CN114184841B - Method for measuring lead resistance of packaging shell - Google Patents
Method for measuring lead resistance of packaging shell Download PDFInfo
- Publication number
- CN114184841B CN114184841B CN202111334458.7A CN202111334458A CN114184841B CN 114184841 B CN114184841 B CN 114184841B CN 202111334458 A CN202111334458 A CN 202111334458A CN 114184841 B CN114184841 B CN 114184841B
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- CN
- China
- Prior art keywords
- shell
- packaging shell
- lead
- resistance
- tested
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000012360 testing method Methods 0.000 claims abstract description 23
- 239000012212 insulator Substances 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 9
- 238000010998 test method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
Abstract
The invention relates to a method for measuring lead resistance of a packaging shell, which comprises the following steps: (1) pretreatment of a packaging shell to be tested; (2) lead resistance measurement. The resistance of the shell lead is calculated by measuring the voltage and the current loaded on the shell lead, so that the influence of contact resistance introduced by adopting direct current resistance test is avoided, and the real resistance of the shell lead below 10 milliohms can be accurately measured.
Description
Technical Field
The invention relates to a method for measuring lead resistance of a packaging shell, and belongs to the technical field of electrical performance test of the packaging shell.
Background
The measurement of the lead resistance of the package shell is mainly carried out by adopting the direct current resistance test of the method 303 in the GJB360A electronic and electric element test method. The method is mainly used for testing the resistor, the electromagnetic winding of the element and the direct current resistance of the lead. When the shell lead is regarded as a through lead with higher resistance, the method can be used for measuring the resistance of the shell lead. This method is not suitable for measurement of contact resistance. When the resistance of the shell lead is lower and is less than 10 milliohms, the resistance of the contact resistor seriously interferes with the measurement of the actual resistance of the shell lead, which tends to cause a serious and large measurement result, and the actual lead resistance of the shell cannot be accurately evaluated.
Disclosure of Invention
The invention provides a method for measuring lead resistance of a packaging shell, which aims at solving the problem that direct current resistance test of method 303 in GJB360A electronic and electric element test method has larger error in measurement of lead resistance lower than 10 milliohms.
The technical solution of the invention is as follows: a measuring device of lead resistance of a packaging shell comprises the following steps of (1) preprocessing the packaging shell to be tested; (2) lead resistance measurement.
The packaging shell to be tested is of a metal wall embedded insulator structure and comprises a metal frame, a metal lead, a ceramic insulator and a metal bottom plate, all the parts are welded and connected through silver-copper solder to form the packaging shell, and a gold layer with the thickness not smaller than 1.3 microns is plated on the surface of the packaging shell.
The pretreatment of the packaging shell to be tested in the step (1) specifically comprises the following steps:
1) Welding an auxiliary test wire in a bonding area on the inner side of the ceramic insulator;
2) The packaging shell is plated with nickel and gold, and the thickness of the gold layer is not less than 1.3 microns;
3) And welding the other end of the auxiliary test wire welded on the inner side of the insulator on the surface of the bottom plate of the packaging shell to form the shell to be tested.
The ceramic insulator is welded with the auxiliary test wire by silver-copper solder, and the auxiliary test wire is welded with the bottom plate surface of the packaging shell by tin-lead solder; the auxiliary test line is made of iron-nickel alloy material.
The step (2) of lead resistance measurement specifically includes:
1) Firstly, regulating the output voltage of a direct-current stabilized voltage supply to be a voltage value between 1V and 10V;
2) Respectively connecting two output ends of a direct current voltage-stabilizing and current-stabilizing power supply at the positions of a bottom plate of the packaging shell and a lead of the shell, and reading the output current I of the power supply at the moment;
3) Adjusting the universal meter to a voltage test grade, respectively connecting two joints of the universal meter into the inner end and the outer end of a ceramic insulator of a shell to be tested, and reading the display voltage U of the universal meter;
4) And calculating the lead resistance R=U/I of the shell to be tested.
The invention has the beneficial effects that: the voltage and the current loaded on the shell lead are measured to calculate the resistance of the shell lead, so that the influence of contact resistance caused by direct current resistance test in method 303 in GJB360A electronic and electric element test method is avoided, the real resistance of the shell lead can be accurately measured, and the method is particularly suitable for accurate measurement of lead resistance smaller than 10 milliohms.
Drawings
FIG. 1 is a schematic diagram of a method for measuring lead resistance of a package.
In the figure, a shell lead wire 1, a universal meter 2, an auxiliary test wire 3 and a direct-current stabilized power supply 4 are adopted.
Detailed Description
The technical scheme of the invention is further described below with reference to the accompanying drawings
As shown in figure 1, the method for measuring the lead resistance of the package shell is suitable for measuring the lead resistance of the shell with the metal frame embedded ceramic insulator, and is suitable for measuring the lead resistance below 10 milliohms.
The method comprises the following specific steps:
1. the shell to be tested is processed as follows:
(1) Welding an auxiliary test line in a bonding area on the inner side of the ceramic insulator by using silver-copper solder during shell brazing, wherein the auxiliary test line is made of an iron-nickel alloy material;
(2) Plating nickel and gold on the shell, wherein the thickness of the gold layer is not less than 1.3 microns;
(3) And welding the other end of the auxiliary test wire welded on the inner side of the insulator on the surface of the bottom plate of the shell by adopting tin-lead solder to form the shell to be tested.
2. The testing steps are as follows:
(1) Firstly, regulating the output voltage of a direct-current stabilized voltage supply to be a voltage value between 1V and 10V;
(2) Respectively connecting two output ends of a direct current stabilized voltage and stabilized current power supply to the positions of a bottom plate of a shell to be tested and an outer lead, and reading the output current I of the power supply at the moment;
(3) Adjusting the universal meter to a voltage test file, respectively connecting two connectors of the universal meter into the inner end and the outer end of an insulator of the shell to be tested, and reading the display voltage U of the universal meter;
(4) And calculating the lead resistance R=U/I of the shell to be tested.
The shell is of a metal wall embedded insulator structure, and comprises a metal frame, a metal lead, a ceramic insulator and a metal bottom plate, wherein the metal frame, the metal lead, the ceramic insulator and the metal bottom plate are welded together through silver-copper solder to form a packaging shell, and a gold layer with the thickness of not less than 1.3 microns is plated on the surface of the shell. The measured lead resistance was 3.5 to 4.5 milliohms.
Claims (3)
1. A method for measuring lead resistance of a packaging shell is characterized in that the packaging shell to be tested is of a metal wall embedded insulator structure and comprises a metal frame, a metal lead, a ceramic insulator and a metal bottom plate, all the parts are welded and connected through silver-copper solder to form the packaging shell, and a gold layer with the thickness not less than 1.3 microns is plated on the surface of the packaging shell;
the method comprises the following steps:
(1) Pretreating a packaging shell to be tested;
1) Welding an auxiliary test wire in a bonding area on the inner side of the ceramic insulator;
2) The packaging shell is plated with nickel and gold, and the thickness of the gold layer is not less than 1.3 microns;
3) Welding the other end of the auxiliary test wire welded on the inner side of the insulator on the surface of the bottom plate of the packaging shell to form a shell to be tested;
(2) Measuring lead resistance;
1) Firstly, regulating the output voltage of a direct-current stabilized voltage supply to be a voltage value between 1V and 10V;
2) Respectively connecting two output ends of a direct current voltage-stabilizing and current-stabilizing power supply to the bottom plate of the packaging shell and the lead position of the packaging shell, and reading the output current I of the power supply at the moment;
3) Adjusting the universal meter to a voltage test grade, respectively connecting two joints of the universal meter into the inner end and the outer end of a ceramic insulator of a shell to be tested, and reading the display voltage U of the universal meter;
4) And calculating the lead resistance R=U/I of the shell to be tested.
2. The method of claim 1, wherein in step 1), the ceramic insulator is soldered to the auxiliary test wire with silver-copper solder, and the auxiliary test wire is soldered to the bottom surface of the package with tin-lead solder.
3. The method for measuring lead resistance of a package according to claim 1, wherein in the step 1), the auxiliary test wire is made of an iron-nickel alloy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111334458.7A CN114184841B (en) | 2021-11-11 | 2021-11-11 | Method for measuring lead resistance of packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111334458.7A CN114184841B (en) | 2021-11-11 | 2021-11-11 | Method for measuring lead resistance of packaging shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114184841A CN114184841A (en) | 2022-03-15 |
| CN114184841B true CN114184841B (en) | 2023-11-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111334458.7A Active CN114184841B (en) | 2021-11-11 | 2021-11-11 | Method for measuring lead resistance of packaging shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114184841B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5550477A (en) * | 1994-08-01 | 1996-08-27 | Axis Usa, Inc. | Methods and apparatus for testing armature coils and coil lead connections using resistance measurements |
| US6674295B1 (en) * | 1999-08-05 | 2004-01-06 | Murata Manufacturing Co., Ltd. | Impedance measuring apparatus for electronic component |
| CN1654967A (en) * | 2004-02-09 | 2005-08-17 | 松下电器产业株式会社 | Resistance value calculation method |
| JP2006337268A (en) * | 2005-06-03 | 2006-12-14 | Sharp Corp | Measurement method for contact resistance, and measurement method for electrical characteristics of semiconductor element |
| CN103822869A (en) * | 2014-02-28 | 2014-05-28 | 工业和信息化部电子第五研究所 | Reliability detection method of bond wire welding spots of power supply |
| CN105785131A (en) * | 2016-04-21 | 2016-07-20 | 浪潮电子信息产业股份有限公司 | Testing device and method for low ohm chip resistors |
| CN107204322A (en) * | 2017-05-03 | 2017-09-26 | 中国电子科技集团公司第五十五研究所 | Multi-chip integrated form CQFP ceramic packages and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799496B (en) * | 2017-09-01 | 2020-05-22 | 华南理工大学 | High-reliability copper alloy bonding wire for electronic packaging and preparation method thereof |
-
2021
- 2021-11-11 CN CN202111334458.7A patent/CN114184841B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5550477A (en) * | 1994-08-01 | 1996-08-27 | Axis Usa, Inc. | Methods and apparatus for testing armature coils and coil lead connections using resistance measurements |
| US6674295B1 (en) * | 1999-08-05 | 2004-01-06 | Murata Manufacturing Co., Ltd. | Impedance measuring apparatus for electronic component |
| CN1654967A (en) * | 2004-02-09 | 2005-08-17 | 松下电器产业株式会社 | Resistance value calculation method |
| JP2006337268A (en) * | 2005-06-03 | 2006-12-14 | Sharp Corp | Measurement method for contact resistance, and measurement method for electrical characteristics of semiconductor element |
| CN103822869A (en) * | 2014-02-28 | 2014-05-28 | 工业和信息化部电子第五研究所 | Reliability detection method of bond wire welding spots of power supply |
| CN105785131A (en) * | 2016-04-21 | 2016-07-20 | 浪潮电子信息产业股份有限公司 | Testing device and method for low ohm chip resistors |
| CN107204322A (en) * | 2017-05-03 | 2017-09-26 | 中国电子科技集团公司第五十五研究所 | Multi-chip integrated form CQFP ceramic packages and preparation method thereof |
Non-Patent Citations (3)
| Title |
|---|
| IC封装的模型及参数测量;邵大川 等;《南开大学学报(自然科学版)》;第28卷(第2期);81-86 * |
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| 微小电阻测量方法及关键技术;刘志存;《物理测试》;第23卷(第1期);34-36 * |
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| CN114184841A (en) | 2022-03-15 |
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