CN106626631B - A kind of aramid fiber carpet veneer pressing plate and preparation method thereof - Google Patents

A kind of aramid fiber carpet veneer pressing plate and preparation method thereof Download PDF

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Publication number
CN106626631B
CN106626631B CN201610826389.4A CN201610826389A CN106626631B CN 106626631 B CN106626631 B CN 106626631B CN 201610826389 A CN201610826389 A CN 201610826389A CN 106626631 B CN106626631 B CN 106626631B
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aramid fiber
resin
parts
felt
epoxy resin
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CN106626631A (en
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杜旻
刘锋
黄洪驰
彭晓伟
邵亚婷
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Sichuan Dongcai Technology Group Co Ltd
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Sichuan Dongcai Technology Group Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/14—Modified phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/20—All layers being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B32B2262/0269—Aromatic polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a kind of aramid fiber carpet veneer pressing plates and preparation method thereof, it is characterized in that：The laminate is the resistance to electric trace resin aramid fiber felt prepreg rear composite material obtained, and proof tracking index >=600V through hot press molding of the high intensity of one or more layers overlapping；Prepreg is by the resistance to electric trace Resin adhesive dipping of high intensity or to be sprayed on aramid fiber felt, the aramid fiber felt impregnated material for having resin semi-solid preparation object on aramid fiber felt of baked rear formation again；The resistance to electric trace Resin adhesive of high intensity is made of 20~55 parts by weight of high-temperature-resistant epoxy resin, 25~60 parts by weight of phenol-formaldehyde resin modified, 3~35 parts by weight of curing agent, 5~35 parts by weight of inorganic particle, 0.01~1 parts by weight of accelerating agent and 125~170 parts by weight of solvent；Product of the present invention is suitable for the fields such as Aeronautics and Astronautics, high-performance ship, shellproof, anti-stab, military project all kinds of engineering equipments, electrical equipment, corrosion-resistant utensil and new-energy automobile.

Description

A kind of aramid fiber carpet veneer pressing plate and preparation method thereof
Technical field
The invention belongs to laminate and its preparation, it is related to a kind of aramid fiber carpet veneer pressing plate and preparation method thereof, especially Be related to a kind of all kinds of engineering equipments of specific use (Aeronautics and Astronautics, high-performance ship, shellproof, anti-stab, military project), electrical equipment, The aramid fiber carpet veneer pressing plate in the fields such as corrosion-resistant utensil and its new-energy automobile and preparation method thereof.
Background technology
Aramid fiber carpet veneer pressing plate is because of its isotropism, high mechanical strength, strength modulus are high, wear-resistant, low conductivity, resistance to Climb electrically, not unique excellent properties such as warpage, not stratified, can be widely applied to specific use (Aeronautics and Astronautics, high performance craft Oceangoing ship, shellproof, anti-stab, military project) the fields such as all kinds of engineering equipments, electrical equipment, corrosion-resistant utensil and its new-energy automobile in, because And to the demand of high-performance aramid fiber carpet veneer pressing plate, especially to making under high temperature, high humidity, high current, Extra High Strength environment Aramid fiber carpet veneer pressing plate demand is also more and more urgent.In recent years, the research of aramid fiber is gradually increased, but to aramid fiber The correlative study of fiber mat product especially aramid fiber carpet veneer pressing plate is few.In aramid fiber felt fibre bundle it is fluffy it is unordered, that This restraining force is poor, and all kinds of engineering equipments of specific use (Aeronautics and Astronautics, high-performance ship, shellproof, anti-stab, military project), It is (outstanding in high voltage, high temperature to aramid fiber carpet veneer pressing plate in the fields such as electrical equipment, corrosion-resistant utensil and its new-energy automobile It is H grades and C grades or more), under the environment such as high humidity, do not require nothing more than and reach >=550MPa under normality (room temperature), specially require its height Reach superelevation bending strength >=300MPa under warm operating condition, while solving wanting for its anti creepage trace performance (PTI >=600V) It asks.The prior art all fails to solve these technical problems.
Invention content
The purpose of the present invention is intended to overcome above-mentioned deficiency in the prior art, especially for it is above-mentioned in the prior art not yet How the aramid fiber carpet veneer pressing plate of solution keeps Extra High Strength (to be often referred to be bent under high temperature (180 DEG C, 200 DEG C or more) 491~509MPa of intensity) while reaching the problem of proof tracking index is 600V, a kind of aramid fiber carpet veneer pressing plate is provided And preparation method thereof, present invention offer is a kind of to meet the fields such as aerospace, high-performance ship, shellproof, anti-stab, military project virtue Synthetic fibre fibre felt layer pressing plate, under the premise of ensureing mechanical electric performance, realize product for a long time can high-temperature resistant, proof tracking index Up to 600V.
Present disclosure is：A kind of aramid fiber carpet veneer pressing plate, it is characterized in that：The aramid fiber carpet veneer pressing plate is one layer Or the resistance to electric trace resin aramid fiber felt prepreg of high intensity of one layer or more (generally at 100 layers or less) overlapping through hot press molding after Composite material obtained, and proof tracking index >=600V；
The resistance to electric trace resin aramid fiber felt prepreg of the high intensity be by the resistance to electric trace Resin adhesive dipping of high intensity or It is sprayed on aramid fiber felt, the baked rear aramid fiber felt for having resin semi-solid preparation object on aramid fiber felt formed soaks again Stain material；
The aramid fiber felt is aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber The mixture of one or more of continuous felt and aramid fiber composite felt；
The resistance to electric trace Resin adhesive of the high intensity is by 20~55 parts by weight of high-temperature-resistant epoxy resin, phenol-formaldehyde resin modified 25 ~60 parts by weight, 3~35 parts by weight of curing agent, 5~35 parts by weight of inorganic particle, 0.01~1 parts by weight of accelerating agent and solvent 125 ~170 parts by weight form；
The high-temperature-resistant epoxy resin be bisphenol A type epoxy resin, bisphenol f type epoxy resin, polybutadiene epoxy resin, Biphenyl type epoxy resin, phenol type novolac epoxy resin, o-cresol type novolac epoxy resin, bisphenol-A phenolic type epoxy resin, It is the epoxy resin of benzenediol type epoxy resin, dicyclopentadiene or bicyclic alkenes and phenolic condensation resin, isocyanate-modified One or both of epoxy resin, glycolylurea epoxide resin, tricyanic epoxy resin and para-aminophenol epoxy resin Mixture；
The phenol-formaldehyde resin modified is Effect of Organosilicon-modified Phenol-formaldehyde Resin, benzoxazine phenol-formaldehyde resin modified, boron modification phenolic aldehyde The mixture of one or both of resin, dimethylbenzene phenol-formaldehyde resin modified and diphenyletherformalde-hyde resin；
The curing agent be 4,4- diaminodiphenylmethane, 4,4- diaminodiphenylsulfones, m-phenylene diamine (MPD), dicyandiamide, low point The mixture of one or both of sub- polyamide and m-xylene diamine；
The inorganic particle is aluminium hydroxide, silica, titanium dioxide, montmorillonite, vermiculite, talcum powder, boron nitride, oxygen Change the mixture of one or both of magnesium and aluminium oxide；
The accelerating agent be 2-methylimidazole, 2-ethyl-4-methylimidazole, N, N- dimethyl benzylamines, boron trifluoride ethylamine, The mixture of one or both of triethylamine, pregnancy urotropine and aluminium acetylacetonate；
The solvent is toluene, dimethylbenzene, dimethylformamide, dimethylacetylamide, glycol dimethyl ether, ethylene glycol ethyl ethers Ether acetate, propylene glycol monomethyl ether, methyl ethyl ketone, cyclohexanone, methyl acetate, butanone, acetone, N,N-dimethylformamide, Yi Jiyi The mixture of one or more of alcohol.
In present disclosure：In the resistance to electric trace resin aramid fiber felt prepreg of the high intensity, resin semi-solid preparation object Weight percent is preferably 25%~65%, the weight percent of aramid fiber felt is preferably 35%~75%.
In present disclosure：The preparation method of the resistance to electric trace Resin adhesive of the high intensity can be：At room temperature, with High-temperature-resistant epoxy resin, phenol-formaldehyde resin modified are added in glue tank, it is small that 0.5 hour~2.5 are stirred at a temperature of 70 DEG C~130 DEG C Inorganic particle, curing agent and solvent is added in Shi Hou, stirs 0.17 hour~1 hour, adds the molding of accelerating agent adjustment glue Time, sampling, with the small skill in using a kitchen knife in cookery test glue molding time, under the conditions of 180 DEG C of hot plates, when the molding between be 360 seconds~512 When between second, the resistance to electric trace Resin adhesive of high intensity, which is prepared, to be finished, and the resistance to electric trace Resin adhesive of high intensity is obtained.
The present invention another content be：A kind of preparation method of aramid fiber carpet veneer pressing plate, it is characterized in that including following step Suddenly：
A, the resistance to electric trace Resin adhesive of high intensity is prepared：
(a) dispensing：By 20~55 parts by weight of high-temperature-resistant epoxy resin, 25~60 parts by weight of phenol-formaldehyde resin modified, curing agent 3 The weight of~35 parts by weight, 125~170 parts by weight of 5~35 parts by weight of inorganic particle, 0.01~1 parts by weight of accelerating agent and solvent Part composition takes each component raw material；
The high-temperature-resistant epoxy resin be bisphenol A type epoxy resin, bisphenol f type epoxy resin, polybutadiene epoxy resin, Biphenyl type epoxy resin, phenol type novolac epoxy resin, o-cresol type novolac epoxy resin, bisphenol-A phenolic type epoxy resin, It is the epoxy resin of benzenediol type epoxy resin, dicyclopentadiene or bicyclic alkenes and phenolic condensation resin, isocyanate-modified One or both of epoxy resin, glycolylurea epoxide resin, tricyanic epoxy resin and para-aminophenol epoxy resin Mixture；
The phenol-formaldehyde resin modified is Effect of Organosilicon-modified Phenol-formaldehyde Resin, benzoxazine phenol-formaldehyde resin modified, boron modification phenolic aldehyde The mixture of one or both of resin, dimethylbenzene phenol-formaldehyde resin modified and diphenyletherformalde-hyde resin；
The curing agent be 4,4- diaminodiphenylmethane, 4,4- diaminodiphenylsulfones, m-phenylene diamine (MPD), dicyandiamide, low point The mixture of one or both of sub- polyamide and m-xylene diamine；
The inorganic particle is aluminium hydroxide, silica, titanium dioxide, montmorillonite, vermiculite, talcum powder, boron nitride, oxygen Change the mixture of one or both of magnesium and aluminium oxide；
The accelerating agent be 2-methylimidazole, 2-ethyl-4-methylimidazole, N, N- dimethyl benzylamines, boron trifluoride ethylamine, The mixture of one or both of triethylamine, pregnancy urotropine and aluminium acetylacetonate；
The solvent is toluene, dimethylbenzene, dimethylformamide, dimethylacetylamide, glycol dimethyl ether, ethylene glycol ethyl ethers Ether acetate, propylene glycol monomethyl ether, methyl ethyl ketone, cyclohexanone, methyl acetate, butanone, acetone, N,N-dimethylformamide, Yi Jiyi The mixture of one or more of alcohol；
(b) at room temperature, high-temperature-resistant epoxy resin, phenol-formaldehyde resin modified are added in glue tank, in 70 DEG C~130 DEG C of temperature After the lower stirring of degree 0.5 hour~2.5 hours, inorganic particle, curing agent and solvent is added, stirs 0.17 hour~1 hour, then adds Entering the molding time of accelerating agent adjustment glue, the molding time of glue is tested in sampling with the small skill in using a kitchen knife in cookery, under the conditions of 180 DEG C of hot plates, When being between 360 seconds~512 seconds between when the molding, the resistance to electric trace Resin adhesive of high intensity, which is prepared, to be finished, and high intensity is obtained Resistance to electricity trace Resin adhesive；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared：
By aramid fiber felt by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains the resistance to electric trace resin aramid fiber felt prepreg of high intensity in 4~18m/min；
The aramid fiber felt is aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber The mixture of one or more of continuous felt and aramid fiber composite felt；
C, aramid fiber carpet veneer pressing plate is suppressed：
The resistance to electric trace resin aramid fiber felt prepreg of high intensity is taken, institute is cut by aramid fiber carpet veneer sheeting process requirement Need size, by the resistance to electric trace resin aramid fiber felt prepreg material of the high intensity it is one or more layers (generally 100 layers with Under) overlapping is placed in two sides and is coated on the smooth stainless-steel sheet of releasing agent, it is sent into common hot press or vacuum hotpressing machine, temperature Control is hot-forming under conditions of 130 DEG C~175 DEG C, pressure control are in 1MPa~30MPa, according to the thickness of laminate after molding 1mm~150mm is spent, the hot-forming time is determined within the scope of 0.5h~50h, obtains aramid fiber carpet veneer pressing plate.
In another content of the present invention：In the resistance to electric trace resin aramid fiber felt prepreg of step (b) the obtained high intensity, The weight percent of resin semi-solid preparation object is 25%~65%, the weight percent of aramid fiber felt is 35%~75%.
Compared with prior art, the present invention has following specific and advantageous effect：
(1) using the present invention, matrix resin and each raw material be can long-term high temperature resistant products, realize can for a long time in 180 DEG C and 200 DEG C of temperature used above can strictly meet high mechanical properties requirement.Under normality bending strength be 705~ 728MPa, and bending strength is that bending strength is 491~509MPa under 482~516MPa, C grades (such as 200 DEG C) at 180 DEG C, especially It is that high temperature strength conservation rate is higher, bending strength conservation rate at bending strength conservation rate >=68%, 200 DEG C at 180 DEG C >= 69%.It solves because aramid fiber felt self-strength difference cannot meet bending strength conservation rate under 180 DEG C and 200 DEG C of temperatures above >=50% technical barrier；
(2) present invention makes the resin system where it using resin and inorganic particle synergistic technology, long-term resistance to reaching On the basis of 180 DEG C and 200 DEG C of temperature used above, while meeting preferable electric property, especially refers in anti creepage trace Number aspect solves the technical barrier for only depending on the inaccessiable proof tracking index 600V of resin self performance, also drops significantly The low production cost of product；
(3) the aramid fiber carpet veneer sheeting process that prepared by the present invention is simple, and easy to operate, product quality is excellent, reduces Cost meets all kinds of engineering equipments of specific use (Aeronautics and Astronautics, high-performance ship, shellproof, anti-stab, military project), electric appliance is set Demand in the fields such as standby, corrosion-resistant utensil and its new-energy automobile to high-temperature-resistant structure composite material has significant real Border use value and application prospect.
Specific implementation mode
Providing the following examples, the invention will be further described, but is not to be construed as to the scope of the present invention Limitation, person skilled in art is according to the content of aforementioned present invention to some nonessential improvement of the invention made and tune It is whole, still fall within protection scope of the present invention.
In following embodiment the amount of each dispensing component materials be parts by weight (such as：Be gram or kilogram).
The preparation of the resistance to electric trace Resin adhesive of first part's high intensity
Embodiment 1-1：
At room temperature, 45 parts of polybutadiene epoxy resin, benzoxazine phenol-formaldehyde resin modified 27 are separately added into glue tank After being stirred 2.5 hours at a temperature of 120 DEG C, curing agent 4,4- diaminodiphenylsulfones 28 is added in part, 33 parts of inorganic particle aluminium nitride Part and 140 parts of dimethylformamide, stir 0.5 hour, be allowed to it is fully dispersed uniformly after, be added accelerating agent boron trifluoride ethylamine The molding time (180 DEG C of hot plates) 360 seconds of glue, glue are tested in the molding time of 0.1 part of adjustment glue, sampling with the small skill in using a kitchen knife in cookery It prepares and finishes.
Embodiment 1-2：
At room temperature, 42 parts of biphenyl type epoxy resin, 35 parts of dimethylbenzene phenol-formaldehyde resin modified, nothing are separately added into glue tank After being stirred 0.5 hour at a temperature of 130 DEG C, curing agent 4,25 parts of 4- diaminodiphenylsulfones is added in 23 parts of machine powder silica With 135 parts of dimethylacetylamide, stir 0.5 hour, be allowed to it is fully dispersed uniformly after, be added accelerating agent 2- ethyl -4- methyl miaows The molding time (180 DEG C of hot plates) 450 seconds of glue, glue are tested in the molding time of 0.5 part of azoles adjustment glue, sampling with the small skill in using a kitchen knife in cookery Liquid is prepared and is finished.
Embodiment 1-3：
At room temperature, be separately added into glue tank 31 parts of bisphenol f type epoxy resin, 55 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, After being stirred 1 hour at a temperature of 130 DEG C, 25 parts of curing agent Versamid and diformazan is added in 28 parts of inorganic particle aluminium oxide 130 parts of benzene stirs 0.42 hour, be allowed to it is fully dispersed uniformly after, the 0.8 part of adjustment of accelerating agent 2-ethyl-4-methylimidazole is added The molding time (180 DEG C of hot plates) 510 seconds of glue is tested in the molding time of glue, sampling with the small skill in using a kitchen knife in cookery, and glue has been prepared Finish.
Embodiment 1-4：
At room temperature, 35 parts of o-cresol type novolac epoxy resin, Effect of Organosilicon-modified Phenol-formaldehyde Resin are separately added into glue tank After being stirred 2.5 hours at a temperature of 70 DEG C, curing agent 4,4- diamino hexichol is added in 42 parts, 27 parts of inorganic particle aluminium hydroxide 145 parts of 20 parts of methane and n,N-Dimethylformamide stir 0.42 hour, be allowed to it is fully dispersed uniformly after, accelerating agent six is added The molding time (180 DEG C of hot plates) of glue is tested in the molding time of 0.35 part of adjustment glue of tetramine, sampling with the small skill in using a kitchen knife in cookery 493 seconds, glue was prepared and is finished.
Embodiment 1-5：
At room temperature, 20 parts of phenol type novolac epoxy resin, 38 parts of diphenyletherformalde-hyde resin, nothing are separately added into glue tank After being stirred 2.5 hours at a temperature of 90 DEG C, 135 parts of 10 parts of curing agent m-phenylene diamine (MPD) and ethyl alcohol is added in 8 parts of machine powder aluminium oxide, Stirring 0.5 hour, be allowed to it is fully dispersed uniformly after, be added the molding time of 0.4 part of adjustment glue of accelerating agent triethylamine, sampling, The molding time (180 DEG C of hot plates) 512 seconds of glue is tested with the small skill in using a kitchen knife in cookery, glue is prepared and finished.
Embodiment 1-6：
At room temperature, 53 parts of bisphenol A type epoxy resin, 25 parts of boron modified phenolic resin, inorganic is separately added into glue tank After being stirred 2 hours at a temperature of 70 DEG C, curing agent 4,32 parts of 4- diaminodiphenylmethane, first is added in 18 parts of powder aluminium hydroxide 125 parts of benzene stirs 1 hour, be allowed to it is fully dispersed uniformly after, the molding of 0.2 part of adjustment glue of accelerating agent 2-methylimidazole is added The molding time (180 DEG C of hot plates) 465 seconds of glue is tested in time, sampling with the small skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-7：
At room temperature, 28 parts of bisphenol-A phenolic type epoxy resin, benzoxazine phenol-formaldehyde resin modified are separately added into glue tank After being stirred 2 hours at a temperature of 85 DEG C, 16 parts of curing agent m-xylene diamine and third is added in 30 parts, 15 parts of inorganic particle magnesia 125 parts of ketone stirs 0.5 hour, be allowed to it is fully dispersed uniformly after, accelerant N, 0.73 part of N- dimethyl benzylamines adjustment glue is added Molding time, sampling tests the molding time (180 DEG C of hot plates) 388 seconds of glue with the small skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-8：
At room temperature, dicyclopentadiene or bicyclic alkenes and 22 parts of phenolic condensation resin, boron are separately added into glue tank After being stirred 1.5 hours at a temperature of 90 DEG C, the double cyanogen of curing agent are added in 34 parts of phenol-formaldehyde resin modified, 15 parts of inorganic particle montmorillonite 132 parts of 4 parts of amine and methyl acetate stir 0.5 hour, be allowed to it is fully dispersed uniformly after, 0.38 part of tune of accelerating agent triethylamine is added The molding time (180 DEG C of hot plates) 368 seconds of glue is tested in the molding time of whole glue, sampling with the small skill in using a kitchen knife in cookery, and glue has been prepared Finish.
Embodiment 1-9：
At room temperature, 39 parts of resorcinol type epoxy resin, benzoxazine phenol-formaldehyde resin modified are separately added into glue tank After being stirred 2 hours at a temperature of 75 DEG C, 12 parts of curing agent m-phenylene diamine (MPD) and hexamethylene is added in 47 parts, 20 parts of inorganic particle talcum powder 136 parts of ketone stirs 0.5 hour, be allowed to it is fully dispersed uniformly after, be added 1 part of adjustment glue of accelerating agent boron trifluoride ethylamine at The molding time (180 DEG C of hot plates) 512 seconds of glue is tested in type time, sampling with the small skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-10：
At room temperature, 45 parts of isocyanate-modified epoxy resin, dimethylbenzene modified phenolic resin are separately added into glue tank After being stirred 0.5 hour at a temperature of 130 DEG C, curing agent 4,4- diamino hexichol first is added in 36 parts of fat, 19 parts of inorganic particle vermiculite 128 parts of 32 parts of alkane and dimethylacetylamide stir 0.17 hour, be allowed to it is fully dispersed uniformly after, accelerating agent acetylacetone,2,4-pentanedione is added The molding time (180 DEG C of hot plates) 493 seconds of glue, glue are tested in the molding time of 0.45 part of aluminium adjustment glue, sampling with the small skill in using a kitchen knife in cookery Liquid is prepared and is finished.
Embodiment 1-11：
At room temperature, 42 parts of para-aminophenol epoxy resin, benzoxazine phenol-formaldehyde resin modified are separately added into glue tank After being stirred 1.5 hours at a temperature of 110 DEG C, curing agent 4,4- diaminodiphenylsulfones is added in 28 parts, 5 parts of inorganic particle aluminium oxide 30 parts and 141 parts of propylene glycol monomethyl ether stir 1 hour, be allowed to it is fully dispersed uniformly after, 1 part of tune of accelerating agent 2-methylimidazole is added The molding time (180 DEG C of hot plates) 460 seconds of glue is tested in the molding time of whole glue, sampling with the small skill in using a kitchen knife in cookery, and glue has been prepared Finish.
Embodiment 1-12：
At room temperature, 40 parts of glycolylurea epoxide resin, 60 parts of diphenyletherformalde-hyde resin, inorganic particle are separately added into glue tank After being stirred 1 hour at a temperature of 110 DEG C, curing agent 4,35 parts of 4- diaminodiphenylsulfones and ethylene glycol ethyl ethers are added in 25 parts of boron nitride 134 parts of ether acetate stirs 0.5 hour, be allowed to it is fully dispersed uniformly after, 0.4 part of adjustment glue of accelerating agent pregnancy urotropine is added The molding time (180 DEG C of hot plates) 500 seconds of glue is tested in the molding time of liquid, sampling with the small skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-13：
At room temperature, be separately added into glue tank 47 parts of tricyanic epoxy resin, 25 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, After being stirred 0.5 hour at a temperature of 120 DEG C, curing agent 4,4- diaminodiphenylmethane 15 is added in 22 parts of inorganic particle magnesia 127 parts of the amide part between N, N- dimethyl, is stirred 0.5 hour, be allowed to it is fully dispersed uniformly after, accelerating agent 2- ethyls -4- is added The molding time (180 DEG C of hot plates) 475 of glue is tested in the molding time of 0.6 part of adjustment glue of methylimidazole, sampling with the small skill in using a kitchen knife in cookery Second, glue is prepared and is finished.
Embodiment 1-14：
At room temperature, 35 parts of polybutadiene epoxy resin, 31 parts of boron modified phenolic resin, inorganic is separately added into glue tank After being stirred 2.5 hours at a temperature of 90 DEG C, curing agent m-phenylene diamine (MPD) 16 is added in 15 parts of powder vermiculite, 5 parts of inorganic particle aluminium nitride Part and 129 parts of methyl ethyl ketone, stir 0.5 hour, be allowed to it is fully dispersed uniformly after, be added accelerant N, 0.7 part of N- dimethyl benzylamines The molding time of glue is adjusted, the molding time (180 DEG C of hot plates) 427 seconds of glue is tested in sampling with the small skill in using a kitchen knife in cookery, and glue is prepared It finishes.
Embodiment 1-15：
At room temperature, 25 parts of phenol type novolac epoxy resin, 32 parts of diphenyletherformalde-hyde resin, neighbour are separately added into glue tank 20 parts of cresols type novolac epoxy resin, 15 parts of inorganic particle boron nitride, 15 parts of inorganic particle aluminium oxide, are stirred at a temperature of 90 DEG C After 2 hours, 80 parts of 3 parts of curing agent dicyandiamide, 60 parts of propylene glycol monomethyl ether and toluene is added, stirs 0.5 hour, is allowed to fully dispersed After uniformly, the molding time of 0.25 part of adjustment glue of accelerating agent triethylamine, sampling, when testing the molding of glue with the small skill in using a kitchen knife in cookery is added Between (180 DEG C of hot plates) 450 seconds, glue prepares and finishes.
Embodiment 1-16：
At room temperature, 37 parts of biphenyl type epoxy resin, 30 parts of boron modified phenolic resin, inorganic powder are separately added into glue tank After being stirred 2.5 hours at a temperature of 85 DEG C, curing agent low molecule polyamides is added in 7 parts of body talcum powder, 25 parts of inorganic particle aluminium oxide 138 parts of 27 parts of amine and cyclohexanone stir 0.75 hour, be allowed to it is fully dispersed uniformly after, accelerating agent aluminium acetylacetonate 0.65 is added The molding time (180 DEG C of hot plates) 412 seconds of glue is tested in the molding time of part adjustment glue, sampling with the small skill in using a kitchen knife in cookery, and glue is matched System finishes.
Embodiment 1-17：
At room temperature, 33 parts of phenol type novolac epoxy resin, dimethylbenzene phenol-formaldehyde resin modified 50 are separately added into glue tank Part, 2 parts of inorganic particle silica 1,5 parts of inorganic particle silica 1 after being stirred 1 hour at a temperature of 110 DEG C, are added solid 50 parts of amide between 12 parts of agent m-xylene diamine, 100 parts of butanone and N, N- dimethyl stirs 1.25 hours, is allowed to fully dispersed After uniformly, be added the molding time of 0.08 part of adjustment glue of accelerating agent pregnancy urotropine, sampling, with the small skill in using a kitchen knife in cookery test glue at 502 seconds type time (180 DEG C of hot plates), glue are prepared and are finished.
Embodiment 1-18：
At room temperature, 15 parts of bisphenol-A phenolic type epoxy resin, dimethylbenzene phenol-formaldehyde resin modified 45 are separately added into glue tank Part, 20 parts of biphenyl type epoxy resin, 25 parts of inorganic particle magnesia, 8 parts of inorganic particle boron nitride, 2 are stirred at a temperature of 110 DEG C After hour, curing agent 4,3 parts of 4- diaminodiphenylmethane, 14 parts of m-phenylene diamine (MPD), 76 parts of glycol dimethyl ether and acetone 55 is added Part, stir 0.5 hour, be allowed to it is fully dispersed uniformly after, when the molding of 0.5 part of adjustment glue of accelerating agent boron trifluoride ethylamine is added Between, the molding time (180 DEG C of hot plates) 443 seconds of glue is tested in sampling with the small skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-19：
At room temperature, 20 parts of resorcinol type epoxy resin, 47 parts of boron modified phenolic resin, three are separately added into glue tank 25 parts of paracyanogen acid epoxy resin, 13 parts of dimethylbenzene phenol-formaldehyde resin modified, 11 parts of inorganic particle aluminium nitride, inorganic particle talcum powder 12 Part, after being stirred 2 hours at a temperature of 130 DEG C, curing agent 4,6 parts of 4- diaminodiphenylmethane, 61 parts of propylene glycol monomethyl ether, vinegar is added 48 parts of 31 parts of sour methyl esters and butanone stir 0.5 hour, be allowed to it is fully dispersed uniformly after, 0.01 part of tune of accelerating agent triethylamine is added The molding time (180 DEG C of hot plates) 494 seconds of glue is tested in the molding time of whole glue, sampling with the small skill in using a kitchen knife in cookery, and glue has been prepared Finish.
Embodiment 1-20：
At room temperature, be separately added into glue tank 15 parts of o-cresol type novolac epoxy resin, 52 parts of diphenyletherformalde-hyde resin, It is 0 part of 35 parts of epoxy resin, the inorganic particle silica 1 of dicyclopentadiene or bicyclic alkenes and phenolic condensation resin, inorganic 15 parts of powder aluminium hydroxide, after being stirred 2 hours at a temperature of 110 DEG C, addition curing agent 4,5 parts of 4- diaminodiphenylmethane, 4, 72 parts of 25 parts of 4- diaminodiphenylsulfones, 85 parts of n,N-Dimethylformamide and ethyl alcohol stir 0.75 hour, are allowed to fully dispersed equal After even, be added the molding time of 0.6 part of adjustment glue of accelerating agent boron trifluoride ethylamine, sampling, with the small skill in using a kitchen knife in cookery test glue at 375 seconds type time (180 DEG C of hot plates), glue are prepared and are finished.
Embodiment 1-21：
At room temperature, 20 parts of glycolylurea epoxide resin, 10 parts of para-aminophenol epoxy resin, benzo are separately added into glue tank 15 parts of oxazine phenol-formaldehyde resin modified, 15 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 12 parts of dimethylbenzene phenol-formaldehyde resin modified, inorganic particle nitrogen Change 10 parts of boron, 20 parts of inorganic particle aluminium oxide, 5 parts of inorganic particle vermiculite, after being stirred 1 hour at a temperature of 120 DEG C, solidification is added 3 parts of agent dicyandiamide and 92 parts of 32 parts of Versamid, 53 parts of cyclohexanone and ethylene glycol ether acetate are stirred 2 hours, are allowed to It is fully dispersed uniformly after, be added the molding time of 0.1 part of 0.25 part of accelerating agent pregnancy urotropine, triethylamine adjustment glue, sampling, The molding time (180 DEG C of hot plates) 367 seconds of glue is tested with the small skill in using a kitchen knife in cookery, glue is prepared and finished.
Embodiment 1-22：
At room temperature, 20 parts of bisphenol A type epoxy resin, 10 parts of bisphenol f type epoxy resin, biphenyl are separately added into glue tank 15 parts of type epoxy resin, 31 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 3 parts of inorganic particle boron nitride, 8 parts of inorganic particle talcum powder, nothing After being stirred 2.5 hours at a temperature of 70 DEG C, 10 parts of curing agent m-phenylene diamine (MPD) and 4,4- diamino is added in 15 parts of machine powder magnesia 75 parts of 15 parts of diphenyl sulphone (DPS), 81 parts of methyl acetate and acetone, stir 1 hour, be allowed to it is fully dispersed uniformly after, be added accelerating agent acetyl The molding time of glue is tested in the molding time of 0.3 part of 0.4 part of acetone aluminium, 2-methylimidazole adjustment glue, sampling with the small skill in using a kitchen knife in cookery (180 DEG C of hot plates) 420 seconds, glue are prepared and are finished.
Embodiment 1-23：
At room temperature, dicyclopentadiene or bicyclic alkenes and 15 parts of phenolic condensation resin, double are separately added into glue tank 35 parts of phenol A phenol aldehyde type epoxy resins, 25 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 18 parts of inorganic particle aluminium hydroxide, inorganic particle cover After being stirred 2.5 hours at a temperature of 75 DEG C, curing agent 4,4- diamino two is added in de- soil 7 parts, 2 parts of inorganic particle silica 85 parts of 15 parts of phenylmethane, 8 parts of m-xylene diamine, 83 parts of glycol dimethyl ether and dimethylbenzene stir 0.25 hour, are allowed to fully divide After dissipating uniformly, the molding time of 0.45 part of adjustment glue of accelerating agent 2-ethyl-4-methylimidazole is added, sampling is surveyed with the small skill in using a kitchen knife in cookery Try the molding time (180 DEG C of hot plates) of glue 477 seconds, glue is prepared and finished.
Embodiment 1-24：
At room temperature, 25 parts of bisphenol f type epoxy resin, o-cresol type novolac epoxy resin 10 are separately added into glue tank It is part, 10 parts of bisphenol-A phenolic type epoxy resin, 35 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 25 parts of dimethylbenzene phenol-formaldehyde resin modified, inorganic 10 parts of powder montmorillonite, 8 parts of inorganic particle aluminium oxide, 4 parts of inorganic particle talcum powder stir 2.5 hours at a temperature of 110 DEG C Afterwards, 10 parts of curing agent m-phenylene diamine (MPD) and 25 parts of Versamid, 20 parts of toluene, 47 parts of ethylene glycol ether acetate and first is added 70 parts of ethyl ketone stirs 0.5 hour, be allowed to it is fully dispersed uniformly after, 0.5 part of accelerating agent 2-ethyl-4-methylimidazole, N, N- is added The molding time (180 DEG C of hot plates) of glue is tested in the molding time of 0.3 part of adjustment glue of dimethyl benzylamine, sampling with the small skill in using a kitchen knife in cookery 432 seconds, glue was prepared and is finished.
Embodiment 1-25：
At room temperature, be separately added into glue tank 20 parts of tricyanic epoxy resin, 10 parts of resorcinol type epoxy resin, Isocyanate-modified 20 parts of epoxy resin, 5 parts of benzoxazine phenol-formaldehyde resin modified, 10 parts of dimethylbenzene phenol-formaldehyde resin modified, two 15 parts of phenylate formaldehyde resin, 20 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 10 parts of inorganic particle aluminium hydroxide, inorganic particle talcum powder 5 After being stirred 2.5 hours at a temperature of 75 DEG C, curing agent 4,4- diaminodiphenylsulfones 15 is added in part, 10 parts of inorganic particle aluminium oxide Part and 89 parts of 3 parts of dicyandiamide, 55 parts of methyl acetate, 26 parts of propylene glycol monomethyl ether and dimethylbenzene stir 0.5 hour, are allowed to fully divide After dissipating uniformly, the molding time of 0.2 part of 0.3 part of accelerating agent boron trifluoride ethylamine, aluminium acetylacetonate adjustment glue is added, samples, The molding time (180 DEG C of hot plates) 468 seconds of glue is tested with the small skill in using a kitchen knife in cookery, glue is prepared and finished.
Embodiment 1-26：
At room temperature, 13 parts of phenol type novolac epoxy resin, resorcinol type epoxy resin 5 are separately added into glue tank Part, 15 parts of 12 parts of epoxy resin, bisphenol A type epoxy resin, the boron of dicyclopentadiene or bicyclic alkenes and phenolic condensation resin 10 parts of phenol-formaldehyde resin modified, 25 parts of Effect of Organosilicon-modified Phenol-formaldehyde Resin, 10 parts of dimethylbenzene phenol-formaldehyde resin modified, inorganic particle talcum powder 5 parts, 12 parts of inorganic particle magnesia, 15 parts of inorganic particle boron nitride, after being stirred 1.5 hours at a temperature of 105 DEG C, be added solidification 2 parts of 8 parts of agent m-phenylene diamine (MPD), 15 parts of 4,4- diaminodiphenylsulfones and dicyandiamide, 63 parts of toluene, 32 parts of cyclohexanone, N, N- dimethyl 34 parts of 41 parts of formamide and ethyl alcohol stir 0.75 hour, be allowed to it is fully dispersed uniformly after, accelerating agent 2-methylimidazole 0.25 is added (180 DEG C of the molding time of glue is tested in 0.35 part of part, boron trifluoride ethylamine molding time for adjusting glue, sampling with the small skill in using a kitchen knife in cookery Hot plate) 385 seconds, glue is prepared and is finished.
Embodiment 1-27：
At room temperature, 20 parts of o-cresol type novolac epoxy resin, para-aminophenol epoxy resin are separately added into glue tank 15 parts, 15 parts of glycolylurea epoxide resin, 5 parts of polybutadiene epoxy resin, 20 parts of dimethylbenzene phenol-formaldehyde resin modified, diphenyletherformalde-hyde tree 15 parts of fat, 13 parts of dimethylbenzene phenol-formaldehyde resin modified, 0 part of inorganic particle silica 1,10 parts of inorganic particle boron nitride, inorganic powder After being stirred 2 hours at a temperature of 125 DEG C, 7 parts of curing agent m-phenylene diamine (MPD), Versamid 26 is added in 15 parts of body aluminium hydroxide Part and 62 parts of 2 parts of dicyandiamide, 56 parts of dimethylbenzene, 22 parts of dimethylformamide, 25 parts of methyl acetate and butanone stir 0.5 hour, Be allowed to it is fully dispersed uniformly after, be added 0.25 part of accelerating agent 2-ethyl-4-methylimidazole, 0.3 part of adjustment glue of triethylamine at The molding time (180 DEG C of hot plates) 451 seconds of glue is tested in type time, sampling with the small skill in using a kitchen knife in cookery, and glue is prepared and finished.
Embodiment 1-28：
At room temperature, it is separately added into 15 parts of para-aminophenol epoxy resin in glue tank, 23 parts of biphenyl type epoxy resin, gathers 15 parts of butadiene epoxy resin, 15 parts of diphenyletherformalde-hyde resin, 5 parts of boron modified phenolic resin, 5 parts of diphenyletherformalde-hyde resin, nothing 8 parts of machine powder vermiculite, 15 parts of inorganic particle magnesia, 12 parts of inorganic particle aluminium nitride stir 1.5 hours at a temperature of 110 DEG C Afterwards, 8 parts of curing agent m-phenylene diamine (MPD), 17 parts of 4,4- diaminodiphenylsulfones and 4,4 parts of 4- diaminodiphenylmethane, dimethylbenzene 80 is added Part, 34 parts of 44 parts of dimethylacetylamide and ethyl alcohol, stir 0.5 hour, be allowed to it is fully dispersed uniformly after, accelerating agent 2- second is added The molding time of 0.25 part of 0.37 part of base -4-methylimidazole, pregnancy urotropine adjustment glue, sampling test glue with the small skill in using a kitchen knife in cookery Molding time (180 DEG C of hot plates) 360 seconds, glue prepares and finishes.
The preparation of the resistance to electric trace resin aramid fiber felt prepreg of second part high intensity
Embodiment 2-1：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 0.5 hour at a temperature of 130 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 360 seconds, glue i.e. prepare finish；B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared.
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 11m/min；The index of aramid fiber felt prepreg is： Mobility is 26mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-2：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 1 hour at a temperature of 130 DEG C, curing agent and stirring solvent 0.42 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 450 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed 9m/min of gluing machine obtains aramid fiber felt prepreg；The index of aramid fiber felt prepreg is：Flowing Property 28mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-3：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2 hours at a temperature of 70 DEG C, curing agent and stirring solvent 1 hour is added in powder, be allowed to it is fully dispersed uniformly after, add Entering the molding time of accelerating agent adjustment glue, the molding time of glue is tested in sampling with the small skill in using a kitchen knife in cookery, under the conditions of 180 DEG C of hot plates, It is 510 seconds between when the molding, glue is prepared and finished；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 16m/min；The index of aramid fiber felt prepreg is： Mobility 23mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-4：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2.5 hours at a temperature of 120 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 493 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 13m/min；The index of aramid fiber felt prepreg is： Mobility is 17mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-5：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2.5 hours at a temperature of 70 DEG C, curing agent and stirring solvent 0.42 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 512 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 12m/min；The index of aramid fiber felt prepreg is： Mobility is 23mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-6：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2 hours at a temperature of 85 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 465 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 7m/min；The index of aramid fiber felt prepreg is：Stream Dynamic property is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-7：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2.5 hours at a temperature of 90 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 388 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 4m/min；The index of aramid fiber felt prepreg is：Stream Dynamic property is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-8：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2 hours at a temperature of 75 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 368 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 11m/min；The index of aramid fiber felt prepreg is： Mobility is 14mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-9：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 0.5 hour at a temperature of 130 DEG C, curing agent and stirring solvent 0.17 hour is added in powder, be allowed to it is fully dispersed After even, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plates Under the conditions of, when the molding between be 512 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 13m/min；The index of aramid fiber felt prepreg is： Mobility is 23mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-10：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 1.5 hours at a temperature of 110 DEG C, curing agent and stirring solvent 1 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 493 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 12m/min；The index of aramid fiber felt prepreg is： Mobility is 22mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-11：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 1 hour at a temperature of 110 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 460 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 13m/min；The index of aramid fiber felt prepreg is： Mobility is 18mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-12：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2.5 hours at a temperature of 90 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 500 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 11m/min；The index of aramid fiber felt prepreg is： Mobility is 22mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-13：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 1.5 hours at a temperature of 90 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 475 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 15m/min；The index of aramid fiber felt prepreg is： Mobility is 16mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-14：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2.5 hours at a temperature of 85 DEG C, curing agent and stirring solvent 0.75 hour is added in powder, be allowed to it is fully dispersed After even, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plates Under the conditions of, when the molding between be 427 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 9m/min；The index of aramid fiber felt prepreg is：Stream Dynamic property is 14mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-15：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 1 hour at a temperature of 110 DEG C, curing agent and stirring solvent 1.25 hours is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 450 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 18m/min；The index of aramid fiber felt prepreg is： Mobility is 19mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-16：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 0.5 hour at a temperature of 120 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed After even, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plates Under the conditions of, when the molding between be 412 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 14m/min；The index of aramid fiber felt prepreg is： Mobility is 20mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-17：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2 hours at a temperature of 110 DEG C, curing agent and stirring solvent 0.75 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 502 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 12m/min；The index of aramid fiber felt prepreg is： Mobility is 23mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-18
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2 hours at a temperature of 90 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 443 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 12m/min；The index of aramid fiber felt prepreg is： Mobility is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-19：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2 hours at a temperature of 110 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 494 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 18m/min；The index of aramid fiber felt prepreg is： Mobility is 20mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-20：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 1 hour at a temperature of 120 DEG C, curing agent and stirring solvent 2 hours is added in powder, be allowed to it is fully dispersed uniformly after, The molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate conditions Under, when the molding between be 375 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 10m/min；The index of aramid fiber felt prepreg is： Mobility is 23mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-21：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2 hours at a temperature of 130 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 367 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 10m/min；The index of aramid fiber felt prepreg is： Mobility is 27mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-22：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2.5 hours at a temperature of 75 DEG C, curing agent and stirring solvent 0.25 hour is added in powder, be allowed to it is fully dispersed After even, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plates Under the conditions of, when the molding between be 420 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 11m/min；The index of aramid fiber felt prepreg is： Mobility is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-23：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2.5 hours at a temperature of 70 DEG C, curing agent and stirring solvent 1 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 477 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 13m/min；The index of aramid fiber felt prepreg is： Mobility is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-24：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2.5 hours at a temperature of 75 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 432 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 10m/min；The index of aramid fiber felt prepreg is： Mobility is 24mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-25：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 1.5 hours at a temperature of 110 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed After even, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plates Under the conditions of, when the molding between be 468 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 11m/min；The index of aramid fiber felt prepreg is： Mobility is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-26：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2 hours at a temperature of 125 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed uniformly Afterwards, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between be 385 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 8m/min；The index of aramid fiber felt prepreg is：Stream Dynamic property is 28mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-27：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 2.5 hours at a temperature of 110 DEG C, curing agent and stirring solvent 0.5 hour is added in powder, be allowed to it is fully dispersed After even, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plates Under the conditions of, when the molding between be 451 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 13m/min；The index of aramid fiber felt prepreg is： Mobility is 21mm, soluble resin content >=95%, volatile matter≤2%.
Embodiment 2-28：
A, the resistance to electric trace Resin adhesive of high intensity is prepared
(a) take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
(b) at room temperature, with being separately added into the high-temperature-resistant epoxy resin of formula ratio, phenol-formaldehyde resin modified and inorganic in glue tank After being stirred 1.5 hours at a temperature of 105 DEG C, curing agent and stirring solvent 0.75 hour is added in powder, be allowed to it is fully dispersed After even, the molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plates Under the conditions of, when the molding between be 360 seconds, glue i.e. prepare finish；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared
By aramid fiber felt, (aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber connect Continuous felt and aramid fiber composite felt) by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains aramid fiber felt prepreg in 14m/min；The index of aramid fiber felt prepreg is： Mobility is 22mm, soluble resin content >=95%, volatile matter≤2%.
Following table 1 is the preparation technology parameter of the resistance to electric trace resin aramid fiber felt prepreg of the high intensity of the embodiment of the present invention And middle control technical indicator and test result situation.
Table 1：The resistance to electric trace resin aramid fiber felt prepreg preparation technology parameter of embodiment high intensity and middle control technical indicator
The preparation of Part III aramid fiber carpet veneer pressing plate
A, take dispensing each component, dispensing component and weight proportion with any in embodiment 1-28；
B, take prepreg, dispensing component and weight proportion with any in embodiment 2-28；
C, embodiment 3-1~3-28 suppresses aramid fiber carpet veneer pressing plate：
The fabric prepreg that required shape and size are cut by aramid fiber carpet veneer sheeting process requirement is taken, it will be pre- Leaching one layer of material of material or more overlapping is placed in two sides and is coated on the smooth stainless-steel sheet of releasing agent, is sent into general equipped with hot plate Logical hot press or vacuum hotpressing machine, temperature control hot pressing under conditions of 130 DEG C~175 DEG C, pressure control are in 1MPa~30MPa Molding, according to thickness 1mm~150mm of laminate after molding, determines that the hot-forming time within the scope of 0.5h~50h, that is, makes Obtain aramid fiber carpet veneer pressing plate.
Following table 2, the aramid fiber carpet veneer pressing plate pressing process parameter that table 3 is the embodiment of the present invention, the skill of resulting product Art the performance test results situation.
Table 2：The aramid fiber carpet veneer pressing plate pressing process parameter of embodiment
Table 3：The technical performance test result of embodiment resulting product
Embodiment 4：
A kind of preparation method of aramid fiber carpet veneer pressing plate, includes the following steps：
A, the resistance to electric trace Resin adhesive of high intensity is prepared：
(a) dispensing：By 38 parts by weight of high-temperature-resistant epoxy resin, 43 parts by weight of phenol-formaldehyde resin modified, 19 parts by weight of curing agent, The parts by weight composition of 150 parts by weight of 20 parts by weight of inorganic particle, 0.5 parts by weight of accelerating agent and solvent takes each component raw material；
The high-temperature-resistant epoxy resin be bisphenol A type epoxy resin, bisphenol f type epoxy resin, polybutadiene epoxy resin, Biphenyl type epoxy resin, phenol type novolac epoxy resin, o-cresol type novolac epoxy resin, bisphenol-A phenolic type epoxy resin, It is the epoxy resin of benzenediol type epoxy resin, dicyclopentadiene or bicyclic alkenes and phenolic condensation resin, isocyanate-modified One or both of epoxy resin, glycolylurea epoxide resin, tricyanic epoxy resin and para-aminophenol epoxy resin Mixture；
The phenol-formaldehyde resin modified is Effect of Organosilicon-modified Phenol-formaldehyde Resin, benzoxazine phenol-formaldehyde resin modified, boron modification phenolic aldehyde The mixture of one or both of resin, dimethylbenzene phenol-formaldehyde resin modified and diphenyletherformalde-hyde resin；
The curing agent be 4,4- diaminodiphenylmethane, 4,4- diaminodiphenylsulfones, m-phenylene diamine (MPD), dicyandiamide, low point The mixture of one or both of sub- polyamide and m-xylene diamine；
The inorganic particle is aluminium hydroxide, silica, titanium dioxide, montmorillonite, vermiculite, talcum powder, boron nitride, oxygen Change the mixture of one or both of magnesium and aluminium oxide；
The accelerating agent be 2-methylimidazole, 2-ethyl-4-methylimidazole, N, N- dimethyl benzylamines, boron trifluoride ethylamine, The mixture of one or both of triethylamine, pregnancy urotropine and aluminium acetylacetonate；
The solvent is toluene, dimethylbenzene, dimethylformamide, dimethylacetylamide, glycol dimethyl ether, ethylene glycol ethyl ethers Ether acetate, propylene glycol monomethyl ether, methyl ethyl ketone, cyclohexanone, methyl acetate, butanone, acetone, N,N-dimethylformamide, Yi Jiyi The mixture of one or more of alcohol；
(b) at room temperature, high-temperature-resistant epoxy resin, phenol-formaldehyde resin modified are added in glue tank, in 70 DEG C~130 DEG C of temperature After the lower stirring of degree 0.5 hour~2.5 hours, inorganic particle, curing agent and solvent is added, stirs 0.17 hour~1 hour, then adds Entering the molding time of accelerating agent adjustment glue, the molding time of glue is tested in sampling with the small skill in using a kitchen knife in cookery, under the conditions of 180 DEG C of hot plates, When being between 360 seconds~512 seconds between when the molding, the resistance to electric trace Resin adhesive of high intensity, which is prepared, to be finished, and high intensity is obtained Resistance to electricity trace Resin adhesive；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared：
By aramid fiber felt by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, And by the drying tunnel preliminary drying of gluing machine, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, stoving temperature range 105 DEG C~ 165 DEG C, the speed of gluing machine obtains the resistance to electric trace resin aramid fiber felt prepreg of high intensity in 4~18m/min；
The aramid fiber felt is aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber The mixture of one or more of continuous felt and aramid fiber composite felt；
C, aramid fiber carpet veneer pressing plate is suppressed：
The resistance to electric trace resin aramid fiber felt prepreg of high intensity is taken, institute is cut by aramid fiber carpet veneer sheeting process requirement Size is needed, the resistance to electric one or more layers overlapping of trace resin aramid fiber felt prepreg material of the high intensity, which is placed in two sides, to be applied Have on the smooth stainless-steel sheet of releasing agent, be sent into common hot press or vacuum hotpressing machine, temperature control 130 DEG C~175 DEG C, Pressure control is hot-forming under conditions of 1MPa~30MPa, according to thickness 1mm~150mm of laminate after molding, determines heat The molded time within the scope of 0.5h~50h, obtains aramid fiber carpet veneer pressing plate.
In the embodiment 4：In the resistance to electric trace resin aramid fiber felt prepreg of step (b) the obtained high intensity, resin half The weight percent of solidfied material is preferably 25%~65%, the weight percent of aramid fiber felt be preferably 35%~ 75%.
In above-described embodiment：Technological parameter (temperature, time, pressure, thickness etc.) in each step and each component dosage number Value etc. is range, and any point is applicable.
The technology contents being not specifically delineated in the content of present invention and above-described embodiment are compared with technology, the raw material Commercial product.
The present invention is not limited to the above embodiments, can implement described in the content of present invention and have the good result.

Claims (5)

1. a kind of aramid fiber carpet veneer pressing plate, it is characterized in that：The aramid fiber carpet veneer pressing plate is one or more layers overlapping The resistance to electric trace resin aramid fiber felt prepreg of high intensity through hot press molding after composite material obtained, and proof tracking index >= 600V；
The resistance to electric trace resin aramid fiber felt prepreg of the high intensity is by the resistance to electric trace Resin adhesive dipping of high intensity or spraying On aramid fiber felt, the aramid fiber felt impreg for having resin semi-solid preparation object on aramid fiber felt of baked rear formation again Material；
The aramid fiber felt is that aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber are continuous The mixture of one or more of felt and aramid fiber composite felt；
The resistance to electric trace Resin adhesive of the high intensity is by 20~55 parts by weight of high-temperature-resistant epoxy resin, phenol-formaldehyde resin modified 25~60 Parts by weight, 3~35 parts by weight of curing agent, 5~35 parts by weight of inorganic particle, 0.01~1 parts by weight of accelerating agent and solvent 125~ 170 parts by weight form；
The high-temperature-resistant epoxy resin is bisphenol A type epoxy resin, bisphenol f type epoxy resin, polybutadiene epoxy resin, biphenyl Type epoxy resin, phenol type novolac epoxy resin, o-cresol type novolac epoxy resin, bisphenol-A phenolic type epoxy resin, isophthalic two Epoxy resin, the isocyanate-modified ring of phenol-type epoxy resin, dicyclopentadiene or bicyclic alkenes and phenolic condensation resin One or both of oxygen resin, glycolylurea epoxide resin, tricyanic epoxy resin and para-aminophenol epoxy resin mix Close object；
The phenol-formaldehyde resin modified be Effect of Organosilicon-modified Phenol-formaldehyde Resin, benzoxazine phenol-formaldehyde resin modified, boron modified phenolic resin, The mixture of one or both of dimethylbenzene phenol-formaldehyde resin modified and diphenyletherformalde-hyde resin；
The curing agent is 4,4- diaminodiphenylmethane, 4,4- diaminodiphenylsulfones, m-phenylene diamine (MPD), dicyandiamide, low molecular weight polycaprolactone The mixture of one or both of amide and m-xylene diamine；
The inorganic particle is aluminium hydroxide, silica, titanium dioxide, montmorillonite, vermiculite, talcum powder, boron nitride, oxidation The mixture of one or both of magnesium and aluminium oxide；
The accelerating agent is 2-methylimidazole, 2-ethyl-4-methylimidazole, N, N- dimethyl benzylamines, boron trifluoride ethylamine, three second The mixture of one or both of amine, pregnancy urotropine and aluminium acetylacetonate；
The solvent is toluene, dimethylbenzene, dimethylacetylamide, glycol dimethyl ether, ethylene glycol ether acetate, propylene glycol first One or both of ether, methyl ethyl ketone, cyclohexanone, methyl acetate, butanone, acetone, N,N-dimethylformamide and ethyl alcohol with On mixture.
2. aramid fiber carpet veneer pressing plate as described in claim 1, it is characterized in that：The resistance to electric trace resin aramid fiber of the high intensity In felt prepreg, the weight percent of resin semi-solid preparation object is 25%~65%, the weight percent of aramid fiber felt be 35%~ 75%。
3. aramid fiber carpet veneer pressing plate as described in claim 1 or 2, it is characterized in that：The resistance to electric trace resin gluing of the high intensity The preparation method of agent is：At room temperature, high-temperature-resistant epoxy resin, phenol-formaldehyde resin modified are added in glue tank, at 70 DEG C~130 DEG C At a temperature of stir 0.5 hour~2.5 hours after, inorganic particle, curing agent and solvent is added, stirs 0.17 hour~1 hour, The molding time of accelerating agent adjustment glue is added, sampling tests the molding time of glue with the small skill in using a kitchen knife in cookery, in 180 DEG C of hot plate items Under part, when the molding between between 360 seconds~512 seconds when, the resistance to electric trace Resin adhesive of high intensity, which is prepared, to be finished, and height is obtained The resistance to electric trace Resin adhesive of intensity.
4. a kind of preparation method of aramid fiber carpet veneer pressing plate, it is characterized by including the following steps：
A, the resistance to electric trace Resin adhesive of high intensity is prepared：
（a）Dispensing：By 20~55 parts by weight of high-temperature-resistant epoxy resin, 25~60 parts by weight of phenol-formaldehyde resin modified, curing agent 3~35 The parts by weight group of parts by weight, 125~170 parts by weight of 5~35 parts by weight of inorganic particle, 0.01~1 parts by weight of accelerating agent and solvent At taking each component raw material；
The high-temperature-resistant epoxy resin is bisphenol A type epoxy resin, bisphenol f type epoxy resin, polybutadiene epoxy resin, biphenyl Type epoxy resin, phenol type novolac epoxy resin, o-cresol type novolac epoxy resin, bisphenol-A phenolic type epoxy resin, isophthalic two Epoxy resin, the isocyanate-modified ring of phenol-type epoxy resin, dicyclopentadiene or bicyclic alkenes and phenolic condensation resin One or both of oxygen resin, glycolylurea epoxide resin, tricyanic epoxy resin and para-aminophenol epoxy resin mix Close object；
The phenol-formaldehyde resin modified be Effect of Organosilicon-modified Phenol-formaldehyde Resin, benzoxazine phenol-formaldehyde resin modified, boron modified phenolic resin, The mixture of one or both of dimethylbenzene phenol-formaldehyde resin modified and diphenyletherformalde-hyde resin；
The curing agent is 4,4- diaminodiphenylmethane, 4,4- diaminodiphenylsulfones, m-phenylene diamine (MPD), dicyandiamide, low molecular weight polycaprolactone The mixture of one or both of amide and m-xylene diamine；
The inorganic particle is aluminium hydroxide, silica, titanium dioxide, montmorillonite, vermiculite, talcum powder, boron nitride, oxidation The mixture of one or both of magnesium and aluminium oxide；
The accelerating agent is 2-methylimidazole, 2-ethyl-4-methylimidazole, N, N- dimethyl benzylamines, boron trifluoride ethylamine, three second The mixture of one or both of amine, pregnancy urotropine and aluminium acetylacetonate；
The solvent is toluene, dimethylbenzene, dimethylacetylamide, glycol dimethyl ether, ethylene glycol ether acetate, propylene glycol first One or both of ether, methyl ethyl ketone, cyclohexanone, methyl acetate, butanone, acetone, N,N-dimethylformamide and ethyl alcohol with On mixture；
（b）At room temperature, high-temperature-resistant epoxy resin, phenol-formaldehyde resin modified are added in glue tank, at a temperature of 70 DEG C~130 DEG C After stirring 0.5 hour~2.5 hours, inorganic particle, curing agent and solvent is added, stirs 0.17 hour~1 hour, adds rush The molding time of glue is adjusted into agent, sampling is tested the molding time of glue with the small skill in using a kitchen knife in cookery, under the conditions of 180 DEG C of hot plates, treated as When the type time is between 360 seconds~512 seconds, the resistance to electric trace Resin adhesive of high intensity, which is prepared, to be finished, and the resistance to electricity of high intensity is obtained Trace Resin adhesive；
B, the resistance to electric trace resin aramid fiber felt prepreg of high intensity is prepared：
By aramid fiber felt by horizontal gluing machine impregnate or spraying process a described in the resistance to electric trace Resin adhesive of high intensity, and pass through The drying tunnel preliminary drying of gluing machine is crossed, the long 24m of gluing machine drying tunnel is divided into 4 sections, every section of 6m, and stoving temperature range is 105 DEG C~165 DEG C, the speed of gluing machine obtains the resistance to electric trace resin aramid fiber felt prepreg of high intensity in 4~18m/min；
The aramid fiber felt is that aramid fiber chopped mat, aramid fiber stitch-bonded felt, aramid fiber surface felt, aramid fiber are continuous The mixture of one or more of felt and aramid fiber composite felt；
C, aramid fiber carpet veneer pressing plate is suppressed：
The resistance to electric trace resin aramid fiber felt prepreg of high intensity is taken, required ruler is cut by aramid fiber carpet veneer sheeting process requirement It is very little, by the resistance to electric one or more layers overlapping of trace resin aramid fiber felt prepreg material of the high intensity be placed in two sides be coated with it is de- On the smooth stainless-steel sheet of mould agent, it is sent into common hot press or vacuum hotpressing machine, temperature is controlled in 130 DEG C~175 DEG C, pressure Control is hot-forming under conditions of 1 MPa~30MPa, according to thickness 1mm~150mm of laminate after molding, determines hot pressing Molding time obtains aramid fiber carpet veneer pressing plate within the scope of 0.5h~50h.
5. by the preparation method of aramid fiber carpet veneer pressing plate described in claim 4, it is characterized in that：High intensity is made described in step b In resistance to electricity trace resin aramid fiber felt prepreg, the weight percent of resin semi-solid preparation object is 25%~65%, aramid fiber felt Weight percent is 35%~75%.
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