotating shaft; 441. a projecting rod; 442. a gear; 45. rotating the disc; 46. a material distribution tray; 47. a kick-out device; 471. fixing the sleeve; 472. a toothed ring; 473. a kick-out plate; 48. a sorting port; 49. an oblique slideway; 410. a patch slot; 411. a buffer member; 4111. a first retaining ring; 4112. a fixed block; 4113. a second retaining ring; 4114. fixing the rod; 4115. a baffle inner ring; 4116. a buffer rod; 41161. a rubber sleeve; 41162. a buffer ball; 41163. a buffer air cushion; 41164. a movable rod; 41165. a top rod; 41166. an elastic member; 412. a discharge outlet; 413. a movable connecting piece; 414. a plugging plate; 415. a limit push rod; 4151. a U-shaped connecting strip; 4152. an electric telescopic push rod; 4153. a fixing strip; 5. a feed channel; 6. a discharge hopper; 7. a U-shaped support plate; 8. a patch assembly; 81. fixing a column; 82. mounting the cylinder; 83. a lever; 84. a second lifting rod; 85. a suction cup; 86. a movable connecting rod; 87. rotating the push rod; 88. a rotating electric machine; 9. a transport member; 91. a frame; 92. a conveyor belt; 93. supporting the inclined plate; 94. a receiving hopper; 95. a material receiving sloping plate; 96. a fixed shaft; 97. rotating the ring; 98. connect the material blend stop.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In order to solve the problem that the specification and size of an LED chip cannot be checked to be qualified when the existing LED chip mounting device is used for mounting a rubber cake, and thus unqualified chips are sorted and selected, please refer to fig. 1 to 7, the following preferred technical scheme is provided:

the utility model provides a LED paster device with bulk cargo classified structure, include frame 1 and set up the support column 2 on 1 one end lateral wall of frame, the top of support column 2 is provided with some glue 3, the one end suspension of some glue 3 is in 1 top of frame, 1 top of frame of 3 adjacent departments of some glue is provided with sorting unit 4, 1 top of frame is provided with the lower extreme and is linked together with 1 inside pay-off passageway 5 that is provided with of frame, be provided with discharge hopper 6 on the 1 outer wall of frame on one side of pay-off passageway 5, and 1 top of frame of 4 adjacent departments of sorting unit is provided with U type backup pad 7, paster subassembly 8 is installed at the top of U type backup pad 7, 1 top of frame of 8 adjacent departments of paster subassembly is provided with transmission 9.

The sorting component 4 comprises a bottom barrel 41 arranged on the top of the machine base 1, the bottom barrel 41 is communicated with the feeding channel 5, a transverse support plate 42 is arranged between the inner walls of the port of the bottom barrel 41, a driving motor 43 is arranged at the bottom of the transverse support plate 42, the transverse support plate 42 outside the driving motor 43 is of a hollow structure, a rotating shaft 44 is fixedly connected with the output end of the top of the driving motor 43, the upper end of the rotating shaft 44 penetrates and extends to the port of the top of the bottom barrel 41, a rotating disc 45 is fixedly connected with the top of the rotating shaft 44, the lower end of the rotating disc 45 is contacted with the bottom barrel 41, a material distribution tray 46 is arranged at the upper end of the rotating disc 45, a material poking device 47 is arranged in the middle of the upper end of the material distribution tray 46, sorting ports 48 are uniformly arranged on the side walls around the material distribution tray 46 at intervals and close to the bottom, oblique slideways 49 are arranged on the outer walls of the ports of the sorting ports 48, and the tail ends of the oblique slideways extend to the upper end of the rotating disc 45, and the top of the rotating disk 45 at the end of the oblique slide way 49 is provided with a patch slot 410.

Top fixedly connected with protruding pole 441 of pivot 44, when pivot 44 fixed connection was in rotary disk 45 bottom, protruding pole 441 runs through and extends to the top of dividing material tray 46, and protruding pole 441 top fixedly connected with gear 442, gear 442 cup joints in the fixed sleeve 471 inner chamber of setting gauge 47, the inside of fixed sleeve 471 is provided with ring gear 472, the rodent on the ring gear 472 inner wall meshes with gear 442 mutually, fixedly connected with switch plate 473 on the both sides outer wall of fixed sleeve 471, switch plate 473 sets up about fixed sleeve 471 central bilateral symmetry, and the end of switch plate 473 is the arc structure, its cambered surface inner wall sets up towards sorting opening 48.

The upper end of the material distributing tray 46 is provided with a material outlet 412 close to the sorting port 48, the material outlet 412 extends to the bottom of the rotating disc 45, a blocking plate 414 is arranged on the outer wall of the port on one side of the material outlet 412 through a movable connecting piece 413, a bulge is arranged on the outer wall of one side of the blocking plate 414 corresponding to the material outlet 412, the blocking plate 414 is covered at the bottom of the material outlet 412, the bulge is clamped in the material outlet 412, the upper end of the bulge is flush with the port of the material outlet 412, a limit push rod 415 is arranged at the bottom of one side of the movable end of the blocking plate 414, and the other end of the limit push rod 415 is movably connected to the lower end of the rotating disc 45.

The limiting push rod 415 comprises a U-shaped connecting strip 4151 connected with the bottom of the movable end of the blocking plate 414, two arms of the U-shaped connecting strip 4151 are arranged in a long and short mode, the tail end of the short arm of the U-shaped connecting strip 4151 is movably connected with one end of an electric telescopic push rod 4152, the other end of the electric telescopic push rod 4152 is fixedly connected with a fixing strip 4153, the tail end of the fixing strip 4153 is movably connected to the bottom of the rotating disk 45 on one side of the fixed end of the blocking plate 414, when the blocking plate 414 is covered at the bottom of the material outlet 412 in a sealing mode, the electric telescopic push rod 4152 is in an extending state, and the long arm of the U-shaped connecting strip 4151 is attached to the bottom plate of the blocking plate 414.

Specifically, a certain number of LED chips with patches are placed in a distribution tray 46, a driving motor 43 is started to cooperate with a rotating shaft 44 to drive the distribution tray 46 to rotate, the distribution tray 46 utilizes centrifugal force to dial the chips to the edge when rotating, simultaneously, a gear 442 on the outer wall of a convex rod 441 at the top of the rotating shaft 44 is meshed with a toothed ring 472 in a fixed sleeve 471, the dials 473 on two sides of the fixed sleeve 471 are driven to dial the chips by cooperating with the centrifugal force to discharge the chips from a sorting port 48 on the side wall of the distribution tray 46 and slide into a patch groove 410 on the top of a rotating disc 45 by virtue of an oblique slideway 49, the chips with out-of-range sizes are intercepted in the distribution tray 46, after the patches are finished, a limit push rod 415 at the bottom of the rotating disc 45 is started, so that an electric telescopic push rod 4152 is contracted to drive a U-shaped connecting bar 4151 to deflect, a short supporting arm blocking plate 414 of the U-shaped connecting bar 4151 is close to drive the blocking plate 414 to be separated from a discharge port 412 on the bottom plate of the distribution tray 46, when the distributing tray 46 rotates, the rotating shaft 44 drives the gear 442 on the outer wall of the protruding rod 441 to be meshed with the toothed ring 472 in the fixing sleeve 471, the poking plates 473 on the two sides of the fixing sleeve 471 are driven to poke the residual out-of-specification chips in a matching manner, the residual out-of-specification chips fall from the discharge opening 412 to enter the feeding channel 5 and are discharged from the discharge hopper 6 on one side of the feeding channel, automatic classification treatment of the LED chips to be subjected to surface mounting and automatic separation and discharge of the out-of-specification LED chips are achieved, and the distributing tray is convenient and practical.

In order to avoid damage when the over-specification LED chip is discharged and dropped, as shown in fig. 3, 8 and 9, the following preferred technical solutions are provided:

be provided with bolster 411 on the end section of thick bamboo 41 inner wall of horizontal backup pad 42 lower extreme, bolster 411 includes the first solid fixed ring 4111 of fixed connection on end section of thick bamboo 41 inner wall, the top of first solid fixed ring 4111 is provided with the solid fixed ring 4113 of second through fixed block 4112, the solid fixed ring 4113 of second and the coaxial setting of first solid fixed ring 4111, and all be provided with through dead lever 4114 between the interior wall of the solid fixed ring 4113 of first solid fixed ring 4111 and second and separate and keep off inner ring 4115, evenly be provided with buffer bar 4116 on the solid fixed ring 4111 of first solid fixed ring 4115 and the solid fixed ring 4113 of second in the outer side of separate and keep off inner ring 4115.

Buffer rod 4116 includes rubber sleeve 41161 fixedly connected to the inner wall of fixed ring, the inner cavity of rubber sleeve 41161 is evenly provided with buffer ball 41162, be provided with buffer air cushion 41163 on the outer wall of buffer ball 41162, buffer air cushion 41163 is attached to the inner wall of rubber sleeve 41161, and swing joint has movable rod 41164 on the relative side wall of adjacent buffer ball 41162, the terminal swing joint of movable rod 41164 is on the outer wall of ejector pin 41165 one end, the other end of ejector pin 41165 is attached to the inner wall of rubber sleeve 41161, relative ejector pin 41165 is fixedly connected through elastic member 41166.

Specifically, when the LED chip that exceeds the specification falls to the inner chamber of the base cylinder 41 from the bin outlet 412 of dividing the material tray 46 bottom, buffer rod 4116 that sets up through the inside buffer layer of first fixed ring 4111 and the second fixed ring 4113, rubber sleeve 41161 of buffer rod 4116 is impacted to deform, the impact of falling of the LED chip pushes away to cave in on the top of rubber sleeve 41161, push ejector rod 41165 and movable rod 41164 cooperate with adjacent buffer ball 41162 to the separation of both sides and move when rubber sleeve 41161 caves in, simultaneously compress elastomeric element 41166 between ejector rod 41165, utilize the sunken deformation of rubber sleeve 41161 and the compression of elastomeric element 41166 to cushion and decelerate the LED chip, so that it slowly drops to discharge from discharge hopper 6 after feeding channel 5 of the adjacent department of base cylinder 41 lower end, effectively prevent the damage of falling of LED, so that the LED chip that exceeds the specification is recovered.

In order to solve the problem that the blanking of an LED patch lamp finished by processing is not timely when the existing LED patch device carries out rubber cake patch, and the LED patch lamp occupies a station to influence the efficiency of uninterrupted patch, please refer to fig. 1 and fig. 10-13, the following preferred technical scheme is provided:

glue dispensing part 3 includes layer board 31 at 2 tops of support column, the top of layer board 31 is provided with some glue boxes 32, some glue boxes 32 are provided with first lifter 33 on being close to the outer wall of dividing material tray 46 one side, the bottom fixedly connected with connecting rod 34 of first lifter 33, the end of connecting rod 34 is provided with spacing ring 35, the inner chamber of spacing ring 35 has cup jointed some glue head 36, some glue head 36 corresponds the suspension in paster groove 410 top, and the top of some glue head 36 is provided with out the rubber tube 37, it is linked together with some glue boxes 32 to go out the rubber tube 37.

Paster subassembly 8 includes fixed column 81 of fixed connection in U type backup pad 7 upper end, the installation section of thick bamboo 82 has been cup jointed in the top activity of fixed column 81, the top fixedly connected with lever 83 of installation section of thick bamboo 82, respectively fixedly connected with second lifter 84 on the both ends outer wall of lever 83, the bottom of second lifter 84 is provided with sucking disc 85, swing joint has movable connecting rod 86 on the second lifter 84 upper portion lateral wall of lever 83 one end, movable connecting rod 86's terminal swing joint has spinning rod 87, spinning rod 87 fixed connection is on the terminal outer wall of rotating electrical machines 88 transmission shaft, rotating electrical machines 88 is positive and negative rotating electrical machines, rotating electrical machines 88 installs in transmission 9 top one side.

The transmission piece 9 includes frame 91 of fixed connection in 1 top both sides of frame, the one end of frame 91 extends to 7 lower extremes of U type backup pad, be provided with conveyer belt 92 between the inner wall of frame 91, the frame 91 upper end of 7 adjacent departments of U type backup pad is provided with supports swash plate 93, support swash plate 93 leans on U type backup pad 7 to set up to one side, and support swash plate 93 top and be provided with and connect hopper 94, connect the roof upper end of hopper 94 port one side to set up rotating electrical machines 88, it presses close to rotary disk 45 to set up to connect hopper 94, it connects the material swash plate 95 to be provided with between the support swash plate 93 inner wall of hopper 94 lower extreme, connect material swash plate 95 lower extreme to press close to the suspension in conveyer belt 92 top, and evenly be provided with fixed axle 96 on the top inclined plane of connecing material swash plate 95, swivel 97 has been cup jointed in the activity on the outer wall of fixed axle 96, evenly spaced on swivel 97 connects the outer wall to be provided with to connect material blend stop 98.

Specifically, after dispensing of the LED chips in the chip slot 410 is completed, the LED chips are rotationally conveyed to be close to the chip component 8, the second lifting rod 84 at one end of the lever 83 descends and then adsorbs the rubber cake by using the suction cup 85 at the bottom of the second lifting rod, then the rotating motor 88 is started to cooperate with the rotating push rod 87 to drive the movable connecting rod 86 to rotationally push the lever 83, so that the second lifting rod 84 adsorbing the rubber cake is suspended above the rotating disk 45, then the second lifting rod 84 descends to attach the rubber cake to the upper end of the dispensed LED chips, then the rotating motor 88 is reversely started to cooperate with the rotating push rod 87 to drive the movable connecting rod 86 to rotationally pull the reverse lever 83, so that the second lifting rod 84 connected with the movable connecting rod 86 is reset and then continues to adsorb the rubber cake; the second lifting rod 84 connected with the movable connecting rod 86 continues to pull the lever 83 backwards after adsorbing the rubber cake again, so that the second lifting rod 84 at the other end of the lever 83 descends to be close to the rotating disk 45 and then adsorbs the LED chip which is already pasted with the chip by the sucking disk 85, the LED chips of the patch are dropped into the hopper 94 after the rotating motor 88 is rotated reversely again, then clamped between the receiving barrier strips 98 on the outer wall of the rotating ring 97 on the outer wall of the receiving sloping plate 95, the rotating ring 97 pushes the receiving barrier strips 98 to drive the rotating ring 97 to rotate and then put into the receiving barrier strips 98 on the outer wall of the rotating ring 97 of the next layer, and then slide to the upper part of the conveyor belt 92 along the receiving sloping plate 95 for conveying, meanwhile, the second lifting rod 84 connected with the movable connecting rod 86 continues to perform surface mounting, and the operation is repeated in this way, so that synchronous operation of surface mounting and surface mounted LED chip feeding and discharging is realized, uninterrupted circulating surface mounting processing of the LED chips is realized, and surface mounting efficiency of the LED chips is accelerated.

For better illustration, the embodiment provides an implementation method of an LED chip mounting device with a bulk material sorting structure, which includes the following steps:

the method comprises the following steps: placing a certain number of LED chips with patches in a distribution tray 46, starting a driving motor 43 to drive the distribution tray 46 to rotate in cooperation with a rotating shaft 44, when the distribution tray 46 rotates, pulling the chips to the edge by centrifugal force, simultaneously, a gear 442 on the outer wall of a convex rod 441 at the top of the rotating shaft 44 is meshed with a toothed ring 472 in a fixed sleeve 471, and simultaneously, driving the poking plates 473 at two sides of the fixed sleeve 471 to poke the chips in cooperation with the centrifugal force, discharging the chips from a sorting port 48 on the side wall of the distribution tray 46 and sliding the chips into a patch groove 410 at the top of a rotating disc 45 by virtue of an oblique slide way 49, wherein the chips with the size out of range are retained in the distribution tray 46;

step two: then, the first lifting rod 33 is controlled to descend to drive the dispensing head 36 in the limiting ring 35 to be close to the LED chips in the patch slot 410, the glue outlet pipe 37 conveys the glue in the dispensing box 32 to the dispensing head 36, and the dispensing head 36 is used for sequentially and intermittently dispensing the LED chips in the patch slot 410 when the rotating disc 45 rotates;

step three: after dispensing of the LED chips in the chip slot 410 is completed, the LED chips are conveyed to be close to the chip assembly 8 in a rotating mode, a second lifting rod 84 at one end of a lever 83 descends and adsorbs rubber cakes by using a suction cup 85 at the bottom of the second lifting rod, then a rotating motor 88 is started to cooperate with a rotating push rod 87 to drive a movable connecting rod 86 to rotate and push the lever 83, so that the second lifting rod 84 adsorbing the rubber cakes is suspended above the rotating disc 45, then the second lifting rod 84 descends to adhere the rubber cakes to the upper ends of the dispensed LED chips, then the rotating motor 88 is started reversely to cooperate with the rotating push rod 87 to drive the movable connecting rod 86 to rotate a reverse pull lever 83, and the second lifting rod 84 connected with the movable connecting rod 86 is reset and then continues to adsorb the rubber cakes;

step four: the second lifting rod 84 connected with the movable connecting rod 86 adsorbs the rubber cake again, then the lever 83 is pulled reversely, the second lifting rod 84 at the other end of the lever 83 is made to descend after approaching the rotating disc 45 and adsorb the LED chip which is already pasted by the sucker 85, the LED chip which is pasted is put into the receiving hopper 94 after the rotating motor 88 rotates reversely again, and then the LED chip slides to the upper part of the conveyor belt 92 along the receiving inclined plate 95 to be conveyed, meanwhile, the second lifting rod 84 connected with the movable connecting rod 86 continues to paste, and the process is repeated;

step five: after the chip mounting is finished, the limiting push rod 415 at the bottom of the rotating disc 45 is started, so that the electric telescopic push rod 4152 is contracted to drive the U-shaped connecting bar 4151 to deflect, the short supporting arm of the U-shaped connecting bar 4151 is close to the blocking plate 414, the blocking plate 414 is driven to be separated from the discharge opening 412 on the bottom plate of the material distribution tray 46, when the material distribution tray 46 rotates, the rotating shaft 44 drives the gear 442 on the outer wall of the protruding rod 441 to be meshed with the gear ring 472 in the fixing sleeve 471, and the material poking plates 473 on two sides of the fixing sleeve 471 are driven by matching with centrifugal force to poke the residual out-of-specification chips, so that the residual out-of-specification chips fall from the discharge opening 412 to enter the feeding channel 5 and are discharged from the discharge hopper 6 on one side of the feeding channel.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a LED paster device with bulk cargo classified structure, includes frame (1) and sets up support column (2) on frame (1) one end lateral wall, and the top of support column (2) is provided with some glue (3), and the one end suspension of some glue (3) is in frame (1) top, its characterized in that: the top of the machine base (1) adjacent to the glue dispensing part (3) is provided with a sorting component (4), the top of the machine base (1) is provided with a lower end communicated with a feeding channel (5) arranged inside the machine base (1), the outer wall of the machine base (1) on one side of the feeding channel (5) is provided with a discharging hopper (6), the top of the machine base (1) adjacent to the sorting component (4) is provided with a U-shaped supporting plate (7), the top of the U-shaped supporting plate (7) is provided with a patch component (8), and the top of the machine base (1) adjacent to the patch component (8) is provided with a transmission part (9);

the sorting component (4) comprises a bottom barrel (41) arranged at the top of the machine base (1), the bottom barrel (41) is communicated with the feeding channel (5), a transverse supporting plate (42) is arranged between the inner walls at the port part of the bottom barrel (41), a driving motor (43) is arranged at the bottom of the transverse supporting plate (42), the transverse supporting plate (42) at the outer side of the driving motor (43) is of a hollow structure, a rotating shaft (44) is fixedly connected with the output end of the top of the driving motor (43), the upper end of the rotating shaft (44) penetrates through and extends to the port part at the top of the bottom barrel (41), the top of the rotating shaft is fixedly connected with a rotating disk (45), the lower end of the rotating disk (45) is contacted with the bottom barrel (41), a material distribution tray (46) is arranged at the upper end of the rotating disk (45), a material poking device (47) is arranged at the middle part of the upper end of the material distribution tray (46), the material poking device (47) is connected with the top end of the rotating shaft (44), sorting ports (48) are uniformly arranged on the peripheral side wall of the material distribution tray (46) and are uniformly spaced at intervals close to the bottom part, an inclined slideway (49) is arranged on the outer wall of the port of the sorting port (48), the tail end of the inclined slideway (49) extends to the upper end of the rotating disk (45), and patch slots (410) are formed in the tops of the rotating disks (45) at the tail end of the inclined slideway (49).

2. The LED chip mounting device with the bulk material sorting structure as claimed in claim 1, wherein: top fixedly connected with protruding pole (441) of pivot (44), when pivot (44) fixed connection was in rotary disk (45) bottom, protruding pole (441) run through and extend to the top of dividing material tray (46), and protruding pole (441) top fixedly connected with gear (442), gear (442) cup joints in fixed sleeve (471) inner chamber of setting gauge (47), the inside of fixed sleeve (471) is provided with ring gear (472), the rodent on ring gear (472) inner wall meshes with gear (442), fixedly connected with switch-plate (473) on the both sides outer wall of fixed sleeve (471), switch-plate (473) set up about fixed sleeve (471) central bilateral symmetry, and the end of switch-plate (473) is the arc structure, its cambered surface inner wall sets up towards sorting opening (48).

3. The LED chip mounting device with the bulk material sorting structure as claimed in claim 2, wherein: be provided with bolster (411) on end section of thick bamboo (41) inner wall of horizontal backup pad (42) lower extreme, bolster (411) are including first solid fixed ring (4111) of fixed connection on end section of thick bamboo (41) inner wall, the top of first solid fixed ring (4111) is provided with the solid fixed ring of second (4113) through fixed block (4112), the solid fixed ring of second (4113) and the coaxial setting of first solid fixed ring (4111), and all be provided with through dead lever (4114) between the interior wall of the solid fixed ring of first solid fixed ring (4111) and second (4113) and keep off inner ring (4115), evenly be provided with buffer beam (4116) on the solid fixed ring of first solid fixed ring (4111) and second (4113) inner wall in the fender inner ring (4115) outside.

4. The LED chip mounting device with the bulk material sorting structure as claimed in claim 3, wherein: buffer rod (4116) includes rubber sleeve (41161) fixed connection on the solid fixed ring inner wall, the inner chamber of rubber sleeve (41161) evenly is provided with buffer ball (41162), be provided with buffer air cushion (41163) on the outer wall of buffer ball (41162), buffer air cushion (41163) is laminated to rubber sleeve (41161) inner wall and is set up, and swing joint has movable rod (41164) on the relative lateral wall of adjacent buffer ball (41162), the terminal swing joint of movable rod (41164) is on the outer wall of ejector pin (41165) one end, rubber sleeve (41161) inner wall setting is pressed close to the other end of ejector pin (41165), relative ejector pin (41165) is fixed continuous through elastomeric element (41166).

5. The LED chip mounting device with the bulk material sorting structure as claimed in claim 4, wherein: divide material tray (46) upper end to be close to bin gate (48) department and be provided with bin outlet (412), bin outlet (412) extend to rotary disk (45) bottom, be provided with shutoff board (414) through swing joint spare (413) on the port outer wall of bin outlet (412) one side, it is provided with the arch to correspond bin outlet (412) department on the one side outer wall of shutoff board (414), shutoff board (414) closing cap is when bin outlet (412) bottom, protruding block in bin outlet (412), and protruding upper end and bin outlet (412) port looks parallel and level, one side bottom of shutoff board (414) movable end is provided with spacing push rod (415), the other end swing joint of spacing push rod (415) is in rotary disk (45) lower extreme.

6. The LED chip mounting device with the bulk material sorting structure as claimed in claim 5, wherein: the limiting push rod (415) comprises a U-shaped connecting strip (4151) connected with the bottom of the movable end of the plugging plate (414), two arms of the U-shaped connecting strip (4151) are arranged in a long and short mode, the tail end of a short supporting arm of the U-shaped connecting strip (4151) is movably connected with one end of an electric telescopic push rod (4152), the other end of the electric telescopic push rod (4152) is fixedly connected with a fixing strip (4153), the tail end of the fixing strip (4153) is movably connected to the bottom of a rotating disk (45) on one side of the fixed end of the plugging plate (414), and when the plugging plate (414) is covered at the bottom of the discharge port (412), the electric telescopic push rod (4152) is in an extending state, and the long supporting arm of the U-shaped connecting strip (4151) is attached to the bottom plate of the plugging plate (414).

7. The LED chip mounting device with the bulk material sorting structure as claimed in claim 6, wherein: glue dispensing part (3) includes layer board (31) of fixed connection in support column (2) top, the top of layer board (31) is provided with glue dispensing box (32), glue dispensing box (32) are provided with first lifter (33) on being close to the outer wall of branch material tray (46) one side, the bottom fixedly connected with connecting rod (34) of first lifter (33), the end of connecting rod (34) is provided with spacing ring (35), glue dispensing head (36) has been cup jointed to the inner chamber of spacing ring (35), glue dispensing head (36) correspond and suspend in paster groove (410) top, and the top of glue dispensing head (36) is provided with glue outlet pipe (37), glue outlet pipe (37) is linked together with glue dispensing box (32).

8. The LED chip mounting device with the bulk material sorting structure as claimed in claim 7, wherein: paster subassembly (8) are including fixed connection in fixed column (81) of U type backup pad (7) upper end, the top activity of fixed column (81) has cup jointed installation section of thick bamboo (82), top fixedly connected with lever (83) of installation section of thick bamboo (82), respectively fixedly connected with second lifter (84) on the both ends outer wall of lever (83), the bottom of second lifter (84) is provided with sucking disc (85), swing joint has movable connecting rod (86) on second lifter (84) upper portion lateral wall of lever (83) one end, the end swing joint of movable connecting rod (86) has spinning rod (87), spinning rod (87) fixed connection is on the terminal outer wall of rotating electrical machines (88) transmission shaft, rotating electrical machines (88) are installed in transmission piece (9) top one side.

9. The LED chip mounting device with bulk cargo sorting structure as claimed in claim 8, wherein: the conveying piece (9) comprises a machine frame (91) fixedly connected to two sides of the top of the machine base (1), one end of the machine frame (91) extends to the lower end of the U-shaped supporting plate (7), a conveying belt (92) is arranged between the inner walls of the machine frame (91), a supporting inclined plate (93) is arranged at the upper end of the machine frame (91) adjacent to the U-shaped supporting plate (7), the supporting inclined plate (93) is obliquely arranged close to the U-shaped supporting plate (7), a material receiving hopper (94) is arranged at the top of the supporting inclined plate (93), the material receiving hopper (94) is arranged close to the rotating disc (45), a material receiving inclined plate (95) is arranged between the inner walls of the supporting inclined plates (93) at the lower end of the material receiving hopper (94), the lower end of the material receiving inclined plate (95) is closely suspended above the conveying belt (92), a fixing shaft (96) is uniformly arranged on the inclined plane at the top of the material receiving inclined plate (95), a rotating ring (97) is movably sleeved on the outer wall of the fixing shaft (96), the outer wall of the rotating ring (97) is evenly provided with material receiving barrier strips (98) at intervals.

10. An implementation method of the LED chip mounting device with bulk sorting structure as claimed in claims 1-9, wherein: the method comprises the following steps:

s1: placing a certain number of LED chips with patches in a distribution tray (46), starting a driving motor (43) to drive the distribution tray (46) to rotate by matching with a rotating shaft (44), pushing the chips to the edge by centrifugal force when the distribution tray (46) rotates, simultaneously meshing a gear (442) on the outer wall of a convex rod (441) at the top of the rotating shaft (44) with a toothed ring (472) in a fixed sleeve (471), driving poking plates (473) at two sides of the fixed sleeve (471) to poke the chips by matching with the centrifugal force, discharging the chips from a sorting port (48) on the side wall of the distribution tray (46) and sliding the chips into patch grooves (410) at the top of the rotating disk (45) by virtue of inclined slideways (49), and intercepting the chips with sizes beyond the range in the distribution tray (46);

s2: then controlling the first lifting rod (33) to descend to drive the dispensing head (36) inside the limiting ring (35) to be close to the LED chip inside the film sticking groove (410), conveying the colloid inside the dispensing box (32) to the dispensing head (36) through the glue outlet pipe (37), and sequentially and intermittently dispensing the LED chip inside the film sticking groove (410) through the dispensing head (36) when the rotating disc (45) rotates;

s3: after dispensing is finished, the LED chips in the chip grooves (410) are rotationally conveyed to be close to the chip assembly (8), a second lifting rod (84) at one end of a lever (83) descends to adsorb a rubber cake by using a sucker (85) at the bottom of the second lifting rod, then a rotating motor (88) is started to be matched with a rotating push rod (87) to drive a movable connecting rod (86) to rotationally push the lever (83), so that the second lifting rod (84) adsorbing the rubber cake is suspended above a rotating disk (45), then the second lifting rod (84) descends to attach the rubber cake to the upper end of the dispensed LED chips, then the rotating motor (88) is reversely started to be matched with the rotating push rod (87) to drive the movable connecting rod (86) to rotationally pull the lever (83) reversely, and the second lifting rod (84) connected with the movable connecting rod (86) is reset to continuously adsorb the rubber cake;

s4: the second lifting rod (84) connected with the movable connecting rod (86) adsorbs the rubber cake again and then continues to pull the lever (83) reversely, so that the second lifting rod (84) at the other end of the lever (83) is close to the rotating disc (45), then descends to adsorb the LED chip which is already pasted with the sucker (85), and after the rotating motor (88) rotates reversely again, the LED chip which is pasted with the rubber cake is put into the receiving hopper (94), slides to the upper part of the conveyor belt (92) along the receiving inclined plate (95) to be conveyed, and meanwhile, the second lifting rod (84) connected with the movable connecting rod (86) continues to paste with the rubber cake, and the process is repeated;

s5: after the paster is finished, a limiting push rod (415) at the bottom of the rotating disk (45) is started, so that an electric telescopic push rod (4152) contracts to drive the U-shaped connecting strip (4151) to deflect, a short supporting arm of the U-shaped connecting strip (4151) is close to the blocking plate (414), the blocking plate (414) is driven to be separated from a discharge opening (412) in the bottom plate of the distributing tray (46), when the distributing tray (46) rotates, a rotating shaft (44) drives a gear (442) on the outer wall of the protruding rod (441) to be meshed with a gear ring (472) in the fixing sleeve (471), and poking plates (473) on two sides of the fixing sleeve (471) are driven by matching centrifugal force to poke residual over-specification chips, so that the residual over-specification chips fall down from the discharge opening (412) to enter the feeding channel (5) and are discharged from a discharge hopper (6) on one side of the fixing sleeve (471).