CN114265376B - ZMD31050 chip debugging method and batch debugging system - Google Patents
ZMD31050 chip debugging method and batch debugging system Download PDFInfo
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Abstract
The invention discloses a method for debugging ZMD31050 chips and a batch debugging system, wherein the method comprises the following steps: firstly, enabling a ZMD31050 chip to enter a CM working mode, and collecting digital automatic zero compensation values of port No. 2 of the ZMD31050 chip under different temperature environments; taking the digital automatic zero compensation value and the pressure signal acquisition value coefficients at different points under different temperature environments as the input of a dynamic link library function to obtain coefficients for calculating a calibration formula; obtaining a check bit of the current debugged chip according to the coefficient used for calculating the calibration formula and the related instruction; the coefficients, check bits and related sending instructions used for calculating the calibration formula are updated to the configuration in the RAM of the ZMD31050 chip, so that the voltage output value of the ZMD31050 chip in the NOM mode is changed, and the ZMD31050 chip is debugged. The invention has the advantages of high automation degree, batch debugging, high debugging efficiency and precision and the like.
Description
Technical Field
The invention mainly relates to the technical field of chip debugging, in particular to a ZMD31050 chip debugging method and a batch debugging system.
Background
In recent years, with the rapid development of electronic technology and information technology, various types of sensors have been put into various fields of scientific research and engineering technology. Therefore, a signal conditioner with high performance and a digital interface is selected, the sensor signal is converted into a digital signal to be transmitted and displayed, and the influence of industrial control field interference is particularly critical. The ZMD31050 is a high-integration and high-precision bridge sensor signal processing control circuit, can convert sensor signals into digital signals for output, and has the characteristics of simple peripheral circuit, low energy consumption, safety, reliability and the like. The ZMD31050 chip is commonly used for developing high-performance digital sensor products, including automobile sensors, industrial sensors, common sensors and the like, and is a bridge type sensing and temperature sensing signal control circuit with high-precision amplification and sensing calibration characteristics. Is particularly suitable for pressure, torque, acceleration, angle, displacement and rotation sensors, and has been widely designed for industrial, medical and civil consumption fields.
The ZMD31050 chip needs to be accurately debugged when outputting an accurate signal, and the current debugging method is to manually complete the debugging by using ZMD31050 debugging software of ZMD company. The disadvantage of this debug method is:
1. the debugging result is inaccurate: the manual calculation is needed in the manual debugging process of the ZMD31050 chip, and the accurate calculation process is extremely complex compared with the manual operation, so that the manual debugging is only a rough calculation process according to the manual experience. This results in that the ZMD31050 chip debug result is often only at the edge of the normal range, even when the chip performance is poor, the debug result is not in the normal range;
2. batch debugging cannot be completed: the manual debugging process is complicated, one-to-one manual calculation is needed in the debugging process, and the debugging of a large number of chips is difficult to manually carry out;
3. the efficiency of the debugging process is low: the debugging process needs a great deal of manual participation, so that the ZMD31050 chip debugging process can only be executed in the working time, unmanned operation can not be realized, and the debugging can be carried out within 24 hours.
The reason for the above disadvantage is that the ZMD31050 chip is directly debugged using the host software without going beyond the debug software provided by ZMD corporation. The communication protocol of the ZMD31050 chip is complex and the calculation algorithm involved in the debugging process is also complex, which makes the method of directly debugging the ZMD31050 chip by using the upper computer software difficult to realize. Therefore, only the method for directly debugging the ZMD31050 chip by the upper computer software is designed, an automatic ZMD31050 chip debugging system can be designed according to the method, and the ZMD31050 chip is automatically debugged in a large batch and more accurately.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: aiming at the technical problems existing in the prior art, the invention provides a ZMD31050 chip debugging method and a batch debugging system with high debugging efficiency and accurate debugging.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
a method for debugging a ZMD31050 chip comprises the following steps:
firstly, enabling a ZMD31050 chip to enter a CM working mode, and collecting digital automatic zero compensation values of port No. 2 of the ZMD31050 chip under different temperature environments;
taking the digital automatic zero compensation value and the pressure signal acquisition value coefficients at different points under different temperature environments as the input of a dynamic link library function to obtain coefficients for calculating a calibration formula;
obtaining a check bit of the current debugged chip according to the coefficient used for calculating the calibration formula and the related instruction;
the coefficients, check bits and related sending instructions used for calculating the calibration formula are updated to the configuration in the RAM of the ZMD31050 chip, so that the voltage output value of the ZMD31050 chip in the NOM mode is changed, and the ZMD31050 chip is debugged.
As a further improvement of the above technical scheme:
when the ZMD31050 chip is debugged for the first time, the pressure signal acquisition value coefficients of different points are set as initial values; after one-time debugging is completed, voltage signals output by ports 1# of the ZMD31050 chip under three pressure points are measured and compared with normal range values; if the measured value is not in the normal range, modifying the current point pressure signal acquisition coefficient according to the relation that the different point pressure signal acquisition value coefficients are inversely proportional to the voltage signal output by the port 1# and gradually approach to obtain a new pressure signal acquisition value coefficient; and then a new round of debugging is performed, the process is repeated until the voltage signals output by the port 1# under each pressure are in a normal range, and the current modified sending instruction is used for updating the configuration in the RAM so as to finish the accurate debugging of the ZMD31050 chip.
The digital automatic zero compensation values under different temperature environments comprise a digital automatic zero compensation zero pressure signal, a full-scale pressure signal and a temperature signal under a first preset temperature; a digital automatic zero compensation zero point pressure signal, a middle point pressure signal, a full scale pressure signal and a temperature signal at a second preset temperature; a digital automatic zero compensation zero pressure signal, a full-scale pressure signal and a temperature signal at a third preset temperature; wherein the first preset temperature < the second preset temperature < the third preset temperature.
The pressure signal acquisition value coefficients of different points comprise zero pressure signal acquisition value coefficients, middle point pressure signal acquisition value coefficients and fullness pressure signal acquisition value coefficients.
The coefficients used to calculate the calibration formula include bridge offset, amplification, second order nonlinearity, first order bridge offset, second order bridge offset, first order amplification, and second order amplification.
The invention also discloses a debugging device of the ZMD31050 chip, which comprises a pressure control module, a temperature control module, a power supply module, a signal acquisition module, a chip communication module and an upper computer; the pressure control module is used for changing the ambient pressure; the temperature control module is used for changing the ambient temperature; the power supply module is used for supplying power to the chip and each module; the signal acquisition module is used for measuring the 1# output of the port of the ZMD31050 chip; the chip communication module is used for collecting the 2# output of the ZMD31050 chip port, and the upper computer is respectively connected with the pressure control module, the temperature control module, the power supply module, the signal acquisition module and the chip communication module and used for debugging the ZMD31050 chip according to the steps of the debugging method of the ZMD31050 chip.
As a further improvement of the above technical scheme:
the signal acquisition module is connected with the switch modules respectively through the multichannel switching modules and used for realizing that one serial port is connected with a plurality of relays, and then the serial port is switched and connected to different ZMD31050 chips so as to finish debugging of batch chips.
The serial port conversion module is respectively connected with the chip communication module and the multipath channel switching module and is used for realizing serial port conversion of USB and I2C.
The invention further discloses a debugging system of the ZMD31050 chip, which comprises the following steps:
the first program module is used for enabling the ZMD31050 chip to enter a CM working mode and collecting digital automatic zero compensation values of a port No. 2 of the ZMD31050 chip under different temperature environments;
the second program module is used for taking the digital automatic zero compensation value and the pressure signal acquisition value coefficient at different points under the different temperature environments as the input of a dynamic link library function to obtain a coefficient for calculating a calibration formula;
the third program module is used for obtaining the check bit of the current debugged chip according to the coefficient used for calculating the calibration formula and the related instruction;
and a fourth program module, configured to update the configuration in the RAM of the ZMD31050 chip by using the coefficient, the check bit and the related transmission instruction for calculating the calibration formula, so that the voltage output value of the ZMD31050 chip in the NOM mode is changed, and thus the ZMD31050 chip is debugged.
The invention also discloses a computer device comprising a memory and a processor, the memory having stored thereon a computer program which, when executed by the processor, performs the steps of the method of debugging a ZMD31050 chip as described above.
Compared with the prior art, the invention has the advantages that:
the debugging method of the invention completes the accurate calculation process through the upper computer software, carries out strict calculation to obtain the debugging result, and can avoid errors caused by manual calculation, thus the method is more accurate compared with the manual debugging method.
Compared with a manual debugging method, the batch ZMD31050 chip automatic debugging system can realize batch chip debugging, the debugging process of the ZMD31050 chip is executed step by step through the upper computer, and data in the debugging process are stored in the MySQL database for subsequent calculation or debugging, so that the batch chip debugging is realized.
Compared with a manual debugging method, the batch ZMD31050 chip automatic debugging system provided by the invention has the advantages that the automatic debugging is realized, the efficiency is higher, and the ZMD31050 chips can be debugged at any time through an upper computer, so that the efficiency is greatly improved.
Drawings
FIG. 1 is a flow chart of a communication method of a ZMD31050 chip of the present invention.
FIG. 2 is a flow chart of a method for debugging a ZMD31050 chip of the present invention in an embodiment.
FIG. 3 is a flow chart of an embodiment of a method for precisely debugging a ZMD31050 chip of the present invention.
FIG. 4 is a block diagram of an embodiment of a ZMD31050 chip auto-debug system of the present invention.
Fig. 5 is a block diagram of a ZMD31050 chip signal acquisition system of the invention in an embodiment.
Fig. 6 is a block diagram of a ZMD31050 chip signal communication system of the present invention in an embodiment.
FIG. 7 is a flowchart of a ZMD31050 chip debug method according to an embodiment of the present invention.
Detailed Description
The invention is further described below with reference to the drawings and specific examples.
The control circuit of the ZMD31050 chip consists of a micro control regulator (CMC) and a control circuit module, wherein the control circuit module comprises an A/D converter, a digital interface control circuit, a PWM and digital interface circuit, and the working modes of all the devices are configured through an EEPROM. CMC is not only a controller in the whole measurement process, but also enables the debugging of sensor signals. The debugging is mainly used for eliminating the influence of drift, zero offset and temperature drift of the amplifier, nonlinearity of the front-end amplifier and the A/D conversion circuit on the measurement result. The debugging of the ZMD31050 chip is realized through a digital serial port, and the digital interface supports I 2 C and SPI protocol. The debugging process of the ZMD31050 chip is completed based on the calibration formula stored in ROM and the calibration parameters stored in EEPROM.
According to the ZMD31050 chip debugging method provided by the embodiment of the invention, the upper computer and the ZMD31050 chip are communicated firstly, and then the ZMD31050 chip debugging is completed, and specifically, the communication process of the ZMD31050 chip is shown in fig. 1:
the ZMD31050 chip has three different modes of operation: open Mode (OM), normal Operation Mode (NOM), and Command Mode (CM). In both OM and NOM operating states, only a portion of the instructions may be executed. In order to debug the ZMD31050 chip, the ZMD31050 chip needs to be switched to the CM operating state, and then the instruction is sent to perform configuration modification. The ZMD31050 chip will only go into OM mode directly after first powering up, and any instruction sent at this time is to go into NOM mode except to send the instruction to enter CM mode. After the first power-on, no matter the mode enters the NOM working mode from the OM working mode or the CM working mode, the NOM working mode is directly entered after the power-off and the restarting are carried out again.
The ZMD31050 chip is self-initialized after being electrified in the NOM working mode, firstly, the content of the RAM in the chip is copied into the EEPROM, then the content in the EEPROM is configured for the chip, and after the configuration is completed, the chip starts to work normally and outputs a voltage signal at a port 1#. When the voltage signal output by the port 1# is not in the normal range, the ZMD31050 chip needs to be debugged, the chip enters the CM mode from the NOM mode, then related instructions are sent to collect the pressure signal and the temperature signal output by the port 2#, the collected data is subjected to algorithm calculation to modify the sending instructions to update the content in the RAM, and finally the normal output value of the ZMD31050 chip in the NOM mode is obtained, so that the debugging of the ZMD31050 chip is completed, and the specific process is as follows:
firstly, an upper computer is required to communicate with a ZMD31050 chip, under a CM working mode through sending an instruction, digital automatic zero compensation values output by ports 2# of the chip under different environments are acquired, and digital automatic zero compensation zero pressure signals, full-scale pressure signals and temperature signals of the ZMD31050 chip under lower temperature (first preset temperature) are respectively required to be acquired; a digital automatic zero-compensation zero-point pressure signal, a middle-point pressure signal, a full-scale pressure signal and a temperature signal at a medium temperature (a second preset temperature); a digital automatic zero-compensation zero-point pressure signal, a full-scale pressure signal and a temperature signal at a higher temperature (preset third temperature);
then, the ten digital automatic zero compensation values and zero pressure signal acquisition value coefficients (the range is 0-1, the initial value is 0.1), the middle point pressure signal acquisition value coefficient (the range is 0-1, the initial value is 0.5) and the full pressure signal acquisition value coefficient (the range is 0-1, the initial value is 0.9) acquired under different environments are required to be used as the input of a dynamic link library function to obtain seven coefficients for calculating an RBIC microcontroller operation calibration formula, wherein the seven coefficients are bridge offset, amplification factor, second-order nonlinearity, temperature coefficient (first-order bridge offset), temperature coefficient (second-order bridge offset), temperature coefficient (first-order amplification factor) and temperature coefficient (second-order amplification factor) respectively;
obtaining the check bit of the current debugged chip through formula calculation by using the seven coefficients obtained through calculation and related instructions;
and finally, using the seven calculated coefficients, the check bits obtained through formula calculation and related sending instructions to update configuration in the RAM, so that the voltage output value of the ZMD31050 chip in the NOM mode is changed, and thus, debugging the ZMD31050 chip.
In a specific embodiment, the ZMD31050 chip may be debugged by the above method, but if the chip is required to be accurately debugged, the zero-point pressure signal acquisition value coefficient, the intermediate-point pressure signal acquisition value coefficient and the full-scale pressure signal acquisition value coefficient need to be accurately acquired. Through multiple debugging experiments, the relation that the signal acquisition value coefficients of three pressure points are inversely proportional to and gradually approximate to the voltage signal output by the port 1# is found, so the accurate debugging method specifically comprises the following steps:
when the ZMD31050 chip is debugged for the first time, the zero point pressure signal acquisition value coefficient, the middle point pressure signal acquisition value coefficient and the fullness pressure signal acquisition value coefficient are set as initial values; after one-time debugging is completed, the voltage signal output by the port 1# under three pressure points is measured by using a digital multimeter and is compared with a normal range value. And if the measured value is not in the normal range, modifying the current point pressure signal acquisition coefficient according to the inverse ratio and the gradually approaching relation. And comparing the acquired value coefficients of the three new pressure signals, performing a new round of debugging, repeating the process until the voltage signals output by the port 1# under each pressure are in a normal range, and using the currently modified transmitting instruction to update the configuration in the RAM to finish the accurate debugging of the ZMD31050 chip, as shown in figure 3.
As shown in fig. 4, the embodiment of the invention also discloses a device for debugging the ZMD31050 chip, which comprises a pressure control module, a temperature control module, a power supply module, a signal acquisition module, a chip communication module and an upper computer; the pressure control module is used for changing the ambient pressure; the temperature control module is used for changing the ambient temperature; the power supply module is used for supplying power to the chip and each module; the signal acquisition module is used for measuring the 1# output of the port of the ZMD31050 chip; the chip communication module is used for collecting the 2# output of the ZMD31050 chip port, and the upper computer is respectively connected with the pressure control module, the temperature control module, the power supply module, the signal acquisition module and the chip communication module and used for debugging the ZMD31050 chip according to the steps of the debugging method of the ZMD31050 chip.
The debugging method is to debug one ZMD31050 chip, and debug a large number of chips, a plurality of switch modules (such as relays) are connected by using a multi-channel switching unit (multi-channel switching board), namely a serial port, each relay is connected with the ZMD31050 chip, when the relay in the multi-channel switching board is switched to the current relay through an upper computer, the rest relays are in a closed state, and the chips connected with the current relay can be operated. Therefore, the operation of batch ZMD31050 chips can be completed without changing serial ports by switching the relays in the channel switching board one by one.
For the signal acquisition module, the power supply module supplies power to the batch chips, the chips are switched one by one through the multi-channel switching board, the signal acquisition of batch ZMD31050 chips can be completed through the digital multimeter, and meanwhile, the upper computer can process the acquired signal data, as shown in fig. 5. And is opposite toIn the chip communication module, the ZMD31050 chip is I 2 C communication protocol, thus requiring addition of USB and I at the exit of the multi-channel switch board 2 And C, the serial port conversion module and the chip communication are in a cyclic reciprocating process, so that the upper computer is used for sending data to the chip and receiving data returned by the chip, as shown in fig. 6.
Batch debugging process: the upper computer software supplies power to the batch ZMD31050 chips through the power supply module, then controls the pressure control module and the temperature control module to change the pressure and the temperature of the environment where the chips are located, and then the upper computer collects a plurality of digital automatic zero compensation values output by the batch chips under different temperatures and pressures through the chip communication module and stores the digital automatic zero compensation values in the MySQL database for subsequent chip debugging;
after the acquisition and storage of the digital automatic zero compensation values are finished, the upper computer completes the debugging of the batch chips through the chip communication module, and the signal acquisition module measures the signal output values of the batch chips after the debugging is finished. And the upper computer software compares the signal output value under each pressure point with the normal range value through an algorithm, updates the coefficient of the signal acquisition value under each pressure point, and then carries out a new round of debugging. And (3) repeating the steps circularly until all products finish accurate debugging, and considering that the ZMD31050 chip is automatically debugged, wherein the execution flow of the whole upper computer software is shown in fig. 7.
The ZMD31050 chip automatic debugging method can realize batch, efficient and accurate automatic debugging of the ZMD31050 chips. According to the invention, the upper computer is communicated with the ZMD31050 chip, chip debugging is completed according to the characteristics of the ZMD31050 chip, and meanwhile, an automatic batch ZMD31050 chip debugging system is designed according to the debugging method, so that automation, large batch and more accurate debugging of the ZMD31050 chips are realized.
The debugging method of the invention completes the accurate calculation process through the upper computer software, carries out strict calculation to obtain the debugging result, and can avoid errors caused by manual calculation, thus the method is more accurate compared with the manual debugging method.
Compared with a manual debugging method, the batch ZMD31050 chip automatic debugging system can realize batch chip debugging, the debugging process of the ZMD31050 chip is executed step by step through the upper computer, and data in the debugging process are stored in the MySQL database for subsequent calculation or debugging, so that the batch chip debugging is realized.
Compared with a manual debugging method, the batch ZMD31050 chip automatic debugging system provided by the invention has the advantages that the automatic debugging is realized, the efficiency is higher, and the ZMD31050 chips can be debugged at any time through an upper computer, so that the efficiency is greatly improved.
The embodiment of the invention also discloses a debugging system of the ZMD31050 chip, which comprises the following steps:
the first program module is used for enabling the ZMD31050 chip to enter a CM working mode and collecting digital automatic zero compensation values of a port No. 2 of the ZMD31050 chip under different temperature environments;
the second program module is used for taking the digital automatic zero compensation value and the pressure signal acquisition value coefficient at different points under the different temperature environments as the input of a dynamic link library function to obtain a coefficient for calculating a calibration formula;
the third program module is used for obtaining the check bit of the current debugged chip according to the coefficient used for calculating the calibration formula and the related instruction;
and a fourth program module, configured to update the configuration in the RAM of the ZMD31050 chip by using the coefficient, the check bit and the related transmission instruction for calculating the calibration formula, so that the voltage output value of the ZMD31050 chip in the NOM mode is changed, and thus the ZMD31050 chip is debugged.
The debugging system of the invention corresponds to the debugging method and has the advantages as described in the debugging method.
The embodiment of the invention also discloses a computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, performs the steps of the method as described above. The embodiment of the invention further discloses a computer device comprising a memory and a processor, the memory having stored thereon a computer program which, when executed by the processor, performs the steps of the method as described above.
The present invention may be implemented by implementing all or part of the procedures in the methods of the embodiments described above, or by instructing the relevant hardware by a computer program, which may be stored in a computer readable storage medium, and which when executed by a processor, may implement the steps of the embodiments of the methods described above. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, executable files or in some intermediate form, etc. The computer readable medium may include: any entity or device capable of carrying computer program code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), an electrical carrier signal, a telecommunications signal, a software distribution medium, and so forth. The memory may be used to store computer programs and/or modules, and the processor performs various functions by executing or executing the computer programs and/or modules stored in the memory, and invoking data stored in the memory. The memory may include high-speed random access memory, and may also include non-volatile memory, such as a hard disk, memory, plug-in hard disk, smart Media Card (SMC), secure Digital (SD) Card, flash Card (Flash Card), at least one disk storage device, flash memory device, or other volatile solid state storage device, etc.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to the invention without departing from the principles thereof are intended to be within the scope of the invention as set forth in the following claims.
Claims (6)
1. The method for debugging the ZMD31050 chip is characterized by comprising the following steps of:
firstly, enabling a ZMD31050 chip to enter a CM working mode, and collecting digital automatic zero compensation values of a port 2 of the ZMD31050 chip under different temperature environments;
taking the digital automatic zero compensation value and the pressure signal acquisition value coefficients at different points under different temperature environments as the input of a dynamic link library function to obtain coefficients for calculating a calibration formula;
obtaining the check bit of the current debugged chip according to the coefficient for calculating the calibration formula;
updating the configuration in the RAM of the ZMD31050 chip by using coefficients and check bits for calculating a calibration formula, so that the voltage output value of the ZMD31050 chip in the NOM mode is changed, and thus the ZMD31050 chip is debugged;
when the ZMD31050 chip is debugged for the first time, the pressure signal acquisition value coefficients of different points are set as initial values; after one-time debugging is completed, voltage signals output by the ZMD31050 chip port 1 under three pressure points are measured and compared with normal range values; if the measured value is not in the normal range, modifying the current point pressure signal acquisition coefficient according to the relation that the different point pressure signal acquisition value coefficients are inversely proportional to the voltage signal output by the port 1 and gradually approach to obtain a new pressure signal acquisition value coefficient; performing a new round of debugging, and repeating the steps until the voltage signals output by the port 1 under each pressure are in a normal range, and using the current modified sending instruction to update the configuration in the RAM so as to finish the accurate debugging of the ZMD31050 chip;
the digital automatic zero compensation values under different temperature environments comprise a digital automatic zero compensation zero pressure signal, a full-scale pressure signal and a temperature signal under a first preset temperature; a digital automatic zero compensation zero point pressure signal, a middle point pressure signal, a full scale pressure signal and a temperature signal at a second preset temperature; a digital automatic zero compensation zero pressure signal, a full-scale pressure signal and a temperature signal at a third preset temperature; the first preset temperature is a low temperature, the second preset temperature is a normal temperature, and the third preset temperature is a high temperature;
the pressure signal acquisition value coefficients of different points comprise zero pressure signal acquisition value coefficients, middle point pressure signal acquisition value coefficients and fullness pressure signal acquisition value coefficients.
2. The method of claim 1, wherein the coefficients used to calculate the calibration formula include bridge offset, amplification, second order nonlinearity, first order bridge offset, second order bridge offset, first order amplification, and second order amplification.
3. The device for debugging the ZMD31050 chip is characterized by comprising a pressure control module, a temperature control module, a power supply module, a signal acquisition module, a chip communication module and an upper computer; the pressure control module is used for changing the ambient pressure; the temperature control module is used for changing the ambient temperature; the power supply module is used for supplying power to the chip and each module; the signal acquisition module is used for measuring the output of the ZMD31050 chip port 1; the chip communication module is used for collecting the output of the ZMD31050 chip port 2, and the upper computer is respectively connected with the pressure control module, the temperature control module, the power supply module, the signal acquisition module and the chip communication module and is used for debugging the ZMD31050 chip according to the steps of the debugging method of the ZMD31050 chip as claimed in any one of claims 1-2;
the signal acquisition module is connected with the switch modules respectively through the multichannel switching modules and used for realizing that one serial port is connected with a plurality of relays, and then the serial port is switched and connected to different ZMD31050 chips so as to finish debugging of batch chips.
4. The ZMD31050 chip debugging device of claim 3, further comprising a serial port conversion module, wherein the serial port conversion module is connected with the chip communication module and the multichannel switching module respectively, and is configured to implement USB and I 2 And C, serial port conversion.
5. A ZMD31050 chip debugging system for performing the steps of the ZMD31050 chip debugging method according to any one of claims 1-2, comprising:
the first program module is used for enabling the ZMD31050 chip to enter a CM working mode and collecting digital automatic zero compensation values of a port 2 of the ZMD31050 chip under different temperature environments;
the second program module is used for taking the digital automatic zero compensation value and the pressure signal acquisition value coefficient at different points under the different temperature environments as the input of a dynamic link library function to obtain a coefficient for calculating a calibration formula;
the third program module is used for obtaining the check bit of the current debugged chip according to the coefficient for calculating the calibration formula;
and a fourth program module, configured to update the configuration in the RAM of the ZMD31050 chip by calculating the coefficient and the check bit of the calibration formula, so that the voltage output value of the ZMD31050 chip in the NOM mode is changed, thereby debugging the ZMD31050 chip.
6. A computer device comprising a memory and a processor, the memory having stored thereon a computer program, wherein the computer program, when executed by the processor, performs the steps of the method of debugging a ZMD31050 chip according to any one of claims 1-2.
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