CN110670415A - High-density aramid fiber paper laminated board and preparation method thereof - Google Patents

High-density aramid fiber paper laminated board and preparation method thereof Download PDF

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Publication number
CN110670415A
CN110670415A CN201910917159.2A CN201910917159A CN110670415A CN 110670415 A CN110670415 A CN 110670415A CN 201910917159 A CN201910917159 A CN 201910917159A CN 110670415 A CN110670415 A CN 110670415A
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China
Prior art keywords
aramid fiber
fiber paper
density
parts
laminated board
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CN201910917159.2A
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Chinese (zh)
Inventor
杜旻
王炳生
黄洪驰
刘锋
师强
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Sichuan Dongdiao Science And Technology Group Co Ltd
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Sichuan Dongdiao Science And Technology Group Co Ltd
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Priority to CN201910917159.2A priority Critical patent/CN110670415A/en
Publication of CN110670415A publication Critical patent/CN110670415A/en
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    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/30—Multi-ply
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31F—MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31F5/00—Attaching together sheets, strips or webs; Reinforcing edges
    • B31F5/04—Attaching together sheets, strips or webs; Reinforcing edges by exclusive use of adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
    • D21H13/10—Organic non-cellulose fibres
    • D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H13/26—Polyamides; Polyimides
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H15/00—Pulp or paper, comprising fibres or web-forming material characterised by features other than their chemical constitution
    • D21H15/02—Pulp or paper, comprising fibres or web-forming material characterised by features other than their chemical constitution characterised by configuration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/26—All layers being made of paper or paperboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/028—Paper layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B32B2262/0269—Aromatic polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/72—Density
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

The invention discloses a high-density aramid fiber paper laminated board and a preparation method thereof, wherein the high-density aramid fiber paper laminated board is an insulating board prepared by one or more layers of overlapped aramid fiber paper prepregs soaked with special resin adhesives through hot press molding at the temperature of 170-190 ℃ and the pressure of 1-24 MPa. The density of the high-density aramid fiber paper laminated board is 1.10g/cm3～1.21g/cm3The longitudinal tensile strength is 116 KN/m-125 KN/m, the transverse tensile strength is 95 KN/m-98 KN/m, the breakdown voltage in the transformer oil at 90 ℃ is 75 KV-85 KV, and the tensile strength and the electrical property are good; the high-density aramid fiber paper laminated board is suitable for the fields of various engineering equipment, electrical equipment and the like such as aerospace, rail transit, large-scale power generation equipment and the like.

Description

High-density aramid fiber paper laminated board and preparation method thereof
Technical Field
The invention belongs to a laminated board and preparation thereof, and particularly relates to a high-density aramid fiber paper laminated board and a preparation method thereof. The high-density aramid fiber paper laminated board prepared by the invention is suitable for being used as an electric insulation laminated board, and is particularly suitable for the fields of various engineering equipment, electrical equipment and the like with special purposes (aviation, aerospace, rail transit, wind power generation and the like).
Background
With the continuous and rapid increase of national electricity consumption, stricter requirements are provided for the effective maximum working load, the real-time working efficiency, the maintenance and the repair in the use process, the safety, the environmental protection performance and the like of power transmission/transformation equipment, particularly oil immersed transformers which are mostly used outdoors. The insulating material is used as an important support for internal overvoltage guarantee, and the requirements on the performance of the related matched insulating material are improved in a crossing mode.
High density (density 1.10 g/cm)3～1.21g/cm3) The aramid fiber paper laminated board is widely applied to special purposes (aerospace, rail transit and large-scale power generation) due to compact structure, high strength, good transformer oil resistance, outstanding flame retardance and excellent electrical performanceEquipment, etc.) in various engineering equipment, large-scale electrical equipment, etc. However, in the prior art, the high-density aramid fiber paper board is mostly formed for many times by stages at high temperature (more than 300 ℃) and high pressure (more than 35MPa), the forming process is complex, special assembly line type equipment is needed, and the requirement on the equipment is extremely high, and if the high-density aramid fiber paper board is produced at low temperature (100 ℃ -200 ℃) and medium pressure (10 MPa-25 MPa), the prepared board has poor interlayer adhesion force, is easy to delaminate after being bent, has an insufficiently compact structure, has large water residual quantity in the prepared board due to the fact that raw paper contains a large amount of water in the production process, cannot meet the use requirement in a long-term high-temperature transformer oil field, and is easy to absorb moisture to generate mildew, so how to solve the existing technical problems is how, and the high-density aramid fiber paper board becomes the.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a high-density aramid fiber paper laminated board and a preparation method thereof. The invention adopts the aramid fiber paper as the raw material, and the aramid fiber paper is pressed and formed at the medium temperature (170-190 ℃) and the medium and low pressure (1-24 MPa) at one time, thereby providing the high-density aramid fiber paper laminated board with good tensile strength and electrical property and the preparation method thereof, so as to meet the requirements of the fields of aerospace, rail transit, large-scale power generation equipment and the like on the high-performance laminated board.
The content of the invention is as follows: the utility model provides a high density aramid fiber paper laminate which characterized by: the high-density aramid fiber paper laminated board is one or more layers of overlapped aramid fiber paper prepreg soaked with special resin adhesive, and is prepared by one-step hot press molding under the conditions of the temperature of 170-190 ℃ (medium temperature) and the pressure of 1-24 MPa (medium and low pressure);
the aramid fiber paper prepreg is prepared by coating aramid fiber paper with the special resin adhesive through a horizontal gluing machine, then passing through a gluing machine drying channel which is 24m long and is divided into 4 sections and 6m sections, and pre-drying the aramid fiber paper at the (baking) temperature of 90-180 ℃ and the vehicle speed of 1.0-6.0 m/min;
the special resin adhesive is prepared by mixing 20-45 parts by weight of high-temperature-resistant epoxy resin, 15-40 parts by weight of modified phenolic resin, 6-32 parts by weight of curing agent, 15-32 parts by weight of inorganic powder, 0.1-2 parts by weight of accelerator and 350-450 parts by weight of solvent;
the high-temperature-resistant epoxy resin is hydantoin epoxy resin (the product providing enterprise and product brand can be CY350, Izoda; 28906, Jialong biotechnology; HY-070, Taijixin new wood), dicyclopentadiene or dicyclopentadiene and phenolic polycondensation resin (the product providing enterprise and product brand can be DNE260A75, Tiangao New technology; HP-72000, Jiashend; Picco2100, Islam), bisphenol A epoxy resin (the product providing enterprise and product brand can be E-44/E-51, Balingite; DER-331, Dow; YDH3000, Aditya Birla), biphenyl epoxy resin (the product providing enterprise and product brand can be NC-3000, Jia, Yuded; YX-4000, Mitsubishi; TMBP, Laiwu new wood), o-cresol type phenolic epoxy resin (the product providing enterprise and product brand can be EPON-678, a shell; NPCN-704, southern taiwan; SQCN700, holy spring chemical) or a mixture of two;
the modified phenolic resin is one or a mixture of two of organic silicon modified phenolic resin (product providing enterprises and product brands can be self-made by an applicant), boron modified phenolic resin (product providing enterprises and product brands can be self-made by the applicant), and benzoxazine modified phenolic resin (product providing enterprises and product brands can be self-made by the applicant);
the curing agent is one or a mixture of two of 4, 4-diaminodiphenylmethane, 4-diaminodiphenyl sulfone, m-phenylenediamine and dicyandiamide;
the inorganic powder is one or a mixture of two of nano silicon dioxide, nano montmorillonite, nano vermiculite and nano talcum powder;
the accelerant is one or a mixture of two of 2-methylimidazole, 2-ethyl-4-methylimidazole, boron trifluoride ethylamine, hexamethyltetramine and aluminum acetylacetonate;
the solvent is one or a mixture of more than two of butanone, acetone, glycol and ethanol.
The invention comprises the following steps: the aramid fiber paper comprises the following components in percentage by weight: the chopped aramid fiber is 1: 1-2, and the surface density is 10g/m2～50g/m2The water content (namely the weight percentage content of water) is 0.5 to 5 percent, and the high molecular structure repeating unit of the aramid fiber is
Figure BDA0002216447810000031
The aramid fiber paper can be the aramid fiber paper purchased in the market at home and abroad.
The invention comprises the following steps: the density of the prepared high-density aramid fiber paper laminated board is 1.10g/cm3～1.21g/cm3The thickness of the plate is 1 mm-6 mm, the longitudinal tensile strength is 116 KN/m-125 KN/m, the transverse tensile strength is 95 KN/m-98 KN/m, and the breakdown voltage in the 90 ℃ transformer oil is 75 KV-85 KV.
The invention comprises the following steps: the one-layer or more-layer overlapped aramid fiber paper prepreg soaked with the special resin adhesive is better as follows: 1-350 layers of overlapped aramid fiber paper prepreg soaked with special resin adhesive.
The invention comprises the following steps: the high-density aramid fiber paper laminated board prepared by (once) hot press molding under the conditions of the temperature of 170-190 ℃ (medium temperature) and the pressure of 1-24 MPa (medium and low pressure) is better as follows: under the conditions of 170-190 ℃ (medium temperature) and 1-24 MPa (medium and low pressure), the high-density aramid fiber paper laminated board is prepared after (once) hot press molding within 1-5 h according to the thickness of the high-density aramid fiber paper laminated board prepared after molding and 1-6 mm of the high-density aramid fiber paper laminated board.
Another aspect of the invention is: a preparation method of a high-density aramid fiber paper laminated board is characterized by comprising the following steps:
a. preparing a special resin adhesive:
at room temperature, sequentially adding 20-45 parts by weight of high-temperature-resistant epoxy resin, 15-40 parts by weight of modified phenolic resin and 15-32 parts by weight of inorganic powder into a glue preparation tank, stirring for 1.5-2.5 hours, adding 6-32 parts by weight of curing agent and 350-450 parts by weight of solvent, stirring for 0.5-2 hours, adding 0.1-2 parts by weight of accelerator, adjusting the forming time of glue solution, sampling, testing the forming time of the glue solution by using a knife method, and completing preparation of the special resin adhesive when the forming time is 250-440 seconds under the condition of a hot plate at 180 ℃;
the high-temperature-resistant epoxy resin is hydantoin epoxy resin (the product providing enterprise and product brand can be CY350, Izoda; 28906, Jialong biotechnology; HY-070, Taijixin new wood), dicyclopentadiene or dicyclopentadiene and phenolic polycondensation resin (the product providing enterprise and product brand can be DNE260A75, Tiangao New technology; HP-72000, Jiashend; Picco2100, Islam), bisphenol A epoxy resin (the product providing enterprise and product brand can be E-44/E-51, Balingite; DER-331, Dow; YDH3000, Aditya Birla), biphenyl epoxy resin (the product providing enterprise and product brand can be NC-3000, Jia, Yuded; YX-4000, Mitsubishi; TMBP, Laiwu new wood), o-cresol type phenolic epoxy resin (the product providing enterprise and product brand can be EPON-678, a shell; NPCN-704, southern taiwan; SQCN700, holy spring chemical) or a mixture of two;
the modified phenolic resin is one or a mixture of two of organic silicon modified phenolic resin (product providing enterprises and product brands can be self-made by an applicant), boron modified phenolic resin (product providing enterprises and product brands can be self-made by the applicant), and benzoxazine modified phenolic resin (product providing enterprises and product brands can be self-made by the applicant);
the curing agent is one or a mixture of two of 4, 4-diaminodiphenylmethane, 4-diaminodiphenyl sulfone, m-phenylenediamine and dicyandiamide;
the inorganic powder is one or a mixture of two of nano silicon dioxide, nano montmorillonite, nano vermiculite and nano talcum powder;
the accelerant is one or a mixture of two of 2-methylimidazole, 2-ethyl-4-methylimidazole, boron trifluoride ethylamine, hexamethyltetramine and aluminum acetylacetonate;
the solvent is one or a mixture of more than two of butanone, acetone, glycol and ethanol;
b. preparing aramid fiber paper prepreg:
taking aramid fiber paper, coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, then passing through a gluing machine drying channel which is 24m long and is divided into 4 sections and 6m in each section, and pre-drying under the conditions that the (baking) temperature is 90-180 ℃ and the vehicle speed is 1.0-6.0 m/min to obtain an aramid fiber paper prepreg;
c. pressing a high-density aramid fiber paper laminated board:
taking aramid fiber paper prepreg (cut into required size according to the technological requirement of the high-density aramid fiber paper laminated board), overlapping one or more layers of aramid fiber paper prepreg on a smooth stainless steel plate with demolding films laid on two surfaces, sending the aramid fiber paper prepreg into a hot press (which can be a common hot press or a vacuum hot press), controlling the temperature to be 170-190 ℃ and the pressure to be 1-24 MPa, and carrying out hot press molding to obtain the high-density aramid fiber paper laminated board.
In another aspect of the invention: the aramid fiber paper in the step b comprises the following components in parts by weight: the chopped aramid fiber is 1: 1-2, and the surface density is 10g/m2～50g/m2The water content (namely the weight percentage content of water) is 0.5 to 5 percent, and the high molecular structure repeating unit of the aramid fiber isThe aramid fiber paper.
In another aspect of the invention: and c, performing hot press molding under the conditions that the temperature is controlled to be 170-190 ℃ and the pressure is 1-24 MPa to obtain the high-density aramid fiber paper laminated board, wherein the process comprises the following steps: controlling the temperature to be 170-190 ℃ and the pressure to be 1-24 MPa, carrying out hot press molding, and determining the hot press molding time to be within 1-5 h according to the thickness of the high-density aramid fiber paper laminated board after molding to obtain the high-density aramid fiber paper laminated board with the thickness of 1-6 mm.
In another aspect of the invention: in the step c, one or more layers of aramid fiber paper prepreg are overlapped, preferably: and (3) overlapping 1-350 layers of aramid fiber paper prepreg.
In another aspect of the invention: the density of the high-density aramid fiber paper laminated board prepared in the step c is 1.10g/cm3～1.21g/cm3The longitudinal tensile strength is 116 KN/m-125 KN/m, the transverse tensile strength is 95 KN/m-98 KN/m, and the breakdown voltage in the 90 ℃ transformer oil is 75 KV-85 KV.
Compared with the prior art, the invention has the following characteristics and beneficial effects:
(1) the aramid paper prepreg is subjected to one-step compression molding by a common laminating process of medium temperature/medium pressure (170-190 ℃/1-24 MPa). The method breaks through a 2-step forming mode that the traditional aramid fiber paper board is made of paper pulp as a raw material, the pressing process is from low temperature to high temperature and from low pressure to high pressure, the paper pulp is carded and humidified by a special device in the preparation process, and the pressing mode of high temperature (more than or equal to 300 ℃) and high pressure (more than or equal to 35MPa) requires special customized pressing equipment, so that the whole preparation process is multiple and complex in working procedures;
(2) by adopting the invention, high density (density is 1.10 g/cm)3～1.21g/cm3) The aramid fiber paper laminated board has high tensile strength, electrical strength in the transformer oil at high temperature and extremely low board water content, and can more strictly meet the use requirements in the transformer oil field with long-term high temperature; for a 1mm thick plate, the test data for the examples show: the longitudinal tensile strength is 116MPa, the transverse tensile strength is 95MPa, the breakdown voltage in oil temperature of 90 ℃ is 75KV, and the water content is 0.46% (the data is a test universal value); the technical problem that the aramid paper laminated board which can meet the requirements of tensile strength (longitudinal strength is more than or equal to 90MPa, and transverse strength is more than or equal to 80MPa), electrical strength (breakdown voltage in 90 ℃ transformer oil is more than or equal to 45KV) and the like and can be used in a high-temperature transformer oil field for a long time can not be prepared by adopting common flat pressing equipment is solved;
(3) the high-density aramid fiber paper laminated board product has the advantages of simple preparation process, simple and convenient process, easy operation and excellent product quality, reduces the production cost, meets the requirements on insulating materials in the fields of various engineering equipment, electrical equipment and the like with special purposes (aerospace, rail transit, large-scale power generation), and has obvious practical use value and application prospect and strong practicability.
Detailed Description
The following examples are intended to further illustrate the present invention and should not be construed as limiting the scope of the invention, which is intended to be covered by the claims appended hereto.
The amounts of each ingredient component material in the following examples are in parts by weight (e.g., grams or kilograms).
Preparation of first part of special resin adhesive
Example 1-1:
at room temperature, 32 parts of dicyclopentadiene or dicyclo diene and phenolic aldehyde polycondensation resin epoxy resin, 29 parts of boron modified phenolic resin and 25 parts of nano talcum powder are respectively added into a glue preparation tank, stirred for 2.5 hours, then added with 29 parts of curing agent 4, 4-diaminodiphenylmethane and 410 parts of acetone, stirred for 1.25 hours, fully dispersed uniformly, added with 0.5 part of accelerant 2-methylimidazole to adjust the forming time of the glue solution, sampled, and tested by a knife method for the forming time (180 ℃ hot plate 392 seconds), and the glue solution is prepared.
Examples 1 to 2:
at room temperature, 20 parts of o-cresol novolac epoxy resin, 15 parts of benzoxazine modified phenolic resin and 21 parts of nano montmorillonite are respectively added into a glue preparation tank, stirred for 1.75 hours, then added with 23 parts of curing agent 4, 4-diaminodiphenyl sulfone and 375 parts of ethanol, stirred for 1 hour, fully dispersed uniformly, added with 1 part of accelerator aluminum acetylacetonate to adjust the forming time of the glue solution, sampled, and tested by a knife method for 431 seconds, and the glue solution is prepared.
Examples 1 to 3:
adding 25 parts of hydantoin epoxy resin, 25 parts of organic silicon modified phenolic resin and 32 parts of nano vermiculite into a glue preparation tank respectively at room temperature, stirring for 2.5 hours, adding 8 parts of curing agent m-phenylenediamine and 370 parts of butanone, stirring for 0.75 hour to fully disperse the materials uniformly, adding 0.1 part of accelerator 2-ethyl-4-methylimidazole to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by a knife method (a hot plate at 180 ℃) for 440 seconds, and finishing the preparation of the glue solution.
Examples 1 to 4:
at room temperature, 22 parts of biphenyl epoxy resin, 16 parts of benzoxazine modified phenolic resin and 17 parts of nano silicon dioxide are respectively added into a glue preparation tank, stirred for 1.5 hours, then added with 9 parts of curing agent 4, 4-diaminodiphenylmethane and 350 parts of acetone, stirred for 1 hour to be fully dispersed uniformly, added with 1.4 parts of accelerator aluminum acetylacetonate to adjust the forming time of glue solution, sampled, and tested by a knife method for 415 seconds, and the glue solution is prepared.
Examples 1 to 5:
at room temperature, 12 parts of bisphenol A epoxy resin, 25 parts of hydantoin epoxy resin, 28 parts of organic silicon modified phenolic resin and 23 parts of nano talcum powder are respectively added into a glue preparation tank, stirred for 2 hours, then added with 22 parts of curing agent 4, 4-diaminodiphenyl sulfone and 410 parts of ethylene glycol, stirred for 1.25 hours, fully dispersed uniformly, added with 0.3 part of accelerant 2-ethyl-4-methylimidazole to adjust the forming time of glue solution, sampled, and tested by a knife method for the forming time (180 ℃ hot plate) of the glue solution for 367 seconds, thus finishing the preparation of the glue solution.
Examples 1 to 6:
respectively adding 16 parts of o-cresol novolac epoxy resin, 10 parts of bisphenol A epoxy resin, 27 parts of benzoxazine modified phenolic resin and 15 parts of nano silicon dioxide into a glue preparation tank at room temperature, stirring for 2.25 hours, adding 6 parts of curing agent m-phenylenediamine and 372 parts of ethanol, stirring for 0.5 hour, fully and uniformly dispersing, adding 0.5 part of accelerator aluminum acetylacetonate to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by a knife method (a 180 ℃ hot plate) for 359 seconds, and finishing the preparation of the glue solution.
Examples 1 to 7:
at room temperature, respectively adding 23 parts of dicyclopentadiene or dicyclo diene and phenolic aldehyde polycondensation resin epoxy resin, 19 parts of biphenyl epoxy resin, 16 parts of organic silicon modified phenolic resin and 24 parts of nano montmorillonite into a glue preparation tank, stirring for 2 hours, adding 8 parts of curing agent m-phenylenediamine, 9 parts of 4, 4-diamino diphenyl sulfone and 440 parts of butanone, stirring for 1 hour to fully disperse uniformly, adding 0.6 part of accelerator 2-ethyl-4-methylimidazole to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by a knife method (a hot plate at 180 ℃) for 307 seconds, and finishing the preparation of the glue solution.
Examples 1 to 8:
at room temperature, 12 parts of hydantoin epoxy resin, 22 parts of o-cresol novolac epoxy resin, 16 parts of organic silicon modified phenolic resin and 23 parts of nano talcum powder are respectively added into a glue preparation tank, stirred for 2 hours, then added with 8 parts of curing agent 4, 4-diaminodiphenyl sulfone, 3 parts of dicyandiamide and 357 parts of acetone, stirred for 1 hour to be fully dispersed uniformly, added with 0.5 part of accelerant acetylacetone aluminum to adjust the forming time of glue solution, sampled, and tested by a knife method for the forming time (180 ℃ hot plate) for 372 seconds, and the glue solution is prepared.
Examples 1 to 9:
adding 16 parts of hydantoin epoxy resin, 8 parts of bisphenol A epoxy resin, 21 parts of biphenyl epoxy resin, 12 parts of boron modified phenolic resin, 16 parts of benzoxazine modified phenolic resin and 21 parts of nano vermiculite into a glue preparation tank respectively at room temperature, stirring for 2.5 hours, adding 23 parts of curing agent 4, 4-diaminodiphenyl sulfone, 2 parts of m-phenylenediamine and 230 parts of acetone and 200 parts of ethylene glycol, stirring for 1.5 hours to fully and uniformly disperse the materials, adding 0.5 part of accelerant 2-methylimidazole and 0.3 part of boron trifluoride ethylamine to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method (a hot plate at 180 ℃) for 283 seconds, and finishing the glue solution preparation.
Examples 1 to 10:
at room temperature, 14 parts of hydantoin epoxy resin, 5 parts of bisphenol A epoxy resin, 16 parts of biphenyl epoxy resin, 24 parts of organic silicon modified phenolic resin, 7 parts of boron modified phenolic resin and 22 parts of nano montmorillonite are respectively added into a glue preparation tank, stirred for 1.5 hours, then added with 30 parts of curing agent 4, 4-diaminodiphenylmethane, 2 parts of m-phenylenediamine, 250 parts of glycol and 150 parts of butanone, stirred for 1.75 hours to be fully and uniformly dispersed, added with 0.9 part of accelerant aluminum acetylacetonate and 0.2 part of 2-ethyl-4-methylimidazole to adjust the forming time of the glue solution, sampled, tested by a knife method for 250 seconds of the forming time (a hot plate at 180 ℃) of the glue solution, and the glue solution is prepared.
Examples 1 to 11:
at room temperature, 7 parts of bisphenol A epoxy resin, 19 parts of biphenyl epoxy resin, 14 parts of o-cresol novolac epoxy resin, 18 parts of boron modified phenolic resin, 22 parts of benzoxazine modified phenolic resin, 12 parts of nano silicon dioxide and 14 parts of nano talcum powder are respectively added into a glue preparation tank, stirred for 2.25 hours, then added with 8 parts of curing agent 4, 4-diaminodiphenyl sulfone, 2 parts of m-phenylenediamine, 2 parts of dicyandiamide, 260 parts of ethylene glycol and 170 parts of ethanol, stirred for 0.75 hours, added with 0.3 part of accelerator hexamethyl tetramine and 0.5 part of aluminum acetylacetonate after being fully dispersed uniformly, sampled, tested for 355 seconds by a knife method, and the glue is prepared.
Examples 1 to 12:
at room temperature, 13 parts of dicyclopentadiene or dicyclo diene and phenolic aldehyde polycondensation resin epoxy resin, 8 parts of bisphenol A epoxy resin, 17 parts of biphenyl epoxy resin, 12 parts of organosilicon modified phenolic resin, 18 parts of benzoxazine modified phenolic resin, 14 parts of nano montmorillonite and 8 parts of nano talcum powder are respectively added into a glue preparation tank, after stirring for 1.5 hours, 3 parts of curing agent 4, 4-diaminodiphenylmethane, 3 parts of 4, 4-diaminodiphenylsulfone, 2 parts of m-phenylenediamine, 200 parts of ethanol and 250 parts of acetone are added, stirring is carried out for 2 hours, after the curing agent is fully and uniformly dispersed, 0.5 part of accelerant 2-ethyl-4-methylimidazole and 1.5 parts of boron trifluoride ethylamine are added to adjust the molding time of the glue solution, sampling is carried out, and the molding time (180 ℃ hot plate) tested by a knife glue solution method is 285 seconds, so that the glue solution is completely prepared.
Preparation of second part aramid fiber paper prepreg
Example 2-1:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the high-temperature-resistant epoxy resin, the modified phenolic resin and the inorganic powder with the formula amount into a glue preparation tank at room temperature, stirring for 2.5 hours, adding a curing agent and a solvent, stirring for 1.25 hours to fully and uniformly disperse the mixture, adding an accelerant to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 392 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 45g/m of 1:22Dipping or spraying the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, and pre-drying the aramid fiber paper through a drying tunnel of the gluing machine, wherein the drying tunnel of the gluing machine is 24m long and is divided into 4 sections and 6m sections, the baking temperature range is 90-180 ℃, and the speed of the gluing machine is 2.5m/min, so that the aramid fiber paper prepreg is prepared; indexes of the fiber paper prepreg are as follows: the fluidity is 19mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
Example 2-2:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the formula amount of high-temperature-resistant epoxy resin, modified phenolic resin and inorganic powder into a glue preparation tank at room temperature, stirring for 1.75 hours, adding a curing agent and a solvent, stirring for 1 hour to fully and uniformly disperse the mixture, adding an accelerant to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 431 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 45g/m of 1:12Coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, and pre-drying the aramid fiber paper through a drying channel of the gluing machine, wherein the drying channel of the gluing machine is 24m long and is divided into 4 sections and 6m in each section, the drying temperature range is 90-180 ℃, and the speed of the gluing machine is 1.5m/min, so that the aramid fiber paper is preparedPrepreg of the cellophane; indexes of the fiber paper prepreg are as follows: the fluidity is 23mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
Examples 2 to 3:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the formula amount of high-temperature-resistant epoxy resin, modified phenolic resin and inorganic powder into a glue preparation tank at room temperature, stirring for 2.5 hours, adding a curing agent and a solvent, stirring for 0.75 hour to fully and uniformly disperse the mixture, adding an accelerant to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 440 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 50g/m of 1:12Coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, and pre-drying the aramid fiber paper through a drying tunnel of the gluing machine, wherein the drying tunnel of the gluing machine is 24m long and is divided into 4 sections and 6m sections, the drying temperature range is 90-180 ℃, and the speed of the gluing machine is 1m/min, so that the aramid fiber paper prepreg is prepared; indexes of the fiber paper prepreg are as follows: the fluidity is 21mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
Examples 2 to 4:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the formula amount of high-temperature-resistant epoxy resin, modified phenolic resin and inorganic powder into a glue preparation tank at room temperature, stirring for 1.5 hours, adding a curing agent and a solvent, stirring for 1 hour to fully and uniformly disperse the mixture, adding an accelerant to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 415 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 35g/m of 1:12Coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, and pre-drying the aramid fiber paper through a drying tunnel of the gluing machine, wherein the drying tunnel of the gluing machine is 24m long and is divided into 4 sections and 6m sections, the drying temperature range is 90-180 ℃, and the speed of the gluing machine is 2m/min, so that the aramid fiber paper prepreg is prepared; indexes of the fiber paper prepreg are as follows: the fluidity is 21mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
Examples 2 to 5:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the formula amount of high-temperature-resistant epoxy resin, modified phenolic resin and inorganic powder into a glue preparation tank at room temperature, stirring for 2 hours, adding a curing agent and a solvent, stirring for 1.25 hours to fully and uniformly disperse the materials, adding an accelerant, adjusting the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 367 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 35g/m of 1:22Coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, and pre-drying the aramid fiber paper through a drying tunnel of the gluing machine, wherein the drying tunnel of the gluing machine is 24m long and is divided into 4 sections and 6m in each section, the baking temperature range is 90-180 ℃, and the speed of the gluing machine is 3.5m/min, so that the aramid fiber paper prepreg is prepared; indexes of the fiber paper prepreg are as follows: the fluidity is 17mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
Examples 2 to 6:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the formula amount of high-temperature-resistant epoxy resin, modified phenolic resin and inorganic powder into a glue preparation tank at room temperature, stirring for 2.25 hours, adding a curing agent and a solvent, stirring for 0.5 hour to fully and uniformly disperse the mixture, adding an accelerant to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 359 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 25g/m of 1:12Coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, and pre-drying the aramid fiber paper through a drying tunnel of the gluing machine, wherein the drying tunnel of the gluing machine is 24m long and is divided into 4 sections and 6m in each section, the drying temperature range is 90-180 ℃, and the speed of the gluing machine is 4m/min, so that the aramid fiber paper prepreg is prepared; indexes of the fiber paper prepreg are as follows: the fluidity is 17mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
Examples 2 to 7:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the formula amount of high-temperature-resistant epoxy resin, modified phenolic resin and inorganic powder into a glue preparation tank at room temperature, stirring for 2 hours, adding a curing agent and a solvent, stirring for 1 hour to fully and uniformly disperse the mixture, adding an accelerant to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 307 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 1:2 of 10g/m2Coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, and pre-drying the aramid fiber paper through a drying tunnel of the gluing machine, wherein the drying tunnel of the gluing machine is 24m long and is divided into 4 sections and 6m in each section, the baking temperature range is 90-180 ℃, and the speed of the gluing machine is 4.5m/min, so that the aramid fiber paper prepreg is prepared; indexes of the fiber paper prepreg are as follows: the fluidity is 16mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
Examples 2 to 8:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the formula amount of high-temperature-resistant epoxy resin, modified phenolic resin and inorganic powder into a glue preparation tank at room temperature, stirring for 2 hours, adding a curing agent and a solvent, stirring for 1 hour to fully and uniformly disperse the mixture, adding an accelerant to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 372 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 35g/m of 1:22Coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, and pre-drying the aramid fiber paper through a drying tunnel of the gluing machine, wherein the drying tunnel of the gluing machine is 24m long and is divided into 4 sections and 6m in each section, the baking temperature range is 90-180 ℃, and the speed of the gluing machine is 3m/min, so that the aramid fiber paper prepreg is prepared; indexes of the fiber paper prepreg are as follows: the fluidity is 18mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
Examples 2 to 9:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the formula amount of high-temperature-resistant epoxy resin, modified phenolic resin and inorganic powder into a glue preparation tank at room temperature, stirring for 2.5 hours, adding a curing agent and a solvent, stirring for 1.5 hours to fully and uniformly disperse the mixture, adding an accelerant to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 283 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 25g/m of 1:22Coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machinePre-drying the aramid fiber paper by a drying channel of a gluing machine, wherein the drying channel of the gluing machine is 24m long and is divided into 4 sections and 6m each section, the drying temperature range is 90-180 ℃, and the speed of the gluing machine is 5m/min, so that the aramid fiber paper prepreg is prepared; indexes of the fiber paper prepreg are as follows: the fluidity is 16mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
Examples 2 to 10:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the formula amount of high-temperature-resistant epoxy resin, modified phenolic resin and inorganic powder into a glue preparation tank at room temperature, stirring for 1.5 hours, adding a curing agent and a solvent, stirring for 1.75 hours to fully and uniformly disperse the mixture, adding an accelerant to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 250 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 1:1 of 10g/m2Coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, and pre-drying the aramid fiber paper through a drying tunnel of the gluing machine, wherein the drying tunnel of the gluing machine is 24m long and is divided into 4 sections and 6m in each section, the drying temperature range is 90-180 ℃, and the speed of the gluing machine is 6m/min, so that the aramid fiber paper prepreg is prepared; indexes of the fiber paper prepreg are as follows: the fluidity is 15mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
Examples 2 to 11:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the formula amount of high-temperature-resistant epoxy resin, modified phenolic resin and inorganic powder into a glue preparation tank at room temperature, stirring for 2.25 hours, adding a curing agent and a solvent, stirring for 0.75 hour to fully and uniformly disperse the mixture, adding an accelerant, adjusting the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 355 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 35g/m of 1:12Coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, and pre-drying the aramid fiber paper through a drying tunnel of the gluing machine, wherein the drying tunnel of the gluing machine is 24m long and is divided into 4 sections and 6m in each section, the drying temperature range is 90-180 ℃, and the speed of the gluing machine is 4m/min, so that the aramid fiber paper prepreg is prepared; indexes of the fiber paper prepreg are as follows: the fluidity is 17mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
Examples 2 to 12:
a. preparation of special resin adhesive
(a) Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
(b) respectively adding the formula amount of high-temperature-resistant epoxy resin, modified phenolic resin and inorganic powder into a glue preparation tank at room temperature, stirring for 1.5 hours, adding a curing agent and a solvent, stirring for 2 hours to fully and uniformly disperse the mixture, adding an accelerant to adjust the forming time of the glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the glue solution when the forming time is 285 seconds under the condition of a hot plate at 180 ℃;
b. preparation of aramid fiber paper prepreg
And (3) precipitating aramid fibers: the chopped aramid fiber is 45g/m of 1:22Coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, and pre-drying the aramid fiber paper through a drying tunnel of the gluing machine, wherein the drying tunnel of the gluing machine is 24m long and is divided into 4 sections and 6m sections, the drying temperature range is 90-180 ℃, and the speed of the gluing machine is 5m/min, so that the aramid fiber paper prepreg is prepared; indexes of the fiber paper prepreg are as follows: the fluidity is 16mm, the content of soluble resin is more than or equal to 95 percent, and the content of volatile matters is less than or equal to 2 percent.
The following table 1 shows the conditions of the preparation process parameters and the test results of the central control technical indexes of the aramid fiber paper prepreg of the embodiment of the present invention.
Table 1: example aramid fiber paper prepreg preparation process parameters and central control technical indexes
Figure BDA0002216447810000151
Preparation of third part high-density aramid fiber paper laminated board
a. Taking the components of the ingredients, wherein the weight ratio of the ingredients is the same as that of any one of the embodiments 1-12;
b. taking a prepreg, wherein the material components and the weight ratio are the same as those in any one of the embodiments 2-12;
c. example 3-1 to 3-12 pressing of a high-density aramid fiber paper laminate:
cutting the high-density aramid fiber paper laminated board into fiber paper prepreg with required shape and size according to the process requirement of the high-density aramid fiber paper laminated board, overlapping one or more layers of the fiber paper prepreg on a smooth stainless steel plate with demoulding films laid on two surfaces, feeding the fiber paper prepreg into a common hot press or a vacuum hot press, carrying out hot press molding under the conditions that the temperature is controlled to be 170-190 ℃ and the pressure is controlled to be 1-24 MPa, and determining the hot press molding time to be within the range of 1-5 h according to the thickness of the molded laminated board to obtain the high-density aramid fiber paper laminated board.
The following tables 2 and 3 show the parameters of the pressing process of the high-density aramid fiber paper laminated board and the conditions of the technical performance test results of the obtained product according to the embodiment of the invention.
Table 2: pressing process parameters of high-density aramid fiber paper laminated board of example
Figure BDA0002216447810000161
Table 3: results of technical Property testing of the articles obtained in examples
Figure BDA0002216447810000162
Figure BDA0002216447810000171
Example 3:
a high-density aramid fiber paper laminated board is characterized in that the high-density aramid fiber paper laminated board is one or more layers of overlapped aramid fiber paper prepregs soaked with special resin adhesives, and the high-density aramid fiber paper laminated board (insulating board) is prepared by one-step hot press molding at the temperature of 170 ℃ and the pressure of 1 MPa;
the aramid fiber paper prepreg is prepared by coating aramid fiber paper with the special resin adhesive through a horizontal gluing machine, then passing through a gluing machine drying channel which is 24m long and is divided into 4 sections and 6m sections, and pre-drying at the (baking) temperature of 90 ℃ and the vehicle speed of 1.0 m/min;
the special resin adhesive is prepared by mixing 20 parts by weight of high-temperature-resistant epoxy resin, 15 parts by weight of modified phenolic resin, 6 parts by weight of curing agent, 15 parts by weight of inorganic powder, 0.1 part by weight of accelerator and 350 parts by weight of solvent.
Example 4:
a high-density aramid fiber paper laminated board is characterized in that the high-density aramid fiber paper laminated board is one or more layers of overlapped aramid fiber paper prepregs soaked with special resin adhesives, and the high-density aramid fiber paper laminated board (insulating board) is prepared by one-step hot press molding at the temperature of 190 ℃ and the pressure of 24 MPa;
the aramid fiber paper prepreg is prepared by coating aramid fiber paper with the special resin adhesive through a horizontal gluing machine, then passing through a gluing machine drying channel which is 24m long and is divided into 4 sections and 6m sections, and pre-drying the aramid fiber paper at the (baking) temperature of 180 ℃ and the vehicle speed of 6.0 m/min;
the special resin adhesive is prepared by mixing 45 parts by weight of high-temperature-resistant epoxy resin, 40 parts by weight of modified phenolic resin, 32 parts by weight of curing agent, 32 parts by weight of inorganic powder, 2 parts by weight of accelerator and 450 parts by weight of solvent.
Example 5:
a high-density aramid fiber paper laminated board is characterized in that the high-density aramid fiber paper laminated board is one or more layers of overlapped aramid fiber paper prepregs soaked with special resin adhesives, and the high-density aramid fiber paper laminated board (insulating board) is prepared by one-step hot press molding at the temperature of 180 ℃ and the pressure of 12 MPa;
the aramid fiber paper prepreg is prepared by coating aramid fiber paper with the special resin adhesive through a horizontal gluing machine, then passing through a gluing machine drying channel which is 24m long and is divided into 4 sections and 6m sections, and pre-drying the aramid fiber paper at the (baking) temperature of 135 ℃ and the vehicle speed of 3.5 m/min;
the special resin adhesive is prepared by mixing 33 parts by weight of high-temperature-resistant epoxy resin, 28 parts by weight of modified phenolic resin, 19 parts by weight of curing agent, 23 parts by weight of inorganic powder, 1 part by weight of accelerator and 400 parts by weight of solvent.
Example 6:
the utility model provides a high density aramid fiber paper laminated board, aramid fiber paper is that component and weight ratio are precipitation aramid fiber: chopped aramid fiber 1:1, surface density 10g/m2The water content (namely the weight percentage content of water) is 0.5 percent, and the high molecular structure repeating unit of the aramid fiber is
Figure BDA0002216447810000181
The aramid fiber paper of (1); the rest of the procedures are the same as those in examples 3 to 6, and are omitted.
Example 7:
the utility model provides a high density aramid fiber paper laminated board, aramid fiber paper is that component and weight ratio are precipitation aramid fiber: short cut aramid fiber 1:2, surface density 50g/m2The water content (namely the weight percentage content of water) is 5 percent, and the high molecular structure repeating unit of the aramid fiber isThe aramid fiber paper of (1); the rest of the procedures are the same as those in examples 3 to 6, and are omitted.
Example 8:
the aramid fiber paper is composed of precipitated aramid fiberMaintaining: short cut aramid fiber 1:1.5, surface density 30g/m2The water content (namely the weight percentage content of water) is 2.7 percent, and the high molecular structure repeating unit of the aramid fiber isThe aramid fiber paper of (1); the rest of the procedures are the same as those in examples 3 to 6, and are omitted.
Example 9:
the utility model provides a high density aramid fiber paper laminated board, aramid fiber paper is that component and weight ratio are precipitation aramid fiber: the chopped aramid fiber has an area density of 10g/m and is 1: 1-22～50g/m2The water content (namely the weight percentage content of water) is 0.5-5%, and the high molecular structure repeating unit of the aramid fiber is
Figure BDA0002216447810000192
The aramid fiber paper of (1); the rest of the procedures are the same as those in examples 3 to 6, and are omitted.
In examples 3 to 9 above: the one-layer or more-layer overlapped aramid fiber paper prepreg soaked with the special resin adhesive is better as follows: 1-350 layers of overlapped aramid fiber paper prepreg soaked with special resin adhesive.
In examples 3 to 9 above: the density of the prepared high-density aramid fiber paper laminated board is 1.10g/cm3～1.21g/cm3The longitudinal tensile strength is 116 KN/m-125 KN/m, the transverse tensile strength is 95 KN/m-98 KN/m, and the breakdown voltage in the 90 ℃ transformer oil is 75 KV-85 KV.
Example 10:
a preparation method of a high-density aramid fiber paper laminated board comprises the following steps:
a. preparing a special resin adhesive:
at room temperature, sequentially adding 20 parts by weight of high-temperature-resistant epoxy resin, 15 parts by weight of modified phenolic resin and 15 parts by weight of inorganic powder into a glue preparation tank, stirring for 1.5 hours, adding 6 parts by weight of curing agent and 350 parts by weight of solvent, stirring for 0.5 hour, adding 0.1 part by weight of accelerator, adjusting the forming time of glue solution, sampling, testing the forming time of the glue solution by using a knife method, and completing preparation of the special resin adhesive under the condition of a hot plate at 180 ℃ when the forming time is 250-440 seconds;
b. preparing aramid fiber paper prepreg:
taking aramid fiber paper, coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, then passing through a gluing machine drying channel which is 24m long and is divided into 4 sections and 6m in each section, and pre-drying under the conditions that the (baking) temperature is 90 ℃ and the vehicle speed is 1.0m/min to obtain an aramid fiber paper prepreg;
c. pressing a high-density aramid fiber paper laminated board:
taking aramid fiber paper prepreg (cut into required size according to the technological requirement of a high-density aramid fiber paper laminated board), overlapping one or more layers of aramid fiber paper prepreg on a smooth stainless steel plate with demolding films laid on two surfaces, sending the aramid fiber paper prepreg into a hot press (which can be a common hot press or a vacuum hot press), controlling the temperature at 170 ℃ and the pressure at 1MPa for hot press molding, and determining the hot press molding time within 1-5 h according to the thickness of the high-density aramid fiber paper laminated board prepared after molding to obtain the high-density aramid fiber paper laminated board.
Example 11:
a preparation method of a high-density aramid fiber paper laminated board comprises the following steps:
a. preparing a special resin adhesive:
at room temperature, sequentially adding 45 parts by weight of high-temperature-resistant epoxy resin, 40 parts by weight of modified phenolic resin and 32 parts by weight of inorganic powder into a glue preparation tank, stirring for 2.5 hours, adding 32 parts by weight of curing agent and 450 parts by weight of solvent, stirring for 2 hours, adding 2 parts by weight of accelerant, adjusting the forming time of glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the special resin adhesive under the condition of a hot plate at 180 ℃ when the forming time is 250-440 seconds;
b. preparing aramid fiber paper prepreg:
taking aramid fiber paper, coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, then passing through a gluing machine drying channel which is 24m long and is divided into 4 sections and 6m in each section, and pre-drying under the conditions that the (baking) temperature is 180 ℃ and the vehicle speed is 6.0m/min to obtain an aramid fiber paper prepreg;
c. pressing a high-density aramid fiber paper laminated board:
taking aramid fiber paper prepreg (cut into required size according to the technological requirement of a high-density aramid fiber paper laminated board), overlapping one or more layers of aramid fiber paper prepreg on a smooth stainless steel plate with demolding films laid on two surfaces, sending the aramid fiber paper prepreg into a hot press (which can be a common hot press or a vacuum hot press), controlling the temperature at 190 ℃ and the pressure at 24MPa for hot press molding, and determining the hot press molding time within 1-5 h according to the thickness of the high-density aramid fiber paper laminated board prepared after molding to obtain the high-density aramid fiber paper laminated board.
Example 12:
a preparation method of a high-density aramid fiber paper laminated board comprises the following steps:
a. preparing a special resin adhesive:
at room temperature, sequentially adding 32 parts by weight of high-temperature-resistant epoxy resin, 27 parts by weight of modified phenolic resin and 23 parts by weight of inorganic powder into a glue preparation tank, stirring for 2 hours, adding 19 parts by weight of curing agent and 400 parts by weight of solvent, stirring for 1.5 hours, adding 1 part by weight of accelerator, adjusting the forming time of glue solution, sampling, testing the forming time of the glue solution by using a knife method, and finishing the preparation of the special resin adhesive under the condition of a hot plate at 180 ℃ when the forming time is 250-440 seconds;
b. preparing aramid fiber paper prepreg:
taking aramid fiber paper, coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, then passing through a gluing machine drying channel which is 24m long and is divided into 4 sections and 6m in each section, and pre-drying under the conditions that the (baking) temperature is 130 ℃ and the vehicle speed is 3.5m/min to obtain an aramid fiber paper prepreg;
c. pressing a high-density aramid fiber paper laminated board:
taking aramid fiber paper prepreg (cut into required size according to the technological requirement of a high-density aramid fiber paper laminated board), overlapping one or more layers of aramid fiber paper prepreg on a smooth stainless steel plate with demolding films laid on two surfaces, sending the aramid fiber paper prepreg into a hot press (which can be a common hot press or a vacuum hot press), controlling the temperature at 180 ℃ and the pressure at 12MPa for hot press molding, and determining the hot press molding time within 1-5 h according to the thickness of the high-density aramid fiber paper laminated board prepared after molding to obtain the high-density aramid fiber paper laminated board.
Example 13:
the preparation method of the high-density aramid fiber paper laminated board comprises the following steps of: short cut aramid fiber 1:1, surface density 10g/m2The water content (namely the weight percentage content of water) is 0.5 percent, and the high molecular structure repeating unit of the aramid fiber is
Figure BDA0002216447810000211
The aramid fiber paper of (1); the same as in any of examples 10 to 12, except that the above-mentioned process is omitted.
Example 14:
the preparation method of the high-density aramid fiber paper laminated board comprises the following steps of: short cut aramid fiber 1:2, surface density 50g/m2The water content (namely the weight percentage content of water) is 5 percent, and the high molecular structure repeating unit of the aramid fiber isThe aramid fiber paper of (1); the same as in any of examples 10 to 12, except that the above-mentioned process is omitted.
Example 15:
the preparation method of the high-density aramid fiber paper laminated board comprises the following steps of: short cut aramid fiber 1:1.5, surface density 30g/m2ComprisingThe water content (namely the weight percentage content of the water) is 2.7 percent, and the high molecular structure repeating unit of the aramid fiber is
Figure BDA0002216447810000222
The aramid fiber paper of (1); the same as in any of examples 10 to 12, except that the above-mentioned process is omitted.
Example 16:
the preparation method of the high-density aramid fiber paper laminated board comprises the following steps of: the chopped aramid fiber has an area density of 10g/m and is 1: 1-22～50g/m2The water content (namely the weight percentage content of water) is 0.5-5%, and the high molecular structure repeating unit of the aramid fiber is
Figure BDA0002216447810000223
The aramid fiber paper of (1); the same as in any of examples 10 to 12, except that the above-mentioned process is omitted.
In examples 10-16 above: in the step c, one or more layers of aramid fiber paper prepreg are overlapped, preferably: and (3) overlapping 1-350 layers of aramid fiber paper prepreg.
In examples 3-16 above:
the high-temperature-resistant epoxy resin is hydantoin epoxy resin (the product providing enterprise and product brand can be CY350, Izoda; 28906, Jialong biotechnology; HY-070, Taijixin new wood), dicyclopentadiene or dicyclopentadiene and phenolic polycondensation resin (the product providing enterprise and product brand can be DNE260A75, Tiangao New technology; HP-72000, Jiashend; Picco2100, Islam), bisphenol A epoxy resin (the product providing enterprise and product brand can be E-44/E-51, Balingite; DER-331, Dow; YDH3000, Aditya Birla), biphenyl epoxy resin (the product providing enterprise and product brand can be NC-3000, Jia, Yuded; YX-4000, Mitsubishi; TMBP, Laiwu new wood), o-cresol type phenolic epoxy resin (the product providing enterprise and product brand can be EPON-678, a shell; NPCN-704, southern taiwan; SQCN700, holy spring chemical) or a mixture of two;
the modified phenolic resin is one or a mixture of two of organic silicon modified phenolic resin (product providing enterprises and product brands can be self-made by an applicant), boron modified phenolic resin (product providing enterprises and product brands can be self-made by the applicant), and benzoxazine modified phenolic resin (product providing enterprises and product brands can be self-made by the applicant);
the curing agent is one or a mixture of two of 4, 4-diaminodiphenylmethane, 4-diaminodiphenyl sulfone, m-phenylenediamine and dicyandiamide;
the inorganic powder is one or a mixture of two of nano silicon dioxide, nano montmorillonite, nano vermiculite and nano talcum powder;
the accelerant is one or a mixture of two of 2-methylimidazole, 2-ethyl-4-methylimidazole, boron trifluoride ethylamine, hexamethyltetramine and aluminum acetylacetonate;
the solvent is one or a mixture of more than two of butanone, acetone, glycol and ethanol.
In examples 3-16 above: the aramid fiber paper product can be commercially available aramid fiber paper at home and abroad.
In examples 10-16 above: the density of the high-density aramid fiber paper laminated board prepared in the step c is 1.10g/cm3～1.21g/cm3The longitudinal tensile strength is 116 KN/m-125 KN/m, the transverse tensile strength is 95 KN/m-98 KN/m, and the breakdown voltage in the 90 ℃ transformer oil is 75 KV-85 KV.
In the above embodiment: the percentages used, not specifically indicated, are percentages by weight or known to those skilled in the art; the proportions used, not specifically noted, are mass (weight) proportions; the parts by weight may each be grams or kilograms.
In the above embodiment: the process parameters (temperature, time, pressure, etc.) and the amounts of the components in each step are within the range, and any point can be applicable.
The present invention and the technical contents not specifically described in the above examples are the same as those of the prior art, and the raw materials are all commercially available products.
The present invention is not limited to the above-described embodiments, and the present invention can be implemented with the above-described advantageous effects.

Claims (10)

1. The utility model provides a high density aramid fiber paper laminate which characterized by: the high-density aramid fiber paper laminated board is prepared by one or more layers of overlapped aramid fiber paper prepregs soaked with special resin adhesives through hot press molding at the temperature of 170-190 ℃ and the pressure of 1-24 MPa;
the aramid fiber paper prepreg is prepared by coating aramid fiber paper with the special resin adhesive through a horizontal gluing machine, then passing through a gluing machine drying channel which is 24m long and is divided into 4 sections and 6m sections, and pre-drying at the temperature of 90-180 ℃ and the vehicle speed of 1.0-6.0 m/min;
the special resin adhesive is prepared by mixing 20-45 parts by weight of high-temperature-resistant epoxy resin, 15-40 parts by weight of modified phenolic resin, 6-32 parts by weight of curing agent, 15-32 parts by weight of inorganic powder, 0.1-2 parts by weight of accelerator and 350-450 parts by weight of solvent;
the high-temperature-resistant epoxy resin is one or a mixture of two of hydantoin epoxy resin, dicyclopentadiene or dicyclopentadiene and phenolic aldehyde polycondensation resin, bisphenol A epoxy resin, biphenyl epoxy resin and o-cresol phenolic aldehyde epoxy resin;
the modified phenolic resin is one or a mixture of two of organic silicon modified phenolic resin, boron modified phenolic resin and benzoxazine modified phenolic resin;
the curing agent is one or a mixture of two of 4, 4-diaminodiphenylmethane, 4-diaminodiphenyl sulfone, m-phenylenediamine and dicyandiamide;
the inorganic powder is one or a mixture of two of nano silicon dioxide, nano montmorillonite, nano vermiculite and nano talcum powder;
the accelerant is one or a mixture of two of 2-methylimidazole, 2-ethyl-4-methylimidazole, boron trifluoride ethylamine, hexamethyltetramine and aluminum acetylacetonate;
the solvent is one or a mixture of more than two of butanone, acetone, glycol and ethanol.
2. The high-density aramid fiber paper laminate as set forth in claim 1, characterized in that: the aramid fiber paper comprises the following components in percentage by weight: the chopped aramid fiber is 1: 1-2, and the surface density is 10g/m2～50g/m2The water content is 0.5-5%, and the aramid fiber has a polymer structure repeating unit ofThe aramid fiber paper.
3. The high-density aramid fiber paper laminate as claimed in claim 1 or 2, wherein: the density of the prepared high-density aramid fiber paper laminated board is 1.10g/cm3～1.21g/cm3The thickness of the plate is 1 mm-6 mm, the longitudinal tensile strength is 116 KN/m-125 KN/m, the transverse tensile strength is 95 KN/m-98 KN/m, and the breakdown voltage in the 90 ℃ transformer oil is 75 KV-85 KV.
4. The high-density aramid fiber paper laminate as claimed in claim 1 or 2, wherein: the one or more layers of overlapped aramid fiber paper prepreg soaked with the special resin adhesive is characterized in that: 1-350 layers of overlapped aramid fiber paper prepreg soaked with special resin adhesive.
5. The high-density aramid fiber paper laminate as claimed in claim 1 or 2, wherein: the high-density aramid fiber paper laminated board prepared by hot press molding at the temperature of 170-190 ℃ and the pressure of 1-24 MPa is prepared by the following steps: under the conditions of 170-190 ℃ of temperature and 1-24 MPa of pressure, the thickness of the high-density aramid fiber paper laminated board is 1-6 mm according to the thickness of the high-density aramid fiber paper laminated board after molding, the hot press molding time is determined within 1-5 h, and the high-density aramid fiber paper laminated board is prepared after hot press molding.
6. A preparation method of a high-density aramid fiber paper laminated board is characterized by comprising the following steps:
a. preparing a special resin adhesive:
at room temperature, sequentially adding 20-45 parts by weight of high-temperature-resistant epoxy resin, 15-40 parts by weight of modified phenolic resin and 15-32 parts by weight of inorganic powder into a glue preparation tank, stirring for 1.5-2.5 hours, adding 6-32 parts by weight of curing agent and 350-450 parts by weight of solvent, stirring for 0.5-2 hours, adding 0.1-2 parts by weight of accelerator, adjusting the forming time of glue solution, sampling, testing the forming time of the glue solution by using a knife method, and completing preparation of the special resin adhesive when the forming time is 250-440 seconds under the condition of a hot plate at 180 ℃;
the high-temperature-resistant epoxy resin is one or a mixture of two of hydantoin epoxy resin, dicyclopentadiene or dicyclopentadiene and phenolic aldehyde polycondensation resin, bisphenol A epoxy resin, biphenyl epoxy resin and o-cresol phenolic aldehyde epoxy resin;
the modified phenolic resin is one or a mixture of two of organic silicon modified phenolic resin, boron modified phenolic resin and benzoxazine modified phenolic resin;
the curing agent is one or a mixture of two of 4, 4-diaminodiphenylmethane, 4-diaminodiphenyl sulfone, m-phenylenediamine and dicyandiamide;
the inorganic powder is one or a mixture of two of nano silicon dioxide, nano montmorillonite, nano vermiculite and nano talcum powder;
the accelerant is one or a mixture of two of 2-methylimidazole, 2-ethyl-4-methylimidazole, boron trifluoride ethylamine, hexamethyltetramine and aluminum acetylacetonate;
the solvent is one or a mixture of more than two of butanone, acetone, glycol and ethanol;
b. preparing aramid fiber paper prepreg:
taking aramid fiber paper, coating the aramid fiber paper with the special resin adhesive in the step a through a horizontal gluing machine, then passing through a gluing machine drying channel which is 24m long and is divided into 4 sections and 6m in each section, and pre-drying under the conditions that the temperature is 90-180 ℃ and the vehicle speed is 1.0-6.0 m/min to obtain an aramid fiber paper prepreg;
c. pressing a high-density aramid fiber paper laminated board:
taking aramid fiber paper prepreg, overlapping one or more layers of aramid fiber paper prepreg on a smooth stainless steel plate with demolding films laid on two surfaces, feeding the aramid fiber paper prepreg into a hot press, and performing hot press molding under the conditions that the temperature is controlled to be 170-190 ℃ and the pressure is 1-24 MPa to obtain the high-density aramid fiber paper laminated board.
7. The method for preparing the high-density aramid fiber paper laminate as claimed in claim 6, wherein the method comprises the following steps: the aramid fiber paper in the step b comprises the following components in parts by weight: the chopped aramid fiber is 1: 1-2, and the surface density is 10g/m2～50g/m2The water content is 0.5-5%, and the aramid fiber has a polymer structure repeating unit ofThe aramid fiber paper.
8. The method for preparing the high-density aramid fiber paper laminate as claimed in claim 6 or 7, wherein the method comprises the following steps: and c, performing hot press molding under the conditions that the temperature is controlled to be 170-190 ℃ and the pressure is 1-24 MPa to obtain the high-density aramid fiber paper laminated board, wherein the process comprises the following steps: controlling the temperature to be 170-190 ℃ and the pressure to be 1-24 MPa, carrying out hot press molding, and determining the hot press molding time to be within 1-5 h according to the thickness of the high-density aramid fiber paper laminated board after molding to obtain the high-density aramid fiber paper laminated board with the thickness of 1-6 mm.
9. The method for preparing the high-density aramid fiber paper laminate as claimed in claim 6 or 7, wherein the method comprises the following steps: in the step c, one or more layers of aramid fiber paper prepreg are overlapped and placed, and the steps are as follows: and (3) overlapping 1-350 layers of aramid fiber paper prepreg.
10. The method for preparing the high-density aramid fiber paper laminate as claimed in claim 6 or 7, wherein the method comprises the following steps: the density of the high-density aramid fiber paper laminated board prepared in the step c is 1.10g/cm3～1.21g/cm3The longitudinal tensile strength is 116 KN/m-125 KN/m, the transverse tensile strength is 95 KN/m-98 KN/m, and the breakdown voltage in the 90 ℃ transformer oil is 75 KV-85 KV.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112746522A (en) * 2020-03-25 2021-05-04 株洲时代新材料科技股份有限公司 High-dielectric-property composite aramid paper
CN113005820A (en) * 2021-02-25 2021-06-22 陕西科技大学 Preparation method of multilayer composite aramid paper
CN115305047A (en) * 2022-08-18 2022-11-08 深圳市纽菲斯新材料科技有限公司 Layer-adding adhesive film for FC-BGA packaging carrier plate and preparation method and application thereof
CN116512694A (en) * 2023-05-08 2023-08-01 长春珑鑫新材料有限公司 A kind of aramid paper honeycomb EMU floor and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614600A (en) * 1994-06-03 1997-03-25 Kashima Oil Co., Ltd. Fiber-reinforced resin plate and process for producing the same
CN104594106A (en) * 2014-12-25 2015-05-06 深圳昊天龙邦复合材料有限公司 Layered composite aramid fiber paper and preparation method thereof
CN106626631A (en) * 2016-09-14 2017-05-10 四川东材科技集团股份有限公司 Aramid fiber felt laminated board and preparation method thereof
CN106758484A (en) * 2015-11-24 2017-05-31 株洲时代新材料科技股份有限公司 A kind of preparation method of aramid fiber cardboard
CN106758460A (en) * 2016-12-30 2017-05-31 铜陵三佳变压器科技股份有限公司 A kind of transformer of breakdown strength high aramid fiber based insulation paper and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614600A (en) * 1994-06-03 1997-03-25 Kashima Oil Co., Ltd. Fiber-reinforced resin plate and process for producing the same
CN104594106A (en) * 2014-12-25 2015-05-06 深圳昊天龙邦复合材料有限公司 Layered composite aramid fiber paper and preparation method thereof
CN106758484A (en) * 2015-11-24 2017-05-31 株洲时代新材料科技股份有限公司 A kind of preparation method of aramid fiber cardboard
CN106626631A (en) * 2016-09-14 2017-05-10 四川东材科技集团股份有限公司 Aramid fiber felt laminated board and preparation method thereof
CN106758460A (en) * 2016-12-30 2017-05-31 铜陵三佳变压器科技股份有限公司 A kind of transformer of breakdown strength high aramid fiber based insulation paper and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112746522A (en) * 2020-03-25 2021-05-04 株洲时代新材料科技股份有限公司 High-dielectric-property composite aramid paper
CN113005820A (en) * 2021-02-25 2021-06-22 陕西科技大学 Preparation method of multilayer composite aramid paper
CN115305047A (en) * 2022-08-18 2022-11-08 深圳市纽菲斯新材料科技有限公司 Layer-adding adhesive film for FC-BGA packaging carrier plate and preparation method and application thereof
CN115305047B (en) * 2022-08-18 2023-08-08 深圳市纽菲斯新材料科技有限公司 Layer-increased adhesive film for FC-BGA packaging loading board, and preparation method and application thereof
CN116512694A (en) * 2023-05-08 2023-08-01 长春珑鑫新材料有限公司 A kind of aramid paper honeycomb EMU floor and preparation method thereof

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