CN114231205A - Heat-resistant UV (ultraviolet) viscosity-reducing adhesive tape - Google Patents
Heat-resistant UV (ultraviolet) viscosity-reducing adhesive tape Download PDFInfo
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- CN114231205A CN114231205A CN202111675087.9A CN202111675087A CN114231205A CN 114231205 A CN114231205 A CN 114231205A CN 202111675087 A CN202111675087 A CN 202111675087A CN 114231205 A CN114231205 A CN 114231205A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/201—Adhesives in the form of films or foils characterised by their carriers characterised by the release coating composition on the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Abstract
The invention provides a heat-resistant UV (ultraviolet) anti-sticking adhesive tape, which comprises a substrate and an adhesive layer arranged on one side of the substrate, wherein a release coating is arranged on one side of the substrate opposite to the adhesive layer, the adhesive layer has a Young modulus of more than 50000Pa at 100 ℃, the adhesive force to an adherend when the adhesive layer is used at a high temperature of 120 ℃ reaches more than 100gf/25mm, the adhesive layer can effectively prevent falling off, the yield is greatly improved, the peeling force to the adherend under a normal temperature condition after high-temperature molding is less than 50gf/25mm, the adhesive can be easily peeled off, and the adhesive residue is effectively improved. The invention ensures higher elastic modulus during high-temperature molding by selecting the high-modulus acrylic adhesive under the high-temperature condition, simultaneously adopts the photosensitizer to be matched with the UV resin, can quickly reduce viscosity in a UV short-time irradiation mode after use, improves the operation efficiency, and adopts the resin containing amino to carry out self-crosslinking and curing under the high-temperature environment, thereby improving the hardness of the adhesive and effectively improving the residual adhesive.
Description
Technical Field
The invention relates to the technical field of composite material processing technologies, and particularly relates to a heat-resistant UV (ultraviolet) anti-sticking adhesive tape.
Background
With the development of the smart phone, especially for the 5G smart phone, in order to avoid interference of 5G signals, the rear cover of the smart phone at present does not use a metal material, but mostly uses glass and a composite material, such as a PC-PMMA composite material. The composite material processing process can involve a high-temperature forming process, in order to protect the surface of the composite material from being damaged in the forming process, a protective adhesive tape needs to be attached to one side surface of the composite material, for example, the composite material is heated at 160 ℃ for 2-3 min to soften the material, a mold is adopted to form the composite material, and the composite material is cooled to normal temperature after the high-temperature forming process and then the protective adhesive tape is peeled off. In the prior art, the adhesive tape often falls off or bubbles due to insufficient viscosity in the high-temperature forming process, residual adhesive pollutes the surface of an adherend, and the peeling force is large at normal temperature after forming, so that the adhesive tape is difficult to peel.
Disclosure of Invention
The purpose of the present invention is to provide a heat-resistant UV-adhesive-reducing tape which can realize excellent adhesion to an adherend during high-temperature molding, can be easily peeled off from the adherend at room temperature after high-temperature molding, and does not cause adhesive residue.
In order to achieve the purpose, the invention adopts the following technical scheme:
a heat-resistant UV (ultraviolet) anti-sticking adhesive tape is characterized by comprising a substrate 2 and an adhesive layer 1 arranged on one side of the substrate 2, wherein a release coating 3 is arranged on one side of the substrate 2 opposite to the adhesive layer 1, and the adhesive layer 1 is a heat-resistant UV anti-sticking layer, and the heat-resistant UV anti-sticking adhesive tape is characterized in that the illumination intensity of the heat-resistant UV anti-sticking adhesive tape is 300mJ/cm2～600mJ/cm2The stripping force can reach below 50gf/25mm, and the stripping force is reduced after UV light irradiation under the conditions that the wavelength is 365nm and the light irradiation time is at least 10 s.
Further, the adhesive layer 1 has a Young's modulus at 100 ℃ of 50000Pa or more, and the adhesive layer 1 has an adhesive force to an adherend of 100gf/25mm or more when used at a high temperature of 120 ℃.
Further, the adhesive layer 1 includes an adhesive substance for imparting adhesiveness, the adhesive substance being selected from one or more of a rubber-based adhesive such as natural rubber or synthetic rubber, a silicone-based adhesive, an acrylic-based adhesive, a vinyl alkyl ether-based adhesive, a polyester-based adhesive, a polyamide-based adhesive, a polyurethane-based adhesive, or a styrene-diene block copolymer-based adhesive.
Preferably, the adhesive material of the adhesive layer 1 is selected from acrylic adhesives based on acrylic polymers obtained by copolymerizing alkyl (meth) acrylates or naphthenes as main monomers with other functional group-containing monomers for improving adhesion, the alkyl (meth) acrylates or naphthenes are selected from alkyl (meth) acrylates or naphthenes having a linear or branched alkyl group with a carbon number of 1-22, and the functional group-containing monomers for improving adhesion are selected from monomers having one or more functional groups from carboxyl and hydroxyl.
Preferably, the monomer for polymerization to form the acrylic polymer further comprises one or more monomers containing aromatic groups and ester ring groups.
Further, the functional group-containing monomer is used in an amount of 40% by weight or less of the total monomer components and at least 0.1% by weight or more of the total monomer components.
Further, the soluble portion of the acrylic polymer has a weight average molecular weight of at least 7.5 x 105g/mol or more, and the glass transition temperature Tg of the acrylic polymer is at least-35 ℃ or more.
Further, the adhesive layer 1 comprises the following components in parts by weight: 100 parts of acrylic adhesive, 12-48 parts of light-cured resin (UV resin), 0.5-1.5 parts of photoinitiator, 0.5-5 parts of curing agent and 5-20 parts of resin with amino groups, wherein the amino resin is selected from one or more of urea-formaldehyde resin (UF), melamine-formaldehyde resin (MF), alkyl melamine-formaldehyde resin, aniline-formaldehyde resin and polyamide polyamine epichlorohydrin (PAE).
Further, the substrate 2 is selected from an elastic material with an elongation rate of at least 120% after stretching, and the elastic material is selected from one of a polyvinyl chloride film (PVC film), a polynaphthalene film (PN film), a polyolefin copolymer film (PO film) or a polyolefin film.
Further, the outermost side of at least one side of the adhesive layer 1 is also provided with a release layer 4.
According to the invention, the high-modulus adhesive under a high-temperature condition is selected, so that the high elastic modulus during high-temperature molding is ensured, meanwhile, the photosensitizer is matched with the UV resin, after the UV resin is used, the viscosity can be rapidly reduced through a UV short-time irradiation mode, the operation efficiency is improved, and the resin containing amino can be self-crosslinked and cured under a high-temperature environment, so that the hardness of the adhesive is improved, and the residual adhesive is effectively improved. Compared with the prior art, the invention has the beneficial effects that: the adhesive force to an adherend can reach more than 100gf/25mm when the adhesive is used at a high temperature of 120 ℃, the falling off is effectively prevented, the yield is greatly improved, the peeling force to the adherend under the normal temperature condition after high-temperature molding is not more than 50gf/25mm, the peeling can be easily realized, and the adhesive residue is effectively improved.
Drawings
FIG. 1 is a schematic structural view of a heat resistant UV detackifying adhesive tape in a preferred embodiment of the present invention;
FIG. 2 is another schematic structural view of a heat resistant UV detackifying tape in a preferred embodiment of the present invention;
FIG. 3 is a schematic view of another construction of the heat resistant UV detackifying tape in the preferred embodiment of the present invention;
description of reference numerals:
1: an adhesive layer; 2: a substrate; 3: a release coating; 4: and a release layer.
Detailed Description
The present invention will be described in further detail with reference to the following drawings and specific examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in figure 1, the heat-resistant UV viscosity-reducing adhesive tape provided by the invention comprises a substrate 2 and an adhesive layer 1 arranged on one side of the substrate 2, wherein the adhesive layer 1 is a heat-resistant UV viscosity-reducing layer, and the light intensity of the heat-resistant UV viscosity-reducing adhesive tape is 300mJ/cm2～600mJ/cm2Wavelength of 365nm and light time of at least 10sThe UV light can quickly generate viscosity reduction after being irradiated, and the stripping force can reach below 50gf/25 mm;
the adhesive layer 1 has a Young's modulus at 100 ℃ of preferably 50000Pa or more, and the Young's modulus of the adhesive layer 1 is in the above range, so that the adhesive layer 1 can have an excellent adhesive force to an adherend when used at a high temperature of 120 ℃, and can reach 100gf/25mm or more;
the adhesive layer 1 includes an adhesive substance for imparting adhesiveness, and the adhesive substance may be one or more of a rubber-based adhesive such as natural rubber or synthetic rubber, a silicone-based adhesive, an acrylic-based adhesive, a vinyl alkyl ether-based adhesive, a polyester-based adhesive, a polyamide-based adhesive, a polyurethane-based adhesive, or a styrene-diene block copolymer-based adhesive;
in order to ensure excellent adhesion of the adhesive layer 1 to an adherend when used at a high temperature of 120 ℃, an acrylic adhesive or the like containing an acrylic polymer (homopolymer or copolymer) as a base polymer, preferably a polymer containing one or more alkyl (meth) acrylates or cycloalkanes as a main monomer, and optionally a polymer obtained by copolymerizing the alkyl (meth) acrylates or cycloalkanes as a main monomer with another functional group-containing monomer for improving adhesion, may be used, preferably an acrylic adhesive;
examples of the alkyl (meth) acrylate or cycloalkyl ester include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, isopentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, and the like, Alkyl or cycloalkyl (meth) acrylates having a linear or branched alkyl group having 1 to 22 carbon atoms such as pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, nonadecyl (meth) acrylate, eicosyl (meth) acrylate, heneicosyl (meth) acrylate, and docosyl (meth) acrylate; in order to increase the young's modulus of the adhesive agent layer 1 at high temperatures, for example, at 100 ℃, among the above monomers, the alkyl (meth) acrylate or cycloalkyl ester is preferably a monomer having a molecular chain length, preferably an alkyl (meth) acrylate or cycloalkyl ester having 4 to 20 carbon atoms in the alkyl group, more preferably an alkyl (meth) acrylate or cycloalkyl ester having 4 to 12 carbon atoms in the alkyl group, and more preferably 2-ethylhexyl acrylate (2-EHA) or n-butyl acrylate; in the present invention, (meth) acrylate means acrylate or methacrylate, and all of "(meth)" in the present invention mean the same;
examples of the functional group-containing monomer include carboxyl group-containing monomers such as (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid; anhydride monomers such as maleic anhydride and itaconic anhydride;
hydroxyalkyl (meth) acrylates such as hydroxy (hydroxy) containing monomers including 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate, vinyl alcohol, allyl alcohol and the like; cyano group-containing monomers such as (meth) acrylonitrile; amide group-containing monomers such as (meth) acrylamide; n-substituted amide group-containing monomers such as N-methyl (meth) acrylamide, N-ethyl (meth) acrylamide, N-dimethyl (meth) acrylamide, N-t-butyl (meth) acrylamide, N-methylol (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-ethoxymethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, N-octylacrylamide, and N-carboxyethylacrylamide; amino group-containing monomers such as aminoethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, dimethylaminopropyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate; glycidyl group-containing monomers such as glycidyl (meth) acrylate and methylglycidyl (meth) acrylate; sulfonic acid group-containing monomers such as styrenesulfonic acid, propenylsulfonic acid, 2- (meth) acrylamido-2-methylpropanesulfonic acid, (meth) acrylamidopropanesulfonic acid, thiopropyl methacrylate, and (meth) acryloyloxynaphthalenesulfonic acid; phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; among the above-mentioned functional group-containing monomers, carboxyl group-containing monomers and hydroxyl group-containing monomers are preferable, and acrylic acid and hydroxyethyl acrylate are more preferable; in order to increase the Young's modulus of the adhesive layer 1 at high temperatures, for example, 100 ℃, the functional group-containing monomer is preferably a monomer having a glass transition temperature of at least 50 ℃ or higher, for example, acrylamide, methyl methacrylate, or the like; the functional group-containing monomers may be used in 1 or 2 or more species; the amount of the functional group-containing monomer used is preferably 40% by weight or less of the total monomer components, more preferably 20% by weight or less of the total monomer components, at least 0.1% by weight or more of the total monomer components, preferably 0.5% by weight or more of the total monomer components, more preferably 2% by weight or more of the total monomer components, and further preferably 5% by weight or more of the total monomer components;
the acrylic polymer may contain a polyfunctional monomer as a comonomer component as necessary for promoting crosslinking, and examples thereof include hexanediol di (meth) acrylate, poly (ethylene) di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, (meth) acrylic acid epoxy ester, polyester (meth) acrylate, urethane (meth) acrylate, and the like; the polyfunctional monomer may be used in 1, 2 or more species; the amount of the polyfunctional monomer used is preferably 30% by weight or less based on the total monomer components;
the acrylic polymer is prepared by polymerizing 1 monomer or a mixture of 2 or more monomers; the polymerization may be carried out by any means such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, etc.; the increase of the molecular weight is favorable for improving the Young modulus of the adhesive layer 1 at high temperature, the polymerization temperature is more suitably controlled at 60 ℃, and the acrylic polymer with high molecular weight is obtained when an initiator is decomposed; the initiator may be chosen as Azobisisobutyronitrile (AIBN), in order to achieve a weight average molecular weight of the soluble fraction of the acrylic polymer of 7.5X 105g/mol or more, and the dosage of the initiator during polymerization is preferably controlled within 0.5 Phr;
preferably, the adhesive layer 1 comprises the following components in parts by weight: 100 parts of acrylic adhesive, 12 to 48 parts of light-cured resin (UV resin), 0.5 to 1.5 parts of photoinitiator and 0.5 to 5 parts of curing agent; the adhesive layer 1 can be controlled by adjusting the composition of the base polymer, the type and component of the photocurable resin, the type and component of the curing agent, and the like; for example, the initial young's modulus of the adhesive layer 1 can be controlled by adjusting monomers used for polymerization to form the base polymer, controlling the glass transition temperature Tg of the base polymer, crosslinking density, and the like;
in order to ensure that the Young's modulus of the adhesive layer 1 at high temperature, for example, 100 ℃ reaches 50000Pa or more, the monomers for forming the acrylic polymer by polymerization include monomers having a relatively large molecular weight, such as aromatic group-containing monomers and ester ring groups, and examples thereof include benzyl acrylate (BZA) and isobornyl acrylate (IBOA); on the other hand, it is preferable that the weight average molecular weight of the soluble portion of the acrylic polymer is at least 7.5 × 105g/mol or more, the glass transition temperature Tg of the acrylic polymer is preferably at least-35 ℃ or more;
the adhesive layer 1 comprises a light-cured resin (UV resin), and the light-cured resin can be one or more of modified epoxy acrylic resin, polyurethane acrylate and polyester acrylate; preferably, the modified epoxy acrylic resin is bisphenol A epoxy acrylic resin;
the adhesive layer 1 includes a photoinitiator, the photoinitiator may be selected from one or more of benzophenone, acetophenone, and anthraquinone, and in order to widen the UV wavelength range suitable for photocuring of the adhesive layer 1, the photoinitiator is preferably used in combination of two or more, for example, 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide (TPO) and the photoinitiator 184 are selected
(Irgacure 184, 1-hydroxycyclohexyl phenyl ketone), photoinitiator 127(Irgacure 127,1, 1' - (methylenebis-4, 1-phenylene) bis [ 2-hydroxy-2-methyl-1-propanone ]);
the adhesive layer 1 also comprises resin with amino, 5 to 20 parts by weight of the resin can perform self-crosslinking curing in a high-temperature environment, and the hardness of the adhesive layer 1 is improved, so that the problem of adhesive residue is solved; the amino resin can be selected from one or more of urea-formaldehyde resin (UF), melamine formaldehyde resin (MF), alkyl melamine formaldehyde resin, aniline formaldehyde resin and polyamide polyamine epichlorohydrin (PAE); in order to increase the cohesive strength of the adhesive layer 1, an amino resin having a large molecular weight and a large molecular structure, such as a melamine formaldehyde resin (MF);
the adhesive layer 1 comprises a curing agent, and the curing agent can be one or more of epoxy curing agents and isocyanate curing agents; preferably, the epoxy curing agent can be one or more selected from aliphatic amine, alicyclic amine, aromatic amine, polyamide, acid anhydride, resin or tertiary amine; preferably, the epoxy curing agent is one or more of Diamino Diphenyl Sulfone (DDS), modified amine curing agent (MA) or Dicyandiamide (DICY); preferably, the isocyanate curing agent can be one or more of HDI curing agent, MDI curing agent, XDI curing agent, HMDI, TDI or IPDI curing agent;
the substrate 2 may be an elastic material with good expansibility, preferably an elastic material with an elongation of at least 120% after stretching, such as a polyvinyl chloride film (PVC film), a polynaphthalene film (PN film), a polyolefin copolymer film (PO film) or a polyolefin film, preferably a polyolefin copolymer film (PO film), a polyvinyl chloride film (PVC film), and a polyolefin film preferably a polypropylene film (PP film); the thickness is not particularly limited, and may be adjusted according to the actual circumstances, and is preferably in the range of 30 to 150 μm, more preferably in the range of 50 to 100 μm; a release coating 3 is provided on the side of the substrate 2 opposite to the adhesive layer 1, and the release coating 3 may be selected from conventionally known back surface treatment techniques, such as a silicon-containing release coating, a hard acyl urethane, and the like;
as shown in fig. 2, the heat-resistant UV anti-adhesive tape according to the present invention may be provided with a release layer 4 on one side of the adhesive layer 1 opposite to the substrate 2, the release layer 4 is used to protect the layer of the adhesive layer 1, the release layer 4 is not particularly limited, and a conventionally known release film, such as a polyester release film (PET), a fluorine-based release film, an organic silicon release film, a non-silicon release film or a release paper, may be used according to actual circumstances, and the thickness thereof is not particularly limited and may be adjusted according to actual circumstances, and is preferably in a range of 25 μm to 100 μm, and more preferably in a range of 25 μm to 50 μm;
as shown in fig. 3, the heat-resistant UV anti-adhesive tape provided by the present invention may be a double-sided tape, comprising a substrate 2, an adhesive layer 1 disposed on both sides of the substrate 2, respectively, a release layer 4 disposed on one side of the adhesive layer 1 opposite to the substrate 2;
examples
The present invention is described in more detail below with reference to examples, but the present invention is not limited to these examples; the adhesive tapes obtained in examples and comparative examples were evaluated by the following methods;
young's modulus: coating an adhesive substance on a release material by using a hand-scraping rod by using a rotary rheometer, drying the adhesive substance in an oven at 120 ℃ for 2-3 min to remove redundant solvent, preparing the adhesive into a 1mm thick adhesive layer, then placing the adhesive layer on a mould of the rheometer, heating the adhesive layer to 150 ℃ from normal temperature under the condition of fixing the frequency of 1Hz, and processing the adhesive layer by using software to obtain Young modulus data of the adhesive layer;
appearance after high-temperature molding: cutting a 25mm (MD direction) x 150mm (TD direction) adhesive tape sample, pressing and attaching the adhesive tape sample to a PMMA surface of a PC-PMMA composite material by a 2kg roller in a reciprocating manner for one time, standing for 2-3 min at the high temperature of 160 ℃ and 50% RH to soften the composite material, and then cooling to the normal temperature; the appearance of the tape after the composite material was molded at high temperature was confirmed by visual observation and hand touch, and the sample having no floating and no bubble was evaluated as "o", and the sample having floating and bubbles was evaluated as "x";
and (3) residual glue inspection after high-temperature forming: cutting a 25mm (MD direction) × 150mm (TD direction) tape sample, applying pressure to an SUS304 plate in a reciprocating manner by a 2kg roller at one time, standing the sample at 120 ℃ and 50% RH for 20min to 40min, peeling the sample with the appearance tested in a 180 DEG direction at a tensile rate of 300mm/min by a universal tensile compression tester at 120 ℃ and 50% RH, visually and manually confirming the state of adhesive residue on the stainless steel plate (SUS304), evaluating the sample with substantially no adhesive residue on the stainless steel plate (SUS304) as "O", and evaluating the sample with adhesive residue on the plate as "X";
adhesion at 120 ℃ environment: cutting a 25mm (MD direction) × 150mm (TD direction) adhesive tape sample, applying pressure to a stainless steel plate (SUS304) by a 2kg roller in a reciprocating manner at one time, standing at 120 ℃ and 50% RH for 20-40 min, measuring the peel strength of the adhesive tape in the 180 DEG peel direction at a tensile speed of 300mm/min at 23 ℃ and 50% RH by using a universal tensile compression tester, and taking the peel strength as the adhesive force;
inspection of residual gum after peeling at 120 ℃: the samples having the above-described adhesive force were checked for the residual glue on the stainless steel plate (SUS304) by visual and hand touch, and the samples having no residual glue were evaluated as "o" and the samples having residual glue were evaluated as "x";
peel force before UV irradiation: cutting a 25mm (MD direction) × 150mm (TD direction) adhesive tape sample, applying pressure to a stainless steel plate (SUS304) by a 2kg roller in a reciprocating manner for one time, standing at normal temperature for 30min, measuring the peel strength of the adhesive tape in the 180 DEG peeling direction at a tensile speed of 300mm/min at 23 ℃ and 50% RH by using a universal tensile compression tester, and taking the peel strength as the peeling force before UV irradiation;
peel force after UV irradiation:cutting 25mm (MD direction) × 150mm (TD direction) adhesive tape sample, pressing and attaching to stainless steel plate (SUS304) with 2kg roller reciprocating once, and irradiating intensity by UV irradiation is 500mJ/cm2The adhesive tape was detackified under the condition of 10s of light irradiation time, and the peel strength at the time of peeling the adhesive tape was measured in a 180 ° peel direction at a tensile speed of 300mm/min at 23 ℃ and 50% RH with a universal tensile compression tester, and this was taken as the peel force; if the peel force is less than 50gf/25mm, it means that peeling can be easily performed;
and (3) residual glue inspection after UV irradiation: the samples having the above-described peeling force were examined for the state of adhesive residue on the stainless steel plate (SUS304) by visual and hand touch, and the sample having substantially no adhesive residue on the stainless steel plate (SUS304) was evaluated as "o", and the sample having adhesive residue on the plate was evaluated as "x";
example 1
Acrylic acid ester monomers such as butyl acrylate, acrylic acid and the like are used, all the monomer components are mixed, the polymerization temperature is 60 ℃, and the acrylic acid base polymer containing a soluble part and having the weight average molecular weight of 80 ten thousand is obtained through free radical copolymerization in ethyl acetate under the action of an initiator AIBN, and the specific formula composition is shown in table 1; the acrylic base polymer obtained above was taken as 100 parts by weight, 12 parts by weight of a photocurable resin, 1.5 parts by weight of a photoinitiator, 5 parts by weight of an amino resin, and 1 part by weight of a curing agent, wherein the photocurable resin was a modified epoxy acrylic resin, the photoinitiator specifically was 0.9 parts by weight of a photoinitiator 184, 0.6 parts by weight of a photoinitiator 127, the amino resin was a melamine formaldehyde resin, and the curing agent was an isocyanate-based fixing agent (a reaction product of trimethylolpropane and toluene diisocyanate, trade name "CORONATE L", abbreviation C/L), to obtain an adhesive substance having a young's modulus at 100 ℃ of 80000 Pa; an adhesive tape having an adhesive layer 1 of 25mm thickness was produced using a PO-based base material, and the specific weight ratio and evaluation results are shown in Table 2;
table 1:
example 2
Acrylic acid ester monomers such as 2-ethylhexyl acrylate, acrylic acid and the like are used, the monomer components are mixed, the polymerization temperature is 60 ℃, and the acrylic acid base polymer containing a soluble part and having the weight average molecular weight of 80 ten thousand is obtained through free radical copolymerization in ethyl acetate under the action of an initiator AIBN, and the specific formula composition is shown in table 1; the acrylic base polymer obtained above was taken as 100 parts by weight, 12 parts by weight of a photocurable resin, 1.5 parts by weight of a photoinitiator, 5 parts by weight of an amino resin, and 1 part by weight of a curing agent, wherein the photocurable resin was a modified epoxy acrylic resin, the photoinitiator specifically was 0.9 parts by weight of a photoinitiator 184, 0.6 parts by weight of a photoinitiator 127, the amino resin was a melamine formaldehyde resin, and the curing agent was an isocyanate-based fixing agent (a reaction product of trimethylolpropane and toluene diisocyanate, trade name "CORONATE L", abbreviation C/L), to obtain an adhesive substance having a young's modulus of 50000Pa at 100 ℃; an adhesive tape having an adhesive layer 1 of 25mm in thickness was produced using a PVC-based base material, and the specific weight ratio and evaluation results are shown in Table 2;
example 3
Acrylic acid ester monomers such as 2-ethylhexyl acrylate, acrylamide and the like are used, all the monomer components are mixed, the polymerization temperature is 60 ℃, and an acrylic acid base polymer containing a soluble part and having the weight average molecular weight of 75 ten thousand is obtained through free radical copolymerization in ethyl acetate under the action of an initiator AIBN, and the specific formula composition is shown in table 1; the acrylic base polymer obtained above was taken as 100 parts by weight, 24 parts by weight of a photocurable resin, 1.5 parts by weight of a photoinitiator, 5 parts by weight of an amino resin, and 1 part by weight of a curing agent, wherein the photocurable resin was a modified epoxy acrylic resin, the photoinitiator specifically was 0.9 parts by weight of a photoinitiator 184, 0.6 parts by weight of a photoinitiator 127, the amino resin was a melamine formaldehyde resin, and the curing agent was an isocyanate-based fixing agent (a reaction product of trimethylolpropane and toluene diisocyanate, trade name "CORONATE L", abbreviation C/L), to obtain an adhesive substance having a young's modulus of 50000Pa at 100 ℃; an adhesive tape having an adhesive layer 1 of 25mm thickness was produced using a PO-based base material, and the specific weight ratio and evaluation results are shown in Table 2;
comparative examples 1 to 3
The specific weight ratios and the evaluation results are shown in tables 1 and 2;
for the adhesive tapes obtained in examples and comparative examples, evaluations were made by the foregoing methods, see table 2;
table 2:
as shown in tables 1 and 2, it can be seen that the heat-resistant UV adhesive tape provided in the preferred embodiment of the present invention has excellent appearance after high temperature molding, has excellent adhesive force to an adherend at a high temperature of 120 ℃ of 100gf/25mm or more, and has an illumination intensity of 500mJ/cm by UV light irradiation2The peeling force after UV irradiation is below 50gf/25mm under the condition of 10s of light irradiation time, the peeling can be easily performed, and the adhesive residue is not generated.
According to the invention, the high-modulus adhesive under a high-temperature condition is selected, so that the high elastic modulus during high-temperature molding is ensured, meanwhile, the photosensitizer is matched with the UV resin, after the UV resin is used, the viscosity can be rapidly reduced through a UV short-time irradiation mode, the operation efficiency is improved, and the resin containing amino can be self-crosslinked and cured under a high-temperature environment, so that the hardness of the adhesive is improved, and the residual adhesive is effectively improved. The heat-resistant UV visbreaking adhesive tape provided by the invention can realize that the adhesive force to an adherend is more than 100gf/25mm when the tape is molded at a high temperature of 120 ℃, the tape can effectively prevent the tape from falling off, the yield is greatly improved, the peeling force is less than 50gf/25mm at normal temperature after molding, the tape can be easily peeled off, and the adhesive residue is effectively improved.
Claims (10)
1. A heat-resistant UV viscosity-reducing adhesive tape comprises a base material (2) and an adhesive layer (1) arranged on one side of the base material (2), wherein a release coating (3) is arranged on one side of the base material (2) opposite to the adhesive layer (1), and the adhesive layer (1) is a heat-resistant UV viscosity-reducing layer, and is characterized in that the light intensity of the heat-resistant UV viscosity-reducing adhesive tape is 300mJ/cm2～600mJ/cm2The stripping force can reach below 50gf/25mm, and the stripping force is reduced after UV light irradiation under the conditions that the wavelength is 365nm and the light irradiation time is at least 10 s.
2. The heat-resistant UV pressure-sensitive adhesive tape according to claim 1, wherein the Young's modulus of said adhesive layer (1) at 100 ℃ is 50000Pa or more, and the adhesive force of said adhesive layer (1) to an adherend when used at a high temperature of 120 ℃ is 100gf/25mm or more.
3. The heat-resistant UV vis-breaking adhesive tape according to claim 1 or 2, wherein the adhesive layer (1) comprises an adhesive substance for imparting adhesiveness, the adhesive substance being selected from one or more of a rubber-based adhesive such as natural rubber, synthetic rubber and the like, a silicone-based adhesive, an acrylic-based adhesive, a vinyl alkyl ether-based adhesive, a polyester-based adhesive, a polyamide-based adhesive, a polyurethane-based adhesive or a styrene-diene block copolymer-based adhesive.
4. The heat-resistant UV pressure-sensitive adhesive tape according to claim 3, wherein the adhesive material of the adhesive layer (1) is selected from acrylic adhesives based on acrylic polymers obtained by copolymerizing alkyl (meth) acrylates or cycloalkanes as a main monomer with other functional group-containing monomers for improving adhesion, the alkyl (meth) acrylates or cycloalkanes are selected from alkyl (meth) acrylates or cycloalkanes having a linear or branched alkyl group having 1 to 22 carbon atoms, and the functional group-containing monomers for improving adhesion are selected from monomers containing one or more functional groups selected from carboxyl groups and hydroxyl groups.
5. A heat resistant UV detackifying tape according to claim 4 wherein said monomers for polymerization to form the acrylic polymer further comprise one or more aromatic, ester ring containing monomers.
6. A heat-resistant UV visbreaking tape according to claim 4 or 5, wherein the functional group-containing monomer is used in an amount of 40% by weight or less, and at least 0.1% by weight or more, based on the total monomer components.
7. A heat resistant UV detackifying tape according to claim 4 or claim 5 in which the soluble portion of the acrylic polymer has a weight average molecular weight of at least 7.5 x 105g/mol or more, and the glass transition temperature Tg of the acrylic polymer is at least-35 ℃ or more.
8. A heat-resistant UV visbreaking adhesive tape according to claim 4 or 5, characterized in that the adhesive layer (1) comprises the following components in parts by weight: 100 parts of acrylic adhesive, 12-48 parts of light-cured resin (UV resin), 0.5-1.5 parts of photoinitiator, 0.5-5 parts of curing agent and 5-20 parts of resin with amino groups, wherein the amino resin is selected from one or more of urea-formaldehyde resin (UF), melamine-formaldehyde resin (MF), alkyl melamine-formaldehyde resin, aniline-formaldehyde resin and polyamide polyamine epichlorohydrin (PAE).
9. A heat resistant UV detackifying tape according to claim 1, wherein the substrate (2) is selected from an elastomeric material having an elongation after stretching of at least 120% and selected from one of a polyvinyl chloride film (PVC film), a polynaphthalene film (PN film), a polyolefin copolymer film (PO film) or a polyolefin film.
10. A heat resistant UV detackifying adhesive tape according to claim 1, wherein the adhesive layer (1) is further provided with a release layer (4) on the outermost side of at least one side thereof.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115232578A (en) * | 2022-08-17 | 2022-10-25 | 苏州赛伍应用技术股份有限公司 | UV viscosity-reducing adhesive and preparation method thereof |
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| WO2016052424A1 (en) * | 2014-09-30 | 2016-04-07 | 日東電工株式会社 | Adhesive sheet |
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| CN110591611A (en) * | 2019-09-20 | 2019-12-20 | 上海精珅新材料有限公司 | UV (ultraviolet) viscosity-reducing protective film glue with reduced viscosity at high temperature and protective film production method thereof |
| CN111440574A (en) * | 2019-12-27 | 2020-07-24 | 宁波激智科技股份有限公司 | Adhesive composition and anti-adhesive tape applied to cutting optical filter |
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| WO2016052424A1 (en) * | 2014-09-30 | 2016-04-07 | 日東電工株式会社 | Adhesive sheet |
| CN105925220A (en) * | 2016-06-14 | 2016-09-07 | 绍兴振德医用敷料有限公司 | Medical pressure-sensitive adhesive capable of being excellently adhered to skin and preparation method and application thereof |
| CN110591611A (en) * | 2019-09-20 | 2019-12-20 | 上海精珅新材料有限公司 | UV (ultraviolet) viscosity-reducing protective film glue with reduced viscosity at high temperature and protective film production method thereof |
| CN111440574A (en) * | 2019-12-27 | 2020-07-24 | 宁波激智科技股份有限公司 | Adhesive composition and anti-adhesive tape applied to cutting optical filter |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115232578A (en) * | 2022-08-17 | 2022-10-25 | 苏州赛伍应用技术股份有限公司 | UV viscosity-reducing adhesive and preparation method thereof |
| CN115232578B (en) * | 2022-08-17 | 2024-02-23 | 苏州赛伍应用技术股份有限公司 | UV (ultraviolet) adhesive and preparation method thereof |
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