CN114261761A - Adsorption transfer device with adjustable pressure - Google Patents
Adsorption transfer device with adjustable pressure Download PDFInfo
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- CN114261761A CN114261761A CN202111625661.XA CN202111625661A CN114261761A CN 114261761 A CN114261761 A CN 114261761A CN 202111625661 A CN202111625661 A CN 202111625661A CN 114261761 A CN114261761 A CN 114261761A
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Abstract
The invention relates to an adsorption transfer device with adjustable pressure, and relates to the technical field of Micro-LED wafer bulk transfer. The pressure-adjustable adsorption transfer device comprises: the device comprises a control unit, a driving unit, a wafer transferring unit, an adsorption platform unit, a pressure detection unit, two sliding blocks and two guide rails; the control unit controls the driving unit to drive the wafer transfer unit to extrude the adsorption platform unit at a preset pressure. The control unit controls the driving unit to drive the wafer transfer unit to extrude the adsorption platform unit at a preset pressure, so that the pressure of the Micro-LED wafer when the Micro-LED wafer is transferred from the wafer transfer unit to the target workpiece of the adsorption platform unit can be adjusted, and the problem that the Micro-LED wafer is damaged in quality due to overlarge pressure or cannot be transferred to the target workpiece of the adsorption platform unit due to undersize pressure is solved.
Description
Technical Field
The invention relates to the technical field of Micro-LED wafer bulk transfer, in particular to an adsorption transfer device with adjustable pressure.
Background
The Micro-LED technology is a new generation of display technology, wherein the mass transfer technology is an important part in the manufacture of Micro-LEDs, and the Micro-LED mass transfer technology is a technology for transferring thousands of Micro-LEDs from a carrier workpiece to a target workpiece. With the further development of the LED display technology, the size of the LED chip is smaller and smaller, and the size of the existing Micro LED reaches the micrometer level. When the Micro-LED wafer is transferred in the prior art, the Micro-LED wafer is damaged due to overlarge pressure, and the Micro-LED wafer is poor in transferring effect and cannot be transferred to a target workpiece due to overlow pressure.
Disclosure of Invention
The invention provides a pressure-adjustable adsorption transfer device, which solves the technical problem that the pressure cannot be adjusted when Micro-LED wafers are transferred in the prior art. The pressure-adjustable adsorption transfer device comprises: the device comprises a control unit, a driving unit, a wafer transferring unit, an adsorption platform unit, a pressure detection unit, two sliding blocks and two guide rails; the adsorption platform unit is arranged on the two guide rails, the two sliding blocks are respectively embedded in the two guide rails, and the pressure detection unit is arranged on the lower side of the adsorption platform unit and is connected with the adsorption platform unit; the control unit is respectively connected with the driving unit and the pressure detection unit; the driving unit is connected with the wafer transferring unit, the wafer transferring unit is arranged on the upper side of the adsorption platform unit, and the control unit controls the driving unit to drive the wafer transferring unit to extrude the adsorption platform unit at a preset pressure.
The technical scheme is that the adsorption platform unit comprises a containing platform, and the containing platform is arranged on the upper side face of the adsorption platform unit.
The further technical proposal is that the adsorption platform unit also comprises two positioning holes; the two positioning holes are respectively arranged at two sides of the containing platform.
The further technical scheme is that the adsorption platform unit further comprises a plurality of vacuum suction holes, and the vacuum suction holes are formed in the upper side face of the adsorption platform unit.
The further technical scheme is that the adsorption platform unit further comprises a taking and placing groove, and the taking and placing groove is formed in one side of the containing platform.
The pressure detection unit comprises two support columns, and the two support columns are arranged below the adsorption platform unit; the two sliding blocks are respectively arranged on the two supporting columns.
The pressure detection unit further comprises an installation plate, a pressure sensor and an installation adjusting block; the two support columns are arranged on the mounting plate, and the mounting adjusting block is arranged on the mounting plate; the pressure sensor is arranged on the installation adjusting block and connected with the adsorption unit.
The further technical scheme is that the pressure sensor further comprises a pressure switch unit, and the pressure switch unit is connected with the pressure sensor.
The further technical proposal is that the device also comprises a rotating device; the rotating device is connected with the control unit and the mounting plate.
The driving unit comprises a driving motor and a driving arm; the driving arm is respectively connected with the wafer transfer unit and the driving motor; the driving motor is connected with the control unit.
The invention has the beneficial effects that: a pressure-adjustable adsorption transfer device comprising: the device comprises a control unit, a driving unit, a wafer transferring unit, an adsorption platform unit, a pressure detection unit, two sliding blocks and two guide rails; the adsorption platform unit is arranged on the two sliding blocks, the two sliding blocks are respectively embedded in the two guide rails, and the pressure detection unit is arranged on the lower side of the adsorption platform unit and is connected with the adsorption platform unit; the control unit is respectively connected with the driving unit and the pressure detection unit; the driving unit is connected with the wafer transferring unit, the wafer transferring unit is arranged on the upper side of the adsorption platform unit, and the control unit controls the driving unit to drive the wafer transferring unit to extrude the adsorption platform unit at a preset pressure. The control unit controls the driving unit to drive the wafer transfer unit to extrude the adsorption platform unit at a preset pressure, so that the pressure of the Micro-LED wafer on a target workpiece transferred from the wafer transfer unit to the adsorption platform unit can be adjusted, and the problem that the Micro-LED wafer cannot be transferred to the target workpiece of the adsorption platform unit due to the fact that the Micro-LED wafer is damaged due to overlarge pressure or the Micro-LED wafer cannot be transferred to the target workpiece of the adsorption platform unit due to the fact that the Micro-LED wafer is under undersized pressure is solved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is an overall structural view of a pressure-adjustable adsorption transfer device according to an embodiment of the present invention;
FIG. 2 is a partial schematic view of a pressure-regulated adsorptive transfer device according to an embodiment of the present invention;
FIG. 3 is a partial schematic view of a pressure-regulated adsorptive transfer device according to an embodiment of the present invention;
fig. 4 is a block diagram of the overall structure of a pressure-adjustable adsorption transfer device according to an embodiment of the present invention.
Reference numerals
The pressure-adjustable device includes: the device comprises a control unit 10, a driving unit 20, a driving motor 21, a driving arm 22, a wafer transferring unit 30, an adsorption platform unit 40, a containing platform 41, a positioning hole 42, a vacuum suction hole 43, a taking and placing groove 44, a pressure detecting unit 50, a supporting column 51, an installing plate 52, a pressure sensor 53, an installing adjusting block 54, a guide rail 60, a sliding block 70, a pressure switch unit 80 and a rotating device 90.
Detailed Description
In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further described and illustrated with reference to the following specific embodiments, but not limited thereto.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It should also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Examples
Referring to fig. 1, the present invention provides a pressure adjustable adsorption transfer device, comprising: a control unit 10, a driving unit 20, a wafer transfer unit 30, an adsorption platform unit 40, a pressure detection unit 50, two guide rails 60 and two slide blocks 70; the adsorption platform unit 40 is arranged on the two guide rails 60, the two slide blocks 70 are respectively embedded in the two guide rails 60, and the pressure detection unit 50 is arranged on the lower side of the adsorption platform unit 40 and connected with the adsorption platform unit 40; the control unit 10 is connected to the driving unit 20 and the pressure detection unit 50, respectively; the driving unit 20 is connected to the wafer transferring unit 30, the wafer transferring unit 30 is disposed on the upper side of the adsorption platform unit 40, and the control unit 10 controls the driving unit 20 to drive the wafer transferring unit 30 to extrude the adsorption platform unit 40 at a predetermined pressure.
Specifically, the control unit 10 controls the driving unit 20 to drive the wafer transfer unit 30 to extrude the adsorption platform unit 40 with a preset pressure, so that the Micro-LED wafer originally adsorbed on the lower side surface of the wafer transfer unit 30 is transferred to the target workpiece on the upper side surface of the adsorption platform unit 40, and the Micro-LED wafer is transferred from the wafer transfer unit 30 to the target workpiece on the adsorption platform unit 40 by providing the preset pressure, thereby completing the transfer of the Micro-LED wafer. The preset pressure can be controlled according to actual needs, when the pressure detected by the pressure detection unit is insufficient, the insufficient pressure may cause a transfer effect of the Micro-LED wafer to be deteriorated, and even the Micro-LED wafer cannot be transferred from the wafer transfer unit 30 to the target workpiece of the adsorption platform unit 40, and at this time, the preset pressure may be appropriately increased. When the pressure detected by the pressure detection unit is too large, the Micro-LED wafer is damaged due to the too large pressure, and the preset pressure can be reduced to ensure that the Micro-LED wafer cannot be damaged in the transfer process. The adsorption transfer device with the adjustable pressure solves the problem that the pressure of the Micro-LED wafer in the transfer process cannot be adjusted in the prior art, so that the good transfer effect of the Micro-LED wafer in the transfer process is ensured, and the quality of the Micro-LED wafer is not damaged.
Further, the adsorption platform unit 40 includes a holding platform 41, and the holding platform 41 is disposed on the upper side surface of the adsorption platform unit 40.
Specifically, when the Micro-LED wafer is transferred to a target workpiece on the adsorption platform unit 40 by the wafer transfer unit 30, the Micro-LED wafer on the lower side surface of the wafer transfer unit 30 needs to be aligned to the holding platform 41, and it should be noted that the holding platform 41 is used for holding the target workpiece, so that the Micro-LED wafer can contact the target workpiece on the holding platform 41 during the transfer process, thereby completing the transfer of the Micro-LED wafer. Through drive unit 20 makes wafer transfer unit 30 extrusion adsorption platform unit 40, and then the Micro-LED wafer that will shift to hold on the target work piece on the platform 41, consequently hold platform 41 and need locate adsorption platform unit 40's the side of going up, with wafer transfer unit 30 downside corresponds each other, ensures good transfer effect.
Further, the adsorption platform unit 40 further includes two positioning holes 42; the two positioning holes 42 are respectively disposed on two sides of the placing platform 41.
Specifically, two symmetrical positioning holes 42 are formed in two sides of the placing platform 41, and the positioning holes 42 are used for better positioning the Micro-LED wafer in the process that the wafer transferring unit 30 transfers the Micro-LED wafer to the target workpiece of the adsorption platform unit 40, so that the Micro-LED wafer is accurately transferred to the target workpiece of the placing platform 41, and the transferring effect is improved.
Further, the adsorption platform unit 40 further includes a plurality of vacuum suction holes 43, and the plurality of vacuum suction holes 43 are all disposed on the upper side surface of the adsorption platform unit 40.
Specifically, the vacuum suction holes 43 are formed in the upper side face of the adsorption platform unit 40, so that the Micro-LED wafer is more stably adsorbed on the adsorption platform unit 40 and is not easy to fall off after being transferred to a target workpiece of the containing platform 41 of the adsorption platform unit 40 in a vacuumizing mode, and when the target workpiece needs to be taken out, the target workpiece can be taken out by removing a vacuum state through the vacuum suction holes 43.
Further, the adsorption platform unit 40 further includes a pick-and-place slot 44, and the pick-and-place slot 44 is disposed on one side of the placing platform 41.
Specifically, the pick-and-place slot 44 is disposed on the upper side of the adsorption platform unit 40 and is disposed on one side of the placing platform, and through the pick-and-place slot 44, after the Micro-LED wafer is transferred from the wafer transfer unit 30 to the target workpiece on the placing platform 41, the current target workpiece needs to be taken out, and then the next target workpiece needs to be placed for transferring the next Micro-LED wafer. Therefore, the target workpiece can be taken out through the pick-and-place slot 44, and the next Micro-LED wafer to be transferred and the next target workpiece are transferred continuously.
Further, the pressure detection unit 50 includes two support columns 51, and the two support columns 51 are disposed below the adsorption platform unit 40; the two sliding blocks 70 are respectively disposed on the two supporting posts 51.
Specifically, the two support columns 51 are arranged below the adsorption platform unit 40, so that the adsorption platform unit 40 is supported, the sliding stability is improved when the adsorption platform unit 40 slides on the guide rail 60 through the sliding block 70, and the sliding block 70 is arranged on the support columns 51, so that the movement reliability of the pressure-adjustable adsorption transfer device provided by the invention when the pressure is adjusted through the guide rail 60 and the sliding block 70 is ensured.
Further, the pressure detection unit 50 further includes a mounting plate 52, a pressure sensor 53, and a mounting adjustment block 54; the two supporting columns 51 are arranged on the mounting plate 52, and the mounting adjusting block 54 is arranged on the mounting plate 52; the pressure sensor 53 is provided on the mounting adjustment block 54, and is connected to the adsorption platform unit 40.
Specifically, by providing the two support columns 51 and the mounting adjustment blocks 54 on the mounting plate 52, the supporting force of the mounting plate 52 on the two support columns 51 and the mounting adjustment blocks 54 is ensured, and the stability of the sliding movement of the guide rail 60 in the slide block 70 is ensured. By providing the mounting adjustment block 54 below the pressure sensor 53, the height of the pressure sensor can be adjusted by the mounting adjustment block 54.
Further, a pressure switch unit 80 is further included, and the pressure switch unit 80 is connected to the pressure sensor 53.
Specifically, the pressure switch unit 80 is connected to the pressure sensor 53, so that the pressure sensor 53 can be controlled, wherein the pressure switch unit 80 further includes a display device, so that the pressure data detected by the pressure sensor 53 can be displayed in real time. Wherein the pressure switch unit 80 may also control the on/off operation of the pressure sensor 53.
Further, a rotating device 90 is also included; the rotating device 90 is connected to the control unit 10 and to the mounting plate 52.
Specifically, the control unit 10 can control the rotation of the rotation device 90 by providing the rotation device 90 under the pressure detection unit 50, connecting the rotation device 90 to the control unit 10 and to the mounting plate 52, and connecting the rotation device 90 under the mounting plate 52. When the alignment of the Micro-LED wafer is inaccurate in the process of transferring the wafer transfer unit 30 to the adsorption platform unit 40, the position of the Micro-LED wafer can be adjusted by controlling the position of the wafer transfer unit 30, and the placing platform 41 of the adsorption unit 40 can be rotated to the position corresponding to the Micro-LED wafer by the rotating device 90 for better alignment, so as to further improve the alignment effect.
Further, the driving unit 20 includes a driving motor 21 and a driving arm 22; the driving arm 22 is connected to the wafer transfer unit 30 and the driving motor 21, respectively; the drive motor 21 is connected to the control unit 10.
Specifically, the driving arm 22 is connected to the wafer transfer unit 30 and the driving motor 21, so that the driving arm 22 is driven by the driving motor 21 to provide a downward pressure for the wafer transfer unit 30 when pressing the adsorption platform unit 40, and the preset pressure can be adjusted by adjusting the power of the driving motor 21, where the higher the power of the driving motor 21 is, the higher the pressure provided by the driving arm 22 is, and thus the higher the pressure of the wafer transfer unit 30 when pressing the adsorption platform unit 40 is. Therefore, the preset pressure can be adjusted by adjusting the power of the driving motor 21, and a good transfer effect on the Micro-LED wafer is further ensured.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A pressure-adjustable adsorption transfer device is characterized by comprising a control unit, a driving unit, a wafer transfer unit, an adsorption platform unit, a pressure detection unit, two sliding blocks and two guide rails; the adsorption platform unit is arranged on the two guide rails, the two sliding blocks are respectively embedded in the two guide rails, and the pressure detection unit is arranged on the lower side of the adsorption platform unit and is connected with the adsorption platform unit; the control unit is respectively connected with the driving unit and the pressure detection unit; the driving unit is connected with the wafer transferring unit, the wafer transferring unit is arranged on the upper side of the adsorption platform unit, and the control unit controls the driving unit to drive the wafer transferring unit to extrude the adsorption platform unit at a preset pressure.
2. The pressure-adjustable adsorption transfer device of claim 1, wherein the adsorption platform unit comprises a holding platform, and the holding platform is arranged on the upper side surface of the adsorption platform unit.
3. The pressure adjustable suction transfer device of claim 2, wherein the suction platform unit further comprises two positioning holes; the two positioning holes are respectively arranged at two sides of the containing platform.
4. The pressure adjustable adsorption transfer device of claim 2 wherein said adsorption platform unit further comprises a plurality of vacuum holes, each of said plurality of vacuum holes being disposed on an upper side of said adsorption platform unit.
5. The pressure adjustable adsorption transfer device of claim 2 wherein the adsorption platform unit further comprises a pick-and-place slot, the pick-and-place slot being disposed on one side of the containment platform.
6. The pressure-adjustable adsorption transfer device of claim 1, wherein the pressure detection unit comprises two support columns, and the two support columns are arranged below the adsorption platform unit; the two sliding blocks are respectively arranged on the two supporting columns.
7. The pressure adjustable adsorption transfer device of claim 6 wherein the pressure detection unit further comprises a mounting plate, a pressure sensor, and a mounting adjustment block; the two support columns are arranged on the mounting plate, and the mounting adjusting block is arranged on the mounting plate; the pressure sensor is arranged on the installation adjusting block and connected with the adsorption unit.
8. The pressure adjustable adsorptive transfer device according to claim 7, further comprising a pressure switch unit connected to said pressure sensor.
9. The pressure adjustable adsorptive transfer device of claim 7, further comprising a rotating means; the rotating device is connected with the control unit and the mounting plate.
10. The pressure adjustable adsorptive transfer device according to claim 1, wherein said driving unit comprises a driving motor and a driving arm; the driving arm is respectively connected with the wafer transfer unit and the driving motor; the driving motor is connected with the control unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111625661.XA CN114261761A (en) | 2021-12-28 | 2021-12-28 | Adsorption transfer device with adjustable pressure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111625661.XA CN114261761A (en) | 2021-12-28 | 2021-12-28 | Adsorption transfer device with adjustable pressure |
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| CN114261761A true CN114261761A (en) | 2022-04-01 |
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| CN202111625661.XA Pending CN114261761A (en) | 2021-12-28 | 2021-12-28 | Adsorption transfer device with adjustable pressure |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106873201A (en) * | 2017-04-21 | 2017-06-20 | 京东方科技集团股份有限公司 | Adhering device |
| US20190058081A1 (en) * | 2017-08-18 | 2019-02-21 | Khaled Ahmed | Micro light-emitting diode (led) display and assembly apparatus |
| CN212266953U (en) * | 2020-06-12 | 2021-01-01 | 京东方科技集团股份有限公司 | Flexible display panel attaching device |
| CN113517309A (en) * | 2021-07-02 | 2021-10-19 | 福州大学 | Mass transfer device and method of Micro LED integrating transfer, detection and repair |
-
2021
- 2021-12-28 CN CN202111625661.XA patent/CN114261761A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106873201A (en) * | 2017-04-21 | 2017-06-20 | 京东方科技集团股份有限公司 | Adhering device |
| US20190058081A1 (en) * | 2017-08-18 | 2019-02-21 | Khaled Ahmed | Micro light-emitting diode (led) display and assembly apparatus |
| CN212266953U (en) * | 2020-06-12 | 2021-01-01 | 京东方科技集团股份有限公司 | Flexible display panel attaching device |
| CN113517309A (en) * | 2021-07-02 | 2021-10-19 | 福州大学 | Mass transfer device and method of Micro LED integrating transfer, detection and repair |
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