CN114267478B - Ultrathin bending-resistant cable assembly and manufacturing method thereof - Google Patents
Ultrathin bending-resistant cable assembly and manufacturing method thereof Download PDFInfo
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- CN114267478B CN114267478B CN202111623131.1A CN202111623131A CN114267478B CN 114267478 B CN114267478 B CN 114267478B CN 202111623131 A CN202111623131 A CN 202111623131A CN 114267478 B CN114267478 B CN 114267478B
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Abstract
The invention discloses an ultrathin bending-resistant cable assembly, which comprises an ultrathin bending-resistant cable and a printed circuit board electrically connected with the ultrathin bending-resistant cable; the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body, and a lower layer bonding pad arranged on the lower layer surface of the circuit board body; the ultrathin bending-resistant cable comprises a conductor layer, an adhesive layer and a shielding film layer, wherein the conductor layer comprises an upper conductor and a lower conductor, the upper conductor is formed by arranging N4 conductors in a row in parallel, and the lower conductor is formed by arranging N4 conductors in a row in parallel, wherein N is more than or equal to 1; each conductor of the upper layer conductor and each conductor of the lower layer conductor are symmetrically arranged one by one; the bonding layer adopts insulating material to adhere the upper conductor and the lower conductor which are well arranged together through high-temperature dissolution, so that an ultrathin flat cable is formed, and the shielding film layer is coated outside the flat cable in a direct-wrapping mode, so that the ultrathin bending-resistant cable is formed.
Description
Technical Field
The invention relates to the technical field of high-speed data signal transmission cables, in particular to an ultrathin bending-resistant cable assembly and a manufacturing method thereof.
Background
With the further increasing demands of product design on weight and space, and the increasing popularity of 5G, the data transmission rate requirements for cable transmission are increasing, and cables are required to be thin, light, flexible, bending-resistant and fire-resistant while effectively transmitting high-speed data signals (the signal transmission rate here means more than 1 Gb/s). The existing high-speed transmission cables such as HDMI, USB, SAS cable, slot SAS, GEN-Z and other protocol cables are internally provided with a plurality of metal conductors, and then short circuits among the conductors are avoided by using plastic to separate each group of conductors and coating insulating materials. Yet another approach uses a coaxial cable approach, which typically includes an insulator wrapped around an inner conductor, the cable and insulator being wrapped with a shield and then protected by a jacket.
The inventor finds that the existing two processes of cable processing is complex and is not suitable for bending for many times, the processed products have poor signal consistency because of asymmetrical conductors, and meanwhile, the processing process leads to poor flame retardance of the cable, so that the service life and the safety and stability of signal transmission are reduced, and particularly, the normal signal transmission cannot be met under the condition of fire.
Disclosure of Invention
The invention aims to provide an ultrathin bending-resistant cable assembly and a manufacturing method thereof, which can effectively solve the technical problems in the prior art.
In order to achieve the above object, an embodiment of the present invention provides an ultrathin bending-resistant cable assembly, including an ultrathin bending-resistant cable and a printed circuit board electrically connected with the ultrathin bending-resistant cable;
the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body and a lower layer bonding pad arranged on the lower layer surface of the circuit board body, wherein the upper layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the lower layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the upper layer bonding pad and the lower layer bonding pad are both arranged close to the rear end of the circuit board body, and each bonding pad of the upper layer bonding pad and each bonding pad of the lower layer bonding pad are arranged symmetrically one by one; the upper bonding pad and the lower bonding pad comprise N groups of butt bonding pads, each group of butt bonding pads form a group of butt bonding pads, and each group of butt bonding pads form ground-signal-ground arrangement from left to right; wherein N is more than or equal to 1;
the ultrathin bending-resistant cable comprises a conductor layer, an adhesive layer and a shielding film layer, wherein the conductor layer comprises an upper conductor and a lower conductor, the upper conductor is formed by arranging N4 conductors in a row in parallel, the lower conductor is formed by arranging N4 conductors in a row in parallel, and each conductor of the upper conductor and each conductor of the lower conductor are symmetrically arranged one by one; the bonding layer is made of insulating materials, the arranged upper conductors and the arranged lower conductors are bonded together through high-temperature dissolution, so that an ultrathin flat cable is formed, and the shielding film layer is coated outside the flat cable in a direct-wrapping mode, so that the ultrathin bending-resistant cable is formed;
wherein a distance between a bottom end of the upper layer conductor and a top end of the lower layer conductor constitutes a first pitch equal to a thickness of the printed circuit board defined by a vertical distance between a surface of the upper layer pad and a surface of the lower layer pad; the upper layer conductors and the lower layer conductors comprise N groups of differential signal groups, and four adjacent conductors in the upper layer conductors and the lower layer conductors form one group of differential signal groups; the distance between two adjacent conductors in each differential signal group forms a second interval, and the second interval is equal to the distance between two adjacent bonding pads in each butt bonding pad group of the printed circuit board; the distance between two adjacent differential signal groups of each layer of conductor forms a third interval, and the third interval is equal to the distance between two adjacent butt joint bonding pads of each layer of bonding pad of the printed circuit board;
the front end of the ultrathin bending-resistant cable is exposed out of the upper layer conductor and the lower layer conductor after being peeled, and the exposed upper layer conductor and lower layer conductor are welded onto the upper layer bonding pad and the lower layer bonding pad of the printed circuit board in an automatic symmetrical mode, so that the electric connection between the ultrathin bending-resistant cable and the printed circuit board is realized.
Preferably, the insulating material is insulating plastic, and the insulating plastic is made of a material with high temperature resistance, bending resistance and low dielectric coefficient.
Preferably, the second pitch is defined by a distance between central axes of two adjacent conductors in each differential signal group, and the distance between two adjacent bonding pads in each group of bonding pads of the printed circuit board refers to the distance between central axes of two adjacent bonding pads in each group of bonding pads; the third distance is defined by the distance between the central axes of two adjacent conductors between two adjacent differential signal groups of each layer of conductor, and the distance between two adjacent abutting bonding pads of each layer of bonding pad of the printed circuit board refers to the distance between the central axes of two adjacent abutting bonding pads of each layer of bonding pad; wherein the third pitch is equal to or greater than the second pitch.
Preferably, the width of each of the conductors is equal, the width of each of the pads is equal, and the width of each of the conductors is greater than the width of each of the pads.
Preferably, the first pitch is 0.55 mm-1.25 mm, the second pitch is 0.45 mm-0.55 mm, the third pitch is 0.45 mm-0.55 mm, the width of each conductor is 0.25 mm-0.35 mm, and the width of each bonding pad is 0.2 mm-0.3 mm.
The embodiment of the invention correspondingly provides a manufacturing method of an ultrathin bending-resistant cable assembly, which comprises the following steps:
the method comprises the steps that a printed circuit board is provided, the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body and a lower layer bonding pad arranged on the lower layer surface of the circuit board body, the upper layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the lower layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the upper layer bonding pad and the lower layer bonding pad are both arranged close to the rear end of the circuit board body, and each bonding pad of the upper layer bonding pad and each bonding pad of the lower layer bonding pad are arranged in a one-to-one symmetry manner; the upper bonding pad and the lower bonding pad comprise N groups of butt bonding pads, each group of butt bonding pads form a group of butt bonding pads, and each group of butt bonding pads form ground-signal-ground arrangement from left to right; wherein N is more than or equal to 1;
providing N.8conductors, arranging N.8conductors side by side and symmetrically arranging an upper layer and a lower layer in a combined way, wherein the upper layer of conductors are formed by arranging N.4conductors in a row in parallel, and the lower layer of conductors are formed by arranging N.4conductors in a row in parallel; wherein a distance between a bottom end of the upper layer conductor and a top end of the lower layer conductor constitutes a first pitch equal to a thickness of the printed circuit board defined by a vertical distance between a surface of the upper layer pad and a surface of the lower layer pad; the upper layer conductors and the lower layer conductors comprise N groups of differential signal groups, and four adjacent conductors in the upper layer conductors and the lower layer conductors form one group of differential signal groups; the distance between two adjacent conductors in each differential signal group forms a second interval, and the second interval is equal to the distance between two adjacent bonding pads in each butt bonding pad group of the printed circuit board; the distance between two adjacent differential signal groups of each layer of conductor forms a third interval, and the third interval is equal to the distance between two adjacent butt joint bonding pads of each layer of bonding pad of the printed circuit board;
providing an insulating material, and bonding upper conductors and lower conductors which are symmetrically arranged and combined together by the insulating material through high-temperature dissolution to form an ultrathin flat cable;
providing a shielding film, and coating the shielding film outside the flat cable in a direct-wrapping mode, so that an ultrathin bending-resistant cable is formed;
the front end of the ultrathin bending-resistant cable is peeled to expose the upper layer conductor and the lower layer conductor, and the exposed upper layer conductor and lower layer conductor are welded to an upper layer bonding pad and a lower layer bonding pad of the printed circuit board in an automatic symmetrical mode, so that the electric connection between the ultrathin bending-resistant cable and the printed circuit board is realized.
Preferably, the insulating material is insulating plastic, and the insulating plastic is made of a material with high temperature resistance, bending resistance and low dielectric coefficient.
Preferably, the second pitch is defined by a distance between central axes of two adjacent conductors in each differential signal group, and the distance between two adjacent bonding pads in each group of bonding pads of the printed circuit board refers to the distance between central axes of two adjacent bonding pads in each group of bonding pads; the third distance is defined by the distance between the central axes of two adjacent conductors between two adjacent differential signal groups of each layer of conductor, and the distance between two adjacent abutting bonding pads of each layer of bonding pad of the printed circuit board refers to the distance between the central axes of two adjacent abutting bonding pads of each layer of bonding pad; wherein the third pitch is equal to or greater than the second pitch.
Preferably, the width of each of the conductors is equal, the width of each of the pads is equal, and the width of each of the conductors is greater than the width of each of the pads.
Preferably, the first pitch is 0.55 mm-1.25 mm, the second pitch is 0.45 mm-0.55 mm, the third pitch is 0.45 mm-0.55 mm, the width of each conductor is 0.25 mm-0.35 mm, and the width of each bonding pad is 0.2 mm-0.3 mm.
Compared with the prior art, the ultrathin bending-resistant cable assembly and the manufacturing method thereof provided by the embodiment of the invention have the following technical effects:
(1) The ultrathin bending-resistant cable provided by the invention comprises a plurality of signal conductor combinations, and the conductor combinations can be formed by fusing only one insulation according to practical application, so that the manufacturing process is simple.
(2) The ultrathin bending-resistant cable provided by the invention can be formed by bonding the cable only by one time, so that the space occupied by the cable in a case, a 5G base station, a server, a data center and the like is greatly reduced, and the use weight of the product is also reduced.
(3) The ultrathin bending-resistant cable assembly provided by the invention has the ultra-strong multiple bending-resistant property and memory property, and the cable can be bent for multiple times at any angle of 45 degrees, 90 degrees and the like according to practical application, so that products can be conveniently routed in the interior of products such as switches, 5G base stations, servers, notebook computers and the like.
(4) The ultrathin bending-resistant cable provided by the invention designs the distance between the upper row metal conductor and the lower row metal conductor according to the thickness of the PCB of the double-sided bonding pad, thereby meeting the requirement of an automatic processing technology, namely the cable can be directly and symmetrically welded on the PCB of the double-sided bonding pad through automation after being peeled automatically, and the signal stability and the impedance consistency are improved.
(5) The ultrathin bending-resistant cable provided by the invention can be increased or decreased according to the transmission mode of the product, and if only 6 groups of differential signals are needed, only 12 conductors are needed to be arranged up and down symmetrically.
(6) The ultrathin bending-resistant cable provided by the invention has good flame retardant effect, can play a good role in protecting signal transmission under the conditions of sudden disasters such as high temperature and fire, and ensures that the signal transmission can normally transmit signals and work under the conditions of high temperature anomalies such as fire.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an ultrathin bending-resistant cable assembly according to an embodiment of the invention;
fig. 2 is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention;
FIG. 3 is a top view of a printed circuit board showing a pad structure on an upper surface of the printed circuit board according to an embodiment of the present invention;
FIG. 4 is a bottom view of a printed circuit board showing a pad structure on a lower surface of the printed circuit board according to an embodiment of the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 3 or FIG. 4 showing the structure of a set of bond pads;
fig. 6 is a schematic structural diagram of an ultrathin bending-resistant cable according to an embodiment of the invention;
FIG. 7 is a cross-sectional view of an ultra-thin flex cable according to an embodiment of the present invention;
FIG. 8 is an enlarged view of a portion of FIG. 7 showing the structure of a set of differential signal sets;
FIG. 9 is a partial cross-sectional view of the ultra-thin flex cable assembly of FIG. 1 showing the connection of the upper/lower bond pads of the printed circuit board to the upper/lower conductors of the ultra-thin flex cable;
fig. 10 is a flow chart of a method for manufacturing an ultrathin bending-resistant cable assembly according to an embodiment of the invention.
The attached drawings are used for identifying and describing:
100. an ultra-thin bend resistant cable assembly;
1. a printed circuit board; 11. a circuit board body; 111. an upper layer surface; 1111. the front edge of the upper surface; 1112. the rear edge of the upper surface; 112. a lower layer surface; 1121. the front edge of the lower layer surface; 1122. the rear edge of the lower layer surface;
12. an upper layer bonding pad; 13. a lower layer bonding pad; 14. an upper golden finger; 15. a lower golden finger;
120/130. Bond pads; 121/131. Signal line pads; 122/132. Ground pads;
2. ultrathin bending-resistant cable; 22. an adhesive layer; 23. a shielding film layer;
211. an upper conductor; 212. a lower conductor;
2110/2120. Differential signal set;
2110a/2120a. Signal lines; 2110b/2120b. Ground.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may communicate with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1, an embodiment of the present invention provides an ultra-thin bending-resistant cable assembly 100, where the ultra-thin bending-resistant cable assembly 100 includes a printed circuit board 1 and an ultra-thin bending-resistant cable 2 electrically connected to the printed circuit board 1. The ultrathin bending-resistant cable 2 comprises n×8 conductors (N is greater than or equal to 1) which are arranged in parallel and symmetrically in an upper layer and a lower layer, n×8 bonding pads are arranged on the upper layer and the lower layer of the printed circuit board 1 to be connected (for example, welded) with the n×8 conductors of the ultrathin bending-resistant cable 2, n×4 bonding pads are arranged on the upper layer of the printed circuit board 1 to be connected with the n×4 conductors in the ultrathin bending-resistant cable 2, and n×4 bonding pads are symmetrically arranged on the lower layer of the printed circuit board 1 to be connected with the rest n×4 conductors in the ultrathin bending-resistant cable 2.
In the following, a detailed description will be given of how the printed circuit board 1 is connected with the ultra-thin bending-resistant cable 2 by describing the specific structures of the printed circuit board 1 and the ultra-thin bending-resistant cable 2 with reference to the accompanying drawings.
Referring to fig. 2 to 5, an embodiment of the present invention provides a printed circuit board 1, where the printed circuit board 1 is suitable for connecting an ultrathin bending-resistant cable 2, the printed circuit board 1 includes a circuit board body 11, an upper layer pad 12 disposed on an upper layer surface 111 of the circuit board body 11, and a lower layer pad 13 disposed on a lower layer surface 112 of the circuit board body 11, the upper layer pad 12 is used for connecting an upper layer conductor in the ultrathin bending-resistant cable 2, and the lower layer pad 13 is used for connecting a lower layer conductor in the ultrathin bending-resistant cable 2.
The upper bonding pad 12 is located in a rear area of the upper surface 111 near the rear edge 1112, and an upper gold finger 14 is disposed in a front area of the upper surface 111 near the front edge 1111, and the upper gold finger 14 is correspondingly connected to the upper bonding pad 12. The lower pad 13 is located in a rear area of the lower surface 112 near the rear edge 1122, a lower gold finger 15 is disposed in a front area of the lower surface 112 near the front edge 1121, and the lower gold finger 15 is correspondingly connected to the lower pad 13.
Specifically, referring to fig. 3 and 5, on the upper surface 111 of the printed circuit board 1, the upper bonding pad 12 is formed by arranging n×4 bonding pads (n+.1, in this embodiment, n=2, i.e., 8 bonding pads) in a row in parallel, the upper bonding pad 12 includes 2 groups of bonding pads 120, and four adjacent bonding pads in the upper bonding pad 12 form a group of bonding pads, each group of bonding pads forms an arrangement of the ground bonding pad 122-signal bonding pad 121-ground bonding pad 122 from left to right.
Specifically, referring to fig. 4 and 5, on the lower surface 112 of the printed circuit board 1, the lower pad 13 is formed by arranging 8 pads in a row in parallel, the lower pad 13 includes 2 sets of pads 130, four adjacent pads in the lower pad 13 form a set of pads 130, and each set of pads also forms an arrangement of ground pad 132-signal pad 131-ground pad 132 from left to right.
Wherein, the upper layer bonding pads 12 are arranged near the rear edge 1112 of the upper layer surface 111 of the circuit board body 11, the lower layer bonding pads 13 are arranged near the rear edge 1122 of the lower layer surface 112 of the circuit board body 11, and each bonding pad of the upper layer bonding pads 12 and each bonding pad of the lower layer bonding pads 13 are arranged in a one-to-one symmetry.
Referring to fig. 6 to 7, an embodiment of the present invention provides an ultrathin bending-resistant cable 2, where the ultrathin bending-resistant cable 2 includes a conductor layer, an adhesive layer 22 and a shielding film layer 23, the conductor layer includes an upper conductor 211 and a lower conductor 212, the upper conductor 211 is formed by arranging 8 conductors in a row in parallel, the lower conductor is formed by arranging 8 conductors in a row in parallel, and each conductor of the upper conductor 211 and each conductor of the lower conductor 212 are arranged in a one-to-one symmetry. The bonding layer 22 is made of an insulating material and bonds the arranged upper layer conductors 211 and lower layer conductors 212 together through high-temperature dissolution, so that an ultrathin flat cable is formed, and the shielding film layer 23 is coated outside the flat cable in a straight-wrapping mode, so that the ultrathin bending-resistant cable 2 is formed.
Preferably, the insulating material used for the adhesive layer 22 is an insulating plastic, and the insulating plastic is made of a material with high temperature resistance, bending resistance and low dielectric coefficient.
Referring to fig. 7 and 8, in particular, the upper conductor 211 includes 2 differential signal groups 2110, and four adjacent conductors in the upper conductor 211 form one of the differential signal groups. The four conductors of each differential signal group of the upper conductor 211 are soldered to the four pads of one set of the bonding pads of the upper pad 12 of the printed circuit board 1, thereby achieving electrical connection. That is, after the four conductors of each differential signal group 2110 of the upper conductor 211 are soldered to the four pads of one set of butt pads in the upper pad 12 of the printed circuit board 1, the four conductors sequentially form an arrangement of the ground line 2110b, the signal line 2110a and the ground line 2110b from left to right.
Likewise, the lower conductors 212 include 2 differential signal groups, and adjacent four conductors in the lower conductors 212 form one of the differential signal groups 2120. The four conductors of each differential signal group of the lower conductor 212 are soldered to four pads of a set of landing pads in the lower pad 13 of the printed circuit board 1, thereby achieving electrical connection. That is, after the four conductors of each differential signal group of the lower conductor 212 are soldered to the four pads of one set of the butt pads in the lower pad 13 of the printed circuit board 1, the four conductors sequentially form an arrangement of the ground line 2120b, the signal line 2120a, and the ground line 2120b from left to right.
Further, referring to fig. 7 and 9, the distance between the bottom end of the upper conductor 211 and the top end of the lower conductor 212 forms a first pitch L1, the first pitch L1 being equal to the thickness H1 of the printed circuit board 1, and the thickness of the printed circuit board 1 being defined by the vertical distance between the surface of the upper pad 12 and the surface of the lower pad 13. Wherein, the first interval L1 can be set to be 0.55 mm-1.25 mm.
Referring to fig. 8 and 5, the distance between two adjacent conductors in each differential signal group 2110/2120 forms a second pitch L2, and the second pitch L2 is equal to the distance H2 between two adjacent pads in each set of butt pads 120/130 of the printed circuit board 1. Wherein the second pitch L2 is defined by a distance between central axes of adjacent two conductors in each differential signal group 2110/2120, and the distance H2 between adjacent two pads in each group of the landing pads 120/130 of the printed circuit board 1 refers to a distance between central axes of adjacent two pads in each group of the landing pads 120/130.
Referring to fig. 7 and 3 (or fig. 4), the distance between two adjacent differential signal groups 2110/2120 of the upper conductor 211/lower conductor 212 forms a third pitch L3, and the third pitch L3 is equal to the distance H3 between two adjacent pairs of pads 120/130 of the upper pad 12/lower pad 13 of the printed circuit board 1. Wherein the third distance L3 is defined by the distance between the central axes of the two adjacent conductors between the two adjacent differential signal groups 2110/2120 of each layer of conductor, and the distance H3 between the two adjacent pairs of pads 120/130 of the upper pad 12/lower pad 13 of the printed circuit board 1 refers to the distance between the central axes of the two adjacent pairs of pads 120/130 of the upper pad 12/lower pad 13. Preferably, the third interval L3 is equal to or greater than the second interval L2. It can be appreciated that setting the third pitch L3 larger than the second pitch L2 can effectively reduce signal crosstalk between the two differential signal groups. Wherein, the second interval L2 can be set to be 0.45-0.55 mm, and the third interval L3 can be set to be 0.45-0.55 mm.
Further, referring to fig. 8 and 5, the width K1 of each conductor in the ultra-thin bending-resistant cable 2 is equal, the width K2 of each pad on the printed circuit board 1 is equal, and the width K1 of each conductor is preferably greater than the width of each pad K2. By this arrangement, it is possible to prevent occurrence of solder overflow when the printed circuit board 1 is soldered to the ultra-thin bending-resistant cable 2. Wherein the width K1 of each conductor may be set to 0.25 mm-0.35 mm, and the width K2 of each bonding pad may be set to 0.2 mm-0.3 mm.
Referring to fig. 1 and 9, when the ultra-thin bending-resistant cable 2 is electrically connected to the printed circuit board 1, the front end of the ultra-thin bending-resistant cable 2 is peeled to expose the upper conductor 211 and the lower conductor 212, and the exposed upper conductor 211 and lower conductor 212 are automatically and symmetrically soldered to the upper pad 12 and the lower pad 13 of the printed circuit board 1, so that the electrical connection between the ultra-thin bending-resistant cable and the printed circuit board is realized.
It will be appreciated that the upper layer pad 12/lower layer pad 13 of the printed circuit board 1 shown in the above embodiment includes two sets of butt pads 120/130, respectively, while the upper layer conductor 211/lower layer conductor 212 of the ultra-thin flex cable 2 includes two sets of differential signal sets 2110/2120, respectively, but is not limited to the design of n=2 described in this embodiment. The ultrathin bending-resistant cable assembly 100 provided in this embodiment may be increased or decreased according to a product transmission manner, for example, when only 6 differential signal sets are needed, i.e., n=6/2=3, the upper pad 12/lower pad 13 of the printed circuit board 1 is respectively provided with three butt-joint pads 120/130, and the upper conductor 211/lower conductor 212 of the ultrathin bending-resistant cable 2 is respectively provided with three differential signal sets 2110/2120 (specifically, two differential signal sets are needed to be arranged symmetrically up and down, and 12 conductors are arranged in parallel in each set). In other embodiments, N may be equal to 4, 5, 6, … …, and will not be described in detail herein.
Referring to fig. 10, an embodiment of the present invention provides a method for manufacturing an ultrathin bending-resistant cable assembly, which includes steps S101 to S105:
s101, providing a printed circuit board, wherein the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body and a lower layer bonding pad arranged on the lower layer surface of the circuit board body;
specifically, the upper layer bonding pads are formed by arranging N4 bonding pads in a row in parallel, the lower layer bonding pads are formed by arranging N4 bonding pads in a row in parallel, the upper layer bonding pads and the lower layer bonding pads are both arranged close to the rear end of the circuit board body, and each bonding pad of the upper layer bonding pads and each bonding pad of the lower layer bonding pads are arranged in a one-to-one symmetry; the upper bonding pad and the lower bonding pad comprise N groups of butt bonding pads, each group of butt bonding pads form a group of butt bonding pads, and each group of butt bonding pads form ground-signal-ground arrangement from left to right; wherein N is more than or equal to 1;
s102, providing N.8 conductors, arranging the N.8 conductors side by side and symmetrically arranging an upper layer and a lower layer in a combined way, wherein the upper layer of conductors are formed by arranging N.4 conductors in a row in parallel, and the lower layer of conductors are formed by arranging N.4 conductors in a row in parallel;
wherein a distance between a bottom end of the upper layer conductor and a top end of the lower layer conductor constitutes a first pitch equal to a thickness of the printed circuit board defined by a vertical distance between a surface of the upper layer pad and a surface of the lower layer pad; the upper layer conductors and the lower layer conductors comprise N groups of differential signal groups, and four adjacent conductors in the upper layer conductors and the lower layer conductors form one group of differential signal groups; the distance between two adjacent conductors in each differential signal group forms a second interval, and the second interval is equal to the distance between two adjacent bonding pads in each butt bonding pad group of the printed circuit board; the distance between two adjacent differential signal groups of each layer of conductor forms a third interval, and the third interval is equal to the distance between two adjacent butt joint bonding pads of each layer of bonding pad of the printed circuit board;
s103, providing an insulating material, and bonding the upper conductors and the lower conductors which are symmetrically arranged and combined together through high-temperature dissolution of the insulating material so as to form an ultrathin flat cable;
s104, providing a shielding film, and coating the shielding film outside the flat cable in a straight wrapping mode, so that an ultrathin bending-resistant cable is formed;
s105, peeling the front end of the ultrathin bending-resistant cable to expose the upper conductor and the lower conductor, and welding the exposed upper conductor and lower conductor to an upper bonding pad and a lower bonding pad of the printed circuit board in an automatic symmetrical mode, so that the electric connection between the ultrathin bending-resistant cable and the printed circuit board is realized.
Preferably, the insulating material is insulating plastic, and the insulating plastic is made of a material with high temperature resistance, bending resistance and low dielectric coefficient.
Preferably, the second pitch is defined by a distance between central axes of adjacent two conductors in each differential signal group, and the distance between adjacent two bonding pads in each group of bonding pads of the printed circuit board refers to the distance between central axes of adjacent two bonding pads in each group of bonding pads; the third distance is defined by the distance between the central axes of two adjacent conductors between two adjacent differential signal groups of each layer of conductor, and the distance between two adjacent abutting bonding pads of each layer of bonding pad of the printed circuit board refers to the distance between the central axes of two adjacent abutting bonding pads of each layer of bonding pad; wherein the third pitch is equal to or greater than the second pitch.
In specific implementation, the first spacing is 0.55 mm-1.25 mm, the second spacing is 0.45 mm-0.55 mm, the third spacing is 0.45 mm-0.55 mm, the width of each conductor is 0.25 mm-0.35 mm, and the width of each bonding pad is 0.2 mm-0.3 mm.
In addition, the width of each conductor is equal, the width of each bonding pad is equal, and the width of each conductor is larger than the width of each bonding pad.
It can be understood that, the specific structure of the ultrathin bending-resistant cable assembly manufactured by the manufacturing method of the ultrathin bending-resistant cable assembly provided by the embodiment can be referred to the related description of the above embodiment, and the description is omitted here.
In summary, compared with the prior art, the ultrathin bending-resistant cable assembly and the manufacturing method thereof provided by the embodiment of the invention have the following technical effects:
(1) The ultrathin bending-resistant cable provided by the invention comprises a plurality of signal conductor combinations, and the conductor combinations can be formed by fusing only one insulation according to practical application, so that the manufacturing process is simple.
(2) The ultrathin bending-resistant cable provided by the invention can be formed by bonding the cable only by one time, so that the space occupied by the cable in a case, a 5G base station, a server, a data center and the like is greatly reduced, and the use weight of the product is also reduced.
(3) The ultrathin bending-resistant cable assembly provided by the invention has the ultra-strong multiple bending-resistant property and memory property, and the cable can be bent for multiple times at any angle of 45 degrees, 90 degrees and the like according to practical application, so that products can be conveniently routed in the interior of products such as switches, 5G base stations, servers, notebook computers and the like.
(4) The ultrathin bending-resistant cable provided by the invention designs the distance between the upper row metal conductor and the lower row metal conductor according to the thickness of the PCB of the double-sided bonding pad, thereby meeting the requirement of an automatic processing technology, namely the cable can be directly and symmetrically welded on the PCB of the double-sided bonding pad through automation after being peeled automatically, and the signal stability and the impedance consistency are improved.
(5) The ultrathin bending-resistant cable provided by the invention can be increased or decreased according to the transmission mode of the product, and if only 6 groups of differential signals are needed, only 12 conductors are needed to be arranged up and down symmetrically.
(6) The ultrathin bending-resistant cable provided by the invention has good flame retardant effect, can play a good role in protecting signal transmission under the conditions of sudden disasters such as high temperature and fire, and ensures that the signal transmission can normally transmit signals and work under the conditions of high temperature anomalies such as fire.
The foregoing disclosure is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, as it is understood by those skilled in the art that all or part of the above-described embodiments may be practiced without resorting to the equivalent thereof, which is intended to fall within the scope of the invention as defined by the appended claims.
Claims (10)
1. The ultrathin bending-resistant cable assembly is characterized by comprising an ultrathin bending-resistant cable and a printed circuit board electrically connected with the ultrathin bending-resistant cable;
the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body and a lower layer bonding pad arranged on the lower layer surface of the circuit board body, wherein the upper layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the lower layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the upper layer bonding pad and the lower layer bonding pad are both arranged close to the rear end of the circuit board body, and each bonding pad of the upper layer bonding pad and each bonding pad of the lower layer bonding pad are arranged symmetrically one by one; the upper bonding pad and the lower bonding pad comprise N groups of butt bonding pads, each group of butt bonding pads form a group of butt bonding pads, and each group of butt bonding pads form ground-signal-ground arrangement from left to right; wherein N is more than or equal to 1;
the ultrathin bending-resistant cable comprises a conductor layer, an adhesive layer and a shielding film layer, wherein the conductor layer comprises an upper conductor and a lower conductor, the upper conductor is formed by arranging N4 conductors in a row in parallel, the lower conductor is formed by arranging N4 conductors in a row in parallel, and each conductor of the upper conductor and each conductor of the lower conductor are symmetrically arranged one by one; the bonding layer is made of insulating materials, the arranged upper conductors and the arranged lower conductors are bonded together through high-temperature dissolution, so that an ultrathin flat cable is formed, and the shielding film layer is coated outside the flat cable in a direct-wrapping mode, so that the ultrathin bending-resistant cable is formed;
wherein a distance between a bottom end of the upper layer conductor and a top end of the lower layer conductor constitutes a first pitch equal to a thickness of the printed circuit board defined by a vertical distance between a surface of the upper layer pad and a surface of the lower layer pad; the upper layer conductors and the lower layer conductors comprise N groups of differential signal groups, and four adjacent conductors in the upper layer conductors and the lower layer conductors form one group of differential signal groups; the distance between two adjacent conductors in each differential signal group forms a second interval, and the second interval is equal to the distance between two adjacent bonding pads in each butt bonding pad group of the printed circuit board; the distance between two adjacent differential signal groups of each layer of conductor forms a third interval, and the third interval is equal to the distance between two adjacent butt joint bonding pads of each layer of bonding pad of the printed circuit board;
the front end of the ultrathin bending-resistant cable is exposed out of the upper layer conductor and the lower layer conductor after being peeled, and the exposed upper layer conductor and lower layer conductor are welded onto the upper layer bonding pad and the lower layer bonding pad of the printed circuit board in an automatic symmetrical mode, so that the electric connection between the ultrathin bending-resistant cable and the printed circuit board is realized.
2. The ultra-thin flex cable assembly according to claim 1, wherein said insulating material is an insulating plastic made of a material having high temperature resistance, flex resistance and low dielectric constant.
3. The ultra-thin flex cable assembly of claim 1, wherein said second pitch is defined by the distance between the central axes of adjacent two conductors in each set of differential signal sets, the distance between adjacent two pads in each set of landing pads of said printed circuit board being the distance between the central axes of adjacent two pads in each set of landing pads; the third distance is defined by the distance between the central axes of two adjacent conductors between two adjacent differential signal groups of each layer of conductor, and the distance between two adjacent abutting bonding pads of each layer of bonding pad of the printed circuit board refers to the distance between the central axes of two adjacent abutting bonding pads of each layer of bonding pad; wherein the third pitch is equal to or greater than the second pitch.
4. The ultra-thin flex cable assembly of claim 3 wherein each of said conductors has an equal width, each of said pads has an equal width, and each of said conductors has a width greater than the width of each of said pads.
5. The ultra-thin flex cable assembly of claim 4 wherein said first spacing is between 0.55mm and 1.25mm, said second spacing is between 0.45mm and 0.55mm, said third spacing is between 0.45mm and 0.55mm, each of said conductors has a width of between 0.25mm and 0.35mm, and each of said bond pads has a width of between 0.2mm and 0.3mm.
6. The manufacturing method of the ultrathin bending-resistant cable assembly is characterized by comprising the following steps of:
the method comprises the steps that a printed circuit board is provided, the printed circuit board comprises a circuit board body, an upper layer bonding pad arranged on the upper layer surface of the circuit board body and a lower layer bonding pad arranged on the lower layer surface of the circuit board body, the upper layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the lower layer bonding pad is formed by arranging N4 bonding pads in a row in parallel, the upper layer bonding pad and the lower layer bonding pad are both arranged close to the rear end of the circuit board body, and each bonding pad of the upper layer bonding pad and each bonding pad of the lower layer bonding pad are arranged in a one-to-one symmetry manner; the upper bonding pad and the lower bonding pad comprise N groups of butt bonding pads, each group of butt bonding pads form a group of butt bonding pads, and each group of butt bonding pads form ground-signal-ground arrangement from left to right; wherein N is more than or equal to 1;
providing N.8conductors, arranging N.8conductors side by side and symmetrically arranging an upper layer and a lower layer in a combined way, wherein the upper layer of conductors are formed by arranging N.4conductors in a row in parallel, and the lower layer of conductors are formed by arranging N.4conductors in a row in parallel; wherein a distance between a bottom end of the upper layer conductor and a top end of the lower layer conductor constitutes a first pitch equal to a thickness of the printed circuit board defined by a vertical distance between a surface of the upper layer pad and a surface of the lower layer pad; the upper layer conductors and the lower layer conductors comprise N groups of differential signal groups, and four adjacent conductors in the upper layer conductors and the lower layer conductors form one group of differential signal groups; the distance between two adjacent conductors in each differential signal group forms a second interval, and the second interval is equal to the distance between two adjacent bonding pads in each butt bonding pad group of the printed circuit board; the distance between two adjacent differential signal groups of each layer of conductor forms a third interval, and the third interval is equal to the distance between two adjacent butt joint bonding pads of each layer of bonding pad of the printed circuit board;
providing an insulating material, and bonding upper conductors and lower conductors which are symmetrically arranged and combined together by the insulating material through high-temperature dissolution to form an ultrathin flat cable;
providing a shielding film, and coating the shielding film outside the flat cable in a direct-wrapping mode, so that an ultrathin bending-resistant cable is formed;
the front end of the ultrathin bending-resistant cable is peeled to expose the upper layer conductor and the lower layer conductor, and the exposed upper layer conductor and lower layer conductor are welded to an upper layer bonding pad and a lower layer bonding pad of the printed circuit board in an automatic symmetrical mode, so that the electric connection between the ultrathin bending-resistant cable and the printed circuit board is realized.
7. The method of claim 6, wherein the insulating material is an insulating plastic, and the insulating plastic is made of a material with high temperature resistance, bending resistance and low dielectric coefficient.
8. The method of manufacturing an ultra-thin flex cable assembly according to claim 6, wherein said second pitch is defined by the distance between the central axes of adjacent two conductors in each set of differential signal sets, the distance between adjacent two pads in each set of bond pads of said printed circuit board being the distance between the central axes of adjacent two pads in each set of bond pads; the third distance is defined by the distance between the central axes of two adjacent conductors between two adjacent differential signal groups of each layer of conductor, and the distance between two adjacent abutting bonding pads of each layer of bonding pad of the printed circuit board refers to the distance between the central axes of two adjacent abutting bonding pads of each layer of bonding pad; wherein the third pitch is equal to or greater than the second pitch.
9. The method of manufacturing an ultra-thin flex cable assembly according to claim 8, wherein each of said conductors has an equal width, each of said pads has an equal width, and each of said conductors has a width greater than a width of each of said pads.
10. The method of manufacturing an ultra-thin flex cable assembly according to claim 9, wherein said first pitch is between 0.55mm and 1.25mm, said second pitch is between 0.45mm and 0.55mm, said third pitch is between 0.45mm and 0.55mm, each of said conductors has a width between 0.25mm and 0.35mm, and each of said bonding pads has a width between 0.2mm and 0.3mm.
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