CN116153828A - Mini-LED fluorescent film material mould pressing automatic feeding and discharging mechanism - Google Patents
Mini-LED fluorescent film material mould pressing automatic feeding and discharging mechanism Download PDFInfo
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- CN116153828A CN116153828A CN202310089891.1A CN202310089891A CN116153828A CN 116153828 A CN116153828 A CN 116153828A CN 202310089891 A CN202310089891 A CN 202310089891A CN 116153828 A CN116153828 A CN 116153828A
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- 238000007599 discharging Methods 0.000 title claims abstract description 29
- 239000000463 material Substances 0.000 title claims abstract description 18
- 238000003825 pressing Methods 0.000 title claims abstract description 12
- 239000011093 chipboard Substances 0.000 claims abstract description 41
- 238000003860 storage Methods 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000007723 die pressing method Methods 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 230000000087 stabilizing effect Effects 0.000 claims description 5
- 230000003139 buffering effect Effects 0.000 claims description 3
- 230000033001 locomotion Effects 0.000 description 28
- 238000000465 moulding Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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Abstract
The invention discloses a Mini-LED fluorescent film material mould pressing automatic feeding and discharging mechanism, which relates to the technical field of mould presses and comprises a workbench, wherein one side of the workbench is provided with a feeding assembly for placing a plurality of chip boards, a buffer assembly for protecting the chip boards is arranged in the feeding assembly, one side of the top of the workbench, which is close to the feeding assembly, is fixedly connected with a driving assembly for driving the chip boards to advance.
Description
Technical Field
The invention relates to the technical field of molding presses, in particular to a Mini-LED fluorescent film material molding automatic feeding and discharging mechanism.
Background
The Mini-LED is defined as an LED device with the chip size between 50 and 200 mu m, a unit consisting of a Mini-LED pixel array and a driving circuit and with the pixel center distance of 0.3 to 1.5mm, the rapid development of the LED small-space display industry and the continuous updating of the technology promote the corresponding manufacturing equipment, and the application of the Mini-LED display module in a plurality of ranges in the market is obtained due to the excellent performance of the Mini-LED small-space display, and the manufacturing yield of the Mini-LED display module is also required as the demand of the terminal market is continuously increased, and a fluorescent film is required to be attached to the surface of the Mini-LED chip by a molding press during packaging;
the following problems exist in the prior art:
in the prior art, when the fluorescent film is attached to the surface of the Mini-LED, the fluorescent film is arranged on the surface of the chip to be attached by the molding press, the integration and the automation degree of the automatic feeding and discharging manufacturing production line are in the integration period, the output of part of equipment is low, the automation degree is not high, the front and rear automation of the equipment are not in place, so that the productivity is severely restricted, the large labor cost is caused, and meanwhile, because the existing equipment is single in structure and the process variation adaptability of the product production is poor, the research and development and production progress of the manufacturing of the Mini-LED display module is restricted, and the automatic feeding and discharging mechanism for the molding of the Mini-LED fluorescent film material is provided for solving the problems.
Disclosure of Invention
The invention aims to provide a Mini-LED fluorescent film material mould pressing automatic feeding and discharging mechanism so as to solve the problems in the background technology.
In order to achieve the aim of the invention, the invention adopts the following technical scheme:
the invention provides a Mini-LED fluorescent film material mould pressing automatic feeding and discharging mechanism, which comprises a workbench, wherein the top of the workbench is provided with a driving belt for transporting chip boards, the top of the middle part of the workbench is provided with a mould pressing plate for packaging the chip boards, the mould pressing plate is arranged at the top of the driving belt, one side of the workbench is provided with a feeding assembly for placing a plurality of chip boards, the feeding assembly is internally provided with a buffer assembly for protecting the chip boards, one side of the top of the workbench, which is close to the feeding assembly, is fixedly connected with a driving assembly for driving the chip boards to advance, one end of the top of the workbench, which is far away from the feeding assembly, is provided with a discharging assembly for outputting materials, the feeding assembly comprises a placing frame for receiving the chip boards, one side, which is far away from the middle part of the workbench, of the placing frame is fixedly connected with the surface of the workbench, one side, which is close to the middle part of the workbench, is arranged at the top of the driving belt, two sides of the placing frame are fixedly connected with first fixing plates for supporting the self, the two sides of the first fixing plates are symmetrically distributed along the middle part of the placing frame, and the bottom of the first fixing plates are fixedly connected with the workbench.
Preferably, a transmission window which is convenient for outputting the chip board is formed in the bottom of one side of the object placing frame, which is close to the middle of the workbench, and a plurality of fixed windows for installing the buffer components are formed in one side of the object placing frame, which is far away from the workbench, and the fixed windows are uniformly distributed along the vertical direction of the object placing frame.
Preferably, the buffer assembly comprises a plurality of mounting frames for fixing the reset springs, the size of each mounting frame is matched with that of the corresponding fixing window, each mounting frame is fixedly connected with the inner wall of the corresponding fixing window, the opening of each mounting frame faces the inside of each mounting frame, the bottom of the inner cavity of each mounting frame is fixedly connected with the corresponding reset spring, and the reset springs are uniformly distributed along the length direction of each mounting frame.
Preferably, one end of the reset spring, which is close to the center of the storage frame, is fixedly connected with a motion seat for buffering the chip board, the surface of the motion seat is in sliding connection with the inner wall of the installation frame, one end of the motion seat, which is close to the middle part of the storage frame, is provided with a trigger inclined plane which is convenient for the board to enter, and the linear distance between the trigger inclined plane and the inner wall of the storage frame is uniformly reduced along the direction of the workbench pointing to the storage frame.
Preferably, the drive assembly includes the fixing base that is used for stabilizing the telescopic, fixing base bottom and workstation fixed surface connection, the fixing base sets up in the one side that the thing frame kept away from the workstation center that puts, the one side that the fixing base is close to the workstation center and a plurality of sleeve fixed connection that are used for installing telescopic spring, a plurality of sleeve is followed fixing base length direction evenly distributed, telescopic spring one end and sleeve inner chamber bottom fixed connection.
Preferably, the telescopic spring is kept away from telescopic one end fixedly connected with and is used for promoting the chip panel motion push pedal, push pedal and fixed window inner wall sliding connection, the push pedal is in the outer one end both sides fixedly connected with of putting the thing frame and is convenient for other subassemblies promote the connecting plate of self motion, both sides the connecting plate is along push pedal axis symmetric distribution.
Preferably, a first rotating rod used for installing a wheel disc is arranged on one side, close to the connecting plate, of the top of the workbench, a motor used for driving the first rotating rod to move is arranged in the workbench, the output end of the motor is fixedly connected with the first rotating rod, the wheel disc is sleeved on the first rotating rod, a raised head used for driving the connecting plate to move is fixedly connected with the surface of an outer ring of the wheel disc, and the surface of the raised head is in sliding connection with one end, far away from the push plate, of the connecting plate.
Preferably, the first pulley that is used for installing the belt has been cup jointed on first dwang surface, first pulley and first dwang fixed connection, the workstation top is close to the one side top of putting the thing frame and rotates through the bearing and be connected with the second dwang that is used for installing the second pulley, the second dwang sets up the one side of keeping away from first dwang at putting the thing frame, the second pulley cup joints on the second dwang and fixed connection with it, first pulley and second pulley pass through the belt and connect.
Preferably, the second dwang has cup jointed the driving gear that is used for driving driven gear motion on the surface, be provided with the third dwang that is used for installing driven gear in the one side that the second dwang is close to the thing frame of putting, driven gear cup joints on third dwang surface and fixed connection with it, third dwang bottom one end is connected with the workstation rotation through the bearing, driving gear and driven gear meshing are connected, third dwang bottom surface and rim plate and protruding head fixed connection.
Preferably, the unloading subassembly is including the baffle that is used for stopping chip panel, the one end fixed connection that the material loading subassembly was kept away from to baffle bottom and workstation, the baffle setting is in the drive belt the place ahead, the unloading window of being convenient for the material discharge has been seted up to one side that the workstation is close to the baffle.
Compared with the prior art, the above technical scheme has the following beneficial effects:
the invention is provided with the feeding and discharging assembly matched with the driving assembly, the top of the workbench is provided with the driving belt for transporting the chip boards, the bottom of one side of the object placing frame, which is close to the middle of the workbench, is provided with the driving window which is convenient for outputting the chip boards, one side of the workbench, which is close to the baffle, is provided with the discharging window which is convenient for discharging the materials, one end of the telescopic spring, which is far away from the sleeve, is fixedly connected with the pushing plate which is used for pushing the chip boards to move, the pushing plate is in sliding connection with the inner wall of the fixed window, the chip boards can be rapidly arranged on the driving belt for packaging and molding, the overall working efficiency is improved, the invention is provided with the buffer assembly and the driving device, one end of the moving seat, which is close to the middle of the object placing frame, is provided with the triggering inclined plane which is convenient for the boards to enter, the driving gear is meshed with the driven gear, the bottom surface of the third rotating rod is fixedly connected with the wheel disc and the protruding heads, and the protruding heads on two sides simultaneously drive the pushing plate to move, in the moving process, the whole device is more stable, the chip boards are further protected, and the boards are prevented from being damaged due to large hard contact.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention.
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is an enlarged schematic view of the structure of FIG. 1A according to the present invention;
FIG. 3 is a schematic view of the position of the storage frame according to the present invention;
FIG. 4 is a schematic diagram of a loading assembly according to the present invention;
FIG. 5 is a schematic view of a storage frame according to the present invention;
FIG. 6 is a schematic view of a cushioning assembly according to the present invention;
FIG. 7 is a schematic view of the drive assembly of the present invention;
FIG. 8 is an enlarged schematic view of the structure of FIG. 3B in accordance with the present invention;
FIG. 9 is a schematic view of a first rotary lever structure of the present invention;
FIG. 10 is a schematic view of a gear engagement structure of the present invention;
in the figure:
1. a work table; 11. a transmission belt; 12. a molding press; 2. a feeding assembly; 21. a storage frame; 22. a first fixing plate; 23. a transmission window; 24. a fixed window; 3. a buffer assembly; 31. a mounting frame; 32. a return spring; 33. a motion seat; 34. triggering an inclined plane; 4. a drive assembly; 41. a fixing seat; 42. a sleeve; 43. a telescopic spring; 44. a push plate; 45. a connecting plate; 46. a first rotating lever; 47. a wheel disc; 48. a nose; 49. a first pulley; 491. a belt; 492. a second rotating lever; 493. a second pulley; 494. a drive gear; 495. a third rotating lever; 496. a driven gear; 497. a second fixing plate; 5. a blanking assembly; 51. a baffle; 52. and a blanking window.
Detailed Description
In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.
Referring to fig. 1-10, the invention provides an automatic feeding and discharging mechanism for die pressing of Mini-LED fluorescent film materials, and referring to fig. 1 and 3, the automatic feeding and discharging mechanism comprises a workbench 1, a driving belt 11 for transporting chip boards is arranged at the top of the workbench 1, a die pressing plate for packaging the chip boards is arranged at the top of the middle of the workbench 1, the die pressing plate is arranged at the top of the driving belt 11, a feeding component 2 for placing a plurality of chip boards is arranged at one side of the workbench 1, a buffer component 3 for protecting the chip boards is arranged in the feeding component 2, a driving component 4 for driving the chip boards to advance is fixedly connected at one side of the top of the workbench 1 close to the feeding component 2, a discharging component 5 for outputting materials is arranged at one end of the top of the workbench away from the feeding component 2, so that the chip boards can be rapidly placed on the driving belt 11 for package and die pressing, and the overall working efficiency is improved.
In order to smoothly transport and load and unload the chip boards, as shown in fig. 1, 2, 5 and 7, a loading frame 21 for receiving the chip boards is provided on the loading assembly 2, one side of the bottom of the loading frame 21 far away from the middle of the table 1 is fixedly connected with the surface of the table 1, one side of the loading frame 21 near the middle of the table 1 is provided at the top of the driving belt 11, two sides of the loading frame 21 are fixedly connected with first fixing plates 22 for supporting themselves, the two sides of the first fixing plates 22 are symmetrically distributed along the middle of the loading frame 21, the bottom of the first fixing plates 22 is fixedly connected with the table 1, a driving window 23 for outputting the chip boards is provided at the bottom of one side of the loading frame 21 near the middle of the table 1, a fixing seat 41 for stabilizing a sleeve 42 is provided on the driving assembly 4, the bottom of the fixing seat 41 is fixedly connected with the surface of the table 1, the fixing seat 41 is provided at one side of the loading frame 21 far away from the center of the table 1, one side of the fixed seat 41, which is close to the center of the workbench 1, is fixedly connected with a plurality of sleeves 42 for installing telescopic springs 43, the sleeves 42 are uniformly distributed along the length direction of the fixed seat 41, one end of each telescopic spring 43 is fixedly connected with the bottom of an inner cavity of each sleeve 42, one end of each telescopic spring 43, which is far away from each sleeve 42, is fixedly connected with a push plate 44 for pushing a chip plate to move, each push plate 44 is slidably connected with the inner wall of a fixed window 24, two sides of one end of each push plate 44, which is outside the object placing frame 21, are fixedly connected with connecting plates 45 for facilitating other components to push the corresponding components to move, the connecting plates 45 on two sides are symmetrically distributed along the axis of each push plate 44, a first rotating rod 46 for installing a wheel disc 47 is arranged on one side, which is close to the connecting plates 45, a motor for driving the first rotating rod 46 to move is arranged in the workbench 1, the output end of the motor is fixedly connected with the first rotating rod 46, the wheel disc 47 is sleeved on the first rotating rod 46, the outer ring surface of the wheel disc 47 is fixedly connected with a raised head 48 for driving the connecting plate 45 to move, the surface of the raised head 48 is in sliding connection with one end of the connecting plate 45 away from the push plate 44, one surface of the object placing frame 21 away from the worktable 1 is provided with a plurality of fixed windows 24 for installing the buffer component 3, the plurality of fixed windows 24 are uniformly distributed along the vertical direction of the object placing frame 21, a baffle plate 51 for stopping chip boards is arranged in the blanking component 5, the bottom of the baffle plate 51 is fixedly connected with one end of the worktable 1 away from the feeding component 2, the baffle plate 51 is arranged in front of the driving belt 11, one side of the worktable 1 close to the baffle plate 51 is provided with a blanking window 52 for facilitating material discharge, the driving belt is started, a plurality of chip boards are placed in the object placing frame 21, the bottommost boards in the object placing frame 21 are not contacted with the driving belt 11 at the top of the push plate 44, at this time, the motor arranged in the workbench 1 is started, the motor drives the first rotating rod 46 at the output end to rotate, the first rotating rod 46 rotates and drives the wheel disc 47 connected with the surface to rotate around the axis of the motor, the wheel disc 47 rotates and drives the raised head 48 at one side of the surface to rotate around the axis of the wheel disc 47, the raised head 48 contacts with the connecting plate 45 at one side of the push plate 44 in the moving process, the raised head 48 moves and drives the connecting plate 45 to move towards one side far away from the object placing frame 21, the connecting plate 45 moves and drives the push plate 44 at one side far away from the object placing frame 21, the push plate 44 is far away from the object placing frame 21 and further presses the telescopic spring 43 at the bottom, the chip board at the top of the push plate 44 is further dropped onto the driving belt 11 at the bottom of the object placing frame 21 from the top of the push plate 44, when the raised head 48 continues to move, the raised head 48 is gradually far away from the connecting plate 45, at this time, the connection plate 45 and the push plate 44 are driven by the elastic force of the bottom expansion spring 43 to approach the lower box storage frame 21, the push plate 44 is further contacted with the chip board to push the board to be discharged from the transmission window 23 of the storage frame 21, the board further moves on the transmission belt 11 to work at the molding press 12, stays at the blanking window 52 under the action of the baffle 51, and is discharged from the blanking window 52.
In order to prevent the chip plate from being in larger hard contact with each other when the chip plate is placed on the placement frame 21, please refer to fig. 5 and 6, a plurality of mounting frames 31 for fixing the reset springs 32 are arranged in the buffer assembly 3, the size of the mounting frames 31 is matched with the fixed window 24, the mounting frames 31 are fixedly connected with the inner walls of the fixed window 24, the opening of the mounting frames 31 faces the inside of the mounting frames 31, the bottom of the inner cavities of the mounting frames 31 is fixedly connected with the reset springs 32, the reset springs 32 are uniformly distributed along the length direction of the mounting frames 31, one ends of the reset springs 32 close to the center of the placement frame 21 are fixedly connected with a motion seat 33 for buffering the chip plate, the surface of the motion seat 33 is in sliding connection with the inner walls of the mounting frames 31, one end of the motion seat 33 close to the middle of the placement frame 21 is provided with a trigger inclined plane 34 which is convenient for the plate to enter, the linear distance between the trigger inclined plane 34 and the inner walls of the placement frame 21 is uniformly reduced along the direction of the workbench 1 pointing to the placement frame 21, when the plate stays in the placement frame 21, the plate can be firstly contacted with the buffer assembly 3 on the placement frame 21, the motion seat 33 is fixedly connected with the motion seat 33 to the motion seat 33, the motion seat 33 is extruded by the motion seat 33 is fixedly connected with the motion seat 33, the motion seat 33 is extruded by the motion seat 33, and the motion seat 33 is prevented from being extruded by the chip plate, and the plate is further damaged by the motion seat 33, and the motion seat 33 is pressed by the motion seat 33.
In order to make the push plate 44 more stable when the driving assembly 4 drives the push plate 44 to advance, as shown in fig. 8, 9 and 10, a first pulley 49 for mounting a belt 491 is sleeved on the surface of the first rotating rod 46, the first pulley 49 is fixedly connected with the first rotating rod 46, a second rotating rod 492 for mounting a second pulley 493 is rotatably connected to the top of one side of the top of the table 1, which is close to the storage frame 21, through a bearing, the second rotating rod 492 is arranged on one side of the storage frame 21, which is far from the first rotating rod 46, the second pulley 493 is sleeved on the second rotating rod 492 and fixedly connected with the second rotating rod 492, the first pulley 49 and the second pulley 493 are connected through a belt 491, a driving gear 494 for driving a driven gear 496 to move is sleeved on the surface of the second rotating rod 492, a third rotating rod 495 for mounting a driven gear 496 is arranged on one side of the second rotating rod 492, which is close to the storage frame 21, the driven gear 496 is sleeved on the surface of the third rotating rod 495 and fixedly connected with the third rotating rod 495, one end of the bottom of the third rotating rod 495 is rotationally connected with the workbench 1 through a bearing, the driving gear 494 is in meshed connection with the driven gear 496, the bottom surface of the third rotating rod 495 is fixedly connected with the wheel disc 47 and the raised head 48, the second rotating rod 492 and the top of the third rotating rod 495 are rotationally connected with a second fixing plate 497 for stabilizing the self through bearings, the second fixing plate 497 is fixedly connected with the outer wall of the storage frame 21, when the first rotating rod 46 is driven by a motor to move, the first belt wheel 49 on the surface of the first rotating rod 46 and the first rotating rod 46 keep synchronous rotation, the first belt wheel 49 rotates and drives the second belt wheel 493 at the other end of the belt 491 to rotate around the self axis, the second belt wheel 493 rotates and drives the second rotating rod 492 to rotate around the self axis, the second rotating rod 492 rotates and drives the driving gear 494 at the top to rotate around the self axis, the driving gear 494 rotates and drives the driven gear 496 at one side to rotate around the self axis, the driven gear 496 rotates and drives the third rotating rod 495 and the wheel disc 47 at the surface to rotate around the self axis, and the wheel discs 47 and the raised heads 48 at both sides together drive the connecting plate 45 to maintain stability during the movement of the push plate 44.
Principle of operation
In the actual use process, the conveyor belt is started, a plurality of chip boards are placed in the object placing frame 21, the bottommost board in the object placing frame 21 is not contacted with the conveyor belt 11 at the top of the push plate 44, at the moment, a motor arranged in the workbench 1 is started, the motor drives a first rotating rod 46 at the output end to rotate, the rotating rod 46 rotates and drives a wheel disc 47 connected with the surface to rotate around the axis of the motor, a raised head 48 at one side of the wheel disc 47 rotates and drives the wheel disc 47 to rotate around the axis of the wheel disc 47, the raised head 48 contacts with a connecting plate 45 at one side of the push plate 44 in the moving process, the raised head 48 moves and drives the connecting plate 45 to move towards one side far away from the object placing frame 21, the connecting plate 45 moves and drives the push plate 44 at one side far away from the object placing frame 21, the push plate 44 is far away from the object placing frame 21 and then presses a telescopic spring 43 at the bottom, the chip plate at the top of the push plate 44 further drops onto the transmission belt 11 at the bottom of the object placing frame 21 from the top of the push plate 44, when the raised heads 48 continue to move, the raised heads 48 gradually get away from the connecting plate 45, at this time, the connecting plate 45 and the push plate 44 are driven by the elastic force of the bottom telescopic spring 43 to move the lower box object placing frame 21 close, the push plate 44 further contacts with the chip plate to push the plate to be discharged from the transmission window 23 of the object placing frame 21, the plate further moves on the transmission belt 11 to work at the molding press 12, stays at the blanking window 52 under the action of the baffle plate 51, is discharged from the blanking window 52, in order that when the chip plate is placed on the object placing frame 21, no large hard contact occurs between the multiple layers of plates, when the plate stays in the object placing frame 21, the plate firstly contacts with the buffer assembly 3 on the object placing frame 21, the plate contacts with the trigger inclined plane 34 on the motion seat 33, the plate presses the motion seat 33, the motion seat 33 presses the reset spring 32 at the bottom, the motion seat 33 enters the mounting frame 31, the chip board is further stopped between the buffer components 3 at the next layer to provide a certain buffer effect, the chip board is prevented from being damaged, in order to enable the push plate 44 to be more stable when the driving component 4 drives the push plate 44 to move forwards, when the first rotating rod 46 moves under the driving of the motor, the first belt pulley 49 on the surface of the first rotating rod 46 and the first rotating rod 46 keep rotating synchronously, the first belt pulley 49 rotates and drives the belt 491 and the second belt pulley 493 at the other end of the belt 491 to rotate around the self axis, the second belt pulley 493 rotates and drives the second rotating rod 492 to rotate around the self axis, the second rotating rod 492 rotates and drives the driving gear 494 at the top to rotate around the self axis, the driven gear 496 on one side rotates and drives the third rotating rod 495 and the wheel disc 47 on the surface to rotate around the self axis, and the wheel disc 47 on the two sides and the raised head 48 on the two sides drive the connecting plate 45 to keep stability in the movement process of the push plate 44, and prevent the push plate 44 from not working normally and being stressed.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (10)
- The automatic feeding and discharging mechanism for the Mini-LED fluorescent film die pressing is characterized by comprising a workbench (1), a driving belt (11) for conveying chip boards is arranged at the top of the workbench (1), a die plate for packaging the chip boards is arranged at the top of the middle of the workbench (1), the die plate is arranged at the top of the driving belt (11), a feeding component (2) for placing a plurality of chip boards is arranged on one side of the workbench (1), a buffer component (3) for protecting the chip boards is arranged in the feeding component (2), a driving component (4) for driving the chip boards to advance is fixedly connected to one side, close to the feeding component (2), of the top of the workbench (1), a discharging component (5) for outputting materials is arranged at one end, far away from the feeding component (2), of the top of the workbench (1), of the workbench (2) comprises a placing frame (21) for bearing the chip boards, one side, far away from the middle of the workbench (1), of the workbench (21) is fixedly connected with the surface of the workbench (1), a first side, close to the middle of the workbench (21), of the workbench (21) is fixedly connected with the surface of the workbench (1), two side, close to the middle of the workbench (21), is fixedly connected with one side, close to the first side, of the workbench (21), and fixedly connected with the first side (22) of the middle of the workbench (21) and is fixedly arranged at two side of the middle of the workbench (21, the bottom of the first fixing plate (22) is fixedly connected with the workbench (1).
- 2. The Mini-LED fluorescent film mould pressing automatic feeding and discharging mechanism according to claim 1, wherein a transmission window (23) which is convenient for outputting chip boards is formed in the bottom of one side of the object placing frame (21) close to the middle of the workbench (1), a plurality of fixing windows (24) for installing the buffer assembly (3) are formed in one surface of the object placing frame (21) far away from the workbench (1), and the fixing windows (24) are uniformly distributed along the vertical direction of the object placing frame (21).
- 3. The Mini-LED fluorescent film material mould pressing automatic feeding and discharging mechanism according to claim 1, wherein the buffer assembly (3) comprises a mounting frame (31) used for fixing a plurality of reset springs (32), the size of the mounting frame (31) is matched with that of the fixed window (24), the mounting frame (31) is fixedly connected with the inner wall of the fixed window (24), the opening of the mounting frame (31) faces the inside of the mounting frame (31), the bottom of the inner cavity of the mounting frame (31) is fixedly connected with the plurality of reset springs (32), and the plurality of reset springs (32) are uniformly distributed along the length direction of the mounting frame (31).
- 4. The automatic feeding and discharging mechanism for Mini-LED fluorescent film die pressing according to claim 3, wherein one end of the reset spring (32) close to the center of the object placing frame (21) is fixedly connected with a moving seat (33) for buffering a chip board, the surface of the moving seat (33) is slidably connected with the inner wall of the mounting frame (31), one end of the moving seat (33) close to the middle of the object placing frame (21) is provided with a triggering inclined surface (34) which is convenient for the board to enter, and the linear distance between the triggering inclined surface (34) and the inner wall of the object placing frame (21) is uniformly reduced along the direction that the workbench (1) points to the object placing frame (21).
- 5. The automatic feeding and discharging mechanism for Mini-LED fluorescent film mould pressing according to claim 1, wherein the driving assembly (4) comprises a fixing seat (41) for stabilizing a sleeve (42), the bottom of the fixing seat (41) is fixedly connected with the surface of the workbench (1), the fixing seat (41) is arranged on one side, far away from the center of the workbench (1), of the object placing frame (21), one side, close to the center of the workbench (1), of the fixing seat (41) is fixedly connected with a plurality of sleeves (42) for installing telescopic springs (43), the sleeves (42) are uniformly distributed along the length direction of the fixing seat (41), and one end of each telescopic spring (43) is fixedly connected with the bottom of an inner cavity of each sleeve (42).
- 6. The automatic feeding and discharging mechanism for Mini-LED fluorescent film die pressing according to claim 5, wherein one end of the telescopic spring (43) away from the sleeve (42) is fixedly connected with a pushing plate (44) for pushing a chip plate to move, the pushing plate (44) is slidably connected with the inner wall of the fixed window (24), two sides of one end of the pushing plate (44) outside the storage frame (21) are fixedly connected with connecting plates (45) for facilitating other components to push the pushing plate to move, and the connecting plates (45) on two sides are symmetrically distributed along the axis of the pushing plate (44).
- 7. The automatic feeding and discharging mechanism for Mini-LED fluorescent film mould pressing according to claim 1, wherein a first rotating rod (46) for installing a wheel disc (47) is arranged on one side, close to a connecting plate (45), of the top of the workbench (1), a motor for driving the first rotating rod (46) to move is arranged in the workbench (1), the output end of the motor is fixedly connected with the first rotating rod (46), the wheel disc (47) is sleeved on the first rotating rod (46), a raised head (48) for driving the connecting plate (45) to move is fixedly connected to the outer ring surface of the wheel disc (47), and the surface of the raised head (48) is in sliding connection with one end, far away from a push plate (44), of the connecting plate (45).
- 8. The automatic feeding and discharging mechanism for Mini-LED fluorescent film die pressing according to claim 7, wherein a first belt wheel (49) for installing a belt (491) is sleeved on the surface of the first rotating rod (46), the first belt wheel (49) is fixedly connected with the first rotating rod (46), a second rotating rod (492) for installing a second belt wheel (493) is rotatably connected to the top of one side of the top of the workbench (1) close to the storage frame (21) through a bearing, the second rotating rod (492) is arranged on one side of the storage frame (21) far away from the first rotating rod (46), the second belt wheel (493) is sleeved on the second rotating rod (492) and is fixedly connected with the second rotating rod (491), and the first belt wheel (49) and the second belt wheel (493) are connected through the belt (491).
- 9. The automatic feeding and discharging mechanism for Mini-LED fluorescent film die pressing according to claim 8, wherein the surface of the second rotating rod (492) is sleeved with a driving gear (494) for driving the driven gear (496) to move, a third rotating rod (495) for installing the driven gear (496) is arranged on one side of the second rotating rod (492) close to the object placing frame (21), the driven gear (496) is sleeved on the surface of the third rotating rod (495) and fixedly connected with the third rotating rod, one end of the bottom of the third rotating rod (495) is rotatably connected with the workbench (1) through a bearing, the driving gear (494) is meshed with the driven gear (496), the bottom surface of the third rotating rod (495) is fixedly connected with the wheel disc (47) and the raised head (48), the tops of the second rotating rod (492) and the third rotating rod (495) are rotatably connected with a second fixing plate (497) for stabilizing the top of the second rotating rod (495) through bearings, and the second fixing plate (497) is fixedly connected with the outer wall of the object placing frame (21).
- 10. The Mini-LED fluorescent film material mould pressing automatic feeding and discharging mechanism according to claim 1, wherein the discharging assembly (5) comprises a baffle plate (51) for stopping chip boards, the bottom of the baffle plate (51) is fixedly connected with one end, far away from the feeding assembly (2), of the workbench (1), the baffle plate (51) is arranged in front of the transmission belt (11), and a discharging window (52) for facilitating material discharging is formed in one side, close to the baffle plate (51), of the workbench (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310089891.1A CN116153828A (en) | 2023-02-09 | 2023-02-09 | Mini-LED fluorescent film material mould pressing automatic feeding and discharging mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310089891.1A CN116153828A (en) | 2023-02-09 | 2023-02-09 | Mini-LED fluorescent film material mould pressing automatic feeding and discharging mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN116153828A true CN116153828A (en) | 2023-05-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310089891.1A Withdrawn CN116153828A (en) | 2023-02-09 | 2023-02-09 | Mini-LED fluorescent film material mould pressing automatic feeding and discharging mechanism |
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| Country | Link |
|---|---|
| CN (1) | CN116153828A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116453995A (en) * | 2023-06-16 | 2023-07-18 | 淄博美林电子有限公司 | Full-automatic IGBT production line |
-
2023
- 2023-02-09 CN CN202310089891.1A patent/CN116153828A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116453995A (en) * | 2023-06-16 | 2023-07-18 | 淄博美林电子有限公司 | Full-automatic IGBT production line |
| CN116453995B (en) * | 2023-06-16 | 2023-08-29 | 淄博美林电子有限公司 | Full-automatic IGBT production line |
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