CN114265376A - Debugging method and batch debugging system for ZMD31050 chip - Google Patents
Debugging method and batch debugging system for ZMD31050 chip Download PDFInfo
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Abstract
The invention discloses a debugging method and a batch debugging system of a ZMD31050 chip, wherein the method comprises the following steps: firstly, enabling a ZMD31050 chip to enter a CM working mode, and acquiring digital automatic zero compensation values of a port 2# of the ZMD31050 chip under different temperature environments; taking the digital automatic zero compensation values under different temperature environments and the coefficients of the pressure signal acquisition values at different points as the input of a dynamic link library function to obtain coefficients for calculating a calibration formula; obtaining the check bit of the current debugged chip according to the coefficient and the related instruction for calculating the calibration formula; the coefficients, check bits and associated send instructions used to calculate the calibration equations are used to update the configuration in the RAM of the ZMD31050 chip so that the voltage output values of the ZMD31050 chip in NOM mode are changed, thereby debugging the ZMD31050 chip. The invention has the advantages of high automation degree, batch debugging, high debugging efficiency and precision and the like.
Description
Technical Field
The invention mainly relates to the technical field of chip debugging, in particular to a debugging method and a batch debugging system of a ZMD31050 chip.
Background
In recent years, with the rapid development of electronic technology and information technology, various sensors have been advanced into various fields of scientific research and engineering technology. Therefore, the selection of a high-performance signal conditioner with a digital interface to convert the sensor signal into a digital signal for transmission and display is particularly critical to solve the influence of industrial control field interference. The ZMD31050 is a high-integration and high-precision bridge type sensor signal processing control circuit, can convert sensor signals into digital signals for output, and has the characteristics of simple peripheral circuit, low energy consumption, safety, reliability and the like. The ZMD31050 chip is commonly used in high-performance digital sensor product development, including automobile sensors, industrial sensors, ordinary sensors, and the like, and is a control circuit for bridge sensing and temperature sensing signals with high-precision amplification and sensing calibration characteristics. Particularly suitable for use in pressure, torque, acceleration, angle, displacement and rotation sensors, and have been widely designed for industrial, medical and consumer applications.
The ZMD31050 chip needs to be debugged accurately if it wants to output accurate signals, and the current debugging method is to use the self-contained ZMD31050 debugging software of the ZMD company to complete debugging manually. The disadvantages of this debugging method are:
1. the debugging result is not accurate: the manual debugging process of the ZMD31050 chip requires manual calculation, and the precise calculation process is extremely complicated relative to the manual work, so the manual debugging only carries out a rough calculation process according to the human experience. This results in that the debugging result of the ZMD31050 chip is often only at the edge of the normal range, and even when the chip performance is poor, the debugging result is not in the normal range;
2. large-batch debugging cannot be completed: the manual debugging process is complicated, and one-to-one manual calculation is needed in the debugging process, so that manual large-batch chip debugging is very difficult;
3. the debugging process is inefficient: a great amount of manual work is needed in the debugging process, so that the debugging process of the ZMD31050 chip can only be executed in working time, unmanned operation cannot be realized, and debugging can be carried out in 24 hours.
The reason for this is that the ZMD31050 chip is directly debugged using the upper computer software without going over the debugging software provided by the ZMD company. The complex communication protocol of the ZMD31050 chip and the complex calculation algorithm involved in the debugging process make the method of directly debugging with the ZMD31050 chip by using upper computer software difficult to realize. Therefore, only by designing a method for directly debugging the ZMD31050 chip by upper computer software, the automatic debugging system of the ZMD31050 chip can be designed according to the method, and the automatic, large-batch and more accurate debugging of the ZMD31050 chip is realized.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: aiming at the technical problems in the prior art, the invention provides a debugging method and a batch debugging system of a ZMD31050 chip, which have high debugging efficiency and accurate debugging.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
a debugging method of a ZMD31050 chip comprises the following steps:
firstly, enabling a ZMD31050 chip to enter a CM working mode, and acquiring digital automatic zero compensation values of a port 2# of the ZMD31050 chip under different temperature environments;
taking the digital automatic zero compensation values under different temperature environments and the coefficients of the pressure signal acquisition values at different points as the input of a dynamic link library function to obtain coefficients for calculating a calibration formula;
obtaining the check bit of the current debugged chip according to the coefficient and the related instruction for calculating the calibration formula;
the coefficients, check bits and associated send instructions used to calculate the calibration equations are used to update the configuration in the RAM of the ZMD31050 chip so that the voltage output values of the ZMD31050 chip in NOM mode are changed, thereby debugging the ZMD31050 chip.
As a further improvement of the above technical solution:
setting the pressure signal acquisition value coefficients of different points as initial values when debugging a ZMD31050 chip is carried out for the first time; after one-time debugging is finished, measuring voltage signals output by a port 1# of a ZMD31050 chip under three pressure points and comparing the voltage signals with normal range values; if the measured value is not in the normal range, modifying the current point pressure signal acquisition coefficient according to the relationship that the pressure signal acquisition coefficient at different points is inversely proportional to the voltage signal output by the port 1# and approaches gradually to obtain a new pressure signal acquisition coefficient; and performing a new round of debugging, circulating until the voltage signals output by the port 1# under various pressures are in a normal range, and using the currently modified sending command to update the configuration in the RAM so as to finish the accurate debugging of the ZMD31050 chip.
The digital automatic zero compensation values under different temperature environments comprise a digital automatic zero compensation zero pressure signal, a full scale pressure signal and a temperature signal under a first preset temperature; the digital automatic zero compensation zero pressure signal, the middle point pressure signal, the full scale pressure signal and the temperature signal at a second preset temperature; a digital automatic zero compensation zero pressure signal, a full scale pressure signal and a temperature signal at a third preset temperature; wherein the first predetermined temperature < the second predetermined temperature < the third predetermined temperature.
The different-point pressure signal acquisition value coefficients comprise a zero-point pressure signal acquisition value coefficient, a middle-point pressure signal acquisition value coefficient and a full-scale pressure signal acquisition value coefficient.
The coefficients used to calculate the calibration formula include bridge offset, amplification, second order nonlinearity, first order bridge offset, second order bridge offset, first order amplification, and second order amplification.
The invention also discloses a debugging device of the ZMD31050 chip, which comprises a pressure control module, a temperature control module, a power supply module, a signal acquisition module, a chip communication module and an upper computer; the pressure control module is used for changing the ambient pressure; the temperature control module is used for changing the ambient temperature; the power supply module is used for supplying power to the chip and each module; the signal acquisition module is used for measuring port 1# output of a ZMD31050 chip; the chip communication module is used for acquiring the port 2# output of the ZMD31050 chip, and the upper computer is respectively connected with the pressure control module, the temperature control module, the power supply module, the signal acquisition module and the chip communication module and is used for debugging the ZMD31050 chip according to the steps of the debugging method of the ZMD31050 chip.
As a further improvement of the above technical solution:
the multi-channel switching module is connected with the ZMD31050 chips in a one-to-one correspondence mode, the signal acquisition module is connected with the switch modules through the multi-channel switching module and used for realizing that one serial port is connected with a plurality of relays and further switching and connecting to different ZMD31050 chips so as to finish debugging of chips in batches.
The USB serial port switching device further comprises a serial port switching module, wherein the serial port switching module is respectively connected with the chip communication module and the multi-channel switching module and is used for realizing serial port switching between the USB and the I2C.
The invention further discloses a debugging system of the ZMD31050 chip, which comprises:
the first program module is used for enabling the ZMD31050 chip to enter a CM working mode and acquiring digital automatic zero compensation values of a port 2# of the ZMD31050 chip under different temperature environments;
the second program module is used for taking the digital automatic zero compensation values under different temperature environments and the coefficients of the pressure signal acquisition values at different points as the input of a dynamic link library function to obtain coefficients for calculating a calibration formula;
the third program module is used for obtaining the check bit of the current debugged chip according to the coefficient and the related instruction for calculating the calibration formula;
and the fourth program module is used for updating the configuration in the RAM of the ZMD31050 chip by using the coefficients, check bits and related sending instructions for calculating the calibration formula, so that the voltage output value of the ZMD31050 chip in the NOM mode is changed, and the ZMD31050 chip is debugged.
The invention also discloses a computer device comprising a memory and a processor, the memory having stored thereon a computer program which, when executed by the processor, performs the steps of the debugging method of the ZMD31050 chip as described above.
Compared with the prior art, the invention has the advantages that:
the debugging method of the invention completes the accurate calculation process through the upper computer software, and obtains the debugging result by strict calculation, thereby avoiding the error generated by manual calculation, and being more accurate compared with the manual debugging method.
Compared with a manual debugging method, the batch ZMD31050 chip automatic debugging system can realize batch chip debugging, the debugging process of the ZMD31050 chips is executed step by step through the upper computer, and data in the debugging process is stored in the MySQL database for subsequent calculation or debugging, so that the batch chip debugging is realized.
Compared with a manual debugging method, the automatic debugging system for the batch ZMD31050 chips realizes automatic debugging, has higher efficiency, and can debug the ZMD31050 chips at any time through the upper computer, so that the efficiency is greatly improved.
Drawings
FIG. 1 is a flow chart of an embodiment of a communication method for a ZMD31050 chip of the present invention.
FIG. 2 is a flowchart of an embodiment of a method for debugging a ZMD31050 chip of the present invention.
FIG. 3 is a flow chart of an embodiment of the method for accurate debugging of a ZMD31050 chip of the present invention.
FIG. 4 is a block diagram of an embodiment of the ZMD31050 chip auto-debug system of the present invention.
FIG. 5 is a block diagram of an embodiment of a ZMD31050 chip signal acquisition system of the present invention.
FIG. 6 is a block diagram of an embodiment of a ZMD31050 chip signal communication system in accordance with the present invention.
FIG. 7 is a flowchart illustrating the method for debugging a ZMD31050 chip according to an embodiment of the present invention.
Detailed Description
The invention is further described below with reference to the figures and the specific embodiments of the description.
The control circuit of the ZMD31050 chip is composed of a micro-control regulator (CMC) and a control circuit module, wherein the control circuit module comprises an A/D converter,The digital interface control circuit, the PWM and digital interface circuit, the working mode of all the equipment is configured by EEPROM. The CMC is not only a controller in the whole measurement process, but also realizes debugging of sensor signals. The debugging is mainly to eliminate the influence of the drift, zero offset and temperature drift of the amplifier, and the nonlinearity of the front-end amplifier and the A/D conversion circuit on the measurement result. The debugging of the ZMD31050 chip is realized by a digital serial port, and the digital interface supports I2C and SPI protocols. The debugging process of the ZMD31050 chip is completed based on the correction formula stored in ROM and the calibration parameters stored in EEPROM.
In the ZMD31050 chip debugging method of the embodiment of the invention, an upper computer is communicated with a ZMD31050 chip firstly and then the debugging of the ZMD31050 chip is completed, specifically, the communication process of the ZMD31050 chip is shown in figure 1:
the ZMD31050 chip has three different modes of operation: open Mode (OM), Normal Operation Mode (NOM), and Command Mode (CM). In both the OM and NOM operating states, only a portion of the instructions may be executed. To debug the ZMD31050 chip, the ZMD31050 chip is switched to CM mode and then instructions are sent to modify the configuration. The ZMD31050 chip will not go into OM mode directly until it is first powered up, and it will go into NOM mode to send any instruction except the CM mode. After the power is firstly powered on, the NOM mode is directly entered no matter the OM mode enters the NOM mode or the CM mode enters the NOM mode after the power is cut off and restarted again.
In the NOM working mode, the ZMD31050 chip is self-initialized after being powered on, the RAM content in the chip is firstly copied to the EEPROM, then the EEPROM content is configured, and after the configuration is completed, the chip starts to work normally and outputs a voltage signal at port 1 #. When the voltage signal output by the port 1# is not in a normal range, the ZMD31050 chip needs to be debugged, firstly, the NOM mode enters the CM mode, then relevant instructions are sent to collect the pressure signal and the temperature signal output by the port 2#, the collected data are calculated by an algorithm to modify a sending instruction for updating the content in the RAM, and finally, the normal output value of the ZMD31050 chip in the NOM mode is obtained, so that the debugging of the ZMD31050 chip is completed, and the specific process is as follows:
firstly, an upper computer is required to communicate with a ZMD31050 chip, digital automatic zero compensation values output by a port 2# of the chip under different environments are acquired by sending an instruction to enter a CM working mode, and a digital automatic zero compensation zero pressure signal, a full pressure signal and a temperature signal of the ZMD31050 chip under a lower temperature (a first preset temperature) are respectively required to be acquired; a digital automatic zero compensation zero pressure signal, a middle point pressure signal, a full scale pressure signal and a temperature signal at a medium temperature (a second preset temperature); a digital automatic zero compensation zero pressure signal, a full scale pressure signal and a temperature signal at a higher temperature (a preset third temperature);
then, the ten digital automatic zero compensation values and zero pressure signal acquisition value coefficients (the range is 0-1, the initial value is 0.1), the middle point pressure signal acquisition value coefficient (the range is 0-1, the initial value is 0.5) and the full scale pressure signal acquisition value coefficient (the range is 0-1, the initial value is 0.9) which are acquired under different environments are used as the input of a dynamic link library function to obtain seven coefficients for calculating the operation calibration formula of the RBIC microcontroller, wherein the seven coefficients are respectively bridge offset, amplification rate, second-order nonlinearity, temperature coefficient (first-order bridge offset), temperature coefficient (second-order bridge offset), temperature coefficient (first-order amplification rate) and temperature coefficient (second-order amplification rate);
then, the seven coefficients and related instructions obtained through calculation are utilized to obtain the check bit of the current debugged chip through formula calculation;
finally, seven coefficients obtained through calculation, check bits obtained through formula calculation and related sending instructions are used for updating the configuration in the RAM, so that the voltage output value of the ZMD31050 chip in the NOM mode is changed, and the ZMD31050 chip is debugged.
In a specific embodiment, the debugging of the ZMD31050 chip can be performed by the above method, but in order to complete the accurate debugging of the chip, the zero-point pressure signal acquisition value coefficient, the middle-point pressure signal acquisition value coefficient and the full-scale pressure signal acquisition value coefficient need to be accurately obtained. Through multiple debugging experiments, the relationship that the signal acquisition value coefficients of the three pressure points are inversely proportional to and approach gradually to the voltage signal output by the port 1# is found, so that the accurate debugging method specifically comprises the following steps:
when the ZMD31050 chip is debugged for the first time, setting a zero point pressure signal acquisition value coefficient, a middle point pressure signal acquisition value coefficient and a full scale pressure signal acquisition value coefficient as initial values; after the debugging is finished once, a digital multimeter is used for measuring voltage signals output by the port 1# under three pressure points and comparing the voltage signals with a normal range value. And if the measured value is not in the normal range, modifying the current point pressure signal acquisition coefficient according to the inverse ratio and the successive approximation relation. And comparing the obtained new three pressure signal acquisition value coefficients, performing a new round of debugging, circularly repeating until the voltage signal output by the port 1# under each pressure is in a normal range, and using the currently modified sending instruction to update the configuration in the RAM to finish the accurate debugging of the ZMD31050 chip, as shown in FIG. 3.
As shown in fig. 4, the embodiment of the invention further discloses a debugging device for a ZMD31050 chip, which comprises a pressure control module, a temperature control module, a power supply module, a signal acquisition module, a chip communication module and an upper computer; the pressure control module is used for changing the ambient pressure; the temperature control module is used for changing the ambient temperature; the power supply module is used for supplying power to the chip and each module; the signal acquisition module is used for measuring port 1# output of the ZMD31050 chip; the chip communication module is used for acquiring the port 2# output of the ZMD31050 chip, and the upper computer is respectively connected with the pressure control module, the temperature control module, the power supply module, the signal acquisition module and the chip communication module and is used for debugging the ZMD31050 chip according to the steps of the debugging method of the ZMD31050 chip.
The debugging method is used for debugging a ZMD31050 chip and for debugging chips in a large batch, a multi-channel switching unit (multi-channel switching board), namely a serial port is used for connecting a plurality of switch modules (such as relays), each relay is connected with the ZMD31050 chip, the relays in the multi-channel switching board are switched by an upper computer, and when the current relay is switched, the rest relays are in a closed state, so that the chips connected with the current relay can be operated. Therefore, the operation of batch ZMD31050 chips can be completed without changing serial ports by switching the relays in the channel switching board one by one.
For the signal acquisition module, firstly, the power supply module supplies power to a batch of chips, then, the chips are switched one by one through the multi-channel switching board, signal acquisition of the batch of ZMD31050 chips can be completed through the digital multimeter, and meanwhile, the upper computer can also process acquired signal data, as shown in FIG. 5. While for chip communication modules, the ZMD31050 chip is I2C communication protocol, therefore, it is necessary to add USB and I at the exit of the multi-channel switch board2And C, the serial port conversion module and the chip communication are in a cyclic reciprocating process, so that the upper computer sends data to the chip and receives data returned by the chip, as shown in figure 6.
Batch debugging process: the upper computer software supplies power to the batch of ZMD31050 chips through the power supply module, controls the pressure control module and the temperature control module to change the pressure and the temperature of the environment where the chips are located, acquires a plurality of digital automatic zero compensation values output by the batch of chips at different temperatures and pressures through the chip communication module, and stores the digital automatic zero compensation values in the MySQL database for subsequent chip debugging;
after the acquisition and storage of the digital automatic zero compensation values are finished, the upper computer finishes the debugging of the chips in batches through the chip communication module, and the signal output values of the chips in batches are measured through the signal acquisition module after the debugging is finished. And the upper computer software compares the output value of the signal under each pressure point with the normal range value through an algorithm, updates the coefficient of the signal acquisition value under each pressure point, and performs a new round of debugging. The above steps are repeated in a circulating way until all products are accurately debugged, the automatic debugging of the ZMD31050 chip is considered to be finished, and the whole upper computer software execution flow is shown in FIG. 7.
The automatic debugging method of the ZMD31050 chip can realize the automatic debugging of the ZMD31050 chip in batch, high efficiency and accuracy. The invention communicates with the ZMD31050 chip through the upper computer, finishes the debugging of the chip according to the characteristics of the ZMD31050 chip, designs the batch automatic debugging system of the ZMD31050 chip according to the debugging method, and realizes the automatic, large-batch and more accurate debugging of the ZMD31050 chip.
The debugging method of the invention completes the accurate calculation process through the upper computer software, and obtains the debugging result by strict calculation, thereby avoiding the error generated by manual calculation, and being more accurate compared with the manual debugging method.
Compared with a manual debugging method, the batch ZMD31050 chip automatic debugging system can realize batch chip debugging, the debugging process of the ZMD31050 chips is executed step by step through the upper computer, and data in the debugging process is stored in the MySQL database for subsequent calculation or debugging, so that the batch chip debugging is realized.
Compared with a manual debugging method, the automatic debugging system for the batch ZMD31050 chips realizes automatic debugging, has higher efficiency, and can debug the ZMD31050 chips at any time through the upper computer, so that the efficiency is greatly improved.
The embodiment of the invention also discloses a debugging system of the ZMD31050 chip, which comprises the following steps:
the first program module is used for enabling the ZMD31050 chip to enter a CM working mode and acquiring digital automatic zero compensation values of a port 2# of the ZMD31050 chip under different temperature environments;
the second program module is used for taking the digital automatic zero compensation values under different temperature environments and the coefficients of the pressure signal acquisition values at different points as the input of a dynamic link library function to obtain coefficients for calculating a calibration formula;
the third program module is used for obtaining the check bit of the current debugged chip according to the coefficient and the related instruction for calculating the calibration formula;
and the fourth program module is used for updating the configuration in the RAM of the ZMD31050 chip by using the coefficients, check bits and related sending instructions for calculating the calibration formula, so that the voltage output value of the ZMD31050 chip in the NOM mode is changed, and the ZMD31050 chip is debugged.
The debugging system of the invention corresponds to the debugging method and has the advantages of the debugging method.
The embodiment of the invention also discloses a computer readable storage medium, wherein a computer program is stored on the computer readable storage medium, and the computer program executes the steps of the method when being executed by a processor. The embodiment of the present invention further discloses a computer device, which comprises a memory and a processor, wherein the memory stores a computer program, and the computer program executes the steps of the method when being executed by the processor.
All or part of the flow of the method of the embodiments may be implemented by a computer program, which may be stored in a computer-readable storage medium and executed by a processor, to implement the steps of the embodiments of the methods. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer readable medium may include: any entity or device capable of carrying computer program code, recording medium, U.S. disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution media, and the like. The memory may be used to store computer programs and/or modules, and the processor may perform various functions by executing or executing the computer programs and/or modules stored in the memory, as well as by invoking data stored in the memory. The memory may include high speed random access memory, and may also include non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), at least one magnetic disk storage device, a Flash memory device, or other volatile solid state storage device.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may be made by those skilled in the art without departing from the principle of the invention.
Claims (10)
1. A debugging method of a ZMD31050 chip is characterized by comprising the following steps:
firstly, enabling a ZMD31050 chip to enter a CM working mode, and acquiring digital automatic zero compensation values of a port 2# of the ZMD31050 chip under different temperature environments;
taking the digital automatic zero compensation values under different temperature environments and the coefficients of the pressure signal acquisition values at different points as the input of a dynamic link library function to obtain coefficients for calculating a calibration formula;
obtaining the check bit of the current debugged chip according to the coefficient for calculating the calibration formula;
the configuration in the RAM of the ZMD31050 chip is updated with the coefficients and check bits used to calculate the calibration equations so that the voltage output values of the ZMD31050 chip in NOM mode are changed, thereby debugging the ZMD31050 chip.
2. The method for debugging a ZMD31050 chip of claim 1, wherein the coefficient of the pressure signal collection values at different points is set to an initial value when the ZMD31050 chip is debugged for the first time; after one-time debugging is finished, measuring voltage signals output by a port 1# of a ZMD31050 chip under three pressure points and comparing the voltage signals with normal range values; if the measured value is not in the normal range, modifying the current point pressure signal acquisition coefficient according to the relationship that the pressure signal acquisition coefficient at different points is inversely proportional to the voltage signal output by the port 1# and approaches gradually to obtain a new pressure signal acquisition coefficient; and performing a new round of debugging, circulating until the voltage signals output by the port 1# under various pressures are in a normal range, and using the currently modified sending command to update the configuration in the RAM so as to finish the accurate debugging of the ZMD31050 chip.
3. The method for debugging ZMD31050 of claim 1 or 2 wherein the digital auto-zero compensation values in different temperature environments comprise a digital auto-zero compensation zero pressure signal, a full level pressure signal and a temperature signal at a first preset temperature; the digital automatic zero compensation zero pressure signal, the middle point pressure signal, the full scale pressure signal and the temperature signal at a second preset temperature; a digital automatic zero compensation zero pressure signal, a full scale pressure signal and a temperature signal at a third preset temperature; wherein the first predetermined temperature < the second predetermined temperature < the third predetermined temperature.
4. The method for debugging a ZMD31050 of claim 3, wherein the different-point pressure signal collection coefficients comprise a zero-point pressure signal collection coefficient, a middle-point pressure signal collection coefficient, and a full-scale pressure signal collection coefficient.
5. The method of debugging ZMD31050 of claim 4 wherein the coefficients used to calculate the calibration equations include bridge offset, amplification, second order nonlinearity, first order bridge offset, second order bridge offset, first order amplification and second order amplification.
6. A debugging device of a ZMD31050 chip is characterized by comprising a pressure control module, a temperature control module, a power supply module, a signal acquisition module, a chip communication module and an upper computer; the pressure control module is used for changing the ambient pressure; the temperature control module is used for changing the ambient temperature; the power supply module is used for supplying power to the chip and each module; the signal acquisition module is used for measuring port 1# output of a ZMD31050 chip; the chip communication module is used for acquiring the port 2# output of the ZMD31050 chip, and the upper computer is respectively connected with the pressure control module, the temperature control module, the power supply module, the signal acquisition module and the chip communication module and is used for debugging the ZMD31050 chip according to the steps of the debugging method of the ZMD31050 chip as claimed in any one of claims 1-5.
7. The debugging device for the ZMD31050 chip as claimed in claim 6, further comprising a multi-channel switching module and a plurality of switch modules, wherein the plurality of switch modules are connected with the ZMD31050 chip in a one-to-one correspondence manner, and the signal acquisition module is respectively connected with the plurality of switch modules through the multi-channel switching module, so as to realize that one serial port is connected with a plurality of relays, and further, the signal acquisition module is connected to different ZMD31050 chips in a switching manner, thereby completing the debugging of batch chips.
8. The debugging device for the ZMD31050 chip of claim 7, further comprising a serial port switch module, wherein said serial port switch module is connected to the chip communication module and the multi-channel switch module, respectively, for implementing USB and I2And C, serial port conversion.
9. A debugging system of a ZMD31050 chip is characterized by comprising the following components:
the first program module is used for enabling the ZMD31050 chip to enter a CM working mode and acquiring digital automatic zero compensation values of a port 2# of the ZMD31050 chip under different temperature environments;
the second program module is used for taking the digital automatic zero compensation values under different temperature environments and the coefficients of the pressure signal acquisition values at different points as the input of a dynamic link library function to obtain coefficients for calculating a calibration formula;
the third program module is used for obtaining the check bit of the current debugged chip according to the coefficient for calculating the calibration formula;
and the fourth program module is used for updating the configuration in the RAM of the ZMD31050 chip by calculating the coefficients and check bits of the calibration formula, so that the voltage output value of the ZMD31050 chip in the NOM mode is changed, and the ZMD31050 chip is debugged.
10. A computer device comprising a memory and a processor, the memory having stored thereon a computer program, wherein the computer program when executed by the processor performs the steps of the method for debugging a ZMD31050 chip as set forth in any of claims 1-5.
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