CN114156068B - Composite sound absorption and insulation plate for transformer - Google Patents
Composite sound absorption and insulation plate for transformer Download PDFInfo
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- CN114156068B CN114156068B CN202111496538.2A CN202111496538A CN114156068B CN 114156068 B CN114156068 B CN 114156068B CN 202111496538 A CN202111496538 A CN 202111496538A CN 114156068 B CN114156068 B CN 114156068B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/33—Arrangements for noise damping
Abstract
The invention relates to a composite sound absorption and insulation board for a transformer, which is formed by compounding a glass fiber reinforced epoxy resin sound insulation board, a middle filling type resistive sound absorption layer, a glass fiber reinforced epoxy resin micropunching board, a sound absorption wedge and a local resonance type acoustic ultra-structure film. The composite sound absorption and insulation member is prepared from an insulating material, and the high-density high-sound insulation composite material is obtained through the component control of a resin matrix; by adding the high-strength glass fiber, the mechanical property of the composite material is improved; and the low-frequency acoustic sealing effect is optimized through the design of the sound absorption wedge and the compounding of the resistive sound absorption layer and the local resonance type acoustic ultra-structural film. The composite sound absorption and insulation member can be used for manufacturing a distribution transformer sound insulation cover and a sound insulation baffle, and has good low-frequency noise reduction effect.
Description
Technical Field
The invention belongs to the field of noise control devices, and particularly relates to a composite sound absorption and insulation board for a transformer.
Background
The transformer is a junction device in the power transmission and distribution network of the power system, and is also one of main devices which cause noise vibration and cause environmental protection complaints. Particularly, with the increase of power supply load and the extension of service time, the noise pollution problem of part of power transformers is increasingly prominent. A large number of field tests and laboratory researches show that the transformer noise is middle-low frequency noise, and the frequency spectrum of the transformer noise is mainly concentrated on 50Hz and frequency multiplication components thereof within the 700Hz range. The noise wave grows up, the attenuation is slow, the penetrating power is strong, and the treatment difficulty is high. For this reason, two modes of noise source control and propagation path control have been proposed. The former adopts the modes of improving the materials, the structure and the like of the body, can directly reduce the noise level of the transformer from the source, has the most remarkable noise reduction effect, but has higher noise reduction technical difficulty and cost; the latter reduces transformer noise by applying a sound insulating/absorbing (vibration) material to absorb energy of a vibration sound signal during the propagation of noise (vibration), has a certain noise reduction effect and is relatively low in cost, but the noise reduction effect for low frequency signals has yet to be improved.
The composite sound absorbing and insulating plate is an important noise reduction device for auxiliary noise reduction or body noise reduction technology. The device is generally based on a mass sound insulation law, and the blocking effect on noise transmission is enhanced by improving the surface density of the plate. Through the technical development of the noise reduction fields of rail transit, mechanical workshops and the like, various types of sound insulation boards exist on the market, but the acoustic performance of the sound insulation boards is not completely matched with the low-frequency characteristic of transformer noise.
Disclosure of Invention
The invention aims to provide a composite sound absorption and insulation board for a transformer, which can be used as a cover wall material of a transformer sound insulation cover, can also be used for manufacturing a semi-closed or fully-closed sound insulation baffle of the transformer, and provides an effective material for enhancing the sound insulation and noise reduction level of the transformer.
The composite sound absorption and insulation board provided by the invention uses glass fiber reinforced epoxy resin as a matrix material, and the surface density and mechanical property of the composite material are cooperatively improved through formulation design and high-strength glass fiber reinforcement, so that good sound insulation performance and service effect are ensured. On the basis, the control effect of the sound insulation board on low-frequency noise is comprehensively improved through the design of the sound absorption wedge, the matching of the resistive sound absorption layer, the local resonance type acoustic ultra-structural film and the high-density sound insulation board.
In order to achieve the aim of the invention, the invention adopts the following technical scheme:
the composite sound absorption and insulation plate for the transformer adopts an inner-absorption and outer-insulation acoustic structure and consists of a glass fiber reinforced epoxy resin sound insulation plate, a middle-filling type resistive sound absorption layer, a sound absorption wedge and a local resonance type acoustic ultra-structure film; the middle filling type anti-sound-absorbing layer is paved above the glass fiber reinforced epoxy resin sound-insulating plate, the sound-absorbing wedges are uniformly paved on the upper surface of the middle filling type anti-sound-absorbing layer, the outer parts of the sound-absorbing wedges are glass fiber reinforced epoxy resin microperforated plates, the inner parts of the sound-absorbing wedges are filled type anti-sound-absorbing layers, and the upper ends of the sound-absorbing wedges are supported with local resonance type acoustic ultra-structure films.
Further, the glass fiber reinforced epoxy resin consists of a resin matrix and high-strength glass fibers, wherein the resin matrix is prepared from the following components in parts by weight:
60-80 parts of bisphenol A type epoxy resin
20-30 parts of diluent
15-30 parts of curing agent
2-10 parts of promoter
1-5 parts of coupling agent
10-30 parts of high-density filling components;
the diluent is ethylene glycol diglycidyl ether, 1, 4-butanediol diglycidyl ether or butyl glycidyl ether, the curing agent is one or more of methyl tetrahydrophthalic anhydride, cardanol modified phenolic amine, 593# curing agent and 701# curing agent, the accelerator is one or more of phthalic anhydride, tetrahydrophthalic anhydride, 2,4, 6-tri (dimethylaminomethyl) phenol, and the coupling agent is isopropyl tri (dioctyl pyrophosphoric acid acyloxy) titanate, A171 or A151.
Further, the high-density filler in the resin matrix is quartz sand, glass beads or mica powder.
Further, the high-strength glass fiber is E-type glass fiber, and the volume ratio of the glass fiber to the resin matrix is 1:7~4:7.
further, the preparation method of the glass fiber reinforced epoxy resin sound insulation plate and the glass fiber reinforced epoxy resin microperforated panel comprises the following steps:
(1) Weighing 1-5 parts of coupling agent and 50ml of aqueous solution, uniformly mixing, adding 10-30 parts of high-density filling component at 40-50 ℃ and continuously stirring for 40-50min, then washing with absolute ethyl alcohol and standing.
(2) Weighing 60-80 parts of bisphenol A epoxy resin, 20-30 parts of diluent and 2-10 parts of accelerator, uniformly stirring, and standing for 10min.
(3) Weighing 15-30 parts of curing agent and keeping the volume ratio of the curing agent to the resin matrix to be 1:7~4:7, uniformly stirring the E glass fibers, pouring the E glass fibers into a mold, and curing at normal temperature.
(4) In order to prepare the glass fiber reinforced epoxy resin sound insulation board, a common flat plate die is adopted for molding; in order to prepare the fiber reinforced epoxy resin microperforated panel, the flat plate mold is uniformly provided with slender steel wires with diameters below 1 mm.
Further, the thickness of the glass fiber reinforced epoxy resin sound insulation plate is 1cm-3cm.
Further, the penetration rate of the glass fiber reinforced epoxy resin microperforated panel is 1% -3%, and the thickness is 1mm-3mm.
Further, the ratio of the base to the length of the wedge is 1: 3-1: 5, the length of the split part is 3cm-6cm, the top of the sound absorption wedge is not completely sharp, and a small platform can be arranged.
Further, the filling type resistive sound absorption layer is made of superfine glass fiber and has the density of 24-48kg/m 3 。
Further, the local resonance type acoustic ultra-structure film is positioned at the top of the sound absorption wedge and consists of a polyimide film and a mass block.
Further, the mass block is a cylindrical iron block, the radius is 5mm-10mm, the thickness is 1-3mm, and the mass block is adhered to the film through an adhesive such as 502 glue or resin.
Further, the thickness of the polyimide film is 0.1-0.5mm, and the prestress is 4-8MPa.
By adopting the technical scheme, the main benefits of the invention are as follows:
(1) The high-density sound insulation board and the microperforated panel are prepared from glass fiber reinforced epoxy resin, and the material is optimized by a formula system, so that the material has excellent sound insulation performance and mechanical performance, and has excellent low-frequency acoustic performance and service durability.
(2) The structural design of the sound absorption wedge is adopted, so that good impedance matching and sound absorption effects are obtained, and the consumption and absorption effects on low-frequency sound wave energy are greatly improved.
(3) The design of the local resonance type acoustic ultra-structure film is adopted, so that the sound insulation effect on low-frequency line spectrum sound is further improved.
(4) According to the invention, through material improvement and composite sound absorption and insulation structure improvement, the limitation of mass sound insulation law is broken through, a good sound insulation effect is obtained under relatively low mass, and the lightweight design of the noise reduction device is realized.
(5) The sound insulation plate provided by the invention is solidified and molded through the die, can be used for preparing composite sound absorption and insulation members with various structural forms according to the installation conditions of the transformer, and is convenient to install and use.
Drawings
FIG. 1 is a schematic structural view of a composite sound absorbing and insulating board in the invention;
in the figure: 1-a glass fiber reinforced epoxy resin microperforated panel; 2-sound absorption wedge; 3-an intermediate filled type resistive sound absorbing layer; 4-glass fiber reinforced epoxy resin sound insulation board; 5-polyimide film; 6-a mass block, wherein the polyimide film 5 and the mass block 6 form a local resonance type acoustic ultra-structural film together; 7-a protective surface baffle.
Detailed Description
The following describes the embodiments of the present invention in further detail with reference to the drawings.
Example 1
As shown in fig. 1, the composite sound absorption and insulation board for the transformer adopts an inner absorption and outer insulation acoustic structure, and consists of a glass fiber reinforced epoxy resin sound insulation board 4, a middle filling type resistive sound absorption layer 3, a sound absorption wedge 2 and a local resonance type acoustic ultra-structural film; the middle filling type anti-sound-absorbing layer 3 is paved above the glass fiber reinforced epoxy resin sound-insulating plate 4, the sound-absorbing wedges 2 are uniformly paved on the upper surface of the middle filling type anti-sound-absorbing layer 3, the outer parts of the sound-absorbing wedges 2 are glass fiber reinforced epoxy resin micropunching plates 1, the inner parts of the sound-absorbing wedges are filled type anti-sound-absorbing layers, and a local resonance type acoustic ultra-structural film is supported at the upper ends of the sound-absorbing wedges 2. The lower part of the sound absorption wedge 2 is open, the filled type sound absorption layer inside and the filled type sound absorption layer 3 in the middle are made of the same material, the sound absorption wedge 2 can be integrally formed, the two sides of the sound absorption wedge 2 are also provided with a protective surface baffle 7, and the sound absorption wedge is connected with the glass fiber reinforced epoxy resin sound insulation plate 4 through screws.
The glass fiber reinforced epoxy resin sound insulation board consists of a resin matrix and high-strength glass fibers, wherein the resin matrix is prepared from the following components in parts by weight:
60 parts of bisphenol A type epoxy resin
30 parts of diluent
15 parts of curing agent
Accelerator 2 parts
1 part of coupling agent
10 parts of high-density filling component;
the diluent in the formula is ethylene glycol diglycidyl ether, the curing agent is methyl tetrahydrophthalic anhydride, the accelerator is phthalic anhydride, and the coupling agent is isopropyl tri (dioctyl pyrophosphoryloxy) titanate. The high-density filler is quartz sand.
The high-strength glass fiber is E-type glass fiber, and the volume ratio of the glass fiber to the resin matrix is 1:7. the preparation method of the glass fiber reinforced epoxy resin comprises the following steps:
(1) 1 part of coupling agent and 50ml of aqueous solution are weighed and mixed uniformly, 10 parts of high-density filler component are added at 40 ℃ and stirred continuously for 40min, and then rinsed with absolute ethanol and left to stand.
(2) 60 parts of bisphenol A epoxy resin, 30 parts of diluent and 2 parts of accelerator are weighed, stirred uniformly and kept stand for 10min.
(3) 15 parts of curing agent, 10 parts of high-density filling component and the volume ratio of the high-density filling component to the resin matrix are weighed and kept at 1:7, uniformly stirring the E glass fibers, pouring the E glass fibers into a mold, and curing at normal temperature.
(4) In order to prepare the glass fiber reinforced epoxy resin sound insulation board, a common flat plate die is adopted for molding; in order to prepare the fiber reinforced epoxy resin microperforated panel, the flat plate mold is uniformly provided with slender steel wires with diameters below 1 mm.
By adopting the preparation process, the thickness of the finally prepared and molded glass fiber reinforced epoxy resin sound insulation plate is 1cm, the penetration rate of the glass fiber reinforced epoxy resin microperforated plate is 1%, the thickness is 1mm, the middle filling type resistive sound absorption layer is superfine glass fiber, and the density is 24kg/m 3 . The sound absorption wedge composed of the microperforated plate and the superfine glass fiber has the length ratio of 1:3, the length of the split part is 3cm.
Meanwhile, a local resonance type acoustic ultra-structure film is arranged at the top of the sound absorption wedge and consists of a polyimide film and a mass block. Wherein the mass block is a cylindrical iron block, the radius is 5mm, and the thickness is 1mm; the thickness of the polyimide film is 0.1mm, and the prestress is 4MPa.
Example 2
As shown in fig. 1, the composite sound absorption and insulation board for the transformer adopts an inner absorption and outer insulation acoustic structure, and consists of a glass fiber reinforced epoxy resin sound insulation board 4, a middle filling type resistive sound absorption layer 3, a sound absorption wedge 2 and a local resonance type acoustic ultra-structural film; the middle filling type anti-sound-absorbing layer 3 is paved above the glass fiber reinforced epoxy resin sound-insulating plate 4, the sound-absorbing wedges 2 are uniformly paved on the upper surface of the middle filling type anti-sound-absorbing layer 3, the outer parts of the sound-absorbing wedges 2 are glass fiber reinforced epoxy resin micropunching plates 1, the inner parts of the sound-absorbing wedges are filled type anti-sound-absorbing layers, and a local resonance type acoustic ultra-structural film is supported at the upper ends of the sound-absorbing wedges 2. The lower part of the sound absorption wedge 2 is open, the filled type sound absorption layer inside and the filled type sound absorption layer 3 in the middle are made of the same material, the sound absorption wedge 2 can be integrally formed, the two sides of the sound absorption wedge 2 are also provided with a protective surface baffle 7, and the sound absorption wedge is connected with the glass fiber reinforced epoxy resin sound insulation plate 4 through screws.
The glass fiber reinforced epoxy resin sound insulation board consists of a resin matrix and high-strength glass fibers, wherein the resin matrix is prepared from the following components in parts by weight:
80 parts of bisphenol A type epoxy resin
Diluent 20 parts
30 parts of curing agent
Accelerator 10 parts
5 parts of coupling agent
30 parts of high-density filling component
The diluent in the formula is 1, 4-butanediol diglycidyl ether, the curing agent is cardanol modified phenolic amine and 593# curing agent, the accelerator is tetrahydrophthalic anhydride, and the coupling agent is A171. The high-density filler is glass microsphere.
The high-strength glass fiber is E-type glass fiber, and the volume ratio of the glass fiber to the resin matrix is 4:7. the preparation method of the glass fiber reinforced epoxy resin comprises the following steps:
(1) 5 parts of coupling agent and 50ml of aqueous solution are weighed and mixed well, 30 parts of high density filler component are added at 50 ℃ and stirred continuously for 50min, followed by rinsing with absolute ethanol and standing.
(2) 80 parts of bisphenol A epoxy resin, 20 parts of diluent and 10 parts of accelerator are weighed, stirred uniformly and kept stand for 10min.
(3) 30 parts of curing agent, 30 parts of high-density filling component and the volume ratio of the high-density filling component to the resin matrix are weighed and kept 4:7, uniformly stirring the E glass fibers, pouring the E glass fibers into a mold, and curing at normal temperature.
(4) In order to prepare the glass fiber reinforced epoxy resin sound insulation board, a common flat plate die is adopted for molding; in order to prepare the fiber reinforced epoxy resin microperforated panel, the flat plate mold is uniformly provided with slender steel wires with diameters below 1 mm.
By adopting the preparation process, the thickness of the finally prepared and molded glass fiber reinforced epoxy resin sound insulation board is 3cm, the penetration rate of the glass fiber reinforced epoxy resin microperforated panel is 3%, the thickness is 3mm, the middle filling type resistive sound absorption layer is superfine glass fiber, and the density is 48kg/m 3 . The micro-scaleThe sound absorption wedge composed of the perforated plate and the superfine glass fiber has the length ratio of 1:5, the length of the split is 6cm.
Meanwhile, a local resonance type acoustic ultra-structure film is arranged at the top of the sound absorption wedge and consists of a polyimide film and a mass block. Wherein the mass block is a cylindrical iron block, the radius is 10mm, and the thickness is 3mm; the thickness of the polyimide film is 0.5mm, and the prestress is 8MPa.
Example 3
As shown in fig. 1, the composite sound absorption and insulation board for the transformer adopts an inner absorption and outer insulation acoustic structure, and consists of a glass fiber reinforced epoxy resin sound insulation board 4, a middle filling type resistive sound absorption layer 3, a sound absorption wedge 2 and a local resonance type acoustic ultra-structural film; the middle filling type anti-sound-absorbing layer 3 is paved above the glass fiber reinforced epoxy resin sound-insulating plate 4, the sound-absorbing wedges 2 are uniformly paved on the upper surface of the middle filling type anti-sound-absorbing layer 3, the outer parts of the sound-absorbing wedges 2 are glass fiber reinforced epoxy resin micropunching plates 1, the inner parts of the sound-absorbing wedges are filled type anti-sound-absorbing layers, and a local resonance type acoustic ultra-structural film is supported at the upper ends of the sound-absorbing wedges 2. The lower part of the sound absorption wedge 2 is open, the filled type sound absorption layer inside and the filled type sound absorption layer 3 in the middle are made of the same material, the sound absorption wedge 2 can be integrally formed, the two sides of the sound absorption wedge 2 are also provided with a protective surface baffle 7, and the sound absorption wedge is connected with the glass fiber reinforced epoxy resin sound insulation plate 4 through screws.
The glass fiber reinforced epoxy resin sound insulation board consists of a resin matrix and high-strength glass fibers, wherein the resin matrix is prepared from the following components in parts by weight:
70 parts of bisphenol A type epoxy resin
Diluent 26 parts
Curing agent 20 parts
3 parts of coupling agent
25 parts of high-density filling component
The diluent in the formula is butyl glycidyl ether, the curing agent is 701# curing agent, the accelerator is 2,4, 6-tri (dimethylaminomethyl) phenol, and the coupling agent is A151. The high-density filler is mica powder.
The high-strength glass fiber is E-type glass fiber, and the volume ratio of the glass fiber to the resin matrix is 3:7. the preparation method of the glass fiber reinforced epoxy resin comprises the following steps:
(1) 3 parts of coupling agent and 50ml of aqueous solution are weighed and mixed well, 25 parts of high density filler component are added at 50 ℃ and stirred continuously for 40min, then rinsed with absolute ethanol and left to stand.
(2) 70 parts of bisphenol A epoxy resin, 26 parts of diluent and 5 parts of accelerator are weighed, stirred uniformly and kept stand for 10min.
(3) Weighing 20 parts of curing agent, 25 parts of high-density filling component and keeping the volume ratio of the high-density filling component to the resin matrix to be 3:7, uniformly stirring the E glass fibers, pouring the E glass fibers into a mold, and curing at normal temperature.
(4) In order to prepare the glass fiber reinforced epoxy resin sound insulation board, a common flat plate die is adopted for molding; in order to prepare the fiber reinforced epoxy resin microperforated panel, the flat plate mold is uniformly provided with slender steel wires with diameters below 1 mm.
By adopting the preparation process, the thickness of the finally prepared and molded glass fiber reinforced epoxy resin sound insulation board is 2.5cm, the penetration rate of the glass fiber reinforced epoxy resin microperforated panel is 2%, the thickness is 2mm, the middle filling type resistive sound absorption layer is superfine glass fiber, and the density is 36kg/m 3 . The sound absorption wedge composed of the microperforated plate and the superfine glass fiber has the length ratio of 1:4, the length of the split part is 5cm.
Meanwhile, a local resonance type acoustic ultra-structure film is arranged at the top of the sound absorption wedge and consists of a polyimide film and a mass block. Wherein the mass block is a cylindrical iron block, the radius is 8mm, and the thickness is 2mm; the thickness of the polyimide film is 0.3mm, and the prestress is 5MPa.
The composite sound absorbing boards in examples 1-3 are subjected to sound insulation measurement part 3 according to the national standard GB/T19889.3-2005 Acoustic building and construction Components: the sound insulation performance test is carried out in laboratory measurement of air sound insulation of the building component, and the results are shown in tables 1-4.
Table 1 data on sound insulation performance of the composite sound absorbing and insulating member of example 1
Table 2 data on sound insulation performance of the composite sound absorbing and insulating member of example 2
Table 3 data on sound insulation performance of the composite sound absorbing and insulating member of example 3
In addition to the above embodiments, other embodiments of the present invention are possible, and all technical solutions adopting equivalent substitution or equivalent transformation form fall within the scope of protection claimed by the present invention.
Claims (2)
1. The composite sound absorption and insulation board for the transformer is characterized in that the composite sound absorption and insulation board adopts an inner sound absorption and insulation acoustic structure and consists of a glass fiber reinforced epoxy resin sound insulation board, a middle filling type resistive sound absorption layer, a sound absorption wedge and a local resonance type acoustic super-structure film; the middle filling type anti-sound-absorbing layer is paved above the glass fiber reinforced epoxy resin sound-insulating plate, the sound-absorbing wedges are uniformly paved on the upper surface of the middle filling type anti-sound-absorbing layer, the outer parts of the sound-absorbing wedges are glass fiber reinforced epoxy resin micropunching plates, the inner parts of the sound-absorbing wedges are filled type anti-sound-absorbing layers, and the upper ends of the sound-absorbing wedges are supported with local resonance type acoustic ultra-structure films;
the glass fiber reinforced epoxy resin sound insulation board consists of a resin matrix and high-strength glass fibers, wherein the thickness of the glass fiber reinforced epoxy resin sound insulation board is 1cm-3cm, and the resin matrix is prepared from the following components in parts by weight:
60-80 parts of bisphenol A type epoxy resin
20-30 parts of diluent
15-30 parts of curing agent
2-10 parts of promoter
1-5 parts of coupling agent
10-30 parts of high-density filler;
the diluent is ethylene glycol diglycidyl ether, 1, 4-butanediol diglycidyl ether or butyl glycidyl ether, the curing agent is one or more of methyl tetrahydrophthalic anhydride, cardanol modified phenolic amine, 593# curing agent and 701# curing agent, the accelerator is one or more of phthalic anhydride, tetrahydrophthalic anhydride, 2,4, 6-tris (dimethylaminomethyl) phenol, the coupling agent is isopropyl tris (dioctyl pyrophosphoric acid acyloxy) titanate, A171 or A151, and the high-density filler in the resin matrix is quartz sand, glass beads or mica powder;
the high-strength glass fiber is E-type glass fiber, and the volume ratio of the high-strength glass fiber to the resin matrix is 1:7~4:7, preparing a base material;
the penetration rate of the glass fiber reinforced epoxy resin microperforated panel is 1% -3%, and the thickness is 1-3mm;
the length ratio of the base part to the splitting part of the sound absorption wedge is 1: 3-1: 5, the length of the split part is 3cm-6cm;
the middle filling type resistive sound absorption layer and the filling type resistive sound absorption layer are superfine glass fibers, and the density is 24-48kg/m 3 ；
The local resonance type acoustic ultra-structure film is positioned at the top of the sound absorption wedge and consists of a polyimide film and a mass block, wherein the mass block is positioned at the upper part of the polyimide film and is positioned in the middle of a gap formed by adjacent sound absorption wedges;
the mass block is a cylindrical iron block, the radius is 5mm-10mm, and the thickness is 1-3mm;
the thickness of the polyimide film is 0.1-0.5mm, and the prestress is 4-8MPa.
2. The composite sound absorbing and insulating board for a transformer according to claim 1, wherein the preparation method of the glass fiber reinforced epoxy resin sound insulating board and the glass fiber reinforced epoxy resin microperforated panel comprises the following steps:
(1) Weighing 1-5 parts of coupling agent and 50ml of aqueous solution, uniformly mixing, adding 10-30 parts of high-density filler at 40-50 ℃ and continuously stirring for 40-50min, then washing with absolute ethyl alcohol and standing;
(2) Weighing 60-80 parts of bisphenol A epoxy resin, 20-30 parts of diluent and 2-10 parts of accelerator, uniformly stirring, and standing for 10min;
(3) Weighing 15-30 parts of curing agent and keeping the volume ratio of the curing agent to the resin matrix to be 1:7~4:7, uniformly stirring the E glass fibers, pouring the E glass fibers into a mold, and curing at normal temperature;
(4) In order to prepare the glass fiber reinforced epoxy resin sound insulation board, a common flat plate die is adopted for molding; in order to prepare the glass fiber reinforced epoxy resin microperforated panel, the flat plate die is uniformly provided with slender steel wires with diameters below 1 mm.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0585772A1 (en) * | 1992-08-27 | 1994-03-09 | ABBPATENT GmbH | Reduction of noise emission of transformers |
| CN111477440A (en) * | 2020-04-08 | 2020-07-31 | 国网河北省电力有限公司沧州供电分公司 | High-efficient compound sound insulation board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2768107B2 (en) * | 1992-02-06 | 1998-06-25 | 日本電気株式会社 | Bolted Langevin vibrator with acoustic matching plate |
| CN103996395A (en) * | 2014-05-29 | 2014-08-20 | 西安交通大学 | Elastic membrane-type low-frequency sound insulation metamaterial structure |
| CN105155704B (en) * | 2015-06-19 | 2018-05-29 | 江苏英思达科技有限公司 | A kind of double-level-metal wedge and preparation method thereof |
| CN108487487A (en) * | 2018-04-12 | 2018-09-04 | 天津航天瑞莱科技有限公司 | A kind of compound wedge absorber |
| CN211628690U (en) * | 2020-01-16 | 2020-10-02 | 广西科技大学鹿山学院 | Composite resonance sound absorption structure |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0585772A1 (en) * | 1992-08-27 | 1994-03-09 | ABBPATENT GmbH | Reduction of noise emission of transformers |
| CN111477440A (en) * | 2020-04-08 | 2020-07-31 | 国网河北省电力有限公司沧州供电分公司 | High-efficient compound sound insulation board |
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