CN114253359A - Heat conduction device and electronic apparatus - Google Patents

Abstract

The application provides a heat conduction device and electronic equipment, wherein the heat conduction device comprises a heat conduction pipe and a liquid storage part; the heat conduction pipe comprises a first heat conduction section, a second heat conduction section and a third heat conduction section, and is provided with a heat conduction cavity; the liquid storage part comprises a first liquid storage section and a second liquid storage section; the liquid storage part is arranged in the heat conduction cavity; the first heat conduction section comprises a connecting section, a heat conduction contact section and a redundant storage section which are sequentially connected, the heat conduction contact section is in contact with the heating source, and the redundant storage section is staggered with the heating source; the first liquid storage section comprises a heat conduction section and a redundant section, the heat conduction section corresponds to the heat conduction contact section, the redundant section corresponds to the redundant storage section, a heat dissipation channel is formed between the second liquid storage section and the heat conduction pipe, and the heat dissipation channel corresponds to the connection section of the first heat conduction section, the second heat conduction section and the third heat conduction section. The redundant section supplies liquid to the heat conduction section after the liquid of the heat conduction section is evaporated, so that the liquid always exists in the heat conduction device, the heat dissipation effect of the heat conduction device is improved, and the performance of an electronic device is prevented from being limited.

Description

Heat conduction device and electronic apparatus

Technical Field

The application relates to the technical field of heat dissipation of electronic products, in particular to a heat conducting device and electronic equipment.

Background

Electronic devices such as processors in portable electronic equipment such as notebook computers and the like are all provided with heat dissipation devices for dissipating heat when the electronic devices operate, so that the electronic devices or equipment are prevented from being affected by overhigh temperature of the electronic devices.

The existing heat dissipation device generally comprises a heat conduction device and a fan, wherein one end of the heat conduction device is connected to a heat-generating electronic device, the other end of the heat conduction device is connected with an outer shell of the fan, heat emitted by the electronic device is conducted to the fan through the heat conduction device, and then the heat is dissipated to the outside of the electronic equipment through the fan. However, current thermal devices have poor heat dissipation capabilities.

Disclosure of Invention

The application provides a heat conduction device and electronic equipment, the heat-sinking capability is stronger for the heat that gives off when electron device moves in time effluvium, prevents electron device stop work, and prevents that electron device from being burnt out.

A first aspect of embodiments of the present application provides a heat conduction device, including: the heat conduction pipe and the liquid storage part; the heat conduction pipe comprises a first heat conduction section, a second heat conduction section and a third heat conduction section which are connected in sequence, and is provided with a heat conduction cavity which penetrates through the first heat conduction section, the second heat conduction section and the third heat conduction section; the liquid storage part is provided with a capillary structure for heat dissipation and comprises a first liquid storage section and a second liquid storage section which are connected in sequence; the liquid storage part is arranged in the heat conduction cavity and extends along the length direction of the heat conduction pipe; the first heat conduction section comprises a connecting section, a heat conduction contact section and a redundant storage section which are sequentially connected, the connecting section is positioned between the second heat conduction section and the heat conduction contact section, the heat conduction contact section is used for contacting the heating source, and the redundant storage section is used for being staggered with the heating source; the first liquid storage section comprises a heat conduction section and a redundant section, the heat conduction section corresponds to the heat conduction contact section, and the redundant section corresponds to the redundant storage section; a heat dissipation channel is formed between the second liquid storage section and the heat conduction pipe, and corresponds to the connection section of the first heat conduction section, the second heat conduction section and the third heat conduction section.

In one embodiment, the heat conducting cavity comprises a first accommodating cavity and a second accommodating cavity, the first accommodating cavity and the second accommodating cavity are sequentially connected along the length direction of the heat conducting pipe, the first accommodating cavity is formed on the first heat conducting section, and the second accommodating cavity is formed on the first heat conducting section, the second heat conducting section and the third heat conducting section; the first liquid storage section is located in the first accommodating cavity, the second liquid storage section is located in the second accommodating cavity, and a heat dissipation channel is formed between the second liquid storage section and the cavity wall of the second accommodating cavity.

The heat conduction section corresponds to the heat conduction contact section, and the redundant section corresponds to the redundant storage section, namely, a first accommodating cavity is formed on the heat conduction contact section and the redundant storage section, and the heat conduction section and the redundant section are positioned in the first accommodating cavity; that is, the heat conducting segment is located in a part of the heat conducting cavity formed by the heat conducting contact segment, and the redundant segment is located in a part of the heat conducting cavity formed by the redundant storage segment. The heat dissipation channel corresponds to the connection section of the first heat conduction section, the second heat conduction section and the third heat conduction section, which means that the heat dissipation channel penetrates through the connection section of the first heat conduction section, the second heat conduction section and the third heat conduction section.

In this embodiment, the heat conduction contact section is in contact with the heat source, and the redundant storage section is staggered with the heat source, because the heat conduction section corresponds with the heat conduction contact section, and the redundant section corresponds with the redundant storage section, when the source that generates heat so generates heat, heat transfer to the heat conduction contact section, again by heat conduction contact section transfer to the heat conduction section, the evaporation of being heated of the liquid of storage in the heat conduction section this moment is gaseous, and gaseous circulation in heat dissipation channel just takes away the heat. And the liquid storage volume in the heat conduction section is reduced because of evaporation, and the liquid in the redundant section can flow to the heat conduction section at this moment, supplements the liquid volume in the heat conduction section for there is liquid in the heat conduction device always. That is to say, the liquid that the whole storage of stock solution spare is more, so, higher at the temperature of the source that generates heat, when the heat that transmits to the heat pipe is more, the liquid in the stock solution spare also can not all vaporize, from this, can prevent that the heat-conducting device from becoming invalid, ensures that the heat-conducting device is in effective heat conduction state always. After the temperature of the electronic device is too high, a protection mechanism can be triggered, the electronic device can prevent the temperature from further rising by reducing power consumption, and after the power consumption of the electronic device is reduced, the performance cannot be effectively exerted, so that the use of electronic equipment can be influenced. The heat conducting device is always in an effective heat conducting state, so that the possibility of triggering a protection mechanism can be prevented or reduced, and the performance of the electronic device can be well exerted.

The heat conduction device comprises an evaporation part, a heat insulation part and a condensation part which are connected in sequence, wherein the evaporation part of the heat conduction device is formed by a heat conduction contact section, a redundant storage section, a connection section, a heat conduction section, a redundant section and a first section; the second section and the second heat conducting section form a heat insulating part of the heat conducting device, and the third section and the third heat conducting section form a condensing part of the heat conducting device.

When heat conduction device installs in electronic equipment inside, the evaporation department with generate heat the source contact, specifically be the heat conduction contact section surface of the heat pipe of evaporation department with generate heat the source contact, when the source work that generates heat, heat transfer to the heat conduction contact section of heat pipe, again by the heat conduction contact section of heat conduction contact section transmission to the heat conduction section of stock solution spare, the liquid evaporation of being heated in the heat conduction section is gaseous, gaseous entering evaporation department and adiabatic portion connection position specifically are for getting into in the part heat dissipation channel that first subsection corresponds. Then, the gas flows to the heat insulation part along the heat dissipation channel, specifically enters a part of the heat dissipation channel corresponding to the second segment, and the temperature of the gas in the heat insulation part is reduced because the heat insulation part is not in contact with the electronic device. Gas after the temperature reduction gets into the condensing part, and the condensing part does not contact with electron device, and is kept apart by adiabatic section between with electron device, and consequently the temperature is lower, and gas further reduces at the condensing part temperature, and gas condensation is liquid this moment, and the liquid that the condensation becomes drips the third subsection to second stock solution section, then flows back to the heat conduction section through second subsection, first subsection in proper order to accomplish a heat conduction cycle. The heat of the electronic device is taken away in the liquid-gas-liquid change process, and the temperature of the electronic device is reduced.

In one embodiment, the redundant segments are equal in length to the redundant memory segments. Therefore, the length of the redundant section is longest in the design range, the liquid stored in the redundant section is more, and the condition that the heat conducting device fails due to the fact that the liquid is completely evaporated can not occur when the temperature of the heating source is higher.

In one embodiment, the length of the heat conduction section is equal to that of the heat conduction contact section, so that the length of the heat conduction section is longest in the design range, more liquid is stored in the heat conduction section, and the condition that the heat conduction device fails due to the fact that all liquid evaporates when the temperature of a heating source is higher cannot occur.

In one embodiment, the cross-section of the redundant segment is the same shape and area as the cross-section of the heat conducting cavity. Therefore, the redundant segment fills part of the heat conducting cavity formed by the redundant storage segment, and at the moment, the outer diameter of the redundant segment is the largest in the design range, so that the liquid storage capacity of the redundant segment is increased.

In one embodiment, the cross-section of the heat conducting section is the same shape and area as the cross-section of the heat conducting cavity. Therefore, the heat conduction section is filled with part of the heat conduction cavity formed by the redundant storage section, at the moment, the outer diameter of the heat conduction section is the largest in the design range, and the liquid storage capacity of the heat conduction section is increased.

In one embodiment, the second liquid storage section comprises a first section, a second section and a third section which are connected in sequence, and one end of the first section, which is far away from the second section, is connected with the heat conducting section; the first section corresponds to the connecting section and has the same length with the connecting section, the second section corresponds to the second heat conducting section and has the same length with the second heat conducting section, and the third section corresponds to the third heat conducting section and has the same length with the third heat conducting section. Therefore, the lengths of the first section, the second section and the third section are the longest in the design range, more liquid can be stored, and the effective work of the heat conducting device is guaranteed. The first section corresponds to the connecting section, the second section corresponds to the second heat conducting section, and the third section corresponds to the third heat conducting section. The first section is located in a part of the heat conduction cavity formed by the connecting section, the second section is located in a part of the heat conduction cavity formed by the second heat conduction section, and the third section is located in a part of the heat conduction cavity formed by the third heat conduction section.

In one embodiment, the liquid reservoir includes one or more of a powder capillary structure, a mesh capillary structure, and a fiber capillary structure.

In one embodiment, the first reservoir segment comprises a powder capillary structure, a mesh capillary structure, and a first fiber capillary structure, and the second reservoir segment comprises a second fiber capillary structure; the grid capillary structure and the first fiber capillary structure are arranged in a stacked mode in the width direction of the liquid storage part, one end of the grid capillary structure and one end of the first fiber capillary structure are both in contact with one end of the powder capillary structure, and the other end of the first fiber capillary structure is connected with one end of the second fiber capillary structure; the powder capillary structure forms a redundant segment and the grid capillary structure and the first fiber capillary structure form a thermally conductive segment. The capillary force of the fiber capillary structure in the horizontal state is strong, and the capillary force of the powder capillary structure in the vertical state is strong, so that the mode of combining the powder capillary structure and the fiber capillary structure is adopted, and the heat conducting device can play a good heat conducting effect no matter what state the electronic equipment is in use. The grid capillary structure supplements the capillary force of the first fiber capillary structure, so that the capillary force at the position of the heat conducting device opposite to the electronic device is stronger, more liquid can be stored, the processing is convenient, and the cost is lower.

In one embodiment, the first accommodating cavity comprises a first cavity and a second cavity which are sequentially distributed along the length direction of the heat conducting pipe, the second cavity is positioned between the first cavity and the second accommodating cavity, and the second cavity comprises a first sub-cavity and a second sub-cavity which are sequentially distributed along the width direction of the heat conducting pipe; the powder capillary structure is positioned in the first cavity, the grid capillary structure is positioned in the first sub-cavity, and the first fiber capillary structure is positioned in the second sub-cavity; the second accommodating cavity comprises a heat dissipation channel and a third cavity which are distributed along the width direction of the heat conduction pipe, the first sub-cavity is opposite to and connected with the heat dissipation channel, the second sub-cavity is opposite to and connected with the third cavity, and the second fiber capillary structure is located in the third cavity. The structure design facilitates the processing of the heat conducting device and has lower cost.

In one embodiment, the length of the first liquid storage section is equal to that of the first accommodating cavity, the length of the second liquid storage section is equal to that of the second accommodating cavity, and the volume of the first liquid storage section is M times of that of the first accommodating cavity; the volume of the second liquid storage section is N times of the volume of the second containing cavity, wherein M is a value larger than 0 and smaller than or equal to 1, and N is a value larger than 0 and smaller than 1.

In this embodiment, the volume of first stock solution section accounts for the first space of accepting the chamber great, consequently can hold more liquid, even the electron device heat is higher, also has sufficient liquid can be evaporated for gaseous and take away the heat, can not appear earlier liquid evaporation for gaseous after, still not condense back liquid, follow-up no liquid can continue to evaporate the condition of taking away the heat and appear, also ensures that the thermal device can not appear the inefficacy condition. The volume of second stock solution section occupies that the space of chamber is less is acceptd to the second, reserves sufficient space for heat dissipation channel for the gas that liquid evaporation becomes has sufficient space to circulate, thereby better taking away the heat, makes the electron device temperature reduce fast.

In one embodiment, the thickness of the second liquid storage section is equal to the height of the second accommodating cavity, and the width of the second liquid storage section is N times of the width of the second accommodating cavity. The length of the second liquid storage section is equal to that of the second accommodating cavity, and the space of the second accommodating cavity can be fully used for setting the second liquid storage section with larger volume, so that more liquid can be stored, and the heat conducting device is ensured to have a good heat conducting function. And the width that sets up the second stock solution section is the second and accepts N times of the width in chamber, can be convenient for process, reduces the processing degree of difficulty to reduce cost.

In one embodiment, the width of the second liquid storage section is equal to the width of the second accommodating cavity, and the thickness of the second liquid storage section is N times the height of the second accommodating cavity. The length of the second liquid storage section is equal to that of the second accommodating cavity, and the space of the second accommodating cavity can be fully used for setting the second liquid storage section with larger volume, so that more liquid can be stored, and the heat conducting device is ensured to have a good heat conducting function. And the thickness that sets up the second stock solution section is the second and accepts N times of the height in chamber, so after installing in electronic equipment, when electronic equipment used, the whole position of comparing in heat dissipation channel of second stock solution section is lower, consequently, the stock solution body that the second stock solution section can be better.

In one embodiment, N is greater than or equal to 0.3 and less than or equal to 0.5. When N is within the range of 0.3 to 0.5, the volume of the heat dissipation channel can be larger, so that gas can better flow through the space, and the second liquid storage section can have enough volume to store liquid after the gas is condensed.

In one embodiment, N is equal to 0.5; the thickness of the second liquid storage section is equal to the height of the second containing cavity, and the width of the second liquid storage section is 0.5 times of the width of the second containing cavity. When N equals 0.5, heat dissipation channel's volume and the volume of second stock solution section equal, and heat dissipation channel volume and second stock solution section volume account for comparatively rationally, can make gaseous good circulation at heat dissipation channel, can make the liquid that forms after the better recovery gas condensation of second stock solution section again.

In one embodiment, the thickness of the first liquid storage section is equal to the height of the first accommodating cavity, and the width of the first liquid storage section is M times of the width of the first accommodating cavity. First stock solution section length equals with first chamber length of acceping, and the space that can the first chamber of acceping of make full use of sets up the first stock solution section of bigger volume to save more liquid of a large amount, in order to ensure that heat-conducting device has good heat conduction function. And the width that sets up first stock solution section is the M times of the first width of acceping the chamber, can be convenient for process, reduces the processing degree of difficulty to reduce cost.

In one embodiment, the width of the first liquid storage section is equal to the width of the first accommodating cavity, and the thickness of the first liquid storage section is M times of the height of the first accommodating cavity. First stock solution section length equals with first chamber length of acceping, and the space that can the first chamber of acceping of make full use of sets up the first stock solution section of bigger volume to save more liquid of a large amount, in order to ensure that heat-conducting device has good heat conduction function. And the thickness that sets up first stock solution section is the first M times of accepting the height in chamber, so after installing in electronic equipment, when electronic equipment used, the whole position of comparing in heat dissipation channel of first stock solution section is lower, consequently, the stock solution body that first stock solution section can be better.

In one embodiment, M is greater than or equal to 0.8 and less than or equal to 1. When M is between 0.8 and 1, the volume of the first liquid storage section is larger, more liquid can be stored, and the heat dissipation function of the heat conduction device is prevented from being invalid.

In one embodiment, M is equal to 1; the thickness of the first liquid storage section is equal to the height of the first accommodating cavity, and the width of the first liquid storage section is equal to the width of the first accommodating cavity. When M equals 1, first stock solution section is full of first accepting the chamber, and the first volume of accepting the chamber of the volume of first stock solution section equals this moment, and the volume of first stock solution section is the biggest in the design range, can save more liquid to ensure that heat-conducting device has good heat conduction function.

In one embodiment, the heat conducting device further comprises a first end cover and a second end cover, the heat conducting pipe has a first end and a second end which are oppositely arranged, the first end is provided with a first opening communicated with the heat conducting cavity, and the second end is provided with a second opening communicated with the heat conducting cavity; the first end cover is fixed at the first end and seals the first opening; the second end cap is fixed to the second end and closes the second opening. Therefore, the heat conducting cavity can be in a closed and vacuum state to prevent liquid loss, and the heat conducting device is convenient to process and low in cost.

In one embodiment, the first heat conducting section is connected with the second heat conducting section at a first included angle, the third heat conducting section is connected with the second heat conducting section at a second included angle, and both the first included angle and the second included angle are larger than 0 degree. From this, the heat pipe has two positions of buckling, and at same length within range, the length of the heat pipe that has the position of buckling is longer, can install bigger volume's stock solution spare to increase the stock solution volume, thereby promote heat-conducting capacity of heat-conducting device, and can increase heat dissipation channel's length, thereby make gas have more sufficient flow space, with the better heat of taking away.

In one embodiment, the heat conduction pipe is a flat strip-shaped pipe body, and the liquid storage part is a flat strip-shaped body. Therefore, the heat conducting device is small in size, small in occupied space in the thickness direction of the electronic equipment and beneficial to light and thin design of the electronic equipment.

In one embodiment, the cross section of the heat conducting pipe along the thickness direction is rectangular, parallelogram or oval.

A second aspect of the present application provides an electronic device, comprising: a housing, an electronic device, and a thermally conductive device of any one of the first aspect of the present application; the heat conducting device and the electronic device are arranged in the shell; the thermally conductive contact section is opposite the electronic device and the redundant memory section is offset from the electronic device.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings required to be used in the embodiments or the background art of the present application will be described below.

Fig. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.

Fig. 2 is a schematic structural view of a housing portion of the electronic apparatus shown in fig. 1.

Fig. 3 is a schematic structural view of the heat conduction device shown in fig. 2.

Fig. 4 is an exploded structural view of the body of the heat conduction device shown in fig. 3.

Fig. 5 is a schematic plan view of the heat conductive pipe of the heat conductive device shown in fig. 4.

Fig. 6 is a schematic cross-sectional structure of a heat conductive pipe of the heat conductive device shown in fig. 4.

Fig. 7 is a schematic view of the reservoir shown in fig. 3.

Fig. 7a is a schematic view of an alternative construction of the reservoir shown in fig. 3.

Fig. 7b is a schematic view of yet another configuration of the reservoir shown in fig. 3.

Fig. 8 is a schematic plan view of the liquid storage member shown in fig. 3 mounted inside a heat transfer pipe.

Fig. 9 is a schematic cross-sectional view of the first liquid storage segment in the first cavity of fig. 8.

Fig. 10 is a schematic cross-sectional view of the second liquid storage segment in the second containing cavity in fig. 8.

FIG. 11 is a cross-sectional view of another embodiment of a second liquid storage segment positioned in a second receiving cavity.

Detailed Description

The embodiments of the present application will be described below with reference to the drawings.

The present application provides an electronic device, including but not limited to a mobile phone (cellular phone), a notebook computer (notebook computer), a tablet computer (tablet personal computer), a laptop computer (laptop computer), a personal digital assistant (personal digital assistant), or a wearable device (wearable device). The following description will be made by taking the electronic device as a notebook computer.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application in a state, and fig. 2 is a schematic structural diagram of a case of the electronic device shown in fig. 1 in an open state. For convenience of description, the length direction of the electronic device 100 is defined as an X-axis direction, the width direction of the electronic device 100 is defined as a Y-axis direction, the thickness direction of the electronic device 100 is defined as a Z-axis direction, and the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.

In this embodiment, the electronic device 100 includes a display screen 110, a hinge member 120, and a main body 130, wherein the display screen 110 is connected to the main body 130 through the hinge member 120, and the display screen 110 can be opened or closed with respect to the main body 130. When the display screen 110 is opened relative to the main body 130, the display screen 110 and the main body 130 form a certain angle, and the electronic device 100 can be used by a user; the display 110 is stacked on the main body 130 when closed with respect to the main body 130, and the electronic apparatus 100 is in a standby or power-off state for storage.

In this embodiment, the display screen 110 includes a display surface 111 and an appearance surface 112, which are disposed opposite to each other, when the display screen 110 is closed relative to the main body 130, the display surface 111 faces the main body 130, and the appearance surface 112 is exposed and in a visible state; when the display screen 110 is opened relative to the main body 130, the display surface 111 is in a visible state, which is convenient for the user to view and operate.

The hinge member 120 is a hinge or hinge structure, and is coupled between the display screen 110 and the main body 130. The rotation shaft member 120 is a rotation structure between the display screen 110 and the main body 130 to realize free rotation of the display screen 110 relative to the main body 130.

The main body 130 includes a housing 131, a keypad 132, electronics (not shown in the drawings), a battery 133, and a heat sink 200. The keyboard 132 is mounted on the housing 131, and the keyboard 132 is exposed with respect to the housing 131 so that the user can operate the keyboard 132. An electronic device, including components such as a circuit board, a processor, a memory card, and a memory stick, which generate heat when the electronic apparatus 100 operates, and the heat dissipation apparatus 200 are mounted inside the housing 131. Specifically, the keyboard 132 is electrically connected to the processor, and the user can operate the keyboard 132 to generate an operation signal, and the processor can process the operation signal. The battery 133 is used to power the electronics and the heat sink 200, etc. The heat dissipation device 200 is connected with the electronic device, the heat generated when the electronic device operates is dissipated by the heat dissipation device 200, after the heat is dissipated by the heat dissipation device 200, the electronic device can be prevented from being overheated to trigger a protection mechanism, after the protection mechanism is triggered, the electronic device can be prevented from further rising with the reduction of power consumption, after the power consumption of the electronic device is reduced, the performance cannot be effectively exerted, and the use of the electronic equipment can be influenced. After the heat is effectively dissipated, the temperature of the electronic device is controlled within a certain range, so that the possibility of triggering a protection mechanism can be prevented or reduced, and the performance of the electronic device can be well exerted.

The housing 131 is rectangular parallelepiped and includes a mounting wall 134, a bottom wall 135 and a peripheral wall 136, wherein the mounting wall 134 and the bottom wall 135 are opposite to each other and are respectively located at two opposite sides of the peripheral wall 136. The mounting wall 134 is used for mounting the keyboard 132, when the display screen 110 is closed relative to the main body 130, the mounting wall 134 is opposite to the display screen 110, the casing 131 houses and protects the keyboard 132 and the display surface 111 of the display screen 110, and when the display screen 110 is opened relative to the main body 130, the mounting wall 134 is exposed, so that the keyboard 132 is exposed, and therefore operation of a user is facilitated. The bottom wall 135 may contact a desktop to facilitate supporting the electronic device 100. The mounting wall 134, the bottom wall 135 and the peripheral wall 136 form a mounting cavity, the peripheral wall 136 is provided with a heat dissipation opening 137, and the bottom wall 135 is provided with a ventilation opening (not shown). The mounting cavity is used for accommodating functional devices of a computer, electronic devices and the heat dissipation device 200, and the heat dissipation port 137 is used for communicating the outside and the mounting cavity, so that heat emitted by the electronic devices can be conveniently circulated to the outside through the heat dissipation port 137. The vents in the bottom wall 135 are used to communicate the outside with the mounting cavity so that outside air can enter the mounting cavity for the fan 230 of the heat sink 200 to operate.

The heat sink 200 is installed in the installation cavity of the housing 131 near the heat dissipation port 137, and the heat sink 200 includes a heat conduction device 300, a heat conduction plate 210, heat dissipation fins 220, and a fan 230; the heat conductive plate 210 is connected to and stacked (attached) on the heat generating electronic device, the heat radiating fins 220 are located between the air outlet of the fan 230 and the heat radiating holes 137 of the case 131, and opposite ends of the heat conductive device 300 contact the heat conductive plate 210 and the heat radiating fins 220, respectively. When the notebook computer is in a working state, the heat conducting plate 210 transfers heat emitted from the electronic device to the heat conducting device 300, the heat conducting device 300 transfers the heat of the electronic device to the heat dissipating fins 220, and the fan 230 supplies air to the heat dissipating fins 220 to dissipate the heat on the heat dissipating fins 220, so that the heat emitted from the electronic device is transferred to the outside through the heat dissipating port 137. In the present embodiment, the number of the heat dissipation fins 220, the heat dissipation fans 230, and the heat conduction devices 300 is two, the two heat dissipation fans 230 are symmetrically distributed on two sides of the heat conduction plate 210, one heat dissipation fin 220 is located between an air outlet of one heat dissipation fan 230 and one heat conduction device 300, the other heat dissipation fin 220 is located between an air outlet of the other heat dissipation fan 230 and the other heat conduction device 300, and the two heat conduction devices 300 are at least partially stacked on the heat conduction plate 210.

The heat conducting plate 210 and the heat dissipating fins 220 are made of metal having high thermal conductivity, and in the present embodiment, the heat conducting plate 210 and the heat dissipating fins 220 are made of copper. In other embodiments, the heat conducting plate 210 and the heat dissipating fins 220 are made of metal such as silver, aluminum or gold; or an alloy made of two or more of copper, gold, indium, and aluminum.

Referring to fig. 3 and fig. 3, which are schematic structural views of the heat conducting device shown in fig. 2, the heat conducting device 300 includes a body 310 and a liquid storage 320, the liquid storage 320 is located inside the body 310, and forms a heat dissipation channel 331 with the body 310, and the heat dissipation channel 331 extends along a length direction of the body 310. The liquid storage component 320 is used for storing liquid, the heat dissipation channel 331 is used for allowing gas generated by heating and gasifying the liquid to flow, and the body 310 is used for conducting heat by utilizing the principle of heat absorption of liquid gasification. The heat conduction device 300 forms an evaporation portion 301, a heat insulation portion 302, and a condensation portion 303. In this embodiment, the body 310 is made of copper; in other embodiments, the body 310 is made of metal such as silver, aluminum or gold; or an alloy made of two or more of copper, gold, indium, and aluminum. In the embodiment, the liquid is water, and the water cost is low; in other embodiments, the liquid is ethanol or diethyl ether, and the ethanol and diethyl ether are gasified at a lower temperature, so that more heat can be taken away. When the electronic equipment works, heat emitted by electronic devices of the electronic equipment is directly transferred to the evaporation part 301, liquid stored in the evaporation part 301 is heated and evaporated into gas, the gas flows to the heat insulation part 302 in the heat dissipation channel 331, the temperature of the gas is gradually reduced when the gas flows through the heat insulation part, the gas finally flows to the condensation part 303, the temperature of the gas is further reduced in the condensation part 303, the gas is then condensed into liquid, and the condensed liquid flows back to the evaporation part for next cycle use.

Referring to fig. 4, fig. 4 is an exploded view of the body of the heat conducting device shown in fig. 3, the body 310 includes a heat conducting chamber 330, a heat conducting pipe 340, a first end cap 350 and a second end cap 360; the heat pipe 340 is a hollow pipe with two opposite ends open, the hollow portion of the heat pipe 340 forms a heat conducting cavity 330 of the body 310, the heat conducting cavity 330 is used for accommodating the liquid storage component 320, and is used for forming a heat dissipation channel 331 with the liquid storage component 320. Specifically, the two ends of the heat conducting pipe 340 are respectively a first end and a second end, an opening at the first end is referred to as a first opening 341, and an opening at the second end is referred to as a second opening 342. The first and second openings 341 and 342 are both in communication with the thermal conduction chamber 330. The first end cap 350 is fixed to the first end of the heat conductive pipe 340, and closes the first opening 341; the second end cap 360 is fixed to the second end of the heat conductive pipe 340 and closes the second opening 342.

In this embodiment, the heat conducting pipe 340, the first end cap 350 and the second end cap 360 are separately formed, so that the first opening 341 or the second opening 342 is used for allowing the liquid storage member 320 to enter the heat conducting cavity 330 before the first end cap 350 and the second end cap 360 are connected to the two ends of the heat conducting pipe 340. In other embodiments, the heat conducting pipe 340 is integrally formed with the first end cap 350, so that the second opening 342 allows the liquid storage member 320 to enter the heat conducting cavity 330; alternatively, the heat pipe 340 is integrally formed with the second end cap 360, and the first opening 341 allows the liquid storage member 320 to enter the heat conducting cavity 330.

With continued reference to fig. 4, the heat pipe 340 is in a bent flat bar shape and has two bending portions. The heat conducting pipe 340 includes a first heat conducting section 347, a second heat conducting section 348 and a third heat conducting section 349, which are connected in sequence, where the dotted line in fig. 4 is used as a boundary point between adjacent heat conducting sections, one end of the first heat conducting section 347 away from the second heat conducting section 348 is a first end of the heat conducting pipe 340, and one end of the third heat conducting section 349 away from the second heat conducting section 348 is a second end of the heat conducting pipe 340. Specifically, the first heat conducting section 347 and the third heat conducting section 349 are located at two opposite ends of the second heat conducting section 348 and are arranged in parallel, the first heat conducting section 347 and the second heat conducting section 348 are connected with each other at a first included angle R1, and the third heat conducting section 349 and the second heat conducting section 348 are connected with each other at a second included angle R2; and the connection between the first heat conduction section 347 and the second heat conduction section 348 is in arc transition, and the connection between the second heat conduction section 348 and the third heat conduction section 349 is in arc transition, thereby facilitating the processing. The first thermally conductive section 347 is used to form the evaporation section 301 of the thermally conductive device 300, the second thermally conductive section 348 is used to form the heat insulation section 302 of the thermally conductive device 300, and the third thermally conductive section 349 is used to form the condensation section 303 of the thermally conductive device 300. The first heat conductive section 347 includes a connection section 347a, a heat conductive contact section 347b, and a redundancy storage section 347c connected in sequence, the connection section 347a being located between the second heat conductive section 348 and the heat conductive contact section 347b, and the heat conductive contact section 347b for contacting a heat generation source, which herein refers to a heat conductive plate transferring heat of the electronic device. The redundant memory segment 347c is offset from the heat-generating source.

In this embodiment, the first included angle R1 and the second included angle R2 are equal and obtuse angles, at this time, the extending directions of the first heat conducting section 347 and the third heat conducting section 349 are both parallel to the X-axis direction, and the second heat conducting section 348 is inclined relative to the Y-axis. In other embodiments, the first included angle R1 is different from the second included angle R2. In other embodiments, the first included angle R1 is a right angle or an acute angle, and the second included angle R2 is a right angle or an acute angle. The length of the heat pipe 340 can be increased in a unit area by the bent heat pipe 340, so that the heat conducting area is increased, and the heat conducting efficiency is improved. In other embodiments, the heat pipe 340 has a bending portion, or has no bending portion.

The heat conducting cavity 330 is formed partially on the first heat conducting section 347 and has the same length as the first heat conducting section 347, partially on the second heat conducting section 348 and has the same length as the second heat conducting section 348, and partially on the third heat conducting section 349 and has the same length as the third heat conducting section 349; that is, the heat conduction cavity 330 extends through the first, second and third heat conduction sections 347, 348, 349.

Referring to fig. 5, fig. 5 is a schematic plan view illustrating the heat conductive pipe of the heat conductive device shown in fig. 4, wherein the heat conductive chamber 330 includes a first accommodating chamber 332 and a second accommodating chamber 333 sequentially distributed along the length direction of the heat conductive pipe 340, wherein the first accommodating chamber 332 is opposite to and communicated with the first opening 341, and the second accommodating chamber 333 is opposite to and communicated with the second opening 342. In this embodiment, the first receiving cavity 332 is located in the first heat conducting section 347, and has a length smaller than that of the first heat conducting section 347. A portion of the second receiving cavity 333 is located in the first heat conducting section 347 and has a length smaller than that of the first heat conducting section 347, another portion of the second receiving cavity 333 is located in the second heat conducting section 348 and has a length equal to that of the second heat conducting section 348, and the rest of the second receiving cavity 333 is located in the third heat conducting section 349 and has a length equal to that of the third heat conducting section 349. That is, the second receiving cavity 333 passes through the second heat conducting section 348 and the third heat conducting section 349, communicates with the first heat conducting section 347 but does not pass through the first heat conducting section 347, and has a gap with the first opening 341, and the gap between the second receiving cavity 333 and the first opening 341 is the first receiving cavity 332.

In this embodiment, the cross-sectional area of the heat conducting cavity 330 is similar to a rectangle. The first receiving chamber 332 includes a first cavity 334 and a second cavity 335 sequentially distributed along the length direction of the heat conductive pipe 340. The first cavity 334 is in opposing communication with the first opening 341; the second cavity 335 is located between the first cavity 334 and the second receiving cavity 333. The second cavity 335 includes a first sub-cavity 336 and a second sub-cavity 337 sequentially distributed along the width direction of the heat conducting pipe 340, that is, the first sub-cavity 336 and the second sub-cavity 337 are stacked and distributed and communicated, and the cavity diameter of the first sub-cavity 336 and the cavity diameter of the second sub-cavity 337 are respectively half of the cavity diameter of the first accommodating cavity 332. The cavity diameter refers to the dimension of the heat conduction cavity in the width direction. In other embodiments, the cavity diameter of the first sub-cavity 336 is 0.3 times, 0.6 times, 0.7 times or 0.8 times the cavity diameter of the first receiving cavity 332, and correspondingly, the cavity diameter of the second sub-cavity 337 is 0.7 times, 0.4 times, 0.3 times or 0.2 times the cavity diameter of the first receiving cavity 332.

The second receiving cavity 333 includes a heat dissipation channel 331 and a third cavity 338 sequentially distributed along the width direction of the heat pipe 340, that is, the heat dissipation channel 331 and the third cavity 338 are distributed and communicated in a stacked manner, and the cavity diameter of the heat dissipation channel 331 and the cavity diameter of the third cavity 338 are respectively half of the cavity diameter of the second receiving cavity 333. In other embodiments, the third cavity 338 has a cavity diameter that is 0.3 times, 0.35 times, 0.4 times, or 0.45 times the cavity diameter of the second housing cavity 333. Correspondingly, the cavity diameter of the heat dissipation channel 331 is 0.7 times, 0.65 times, 0.6 times or 0.55 times the cavity diameter of the second accommodating cavity 333.

In this embodiment, the first receiving cavity 332 is located at the first heat conducting section 347, and has a length smaller than that of the first heat conducting section 347, that is, the first cavity 334 and the second cavity 335 (the first sub-cavity 336 and the second sub-cavity 337) are located at the first heat conducting section 347; specifically, the first cavity 334 is located in the redundant storage section 347c and the second cavity 335 is located in the thermally conductive contact section 347 b. A portion of the second receiving cavity 333 is located in the first heat conducting section 347 and has a length smaller than that of the first heat conducting section 347, another portion of the second receiving cavity 333 is located in the second heat conducting section 348 and has a length equal to that of the second heat conducting section 348, and the rest of the second receiving cavity 333 is located in the third heat conducting section 349 and has a length equal to that of the third heat conducting section 349.

Specifically, a portion of the third cavity 338 of the second receiving cavity 333 is located in the first heat conducting section 347 and has a length smaller than that of the first heat conducting section 347, a portion of the third cavity 338 is located in the second heat conducting section 348 and has a length equal to that of the second heat conducting section 348, and the remaining portion of the third cavity 338 is located in the third heat conducting section 349 and has a length equal to that of the third heat conducting section 349. That is, the third cavity 338 penetrates the second heat conducting section 348 and the third heat conducting section 349 and is spaced apart from the first opening 341, and the space between the third cavity 338 and the first opening 341 is a part of the first receiving cavity 332.

The liquid storage component 320 is installed in the heat conducting cavity 330 of the body 310, and a heat dissipation channel 331 is formed between the liquid storage component 320 and the cavity wall of the heat conducting cavity 330, specifically, the liquid storage component 320 is located in the heat conducting cavity 330 and close to the cavity wall on one side, and the heat dissipation channel 331 is formed between the liquid storage component 320 and the cavity wall on the other side. The liquid storage part 320 is partially positioned in the third cavity 338, the heat dissipation channel 331 and the third cavity 338 are arranged in a stacked manner, and the length and the contour of the heat dissipation channel 331 are the same, that is, the heat dissipation channel 331 is partially positioned in the first heat conduction section 347 and is shorter than the first heat conduction section 347; another portion of the heat dissipation channel 331 is located on the second heat conduction section 348 and has the same length as the second heat conduction section 348; the heat dissipation channel 331 is also partially formed on the third heat conduction section 349 and has the same length as the third heat conduction section 349. That is, the heat dissipation channel 331 penetrates through the second heat conduction section 348 and the third heat conduction section 349, and has a certain interval with the first opening 341, and the interval between the heat dissipation channel 331 and the first opening 341 is another part of the first receiving cavity 332. The heat dissipation channel 331 extends from the first heat conduction section 347 to the third heat conduction section 349, and since the first heat conduction section 347 and the second heat conduction section 348 form an included angle, and the second heat conduction section 348 and the third heat conduction section 349 form an included angle, the heat dissipation channel 331 is also bent along with the bending of the heat conduction pipe 340. Then, when the liquid is evaporated into gas and flows in the heat dissipation channel 331, the flow rate of the gas is reduced at the bent portion, and the time for the gas to contact the wall of the heat conduction pipe 340 is increased, thereby facilitating the condensation of the gas into liquid.

In this embodiment, in the length direction of the heat conducting pipe 340, the first sub-cavity 336 is opposite to and connected to the heat dissipating channel 331, and the second sub-cavity 337 is opposite to and connected to the third cavity 338. First cavity 334, second cavity 335 (first subchamber 336 and second subchamber 337), and third cavity 338 each receive a portion of reservoir 320.

Referring to fig. 6, fig. 6 is a schematic cross-sectional view of the heat conducting pipe of the heat conducting device shown in fig. 4, wherein the heat conducting pipe 340 is a strip-shaped pipe body with a flat section along the thickness direction, the cross-sectional shape is substantially rectangular, and the width (Y direction in fig. 6) dimension of the heat conducting pipe 340 is larger than the thickness (Z direction in fig. 6) dimension of the heat conducting pipe 340. The thickness of the heat pipe 340 is between 1.8 mm and 2.2 mm, and the thickness of the heat pipe 340 may be 1.8 mm, 1.9 mm, 2 mm, 2.1 mm, or 2.2 mm. Therefore, the thickness of the heat pipe 340 is small, and the thickness space occupied by the heat pipe 340 in the notebook computer can be saved. In other embodiments, the heat conducting pipe 340 is a round pipe. It should be noted that the thickness of the heat conducting pipe 340 includes the thickness of the pipe wall and the width of the heat conducting cavity 330 along the Z-axis direction.

Specifically, the heat conductive pipes 340 comprise a first wall 343, a second wall 344, a third wall 345 and a fourth wall 346 connected in sequence, wherein the first wall 343 and the third wall 345 are oppositely arranged and parallel, the second wall 344 and the fourth wall 346 are oppositely arranged and parallel, and the connection is arranged in an arc angle; the first wall 343 and the third wall 345 form two long sides of the rectangular cross section, the second wall 344 and the fourth wall 346 form two short sides of the rectangular cross section, the two long sides are parallel to the width direction of the heat conductive pipes 340, and the two short sides are parallel to the thickness direction of the heat conductive pipes 340; the first wall 343, the second wall 344, the third wall 345 and the fourth wall 346 enclose a heat conducting cavity 330. The cross section of the heat pipe 340 in the thickness direction is rectangular, so that the heat pipe 340 has a small thickness, and occupies a small space in the thickness direction when being installed inside an electronic device; in addition, the heat conducting pipe 340 with such a shape is easy to process, and the shape of the heat conducting cavity 330 is relatively regular and has a large capacity, so that the heat radiating channel 331 and the liquid storage part 320 are convenient to arrange.

In other embodiments, the cross-sectional shape of the heat conductive pipe 340 in the thickness direction is a parallelogram, which is different from the rectangular cross-section in that the second wall 344 and the fourth wall 346 are inclined with respect to the central axis of the heat conductive pipe 340 in the thickness direction. In other embodiments, the cross-sectional shape of the heat pipe 340 along the thickness direction is an ellipse, specifically, the first wall 343, the second wall 344, the third wall 345 and the fourth wall 346 are arc-shaped walls, the major axis of the ellipse of the cross-section of the heat pipe 340 along the thickness direction is parallel to the width direction of the body 310, the minor axis of the ellipse of the cross-section of the heat pipe 340 along the thickness direction is parallel to the thickness direction of the body 310, and the major axis is much larger than the minor axis, for example, the major axis is 4 times or 5 times of the minor axis.

Referring to fig. 7 and 7, which are schematic structural views of the liquid storage device shown in fig. 3, the liquid storage device 320 is an elongated strip with a rectangular cross section, which can be understood as a strip with a flat shape, and the outline of the liquid storage device 320 is substantially the same as the outline of the heat conduction pipe, and in particular, referring to fig. 5, the outline of the liquid storage device 320 is the same as the outlines of the first receiving cavity 332 and the third cavity 338. The reservoir 320 is located within the first receiving cavity 332 and the third receiving cavity 338 of the thermal conduction cavity 330. The liquid storage member 320 is made of copper in this embodiment. In other embodiments, the liquid storage member 320 is made of metal such as silver, aluminum or gold; or an alloy made of two or more of copper, gold, indium, and aluminum. In other embodiments, the liquid storage member 320 is made of sponge, soft gel, or other materials that can be easily processed into a capillary structure.

The reservoir 320 includes a first reservoir portion 321 and a second reservoir portion 322, the first reservoir portion 321 and the second reservoir portion 322 may be integrally formed, and the first reservoir portion 321 is connected to one end of the second reservoir portion 322. The first liquid storage section 321 of the liquid storage part 320 is used for storing liquid, and the second liquid storage section 322 is used for storing liquid in the first liquid storage section 321, changing the liquid into gas, and condensing the gas. The first liquid storage section 321 is used for forming the evaporation portion 301 of the heat conducting device 300, and includes a heat conducting section 321b and a redundant section 321a connected in sequence, wherein the heat conducting section 321b is located between the second liquid storage section 322 and the redundant section 321a, the heat conducting section 321b is used for being opposite to the electronic device of the electronic apparatus, and the redundant section 321a is used for being staggered from the electronic device of the electronic apparatus. The second liquid storage section 322 includes a first section 322a, a second section 322b, and a third section 322c connected in this order, the first section 322a being for forming the evaporation portion 301 of the heat conduction device 300, the second section 322b being for forming the heat insulation portion 302 of the heat conduction device 300, and the third section 322c being for forming the condensation portion 303 of the heat conduction device 300.

The liquid storage member 320 has a capillary structure for dissipating heat, and specifically, the liquid storage member 320 includes one or more of a powder capillary structure (power), a mesh capillary structure (mesh), and a fiber capillary structure (fiber). In this embodiment, the first reservoir 321 includes a powder capillary structure 323, a mesh capillary structure 324, and a first fiber capillary structure 325, and the second reservoir 322 includes a second fiber capillary structure 326. Wherein the powder capillary structure 323 is used as a redundant segment, and the mesh capillary structure 324 and the first fiber capillary structure 325 are used as a heat conductive segment. The redundant segment (powder capillary structure 323), the heat conducting segment (grid capillary structure 324 and the first fiber capillary structure 325), and the second fiber capillary structure 326 are distributed along the length direction of the liquid storage member 320. The capillary force of the fiber capillary structure in the horizontal state is strong, and the capillary force of the powder capillary structure 323 in the vertical state is strong, so that the mode of combining the powder capillary structure 323 and the fiber capillary structure is adopted, and the heat conducting device 300 can play a good heat conducting effect no matter what state the notebook computer is in use. The mesh capillary structure 324 supplements the capillary force of the first fiber capillary structure 325, so that the capillary force at the position of the heat conducting device 300 opposite to the heat conducting plate 210 is stronger, more liquid can be stored, and other parts of liquid can be better adsorbed, and the mesh capillary structure is convenient to process and lower in cost.

In other embodiments, referring to fig. 7a, fig. 7a is another schematic view of the reservoir shown in fig. 3, the first reservoir segment 321 includes a lattice capillary structure 324, a first fiber capillary structure 325, and a third fiber capillary structure 327, and the second reservoir segment 322 is a second fiber capillary structure 326; wherein the first fiber capillary structure 325, the second fiber capillary structure 326 and the third fiber capillary structure 327 are integrally formed into a fiber capillary structure. The difference from the above embodiment is that the powder capillary structure 323 is replaced with a third fiber capillary structure 327. Therefore, the first liquid storage section 321 and the second liquid storage section 322 are integrally formed, so that the processing technology can be simplified, and the cost is further reduced. In addition, generally, when the notebook computer is used, the main body is mostly in a horizontal state, and the heat conduction device 300 is correspondingly in a horizontal state, so that the portion of the first liquid storage section 321 and the second liquid storage section 322 are both in a fiber capillary structure, and the heat conduction performance can be improved.

In other embodiments, referring to FIG. 7b, which is a schematic view of yet another configuration of the reservoir shown in FIG. 3, the first reservoir segment 321 and the second reservoir segment 322 of the reservoir 320 are both formed of a fibrous capillary structure. The processing technology can be further simplified, and the cost is reduced. In addition, generally, when the notebook computer is used, the main body is mostly in a horizontal state, at this time, the heat conduction device 300 is correspondingly in a horizontal state, and at this time, the liquid storage device 320 is integrally formed in a fiber capillary structure, so that the heat conduction performance can be improved.

With continued reference to fig. 7, in the present embodiment, the grid capillary structure 324 and the first fiber capillary structure 325 are stacked in the width direction of the liquid storage component 320, the grid capillary structure 324 and the first fiber capillary structure 325 have the same length, and two ends of the two are aligned respectively; the outer diameter of the mesh capillary structure 324 and the outer diameter of the first fiber capillary structure 325 are each half of the outer diameter of the first reservoir section 321. In other embodiments, the mesh capillary structure 324 has an outer diameter that is 0.3 times, 0.6 times, 0.7 times, or 0.8 times the outer diameter of the first reservoir 321, and correspondingly, the first fiber capillary structure 325 has an outer diameter that is 0.7 times, 0.4 times, 0.3 times, or 0.2 times the outer diameter of the first reservoir 321.

One ends of the mesh capillary structure 324 and the first fiber capillary structure 325 are in contact with one end of the powder capillary structure 323; the second fiber capillary structure 326 is connected with one end, far away from the powder capillary structure 323, of the first fiber capillary structure 325, the first fiber capillary structure 325 and the second fiber capillary structure 326 are integrally formed into a fiber capillary structure, and the fiber capillary structure is woven by copper wires with the diameter of 0.2 mm.

Referring to fig. 8 and fig. 8, which are schematic plane structures of the liquid storage part shown in fig. 3 and installed inside the heat conduction pipe, and also referring to fig. 5, the first liquid storage section 321 is located at a side of the heat conduction cavity 330 close to the first opening 341 and extends along the length direction of the heat conduction cavity 330, and the outer wall of the first liquid storage section 321 is in contact with the cavity wall of the heat conduction cavity 330 (the first liquid storage section 321 fills the space of the heat conduction cavity 330), or has a smaller interval with the cavity wall of the heat conduction cavity 330; the second liquid storage section 322 is located on one side of the heat conduction cavity 330 close to the second opening 342 and extends along the length direction of the heat conduction cavity 330, the heat conduction cavity 330 is not filled with the second liquid storage section 322, a part of the outer wall of the second liquid storage section 322 is in contact with a part of the cavity wall of the heat conduction cavity 330, a larger interval is formed between the other part of the outer wall of the second liquid storage section 322 and the other part of the cavity wall of the heat conduction cavity 330, the interval extends along the length direction of the heat conduction cavity 330, and a vacuum heat dissipation channel 331 is formed between the liquid storage member 320 and the heat conduction cavity 330.

Referring to fig. 5 and 7, the first liquid storage segment 321 is located in the first receiving cavity 332, and the second liquid storage segment 322 is located in the third hollow 338 of the second receiving cavity 333, that is, the second liquid storage segment 322 extends along the length direction of the body 310, the second liquid storage segment 322 only occupies the third hollow 338, and the remaining portion of the second receiving cavity 333 not occupied by the second liquid storage segment 322 forms the heat dissipation channel 331.

Specifically, the redundant segment 321a corresponds to the redundant storage segment 347c, and the heat conducting segment 321b corresponds to the heat conducting contact segment 347 b; that is, the redundant segment 321a is located within the first cavity 334 and the thermally conductive contact segment 347b is located within the second cavity 335. First section 322a corresponds to connecting section 347a, second section 322b corresponds to second thermally conductive section 348, and third section 322c corresponds to third thermally conductive section 349; that is, the first segment 322a is located in a portion of the second receiving cavity 333 formed by the connecting segment 347a, the second segment 322b is located in a portion of the second receiving cavity 333 formed by the second heat conducting segment 348, and the third segment 322c is located in a portion of the second receiving cavity 333 formed by the third heat conducting segment 349. The heat dissipation channel 331 is a part of the second receiving cavity 333, that is, the heat dissipation channel 331 penetrates the connection section 347a, the second heat conduction section 348 and the third heat conduction section 349.

In this embodiment, the redundant segment 321a and the redundant memory segment 347c have the same length, and the thermally conductive segment 321b and the thermally conductive contact segment 347b have the same length. First section 322a is of equal length to connecting section 347a, second section 322b is of equal length to second thermally conductive section 348, and third section 322c is of equal length to third thermally conductive section 349. Where equality allows for the presence of machining errors. Therefore, the internal space of the heat pipe 340 is fully utilized, so that the length of the first liquid storage section 321 is longer, and the first section 322a, the second section 322b and the third section 322c which form the second liquid storage section 322 are all longer, so that the volume of the liquid storage member 320 in the design range is the largest, the liquid storage amount is increased, and the heat dissipation effect of the heat conduction device is enhanced.

In this embodiment, the redundant segment 321a and the redundant storage segment 347c have the same length, and the heat conducting segment 321b and the heat conducting contact segment 347b have the same length, that is, the first liquid storage segment 321 has the same length as the first receiving cavity 332. On the premise of equal length, the volume of the first liquid storage section 321 is between 0.8 and 1 times of the volume of the first receiving cavity 332, for example, the volume of the first liquid storage section 321 is 0.8, 0.85, 0.9, 0.95 or 1 times of the volume of the first receiving cavity 332. Specifically, the thickness of the first liquid storage section 321 is equal to the height of the first receiving cavity 332, where the equal allows for the existence of the machining error, and the width of the first liquid storage section 321 is between 0.8 and 1 times the width of the first receiving cavity 332; alternatively, the width of the first liquid storage section 321 is equal to the width of the first receiving cavity 332, and the thickness of the first liquid storage section 321 is between 0.8 times and 1 time the height of the first receiving cavity 332. Therefore, the first liquid storage section 321 has a larger outer diameter and can contain more liquid, thereby increasing the heat dissipation effect. The outer diameter of the second liquid storage section 322 is smaller, and enough space can be reserved for arranging the heat dissipation channel 331, so that gas can better circulate.

The first section 322a and the connecting section 347a have the same length, the second section 322b and the second heat-conducting section 348 have the same length, and the third section 322c and the third heat-conducting section 349 have the same length, that is, the second liquid storage section 322 has the same length as the second receiving cavity 333. On the premise of equal length, the volume of the second liquid storage section 322 is between 0.3 and 0.5 times the volume of the second receiving cavity 333, for example, the volume of the second liquid storage section 322 is 0.3, 0.35, 0.4, 0.45 or 0.5 times the volume of the second receiving cavity 333. Specifically, the thickness of the second liquid storage section 322 is the same as the height of the second receiving cavity 333, and the width of the second liquid storage section 322 is between 0.3 and 0.5 times the width of the second receiving cavity 333, so that the volume of the second liquid storage section 322 is between 0.3 and 0.5 times the volume of the second receiving cavity 333. Alternatively, the width of the second liquid storage section 322 is set to be the same as the width of the second accommodating cavity 333, and the thickness of the second liquid storage section 322 is set to be between 0.3 times and 0.5 times the height of the second accommodating cavity 333, so that the volume of the second liquid storage section 322 is between 0.3 times and 0.5 times the volume of the second accommodating cavity 333. Therefore, the volume of the second accommodating cavity 333 occupied by the second liquid storage section 322 is reasonable, the volume of the heat dissipation channel 331 is large, vapor generated after liquid vaporization can circulate well, and heat conduction efficiency is improved.

In this embodiment, referring to fig. 5 and fig. 9 simultaneously, fig. 9 is a schematic cross-sectional structure diagram of the first liquid storage segment in fig. 8 located in the first receiving cavity, where a volume of the first liquid storage segment 321 is 1 time of a volume of the first receiving cavity 332, at this time, the volume of the first liquid storage segment 321 is the same as the volume of the first receiving cavity 332, and when the first liquid storage segment 321 is located in the first receiving cavity 332, the first liquid storage segment 321 fills the first receiving cavity 332, that is, a length, a width, and a thickness of the first liquid storage segment 321 are respectively equal to a length, a width, and a thickness of the first receiving cavity 332; wherein the four outer peripheral walls of the first reservoir section 321 are connected with the first, second, third and fourth walls 343, 344, 345 and 346, respectively. That is, when the redundant segment 321a is located in the first cavity 334 formed by the redundant memory segment 347c, the redundant segment 321a fills the first cavity 334, i.e., the length, width and thickness of the redundant segment 321a are equal to the length, width and thickness of the first cavity 334, respectively. The thermally conductive section 321b is located in the second cavity 335 formed by the thermally conductive contact section 347b, and the thermally conductive section 321b fills the second cavity 335, i.e. the length, width and thickness of the thermally conductive section 321b are equal to the length, width and thickness of the second cavity 335, respectively. In other words, the cross-section of the redundant segment 321a has the same shape and area as the cross-section of the first cavity 334, and the cross-section of the heat conducting segment 321b has the same area and shape as the cross-section of the second cavity 335. Therefore, the volume of the first liquid storage segment 321 (the redundant segment 321a and the heat conducting segment 321 b) is the largest in the design range, and more liquid can be contained, so that the heat dissipation effect is increased.

In this embodiment, referring to fig. 5 and fig. 10, fig. 10 is a schematic cross-sectional view of the second liquid storage segment in fig. 8 located in the second receiving cavity, wherein the volume of the second liquid storage segment 322 is 0.5 times the volume of the second receiving cavity 333; specifically, the length and the thickness of the second liquid storage section 322 are respectively equal to those of the second accommodating cavity 333, and the width of the second liquid storage section 322 is 0.5 times that of the second accommodating cavity 333; three of the four peripheral walls of the second liquid storage section 322 are connected to the first wall 343, the third wall 345 and the fourth wall 346, and a space is formed between the other peripheral wall of the second liquid storage section 322 and the second wall 344 to form a heat dissipation channel 331. From this, second stock solution section 322 and heat dissipation channel 331's volume distribution is comparatively reasonable, at this moment, can make the better stock solution body of second stock solution section 322 ability, can ensure again that heat dissipation channel 331 can make gas have more for abundant space to circulate to the radiating effect has been strengthened.

Referring to fig. 11, fig. 11 is a schematic cross-sectional view of a second liquid storage segment in a second receiving cavity according to another embodiment. The volume of the second liquid storage section 322 is 0.5 times of the volume of the second accommodating cavity 333; specifically, the length and the width of the second liquid storage section 322 are respectively equal to those of the second accommodating cavity 333, and the thickness of the second liquid storage section 322 is 0.5 times of the height of the second accommodating cavity 333; three of the four peripheral walls of the second liquid storage section 322 are connected with the second wall 344, the third wall 345 and the fourth wall 346, and the other peripheral wall of the second liquid storage section 322 is spaced from the first wall 343 to form a heat dissipation channel 331. From this, second stock solution section 322 and heat dissipation channel 331's volume is all comparatively reasonable, at this moment, can make the better stock solution body of second stock solution section 322 ability, can ensure again that heat dissipation channel 331 can make gas have more for abundant space to circulate to the radiating effect has been strengthened. After the heat conducting device 300 is installed inside the casing of the electronic device, the second liquid storage section 322 and the heat dissipating channel 331 are stacked along the thickness direction of the electronic device, and the second liquid storage section 322 is located below the heat dissipating channel 331, so that the condensed gas drops downwards into the second liquid storage section 322 under the action of gravity, and the second liquid storage section 322 better stores the liquid condensed from the gas.

Referring to fig. 5, 7 and 8, the evaporation portion 301 of the heat conducting device 300 includes a connection section 347a, a heat conducting contact section 347b, a redundant storage section 347c, a first liquid storage section 321 and a first segment 322 a; the heat insulation 302 of the heat conduction device 300 includes a second heat conduction section 348 and a second section 322 b; the condensation section 303 of the heat transfer device 300 includes a third heat transfer section 349 and a third section 322 c.

Here, at the evaporation portion 301, the heat conducting contact section 347b is in contact with the heat conducting plate 210, and specifically, the outer surface of the heat conducting contact section 347b is in contact with the outer surface of the heat conducting plate 210, so that heat is transferred to the heat conducting contact section 347b through the heat conducting plate 210 and then transferred to the heat conducting section 321b through the heat conducting contact section 347b, so that the liquid stored in the heat conducting section 321b is heated and evaporated. The redundant storage section 347c is staggered from the heat conducting plate 210 without contacting, after the liquid in the heat conducting section 321b is partially evaporated, the liquid stored in the redundant section 321a can flow to the heat conducting section 321b, so as to supplement the liquid to the heat conducting section 321b, and prevent the heat conducting device 300 from failing after the liquid in the liquid storage member 320 is dried. The heat dissipation channel 331 corresponding to the first segment 322a allows the evaporated gas to flow to the heat insulation portion 302, and the first segment 322a allows the condensed liquid to flow back to the heat conducting segment 321 b.

At the heat insulating part 302, the second heat conducting section 348 is not in contact with the heat conducting plate 210, and after the part of the heat dissipating passage 331 corresponding to the second section 322b receives the gas transferred from the evaporation part 301, the temperature of the gas is lowered and continues to flow to the condensation part 303. The second section 322b is used for returning the condensed liquid to the heat conducting section 321 b. The second heat conducting section 348 isolates the third heat conducting section 349 and the heat conducting plate 210, and reduces or avoids the risk that the heat of the heat conducting plate 210 is directly transferred to the third heat conducting section 349, so that the gas can be better condensed into liquid at the third heat conducting section 349, and the liquid and the gas can be well circulated.

At the condensing part 303, the third heat conductive section 349 is not in contact with the heat conductive plate 210, and the third heat conductive section 349 is farther from the heat conductive plate 210 with respect to the second heat conductive section 348. The outer surface of the third heat conducting section 349 contacts the heat dissipating fins 220 to conduct heat away. After the part of the heat dissipation channel 331 corresponding to the third segment 322c receives the gas transmitted by the heat insulation part 302, the temperature of the gas is further reduced, at this time, the gas is condensed into liquid and drops into the third segment 322c, and the condensed liquid sequentially flows into the second segment 322b and the first segment 322a from the third segment 322c to the heat conduction segment 321b, thereby completing a cycle.

In this embodiment, since the heat conduction function of the heat conduction device 300 is realized by absorbing heat based on vaporization of liquid, then, under the condition that the amount of liquid in the liquid storage member 320 is small, the liquid is easily vaporized into gas, at this time, there is no liquid in the liquid storage member 320, then the heat conduction device 300 loses the heat conduction function, and at this time, the electronic device has a risk of being burnt. In this embodiment, the heat conducting section 321b of the first liquid storage section 321 is opposite to the electronic device, and the redundant section 321a is staggered from the electronic device, so as to supplement the liquid into the heat conducting section 321b after the liquid in the heat conducting section 321b is evaporated, so that the liquid always exists in the heat conducting device 300. That is, the liquid stored in the liquid storage 320 is relatively large, and therefore, when the temperature of the electronic device is relatively high and the heat transferred to the heat pipe 340 is relatively large, the liquid in the liquid storage 320 is not completely vaporized, so that the heat conduction device 300 can be prevented from being out of work, and the heat conduction device 300 is ensured to be in an effective heat conduction state all the time. After the temperature of the electronic device is too high, a protection mechanism can be triggered, the electronic device can prevent the temperature from further rising by reducing power consumption, and after the power consumption of the electronic device is reduced, the performance cannot be effectively exerted, so that the use of electronic equipment can be influenced. The heat conducting device is always in an effective heat conducting state, so that the possibility of triggering a protection mechanism can be prevented or reduced, and the performance of the electronic device can be well exerted.

It is understood that due to the difference in the heat dissipation of the electronic device, some or all of the gas may also be liquefied into liquid when flowing through the corresponding part of the heat dissipation channel 331 in the heat insulation portion 302. Part or all of the gas may not be liquefied into a liquid when it flows to the side of the condensation unit 303 close to the heat insulating unit 302, and may be liquefied into a liquid when it flows to the side of the condensation unit 303 away from the heat insulating unit 302. It is further understood that when the heat conducting device 300 is not installed in the electronic device, i.e. in the initial state, the first liquid storage section 321 and the second liquid storage section 322 both partially or completely store liquid.

In this embodiment, where the first reservoir 321 includes the powder capillary structure 323, the mesh capillary structure 324, and the first fiber capillary structure 325, and the second reservoir 322 includes the second fiber capillary structure 326, the relationship between the capillary structures and the chambers is as follows: the powder capillary structure 323 is located within the first cavity 334, the grid capillary structure 324 is located within the first sub-cavity 336, and the first fiber capillary structure 325 is located within the second sub-cavity 337. The second fiber capillary structure is located within the third cavity 338 of the second housing 333.

After the heat conducting device 300 is installed in the installation cavity of the housing 131, the heat conducting section 321b (the first fiber capillary structure 325 and the grid capillary structure 324) is opposite to the heat conducting plate 210, that is, the heat conducting section 321b (the first fiber capillary structure 325 and the grid capillary structure 324) is opposite to the electronic device, compared with the case of only providing the first fiber capillary structure 325, the capillary force effect is enhanced, and the condensed liquid can be better absorbed back from the second fiber capillary structure 326, so that the heat conducting effect is increased. The redundant segment 321a (powder capillary structure 323) is located between the heat conducting segment 321b (grid capillary structure 324 and first fiber capillary structure 325) and the second fiber capillary structure 326, and the redundant segment 321a (powder capillary structure 323) is located next to the electronic device, but is not opposite to the electronic device, which neither hinders the circulation of liquid and gas, but can increase the capillary force, store more liquid, and reduce the occurrence of heat conduction failure due to the total vaporization of the liquid in the liquid storage member 320. The long length of the circulation zone (second fiber capillary structure 326) allows for the storage and transfer of liquid formed by the condensation of the gas, increases the storage of liquid, and ensures good circulation of liquid and gas.

When the heat conducting device 300 is manufactured, firstly, metal powder for manufacturing the powder capillary structure 323 is filled in the first cavity 334; then welding the grid capillary structure 324 into the first sub-cavity 336, then loading the fiber capillary structure into the heat-conducting cavity 330, and enabling the first fiber capillary structure 325 to be located in the second sub-cavity 337 and the first fiber capillary structure 325 to be located in the second accommodating cavity 333; the heat conducting pipe 340 is then sintered, at this time, the metal powder is formed into the powder capillary structure 323, and the fiber capillary structure, the mesh capillary structure 324 and the powder capillary structure 323 are all fixed on the wall of the heat conducting cavity 330. Finally, the first end cap 350 is secured to the first end of the heat pipe 340 and the second end cap 360 is secured to the second end of the heat pipe 340. The whole process is simple, the cost is low, and the capillary force action is strong. In the manner of combining the fiber capillary structure, the mesh capillary structure and the powder capillary structure, when the thickness of the heat conduction device 300 is less than 2 mm, the space of the heat dissipation channel 331 is still large enough, and the second fiber capillary structure 326 can still maintain a good state of storing liquid and returning liquid to the first liquid storage section 321.

That is, the powder capillary structure 323 as the redundant segment 321a has a strong liquid storage capacity, and can ensure that the stored liquid is supplemented to the grid capillary structure 324 and the first fiber capillary structure 325, and the possibility of flowing to the second fiber capillary structure 326 is low, and in addition, the processing technology of the powder capillary structure 323 is simpler and the cost is lower. The mesh capillary structure 324 supplements the capillary force and the liquid storage capacity of the first fiber capillary structure 325, so that the capillary force at the heat conducting section 321b is stronger than that at other parts of the liquid storage part 320, and after the liquid at the heat conducting section 321b is evaporated, the liquid is quickly adsorbed from other parts for supplementing, so that the heat conducting capacity of the heat conducting device is enhanced. The second fiber capillary structure 326 has a long penetration length and a strong capillary force, can better adsorb condensed liquid, can rapidly transmit the condensed liquid to the heat conducting section 321b, and cannot reversely adsorb the liquid at the heat conducting section 321 b. That is, the capillary force of the mesh capillary structure 324 and the first fiber capillary structure 325 is the largest, the capillary force of the second fiber capillary structure 326 is the next to the capillary force of the powder capillary structure 323 is the smallest.

As can be seen from the above, the liquid storage component 320 is formed by combining the powder capillary structure 323, the grid capillary structure 324, the first fiber capillary structure 325 and the second fiber capillary structure 326, so that the heat conduction device has low cost, high liquid storage capacity and reasonable capillary force distribution, and the heat conduction device has high heat conduction capacity.

The above embodiments and embodiments of the present application are only examples and embodiments, and the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all the changes or substitutions should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (19)

1. A heat transfer device, comprising: the heat conduction pipe and the liquid storage part;

the heat conduction pipe comprises a first heat conduction section, a second heat conduction section and a third heat conduction section which are connected in sequence, and the heat conduction pipe is provided with a heat conduction cavity which penetrates through the first heat conduction section, the second heat conduction section and the third heat conduction section; the liquid storage part is provided with a capillary structure for heat dissipation and comprises a first liquid storage section and a second liquid storage section which are connected in sequence;

the liquid storage part is arranged in the heat conduction cavity and extends along the length direction of the heat conduction pipe; the first heat conduction section comprises a connecting section, a heat conduction contact section and a redundant storage section which are sequentially connected, the connecting section is positioned between the second heat conduction section and the heat conduction contact section, the heat conduction contact section is used for contacting a heating source, and the redundant storage section is used for being staggered with the heating source; the first liquid storage section comprises a heat conduction section and a redundant section, the heat conduction section corresponds to the heat conduction contact section, and the redundant section corresponds to the redundant storage section; and a heat dissipation channel is formed between the second liquid storage section and the heat conduction pipe, and corresponds to the connection section of the first heat conduction section, the second heat conduction section and the third heat conduction section.

2. The heat transfer device of claim 1, wherein the redundant segment and the redundant memory segment are equal in length.

3. A heat transfer device as recited in claim 1 or 2, wherein the cross-section of the redundant segment is the same shape and area as the cross-section of the heat transfer cavity.

4. A heat transfer device as claimed in claim 1 or 2, wherein the second liquid storage section comprises a first section, a second section and a third section connected in series, and an end of the first section remote from the second section is connected to the heat transfer section; the first segment corresponds to the connecting segment and is equal in length, the second segment corresponds to the second heat conduction segment and is equal in length, and the third segment corresponds to the third heat conduction segment and is equal in length.

5. A heat transfer device as defined in claim 1 or 2, wherein the liquid reservoir comprises one or more of a powder capillary structure, a mesh capillary structure and a fibre capillary structure.

6. A heat transfer device as recited in claim 5, wherein the first reservoir segment includes a powder capillary structure, a mesh capillary structure, and a first fiber capillary structure, and the second reservoir segment includes a second fiber capillary structure; the grid capillary structure and the first fiber capillary structure are arranged in a stacked mode in the width direction of the liquid storage part, one end of the grid capillary structure and one end of the first fiber capillary structure are both in contact with one end of the powder capillary structure, and the other end of the first fiber capillary structure is connected with one end of the second fiber capillary structure; the powder capillary structure forms the redundant segment, and the grid capillary structure and the first fiber capillary structure form the thermally conductive segment.

7. A heat transfer device as recited in claim 6, wherein the heat transfer chamber comprises a first receiving chamber and a second receiving chamber, the first receiving chamber and the second receiving chamber are sequentially connected along the length direction of the heat transfer pipe, the first receiving chamber comprises a first cavity and a second cavity sequentially distributed along the length direction of the heat transfer pipe, the second cavity is located between the first cavity and the second heat transfer section, and the second cavity comprises a first sub-chamber and a second sub-chamber sequentially distributed along the width direction of the heat transfer pipe; the powder capillary structure is located in the first cavity, the grid capillary structure is located in the first sub-cavity, and the first fiber capillary structure is located in the second sub-cavity;

the second accommodating cavity comprises a heat dissipation channel and a third cavity which are distributed along the width direction of the heat conduction pipe, the first sub-cavity is opposite to and connected with the heat dissipation channel, the second sub-cavity is opposite to and connected with the third cavity, and the second fiber capillary structure is located in the third cavity.

8. A heat transfer device according to claim 1 or 2, wherein the heat transfer chambers include a first receiving chamber and a second receiving chamber, the first receiving chamber and the second receiving chamber being sequentially connected along a length direction of the heat transfer pipe, the first receiving chamber being formed on the first heat transfer section, the second heat transfer section, and the third heat transfer section; the first liquid storage section is located in the first accommodating cavity, the second liquid storage section is located in the second accommodating cavity, and the heat dissipation channel is formed between the first liquid storage section and the cavity wall of the second accommodating cavity.

9. A heat transfer device as recited in claim 8, wherein the first reservoir segment has a length equal to a length of the first receiving cavity, and the second reservoir segment has a length equal to a length of the second receiving cavity; the volume of the first liquid storage section is M times of the volume of the first accommodating cavity; the volume of the second liquid storage section is N times of the volume of the second containing cavity, wherein M is a numerical value larger than 0 and smaller than or equal to 1, and N is a numerical value larger than 0 and smaller than 1.

10. A heat transfer device as recited in claim 9, wherein the second reservoir has a thickness equal to a height of the second receiving cavity, and the second reservoir has a width N times the width of the second receiving cavity.

11. A heat transfer device as recited in claim 9, wherein the second reservoir has a width equal to a width of the second receiving cavity, and the second reservoir has a thickness N times the height of the second receiving cavity.

12. A heat transfer device as recited in claim 9, wherein N is greater than or equal to 0.3 and less than or equal to 0.5.

13. A heat transfer device as recited in claim 9, wherein the first reservoir section has a thickness equal to a height of the first receiving cavity, and the first reservoir section has a width M times the width of the first receiving cavity.

14. A heat transfer device as recited in claim 9, wherein the first reservoir section has a width equal to a width of the first receiving cavity, and the first reservoir section has a thickness M times a height of the first receiving cavity.

15. A heat transfer device as recited in claim 9, wherein M is greater than or equal to 0.8 and less than or equal to 1.

16. A heat transfer device as recited in claim 1 or 2, wherein the first heat transfer section is connected to the second heat transfer section at a first included angle, the third heat transfer section is connected to the second heat transfer section at a second included angle, and both the first included angle and the second included angle are greater than 0 degrees.

17. A heat transfer device as recited in claim 1 or 2, further comprising a first end cap and a second end cap, wherein the heat transfer tube has a first end and a second end disposed opposite to each other, the first end is provided with a first opening communicating with the heat transfer chamber, and the second end is provided with a second opening communicating with the heat transfer chamber;

the first end cover is fixed at the first end and seals the first opening; the second end cap is fixed to the second end and closes the second opening.

18. A heat transfer device according to claim 1 or 2, wherein the heat transfer tube has a rectangular, parallelogram, or oval cross-section in the thickness direction.

19. An electronic device, comprising: a housing, an electronic device, and the thermal conduction device of any one of claims 1 to 18; the heat conducting device and the electronic device are arranged in the shell; the thermally conductive contact segment is opposite the electronic device and the redundant memory segment is offset from the electronic device.

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