CN114158200A - Board splicing equipment and PCB board splicing method - Google Patents

Abstract

The invention belongs to the technical field of PCBA manufacturing, and discloses a board splicing device and a PCB board splicing method, wherein the board splicing device is used for supplying materials to SMT equipment and specifically comprises a tray conveying device, a PCB feeding device, a carrying device and a coordinate calibration device, the carrying device can move between a station of the PCB feeding device and a station of the tray conveying device, and the coordinate calibration device is connected with the carrying device; the PCB splicing method uses the splicing equipment, and comprises the steps of identifying the coordinates of the PCB relative to a preset placing position, carrying a plurality of PCBs to the same tray, and finally conveying the tray to SMT equipment. The carrying device can carry a plurality of PCB boards to the same tray, the feeding efficiency of the SMT equipment is improved, and the production efficiency of downstream SMT equipment is improved.

Description

Board splicing equipment and PCB board splicing method

Technical Field

The invention relates to the technical field of PCBA manufacturing, in particular to a board splicing device and a PCB board splicing method.

Background

In the SMT (Surface Mounting Technology) industry, in a production line, a single board is generally printed by a solder paste machine in a manner of providing a single board by a worker or a board loader, and the printed single board is printed in a chip mounter for printing, so that the maximum printing area of equipment cannot be effectively utilized, the productivity of the equipment is wasted, and the production efficiency is low. When the requirement of capacity is large and the types of machines are various, the prior art generally purchases a plurality of production lines to increase the output or adopts a one-to-two double-track line body after the printing machine, so the cost is increased greatly and the output cannot be obviously increased. Especially, the small-sized PCB is mostly delivered in a multi-connection board mode, single-piece X-shaped printed boards are not eliminated (in the production of the multi-connection board, one or more defective products appear in the multi-connection board, and the defective products are marked with an X mark on the surface), the X-shaped printed boards in the feeding process need to be particularly centralized in the whole production process, and in the production back-stage process, manual work or a board dividing machine is needed to separate the multi-connection board from one piece, so that the time consumption and the cost are increased.

Based on the above current situation, it is necessary to design a board splicing device and a PCB board splicing method to solve the above problems.

Disclosure of Invention

One object of the present invention is: the board splicing equipment and the PCB board splicing method can splice a plurality of PCBs, so that the feeding efficiency of the SMT equipment is improved.

In order to achieve the purpose, the invention adopts the following technical scheme:

in one aspect, a splicing apparatus for feeding SMT equipment is disclosed, comprising:

the tray conveying device is used for providing and conveying trays;

the PCB feeding device is used for providing a PCB;

the carrying device can move between a station of the PCB feeding device and a station of the tray conveying device;

the coordinate calibration device is connected with the carrying device and can identify the coordinates of the PCB relative to a preset placing position, and the carrying device can carry a plurality of PCBs to the same tray.

As a preferable scheme, the coordinate calibration device includes:

the first calibration mechanism is arranged between the PCB feeding device and the tray conveying device and can identify the offset coordinate of the PCB relative to the preset placement position;

and the second calibration mechanism is used for identifying the coordinates of the carrying device relative to the preset placing position.

As a preferable scheme, the second calibration mechanism includes:

the calibration plate is arranged opposite to the tray, a plurality of preset identification points are arranged on the calibration plate, and the preset identification points correspond to the preset placing positions one by one;

and the positioning measuring piece is arranged on the carrying device, and can identify the coordinate of the carrying device relative to the preset identification point when the carrying device moves to a position between the calibration plate and the tray.

As a preferable aspect, the tray conveying device includes:

the tray feeding mechanism is used for providing the tray;

the plasma cleaning mechanism is positioned at the downstream of the tray feeding mechanism and can be used for cleaning the tray in a plasma manner;

conveying mechanism is located plasma cleaning mechanism's low reaches, conveying mechanism is used for carrying tray feed mechanism provides the tray, conveying mechanism has set gradually feeding position, fixed position and ejection of compact position, the tray can be fixed in fixed position, handling device can move in PCB loading attachment's station with between the fixed position.

As a preferable aspect, the conveying mechanism includes:

a base;

the first guide rail extends along the direction far away from the tray feeding mechanism;

the second guide rail, with first guide rail parallel arrangement, the second guide rail is along being close to or keeping away from the direction sliding connection of first guide rail in the base, the tray can first guide rail with follow in proper order on the second guide rail the material inlet level fixed position extremely the direction of material outlet level removes.

As a preferred scheme, climbing mechanism is installed to the below of fixed position, the baffle is installed to the top of fixed position, works as the tray removes when fixed position, climbing mechanism can the jacking the tray and will the tray support press in the baffle.

As a preferred scheme, the PCB loading device includes:

the first feeding mechanism is arranged on one side of the tray conveying device and can provide the PCB of a first type;

and the second feeding mechanism is arranged on the other side of the tray conveying device and can provide a second type of PCB.

As a preferred scheme, the first feeding mechanism comprises a bearing table and a first lifting assembly, the bearing table is connected to an execution end of the first lifting assembly, a plurality of stacked first-kind PCB boards are placed on the bearing table, and the first lifting assembly can drive the bearing table to lift;

second feed mechanism includes supporter and second lifting unit, the supporter connect in second lifting unit's execution end, be provided with a plurality of places that extend along vertical direction interval on the supporter, every place and placed respectively on the position and placed the second kind the PCB board, second lifting unit can drive the supporter goes up and down.

On the other hand, the PCB splicing method is further disclosed, the splicing device is used, and the method comprises the following steps:

identifying the coordinates of the PCB relative to the preset placement positions;

conveying a plurality of PCB boards to the same tray;

and conveying the tray to the SMT equipment.

As a preferable scheme, identifying coordinates of the PCB with respect to the preset placement position includes:

identifying the offset coordinate of the PCB relative to the preset placement position, and finely adjusting the PCB;

and identifying the coordinates of the carrying device relative to the preset placing position.

The invention has the beneficial effects that: the PCB splicing method uses the splicing device, and after a coordinate calibration device identifies coordinates of a PCB relative to a preset placement position, a carrying device can carry a plurality of PCBs to the same tray, so that the feeding efficiency of the SMT equipment is improved, and the production efficiency of downstream SMT equipment is further improved.

Drawings

The invention is explained in more detail below with reference to the figures and examples.

FIG. 1 is a schematic view of a first perspective of a panel splicing apparatus;

FIG. 2 is a schematic view of a second perspective of the panel splicing apparatus;

FIG. 3 is a schematic view of the handling apparatus and the positioning and measuring member;

FIG. 4 is a schematic structural view of a gripping mechanism and a positioning measurement member;

FIG. 5 is a schematic structural diagram of a tray feeding mechanism and a plasma cleaning mechanism;

FIG. 6 is an enlarged view of a portion of FIG. 5 at A;

FIG. 7 is a schematic structural view of a conveying mechanism;

FIG. 8 is a cross-sectional view of a first feed mechanism;

FIG. 9 is a schematic structural view of a second feeding mechanism;

FIG. 10 is a flow chart of a PCB tiling method.

In fig. 1 to 10:

1. a tray conveying device; 11. a tray feeding mechanism; 111. a first drive assembly; 112. a tray support; 1121. a placing table; 113. a second drive assembly; 114. a first push plate; 12. a plasma cleaning mechanism; 121. a plasma cleaning head; 122. a third drive assembly; 13. a conveying mechanism; 131. a base; 132. a first guide rail; 133. a second guide rail; 134. a fourth drive assembly; 135. a belt transport assembly; 14. a jacking mechanism; 15. a baffle plate;

2. a PCB feeding device; 21. a first feeding mechanism; 211. a bearing table; 212. a first lifting assembly; 22. a second feeding mechanism; 221. a rack; 222. a second lifting assembly; 223. a fifth drive assembly; 224. a second push plate;

3. a carrying device; 31. a three-axis drive mechanism; 311. an X-axis drive assembly; 312. a Y-axis drive assembly; 313. a Z-axis drive assembly; 32. a grabbing mechanism; 321. a self-locking sucker; 322. a rotary drive member;

4. a coordinate calibration device; 41. a first calibration mechanism; 411. a bottom camera; 42. a second calibration mechanism; 421. calibrating the plate; 422. positioning a measuring member;

5. and a frame.

Detailed Description

In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

The first embodiment is as follows:

as shown in fig. 1, the present embodiment provides a board splicing device, which can splice a plurality of PCB boards on a same tray, and then supply materials to an SMT device, and specifically includes a tray conveying device 1, a PCB feeding device 2, a carrying device 3, and a coordinate calibration device 4, where the tray conveying device 1 can provide and convey a tray coated with high-temperature self-adhesive silica gel; the PCB feeding device 2 can provide a PCB which can be a single-chip board, so that the operation of picking and beating the X-shaped board by subsequent manual work or separation of a board separator in the prior art is omitted, and the production efficiency is improved; the carrying device 3 can reciprocate between the station of the PCB feeding device 2 and the station of the tray conveying device 1; coordinate calibration device 4 is connected with handling device 3 communication, coordinate calibration device 4 can discern the relative coordinate of presetting the placement position of the PCB board that handling device 3 carried, specifically, be provided with virtual machine coordinate system on the makeup equipment, handling device 3 and coordinate calibration device 4 all are in this machine coordinate system, and based on this machine coordinate system, be provided with a plurality of presetting placement positions on the tray conveyor 1, this presetting placement position does not have the benchmark relation with the coordinate of tray, make handling device 3 can accurately carry the polylith PCB board to on the same tray, the specific quantity of PCB board can set up according to actual need, this embodiment does not do the injecing. At first, tray conveyor 1 and PCB loading attachment 2 provide tray and PCB respectively, then handling device 3 snatchs the PCB board, coordinate calibration device 4 discerns the coordinate of PCB board relative preset placement position, make handling device 3 carry this PCB board assigned position on the tray accurately, handling device 3 repeats above-mentioned action with coordinate calibration device 4, PCB board to the quantity of presetting has been placed on the tray, SMT equipment is provided to the tray that will fully load with the PCB board at last, improve the feed efficiency to SMT equipment, and then the production efficiency of low reaches SMT equipment has been improved.

As shown in fig. 1 and 2, the coordinate calibration device 4 includes a first calibration mechanism 41 and a second calibration mechanism 42, the first calibration mechanism 41 is installed on the frame 5 and located between the PCB feeding device 2 and the tray conveying device 1, and the second calibration mechanism 42 is installed downstream of the first calibration mechanism 41. Specifically, after the carrying device 3 grabs the PCB, the first calibration mechanism 41 can identify the offset coordinate of the PCB relative to the preset placement position, so that the carrying device 3 can finely adjust the grabbed PCB, thereby eliminating the error of grabbing the PCB, then the second calibration mechanism 42 can identify the coordinate of the carrying device 3 relative to the preset placement position, it can be understood that the carrying device 3 has a mechanical error, the second calibration mechanism 42 controls the carrying device 3 to self-adjust to eliminate the error of the carrying device 3, and the PCB is tiled to the designated position on the tray, so that the relative position degree among multiple PCBs is improved.

As shown in fig. 3 and 4, specifically, the carrying device 3 includes a three-axis driving mechanism 31 and a grabbing mechanism 32, the three-axis driving mechanism 31 is mounted on the frame 5 and located above the tray conveying device 1, the grabbing mechanism 32 is connected to an execution end of the three-axis driving mechanism 31, the three-axis driving mechanism 31 includes an X-axis driving component 311, a Y-axis driving component 312 and a Z-axis driving component 313, the X-axis driving component 311 may be configured as a rack-and-pinion driving structure or a lead screw nut driving structure driven by a motor, the X-axis driving component 311 of the present embodiment is a lead screw nut driving structure, the Y-axis driving component 312 may be configured as a rack-and-pinion driving structure or a lead screw nut driving structure driven by a motor, the Y-axis driving component 312 of the present embodiment is a lead screw nut driving structure, the X-axis driving component 311 is connected to an execution end of the Y-axis driving component 312, the Z-axis driving component 313 may also be configured as a rack-and-pinion driving structure or a lead screw nut driving structure driven by a motor Moving structure, the Z-axis driving assembly 313 of this embodiment includes a motor and a belt transmission pair connected to the output end of the motor, and the grabbing mechanism 32 is connected to the belt, so that the three-axis driving mechanism 31 can drive the grabbing mechanism 32 to move in three degrees of freedom.

In this embodiment, the grabbing mechanism 32 includes a rotation driving element 322 and a self-locking sucker 321 connected to the output end of the rotation driving element 322, the self-locking sucker 321 is a prior art, and can be self-sealed when being sucked to a hole, a specific structure is not described, the rotation driving element 322 can be set as a motor or a rotating cylinder, the rotation driving element 322 of this embodiment is a motor, the motor is installed on a belt of the Z-axis driving component 313, and the self-locking sucker 321 is connected to the output end of the motor. The first calibration mechanism 41 includes a bottom camera 411, the bottom camera 411 may also be replaced by a grating reader or a magnetic grating reader, and the bottom camera 411 of this embodiment is installed on the rack 5 and located between the PCB feeding device 2 and the tray conveying device 1. When the self-locking sucker 321 adsorbs the PCB provided by the PCB feeding device 2 and moves to the upper side of the bottom camera 411, the bottom camera 411 can identify an optical point on the PCB, then the deviation of the PCB relative to a preset placing position is calculated, and finally the motor drives the self-locking sucker 321 and the PCB to rotate so as to correct and correct the deviation of the PCB, so that the grabbing error of the grabbing mechanism 32 is eliminated. In other embodiments of the present invention, the handling device 3 may also be configured as a multi-degree-of-freedom mechanical arm, and the self-locking suction cup 321 is connected to an execution end of the mechanical arm, and can also achieve the function of grabbing and moving the PCB board.

Specifically, the second calibration mechanism 42 includes a calibration board 421 and a positioning measurement component 422, when the tray is fixed, the calibration board 421 and the tray are arranged relatively, a plurality of preset identification points are arranged on the calibration board 421, the preset identification points correspond to preset placement positions on which the PCB board needs to be placed one-to-one, the positioning measurement component 422 can be arranged as a camera, a grating reader or a magnetic grating reader, the positioning measurement component 422 of this embodiment is arranged as a camera, and the camera and the Z-axis driving component 313 are arranged on the same mounting board and connected to the execution end of the X-axis driving component 311. After grabbing mechanism 32 and absorbing the PCB board through bottom camera 411, remove to between calibration board 421 and the tray, the camera of second calibration mechanism 42 can discern the default identification point on the calibration board 421, then calculate the relative coordinate of presetting the identification point of grabbing mechanism 32, and the triaxial actuating mechanism 31 drive is grabbed mechanism 32 and is placed the PCB board and place the preset of tray and put the position at last, has improved the collage precision of PCB board.

As shown in fig. 5 to 7, the tray conveying device 1 includes a tray feeding mechanism 11, a plasma cleaning mechanism 12, and a conveying mechanism 13, the tray feeding mechanism 11 is capable of providing a tray, the plasma cleaning mechanism 12 is located downstream of the tray feeding mechanism 11, the plasma cleaning mechanism 12 is capable of plasma cleaning a silica gel surface of the tray provided by the tray feeding mechanism 11, thereby increasing the number of times the tray is used, the conveying mechanism 13 is located downstream of the plasma cleaning mechanism 12, and the conveying mechanism 13 is capable of conveying the tray after plasma cleaning. Feeding level, fixed position and play material level have set gradually on conveying mechanism 13, and the feeding is located the discharge end intercommunication of plasma wiper mechanism 12, and after plasma wiper mechanism 12 washs the tray, conveying mechanism 13 can carry the tray to fixed position fixed, then handling device 3 carries polylith PCB board to the tray on, and conveying mechanism 13 carries the tray that bears the weight of the PCB board to ejection of compact position at last. It can be understood that when the tray is fixed in fixed position, predetermine the tray of placing the position when being located the fixed on, but the tray at this moment only plays the effect of bearing PCB board to do not participate in the coordinate positioning of PCB board, as long as place the relative position degree between the polylith PCB board with polylith PCB board one-to-one in the machine coordinate system a plurality of predetermine the position of placing and guarantee that polylith PCB board.

Specifically, the tray feeding mechanism 11 includes a first driving assembly 111, a tray support 112, a second driving assembly 113 and a first pushing plate 114, wherein the tray support 112 is provided with placing platforms 1121 arranged at intervals along the vertical direction, the placing platforms 1121 are symmetrically arranged at two sides of the tray support 112, and a tray is placed on each pair of placing platforms 1121; the first driving assembly 111 may be configured as a gear-rack driving structure or a lead screw nut driving structure driven by a motor, the first driving assembly 111 of this embodiment is a lead screw nut structure, and the tray support 112 is connected to an output end of the first driving assembly 111; the second driving assembly 113 is installed on the top of the tray support 112, the second driving assembly 113 may be configured as an air cylinder push rod structure or a motor-driven chain structure, the second driving assembly 113 of this embodiment is a motor-driven chain structure, the first pushing plate 114 is connected to the execution end of the second driving assembly 113, and the second driving assembly 113 can drive the first pushing plate 114 to move the tray from the placing table 1121 in a direction close to the plasma cleaning mechanism 12 and the conveying mechanism 13. The first tray is located on the pair of the uppermost placing tables 1121, the second driving assembly 113 drives the first pushing plate 114 to push the first tray to the feeding position of the conveying mechanism 13, the plasma cleaning mechanism 12 located at the feeding position plasma cleans the first tray, and then the conveying mechanism 13 conveys the first tray; the first driving assembly 111 drives the second tray to ascend to the position of the first push plate 114, and the second driving assembly 113 drives the first push plate 114 to repeat the same action to convey the second tray to the plasma cleaning mechanism 12 for cleaning, so that the tray feeding efficiency is improved.

Specifically, the plasma cleaning mechanism 12 includes a plasma cleaning head 121 and a third driving assembly 122, the plasma cleaning head 121 is a prior art, a specific structure is not described here, the third driving assembly 122 is installed at the discharging end of the tray feeding mechanism 11, and may be configured as an air cylinder push rod structure or a motor-driven belt transmission structure, the third driving assembly 122 of this embodiment is configured as a motor-driven belt transmission structure, the plasma cleaning head 121 is installed on a belt of the belt transmission structure, and a driving direction of the third driving assembly 122 is perpendicular to a conveying direction of the conveying mechanism 13. It is understood that the third driving mechanism can drive the plasma cleaning head 121 in the width direction of the tray when the tray is conveyed in the length direction of the tray by the conveying mechanism 13, thereby plasma-cleaning the entire silica gel surface of the tray.

In this embodiment, as shown in fig. 7, the conveying mechanism 13 includes a base 131, a first guide rail 132 and a second guide rail 133, the base 131 is installed on the frame 5, the first guide rail 132 and the second guide rail 133 are arranged in parallel and both extend along a direction away from the tray feeding mechanism 11, a belt conveying assembly 135 is installed on the first guide rail 132 and the second guide rail 133, the belt conveying assembly 135 includes a motor and a plurality of sets of rollers installed on side walls of the first guide rail 132 and the second guide rail 133, a belt is wound on the rollers, the rollers are connected to an output end of the motor, and the motor can drive the belt to rotate through the rollers. After the tray provided by the tray feeding mechanism 11 enters the feeding position of the conveying mechanism 13, the tray is placed on the belt of the belt conveying assembly 135, so that the tray can be driven to move along the direction from the feeding position to the discharging position.

As a preferred embodiment, the first guide rail 132 is fixed on the base 131, a guide rail extending from the first guide rail 132 to the second guide rail 133 is installed on the base 131, a slider is installed at the bottom of the second guide rail 133, the slider is slidably connected to the guide rail, the conveying mechanism 13 further includes a fourth driving assembly 134, the fourth driving assembly 134 may be configured as an air cylinder push rod structure or a motor-driven lead screw nut structure, the fourth driving assembly 134 of this embodiment is configured as a motor-driven lead screw nut structure, and the second guide rail 133 is connected to an execution end of the fourth driving assembly 134. The fourth driving assembly 134 can drive the second guide rail 133 to move in a direction close to or far away from the first guide rail 132, so that the distance between the first guide rail 132 and the second guide rail 133 can be adjusted to adapt to trays with different widths, and the universality is improved.

Specifically, a fixed position of the tray conveying device 1 is provided with a jacking mechanism 14 and a baffle 15, the jacking mechanism 14 can be driven by an electric push rod or an air cylinder, the jacking mechanism 14 in the embodiment is driven by the air cylinder, the air cylinder is installed on the rack 5 and is positioned below the fixed position, and the output end of the air cylinder is provided with a buffer piece; the two baffle plates 15 are respectively arranged on the first guide rail 132 and the second guide rail 133, and the distance between the two baffle plates 15 is slightly smaller than that between the first guide rail 132 and the second guide rail 133. When belt conveying assembly 135 drive tray removed to the fixed position, climbing mechanism 14 can the jacking tray and support the tray in baffle 15 to be fixed in the fixed position with the tray, be convenient for follow-up handling device 3 carries polylith PCB board to the tray of fixed position on.

As shown in fig. 1, 8 and 9, the PCB feeding device 2 includes a first feeding mechanism 21 and a second feeding mechanism 22, and the first feeding mechanism 21 and the second feeding mechanism 22 are respectively disposed at two sides of the conveying mechanism 13. First feed mechanism 21 and second feed mechanism 22 can provide different types of PCB board respectively, make handling device 3 can carry different types of PCB board to on the same tray to can satisfy the SMT technology demand of many models or negative and positive board, improved production efficiency.

Specifically, first feed mechanism 21 includes plummer 211 and first lifting unit 212, the quantity of plummer 211 can set up according to actual need, two plummers 211 of this embodiment are installed on frame 5 and are located conveying mechanism 13's one side, can place the range upon range of worn board of polylith on the plummer 211, first lifting unit 212 can set up to motor drive's screw nut structure or gear rack structure, the first lifting unit 212 of this embodiment is motor drive's screw nut structure, the nut rotates and installs the bottom at frame 5, the lead screw rotates the mesa that runs through frame 5 and is connected with plummer 211, compact structure. After the carrying device 3 takes away one PCB on the carrying platform 211, the first lifting assembly 212 can drive the carrying platform 211 to ascend by a distance equal to the thickness of one PCB, so that the carrying device 3 can take away the next PCB.

Specifically, the second feeding mechanism 22 includes a rack 221, a second lifting assembly 222, a fifth driving assembly 223 and a second push plate 224, wherein the rack 221 is provided with placing tables arranged at intervals along the vertical direction, the placing tables are symmetrically arranged on two sides of the rack 221, each pair of placing tables is a placing position, and each placing position is provided with a PCB board one surface of which is already mounted; the second lifting assembly 222 can be a gear and rack driving structure or a screw nut driving structure driven by a motor, the second lifting assembly 222 of this embodiment is a screw nut structure, and the rack 221 is connected to the output end of the second lifting assembly 222; fifth drive assembly 223 is installed at the top of tray support 112, and fifth drive assembly 223 can set up to cylinder push rod structure or motor drive's chain structure, and second drive assembly 113 of this embodiment is cylinder push rod structure, and the cylinder is installed in one side of supporter 221, and second push pedal 224 passes through the keysets to be connected in the output of cylinder, and fifth drive assembly 223 can drive second push pedal 224 and release the PCB board from placing the position along the direction that is close to conveying mechanism 13. The first PCB is positioned on the pair of uppermost placing tables, the fifth driving assembly 223 drives the second pushing plate 224 to push out the first PCB, and the carrying device 3 can carry the first PCB to the tray of the conveying mechanism 13; the second lifting assembly 222 drives the second PCB to ascend to the position of the second pushing plate 224, and the fifth driving assembly 223 drives the second pushing plate 224 to repeat the same action to push out the second PCB, so that the feeding efficiency of the PCBs is improved. In other embodiments of the present invention, the PCB loading devices 2 may be provided with a plurality of first loading mechanisms 21 or a plurality of second loading mechanisms 22, which are also capable of providing different types of PCB boards.

Example two:

as shown in fig. 10, the present embodiment provides a PCB splicing method, and a plurality of PCBs can be spliced on the same tray by using the splicing device of the first embodiment, so as to improve the feeding efficiency to the SMT equipment, and further improve the production efficiency of downstream SMT equipment. The method specifically comprises the following steps:

s101: and (6) feeding the tray.

The tray feeding mechanism 11 can provide the tray coated with the high-temperature self-adhesive silica gel downstream.

S102: the tray is plasma cleaned.

The plasma cleaning mechanism 12 plasma cleans the silica gel surface of the supplied tray, thereby increasing the number of times the tray is used.

S103: the carrying device 3 grabs the PCB board.

The carrying device 3 grabs the PCB provided by the PCB feeding device 2.

S104: the first calibration mechanism 41 identifies the offset coordinate of the PCB with respect to the preset placement position, and the grabbing mechanism 32 finely adjusts the PCB.

When the grabbing mechanism 32 adsorbs the PCB provided by the PCB feeding device 2 and moves above the bottom camera 411 of the first calibration mechanism 41, the bottom camera 411 can identify an optical point on the PCB, then calculate a deviation of a preset coordinate of the PCB relative to the PCB in a machine coordinate system, and finally, the motor drives the PCB to rotate to correct the deviation of the PCB, so that a grabbing error of the grabbing mechanism 32 is eliminated.

S105: the second calibration means 42 identifies the coordinates of the handling device 3 relative to the predetermined placement position.

After the carrying device 3 grabs the PCB and goes through the step S104, the carrying device 3 moves the PCB with the PCB to a position between the calibration board 421 and the tray, the camera of the second calibration mechanism 42 can identify the preset identification point on the calibration board 421, the preset identification point corresponds to the preset placement position one by one, and then the coordinate of the grabbing mechanism 32 relative to the preset identification point is calculated.

S201: the carrying device 3 pastes the PCB board to the tray.

After the calculation of the second calibration mechanism 42 in step S105, the three-axis driving mechanism 31 drives the grabbing mechanism 32 to correct the deviation and then place the PCB on the preset placement position of the tray, so that the collaging precision of the PCB is improved.

S202: and judging whether a preset number of PCB boards are spliced on the tray.

If yes, executing S300;

if not, S103 is executed, specifically, two first feeding mechanisms 21 and two second feeding mechanisms 22 are provided in this embodiment, and the carrying device 3 may cyclically grab the PCB boards in the directions of the station of the first feeding mechanism 21, the station of the second first feeding mechanism 21, the station of the first second feeding mechanism 22, and the station of the second feeding mechanism 22 in sequence, so as to tile different types of PCB boards onto the same tray. In other embodiments, the carrying device 3 may also finish taking the PCB provided by the first feeding mechanism 21, and then finish taking the PCB provided by the second first feeding mechanism 21, the first second feeding mechanism 22, and the second feeding mechanism 22 in sequence, so as to tile a plurality of same kind of PCBs onto the same tray.

S300: the tray is conveyed to the SMT equipment.

After the PCB boards with the preset number are spliced on the tray, the tray is conveyed to SMT equipment so as to complete the subsequent SMT process, and the production efficiency is improved.

In the description herein, it is to be understood that the terms "upper," "lower," "left," "right," and the like are based on the orientation or positional relationship shown in the drawings for convenience in description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

In addition, the foregoing is only the preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (10)

1. A panel splicing device for feeding SMT equipment, comprising:

a pallet conveying device (1) for supplying and conveying pallets;

the PCB feeding device (2) is used for providing a PCB;

the carrying device (3) can move between a station of the PCB feeding device (2) and a station of the tray conveying device (1);

the coordinate calibration device (4) is connected with the carrying device (3), the coordinate calibration device (4) can identify the coordinates of the PCB relative to a preset placing position, and the carrying device (3) can carry a plurality of PCBs to the same tray.

2. Jigsaw device according to claim 1, wherein said coordinate calibration means (4) comprise:

the first calibration mechanism (41) is arranged between the PCB feeding device (2) and the tray conveying device (1), and the first calibration mechanism (41) can identify the offset coordinate of the PCB relative to the preset placement position;

and the second calibration mechanism (42) is used for identifying the coordinates of the carrying device (3) relative to the preset placing position.

3. Jigsaw device according to claim 2, wherein the second indexing means (42) comprise:

the calibration plate (421) is arranged opposite to the tray, a plurality of preset identification points are arranged on the calibration plate (421), and the preset identification points correspond to the preset placement positions one by one;

and the positioning measuring piece (422) is arranged on the conveying device (3), and when the conveying device (3) moves to a position between the calibration plate (421) and the tray, the positioning measuring piece (422) can identify the coordinate of the conveying device (3) relative to the preset identification point.

4. Jigsaw device according to claim 1, wherein said pallet conveyor (1) comprises:

a tray feeding mechanism (11) for providing the tray;

the plasma cleaning mechanism (12) is positioned at the downstream of the tray feeding mechanism (11), and the plasma cleaning mechanism (12) can perform plasma cleaning on the tray;

conveying mechanism (13), be located the low reaches of plasma wiper mechanism (12), conveying mechanism (13) are used for carrying tray feed mechanism (11) provide the tray, conveying mechanism (13) have set gradually into material level, fixed position and ejection of compact position, the tray can be fixed in fixed position, handling device (3) can move in the station of PCB loading attachment (2) with between the fixed position.

5. Jigsaw device according to claim 4, wherein said conveying means (13) comprise:

a base (131);

a first guide rail (132) extending in a direction away from the tray feeding mechanism (11);

second guide rail (133), with first guide rail (132) parallel arrangement, second guide rail (133) are along being close to or keeping away from the direction sliding connection of first guide rail (132) in base (131), the tray can first guide rail (132) with follow in proper order on second guide rail (133) the material inlet level fixed position extremely the direction of material outlet level removes.

6. Board splicing device according to claim 4, wherein a jacking mechanism (14) is mounted below the fixing position, a baffle (15) is mounted above the fixing position, and when the tray moves to the fixing position, the jacking mechanism (14) can jack the tray and press the tray against the baffle (15).

7. Jigsaw device according to claim 1, wherein the PCB feeding means (2) comprises:

the first feeding mechanism (21) is arranged on one side of the tray conveying device (1), and the first feeding mechanism (21) can provide the PCB of the first kind;

and the second feeding mechanism (22) is arranged on the other side of the tray conveying device (1), and the second feeding mechanism (22) can provide the PCB of the second kind.

8. The board splicing device according to claim 7, wherein the first feeding mechanism (21) comprises a bearing table (211) and a first lifting assembly (212), the bearing table (211) is connected to an execution end of the first lifting assembly (212), a plurality of stacked PCB boards of a first kind are placed on the bearing table (211), and the first lifting assembly (212) can drive the bearing table (211) to lift;

second feed mechanism (22) includes supporter (221) and second lifting unit (222), supporter (221) connect in the execution end of second lifting unit (222), be provided with a plurality of places positions that extend along vertical direction interval on supporter (221), every place and place the second kind respectively on the position PCB board, second lifting unit (222) can drive supporter (221) goes up and down.

9. A method of PCB board splicing, using the board splicing apparatus of any one of claims 1 to 8, comprising:

identifying the coordinates of the PCB relative to the preset placement positions;

conveying a plurality of PCB boards to the same tray;

and conveying the tray to the SMT equipment.

10. The PCB panel splicing method according to claim 9, wherein identifying coordinates of the PCB panel relative to the preset placement position comprises:

identifying the offset coordinate of the PCB relative to the preset placement position, and finely adjusting the PCB;

and identifying the coordinates of the carrying device (3) relative to the preset placing position.

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