CN114184841A - Method for measuring lead resistance of packaging shell - Google Patents
Method for measuring lead resistance of packaging shell Download PDFInfo
- Publication number
- CN114184841A CN114184841A CN202111334458.7A CN202111334458A CN114184841A CN 114184841 A CN114184841 A CN 114184841A CN 202111334458 A CN202111334458 A CN 202111334458A CN 114184841 A CN114184841 A CN 114184841A
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- China
- Prior art keywords
- shell
- lead
- resistance
- tested
- voltage
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 238000012360 testing method Methods 0.000 claims abstract description 22
- 238000007781 pre-processing Methods 0.000 claims abstract description 4
- 239000012212 insulator Substances 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 description 4
- 238000010998 test method Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Abstract
The invention relates to a method for measuring lead resistance of a packaging shell, which comprises the following steps: (1) preprocessing a packaging shell to be tested; (2) and measuring the resistance of the lead. The resistance of the shell lead is calculated by measuring the voltage and the current loaded on the shell lead, so that the influence of contact resistance introduced by adopting direct current resistance test is avoided, and the real resistance of the shell lead below 10 milliohms can be accurately measured.
Description
Technical Field
The invention discloses a method for measuring lead resistance of a packaging shell, and belongs to the technical field of electrical performance test of packaging shells.
Background
The lead resistance of the package casing is mainly measured by adopting a direct current resistance test 303 in a GJB360A electronic and electrical element test method. The method is mainly used for testing the direct current resistance of the resistor, the electromagnetic winding of the element and the lead. When the shell lead is taken as a through lead with higher resistance, the resistance of the shell lead can be measured by using the method for reference. This method is not suitable for the measurement of contact resistance. When the resistance of the lead of the shell is lower than 10 milliohms, the resistance value of the contact resistor seriously interferes with the measurement of the actual resistance value of the lead of the shell, which inevitably causes a serious and large measurement result and can not accurately evaluate the real lead resistance of the shell.
Disclosure of Invention
The invention provides a method for measuring lead resistance of a package shell, aiming at solving the problem that the error is larger in the measurement of lead resistance lower than 10 milliohms by a method 303 direct current resistance test in GJB360A electronic and electric element test method.
The technical solution of the invention is as follows: a measuring device for lead resistance of a package shell comprises the following steps of (1) preprocessing a package shell to be tested; (2) and measuring the resistance of the lead.
The packaging shell to be tested is of a metal wall embedded insulator structure and comprises a metal frame, a metal lead, a ceramic insulator and a metal bottom plate, all parts are connected through silver-copper solder in a welding mode to form the packaging shell, and a gold layer with the thickness not smaller than 1.3 microns is plated on the surface of the shell.
The pretreatment of the package shell to be tested in the step (1) specifically comprises the following steps:
1) welding an auxiliary test line in a bonding area at the inner side of the ceramic insulator;
2) plating nickel and gold on the packaging shell, wherein the thickness of the gold layer is not less than 1.3 microns;
3) and welding the other end of the auxiliary test wire welded on the inner side of the insulator on the surface of the bottom plate of the packaging shell to form the shell to be tested.
The ceramic insulator and the auxiliary test wire are welded by silver-copper solder, and the auxiliary test wire and the surface of the bottom plate of the packaging shell are welded by tin-lead solder; the auxiliary test line is made of iron-nickel alloy material.
The step (2) of measuring the lead resistance specifically comprises the following steps:
1) firstly, adjusting the output voltage of a direct current voltage-stabilizing and current-stabilizing power supply to be a voltage value between 1V and 10V;
2) respectively connecting two output ends of a direct-current voltage-stabilizing and current-stabilizing power supply to a bottom plate of a packaging shell and a lead position of the shell, and reading output current I of the power supply at the moment;
3) adjusting the universal meter to a voltage test gear, respectively connecting two connectors of the universal meter to the inner end and the outer end of the ceramic insulator of the shell to be tested, and reading the display voltage U of the universal meter;
4) and calculating the lead resistance R = U/I of the shell to be tested.
The invention has the beneficial effects that: the resistance of the shell lead is calculated by measuring the voltage and the current loaded on the shell lead, so that the influence of contact resistance introduced by a direct current resistance test in a method 303 in GJB360A electronic and electrical element test method is avoided, the real resistance of the shell lead can be accurately measured, and the method is particularly suitable for accurately measuring the lead resistance of less than 10 milliohms.
Drawings
FIG. 1 is a schematic diagram of a method for measuring lead resistance of a package.
In the figure, 1 is a shell lead, 2 is a multimeter, 3 is an auxiliary test wire, and 4 is a direct current stabilized power supply.
Detailed Description
The technical scheme of the invention is further explained by combining the attached drawings
As shown in the attached figure 1, the method for measuring the lead resistance of the package shell is suitable for measuring the lead resistance of the ceramic insulator shell with the embedded metal frame, and is suitable for measuring the lead resistance of less than 10 milliohms.
The method comprises the following specific steps:
1. the shell to be tested is processed as follows:
(1) welding an auxiliary test wire on a bonding area on the inner side of the ceramic insulator by using silver-copper solder during shell brazing, wherein the material is an iron-nickel alloy material;
(2) plating nickel and gold on the shell, wherein the thickness of the gold layer is not less than 1.3 microns;
(3) and adopting tin-lead solder to weld the other end of the auxiliary test wire welded on the inner side of the insulator on the surface of the bottom plate of the shell to form the shell to be tested.
2. The testing steps are as follows:
(1) firstly, adjusting the output voltage of a direct current voltage-stabilizing and current-stabilizing power supply to be a voltage value between 1V and 10V;
(2) respectively connecting two output ends of a direct-current voltage-stabilizing and current-stabilizing power supply to the bottom plate of the shell to be tested and the position of an outer lead, and reading the output current I of the power supply at the moment;
(3) adjusting the universal meter to a voltage test gear, respectively connecting two connectors of the universal meter to the inner end and the outer end of the insulator of the shell to be tested, and reading the display voltage U of the universal meter;
(4) and calculating the lead resistance R = U/I of the shell to be tested.
The measured shell in the embodiment is of a metal wall embedded insulator structure and comprises a metal frame, a metal lead, a ceramic insulator and a metal bottom plate, all parts are welded together through silver-copper solder to form a packaging shell, and a gold layer with the thickness not less than 1.3 microns is plated on the surface of the shell. The measured lead resistance is 3.5 to 4.5 milliohms.
Claims (6)
1. A method for measuring lead resistance of a package shell is characterized by comprising the following steps:
(1) preprocessing a packaging shell to be tested;
(2) and measuring the resistance of the lead.
2. The method as claimed in claim 1, wherein the package casing to be tested is a metal wall embedded insulator structure, and comprises a metal frame, a metal lead, a ceramic insulator and a metal base plate, all parts are connected by silver-copper solder to form the package casing, and a gold layer with a thickness of not less than 1.3 μm is plated on the surface of the package casing.
3. The method as claimed in claim 2, wherein the step (1) of preprocessing the package to be tested includes:
1) welding an auxiliary test line in a bonding area at the inner side of the ceramic insulator;
2) plating nickel and gold on the packaging shell, wherein the thickness of the gold layer is not less than 1.3 microns;
3) and welding the other end of the auxiliary test wire welded on the inner side of the insulator on the surface of the bottom plate of the packaging shell to form the shell to be tested.
4. The method as claimed in claim 1, wherein the step (2) of measuring the lead resistance specifically comprises:
1) firstly, adjusting the output voltage of a direct current voltage-stabilizing and current-stabilizing power supply to be a voltage value between 1V and 10V;
2) respectively connecting two output ends of a direct-current voltage-stabilizing and current-stabilizing power supply to a bottom plate of a packaging shell and a lead position of the packaging shell, and reading output current I of the power supply at the moment;
3) adjusting the universal meter to a voltage test gear, respectively connecting two connectors of the universal meter to the inner end and the outer end of the ceramic insulator of the shell to be tested, and reading the display voltage U of the universal meter;
4) and calculating the lead resistance R = U/I of the shell to be tested.
5. The method as claimed in claim 3, wherein in step 1), the ceramic insulator is soldered to the auxiliary test line with silver-copper solder, and the auxiliary test line is soldered to the bottom surface of the package casing with tin-lead solder.
6. The method as claimed in claim 3, wherein in step 1), the auxiliary test line is made of an iron-nickel alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111334458.7A CN114184841B (en) | 2021-11-11 | 2021-11-11 | Method for measuring lead resistance of packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111334458.7A CN114184841B (en) | 2021-11-11 | 2021-11-11 | Method for measuring lead resistance of packaging shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114184841A true CN114184841A (en) | 2022-03-15 |
| CN114184841B CN114184841B (en) | 2023-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111334458.7A Active CN114184841B (en) | 2021-11-11 | 2021-11-11 | Method for measuring lead resistance of packaging shell |
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| Country | Link |
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| CN (1) | CN114184841B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5550477A (en) * | 1994-08-01 | 1996-08-27 | Axis Usa, Inc. | Methods and apparatus for testing armature coils and coil lead connections using resistance measurements |
| US6674295B1 (en) * | 1999-08-05 | 2004-01-06 | Murata Manufacturing Co., Ltd. | Impedance measuring apparatus for electronic component |
| CN1654967A (en) * | 2004-02-09 | 2005-08-17 | 松下电器产业株式会社 | Resistance value calculation method |
| JP2006337268A (en) * | 2005-06-03 | 2006-12-14 | Sharp Corp | Measurement method for contact resistance, and measurement method for electrical characteristics of semiconductor element |
| CN103822869A (en) * | 2014-02-28 | 2014-05-28 | 工业和信息化部电子第五研究所 | Reliability detection method of bond wire welding spots of power supply |
| CN105785131A (en) * | 2016-04-21 | 2016-07-20 | 浪潮电子信息产业股份有限公司 | Testing device and method for low ohm chip resistors |
| CN107204322A (en) * | 2017-05-03 | 2017-09-26 | 中国电子科技集团公司第五十五研究所 | Multi-chip integrated form CQFP ceramic packages and preparation method thereof |
| US20200373272A1 (en) * | 2017-09-01 | 2020-11-26 | South China University Of Technology | High-Reliability Copper Alloy Bonding Wire for Electronic Packaging and Preparation Method Therefor |
-
2021
- 2021-11-11 CN CN202111334458.7A patent/CN114184841B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5550477A (en) * | 1994-08-01 | 1996-08-27 | Axis Usa, Inc. | Methods and apparatus for testing armature coils and coil lead connections using resistance measurements |
| US6674295B1 (en) * | 1999-08-05 | 2004-01-06 | Murata Manufacturing Co., Ltd. | Impedance measuring apparatus for electronic component |
| CN1654967A (en) * | 2004-02-09 | 2005-08-17 | 松下电器产业株式会社 | Resistance value calculation method |
| JP2006337268A (en) * | 2005-06-03 | 2006-12-14 | Sharp Corp | Measurement method for contact resistance, and measurement method for electrical characteristics of semiconductor element |
| CN103822869A (en) * | 2014-02-28 | 2014-05-28 | 工业和信息化部电子第五研究所 | Reliability detection method of bond wire welding spots of power supply |
| CN105785131A (en) * | 2016-04-21 | 2016-07-20 | 浪潮电子信息产业股份有限公司 | Testing device and method for low ohm chip resistors |
| CN107204322A (en) * | 2017-05-03 | 2017-09-26 | 中国电子科技集团公司第五十五研究所 | Multi-chip integrated form CQFP ceramic packages and preparation method thereof |
| US20200373272A1 (en) * | 2017-09-01 | 2020-11-26 | South China University Of Technology | High-Reliability Copper Alloy Bonding Wire for Electronic Packaging and Preparation Method Therefor |
Non-Patent Citations (3)
| Title |
|---|
| 刘志存: "微小电阻测量方法及关键技术", 《物理测试》, vol. 23, no. 1, pages 34 - 36 * |
| 邵大川 等: "IC封装的模型及参数测量", 《南开大学学报(自然科学版)》, vol. 28, no. 2, pages 81 - 86 * |
| 顾汉玉 等: "一种精确测量MOSFET 晶圆导通电阻的方法", 《电子与封装》, vol. 14, no. 9, pages 17 - 20 * |
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| CN114184841B (en) | 2023-11-24 |
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