CN114267478A - Ultrathin bending-resistant cable assembly and manufacturing method thereof - Google Patents
Ultrathin bending-resistant cable assembly and manufacturing method thereof Download PDFInfo
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- CN114267478A CN114267478A CN202111623131.1A CN202111623131A CN114267478A CN 114267478 A CN114267478 A CN 114267478A CN 202111623131 A CN202111623131 A CN 202111623131A CN 114267478 A CN114267478 A CN 114267478A
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Abstract
The invention discloses an ultrathin bending-resistant cable assembly which comprises an ultrathin bending-resistant cable and a printed circuit board electrically connected with the ultrathin bending-resistant cable; the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body and a lower layer bonding pad arranged on the lower layer surface of the circuit board body; the ultrathin bending-resistant cable comprises a conductor layer, an adhesive layer and a shielding film layer, wherein the conductor layer comprises an upper conductor and a lower conductor, the upper conductor is formed by arranging N x 4 conductors in a row in parallel, the lower conductor is formed by arranging N x 4 conductors in a row in parallel, and N is more than or equal to 1; each conductor of the upper layer conductor and each conductor of the lower layer conductor are symmetrically arranged one by one; the bonding layer adopts insulating material to form an ultra-thin flat winding displacement through high temperature dissolution with the upper conductor and the lower floor conductor bonding of arranging together, and the shielding thin layer passes through the cladding of direct package mode outside the flat winding displacement to form ultra-thin resistant cable of buckling.
Description
Technical Field
The invention relates to the technical field of high-speed data signal transmission cables, in particular to an ultrathin bending-resistant cable assembly and a manufacturing method thereof.
Background
With the increasing weight and space requirements of product design and the popularity of 5G, the data transmission rate requirements for cable transmission are increasing, and cables are required to be thin, light, flexible and resistant to bending and fire while efficiently transmitting high-speed data signals (the signal transmission rate referred to herein is greater than 1 Gb/s). The existing high-speed transmission cable such as HDMI, USB, SAS cable, slim SAS, GEN-Z protocol cable is internally provided with a plurality of metal conductors, and then each group of conductors are separated by using plastic and coated with insulating materials to avoid short circuit between the conductors. Still another approach uses a coaxial cable approach, i.e., the coaxial cable typically includes an insulator wrapped around an inner conductor, with the cable and insulator being surrounded by a shield and then protected by a jacket.
The inventor finds that the cable of the two existing processes is complex to process and is not suitable for being bent for multiple times, the processed product has poor signal consistency due to asymmetric conductors, and meanwhile, the processing process causes poor flame retardance of the cable, so that the service life and the safety and stability of signal transmission are reduced, and especially normal signal transmission cannot be met under the condition of fire.
Disclosure of Invention
The present invention is directed to an ultra-thin bending-resistant cable assembly and a method for manufacturing the same, which can effectively solve the above-mentioned problems in the prior art.
In order to achieve the above object, an embodiment of the present invention provides an ultra-thin bending-resistant cable assembly, which includes an ultra-thin bending-resistant cable and a printed circuit board electrically connected to the ultra-thin bending-resistant cable;
the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body and a lower layer bonding pad arranged on the lower layer surface of the circuit board body, wherein the upper layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the lower layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the upper layer bonding pad and the lower layer bonding pad are both arranged close to the rear end of the circuit board body, and each bonding pad of the upper layer bonding pad and each bonding pad of the lower layer bonding pad are symmetrically arranged one by one; the upper layer bonding pad and the lower layer bonding pad comprise N groups of butt-joint bonding pads, adjacent four bonding pads in the upper layer bonding pad and the lower layer bonding pad form a group of butt-joint bonding pads, and each group of butt-joint bonding pads form grounding-signal-grounding arrangement from left to right; wherein N is more than or equal to 1;
the ultrathin bending-resistant cable comprises a conductor layer, an adhesive layer and a shielding film layer, wherein the conductor layer comprises an upper conductor and a lower conductor, the upper conductor is formed by arranging N4 conductors in a row in parallel, the lower conductor is formed by arranging N4 conductors in a row in parallel, and each conductor of the upper conductor and each conductor of the lower conductor are symmetrically arranged one by one; the bonding layer is made of an insulating material and bonds the arranged upper-layer conductors and the arranged lower-layer conductors together through high-temperature dissolution so as to form an ultrathin flat cable, and the shielding film layer is coated outside the flat cable in a direct wrapping mode so as to form the ultrathin bending-resistant cable;
wherein a distance between a bottom end of the upper conductor and a top end of the lower conductor constitutes a first pitch equal to a thickness of the printed circuit board defined by a perpendicular distance between a surface of the upper pad and a surface of the lower pad; the upper-layer conductor and the lower-layer conductor respectively comprise N groups of differential signal groups, and adjacent four conductors in the upper-layer conductor and the lower-layer conductor form one group of differential signal groups; the distance between two adjacent conductors in each group of differential signal groups forms a second distance, and the second distance is equal to the distance between two adjacent bonding pads in each group of butt-joint bonding pads of the printed circuit board; the distance between two adjacent groups of differential signal sets of each layer of conductor forms a third distance, and the third distance is equal to the distance between two adjacent groups of butt-joint bonding pads of each layer of bonding pad of the printed circuit board;
the front end of the ultrathin bending-resistant cable is exposed out of the upper conductor and the lower conductor after being peeled, and the upper conductor and the lower conductor are exposed out of the upper layer and the lower layer and are welded on an upper layer pad and a lower layer pad of the printed circuit board through automatic symmetry, so that the ultrathin bending-resistant cable is electrically connected with the printed circuit board.
Preferably, the insulating material is insulating plastic, and the insulating plastic is made of a material which is high in temperature resistance, bending resistance and low in dielectric coefficient.
Preferably, the second distance is defined by a distance between central axes of two adjacent conductors in each set of differential signals, and the distance between two adjacent pads in each set of butt-joint pads of the printed circuit board refers to a distance between central axes of two adjacent pads in each set of butt-joint pads; the third distance is defined by the distance between the central axes of two adjacent conductors between two adjacent groups of differential signal groups of each layer of conductors, and the distance between two adjacent groups of butt-joint bonding pads of each layer of bonding pads of the printed circuit board is the distance between the central axes of two adjacent bonding pads between two adjacent groups of butt-joint bonding pads of each layer of bonding pads; wherein the third pitch is equal to or greater than the second pitch.
Preferably, the width of each conductor is equal, the width of each pad is equal, and the width of each conductor is greater than the width of each pad.
Preferably, the first pitch is 0.55mm to 1.25mm, the second pitch is 0.45mm to 0.55mm, the third pitch is 0.45mm to 0.55mm, the width of each conductor is 0.25mm to 0.35mm, and the width of each pad is 0.2mm to 0.3 mm.
The embodiment of the invention correspondingly provides a manufacturing method of an ultrathin bending-resistant cable assembly, which comprises the following steps:
providing a printed circuit board, wherein the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body and a lower layer bonding pad arranged on the lower layer surface of the circuit board body, the upper layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the lower layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the upper layer bonding pad and the lower layer bonding pad are both arranged close to the rear end of the circuit board body, and each bonding pad of the upper layer bonding pad and each bonding pad of the lower layer bonding pad are symmetrically arranged one by one; the upper layer bonding pad and the lower layer bonding pad comprise N groups of butt-joint bonding pads, adjacent four bonding pads in the upper layer bonding pad and the lower layer bonding pad form a group of butt-joint bonding pads, and each group of butt-joint bonding pads form grounding-signal-grounding arrangement from left to right; wherein N is more than or equal to 1;
providing N × 8 conductors, arranging the N × 8 conductors in parallel and symmetrically arranging and combining the upper layer and the lower layer, wherein the upper layer of conductors are formed by arranging N × 4 conductors in a row in parallel, and the lower layer of conductors are formed by arranging N × 4 conductors in a row in parallel; wherein a distance between a bottom end of the upper conductor and a top end of the lower conductor constitutes a first pitch equal to a thickness of the printed circuit board defined by a perpendicular distance between a surface of the upper pad and a surface of the lower pad; the upper-layer conductor and the lower-layer conductor respectively comprise N groups of differential signal groups, and adjacent four conductors in the upper-layer conductor and the lower-layer conductor form one group of differential signal groups; the distance between two adjacent conductors in each group of differential signal groups forms a second distance, and the second distance is equal to the distance between two adjacent bonding pads in each group of butt-joint bonding pads of the printed circuit board; the distance between two adjacent groups of differential signal sets of each layer of conductor forms a third distance, and the third distance is equal to the distance between two adjacent groups of butt-joint bonding pads of each layer of bonding pad of the printed circuit board;
providing an insulating material, and bonding an upper layer conductor and a lower layer conductor which are symmetrically arranged and combined together by dissolving the insulating material at a high temperature to form an ultrathin flat cable;
providing a shielding film, and coating the shielding film outside the flat cable in a direct wrapping mode to form an ultrathin bending-resistant cable;
the front end to the ultra-thin resistant cable of buckling skins in order to expose upper conductor and lower floor's conductor, and will expose upper conductor and lower floor's conductor pass through automatic symmetry welding and receive on printed circuit board's the upper pad and the lower floor's pad to realize the ultra-thin resistant cable of buckling and printed circuit board's electric connection.
Preferably, the insulating material is insulating plastic, and the insulating plastic is made of a material which is high in temperature resistance, bending resistance and low in dielectric coefficient.
Preferably, the second distance is defined by a distance between central axes of two adjacent conductors in each set of differential signals, and the distance between two adjacent pads in each set of butt-joint pads of the printed circuit board refers to a distance between central axes of two adjacent pads in each set of butt-joint pads; the third distance is defined by the distance between the central axes of two adjacent conductors between two adjacent groups of differential signal groups of each layer of conductors, and the distance between two adjacent groups of butt-joint bonding pads of each layer of bonding pads of the printed circuit board is the distance between the central axes of two adjacent bonding pads between two adjacent groups of butt-joint bonding pads of each layer of bonding pads; wherein the third pitch is equal to or greater than the second pitch.
Preferably, the width of each conductor is equal, the width of each pad is equal, and the width of each conductor is greater than the width of each pad.
Preferably, the first pitch is 0.55mm to 1.25mm, the second pitch is 0.45mm to 0.55mm, the third pitch is 0.45mm to 0.55mm, the width of each conductor is 0.25mm to 0.35mm, and the width of each pad is 0.2mm to 0.3 mm.
Compared with the prior art, the ultrathin bending-resistant cable assembly and the manufacturing method thereof provided by the embodiment of the invention have the following technical effects:
(1) the ultrathin bending-resistant cable provided by the invention comprises a plurality of signal conductor combinations, can be fused at one time only by one insulation according to the conductor combination of practical application, and is simple in manufacturing process.
(2) The ultrathin bending-resistant cable provided by the invention can be formed by bonding the cables only once, so that the space occupied by the cables in a chassis, a 5G base station, a server, a data center and the like is greatly reduced, and the use weight of the product is also reduced.
(3) The ultrathin bending-resistant cable assembly provided by the invention has super-strong repeated bending resistance and memory, and the cable can be bent for multiple times at any angle of 45 degrees, 90 degrees and the like according to practical application, so that the routing of products in a switch, a 5G base station, a server, a notebook computer and the like is greatly facilitated.
(4) The distance between the upper row of metal conductors and the lower row of metal conductors of the ultrathin bending-resistant cable is designed according to the thickness of the PCB of the double-sided bonding pad, so that the requirement of an automatic processing technology is met, namely the cable can be directly welded to the PCB of the double-sided bonding pad through automatic symmetrical welding after being automatically stripped, and the signal stability and the impedance consistency are improved.
(5) The ultrathin bending-resistant cable provided by the invention can be increased or decreased according to the product transmission mode, and if only 6 groups of differential signals are needed, only 12 conductors are needed to be arranged in an up-down symmetrical mode.
(6) The ultrathin bending-resistant cable provided by the invention has a good flame-retardant effect, can play a good role in protecting signal transmission under the conditions of high temperature, sudden disasters such as fire and the like, and can ensure that the signal transmission can normally transmit signals and work under the conditions of high temperature abnormity such as fire and the like.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an ultra-thin bending-resistant cable assembly according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention;
FIG. 3 is a top view of a printed circuit board illustrating a pad structure on an upper surface of the printed circuit board according to an embodiment of the present invention;
FIG. 4 is a bottom view of a printed circuit board illustrating a pad structure on a lower surface of the printed circuit board in accordance with an embodiment of the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 3 or FIG. 4, showing the structure of a set of landing pads;
fig. 6 is a schematic structural diagram of an ultra-thin bending-resistant cable according to an embodiment of the present invention;
FIG. 7 is a cross-sectional view of an ultra-thin bend-resistant cable provided in accordance with an embodiment of the present invention;
FIG. 8 is an enlarged view of a portion of FIG. 7, showing the structure of a set of differential signal groups;
FIG. 9 is a partial cross-sectional view of the ultra-thin bend-resistant cable assembly shown in FIG. 1, showing the connection of the upper/lower lands of the printed circuit board to the upper/lower conductors of the ultra-thin bend-resistant cable;
fig. 10 is a schematic flow chart of a method for manufacturing an ultra-thin bend-resistant cable assembly according to an embodiment of the present invention.
The attached drawings indicate the following:
100. an ultra-thin bend-resistant cable assembly;
1. a printed circuit board; 11. a circuit board body; 111. the upper layer surface; 1111. the front edge of the upper layer surface; 1112. the back side of the upper layer surface; 112. a lower layer surface; 1121. the front edge of the lower layer surface; 1122. the back side of the lower layer surface;
12. an upper layer pad; 13. a lower layer pad; 14. an upper layer of golden fingers; 15. a lower layer of golden fingers;
120/130, landing pads; 121/131, signal line pad; 122/132, a ground pad;
2. an ultrathin bending-resistant cable; 22. an adhesive layer; 23. a shielding thin film layer;
211. an upper conductor; 212. a lower layer conductor;
2110/2120, differential signal group;
2110a/2120a. signal lines; 2110b/2120b.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1, an embodiment of the present invention provides an ultra-thin bending-resistant cable assembly 100, where the ultra-thin bending-resistant cable assembly 100 includes a printed circuit board 1 and an ultra-thin bending-resistant cable 2 electrically connected to the printed circuit board 1 correspondingly. The ultra-thin bending-resistant cable 2 comprises N × 8 conductors (N is larger than or equal to 1) which are symmetrically arranged in parallel on an upper layer and a lower layer, N × 8 bonding pads are arranged on the upper layer and the lower layer of the printed circuit board 1 to be connected (for example, welded) with the N × 8 conductors of the ultra-thin bending-resistant cable 2, N × 4 bonding pads are arranged on the upper layer of the printed circuit board 1 to be connected with the N × 4 conductors in the ultra-thin bending-resistant cable 2, and N × 4 bonding pads are symmetrically arranged on the lower layer of the printed circuit board 1 to be connected with the rest N × 4 conductors in the ultra-thin bending-resistant cable 2.
Next, the specific structures of the printed circuit board 1 and the ultra-thin bending-resistant cable 2 will be described with reference to the drawings, so as to describe in detail how the printed circuit board 1 and the ultra-thin bending-resistant cable 2 are correspondingly connected.
Referring to fig. 2 to 5, an embodiment of the present invention provides a printed circuit board 1, where the printed circuit board 1 is suitable for connecting an ultra-thin bending-resistant cable 2, the printed circuit board 1 includes a circuit board body 11, an upper layer pad 12 disposed on an upper surface 111 of the circuit board body 11, and a lower layer pad 13 disposed on a lower surface 112 of the circuit board body 11, the upper layer pad 12 is used for connecting an upper layer conductor in the ultra-thin bending-resistant cable 2, and the lower layer pad 13 is used for connecting a lower layer conductor in the ultra-thin bending-resistant cable 2.
The upper layer bonding pad 12 is located in a rear area of the upper layer surface 111 close to the rear edge 1112, an upper layer golden finger 14 is arranged in a front area of the upper layer surface 111 close to the front edge 1111, and the upper layer golden finger 14 is correspondingly connected with the upper layer bonding pad 12. The lower layer pads 13 are located in the rear region of the lower layer surface 112 close to the rear edge 1122, and the front region of the lower layer surface 112 close to the front edge 1121 is provided with lower layer gold fingers 15, and the lower layer gold fingers 15 are correspondingly connected with the lower layer pads 13.
Specifically, referring to fig. 3 and 5, on the upper surface 111 of the printed circuit board 1, the upper layer bonding pads 12 are formed by N × 4 (N is greater than or equal to 1, in this embodiment, N is 2, that is, 8 bonding pads) in a row and arranged in parallel, the upper layer bonding pads 12 include 2 pairs of bonding pads 120, four adjacent bonding pads in the upper layer bonding pads 12 form a group of bonding pads, and each group of bonding pads forms an arrangement of a ground bonding pad 122-a signal bonding pad 121-a ground bonding pad 122 from left to right.
Specifically, referring to fig. 4 and 5, on the lower layer surface 112 of the printed circuit board 1, the lower layer pads 13 are formed by 8 pads arranged in parallel in a row, each lower layer pad 13 includes 2 pairs of the docking pads 130, four adjacent pads in the lower layer pads 13 form a set of the docking pads 130, and each set of the docking pads also form an arrangement of a ground pad 132-a signal pad 131-a ground pad 132 from left to right.
The upper layer pads 12 are disposed near a back edge 1112 of the upper layer surface 111 of the circuit board body 11, the lower layer pads 13 are disposed near a back edge 1122 of the lower layer surface 112 of the circuit board body 11, and each of the upper layer pads 12 and each of the lower layer pads 13 are arranged in a one-to-one symmetrical manner.
Referring to fig. 6 to 7, an embodiment of the present invention provides an ultrathin bending-resistant cable 2, where the ultrathin bending-resistant cable 2 includes a conductor layer, an adhesive layer 22, and a shielding film layer 23, the conductor layer includes an upper conductor 211 and a lower conductor 212, the upper conductor 211 is formed by 8 conductors arranged in parallel in a row, the lower conductor is formed by 8 conductors arranged in parallel in a row, and each conductor of the upper conductor 211 and each conductor of the lower conductor 212 are arranged in a one-to-one symmetric manner. The bonding layer 22 is made of insulating materials, the upper-layer conductors 211 and the lower-layer conductors 212 which are arranged are bonded together through high-temperature dissolution, so that an ultrathin flat cable is formed, and the shielding film layer 23 is coated outside the flat cable in a direct wrapping mode, so that the ultrathin bending-resistant cable 2 is formed.
Preferably, the insulating material used for the adhesive layer 22 is insulating plastic, and the insulating plastic is made of a material which is high in temperature resistance, bending resistance and low in dielectric coefficient.
In particular, with reference to fig. 7 and 8, the upper layer conductor 211 includes 2 sets 2110 of differential signal sets, and four adjacent conductors in the upper layer conductor 211 constitute one set of the differential signal sets. The four conductors of each set of differential signals of the upper layer conductor 211 are correspondingly welded with the four pads of one set of butt-joint pads in the upper layer pads 12 of the printed circuit board 1, so that the electrical connection is realized. That is, after the four conductors of each set 2110 of differential signals of the upper layer conductors 211 are soldered to the four pads of one set of pads in the upper layer pads 12 of the printed circuit board 1, the four conductors form the arrangement of the ground line 2110b, the signal line 2110a and the ground line 2110b from left to right.
Similarly, the lower conductor 212 includes 2 sets of differential signals, and four adjacent conductors in the lower conductor 212 form one set of the differential signals 2120. The four conductors of each group of differential signal groups of the lower layer conductors 212 are correspondingly welded with the four pads of one group of butt-joint pads in the lower layer pads 13 of the printed circuit board 1, so that the electrical connection is realized. That is, after the four conductors of each differential signal group of the lower conductor 212 are soldered to the four pads of one set of the mating pads in the lower pad 13 of the printed circuit board 1, the four conductors form an arrangement of a ground line 2120b, a signal line 2120a and a ground line 2120b in this order from left to right.
Further, referring to fig. 7 and 9, the distance between the bottom end of the upper conductor 211 and the top end of the lower conductor 212 constitutes a first pitch L1, the first pitch L1 is equal to the thickness H1 of the printed circuit board 1, and the thickness of the printed circuit board 1 is defined by the vertical distance between the surface of the upper pad 12 and the surface of the lower pad 13. Wherein the first interval L1 may be set to 0.55mm to 1.25 mm.
Referring to fig. 8 and 5, the distance between two adjacent conductors in each set of differential signal groups 2110/2120 constitutes a second pitch L2, and the second pitch L2 is equal to the distance H2 between two adjacent pads in each set of docking pads 120/130 of the printed circuit board 1. The second distance L2 is defined by a distance between the central axes of two adjacent conductors in each set of differential signal sets 2110/2120, and the distance H2 between two adjacent pads in each set of docking pads 120/130 of the printed circuit board 1 is defined as a distance between the central axes of two adjacent pads in each set of docking pads 120/130.
With reference to fig. 7 and 3 (or fig. 4), the distance between two adjacent sets of differential signal sets 2110/2120 of the upper/ lower conductors 211, 212 forms a third pitch L3, L3 being equal to the distance H3 between two adjacent sets of docking pads 120/130 of the upper/ lower pads 12, 13 of the printed circuit board 1. The third distance L3 is defined by a distance between the central axes of two adjacent conductors between two adjacent sets of differential signal sets 2110/2120 of each layer of conductors, and the distance H3 between two adjacent sets of docking pads 120/130 of the upper layer pad 12/the lower layer pad 13 of the pcb 1 refers to a distance between the central axes of two adjacent pads between two adjacent sets of docking pads 120/130 of the upper layer pad 12/the lower layer pad 13. Preferably, the third pitch L3 is equal to or greater than the second pitch L2. It can be understood that, by setting the third spacing L3 to be larger than the second spacing L2, the signal crosstalk between the two differential signal groups can be effectively reduced. The second interval L2 may be set to be 0.45-0.55 mm, and the third interval L3 may be set to be 0.45-0.55 mm.
Further, referring to fig. 8 and 5, the width K1 of each conductor in the ultra-thin flex-resistant cable 2 is equal, the width K2 of each pad on the printed circuit board 1 is equal, and the width K1 of each conductor is preferably greater than the width of each pad K2. By such arrangement, the occurrence of tin overflow when the printed circuit board 1 is welded with the ultrathin bending-resistant cable 2 can be prevented. Wherein the width K1 of each conductor may be set to 0.25mm to 0.35mm, and the width K2 of each pad may be set to 0.2mm to 0.3 mm.
Referring to fig. 1 and 9, when the ultra-thin bending-resistant cable 2 is electrically connected to the printed circuit board 1, the front end of the ultra-thin bending-resistant cable 2 is peeled to expose the upper conductor 211 and the lower conductor 212, and the exposed upper conductor 211 and the exposed lower conductor 212 are automatically and symmetrically welded to the upper pad 12 and the lower pad 13 of the printed circuit board 1, so that the ultra-thin bending-resistant cable is electrically connected to the printed circuit board.
It is understood that the upper layer pads 12/the lower layer pads 13 of the printed circuit board 1 shown in the above embodiments respectively include two sets of the docking pads 120/130, and the upper layer conductors 211/the lower layer conductors 212 of the ultra-thin flex-resistant cable 2 respectively include two sets of the differential signal sets 2110/2120, but the present embodiment is not limited to the design of N-2. The ultra-thin bending-resistant cable assembly 100 provided in this embodiment can be increased or decreased according to the transmission manner of the product, for example, only 6 sets of differential signals are required, that is, when N is 6/2 is 3, the upper layer pad 12/the lower layer pad 13 of the printed circuit board 1 respectively includes three sets of docking pads 120/130, and the upper layer conductor 211/the lower layer conductor 212 of the ultra-thin bending-resistant cable 2 respectively includes three sets of differential signal sets 2110/2120 (specifically, two rows of conductors are arranged in an up-down symmetrical manner, and 12 conductors are arranged in parallel in each row). In other embodiments, N may also be equal to 4, 5, and 6 … …, which will not be described herein.
Referring to fig. 10, an embodiment of the present invention provides a method for manufacturing an ultra-thin bending-resistant cable assembly, which includes steps S101 to S105:
s101, providing a printed circuit board, wherein the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body and a lower layer bonding pad arranged on the lower layer surface of the circuit board body;
specifically, the upper layer of bonding pads are formed by arranging N × 4 bonding pads in a row in parallel, the lower layer of bonding pads are formed by arranging N × 4 bonding pads in a row in parallel, the upper layer of bonding pads and the lower layer of bonding pads are both arranged close to the rear end of the circuit board body, and each bonding pad of the upper layer of bonding pads and each bonding pad of the lower layer of bonding pads are symmetrically arranged one by one; the upper layer bonding pad and the lower layer bonding pad comprise N groups of butt-joint bonding pads, adjacent four bonding pads in the upper layer bonding pad and the lower layer bonding pad form a group of butt-joint bonding pads, and each group of butt-joint bonding pads form grounding-signal-grounding arrangement from left to right; wherein N is more than or equal to 1;
s102, providing N × 8 conductors, arranging and combining the N × 8 conductors side by side and symmetrically in an upper layer and a lower layer, wherein the upper layer of conductors are formed by arranging N × 4 conductors in a row in parallel, and the lower layer of conductors are formed by arranging N × 4 conductors in a row in parallel;
wherein a distance between a bottom end of the upper conductor and a top end of the lower conductor constitutes a first pitch equal to a thickness of the printed circuit board defined by a perpendicular distance between a surface of the upper pad and a surface of the lower pad; the upper-layer conductor and the lower-layer conductor respectively comprise N groups of differential signal groups, and adjacent four conductors in the upper-layer conductor and the lower-layer conductor form one group of differential signal groups; the distance between two adjacent conductors in each group of differential signal groups forms a second distance, and the second distance is equal to the distance between two adjacent bonding pads in each group of butt-joint bonding pads of the printed circuit board; the distance between two adjacent groups of differential signal sets of each layer of conductor forms a third distance, and the third distance is equal to the distance between two adjacent groups of butt-joint bonding pads of each layer of bonding pad of the printed circuit board;
s103, providing an insulating material, and bonding the upper-layer conductors and the lower-layer conductors which are symmetrically arranged and combined together by the insulating material through high-temperature dissolution to form an ultrathin flat cable;
s104, providing a shielding film, and coating the shielding film outside the flat bus bar in a direct wrapping mode to form the ultrathin bending-resistant cable;
s105, the front end of the ultrathin bending-resistant cable is peeled to expose the upper-layer conductor and the lower-layer conductor, and the exposed upper-layer conductor and the exposed lower-layer conductor are welded on an upper-layer pad and a lower-layer pad of the printed circuit board through automatic symmetry, so that the electric connection of the ultrathin bending-resistant cable and the printed circuit board is realized.
Preferably, the insulating material is insulating plastic, and the insulating plastic is made of a material which is high in temperature resistance, bending resistance and low in dielectric coefficient.
Preferably, the second distance is defined by a distance between central axes of two adjacent conductors in each set of differential signals, and the distance between two adjacent pads in each set of butt-joint pads of the printed circuit board is defined as a distance between central axes of two adjacent pads in each set of butt-joint pads; the third distance is defined by the distance between the central axes of two adjacent conductors between two adjacent groups of differential signal groups of each layer of conductors, and the distance between two adjacent groups of butt-joint bonding pads of each layer of bonding pads of the printed circuit board is the distance between the central axes of two adjacent bonding pads between two adjacent groups of butt-joint bonding pads of each layer of bonding pads; wherein the third pitch is equal to or greater than the second pitch.
In specific implementation, the first spacing is 0.55mm to 1.25mm, the second spacing is 0.45mm to 0.55mm, the third spacing is 0.45mm to 0.55mm, the width of each conductor is 0.25mm to 0.35mm, and the width of each bonding pad is 0.2mm to 0.3 mm.
In addition, the width of each conductor is equal, the width of each pad is equal, and the width of each conductor is greater than the width of each pad.
It can be understood that, the specific structure of the ultra-thin bending-resistant cable assembly manufactured by the manufacturing method of the ultra-thin bending-resistant cable assembly provided by the present embodiment may refer to the description of the above embodiments, and the description is omitted here.
In summary, compared with the prior art, the ultrathin bending-resistant cable assembly and the manufacturing method thereof provided by the embodiments of the present invention have the following technical effects:
(1) the ultrathin bending-resistant cable provided by the invention comprises a plurality of signal conductor combinations, can be fused at one time only by one insulation according to the conductor combination of practical application, and is simple in manufacturing process.
(2) The ultrathin bending-resistant cable provided by the invention can be formed by bonding the cables only once, so that the space occupied by the cables in a chassis, a 5G base station, a server, a data center and the like is greatly reduced, and the use weight of the product is also reduced.
(3) The ultrathin bending-resistant cable assembly provided by the invention has super-strong repeated bending resistance and memory, and the cable can be bent for multiple times at any angle of 45 degrees, 90 degrees and the like according to practical application, so that the routing of products in a switch, a 5G base station, a server, a notebook computer and the like is greatly facilitated.
(4) The distance between the upper row of metal conductors and the lower row of metal conductors of the ultrathin bending-resistant cable is designed according to the thickness of the PCB of the double-sided bonding pad, so that the requirement of an automatic processing technology is met, namely the cable can be directly welded to the PCB of the double-sided bonding pad through automatic symmetrical welding after being automatically stripped, and the signal stability and the impedance consistency are improved.
(5) The ultrathin bending-resistant cable provided by the invention can be increased or decreased according to the product transmission mode, and if only 6 groups of differential signals are needed, only 12 conductors are needed to be arranged in an up-down symmetrical mode.
(6) The ultrathin bending-resistant cable provided by the invention has a good flame-retardant effect, can play a good role in protecting signal transmission under the conditions of high temperature, sudden disasters such as fire and the like, and can ensure that the signal transmission can normally transmit signals and work under the conditions of high temperature abnormity such as fire and the like.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An ultrathin bending-resistant cable assembly is characterized by comprising an ultrathin bending-resistant cable and a printed circuit board electrically connected with the ultrathin bending-resistant cable;
the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body and a lower layer bonding pad arranged on the lower layer surface of the circuit board body, wherein the upper layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the lower layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the upper layer bonding pad and the lower layer bonding pad are both arranged close to the rear end of the circuit board body, and each bonding pad of the upper layer bonding pad and each bonding pad of the lower layer bonding pad are symmetrically arranged one by one; the upper layer bonding pad and the lower layer bonding pad comprise N groups of butt-joint bonding pads, adjacent four bonding pads in the upper layer bonding pad and the lower layer bonding pad form a group of butt-joint bonding pads, and each group of butt-joint bonding pads form grounding-signal-grounding arrangement from left to right; wherein N is more than or equal to 1;
the ultrathin bending-resistant cable comprises a conductor layer, an adhesive layer and a shielding film layer, wherein the conductor layer comprises an upper conductor and a lower conductor, the upper conductor is formed by arranging N4 conductors in a row in parallel, the lower conductor is formed by arranging N4 conductors in a row in parallel, and each conductor of the upper conductor and each conductor of the lower conductor are symmetrically arranged one by one; the bonding layer is made of an insulating material and bonds the arranged upper-layer conductors and the arranged lower-layer conductors together through high-temperature dissolution so as to form an ultrathin flat cable, and the shielding film layer is coated outside the flat cable in a direct wrapping mode so as to form the ultrathin bending-resistant cable;
wherein a distance between a bottom end of the upper conductor and a top end of the lower conductor constitutes a first pitch equal to a thickness of the printed circuit board defined by a perpendicular distance between a surface of the upper pad and a surface of the lower pad; the upper-layer conductor and the lower-layer conductor respectively comprise N groups of differential signal groups, and adjacent four conductors in the upper-layer conductor and the lower-layer conductor form one group of differential signal groups; the distance between two adjacent conductors in each group of differential signal groups forms a second distance, and the second distance is equal to the distance between two adjacent bonding pads in each group of butt-joint bonding pads of the printed circuit board; the distance between two adjacent groups of differential signal sets of each layer of conductor forms a third distance, and the third distance is equal to the distance between two adjacent groups of butt-joint bonding pads of each layer of bonding pad of the printed circuit board;
the front end of the ultrathin bending-resistant cable is exposed out of the upper conductor and the lower conductor after being peeled, and the upper conductor and the lower conductor are exposed out of the upper layer and the lower layer and are welded on an upper layer pad and a lower layer pad of the printed circuit board through automatic symmetry, so that the ultrathin bending-resistant cable is electrically connected with the printed circuit board.
2. The ultra-thin bend-resistant cable assembly of claim 1, wherein the insulating material is an insulating plastic made of a material that is resistant to high temperature, bending, and low in dielectric constant.
3. The ultra-thin bend-resistant cable assembly of claim 1, wherein the second pitch is defined by a distance between central axes of two adjacent conductors in each set of differential signals, the distance between two adjacent pads in each set of mating pads of the printed circuit board being the distance between central axes of two adjacent pads in each set of mating pads; the third distance is defined by the distance between the central axes of two adjacent conductors between two adjacent groups of differential signal groups of each layer of conductors, and the distance between two adjacent groups of butt-joint bonding pads of each layer of bonding pads of the printed circuit board is the distance between the central axes of two adjacent bonding pads between two adjacent groups of butt-joint bonding pads of each layer of bonding pads; wherein the third pitch is equal to or greater than the second pitch.
4. The ultra-thin, bend-resistant cable assembly of claim 3 wherein each of the conductors has an equal width, each of the pads has an equal width, and each of the conductors has a width greater than each of the pads.
5. The ultra-thin bend-resistant cable assembly of claim 4, wherein the first pitch is 0.55mm to 1.25mm, the second pitch is 0.45mm to 0.55mm, the third pitch is 0.45mm to 0.55mm, the width of each conductor is 0.25mm to 0.35mm, and the width of each pad is 0.2mm to 0.3 mm.
6. A method for manufacturing an ultrathin bending-resistant cable assembly is characterized by comprising the following steps:
providing a printed circuit board, wherein the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body and a lower layer bonding pad arranged on the lower layer surface of the circuit board body, the upper layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the lower layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the upper layer bonding pad and the lower layer bonding pad are both arranged close to the rear end of the circuit board body, and each bonding pad of the upper layer bonding pad and each bonding pad of the lower layer bonding pad are symmetrically arranged one by one; the upper layer bonding pad and the lower layer bonding pad comprise N groups of butt-joint bonding pads, adjacent four bonding pads in the upper layer bonding pad and the lower layer bonding pad form a group of butt-joint bonding pads, and each group of butt-joint bonding pads form grounding-signal-grounding arrangement from left to right; wherein N is more than or equal to 1;
providing N × 8 conductors, arranging the N × 8 conductors in parallel and symmetrically arranging and combining the upper layer and the lower layer, wherein the upper layer of conductors are formed by arranging N × 4 conductors in a row in parallel, and the lower layer of conductors are formed by arranging N × 4 conductors in a row in parallel; wherein a distance between a bottom end of the upper conductor and a top end of the lower conductor constitutes a first pitch equal to a thickness of the printed circuit board defined by a perpendicular distance between a surface of the upper pad and a surface of the lower pad; the upper-layer conductor and the lower-layer conductor respectively comprise N groups of differential signal groups, and adjacent four conductors in the upper-layer conductor and the lower-layer conductor form one group of differential signal groups; the distance between two adjacent conductors in each group of differential signal groups forms a second distance, and the second distance is equal to the distance between two adjacent bonding pads in each group of butt-joint bonding pads of the printed circuit board; the distance between two adjacent groups of differential signal sets of each layer of conductor forms a third distance, and the third distance is equal to the distance between two adjacent groups of butt-joint bonding pads of each layer of bonding pad of the printed circuit board;
providing an insulating material, and bonding an upper layer conductor and a lower layer conductor which are symmetrically arranged and combined together by dissolving the insulating material at a high temperature to form an ultrathin flat cable;
providing a shielding film, and coating the shielding film outside the flat cable in a direct wrapping mode to form an ultrathin bending-resistant cable;
the front end to the ultra-thin resistant cable of buckling skins in order to expose upper conductor and lower floor's conductor, and will expose upper conductor and lower floor's conductor pass through automatic symmetry welding and receive on printed circuit board's the upper pad and the lower floor's pad to realize the ultra-thin resistant cable of buckling and printed circuit board's electric connection.
7. The method of claim 6, wherein the insulation material is an insulation plastic made of a material that is resistant to high temperature, bending, and low in dielectric constant.
8. The method of claim 6, wherein the second pitch is defined by a distance between the central axes of two adjacent conductors in each set of differential signals, and wherein the distance between two adjacent pads in each set of mating pads of the printed circuit board is defined as a distance between the central axes of two adjacent pads in each set of mating pads; the third distance is defined by the distance between the central axes of two adjacent conductors between two adjacent groups of differential signal groups of each layer of conductors, and the distance between two adjacent groups of butt-joint bonding pads of each layer of bonding pads of the printed circuit board is the distance between the central axes of two adjacent bonding pads between two adjacent groups of butt-joint bonding pads of each layer of bonding pads; wherein the third pitch is equal to or greater than the second pitch.
9. The method of manufacturing an ultra-thin bend-resistant cable assembly as recited in claim 8, wherein each of the conductors has an equal width, each of the pads has an equal width, and each of the conductors has a width greater than each of the pads.
10. The method of claim 9, wherein the first pitch is 0.55mm to 1.25mm, the second pitch is 0.45mm to 0.55mm, the third pitch is 0.45mm to 0.55mm, the width of each conductor is 0.25mm to 0.35mm, and the width of each pad is 0.2mm to 0.3 mm.
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| CN202111623131.1A CN114267478B (en) | 2021-12-28 | 2021-12-28 | Ultrathin bending-resistant cable assembly and manufacturing method thereof |
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| CN114267478B (en) | 2023-05-16 |
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