CN106626631A - Aramid fiber felt laminated board and preparation method thereof - Google Patents
Aramid fiber felt laminated board and preparation method thereof Download PDFInfo
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- CN106626631A CN106626631A CN201610826389.4A CN201610826389A CN106626631A CN 106626631 A CN106626631 A CN 106626631A CN 201610826389 A CN201610826389 A CN 201610826389A CN 106626631 A CN106626631 A CN 106626631A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/20—All layers being fibrous or filamentary
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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Abstract
The invention discloses an aramid fiber felt laminated board and a preparation method thereof. The aramid fiber felt laminated board is characterized in that the laminated board is a composite material formed by hot briquetting of one or more layers of overlapped high-strength tracking resistance resin aramid fiber felt prepreg, and the electric leakage resistance mark index is larger than or equal to 600V. The prepreg is formed by dipping or spraying a high-strength tracking resistance resin adhesive on the aramid fiber felt and then baking the high-strength tracking resistance resin adhesive, and the prepreg is the aramid fiber felt impregnated material with the resin prepreg formed on the aramid fiber felt; the high-strength tracking resistance resin adhesive is prepared from the following components in parts by weight: 20-55 parts of high-temperature-resistant epoxy resin, 25-60 parts of modified phenolic resin, 3-35 parts of a curing agent, 5-35 parts of inorganic powder, 0.01-1 part of an accelerant and 125-170 parts of a solvent. The product disclosed by the invention is suitable for the technical fields of various engineering equipment of aviation, spaceflight, high-performance ships, bulletproof, stab-resistance and military industry, electrical equipment, corrosion-resistant appliances, new energy automobiles and the like.
Description
Technical field
The invention belongs to laminate and its preparation, are related to a kind of aramid fiber carpet veneer pressing plate and preparation method thereof, particularly
Be related to a kind of all kinds of engineering equipments of specific use (Aeronautics and Astronautics, high-performance ship, shellproof, anti-stab, military project), electric equipment,
The aramid fiber carpet veneer pressing plate in the field such as corrosion-resistant utensil and its new-energy automobile and preparation method thereof.
Background technology
Aramid fiber carpet veneer pressing plate is because of its isotropism, high mechanical strength, high, wear-resistant strength modulus, low conductivity, resistance to
Electrical, the not uniqueness such as warpage, not stratified excellent properties are climbed, specific use (Aeronautics and Astronautics, high performance craft is can be widely applied to
Oceangoing ship, shellproof, anti-stab, military project) the field such as all kinds of engineering equipments, electric equipment, corrosion-resistant utensil and its new-energy automobile in, because
And to the demand of high-performance aramid fiber carpet veneer pressing plate, especially to making under high temperature, high humidity, high current, Extra High Strength environment
Aramid fiber carpet veneer pressing plate demand is also more and more urgent.In recent years, the research to aramid fiber gradually increases, but to aramid fiber
The correlative study of fiber mat product especially aramid fiber carpet veneer pressing plate is few.In aramid fiber felt fibre bundle it is fluffy it is unordered, that
This restraining force is poor, and all kinds of engineering equipments in specific use (Aeronautics and Astronautics, high-performance ship, shellproof, anti-stab, military project),
It is (outstanding in high voltage, high temperature to aramid fiber carpet veneer pressing plate in the fields such as electric equipment, corrosion-resistant utensil and its new-energy automobile
It is more than H levels and C levels), under the environment such as high humidity, do not require nothing more than normality (room temperature) and be issued to >=550MPa, specially require its high
Warm condition of work is issued to superelevation bending strength >=300MPa, while solving wanting for its anti creepage trace performance (PTI >=600V)
Ask.Prior art all fails to solve these technical problems.
The content of the invention
The purpose of the present invention is intended to overcome above-mentioned deficiency of the prior art, especially in above-mentioned prior art not yet
How the aramid fiber carpet veneer pressing plate of solution keeps Extra High Strength (to be often referred to bending under high temperature (180 DEG C, 200 DEG C and more than)
491～509MPa of intensity), while reach proof tracking index be 600V problem, there is provided a kind of aramid fiber carpet veneer pressing plate
And preparation method thereof, the present invention provides one kind can meet the field such as Aero-Space, high-performance ship, shellproof, anti-stab, military project virtue
Synthetic fibre fibre felt layer pressing plate, ensure mechanical electric performance on the premise of, realize product for a long time can high-temperature resistant, proof tracking index
Up to 600V.
Present disclosure is：A kind of aramid fiber carpet veneer pressing plate, is characterized in that：The aramid fiber carpet veneer pressing plate is one layer
Or the resistance to electric trace resin aramid fiber felt prepreg of high intensity that more than a layer (typically below 100 layers) overlaps is Jing after hot-forming
Obtained composite, and proof tracking index >=600V；
The resistance to electric trace resin aramid fiber felt prepreg of the high intensity be by the resistance to electric trace Resin adhesive dipping of high intensity or
It is sprayed on aramid fiber felt, the aramid fiber felt for having resin semi-solid preparation thing on aramid fiber felt of baked rear formation again soaks
Stain material；
The aramid fiber felt is aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber
One or more mixture in continuous felt and aramid fiber composite felt；
The resistance to electric trace Resin adhesive of the high intensity is by the weight portion of high-temperature-resistant epoxy resin 20～55, phenol-formaldehyde resin modified 25
～60 weight portions, the weight portion of curing agent 3～35, the weight portion of inorganic particle 5～35, the weight portion of accelerator 0.01～1 and solvent 125
～170 weight portions are constituted；
The high-temperature-resistant epoxy resin be bisphenol A type epoxy resin, bisphenol f type epoxy resin, polybutadiene epoxy resin,
Biphenyl type epoxy resin, phenol type novolac epoxy resin, orthoresol type novolac epoxy resin, bisphenol-A phenolic type epoxy resin,
It is benzenediol type epoxy resin, the epoxy resin of dicyclopentadiene or bicyclic alkenes and phenolic condensation resin, isocyanate-modified
Epoxy resin, glycolylurea epoxide resin, tricyanic epoxy resin and para-aminophenol epoxy resin in one or two
Mixture；
The phenol-formaldehyde resin modified is Effect of Organosilicon-modified Phenol-formaldehyde Resin, benzoxazine phenol-formaldehyde resin modified, boron modification phenolic aldehyde
One or two mixture in resin, dimethylbenzene phenol-formaldehyde resin modified and diphenyletherformalde-hyde resin；
The curing agent be 4,4- MDAs, 4,4- DADPSs, m-phenylene diamine (MPD), dicyandiamide, low point
One or two mixture in sub- polyamide and m-xylene diamine；
The inorganic particle is aluminium hydroxide, silica, titanium dioxide, montmorillonite, vermiculite, talcum powder, boron nitride, oxygen
Change magnesium and one or two the mixture in aluminum oxide；
The accelerator be 2-methylimidazole, 2-ethyl-4-methylimidazole, N, N- dimethyl benzylamines, boron trifluoride ethylamine,
One or two mixture in triethylamine, pregnancy urotropine and aluminium acetylacetonate；
The solvent is toluene, dimethylbenzene, dimethylformamide, dimethyl acetamide, glycol dimethyl ether, ethylene glycol ethyl ethers
Ether acetate, propylene glycol monomethyl ether, MEK, cyclohexanone, methyl acetate, butanone, acetone, N,N-dimethylformamide, Yi Jiyi
One or more mixture in alcohol.
In present disclosure：In the resistance to electric trace resin aramid fiber felt prepreg of the high intensity, resin semi-solid preparation thing
Weight percent is reasonable be 25%～65%, aramid fiber felt weight percent it is reasonable be 35%～75%.
In present disclosure：The preparation method of the resistance to electric trace Resin adhesive of the high intensity can be：Under room temperature, matching somebody with somebody
High-temperature-resistant epoxy resin, phenol-formaldehyde resin modified are added in glue tank, stirring 0.5 hour～2.5 is little at a temperature of 70 DEG C～130 DEG C
Shi Hou, adds inorganic particle, curing agent and solvent, stirs 0.17 hour～1 hour, adds the shaping that accelerator adjusts glue
Time, sampling tests the molding time of glue with the little skill in using a kitchen knife in cookery, is 360 seconds～512 under the conditions of 180 DEG C of hot plates, between when the molding
When between second, the resistance to electric trace Resin adhesive of high intensity is prepared and finished, that is, the resistance to electric trace Resin adhesive of high intensity is obtained.
The present invention another content be：A kind of preparation method of aramid fiber carpet veneer pressing plate, is characterized in that including following step
Suddenly：
A, the resistance to electric trace Resin adhesive of preparation high intensity：
(a) dispensing：By the weight portion of high-temperature-resistant epoxy resin 20～55, the weight portion of phenol-formaldehyde resin modified 25～60, curing agent 3
The weight of～35 weight portions, the weight portion of inorganic particle 5～35, the weight portion of accelerator 0.01～1 and the weight portion of solvent 125～170
Part composition takes each component raw material；
The high-temperature-resistant epoxy resin be bisphenol A type epoxy resin, bisphenol f type epoxy resin, polybutadiene epoxy resin,
Biphenyl type epoxy resin, phenol type novolac epoxy resin, orthoresol type novolac epoxy resin, bisphenol-A phenolic type epoxy resin,
It is benzenediol type epoxy resin, the epoxy resin of dicyclopentadiene or bicyclic alkenes and phenolic condensation resin, isocyanate-modified
Epoxy resin, glycolylurea epoxide resin, tricyanic epoxy resin and para-aminophenol epoxy resin in one or two
Mixture；
The phenol-formaldehyde resin modified is Effect of Organosilicon-modified Phenol-formaldehyde Resin, benzoxazine phenol-formaldehyde resin modified, boron modification phenolic aldehyde
One or two mixture in resin, dimethylbenzene phenol-formaldehyde resin modified and diphenyletherformalde-hyde resin；
The curing agent be 4,4- MDAs, 4,4- DADPSs, m-phenylene diamine (MPD), dicyandiamide, low point
One or two mixture in sub- polyamide and m-xylene diamine；
The inorganic particle is aluminium hydroxide, silica, titanium dioxide, montmorillonite, vermiculite, talcum powder, boron nitride, oxygen
Change magnesium and one or two the mixture in aluminum oxide；
The accelerator be 2-methylimidazole, 2-ethyl-4-methylimidazole, N, N- dimethyl benzylamines, boron trifluoride ethylamine,
One or two mixture in triethylamine, pregnancy urotropine and aluminium acetylacetonate；
The solvent is toluene, dimethylbenzene, dimethylformamide, dimethyl acetamide, glycol dimethyl ether, ethylene glycol ethyl ethers
Ether acetate, propylene glycol monomethyl ether, MEK, cyclohexanone, methyl acetate, butanone, acetone, N,N-dimethylformamide, Yi Jiyi
One or more mixture in alcohol；
Under (b) room temperature, high-temperature-resistant epoxy resin, phenol-formaldehyde resin modified are added in glue tank, in 70 DEG C～130 DEG C of temperature
After the lower stirring of degree 0.5 hour～2.5 hours, inorganic particle, curing agent and solvent are added, stirred 0.17 hour～1 hour, then added
Enter the molding time that accelerator adjusts glue, sampling tests the molding time of glue with the little skill in using a kitchen knife in cookery, under the conditions of 180 DEG C of hot plates,
When between when the molding between 360 seconds～512 seconds, the resistance to electric trace Resin adhesive of high intensity is prepared and finished, that is, high intensity is obtained
Resistance to electric trace Resin adhesive；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity：
Aramid fiber felt is impregnated or the resistance to electric trace Resin adhesive of high intensity described in spraying process a by horizontal gluing machine,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained the resistance to electric trace resin aramid fiber felt prepreg of high intensity in 4～18m/min；
The aramid fiber felt is aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber
One or more mixture in continuous felt and aramid fiber composite felt；
C, compacting aramid fiber carpet veneer pressing plate：
The resistance to electric trace resin aramid fiber felt prepreg of high intensity is taken, by aramid fiber carpet veneer sheeting process requirement institute is cut into
Need size, by the resistance to electric trace resin aramid fiber felt prepreg material of the high intensity it is one or more layers (typically 100 layers with
Under) overlap and be placed in two sides and scribble on the smooth stainless-steel sheet of releasing agent, send into common hot press or vacuum hotpressing machine, temperature
Control 130 DEG C～175 DEG C, Stress control it is hot-forming under conditions of 1MPa～30MPa, according to the thickness of laminate after shaping
Degree 1mm～150mm, determines the hot-forming time in the range of 0.5h～50h, that is, aramid fiber carpet veneer pressing plate is obtained.
In another content of the present invention：In the resistance to electric trace resin aramid fiber felt prepreg of step (b) the prepared high intensity,
It is 35%～75% that the percentage by weight of resin semi-solid preparation thing is the percentage by weight of 25%～65%, aramid fiber felt.
Compared with prior art, the present invention has following specific and beneficial effect：
(1) using the present invention, matrix resin and each raw material be can high temperature resistant products for a long time, realize can for a long time in
180 DEG C and 200 DEG C of temperature used above can strictly meet high mechanical properties requirement.Under normality bending strength be 705～
728MPa, and bending strength is that bending strength is 491～509MPa under 482～516MPa, C levels (such as 200 DEG C) at 180 DEG C, especially
It is that high temperature strength conservation rate is higher, bending strength conservation rate >=68% at 180 DEG C, bending strength conservation rate at 200 DEG C >=
69%.Solve bending strength conservation rate under can not meeting 180 DEG C and 200 DEG C of temperatures above because of aramid fiber felt self-strength difference
>=50% technical barrier；
(2) present invention is using resin and inorganic particle synergistic technology so as to the resin system at place, long-term resistance to reaching
On the basis of 180 DEG C and 200 DEG C of temperature used above, while meeting preferable electric property, especially refer in anti creepage trace
Number aspect, solves only by the technical barrier of the inaccessiable proof tracking index 600V of resin self performance, also drops significantly
The low production cost of product；
(3) aramid fiber carpet veneer sheeting process prepared by the present invention is simple, easily operation, and product quality is excellent, reduces
Cost, meets all kinds of engineering equipments of specific use (Aeronautics and Astronautics, high-performance ship, shellproof, anti-stab, military project), electrical equipment and sets
Demand in the field such as standby, corrosion-resistant utensil and its new-energy automobile to high-temperature-resistant structure composite, it has significant reality
Border use value and application prospect.
Specific embodiment
The invention will be further described to provide the following examples, but is not to be construed as to the scope of the present invention
Limit, some nonessential improvement and tune that person skilled in art makes according to the content of the invention described above to the present invention
It is whole, still fall within protection scope of the present invention.
The amount of each dispensing component materials is weight portion (for example in following examples：Be gram or kilogram).
The preparation of the resistance to electric trace Resin adhesive of Part I high intensity
Embodiment 1-1：
Under room temperature, in glue tank 45 parts of polybutadiene epoxy resin, benzoxazine phenol-formaldehyde resin modified 27 are separately added into
Part, 33 parts of inorganic particle aluminium nitride, after stirring 2.5 hours at a temperature of 120 DEG C, add curing agent 4,4- DADPSs 28
Part and 140 parts of dimethylformamide, stir 0.5 hour, be allowed to it is fully dispersed it is uniform after, add accelerator boron trifluoride ethylamine
The molding time of 0.1 part of adjustment glue, sampling tests the molding time (180 DEG C of hot plates) 360 seconds of glue, glue with the little skill in using a kitchen knife in cookery
Prepare and finish.
Embodiment 1-2：
Under room temperature, in glue tank 42 parts of biphenyl type epoxy resin, 35 parts of dimethylbenzene phenol-formaldehyde resin modified, nothing are separately added into
23 parts of machine powder silica, after stirring 0.5 hour at a temperature of 130 DEG C, adds curing agent 4,25 parts of 4- DADPSs
With 135 parts of dimethyl acetamide, stir 0.5 hour, be allowed to it is fully dispersed it is uniform after, add accelerator 2- ethyl -4- methyl miaows
The molding time of 0.5 part of azoles adjustment glue, sampling tests the molding time (180 DEG C of hot plates) 450 seconds of glue, glue with the little skill in using a kitchen knife in cookery
Liquid is prepared and finished.
Embodiment 1-3：
Under room temperature, be separately added in glue tank 31 parts of bisphenol f type epoxy resin, 55 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin,
28 parts of inorganic particle aluminum oxide, after stirring 1 hour at a temperature of 130 DEG C, adds 25 parts of curing agent Versamid and diformazan
130 parts of benzene, stirs 0.42 hour, be allowed to it is fully dispersed it is uniform after, add the 0.8 part of adjustment of accelerator 2-ethyl-4-methylimidazole
The molding time of glue, sampling tests the molding time (180 DEG C of hot plates) 510 seconds of glue with the little skill in using a kitchen knife in cookery, and glue has been prepared
Finish.
Embodiment 1-4：
Under room temperature, in glue tank 35 parts of orthoresol type novolac epoxy resin, Effect of Organosilicon-modified Phenol-formaldehyde Resin are separately added into
42 parts, 27 parts of inorganic particle aluminium hydroxide, after stirring 2.5 hours at a temperature of 70 DEG C, add curing agent 4,4- diaminourea hexichol
145 parts of 20 parts of methane and DMF, stir 0.42 hour, be allowed to it is fully dispersed it is uniform after, add accelerator six
The molding time of 0.35 part of adjustment glue of tetramine, sampling tests the molding time (180 DEG C of hot plates) of glue with the little skill in using a kitchen knife in cookery
493 seconds, glue was prepared and finished.
Embodiment 1-5：
Under room temperature, in glue tank 20 parts of phenol type novolac epoxy resin, 38 parts of diphenyletherformalde-hyde resin, nothing are separately added into
8 parts of machine powder aluminum oxide, after stirring 2.5 hours at a temperature of 90 DEG C, adds 135 parts of 10 parts of curing agent m-phenylene diamine (MPD) and ethanol,
Stirring 0.5 hour, be allowed to it is fully dispersed it is uniform after, add the molding time of 0.4 part of adjustment glue of accelerator triethylamine, sampling,
The molding time (180 DEG C of hot plates) 512 seconds of glue is tested with the little skill in using a kitchen knife in cookery, glue is prepared and finished.
Embodiment 1-6：
Under room temperature, with being separately added into 53 parts of bisphenol A type epoxy resin, 25 parts of boron modified phenolic resin, inorganic in glue tank
18 parts of powder aluminium hydroxide, after stirring 2 hours at a temperature of 70 DEG C, adds curing agent 4,32 parts of 4- MDAs, first
125 parts of benzene, stirs 1 hour, be allowed to it is fully dispersed it is uniform after, add the shaping of 0.2 part of adjustment glue of accelerator 2-methylimidazole
Time, sampling tests the molding time (180 DEG C of hot plates) 465 seconds of glue with the little skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-7：
Under room temperature, in glue tank 28 parts of bisphenol-A phenolic type epoxy resin, benzoxazine phenol-formaldehyde resin modified are separately added into
30 parts, 15 parts of inorganic particle magnesia, at a temperature of 85 DEG C after stirring 2 hours, add 16 parts of curing agent m-xylene diamine and third
125 parts of ketone, stirs 0.5 hour, be allowed to it is fully dispersed it is uniform after, add accelerant N, 0.73 part of adjustment glue of N- dimethyl benzylamines
Molding time, sampling tests the molding time (180 DEG C of hot plates) 388 seconds of glue with the little skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-8：
Under room temperature, dicyclopentadiene or bicyclic alkenes and 22 parts of phenolic condensation resin, boron are separately added in glue tank
34 parts of phenol-formaldehyde resin modified, 15 parts of inorganic particle montmorillonite, after stirring 1.5 hours at a temperature of 90 DEG C, add the double cyanogen of curing agent
132 parts of 4 parts of amine and methyl acetate, stir 0.5 hour, be allowed to it is fully dispersed it is uniform after, add 0.38 part of tune of accelerator triethylamine
The molding time of whole glue, sampling tests the molding time (180 DEG C of hot plates) 368 seconds of glue with the little skill in using a kitchen knife in cookery, and glue has been prepared
Finish.
Embodiment 1-9：
Under room temperature, in glue tank 39 parts of resorcinol type epoxy resin, benzoxazine phenol-formaldehyde resin modified are separately added into
47 parts, 20 parts of inorganic particle talcum powder, after stirring 2 hours at a temperature of 75 DEG C, add 12 parts of curing agent m-phenylene diamine (MPD) and hexamethylene
136 parts of ketone, stirs 0.5 hour, be allowed to it is fully dispersed it is uniform after, add 1 part of adjustment glue of accelerator boron trifluoride ethylamine into
Type time, sampling tests the molding time (180 DEG C of hot plates) 512 seconds of glue with the little skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-10：
Under room temperature, in glue tank 45 parts of isocyanate-modified epoxy resin, dimethylbenzene modified phenolic resin are separately added into
36 parts of fat, 19 parts of inorganic particle vermiculite, after stirring 0.5 hour at a temperature of 130 DEG C, add curing agent 4,4- diaminourea hexichol first
128 parts of 32 parts of alkane and dimethyl acetamide, stir 0.17 hour, be allowed to it is fully dispersed it is uniform after, add accelerator acetylacetone,2,4-pentanedione
The molding time of 0.45 part of aluminium adjustment glue, sampling tests the molding time (180 DEG C of hot plates) 493 seconds of glue, glue with the little skill in using a kitchen knife in cookery
Liquid is prepared and finished.
Embodiment 1-11：
Under room temperature, in glue tank 42 parts of para-aminophenol epoxy resin, benzoxazine phenol-formaldehyde resin modified are separately added into
28 parts, 5 parts of inorganic particle aluminum oxide, after stirring 1.5 hours at a temperature of 110 DEG C, add curing agent 4,4- DADPSs
30 parts and 141 parts of propylene glycol monomethyl ether, stir 1 hour, be allowed to it is fully dispersed it is uniform after, add 1 part of tune of accelerator 2-methylimidazole
The molding time of whole glue, sampling tests the molding time (180 DEG C of hot plates) 460 seconds of glue with the little skill in using a kitchen knife in cookery, and glue has been prepared
Finish.
Embodiment 1-12：
Under room temperature, in glue tank 40 parts of glycolylurea epoxide resin, 60 parts of diphenyletherformalde-hyde resin, inorganic particle are separately added into
25 parts of boron nitride, after stirring 1 hour at a temperature of 110 DEG C, adds curing agent 4,35 parts of 4- DADPSs and ethylene glycol ethyl ethers
134 parts of ether acetate, stirs 0.5 hour, be allowed to it is fully dispersed it is uniform after, add 0.4 part of adjustment glue of accelerator pregnancy urotropine
The molding time of liquid, sampling tests the molding time (180 DEG C of hot plates) 500 seconds of glue with the little skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-13：
Under room temperature, be separately added in glue tank 47 parts of tricyanic epoxy resin, 25 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin,
22 parts of inorganic particle magnesia, after stirring 0.5 hour at a temperature of 120 DEG C, adds curing agent 4,4- MDAs 15
127 parts of the acid amides part and between N, N- dimethyl, stirs 0.5 hour, be allowed to it is fully dispersed it is uniform after, add accelerator 2- ethyl -4-
The molding time of 0.6 part of adjustment glue of methylimidazole, sampling tests the molding time (180 DEG C of hot plates) 475 of glue with the little skill in using a kitchen knife in cookery
Second, glue is prepared and finished.
Embodiment 1-14：
Under room temperature, with being separately added into 35 parts of polybutadiene epoxy resin, 31 parts of boron modified phenolic resin, inorganic in glue tank
15 parts of powder vermiculite, 5 parts of inorganic particle aluminium nitride, after stirring 2.5 hours at a temperature of 90 DEG C, add curing agent m-phenylene diamine (MPD) 16
Part and 129 parts of MEK, stir 0.5 hour, be allowed to it is fully dispersed it is uniform after, add accelerant N, 0.7 part of N- dimethyl benzylamines
The molding time of adjustment glue, sampling tests the molding time (180 DEG C of hot plates) 427 seconds of glue with the little skill in using a kitchen knife in cookery, and glue is prepared
Finish.
Embodiment 1-15：
Under room temperature, 25 parts of phenol type novolac epoxy resin, 32 parts of diphenyletherformalde-hyde resin, neighbour are separately added in glue tank
20 parts of cresols type novolac epoxy resin, 15 parts of inorganic particle boron nitride, 15 parts of inorganic particle aluminum oxide, stir at a temperature of 90 DEG C
After 2 hours, 80 parts of 3 parts of curing agent dicyandiamide, 60 parts of propylene glycol monomethyl ether and toluene are added, stirred 0.5 hour, be allowed to fully dispersed
After uniform, the molding time of 0.25 part of adjustment glue of accelerator triethylamine, sampling, when testing the shaping of glue with the little skill in using a kitchen knife in cookery are added
Between (180 DEG C of hot plates) 450 seconds, glue is prepared and finished.
Embodiment 1-16：
Under room temperature, in glue tank 37 parts of biphenyl type epoxy resin, 30 parts of boron modified phenolic resin, inorganic powder are separately added into
7 parts of body talcum powder, 25 parts of inorganic particle aluminum oxide, after stirring 2.5 hours at a temperature of 85 DEG C, add curing agent low molecule polyamides
138 parts of 27 parts of amine and cyclohexanone, stir 0.75 hour, be allowed to it is fully dispersed it is uniform after, add accelerator aluminium acetylacetonate 0.65
The molding time of part adjustment glue, sampling tests the molding time (180 DEG C of hot plates) 412 seconds of glue with the little skill in using a kitchen knife in cookery, and glue is matched somebody with somebody
System is finished.
Embodiment 1-17：
Under room temperature, in glue tank 33 parts of phenol type novolac epoxy resin, dimethylbenzene phenol-formaldehyde resin modified 50 are separately added into
Part, 2 parts of inorganic particle silica 1,5 parts of inorganic particle silica 1, after stirring 1 hour at a temperature of 110 DEG C, add solid
12 parts of agent m-xylene diamine, 100 parts of butanone, 50 parts of acid amides and between N, N- dimethyl, stir 1.25 hours, are allowed to fully dispersed
After uniform, add the molding time of 0.08 part of adjustment glue of accelerator pregnancy urotropine, sampling, with the little skill in using a kitchen knife in cookery test glue into
502 seconds type time (180 DEG C of hot plates), glue is prepared and finished.
Embodiment 1-18：
Under room temperature, in glue tank 15 parts of bisphenol-A phenolic type epoxy resin, dimethylbenzene phenol-formaldehyde resin modified 45 are separately added into
Part, 20 parts of biphenyl type epoxy resin, 25 parts of inorganic particle magnesia, 8 parts of inorganic particle boron nitride, at a temperature of 110 DEG C 2 are stirred
After hour, curing agent 4,3 parts of 4- MDAs, 14 parts of m-phenylene diamine (MPD), 76 parts of glycol dimethyl ether and acetone 55 are added
Part, stir 0.5 hour, be allowed to it is fully dispersed it is uniform after, when adding the shaping of 0.5 part of adjustment glue of accelerator boron trifluoride ethylamine
Between, sampling tests the molding time (180 DEG C of hot plates) 443 seconds of glue with the little skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-19：
Under room temperature, be separately added in glue tank 20 parts of resorcinol type epoxy resin, 47 parts of boron modified phenolic resin, three
Paracyanogen 25 parts of epoxy resin of acid, 13 parts of dimethylbenzene phenol-formaldehyde resin modified, 11 parts of inorganic particle aluminium nitride, inorganic particle talcum powder 12
Part, after stirring 2 hours at a temperature of 130 DEG C, add curing agent 4,6 parts of 4- MDAs, 61 parts of propylene glycol monomethyl ether, vinegar
48 parts of 31 parts of sour methyl esters and butanone, stir 0.5 hour, be allowed to it is fully dispersed it is uniform after, add 0.01 part of tune of accelerator triethylamine
The molding time of whole glue, sampling tests the molding time (180 DEG C of hot plates) 494 seconds of glue with the little skill in using a kitchen knife in cookery, and glue has been prepared
Finish.
Embodiment 1-20：
Under room temperature, be separately added in glue tank 15 parts of orthoresol type novolac epoxy resin, 52 parts of diphenyletherformalde-hyde resin,
It is dicyclopentadiene or bicyclic alkenes and 35 parts of the epoxy resin of phenolic condensation resin, 0 part of inorganic particle silica 1, inorganic
15 parts of powder aluminium hydroxide, at a temperature of 110 DEG C after stirring 2 hours, adds curing agent 4,5 parts of 4- MDAs, 4,
72 parts of 25 parts of 4- DADPSs, 85 parts of DMF and ethanol, stir 0.75 hour, are allowed to fully dispersed equal
After even, add the molding time of 0.6 part of adjustment glue of accelerator boron trifluoride ethylamine, sampling, with the little skill in using a kitchen knife in cookery test glue into
375 seconds type time (180 DEG C of hot plates), glue is prepared and finished.
Embodiment 1-21：
Under room temperature, in glue tank 20 parts of glycolylurea epoxide resin, 10 parts of para-aminophenol epoxy resin, benzo are separately added into
15 parts of oxazine phenol-formaldehyde resin modified, 15 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 12 parts of dimethylbenzene phenol-formaldehyde resin modified, inorganic particle nitrogen
Change 10 parts of boron, 20 parts of inorganic particle aluminum oxide, 5 parts of inorganic particle vermiculite, after stirring 1 hour at a temperature of 120 DEG C, add solidification
3 parts of agent dicyandiamide and 92 parts of 32 parts of Versamid, 53 parts of cyclohexanone and ethylene glycol ether acetate, stir 2 hours, are allowed to
It is fully dispersed it is uniform after, add 0.25 part of accelerator pregnancy urotropine, the molding time of 0.1 part of adjustment glue of triethylamine, sampling,
The molding time (180 DEG C of hot plates) 367 seconds of glue is tested with the little skill in using a kitchen knife in cookery, glue is prepared and finished.
Embodiment 1-22：
Under room temperature, in glue tank 20 parts of bisphenol A type epoxy resin, 10 parts of bisphenol f type epoxy resin, biphenyl are separately added into
15 parts of type epoxy resin, 31 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 3 parts of inorganic particle boron nitride, 8 parts of inorganic particle talcum powder, nothing
15 parts of machine powder magnesia, after stirring 2.5 hours at a temperature of 70 DEG C, adds 10 parts of curing agent m-phenylene diamine (MPD) and 4,4- diaminourea
75 parts of 15 parts of diphenyl sulphone (DPS), 81 parts of methyl acetate and acetone, stir 1 hour, be allowed to it is fully dispersed it is uniform after, add accelerator acetyl
The molding time of 0.4 part of acetone aluminium, 0.3 part of adjustment glue of 2-methylimidazole, sampling tests the molding time of glue with the little skill in using a kitchen knife in cookery
(180 DEG C of hot plates) 420 seconds, glue is prepared and finished.
Embodiment 1-23：
Under room temperature, with being separately added into dicyclopentadiene or bicyclic alkenes and 15 parts of phenolic condensation resin, double in glue tank
35 parts of phenol A phenol aldehyde type epoxy resins, 25 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 18 parts of inorganic particle aluminium hydroxide, inorganic particle are covered
De- soil 7 parts, 2 parts of inorganic particle silica, after stirring 2.5 hours at a temperature of 75 DEG C, add curing agent 4,4- diaminourea two
85 parts of 15 parts of phenylmethane, 8 parts of m-xylene diamine, 83 parts of glycol dimethyl ether and dimethylbenzene, stir 0.25 hour, are allowed to fully divide
After dissipating uniformly, the molding time of 0.45 part of adjustment glue of accelerator 2-ethyl-4-methylimidazole, sampling is added to be surveyed with the little skill in using a kitchen knife in cookery
The molding time (180 DEG C of hot plates) of examination glue 477 seconds, glue is prepared and finished.
Embodiment 1-24：
Under room temperature, in glue tank 25 parts of bisphenol f type epoxy resin, orthoresol type novolac epoxy resin 10 are separately added into
It is part, 10 parts of bisphenol-A phenolic type epoxy resin, 35 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 25 parts of dimethylbenzene phenol-formaldehyde resin modified, inorganic
10 parts of powder montmorillonite, 8 parts of inorganic particle aluminum oxide, 4 parts of inorganic particle talcum powder, stir 2.5 hours at a temperature of 110 DEG C
Afterwards, 10 parts of curing agent m-phenylene diamine (MPD) and 25 parts of Versamid, 20 parts of toluene, 47 parts of ethylene glycol ether acetate and first are added
70 parts of ethyl ketone, stirs 0.5 hour, be allowed to it is fully dispersed it is uniform after, add 0.5 part of accelerator 2-ethyl-4-methylimidazole, N, N-
The molding time of 0.3 part of adjustment glue of dimethyl benzylamine, sampling tests the molding time (180 DEG C of hot plates) of glue with the little skill in using a kitchen knife in cookery
432 seconds, glue was prepared and finished.
Embodiment 1-25：
Under room temperature, be separately added in glue tank 20 parts of tricyanic epoxy resin, 10 parts of resorcinol type epoxy resin,
Isocyanate-modified 20 parts of epoxy resin, 5 parts of benzoxazine phenol-formaldehyde resin modified, 10 parts of dimethylbenzene phenol-formaldehyde resin modified, two
15 parts of phenylate formaldehyde resin, 20 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 10 parts of inorganic particle aluminium hydroxide, inorganic particle talcum powder 5
Part, 10 parts of inorganic particle aluminum oxide, after stirring 2.5 hours at a temperature of 75 DEG C, add curing agent 4,4- DADPSs 15
Part and 89 parts of 3 parts of dicyandiamide, 55 parts of methyl acetate, 26 parts of propylene glycol monomethyl ether and dimethylbenzene, stir 0.5 hour, are allowed to fully divide
After dissipating uniformly, 0.3 part of accelerator boron trifluoride ethylamine, the molding time of 0.2 part of adjustment glue of aluminium acetylacetonate are added, are sampled,
The molding time (180 DEG C of hot plates) 468 seconds of glue is tested with the little skill in using a kitchen knife in cookery, glue is prepared and finished.
Embodiment 1-26：
Under room temperature, in glue tank 13 parts of phenol type novolac epoxy resin, resorcinol type epoxy resin 5 are separately added into
12 parts of the epoxy resin, 15 parts of bisphenol A type epoxy resin, boron of part, dicyclopentadiene or bicyclic alkenes and phenolic condensation resin
10 parts of phenol-formaldehyde resin modified, 25 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 10 parts of dimethylbenzene phenol-formaldehyde resin modified, inorganic particle talcum powder
5 parts, 12 parts of inorganic particle magnesia, 15 parts of inorganic particle boron nitride, at a temperature of 105 DEG C after stirring 1.5 hours, add solidification
2 parts of 8 parts of agent m-phenylene diamine (MPD), 15 parts of 4,4- DADPSs and dicyandiamide, 63 parts of toluene, 32 parts of cyclohexanone, N, N- dimethyl
34 parts of 41 parts of formamide and ethanol, stir 0.75 hour, be allowed to it is fully dispersed it is uniform after, add accelerator 2-methylimidazole 0.25
Part, the molding time of 0.35 part of adjustment glue of boron trifluoride ethylamine, sampling tests (180 DEG C of the molding time of glue with the little skill in using a kitchen knife in cookery
Hot plate) 385 seconds, glue is prepared and finished.
Embodiment 1-27：
Under room temperature, in glue tank 20 parts of orthoresol type novolac epoxy resin, para-aminophenol epoxy resin are separately added into
15 parts, 15 parts of glycolylurea epoxide resin, 5 parts of polybutadiene epoxy resin, 20 parts of dimethylbenzene phenol-formaldehyde resin modified, diphenyletherformalde-hyde tree
15 parts of fat, 13 parts of dimethylbenzene phenol-formaldehyde resin modified, 0 part of inorganic particle silica 1,10 parts of inorganic particle boron nitride, inorganic powder
15 parts of body aluminium hydroxide, after stirring 2 hours at a temperature of 125 DEG C, adds 7 parts of curing agent m-phenylene diamine (MPD), Versamid 26
Part and 62 parts of 2 parts of dicyandiamide, 56 parts of dimethylbenzene, 22 parts of dimethylformamide, 25 parts of methyl acetate and butanone, stir 0.5 hour,
Be allowed to it is fully dispersed it is uniform after, add 0.25 part of accelerator 2-ethyl-4-methylimidazole, 0.3 part of adjustment glue of triethylamine into
Type time, sampling tests the molding time (180 DEG C of hot plates) 451 seconds of glue with the little skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-28：
Under room temperature, 15 parts of para-aminophenol epoxy resin, 23 parts of biphenyl type epoxy resin are separately added in glue tank, are gathered
15 parts of butadiene epoxy resin, 15 parts of diphenyletherformalde-hyde resin, 5 parts of boron modified phenolic resin, 5 parts of diphenyletherformalde-hyde resin, nothing
8 parts of machine powder vermiculite, 15 parts of inorganic particle magnesia, 12 parts of inorganic particle aluminium nitride, stir 1.5 hours at a temperature of 110 DEG C
Afterwards, 8 parts of curing agent m-phenylene diamine (MPD), 17 parts of 4,4- DADPSs and 4 parts of 4,4- MDA, dimethylbenzene 80 are added
Part, 34 parts of 44 parts of dimethyl acetamide and ethanol, stir 0.5 hour, be allowed to it is fully dispersed it is uniform after, add accelerator 2- second
The molding time of 0.37 part of base -4-methylimidazole, 0.25 part of adjustment glue of pregnancy urotropine, sampling tests glue with the little skill in using a kitchen knife in cookery
Molding time (180 DEG C of hot plates) 360 seconds, glue is prepared and finished.
The preparation of the resistance to electric trace resin aramid fiber felt prepreg of Part II high intensity
Embodiment 2-1：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 130 DEG C after stirring 0.5 hour, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 360 seconds, glue is prepared and finished；B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity.
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 11m/min；The index of aramid fiber felt prepreg is：
Mobility is 26mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-2：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 130 DEG C after stirring 1 hour, adds curing agent and stirring solvent 0.42 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 450 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, speed 9m/min of gluing machine is obtained aramid fiber felt prepreg；The index of aramid fiber felt prepreg is：Flowing
Property 28mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-3：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 70 DEG C after stirring 2 hours, adds curing agent and stirring solvent 1 hour, be allowed to it is fully dispersed it is uniform after, plus
Enter the molding time that accelerator adjusts glue, sampling tests the molding time of glue with the little skill in using a kitchen knife in cookery, under the conditions of 180 DEG C of hot plates,
It it is 510 seconds between when the molding, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 16m/min；The index of aramid fiber felt prepreg is：
Mobility 23mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-4：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 120 DEG C after stirring 2.5 hours, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 493 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 13m/min；The index of aramid fiber felt prepreg is：
Mobility is 17mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-5：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 70 DEG C after stirring 2.5 hours, adds curing agent and stirring solvent 0.42 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 512 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 12m/min；The index of aramid fiber felt prepreg is：
Mobility is 23mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-6：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 85 DEG C after stirring 2 hours, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 465 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 7m/min；The index of aramid fiber felt prepreg is：Stream
Dynamic property be 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-7：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 90 DEG C after stirring 2.5 hours, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 388 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 4m/min；The index of aramid fiber felt prepreg is：Stream
Dynamic property be 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-8：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 75 DEG C after stirring 2 hours, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 368 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 11m/min；The index of aramid fiber felt prepreg is：
Mobility is 14mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-9：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 130 DEG C after stirring 0.5 hour, adds curing agent and stirring solvent 0.17 hour, be allowed to it is fully dispersed
After even, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plates with the little skill in using a kitchen knife in cookery
Under the conditions of, when the molding between be 512 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 13m/min；The index of aramid fiber felt prepreg is：
Mobility is 23mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-10：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 110 DEG C after stirring 1.5 hours, adds curing agent and stirring solvent 1 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 493 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 12m/min；The index of aramid fiber felt prepreg is：
Mobility is 22mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-11：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 110 DEG C after stirring 1 hour, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 460 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 13m/min；The index of aramid fiber felt prepreg is：
Mobility is 18mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-12：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 90 DEG C after stirring 2.5 hours, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 500 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 11m/min；The index of aramid fiber felt prepreg is：
Mobility is 22mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-13：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 90 DEG C after stirring 1.5 hours, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 475 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 15m/min；The index of aramid fiber felt prepreg is：
Mobility is 16mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-14：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 85 DEG C after stirring 2.5 hours, adds curing agent and stirring solvent 0.75 hour, be allowed to it is fully dispersed
After even, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plates with the little skill in using a kitchen knife in cookery
Under the conditions of, when the molding between be 427 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 9m/min；The index of aramid fiber felt prepreg is：Stream
Dynamic property be 14mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-15：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 110 DEG C after stirring 1 hour, adds curing agent and stirring solvent 1.25 hours, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 450 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 18m/min；The index of aramid fiber felt prepreg is：
Mobility is 19mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-16：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 120 DEG C after stirring 0.5 hour, adds curing agent and stirring solvent 0.5 hour, be allowed to it is fully dispersed
After even, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plates with the little skill in using a kitchen knife in cookery
Under the conditions of, when the molding between be 412 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 14m/min；The index of aramid fiber felt prepreg is：
Mobility is 20mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-17：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 110 DEG C after stirring 2 hours, adds curing agent and stirring solvent 0.75 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 502 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 12m/min；The index of aramid fiber felt prepreg is：
Mobility is 23mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-18
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 90 DEG C after stirring 2 hours, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 443 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 12m/min；The index of aramid fiber felt prepreg is：
Mobility is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-19：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 110 DEG C after stirring 2 hours, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 494 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 18m/min；The index of aramid fiber felt prepreg is：
Mobility is 20mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-20：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 120 DEG C after stirring 1 hour, adds curing agent and stirring solvent 2 hours, be allowed to it is fully dispersed it is uniform after,
Accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate conditions with the little skill in using a kitchen knife in cookery
Under, when the molding between be 375 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 10m/min；The index of aramid fiber felt prepreg is：
Mobility is 23mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-21：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 130 DEG C after stirring 2 hours, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 367 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 10m/min；The index of aramid fiber felt prepreg is：
Mobility is 27mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-22：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 75 DEG C after stirring 2.5 hours, adds curing agent and stirring solvent 0.25 hour, be allowed to it is fully dispersed
After even, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plates with the little skill in using a kitchen knife in cookery
Under the conditions of, when the molding between be 420 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 11m/min；The index of aramid fiber felt prepreg is：
Mobility is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-23：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 70 DEG C after stirring 2.5 hours, adds curing agent and stirring solvent 1 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 477 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 13m/min；The index of aramid fiber felt prepreg is：
Mobility is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-24：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 75 DEG C after stirring 2.5 hours, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 432 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 10m/min；The index of aramid fiber felt prepreg is：
Mobility is 24mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-25：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 110 DEG C after stirring 1.5 hours, adds curing agent and stirring solvent 0.5 hour, be allowed to it is fully dispersed
After even, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plates with the little skill in using a kitchen knife in cookery
Under the conditions of, when the molding between be 468 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 11m/min；The index of aramid fiber felt prepreg is：
Mobility is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-26：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 125 DEG C after stirring 2 hours, adds curing agent and stirring solvent 0.5 hour, is allowed to fully dispersed uniform
Afterwards, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
Under part, when the molding between be 385 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 8m/min；The index of aramid fiber felt prepreg is：Stream
Dynamic property be 28mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-27：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 110 DEG C after stirring 2.5 hours, adds curing agent and stirring solvent 0.5 hour, be allowed to it is fully dispersed
After even, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plates with the little skill in using a kitchen knife in cookery
Under the conditions of, when the molding between be 451 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 13m/min；The index of aramid fiber felt prepreg is：
Mobility is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-28：
A, the resistance to electric trace Resin adhesive of preparation high intensity
A () takes dispensing each component, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
Under (b) room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank
Powder, at a temperature of 105 DEG C after stirring 1.5 hours, adds curing agent and stirring solvent 0.75 hour, be allowed to it is fully dispersed
After even, accelerator is added to adjust the molding time of glue, sampling tests the molding time of glue, in 180 DEG C of hot plates with the little skill in using a kitchen knife in cookery
Under the conditions of, when the molding between be 360 seconds, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect
Continuous felt and aramid fiber composite felt) impregnated by horizontal gluing machine or the resistance to electric trace Resin adhesive of high intensity described in spraying process a,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained aramid fiber felt prepreg in 14m/min；The index of aramid fiber felt prepreg is：
Mobility is 22mm, soluble resin content >=95%, volatile matter≤2%.
Table 1 below is the preparation technology parameter of the resistance to electric trace resin aramid fiber felt prepreg of high intensity of the embodiment of the present invention
And middle control technical indicator and test result situation.
Table 1：The resistance to electric trace resin aramid fiber felt prepreg preparation technology parameter of embodiment high intensity and middle control technical indicator
The preparation of Part III aramid fiber carpet veneer pressing plate
A, dispensing each component is taken, dispensing component and weight proportion are with arbitrary in embodiment 1-28；
B, prepreg is taken, dispensing component and weight proportion are with arbitrary in embodiment 2-28；
C, embodiment 3-1～3-28 compacting aramid fiber carpet veneer pressing plates：
The fabric prepreg that required form and size are cut into by aramid fiber carpet veneer sheeting process requirement is taken, will be pre-
Leaching one layer of material of material and above overlap are placed in two sides and scribble on the smooth stainless-steel sheet of releasing agent, send into general equipped with hot plate
Logical hot press or vacuum hotpressing machine, temperature control is in 130 DEG C～175 DEG C, Stress control hot pressing under conditions of 1MPa～30MPa
Shaping, according to the thickness 1mm～150mm of laminate after shaping, determines that the hot-forming time in the range of 0.5h～50h, that is, makes
Obtain aramid fiber carpet veneer pressing plate.
Table 2 below, table 3 for the embodiment of the present invention aramid fiber carpet veneer pressing plate pressing process parameter, the skill of resulting product
Art the performance test results situation.
Table 2：The aramid fiber carpet veneer pressing plate pressing process parameter of embodiment
Table 3：The technical performance test result of embodiment resulting product
Embodiment 4：
A kind of preparation method of aramid fiber carpet veneer pressing plate, comprises the following steps：
A, the resistance to electric trace Resin adhesive of preparation high intensity：
(a) dispensing：By the weight portion of high-temperature-resistant epoxy resin 38, the weight portion of phenol-formaldehyde resin modified 43, the weight portion of curing agent 19,
The weight portion composition of the weight portion of inorganic particle 20, the weight portion of accelerator 0.5 and the weight portion of solvent 150 takes each component raw material；
The high-temperature-resistant epoxy resin be bisphenol A type epoxy resin, bisphenol f type epoxy resin, polybutadiene epoxy resin,
Biphenyl type epoxy resin, phenol type novolac epoxy resin, orthoresol type novolac epoxy resin, bisphenol-A phenolic type epoxy resin,
It is benzenediol type epoxy resin, the epoxy resin of dicyclopentadiene or bicyclic alkenes and phenolic condensation resin, isocyanate-modified
Epoxy resin, glycolylurea epoxide resin, tricyanic epoxy resin and para-aminophenol epoxy resin in one or two
Mixture；
The phenol-formaldehyde resin modified is Effect of Organosilicon-modified Phenol-formaldehyde Resin, benzoxazine phenol-formaldehyde resin modified, boron modification phenolic aldehyde
One or two mixture in resin, dimethylbenzene phenol-formaldehyde resin modified and diphenyletherformalde-hyde resin；
The curing agent be 4,4- MDAs, 4,4- DADPSs, m-phenylene diamine (MPD), dicyandiamide, low point
One or two mixture in sub- polyamide and m-xylene diamine；
The inorganic particle is aluminium hydroxide, silica, titanium dioxide, montmorillonite, vermiculite, talcum powder, boron nitride, oxygen
Change magnesium and one or two the mixture in aluminum oxide；
The accelerator be 2-methylimidazole, 2-ethyl-4-methylimidazole, N, N- dimethyl benzylamines, boron trifluoride ethylamine,
One or two mixture in triethylamine, pregnancy urotropine and aluminium acetylacetonate；
The solvent is toluene, dimethylbenzene, dimethylformamide, dimethyl acetamide, glycol dimethyl ether, ethylene glycol ethyl ethers
Ether acetate, propylene glycol monomethyl ether, MEK, cyclohexanone, methyl acetate, butanone, acetone, N,N-dimethylformamide, Yi Jiyi
One or more mixture in alcohol；
Under (b) room temperature, high-temperature-resistant epoxy resin, phenol-formaldehyde resin modified are added in glue tank, in 70 DEG C～130 DEG C of temperature
After the lower stirring of degree 0.5 hour～2.5 hours, inorganic particle, curing agent and solvent are added, stirred 0.17 hour～1 hour, then added
Enter the molding time that accelerator adjusts glue, sampling tests the molding time of glue with the little skill in using a kitchen knife in cookery, under the conditions of 180 DEG C of hot plates,
When between when the molding between 360 seconds～512 seconds, the resistance to electric trace Resin adhesive of high intensity is prepared and finished, that is, high intensity is obtained
Resistance to electric trace Resin adhesive；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity：
Aramid fiber felt is impregnated or the resistance to electric trace Resin adhesive of high intensity described in spraying process a by horizontal gluing machine,
And through the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel, be divided into 4 sections, every section of 6m, stoving temperature scope 105 DEG C～
165 DEG C, the speed of gluing machine is obtained the resistance to electric trace resin aramid fiber felt prepreg of high intensity in 4～18m/min；
The aramid fiber felt is aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber
One or more mixture in continuous felt and aramid fiber composite felt；
C, compacting aramid fiber carpet veneer pressing plate：
The resistance to electric trace resin aramid fiber felt prepreg of high intensity is taken, by aramid fiber carpet veneer sheeting process requirement institute is cut into
Size is needed, the one or more layers overlap of the resistance to electric trace resin aramid fiber felt prepreg material of the high intensity is placed in into two sides painting
Have on the smooth stainless-steel sheet of releasing agent, send into common hot press or vacuum hotpressing machine, temperature control 130 DEG C～175 DEG C,
Stress control is hot-forming under conditions of 1MPa～30MPa, according to the thickness 1mm～150mm of laminate after shaping, it is determined that hot
The molded time is obtained aramid fiber carpet veneer pressing plate in the range of 0.5h～50h, that is,.
In the embodiment 4：In the resistance to electric trace resin aramid fiber felt prepreg of step (b) the prepared high intensity, resin half
The weight percent of solidfied material is reasonable be 25%～65%, aramid fiber felt weight percent it is reasonable be 35%～
75%.
In above-described embodiment：Technological parameter (temperature, time, pressure, thickness etc.) and each component consumption number in each step
Value etc. is scope, and any point is applicable.
Compared with technology, the raw material are the technology contents being not specifically delineated in present invention and above-described embodiment
Commercially available prod.
The invention is not restricted to above-described embodiment, can implement and with the good result described in present invention.
Claims (5)
1. a kind of aramid fiber carpet veneer pressing plate, is characterized in that：The aramid fiber carpet veneer pressing plate is one or more layers overlap
The resistance to electric trace resin aramid fiber felt prepreg obtained composite Jing after hot-forming of high intensity, and proof tracking index >=
600V；
The resistance to electric trace resin aramid fiber felt prepreg of the high intensity is by the resistance to electric trace Resin adhesive dipping of high intensity or sprays
What is formed on aramid fiber felt, after baked again has the aramid fiber felt impreg of resin semi-solid preparation thing on aramid fiber felt
Material；
The aramid fiber felt is that aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber are continuous
One or more mixture in felt and aramid fiber composite felt；
The resistance to electric trace Resin adhesive of the high intensity is by the weight portion of high-temperature-resistant epoxy resin 20～55, phenol-formaldehyde resin modified 25～60
Weight portion, the weight portion of curing agent 3～35, the weight portion of inorganic particle 5～35, the weight portion of accelerator 0.01～1 and solvent 125～
170 weight portions are constituted；
The high-temperature-resistant epoxy resin is bisphenol A type epoxy resin, bisphenol f type epoxy resin, polybutadiene epoxy resin, biphenyl
Type epoxy resin, phenol type novolac epoxy resin, orthoresol type novolac epoxy resin, bisphenol-A phenolic type epoxy resin, isophthalic two
The epoxy resin of phenol-type epoxy resin, dicyclopentadiene or bicyclic alkenes and phenolic condensation resin, isocyanate-modified ring
One or two mixed in oxygen tree fat, glycolylurea epoxide resin, tricyanic epoxy resin and para-aminophenol epoxy resin
Compound；
The phenol-formaldehyde resin modified be Effect of Organosilicon-modified Phenol-formaldehyde Resin, benzoxazine phenol-formaldehyde resin modified, boron modified phenolic resin,
One or two mixture in dimethylbenzene phenol-formaldehyde resin modified and diphenyletherformalde-hyde resin；
The curing agent is 4,4- MDAs, 4,4- DADPSs, m-phenylene diamine (MPD), dicyandiamide, low molecular weight polycaprolactone
One or two mixture in acid amides and m-xylene diamine；
The inorganic particle is aluminium hydroxide, silica, titanium dioxide, montmorillonite, vermiculite, talcum powder, boron nitride, oxidation
One or two mixture in magnesium and aluminum oxide；
The accelerator be 2-methylimidazole, 2-ethyl-4-methylimidazole, N, N- dimethyl benzylamines, boron trifluoride ethylamine, three second
One or two mixture in amine, pregnancy urotropine and aluminium acetylacetonate；
The solvent is toluene, dimethylbenzene, dimethylformamide, dimethyl acetamide, glycol dimethyl ether, ethylene glycol ethyl ether vinegar
In acid esters, propylene glycol monomethyl ether, MEK, cyclohexanone, methyl acetate, butanone, acetone, N,N-dimethylformamide and ethanol
One or more mixture.
2. the aramid fiber carpet veneer pressing plate as described in claim 1, is characterized in that：The resistance to electric trace resin aramid fiber of the high intensity
In felt prepreg, the percentage by weight of resin semi-solid preparation thing be the percentage by weight of 25%～65%, aramid fiber felt be 35%～
75%。
3. the aramid fiber carpet veneer pressing plate as described in claim 1 or 2, is characterized in that：The resistance to electric trace resin gluing of the high intensity
The preparation method of agent is：Under room temperature, high-temperature-resistant epoxy resin, phenol-formaldehyde resin modified are added in glue tank, at 70 DEG C～130 DEG C
At a temperature of after stirring 0.5 hour～2.5 hours, add inorganic particle, curing agent and solvent, stir 0.17 hour～1 hour,
The molding time that accelerator adjusts glue is added, sampling tests the molding time of glue, in 180 DEG C of hot plate bars with the little skill in using a kitchen knife in cookery
When under part, between when the molding between 360 seconds～512 seconds, the resistance to electric trace Resin adhesive of high intensity is prepared and finished, that is, height is obtained
The resistance to electric trace Resin adhesive of intensity.
4. a kind of preparation method of aramid fiber carpet veneer pressing plate, is characterized in that comprising the following steps：
A, the resistance to electric trace Resin adhesive of preparation high intensity：
（a）Dispensing：By the weight portion of high-temperature-resistant epoxy resin 20～55, the weight portion of phenol-formaldehyde resin modified 25～60, curing agent 3～35
The weight portion group of weight portion, the weight portion of inorganic particle 5～35, the weight portion of accelerator 0.01～1 and the weight portion of solvent 125～170
Into taking each component raw material；
The high-temperature-resistant epoxy resin is bisphenol A type epoxy resin, bisphenol f type epoxy resin, polybutadiene epoxy resin, biphenyl
Type epoxy resin, phenol type novolac epoxy resin, orthoresol type novolac epoxy resin, bisphenol-A phenolic type epoxy resin, isophthalic two
The epoxy resin of phenol-type epoxy resin, dicyclopentadiene or bicyclic alkenes and phenolic condensation resin, isocyanate-modified ring
One or two mixed in oxygen tree fat, glycolylurea epoxide resin, tricyanic epoxy resin and para-aminophenol epoxy resin
Compound；
The phenol-formaldehyde resin modified be Effect of Organosilicon-modified Phenol-formaldehyde Resin, benzoxazine phenol-formaldehyde resin modified, boron modified phenolic resin,
One or two mixture in dimethylbenzene phenol-formaldehyde resin modified and diphenyletherformalde-hyde resin；
The curing agent is 4,4- MDAs, 4,4- DADPSs, m-phenylene diamine (MPD), dicyandiamide, low molecular weight polycaprolactone
One or two mixture in acid amides and m-xylene diamine；
The inorganic particle is aluminium hydroxide, silica, titanium dioxide, montmorillonite, vermiculite, talcum powder, boron nitride, oxidation
One or two mixture in magnesium and aluminum oxide；
The accelerator be 2-methylimidazole, 2-ethyl-4-methylimidazole, N, N- dimethyl benzylamines, boron trifluoride ethylamine, three second
One or two mixture in amine, pregnancy urotropine and aluminium acetylacetonate；
The solvent is toluene, dimethylbenzene, dimethylformamide, dimethyl acetamide, glycol dimethyl ether, ethylene glycol ethyl ether vinegar
In acid esters, propylene glycol monomethyl ether, MEK, cyclohexanone, methyl acetate, butanone, acetone, N,N-dimethylformamide and ethanol
One or more mixture；
（b）Under room temperature, high-temperature-resistant epoxy resin, phenol-formaldehyde resin modified are added in glue tank, at a temperature of 70 DEG C～130 DEG C
After stirring 0.5 hour～2.5 hours, inorganic particle, curing agent and solvent are added, stirred 0.17 hour～1 hour, add rush
Enter the molding time that agent adjusts glue, sampling tests the molding time of glue with the little skill in using a kitchen knife in cookery, under the conditions of 180 DEG C of hot plates, treats as
When the type time is between 360 seconds～512 seconds, the resistance to electric trace Resin adhesive of high intensity is prepared and finished, that is, the resistance to electricity of high intensity is obtained
Trace Resin adhesive；
B, the resistance to electric trace resin aramid fiber felt prepreg of preparation high intensity：
Aramid fiber felt is impregnated or the resistance to electric trace Resin adhesive of high intensity described in spraying process a by horizontal gluing machine, and Jing
The drying tunnel preliminary drying of gluing machine is crossed, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, and stoving temperature scope is 105 DEG C～165
DEG C, the speed of gluing machine is obtained the resistance to electric trace resin aramid fiber felt prepreg of high intensity in 4～18m/min；
The aramid fiber felt is that aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber are continuous
One or more mixture in felt and aramid fiber composite felt；
C, compacting aramid fiber carpet veneer pressing plate：
The resistance to electric trace resin aramid fiber felt prepreg of high intensity is taken, by aramid fiber carpet veneer sheeting process requirement required chi is cut into
It is very little, by the one or more layers overlap of the resistance to electric trace resin aramid fiber felt prepreg material of the high intensity be placed in two sides scribble it is de-
On the smooth stainless-steel sheet of mould agent, common hot press or vacuum hotpressing machine are sent into, temperature control is in 130 DEG C～175 DEG C, pressure
Control is hot-forming under conditions of 1 MPa～30MPa, according to the thickness 1mm～150mm of laminate after shaping, determines hot pressing
Molding time is obtained aramid fiber carpet veneer pressing plate in the range of 0.5h～50h, that is,.
5. as described in claim 4 aramid fiber carpet veneer pressing plate preparation method, it is characterized in that：Step（b）It is described prepared high-strength
In spending resistance to electric trace resin aramid fiber felt prepreg, the percentage by weight of resin semi-solid preparation thing is 25%～65%, aramid fiber felt
Percentage by weight be 35%～75%.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107746546A (en) * | 2017-09-06 | 2018-03-02 | 嘉善金泰工程塑业有限公司 | A kind of epoxy resin hatch cover of ship pad and its manufacture method |
| CN108517715A (en) * | 2018-04-03 | 2018-09-11 | 东华大学 | A kind of paper honeycomb core material impregnant and its application |
| CN108912602A (en) * | 2018-05-30 | 2018-11-30 | 中国科学技术大学 | A kind of three-dimensional imitative clam shell feature material and preparation method thereof |
| CN108996530A (en) * | 2018-08-16 | 2018-12-14 | 军事科学院系统工程研究院卫勤保障技术研究所 | A kind of preparation method for nanometer magnesium oxide and a kind of nano magnesia-nanofiber composite felt and its preparation method and application |
| CN109401204A (en) * | 2018-10-31 | 2019-03-01 | 湖北工业大学 | A kind of rub resistance flexible-epoxy root-resistant puncturing water-proof composite material |
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| CN110670415A (en) * | 2019-09-26 | 2020-01-10 | 四川东材科技集团股份有限公司 | High-density aramid fiber paper laminated board and preparation method thereof |
| CN110746746A (en) * | 2019-09-26 | 2020-02-04 | 四川东材科技集团股份有限公司 | Medium-density aramid fiber paper laminated board and preparation method thereof |
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| JPH04125136A (en) * | 1990-01-26 | 1992-04-24 | Nec Corp | Fiber reinforced composite material |
| CN104842619A (en) * | 2015-05-06 | 2015-08-19 | 江苏恒神股份有限公司 | Prepreg manufacturing process of high-tenacity multilayer structure |
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| CN107746546A (en) * | 2017-09-06 | 2018-03-02 | 嘉善金泰工程塑业有限公司 | A kind of epoxy resin hatch cover of ship pad and its manufacture method |
| CN108517715A (en) * | 2018-04-03 | 2018-09-11 | 东华大学 | A kind of paper honeycomb core material impregnant and its application |
| CN108912602A (en) * | 2018-05-30 | 2018-11-30 | 中国科学技术大学 | A kind of three-dimensional imitative clam shell feature material and preparation method thereof |
| CN109867913A (en) * | 2018-08-11 | 2019-06-11 | 珠海市磐石电子科技有限公司 | Wear-resisting prepreg and wearing layer |
| CN108996530A (en) * | 2018-08-16 | 2018-12-14 | 军事科学院系统工程研究院卫勤保障技术研究所 | A kind of preparation method for nanometer magnesium oxide and a kind of nano magnesia-nanofiber composite felt and its preparation method and application |
| CN108996530B (en) * | 2018-08-16 | 2020-09-22 | 军事科学院系统工程研究院卫勤保障技术研究所 | Preparation method of nano magnesium oxide, nano magnesium oxide-nano fiber composite felt, and preparation method and application thereof |
| CN109401204A (en) * | 2018-10-31 | 2019-03-01 | 湖北工业大学 | A kind of rub resistance flexible-epoxy root-resistant puncturing water-proof composite material |
| CN110670415A (en) * | 2019-09-26 | 2020-01-10 | 四川东材科技集团股份有限公司 | High-density aramid fiber paper laminated board and preparation method thereof |
| CN110746746A (en) * | 2019-09-26 | 2020-02-04 | 四川东材科技集团股份有限公司 | Medium-density aramid fiber paper laminated board and preparation method thereof |
| CN111703088A (en) * | 2020-06-24 | 2020-09-25 | 中国兵器工业第五九研究所 | Preparation method of fragment convergence type bulletproof composite material |
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