CN103881307A - Ultralow-density composite material and resin combination prepreg as well as preparation method and applications thereof - Google Patents
Ultralow-density composite material and resin combination prepreg as well as preparation method and applications thereof Download PDFInfo
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Abstract
The invention relates to an ultralow-density composite material and resin combination prepreg as well as a preparation method and applications thereof. The liquid-state ultralow-density composite material and resin combination prepreg is characterized by comprising the following active ingredients in percentage by weight: 5%-30% of epoxy resin, 5%-20% of phenoxy resin, 5%-20% of leveling agent, 0.3%-5% of phenolic resin, 0.5%-5% of amine curing agent, 0.02%-0.2% of accelerant, 5%-40% of porous silicon dioxide, 30%-70% of hollow microbeads, 0.2%-1% of amino-terminated coupling agent and 0.5%-1% of ethanol, wherein the hollow microbeads are hollow glass microbeads or hollow ceramic microbeads. The applications are characterized in that after being soaked with a reinforcement material, the liquid-state ultralow-density resin combination prepreg is dried and prepared into semi-cured-state bonding sheet. The liquid-state ultralow-density composite material and resin combination prepreg has high strength and high impact performances, the density of the composite material is 0.75g/cm<3> and even lower, and has ultralow density, high specific strength, high smoothness, high reliability and excellent chemical resistance.
Description
Technical field
The present invention relates to a kind of extremely-low density matrix material, resin combination prepreg and its production and use.Be applicable to prepare bonding sheet and extremely-low density high specific strength laminar composite as resin combination prepreg and with it.Belong to reinforced composite technical field.
Background technology
Matrix material is as a kind of type material, has the advantages such as good insulativity, endurance, reliability, quality are light, high specific strength due to it, is more and more applied in industry-by-industry.But along with social fast development and the shortage of various resources, the mankind are to environmental problem growing interest, also more and more higher to the requirement of energy-conserving and environment-protective.Matrix material also becomes inexorable trend to lightweight development.
Lighting matrix material has been widely used in the fields such as consumption electronic products, deep sea diving device, aerospace, building and automobile.But the composite density of prior art is relatively high, generally exceed 1.5g/cm
3.In order to reduce the density of matrix material, people had carried out some researchs and report to light composite material low density in recent years.For example:
As the Chinese patent bulletin of application number 201210077459.2, disclose a kind of density and be less than light-high-strength matrix material that contains hollow glass micro-ball of water and preparation method thereof, belong to strongthener technical field, it is characterized in that adopting at least one deck prepreg lamination thermofixation to form, or at least one deck cloth film solidifies and forms through laminated heat, or solidify and form through laminated heat by one deck prepreg at least and one deck cloth film at least: described prepreg makes through baking after by the first strongthener dipping mixed solution, wherein, described mixed solution is closed and is made into very much by weight by following material: 100 parts of epoxy resin, toughner 0-15 part, solvent 30-70 part, solidifying agent 2.5-35 part, promotor 0.01-0.3 part, coupling agent 0.5-3 part, tensio-active agent 0.05-0.15 part, hollow glass micro-ball 20-60 part.The laminar composite density Schwellenwert of this invention only reaches 0.91g/cm
3, the least density of matrix material is still higher, is not suitable for extremely-low density matrix material and uses.
As the Chinese patent bulletin of application number 201310230879.4, a kind of laminating material and preparation method thereof is disclosed, described laminating material solidifies and makes through laminated heat after flooding mixed glue solution by strongthener, described mixed glue solution comprises: be greater than zero and be less than or equal to the hollow glass micro-ball of 100 weight parts, be greater than zero and be less than or equal to the coupling agent of 5 weight parts, be greater than zero and be less than or equal to the tensio-active agent of 0.5 weight part, the epoxy resin of 125 weight parts, the solidifying agent of 2.5-30 weight part, the solvent of the promotor of 0.03-0.5 weight part and 35-150 weight part.The present invention passes through to add hollow glass micro-ball, and matches with other components, makes laminating material quality gently and has suitable intensity.But the density Schwellenwert of this laminar composite only reaches 0.94g/cm
3, the least density of matrix material is still higher, is not suitable for extremely-low density matrix material and uses.
Summary of the invention
One of object of the present invention, is that the least density of the matrix material in order to solve prior art is still higher, is not suitable for the problem that extremely-low density matrix material uses, and a kind of extremely-low density matrix material is provided.Laminar composite prepared by this extremely-low density matrix material is in guaranteeing the performances such as insulativity, endurance, reliability, high specific strength, and the creationary density by laminar composite is reduced to 0.75g/cm
3, there is lighter quality and the better effect of energy-conserving and environment-protective.
Two of object of the present invention is resin combination prepregs for a kind of extremely-low density matrix material is provided and preparation method thereof.
Three of object of the present invention is purposes of the resin combination prepreg for a kind of extremely-low density matrix material is provided.
One of to achieve these goals, the present invention can adopt following technical scheme:
Extremely-low density matrix material, it is characterized in that: be a kind of resin combination of being made by epoxy resin, phenoxy resin, flow agent, solidifying agent, promotor, how empty silicon-dioxide, cenosphere, end amino coupling agent, ethanol, each material composition percentage composition meter by weight in prescription, epoxy resin 5%-30%, phenoxy resin 5%-20%, flow agent 5%-20%, resol 0.3%-5%, amine curing agent 0.5%-5%, promotor 0.02%-0.2%, porous silica 5%-40%, cenosphere 30%-70%, end amino coupling agent 0.2%-1%, ethanol 0.5%-1%; Described cenosphere is hollow glass micropearl or hollow ceramic microspheres.
One of to achieve these goals, the present invention can also adopt following technical scheme:
Preferably, each material composition is percentage composition meter by weight, epoxy resin 5%-25%, phenoxy resin 5%-15%, flow agent 5%-20%, resol 0.3%-4%, amine curing agent 1%-5%, promotor 0.02%-0.2%, porous silica 5%-30%, cenosphere 40%-70%, end amino coupling agent 0.2%-1%, ethanol 0.5%-1%.
Preferably, each material composition is percentage composition meter by weight, epoxy resin 5%-20%, phenoxy resin 5%-10%, flow agent 10%-20%, resol 0.3%-2%, amine curing agent 0.5%-5%, promotor 0.02%-0.2%, porous silica 5%-20%, cenosphere 45%-70%, end amino coupling agent 0.2%-0.7%, ethanol 0.5%-1%.
Preferably, described epoxy resin is one or two or more kinds combination in bisphenol A-type novolac epoxy, novolac epoxy, o-cresol epoxy resin, phosphorous epoxy resin or DCPD-containing epoxy resin.
Preferably, described phenoxy resin is bisphenol A-type phenoxy resin, Bisphenol F type phenoxy resin or nitrogenous phenoxy resin bisphenol A type epoxy resin, and the epoxy equivalent (weight) of phenoxy resin is between 5000-20000.
Preferably, the preferred epoxy terminated flow agent of described flow agent.
Preferably, described resol is the mixture of any one or at least two kinds in phenol resol, bisphenol A-type resol, Nitrogen-containing Phenolic Resins or phosphorus containing phenolic resin.The preferred Nitrogen-containing Phenolic Resins of described mixture and phosphorus containing phenolic resin, Nitrogen-containing Phenolic Resins and phosphorus containing phenolic resin, with phenolic aldehyde skeleton structure, can significantly improve the thermal characteristics of cured product.Meanwhile, the nitrogen of Nitrogen-containing Phenolic Resins and phosphorus containing phenolic resin and phosphorus have cooperative flame retardant effect, better improve the flame retardant properties of matrix material.
Preferably, any one in the preferred Dyhard RU 100 of described amine curing agent, diaminodiphenylsulfone(DDS), diaminodiphenyl oxide, diaminodiphenylmethane or p-diaminodiphenyl or at least two kinds of mixtures.
Preferably, the preferred glyoxaline compound of described promotor, any one in further preferred glyoxal ethyline, 2-ethyl-4-methylimidazole, 2-phenylimidazole or 2-undecyl imidazole or at least two kinds of mixtures.
Preferably, the excellent scope of the particle diameter of described porous silica is preferably 5-30 micron.
Preferably, the particle diameter of described cenosphere is preferably 10-300 micron, and ultimate compression strength is preferably 550-10000PSI, and further particle diameter is preferably 10-150 micron, and ultimate compression strength is preferably 3000-5500PSI.
Preferably, the preferred double-end amino coupling agent of described end amino coupling agent.
Preferably, described ethanol is dehydrated alcohol.
As the preparation method of extremely-low density matrix material of the present invention, can prepare by the each component in composite formula described in known method proportioning, mixing, dispersed with stirring.
To achieve these goals two, the present invention can adopt following technical scheme:
The prepreg of foregoing extremely-low density composite, is characterized in that: be made up of resin combination and liquid organic solvent, by quality percentage composition, resin combination is 20%-50%, and organic solvent is 50%-80%; Resin combination is made up of epoxy resin, phenoxy resin, flow agent, solidifying agent, promotor, how empty silicon-dioxide, cenosphere, end amino coupling agent and ethanol, each material composition percentage composition meter by weight in resin combination prescription, epoxy resin 5%-30%, phenoxy resin 5%-20%, flow agent 5%-20%, resol 0.3%-5%, amine curing agent 0.5%-5%, promotor 0.02%-0.2%, porous silica 5%-40%, cenosphere 30%-70%, end amino coupling agent 0.2%-1%, ethanol 0.5%-1%; Described cenosphere is hollow glass micropearl or hollow ceramic microspheres.
The preparation method of the resin combination prepreg of extremely-low density matrix material, is characterized in that comprising the steps:
1) take in proportion end amino coupling agent and dehydrated alcohol, and add successively in proportion in ready liquid organic solvent, stir 30 minutes, make mixed solution;
2) take in proportion phenoxy resin, flow agent, and add successively in the mixed solution of step 1), stir 30 minutes, make the glue of certain viscosity;
3) take in proportion how empty silicon-dioxide, cenosphere, and add successively 2) glue in, high-speed stirring 100 minutes, makes lightweight solution;
4) take in proportion epoxy resin, resol, amine curing agent, promotor, add successively in the solution of step 3), high-speed stirring, is deployed into the resin liquid of solids content 50%-75%, makes liquid extremely-low density resin combination prepreg.
Further, described liquid organic solvent, as concrete example, is alcohols, comprises propyl carbinol or isopropylcarbinol; Or be ketone, comprise acetone, butanone, methyl ethyl ketone, pimelinketone; Or be nitrogen-containing solvent, comprise DMF, N,N-dimethylacetamide; Or be arene, comprise toluene, dimethylbenzene; Or be ethers, comprise ethylene glycol monomethyl ether, propylene glycol monomethyl ether; Or be ester class, comprise glycol methyl ether acetate, 1-Methoxy-2-propyl acetate; Above-mentioned solvent uses separately one, or is two kinds or two or more mixing use.
To achieve these goals three, the present invention can adopt following technical scheme:
A kind of purposes of extremely-low density matrix material, it is characterized in that: liquid extremely-low density resin combination prepreg is soaked to strongthener post-drying, make semi-cured state bonding sheet, the method of making semi-cured state bonding sheet is: with glasscloth, glass mat, carbon fiber cloth or aramid fiber are as strongthener, described strongthener is immersed in extremely-low density composite resin composition prepreg, and make increasing material immersion strongthener soak above-mentioned resin combination prepreg, then at 130-240 ℃ of temperature, toast, make the bonding sheet of semi-cured state.
To achieve these goals three, the present invention can also adopt following technical scheme:
Further, the content of prepared semicure bonding sheet is between 50%-90%.
Further, by the semicure bonding sheet of making as stated above, for the preparation of laminar composite, stacked by the number of setting by prepared semicure bonding sheet, release film is mixed on two sides, at temperature 150-220 ℃, and pressure 5-30Kg/cm
2condition under, through hot-forming be extremely-low density high specific strength laminar composite.This composite density is at 0.75g/cm
3even lower, and there is high specific strength, high planarization, high reliability and excellent endurance energy.
Compared with prior art, the present invention has following outstanding beneficial effect:
1, the present invention adopts epoxy resin to add phenoxy resin combination, makes matrix material have high strength and high impact property.
2, the present invention adopts epoxy terminated flow agent, on the one hand overcome high filler adding proportion band poor fluidity, affect planarization and the thickness evenness of laminar composite, epoxy terminated flow agent can participate in curing reaction simultaneously on the other hand, avoids the residual negative impact to laminar composite intensity of small molecules.
3, the present invention adopts the porous silica of different-grain diameter scope and cenosphere to be used in combination, and effectively increases the filling proportion of mineral filler, thereby reduces to greatest extent the density of matrix material, and composite density is at 0.75g/cm
3even lower.
4, the present invention adopts that phenolic curing agent and amine curing agent are collaborative to be solidified, and has improved the reaction kinetics of single curing agent, has reduced temperature of reaction, in guaranteeing composite property, reaches energy-saving effect.
5, the present invention adopts end amino coupling agent, makes porous silica, cenosphere and strongthener and interlaminar resin form good interface, promotes the intensity of matrix material.
6, technique of the present invention is simple, and cost is low, in adhesive sheet and field of compound material, has a extensive future.Prepared laminar composite has extremely-low density, high specific strength, high planarization, high reliability and excellent endurance energy.
Embodiment:
Specific embodiment 1:
The present embodiment comprises bonding sheet and the extremely-low density high specific strength laminar composite of preparing extremely-low density matrix material, semi-cured state.
1, prepare the preparation method of extremely-low density composite resin composition and resin combination prepreg as follows:
1) take the end amino coupling agent of 0.8 weight part and the dehydrated alcohol of 2 weight parts and add successively in butanone, toluene, propylene glycol monomethyl ether and the pimelinketone mixed solvent having mixed in the ratio of 3:3:2:2, mixed solvent is 129 weight parts, stir 30 minutes with the rotating speed of 500-1200 rev/min, make mixing solutions;
2) take the phenoxy resin of 16 weight parts, the flow agent of 40 weight parts, add successively in the mixed solution of step 1), stir 30 minutes with the rotating speed of 500-1200 rev/min, make the glue in certain year;
3) take the porous silica of 16 weight parts, the cenosphere of 136 weight parts, add successively step 2) mixed solution in, with the rotating speed of 500-1200 rev/min, high-speed stirring 2 hours, makes extremely-low density glue;
4) take the epoxy resin of 80 weight parts, resol, the amine curing agent of 8 weight parts and the promotor of 0.12 weight part of 1.6 weight parts adds in the mixed solution of step 3) successively, with the rotating speed high-speed stirring of 500-1200 rev/min 1 hour, be deployed into the resin liquid of solids content 70%, make extremely-low density resin combination presoak;
2, preparation semi-cured state bonding sheet
Flood after above-mentioned resin liquid with the glass mat of 4 MAT75 specifications, in 170 ℃ of baking ovens, toast, make the bonding sheet of semi-cured state;
3, prepare extremely-low density laminar composite
By above-mentioned 4 bonding sheets stack alignment, respectively join up and down and two-sidedly after 1 release film distinguish again superimposed upper mirror surface formwork, send into vacuum hotpressing machine, according to pressure 25Kg/cm2,180 ℃ of temperature, pressing 60 minutes, making thickness is the extremely-low density laminar composite of 1.6mm thickness.
Specific embodiment 2:
The present embodiment comprises bonding sheet and the extremely-low density high specific strength laminar composite of preparing extremely-low density matrix material, semi-cured state.
1, prepare the preparation method of extremely-low density composite resin composition and resin combination prepreg as follows:
1) take the end amino coupling agent of 0.9 weight part and the dehydrated alcohol of 2 weight parts and add successively in butanone, toluene, propylene glycol monomethyl ether and the pimelinketone mixed solvent having mixed in the ratio of 4:2:2:2, mixed solvent is 162 weight parts, stir 30 minutes with the rotating speed of 500-1200 rev/min, make mixing solutions;
2) take the phenoxy resin of 20 weight parts, the flow agent of 51 weight parts, add successively in the mixed solution of step 1), stir 30 minutes with the rotating speed of 500-1200 rev/min, make the glue in certain year;
3) take the porous silica of 18 weight parts, the cenosphere of 149 weight parts, add successively step 2) mixed solution in, with the rotating speed of 500-1200 rev/min, high-speed stirring 2 hours, makes extremely-low density glue;
4) take the epoxy resin of 51 weight parts, resol, the amine curing agent of 7.6 weight parts and the promotor of 0.09 weight part of 1.5 weight parts adds in the mixed solution of step 3) successively, with the rotating speed high-speed stirring of 500-1200 rev/min 1 hour, be deployed into the resin liquid of solids content 60%, make extremely-low density resin combination presoak;
2, preparation semi-cured state bonding sheet
Flood after above-mentioned resin liquid with the E-glasscloth of 6 2113 specifications, in 170 ℃ of baking ovens, toast, make the bonding sheet of semi-cured state;
3, prepare extremely-low density laminar composite
By above-mentioned 6 bonding sheets stack alignment, respectively join up and down and two-sidedly after 1 release film distinguish again superimposed upper mirror surface formwork, send into vacuum hotpressing machine, according to pressure 30Kg/cm2,180 ℃ of temperature, pressing 60 minutes, making thickness is the extremely-low density laminar composite of 1.6mm thickness.
Specific embodiment 3:
The present embodiment comprises bonding sheet and the extremely-low density high specific strength laminar composite of preparing extremely-low density matrix material, semi-cured state.
1, prepare the preparation method of extremely-low density composite resin composition and resin combination prepreg as follows:
1) take the end amino coupling agent of 1 weight part and the dehydrated alcohol of 2.2 weight parts and add successively in butanone, toluene, propylene glycol monomethyl ether and the pimelinketone mixed solvent having mixed in the ratio of 4:2:2:2, mixed solvent is 184 weight parts, stir 30 minutes with the rotating speed of 500-1200 rev/min, make mixing solutions;
2) take the phenoxy resin of 25 weight parts, the flow agent of 53 weight parts, add successively in the mixed solution of step 1), stir 30 minutes with the rotating speed of 500-1200 rev/min, make the glue in certain year;
3) take the porous silica of 26 weight parts, the cenosphere of 154 weight parts, add successively step 2) mixed solution in, with the rotating speed of 500-1200 rev/min, high-speed stirring 2 hours, makes extremely-low density glue;
4) take the epoxy resin of 32 weight parts, resol, the amine curing agent of 6.7 weight parts and the promotor of 0.09 weight part of 1.4 weight parts adds in the mixed solution of step 3) successively, with the rotating speed high-speed stirring of 500-1200 rev/min 1 hour, be deployed into the resin liquid of solids content 62%, make extremely-low density resin combination presoak;
2, preparation semi-cured state bonding sheet
Flood after above-mentioned resin liquid with the E-glasscloth of 8 1080 specifications, in 170 ℃ of baking ovens, toast, make the bonding sheet of semi-cured state;
3, prepare extremely-low density laminar composite
By above-mentioned 8 bonding sheets stack alignment, respectively join up and down and two-sidedly after 1 release film distinguish again superimposed upper mirror surface formwork, send into vacuum hotpressing machine, according to pressure 25Kg/cm2,180 ℃ of temperature, pressing 60 minutes, making thickness is the extremely-low density laminar composite of 1.6mm thickness.
In sum, the present invention adopts epoxy resin to add phenoxy resin, guarantees the high specific strength of laminar composite.Plate face planarization when the present invention adopts flow agent to improve high filling mineral filler.The present invention adopts resol and amine curing agent co-curing, has improved the reaction kinetics of single curing agent, has reduced temperature of reaction, in guaranteeing composite property, reaches energy-saving effect.
The liquid extremely-low density composite resin composition that above-described embodiment 1-embodiment 3 relates to, wherein epoxy resin, phenoxy resin, flow agent, porous silica, cenosphere, resol, amine curing agent, promotor, end amino coupling agent and ethanol, can make extremely-low density composite resin composition, add a certain proportion of mixed organic solvents, can make the extremely-low density resin combination prepreg of different solids content.
Certainly, in composite resin composition, the mass percent of each material component is respectively: epoxy resin 5%-30%, phenoxy resin 3%-20%, flow agent 5%-20%, porous silica 5%-40%, cenosphere 30%-70%, resol 0.3%-5%, amine curing agent 0.5%-5%, promotor 0.02%-0.2%, end amino coupling agent 0.1%-1%, ethanol 0.5%-1%, as long as be configured to according to the above ratio the liquid or solid-state extremely-low density Halogen composite resin composition of any weight, be suitable for equally the preparation method outside specific embodiment, belong to the protection domain of this patent.
Comparative example:
1. take the silicon-dioxide of 225 weight part brominated epoxy resins, 75 weight parts, the dicy-curing agent of 6.4 weight parts, two-Methylimidazole of 0.16 weight part, add successively in the butanone and solvent dimethylformamide having mixed in 1:4 ratio, mixed solvent is 160 weight parts, high-speed stirring 60 minutes, is deployed into the resin liquid of solids content 65%;
2, flood after above-mentioned resin liquid with the glass mat of 4 MAT75 specifications, in 170 ℃ of baking ovens, toast, make the bonding sheet of semi-cured state;
3. by above-mentioned 4 bonding sheets stack alignment, respectively join up and down and two-sidedly after 1 release film distinguish again superimposed upper mirror surface formwork, send into vacuum hotpressing machine, according to pressure 25Kg/cm2,180 ℃ of temperature, pressing 60 minutes, makes the matrix material that thickness is 1.6mm thickness.
Result:
To adopt the comparative example of common brominated epoxy resin and the low density halogen-free flame-retardance high strength composite that embodiment 1,2,3 prepares to compare, result is as table 1:
| Index | Embodiment 1 | Embodiment 2 | Embodiment 3 | Comparative example |
| Density g/cm3 | 0.73 | 0.74 | 0.71 | 2.0 |
| Flexural strength | 254 | 298 | 306 | 470 |
| Specific tenacity | 0.348 | 0.403 | 0.431 | 0.235 |
| Flame resistivity | V-0 | V-0 | V-0 | V-0 |
| Heat decomposition temperature Td(℃) | ＞350 | ＞350 | ＞350 | 310 |
As can be seen from Table 1, the common epoxy material of density ratio of the prepared extremely-low density laminar composite of several embodiments of the present invention is low more than 60%, and specific tenacity also has greatly improved.The extremely-low density that the present invention proposes, the invention thought of high specific strength are fully demonstrated.This laminar composite has outstanding representation aspect flame retardant resistance and thermal reliability simultaneously.
Claims (10)
1. extremely-low density matrix material, it is characterized in that: be a kind of resin combination of being made by epoxy resin, phenoxy resin, flow agent, solidifying agent, promotor, how empty silicon-dioxide, cenosphere, end amino coupling agent, ethanol, each material composition percentage composition meter by weight in prescription, epoxy resin 5%-30%, phenoxy resin 5%-20%, flow agent 5%-20%, resol 0.3%-5%, amine curing agent 0.5%-5%, promotor 0.02%-0.2%, porous silica 5%-40%, cenosphere 30%-70%, end amino coupling agent 0.2%-1%, ethanol 0.5%-1%; Described cenosphere is hollow glass micropearl or hollow ceramic microspheres.
2. extremely-low density matrix material as claimed in claim 1, it is characterized in that: each material composition is percentage composition meter by weight epoxy resin 5%-25%, phenoxy resin 5%-15%, flow agent 5%-20%, resol 0.3%-4%, amine curing agent 1%-5%, promotor 0.02%-0.2%, porous silica 5%-30%, cenosphere 40%-70%, end amino coupling agent 0.2%-1%, ethanol 0.5%-1%; Or each material composition is percentage composition meter by weight, epoxy resin 5%-20%, phenoxy resin 5%-10%, flow agent 10%-20%, resol 0.3%-2%, amine curing agent 0.5%-5%, promotor 0.02%-0.2%, porous silica 5%-20%, cenosphere 45%-70%, end amino coupling agent 0.2%-0.7%, ethanol 0.5%-1%.
3. extremely-low density matrix material as claimed in claim 1 or 2, is characterized in that: described epoxy resin is one or two or more kinds combination in bisphenol A-type novolac epoxy, novolac epoxy, o-cresol epoxy resin, phosphorous epoxy resin or DCPD-containing epoxy resin; Described phenoxy resin is bisphenol A-type phenoxy resin, Bisphenol F type phenoxy resin or nitrogenous phenoxy resin bisphenol A type epoxy resin, and the epoxy equivalent (weight) of phenoxy resin is between 5000-20000.
4. extremely-low density matrix material as claimed in claim 1 or 2, is characterized in that: the preferred epoxy terminated flow agent of described flow agent; Any one in the preferred Dyhard RU 100 of described amine curing agent, diaminodiphenylsulfone(DDS), diaminodiphenyl oxide, diaminodiphenylmethane or p-diaminodiphenyl or two or more mixture; The preferred glyoxaline compound of described promotor, any one in further preferred glyoxal ethyline, 2-ethyl-4-methylimidazole, 2-phenylimidazole or 2-undecyl imidazole or two or more mixture; Described resol is the mixture of any one or at least two kinds in phenol resol, bisphenol A-type resol, Nitrogen-containing Phenolic Resins or phosphorus containing phenolic resin; Described end amino coupling agent is double-end amino coupling agent; Described ethanol is dehydrated alcohol.
5. extremely-low density matrix material as claimed in claim 1 or 2, is characterized in that: the excellent scope of particle diameter of described porous silica is preferably 5-30 micron; The particle diameter of described cenosphere is preferably 10-300 micron, and ultimate compression strength is preferably 550-10000PSI, and further particle diameter is preferably 10-150 micron, and ultimate compression strength is preferably 3000-5500PSI.
6. the resin combination prepreg of extremely-low density matrix material as claimed in claim 1, is characterized in that: be made up of resin combination and liquid organic solvent, by quality percentage composition, resin combination is 20%-50%, and organic solvent is 50%-80%; Resin combination is made up of epoxy resin, phenoxy resin, flow agent, solidifying agent, promotor, how empty silicon-dioxide, cenosphere, end amino coupling agent and ethanol, each material composition percentage composition meter by weight in resin combination prescription, epoxy resin 5%-30%, phenoxy resin 5%-20%, flow agent 5%-20%, resol 0.3%-5%, amine curing agent 0.5%-5%, promotor 0.02%-0.2%, porous silica 5%-40%, cenosphere 30%-70%, end amino coupling agent 0.2%-1%, ethanol 0.5%-1%.
7. the preparation method of the resin combination prepreg of extremely-low density matrix material as claimed in claim 6, is characterized in that comprising the steps:
1) take in proportion end amino coupling agent and dehydrated alcohol, and add successively in proportion in ready liquid organic solvent, stir 30 minutes, make mixed solution;
2) take in proportion phenoxy resin, flow agent, and add successively in the mixed solution of step 1), stir 30 minutes, make the glue of certain viscosity;
3) take in proportion how empty silicon-dioxide, cenosphere, and add successively 2) glue in, high-speed stirring 100 minutes, makes lightweight solution;
4) take in proportion epoxy resin, resol, amine curing agent, promotor, add successively in the solution of step 3), high-speed stirring, is deployed into the resin liquid of solids content 50%-75%, makes liquid extremely-low density resin combination prepreg.
8. as the preparation method of the resin combination prepreg of the extremely-low density matrix material of claim 7.It is characterized in that: described liquid organic solvent is alcohols, comprises propyl carbinol or isopropylcarbinol; Or be ketone, comprise acetone, butanone, methyl ethyl ketone, pimelinketone; Or be nitrogen-containing solvent, comprise DMF, N,N-dimethylacetamide; Or be arene, comprise toluene, dimethylbenzene; Or be ethers, comprise ethylene glycol monomethyl ether, propylene glycol monomethyl ether; Or be ester class, comprise glycol methyl ether acetate, 1-Methoxy-2-propyl acetate; Above-mentioned solvent uses separately one, or is two kinds or two or more mixing use.
9. the purposes of the resin combination prepreg of extremely-low density matrix material as claimed in claim 6, is characterized in that: liquid extremely-low density resin combination prepreg is soaked to strongthener post-drying, make semi-cured state bonding sheet; The preparation method of described semi-cured state bonding sheet is: use glasscloth, glass mat, carbon fiber cloth or aramid fiber as strongthener, described strongthener is immersed in extremely-low density composite resin composition prepreg, and make increasing material immersion strongthener soak above-mentioned resin combination prepreg, then at 130-240 ℃ of temperature, toast, make the bonding sheet of semi-cured state; The content of prepared semicure bonding sheet is between 50%-90%.
10. the purposes of the resin combination prepreg of extremely-low density matrix material as claimed in claim 9, it is characterized in that: by the semicure bonding sheet of making as stated above for the preparation of laminar composite, stacked by the number of setting by prepared semicure bonding sheet, release film is mixed on two sides, at temperature 150-220 ℃, pressure 5-30Kg/cm
2condition under, through hot-forming be extremely-low density high specific strength laminar composite.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104616805A (en) * | 2014-12-31 | 2015-05-13 | 东莞市高能磁电技术有限公司 | Halogen-free and flame-proof insulating power cable employing low-density high-strength composite material |
| CN106633655A (en) * | 2016-12-20 | 2017-05-10 | 浙江华正新材料股份有限公司 | Thermosetting resin ultralow-density laminating material and preparation method thereof |
| CN106957446A (en) * | 2017-05-12 | 2017-07-18 | 威海光威复合材料股份有限公司 | The method that nano ceramics powder modified phenolic resins prepare high rigidity composite |
| CN114230768A (en) * | 2021-12-10 | 2022-03-25 | 中科威禾科技(肇庆)有限公司 | Glue solution for quickly-cured light molded plate, light molded plate and preparation method of light molded plate |
| CN114714679A (en) * | 2022-04-01 | 2022-07-08 | 四川东材科技集团股份有限公司 | Low-density fiber reinforced composite material product and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102924870A (en) * | 2012-11-28 | 2013-02-13 | 广东裕丰威禾电子科技股份有限公司 | Low-density halogen-free flame retardant type high-strength composite material as well as preparation method and use thereof |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102924870A (en) * | 2012-11-28 | 2013-02-13 | 广东裕丰威禾电子科技股份有限公司 | Low-density halogen-free flame retardant type high-strength composite material as well as preparation method and use thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104616805A (en) * | 2014-12-31 | 2015-05-13 | 东莞市高能磁电技术有限公司 | Halogen-free and flame-proof insulating power cable employing low-density high-strength composite material |
| CN106633655A (en) * | 2016-12-20 | 2017-05-10 | 浙江华正新材料股份有限公司 | Thermosetting resin ultralow-density laminating material and preparation method thereof |
| CN106633655B (en) * | 2016-12-20 | 2019-10-29 | 浙江华正新材料股份有限公司 | A kind of thermosetting resin extremely-low density laminated material and preparation method thereof |
| CN106957446A (en) * | 2017-05-12 | 2017-07-18 | 威海光威复合材料股份有限公司 | The method that nano ceramics powder modified phenolic resins prepare high rigidity composite |
| CN114230768A (en) * | 2021-12-10 | 2022-03-25 | 中科威禾科技(肇庆)有限公司 | Glue solution for quickly-cured light molded plate, light molded plate and preparation method of light molded plate |
| CN114714679A (en) * | 2022-04-01 | 2022-07-08 | 四川东材科技集团股份有限公司 | Low-density fiber reinforced composite material product and preparation method thereof |
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