CN106661194B - Epoxy resin composition for carbon-fiber-reinforced composite material, resin sheet, prepreg, carbon fibre reinforced composite - Google Patents
Epoxy resin composition for carbon-fiber-reinforced composite material, resin sheet, prepreg, carbon fibre reinforced composite Download PDFInfo
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- CN106661194B CN106661194B CN201580037761.7A CN201580037761A CN106661194B CN 106661194 B CN106661194 B CN 106661194B CN 201580037761 A CN201580037761 A CN 201580037761A CN 106661194 B CN106661194 B CN 106661194B
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- Prior art keywords
- epoxy resin
- reinforced composite
- carbon
- resin
- composition
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 115
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 115
- 239000000203 mixture Substances 0.000 title claims abstract description 60
- 229920005989 resin Polymers 0.000 title claims abstract description 56
- 239000011347 resin Substances 0.000 title claims abstract description 56
- 239000000835 fiber Substances 0.000 title claims abstract description 50
- 239000000463 material Substances 0.000 title claims abstract description 40
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 36
- 239000002131 composite material Substances 0.000 title claims abstract description 33
- 239000003733 fiber-reinforced composite Substances 0.000 title claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 31
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 29
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims description 14
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 11
- 239000004917 carbon fiber Substances 0.000 claims description 11
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical class C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 9
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 9
- 150000001412 amines Chemical class 0.000 claims description 6
- 239000010426 asphalt Substances 0.000 claims description 5
- 150000001555 benzenes Chemical class 0.000 claims description 5
- 238000006068 polycondensation reaction Methods 0.000 claims description 5
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 description 33
- -1 CFRP Substances 0.000 description 29
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
- 239000002585 base Substances 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 15
- 238000003786 synthesis reaction Methods 0.000 description 15
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- 239000002904 solvent Substances 0.000 description 13
- 150000002989 phenols Chemical class 0.000 description 12
- 239000004744 fabric Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 8
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 8
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 8
- 239000005011 phenolic resin Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinyl group Chemical group C1(O)=CC(O)=CC=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 7
- 239000002966 varnish Substances 0.000 description 7
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229940106691 bisphenol a Drugs 0.000 description 6
- 239000000460 chlorine Substances 0.000 description 6
- 229910052801 chlorine Inorganic materials 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 235000010290 biphenyl Nutrition 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 239000003814 drug Substances 0.000 description 5
- 229940079593 drug Drugs 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 150000002924 oxiranes Chemical class 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical group C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 description 4
- UIMPAOAAAYDUKQ-UHFFFAOYSA-N 1-methoxy-4-(4-methoxyphenyl)benzene Chemical group C1=CC(OC)=CC=C1C1=CC=C(OC)C=C1 UIMPAOAAAYDUKQ-UHFFFAOYSA-N 0.000 description 4
- MLPVBIWIRCKMJV-UHFFFAOYSA-N 2-ethylaniline Chemical compound CCC1=CC=CC=C1N MLPVBIWIRCKMJV-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- MMIVZWZHLDUCKH-UHFFFAOYSA-N chloromethane;chloromethylbenzene Chemical compound ClC.ClCC1=CC=CC=C1 MMIVZWZHLDUCKH-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004567 concrete Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000930 thermomechanical effect Effects 0.000 description 4
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 150000005205 dihydroxybenzenes Chemical class 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000001802 infusion Methods 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000009417 prefabrication Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- ALLIZEAXNXSFGD-UHFFFAOYSA-N 1-methyl-2-phenylbenzene Chemical group CC1=CC=CC=C1C1=CC=CC=C1 ALLIZEAXNXSFGD-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- JECYUBVRTQDVAT-UHFFFAOYSA-N 2-acetylphenol Chemical compound CC(=O)C1=CC=CC=C1O JECYUBVRTQDVAT-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- TXFPEBPIARQUIG-UHFFFAOYSA-N 4'-hydroxyacetophenone Chemical compound CC(=O)C1=CC=C(O)C=C1 TXFPEBPIARQUIG-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical class C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
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- CJPQIRJHIZUAQP-MRXNPFEDSA-N benalaxyl-M Chemical compound CC=1C=CC=C(C)C=1N([C@H](C)C(=O)OC)C(=O)CC1=CC=CC=C1 CJPQIRJHIZUAQP-MRXNPFEDSA-N 0.000 description 2
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- 238000005538 encapsulation Methods 0.000 description 2
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- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical compound O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KZTYYGOKRVBIMI-UHFFFAOYSA-N S-phenyl benzenesulfonothioate Natural products C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- BULOCEWDRJUMEL-UHFFFAOYSA-N benzene formaldehyde Chemical compound C=O.C1=CC=CC=C1.C=O BULOCEWDRJUMEL-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000002520 cambial effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 229940113088 dimethylacetamide Drugs 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- SXZIXHOMFPUIRK-UHFFFAOYSA-N diphenylmethanimine Chemical compound C=1C=CC=CC=1C(=N)C1=CC=CC=C1 SXZIXHOMFPUIRK-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000004002 naphthaldehydes Chemical class 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 229940054441 o-phthalaldehyde Drugs 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- FTDXCHCAMNRNNY-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1 FTDXCHCAMNRNNY-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- ZWLUXSQADUDCSB-UHFFFAOYSA-N phthalaldehyde Chemical compound O=CC1=CC=CC=C1C=O ZWLUXSQADUDCSB-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- XDOBJOBITOLMFI-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical class CC1=CC=CC=C1.O=C1NC(=O)C=C1 XDOBJOBITOLMFI-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007613 slurry method Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
Abstract
The purpose of the present invention is to provide a kind of epoxy resin composition for carbon-fiber-reinforced composite material and excellent prepreg, resin sheet, the carbon fibre reinforced composite of the resin combination are used, the epoxy resin composition for carbon-fiber-reinforced composite material is capable of providing the carbon fibre reinforced composite that high-fire resistance, dimensional stability and high tenacity, rigidity are shown as its solidfied material when being used as the composition epoxy resin of carbon fibre reinforced composite.Carbon fibre composite composition epoxy resin of the invention is using epoxy resin represented by the following general formula (1) and curing agent as neccessary composition, (in formula, (a) ratio of (b) is (a)/(b)=l~3, G indicates that glycidyl, n are repeat number and are 0~5).
Description
Technical field
The present invention relates to a kind of composition epoxy resin for being suitable for carbon fibre reinforced composite and the epoxy is used
The resin sheet of resin combination, makes carbon fibre reinforced composite obtained from its solidification at prepreg.
Background technique
Epoxy resin is solidified by using various curing agent, forms usual engineering properties, water resistance, chemical-resistant, resistance to
The excellent solidfied material such as hot, electrical properties, and it is wide applied to adhesive, coating, plywood, moulding material, founding materials etc.
In general field.Wherein, especially in the field of fibre reinforced composites, using epoxy resin and curing agent as matrix resin
And be infiltrated in reinforcing fiber and make its solidification, it is possible thereby to assign the characteristics such as lightweight, high intensity, therefore in airframe
With in computers purposes such as the shell (shell) of component, the blade of windmill, automobile exterior panel and chip tray or laptop etc.
It is widely applied, and its demand just increases year by year.
In recent years, as described above, the application range of carbon fibre reinforced composite (CFRP) expands, various shapes are gradually available for
The formed body of shape.In this case it is necessary to be carried out by being bonded single substrate or multiple substrates to these complicated shapes
Molding.
It is assumed that above-mentioned formed body uses under the harsh environment of the temperature environments such as automobile or aircraft, according to the thickness of the CFRP
Or shape, be easy to appear it is biggish as and carbon fiber line swell increment difference caused by strain.Specifically, for example thickness compared with
The part of thick part and thinner thickness, line swell increment is different, and due to pulling each other, internal stress is easy to store
Product.Therefore, it cracks or the problems such as removing with carbon fiber.
In addition, usually in the reinforced fiber plastics such as CFRP, fiber and solidify matrix resin linear expansion coefficient difference
Greatly, especially in the case where carbon fiber, line expansion is negative, and the line expansion strain as caused by temperature cycles becomes larger.
It can be seen that in order to keep the line expansion variation of resin itself as small as possible and be resistant to the stress, it is desirable that strong
The high matrix resin of degree/obdurability.
Conventionally, there is known with biphenyl backbone phenol resol resins, as by benzene obtained from its epoxidation
Phenol phenolic resin varnish type epoxy resin and curing agent are the electronic part encapsulation composition epoxy resin of neccessary composition (for example, specially
Sharp document 1).However, in the patent document 1, though describe the heat resistance of electronic part encapsulation epoxy composite, anti-flammability
It is excellent, but about the specific resin composition of reduction line expansion characteristics, there is no record, and about carbon fiber reinforced plastic
The serviceability of material purposes is not also recorded.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2013-43958 bulletin
Summary of the invention
Problem to be solved by the invention
Problem of the present invention is that point in view of the above-mentioned problems of the prior art, a kind of carbon fibre reinforced composite is provided and is used
Composition epoxy resin and excellent prepreg, resin sheet, the carbon fibre reinforced composite for having used the resin combination,
The epoxy resin composition for carbon-fiber-reinforced composite material is in the epoxy composite for being used as carbon fibre reinforced composite
When object, it is capable of providing and shows that high-fire resistance, dimensional stability and high tenacity, the fibre reinforced of rigidity are multiple as its solidfied material
Condensation material.
The means used to solve the problem
The inventors of the present invention have made intensive studies the above problem, as a result, it has been found that, contain the phenol phenol with specific structure
The composition epoxy resin of Novolac type epoxy resin and curing agent is as providing high-fire resistance and low linear expansion is excellent
The excellent composition epoxy resin of the epoxy resin composition for fiber-reinforced composite material of resin cured matter, so as to complete this
Invention.
That is, the present invention provides:
(1) a kind of epoxy resin composition for carbon-fiber-reinforced composite material, wherein the carbon fibre reinforced composite
With composition epoxy resin using epoxy resin represented by the following general formula (1) and curing agent as neccessary composition,
(in formula, the ratio of (a) (b) is that (a)/(b)=1~3, G indicates that glycidyl, n are repeat number and are 0~5)；
(2) epoxy resin composition for carbon-fiber-reinforced composite material as described in above-mentioned (1), wherein above-mentioned curing agent
For amine curing agent；
(3) epoxy resin composition for carbon-fiber-reinforced composite material as described in above-mentioned (1) or (2), also contains it
Its epoxy resin；
(4) a kind of resin sheet, it uses the carbon fibre reinforced composite use described in any one of above-mentioned (1) to (3)
Composition epoxy resin；
(5) a kind of prepreg, by using carbon fibre reinforced composite described in any one of above-mentioned (1) to (3)
Resin sheet described in composition epoxy resin or above-mentioned (4) is infiltrated in carbon fiber and obtains；
(6) a kind of carbon fibre reinforced composite, by obtaining the solidification of prepreg described in above-mentioned (5).
Invention effect
According to the present invention it is possible to provide a kind of epoxy resin composition for carbon-fiber-reinforced composite material, used the ring
Resin sheet, prepreg, the carbon fibre reinforced composite of epoxy resin composition, the carbon fibre reinforced composite asphalt mixtures modified by epoxy resin
The solidfied material of oil/fat composition shows low linear expansion coefficient (excellent dimensional stability), high-fire resistance and high tenacity, rigidity.
Detailed description of the invention
Fig. 1 is the thermo-mechanical analysis figure of the carbon fibre reinforced composite obtained by embodiment 5.
Fig. 2 is the thermo-mechanical analysis figure of the carbon fibre reinforced composite obtained by comparative example 3.
Specific embodiment
Epoxy resin composition for carbon-fiber-reinforced composite material of the invention is illustrated.
Epoxy resin composition for carbon-fiber-reinforced composite material (hereinafter referred to as " epoxy resin of the invention of the invention
Composition ") contain epoxy resin represented by the following general formula (1) as neccessary composition.
(in formula, the ratio of (a) (b) is that (a)/(b)=1~3, G indicates that glycidyl, n are repeat number and are 0~5).
Epoxy resin represented by above-mentioned general formula (1) used in the present invention, can pass through Japanese Unexamined Patent Publication 2011-252037
Number bulletin, Japanese Unexamined Patent Publication 2008-156553 bulletin, Japanese Unexamined Patent Publication 2013-043958 bulletin, International Publication WO2012/
053522, the method recorded in WO2007/007827 is synthesized, as long as the structure with above-mentioned formula (1), can be used any
The epoxy resin of method synthesis.
It wherein, in the present invention, is (a)/(b)=1~3 especially with the ratio of above-mentioned formula (a) and above-mentioned formula (b)
Epoxy resin.(a) when structure is more, heat resistance is improved, but correspondingly not only its water absorption character is deteriorated, but also becomes fragile and be hardened.Cause
This, the multifunctional rate being set as in above range.
The softening point (ring and ball method) of used epoxy resin is preferably 50 DEG C~150 DEG C, further preferably 52 DEG C~
100 DEG C, particularly preferably 52 DEG C~95 DEG C.When softening point is 50 DEG C or less, sometimes tacky violent, operating difficulties and in productivity
Aspect is led to the problem of.In addition, in the case that softening point is 150 DEG C or more, for the temperature for approaching forming temperature, it is possible to can not be true
Mobility when forming is protected, therefore not preferably.
The epoxide equivalent of used epoxy resin is preferably 180g/eq.~350g/eq..Particularly preferably 190g/eq.
~300g/eq..In the case where epoxide equivalent is lower than 180g/eq., functional group is excessive, therefore the solidfied material after solidifying is inhaled sometimes
Water rate gets higher and is easy to become fragile.In the case where epoxide equivalent is more than 350g/eq., it is believed that softening point become very large or
Person's epoxidation does not carry out thoroughly, it is possible to which chlorine dose becomes very more, therefore not preferably.
It should be noted that the chlorine dose of epoxy resin used in the present invention is preferably in terms of total chlorine (Hydrolyze method)
200ppm~1500ppm, particularly preferably 200ppm~900ppm.According to the standard of JPCA, it is expected that the chlorine dose of epoxy monomer
No more than 900ppm.In addition, when chlorine dose is more, it is possible to correspondingly be had an impact to electrical reliability, therefore not preferably.In chlorine dose
In the case where lower than 200ppm, excessive purification procedures in need, the tendency to be led to the problem of in terms of productivity, therefore not
It is preferred that.
It should be noted that the melt viscosity at 150 DEG C of epoxy resin used in the present invention is preferably
0.05Pas~5Pas, particularly preferably 0.05Pas~2.0Pas.When viscosity is high, it is possible to be produced in terms of mobility
Raw problem, and led to the problem of in terms of the flowability or embeddability in pressurization.In the case where being lower than 0.05Pas, molecule
Measure too small, therefore heat resistance is insufficient sometimes.
The ratio of (a) and (b) is (a)/(b)=1~3 in above-mentioned formula (1).That is, being characterized in that more than half for isophthalic two
The glycidol ether form of phenol structure.The ratio is important the precipitation of crystal and the raising of heat resistance, and preferably (a)/(b) is super
Cross 1.In addition, by making (a)/(b) be 3 hereinafter, the amount of the glycidol ether form of resorcinol structure is limited, it is possible thereby to change
Kind water absorption rate and obdurability.
In above-mentioned formula (1), n is repetitive unit, is 0~5.Prepreg or resin sheet is made to control by making n be no more than 5
When flowability or mobility.In the case where it is more than 5, not only led to the problem of in terms of mobility, but also in a solvent
Dissolubility in terms of also lead to the problem of.
The dissolubility of epoxy resin used in the present invention in a solvent is important.For example, and with same bone
In the case where the epoxy resin of the biphenyl aralkyl-type of frame, about these resins, it is also desirable in methyl ethyl ketone or toluene, the third two
Dissolubility in alcohol monomethyl ether equal solvent.
Dissolubility especially in methyl ethyl ketone is important, and require at 5 DEG C, in room temperature etc. under the conditions ofs 2 months
It does not precipitate crystal above.Also related with the ratio of above-mentioned (a)/(b), when (a) value is big, crystal is easy to be precipitated, and therefore (a)/(b) is
1 or more is important.
As the curing agent that can be used in composition epoxy resin of the invention, can enumerate for example: amine curing agent,
Acid anhydride type curing agent, amides curing agent and phenols curing agent etc..Wherein, amine curing agent can balancedly take into account epoxy resin
The low linear expansion of composition and the heat resistance of resin cured matter, therefore preferably.
It as the amine curing agent preferably comprised in the present invention, can enumerate: diaminodiphenylmethane, diamino hexichol
Sulfone, naphthylenediamine, aniline novolaks, o ethyl aniline novolaks, passes through aniline and xylylene dichlorides at isophorone diamine
Anline resin obtained from reaction passes through aniline and substituted biphenyl class (4,4 '-bis- (chloromethyl) -1,1 '-biphenyl and 4,4 '-bis-
(methoxy) -1,1 '-biphenyl etc.) or substituted benzene base class (bis- (chloromethyl) benzene of 1,4-, 1,4- bis- (methoxies)
Benzene and bis- (hydroxymethyl) benzene of Isosorbide-5-Nitrae-etc.) etc. polycondensation obtained from anline resin etc., but be not limited to these.
Especially from the aspect of obdurability and heat resistance, optimization aromatic amine compounds, wherein for 3,3 '-two
Aminodiphenyl sulfone, aniline novolaks, o ethyl aniline novolaks, passes through aniline and dichloromethane at 4,4 '-diaminodiphenylsulfones
Anline resin obtained from the reaction of base benzene, by aniline and substituted biphenyl class (4,4 '-bis- (chloromethyl) -1,1 '-biphenyl and 4,
4 '-bis- (methoxy) -1,1 '-biphenyl etc.) or substituted benzene base class (bis- (chloromethyl) benzene of 1,4-, the bis- (methoxyl groups of 1,4-
Methyl) benzene and bis- (hydroxymethyl) benzene of Isosorbide-5-Nitrae-etc.) etc. polycondensation obtained from for anline resin, resist flexure or stress
Intensity is high, the elasticity modulus under high temperature can be improved according to its crosslink density, from the aspect of the intensity from raising as CFRP
It is also preferred that in addition, from the aspect of heat resistance preferably.
In addition, enumerating the example of other curing agent that can contain.
It as acid anhydride type curing agent, can enumerate: phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, maleic acid
Acid anhydride, tetrabydrophthalic anhydride, methyl tetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride and first
Base hexahydrophthalic anhydride etc..
It as amides curing agent, can enumerate: dicyandiamide or the polyamides synthesized by linolenic dimer with ethylenediamine
Polyimide resin etc..
As phenols curing agent, can enumerate: polyatomic phenol (bisphenol-A, Bisphenol F, bisphenol S, bisphenol fluorene, terpene diphenol, 4,
4 '-dihydroxybiphenyls, 2,2 '-dihydroxybiphenyls, 3,3 ', 5,5 '-tetramethyls-(1,1 '-biphenyl) -4,4 '-glycol, to benzene two
Phenol, resorcinol, naphthalenediol, three (4- hydroxy phenyl) methane and 1,1,2,2- tetra- (4- hydroxy phenyl) ethane etc.)；Pass through phenols
(phenol, alkyl substituted phenol, naphthols, alkyl-substituted naphthaline phenol, dihydroxy benzenes and dihydroxy naphthlene etc.) and aldehydes (formaldehyde, acetaldehyde, benzene
Formaldehyde, parahydroxyben-zaldehyde, salicylaldhyde and furfural etc.), ketone (parahydroxyacet-ophenone and o-hydroxyacetophenone etc.) or
Phenol resin obtained from the condensation of dienes (dicyclopentadiene and three dicyclopentadienes etc.)；By above-mentioned phenols and replace connection
Benzene class (4,4 '-bis- (chloromethyl) -1,1 '-biphenyl and 4,4 '-bis- (methoxy) -1,1 '-biphenyl etc.) or substituted-phenyl
The polycondensation of class (bis- (chloromethyl) benzene of 1,4-, bis- (methoxy) benzene of 1,4- and bis- (hydroxymethyl) benzene of 1,4- etc.) etc. and obtain
Phenol resin；The modified product of above-mentioned phenols and/or above-mentioned phenol resin；The halogenated phenols such as tetrabromobisphenol A and brominated phenolic resin.
In addition to this, it as imidazole curing agent, can enumerate: BF3Amine complex, guanidine derivatives etc..
In composition epoxy resin of the invention, the usage amount of curing agent is excellent relative to 1 equivalent of epoxy group of epoxy resin
It is selected as 0.7 equivalent~1.2 equivalents.In the case where being less than 0.7 equivalent relative to 1 equivalent of epoxy group or more than 1.2 equivalents
In the case where, being possible to solidification becomes incomplete and is unable to get good solidification physical property.
In addition, can according to need cooperation curing accelerator in composition epoxy resin of the invention.It can also be by making
Gelation time is adjusted with curing accelerator.It as the example for the curing accelerator that can be used, can enumerate: 2- methyl miaow
The imidazoles such as azoles, 2- ethyl imidazol(e), 2-ethyl-4-methylimidazole；2- (dimethylamino methyl) phenol, 1,8- diazabicyclo
The tertiary amines such as [5.4.0] 11 carbon -7- alkene；The phosphines such as triphenylphosphine；The metallic compounds such as tin octoate.Relative to epoxy resin
0.01 parts by weight~5.0 parts by weight curing accelerator can be used in 100 parts by weight as needed.
In composition epoxy resin of the invention, epoxy resin represented by above-mentioned general formula (1) be can be used alone, can also
To cooperate other epoxy resin and and with two kinds or more.As can be with other asphalt mixtures modified by epoxy resin of the epoxy resin of general formula (1)
The concrete example of rouge can be enumerated: phenols (phenol, alkyl substituted phenol, aromatic series fortified phenol, naphthols, alkyl-substituted naphthaline phenol,
Dihydroxy benzenes, alkyl replace dihydroxy benzenes, dihydroxy naphthlene etc.) (formaldehyde, acetaldehyde, alkyl aldehydes, benzaldehyde, alkyl take with various aldehyde
For benzaldehyde, hydroxy benzaldehyde, naphthaldehyde, glutaraldehyde, o-phthalaldehyde, crotonaldehyde, cinnamic acid etc.) condensation polymer；Phenols with
Various diolefin compound (dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinyl norbornene, four
Hydrogen indenes, divinylbenzene, divinyl biphenyls, diisopropenyl biphenyl, butadiene, isoprene etc.) polymer；Phenols with
The condensation polymer of ketone (acetone, methyl ethyl ketone, methyl iso-butyl ketone (MIBK), acetophenone, benzophenone etc.)；By phenols and replace connection
Benzene class (4,4 '-bis- (chloromethyl) -1,1 '-biphenyl and 4,4 '-bis- (methoxy) -1,1 '-biphenyl etc.) or substituted-phenyl
The polycondensation of class (bis- (chloromethyl) benzene of 1,4-, bis- (methoxy) benzene of 1,4- and bis- (hydroxymethyl) benzene of 1,4- etc.) etc. and obtain
Phenol resin；Condensation polymer, alcohols of bisphenols and various aldehyde etc. is subjected to glycidol ethers obtained from glycidyl
Epoxy resin；With 4- vinyl -1- cyclohexene dicyclic oxide or 3,4- epoxycyclohexyl-methyl -3,4 '-epoxycyclohexyl first
Acid esters etc. is the alicyclic epoxy resin of representative；With four glycidyl group diaminodiphenylmethane (TGDDM) or three-glycidyl
Base para-aminophenol etc. is the glycidyl amine epoxy resin of representative；Glycidyl ester epoxy resin etc., still, as long as
Usually used epoxy resin, is not limited to these.
In the case where being used in combination with other epoxy resin, the epoxy resin of above-mentioned general formula (1) institute in whole epoxy resin
The ratio accounted for is preferably 30 weight % or more, particularly preferably 40 weight % or more.The ratio of the epoxy resin of above-mentioned general formula (1)
When less than 30 weight %, it is unable to get the physical property such as high-fire resistance, dimensional stability, obdurability, water resistance sometimes.
In composition epoxy resin of the invention, well known additive can also be cooperated as needed.As can be used
Additive concrete example, can enumerate: polybutadiene and its modified product, the modified product of acrylonitrile copolymer, polyphenylene oxide,
Polystyrene, polyethylene, polyimides, fluorine resin, maleimide compound, cyanate compound, Silica hydrogel, silicon
Oil and silica, aluminium oxide, calcium carbonate, silica flour, aluminium powder, graphite, talcum, clay, iron oxide, titanium oxide, nitridation
The surface treating agents of the packing materials such as the inorganic filling materials such as aluminium, asbestos, mica, glass powder, silane coupling agent, release agent,
The colorants such as carbon black, phthalocyanine blue, phthalocyanine green.
In addition, can according to need the well known maleimide chemical combination of cooperation in composition epoxy resin of the invention
Object.It as the concrete example for the maleimide compound that can be used, can enumerate: 4,4'- dimaleoyl imino hexichol first
Alkane, more phenylmethane maleimides, meta-phenylene bismaleimide, 2,2 '-bis- [4- (4- maleimide phenoxyl)
Phenyl] propane, 3,3 '-dimethyl -5,5 '-diethyl -4,4 '-dimaleoyl imino diphenyl-methane, 4- methyl-1, the Asia 3- benzene
Base bismaleimide, 4,4 '-dimaleoyl imino diphenyl ether, 4,4 '-dimaleoyl imino diphenyl sulphone (DPS)s, the bis- (3- of 1,3-
Maleimide phenoxyl) benzene, bis- (4- maleimide phenoxyl) benzene of 1,3- etc., but it is not limited to these.These horses
Carrying out imide analog compounds can be used alone, and also two or more kinds may be used.When cooperating maleimide compound, according to
It needs to cooperate curing accelerator, the radical polymerizations such as above-mentioned curing accelerator or organic peroxide, azo-compound can be used
Close initiator etc..
Organic solvent can be added in composition epoxy resin of the invention and be made varnish shape composition (hereinafter,
Referred to as varnish).It as used solvent, can enumerate for example: gamma-butyrolacton class, N-Methyl pyrrolidone, N, N- diformazan
Base formamide, DMAC N,N' dimethyl acetamide, N, the amide solvents such as N- methylimidazole alkanone；The sulfones class such as sulfolane；Diethyl two
Diethylene glycol dimethyl ether, diethylene glycol diethyl ether, propylene glycol, propylene glycol monomethyl ether, propylene glycol monomethyl ether monoacetate, propylene glycol monobutyl ether
Equal ether solvents；The ketones solvents such as methyl ethyl ketone, methyl iso-butyl ketone (MIBK), cyclopentanone, cyclohexanone；The fragrance such as toluene, dimethylbenzene
Same clan's solvent.Solvent can the solid point concentration in addition to solvent in obtained varnish be usually 10 weights of weight %~80
It is used in the range of amount %, preferably 20 weight of weight %~70 %.
Resin sheet of the invention, prepreg, carbon fibre reinforced composite are illustrated.
Composition epoxy resin of the invention can be coated on to the one or two sides of supporting base material and be used as resin sheet.Make
For coating method, can enumerate for example: casting；Resin is squeezed out and utilized from nozzle or die orifice using pump or extruder etc. and is scraped
The method of knife adjusting thickness；The method for carrying out calendering processing using roller and adjusting thickness；It is carried out using spraying device etc. spraying
Method etc..It should be noted that cambial process can be in the temperature model for the thermal decomposition that can be avoided composition epoxy resin
Enclose lower heating while progress.Furthermore it is possible to implement calendering process, grinding processing etc. as needed.It, can be with as supporting base material
It enumerates for example: porous substrate, polyethylene, polypropylene, polyethylene terephthalate, polyester comprising paper, cloth, non-woven fabrics etc.
The thin paper shape object (slender lobule body) appropriate such as the plastic foils such as film or sheet material, mesh, foaming body, metal foil and their laminated body
Deng, but it is not limited to these.Thickness is not particularly limited in supporting base material, is suitably determined depending on the application.
Lowering viscousity and its leaching can be made and by composition epoxy resin of the invention and/or resin sheet heating melting
It seeps in fiber base material, thus obtains prepreg of the invention.
Alternatively, it is also possible to and making the composition epoxy resin of varnish shape be infiltrated in fiber base material and be thermally dried
Obtain prepreg of the invention.Above-mentioned prepreg is cut into desired shape and is laminated, is then pressed into utilization
Shape method or autoclave forming process, sheet material winding (sheet winding) forming process etc. make ring while applying pressure to sandwich
Epoxy resin composition is heating and curing, it is hereby achieved that carbon fibre reinforced composite of the invention.Alternatively, it is also possible to presoak
Laminated copper foil or organic film when the stacking of material.
In addition, the manufacturing process of carbon fibre reinforced composite of the invention can use in addition to the method described above it is well known
Method, which is formed, to be obtained.Such as following resin transfer molding technology (RTM method) also can be used: carbon fiber base material is (logical
Be often used carbon fibre fabric) cut, be laminated, figuration and make prefabrication (infiltration resin before preliminary forming body), by prefabrication
It is configured in shaping dies and is closed mold, resin is injected and it is made to be infiltrated in prefabrication, and solidified, then open mould
Tool takes out formed products.
Alternatively, it is also possible to one kind used as RTM method, such as VaRTM method, SCRIMP (Seeman ' s
Composite Resin Infusion Molding Process, western graceful composite resin infiltration are molded) method, Japan
(Controlled Atmospheric Pressure Resin Infusion, can by the CAPRI that special table 2005-527410 is recorded
Governor pressure resin penetration forming technique) method etc., the CAPRI method is to be exhausted resin feed trough to subatmospheric pressure
Power is compressed using circulation, and controls net forming pressure, thus more suitably controls resin molding process, especially VaRTM method.
In addition it is also possible to the following method: clamping the membrane stack method of fiber base material with resin sheet (film)；Or in order to improve
The method for infiltrating and powdered resin being made to be attached to reinforcing-fiber substrate；Make during making resin be mixed in fiber base material
With fluidized bed or the manufacturing process (Powder Impregnated Yarn, powder infusion yarn) of fluid slurry method；Make resin fibre
It is blended the method in fiber base material.
It as carbon fiber, can enumerate: the carbon fibers such as acrylic compounds, pitch class, artificial silk class, wherein it is preferable to use drawings
Stretch the carbon fiber of the high acrylic compounds of intensity.These fibers can also be used in mixed way two or more.As the form of carbon fiber,
It is not particularly limited, the long fibre pulled together in one direction, short linen, fabric, pad, knitted fabric, woven stripe can be used for example
Band (group body knob) is cut into the staple fiber of length less than 10mm etc..Long fibre described herein refers to that substantial 10mm or more connects
Continuous staple fiber or fibre bundle.In addition, staple fiber refers to the fibre bundle for being cut into the length less than 10mm.Especially requiring to compare
Intensity, the use higher than elasticity modulus on the way, fibre bundle are most suitable for along the arrangement that single direction pulls together, but operate easy cloth
The arrangement of (fabric) shape is also suitble to.
Embodiment
It is exemplified below synthesis example and embodiment and further specifically describes feature of the invention.Material as shown below,
Process content, processing step etc. can be suitably changed without departing from the spirit and scope of the invention.Therefore, of the invention
Range should not restrictively be explained by concrete example as shown below.
Epoxide equivalent
It is measured using the method recorded in JIS K-7236, unit g/eq..
Softening point
It is measured using the method according to JIS K-7234, unit is DEG C.
Synthesis example 1
In the flask for being equipped with thermometer, condenser pipe, blender, 316 parts of phenol, 158 parts of resorcinol is added, and rise
Then temperature adds 201 parts of 4,4 '-dichloride methyl biphenyl with 2 hour substeps to 100 DEG C, and it is small to react 5 again at the same temperature
When.Then, 160 DEG C are warming up to, 4,4 '-dichloride methyl biphenyl total overall reactions are made.Therebetween, HC1 generated is captured simultaneously using alkali
It is distilled off.After reaction, using rotary evaporator, at 180 DEG C and under reduced pressure by unreacting phenol and unreacted
Resorcinol is distilled off, and results in 266 parts of phenol resin (P-1).The hydroxyl equivalent of obtained phenol resin (P-1) is
137g/eq., softening point are 94 DEG C, and ICI viscosity is 470mPas, and it is 64% that dihydric phenol, which imports ratio,.
Synthesis example 2
In the flask for having blender, reflux condensing tube, agitating device, synthesis example is added while implementing nitrogen purging
Obtained 266 parts of phenol resin (P-1), 719 parts of epichlorohydrin, 72 parts of methanol, 21 parts of water in 1, and it is warming up to 75 DEG C.Next,
83 parts of laminar sodium hydroxide is added with 90 minutes substeps, has then carried out reaction in 75 minutes at 75 DEG C again.Reaction knot
It is washed after beam, using rotary evaporator, is distilled excessive epichlorohydrin equal solvent at 140 DEG C and under reduced pressure from organic layer
It removes.750 parts of methyl iso-butyl ketone (MIBK) is added in residue and is dissolved, and is warming up to 75 DEG C.30% hydrogen-oxygen is added under stiring
Change 52 parts of sodium water solution and react within 1 hour, washing then is carried out to organic layer until washing water uses rotation as neutrality
Turn evaporator, methyl iso-butyl ketone (MIBK) equal solvent is distilled off at 180 DEG C and under reduced pressure from obtained organic layer, thus
338 parts of epoxy resin (EP1) is arrived.The epoxide equivalent of obtained epoxy resin (EP1) is 209g/eq., softening point 71
DEG C, the viscosity at 150 DEG C is 370mPas, and the importing ratio of 2 yuan of glycidyl substituted-phenyls is 68%.
Embodiment 1, comparative example 1
Use epoxy resin (EP1) obtained in synthesis example 2 and the epoxy resin (EP2, the Japanese chemical drug system that compare
Make, bisphenol A type epoxy resin, RE-310S), using with the same amount of methyl ethyl ketone of epoxy resin, to relative to epoxy resin
Being calculated as the curing agent of 1 equivalent and weight relative to epoxy resin using Ahew is 1phr as curing accelerator
Catalyst be diluted, and mixed, be then coated on using 100 microns of applicator (applicator) at room temperature
Polyimides (UPIlex), then 120 DEG C circulation nitrogen 5 minutes, while being dried, respectively obtained using hot-air drier
Resin sheet.The film thickness for having used the resin sheet of the invention of obtained epoxy resin (EP1) in synthesis example 2 is average 32 μ
M, having used the comparison of the epoxy resin compared with resin sheet is semi-solid, can not measure film thickness.It confirmed obtained
Resin sheet of the invention can be dissolved in tetrahydrofuran, be before curing.
Embodiment 2~4, comparative example 2
Respectively using 21 parts of obtained epoxy resin (EP1) and epoxy resin (EP2, the day compared in synthesis example 2
The manufacture of this chemical drug, bisphenol A type epoxy resin, RE-310S) 18 parts, make to be calculated as 1 equivalent relative to epoxy resin with Ahew
Curing agent melted at 140 DEG C in aluminium cup, while being stirred and it made uniformly then to add the weight relative to epoxy resin
Amount is the catalyst as curing accelerator of 1phr and stirring, and cooling.Resin plate has been obtained as a result,.
Obtained resin plate is put into 180 DEG C of baking oven with being fitted into the state of aluminium cup, heats 10 at 180 DEG C as former state
Hour, to obtain the formed body and the formed body compared (the curing agent H- in table 2 of composition epoxy resin of the invention
1: bright and chemical conversion industry (Co., Ltd.) manufacture, phenol resol resins).From obtained resin plate cut out 2mm ×
The sample for evaluation of 10mm × 5mm is determined its characteristic using following projects and method.Measurement result is shown in table 1
With table 2.
Heat resistance, dimensional stability (line expansion change rate): TMA (thermomechanical measuring device, TA Instruments,
TMA-Q400EM, 2 DEG C/min of heating rate)
Elasticity modulus (DMA)
Measurement of Dynamic Viscoelasticity instrument: TA-instruments, DMA-2980
Measuring temperature range: -30 DEG C~280 DEG C
Heating rate: 2 DEG C/min
Test chip size: the test film for cutting into 5mm × 50mm has been used
Tg: using DMA measure in Tan- δ peak point as Tg.
Table 1
The epoxy resin of EP1 synthesis example 2
EP2 bisphenol A type epoxy resin, Japanese chemical drug manufacture, RE-310S
The resin recorded in synthesis example 1 described in the synthesis of amine compounds 1 Japanese Unexamined Patent Publication 2009-001783
According to table 1 it has been confirmed that using composition epoxy resin compared to comparing, epoxy resin group of the invention is being used
The offline expansion variation of the case where closing object is small, therefore excellent in dimensional stability.
Table 2
Even if according to table 2 it has been confirmed that composition epoxy resin of the invention with the Ahew of same degree
Other curing agent compare, also for high-fire resistance, and water absorption rate is low, and the material that the elasticity modulus under high temperature is high.
Embodiment 5, comparative example 3
Respectively using 6.8 parts of obtained epoxy resin (EP1) and epoxy resin (EP2, the day compared in synthesis example 2
The manufacture of this chemical drug, bisphenol A type epoxy resin, RE-310S) 6.5 parts, 1 is calculated as using relative to epoxy resin with Ahew
The curing agent of equivalent, and 6.7 parts of methyl ethyl ketone (MEK) are used as solvent, it is stirred in aluminium cup, so that resin concentration
Mode for 60 weight % has made uniform resin varnish.It is impregnated in the carbon cloth of 150 μm of thickness, 18 pieces/inch of line density
In prepared resin varnish, then solvent is set to volatilize under the drying condition of table 3, to make prepreg.Next, In
Apply the load 10 minutes of 10kg in hot plate press at 175 DEG C and make prepreg precuring, it is small that 2 are then carried out at 160 DEG C
When after solidification, carried out 6 hours at 180 DEG C after solidify, result in carbon fibre reinforced composite (CFRP).From acquired
CFRP cut out the rectangular sample for evaluation of 4mm × l6mm, and carried out the measurement of heat resistance using following methods.It will measurement
As a result it is shown in table 3.
Heat resistance, dimensional stability (line expansion change rate): TMA (thermomechanical measurement dress, TA Instruments,
TMA-Q400EM, 2 DEG C/min of heating rate)
Table 3
EP1: the epoxy resin of synthesis example 2
EP2: bisphenol A type epoxy resin, Japanese chemical drug manufacture, RE-310S
Amine compounds 1: the resin recorded in synthesis example 1 described in synthesis Japanese Unexamined Patent Publication 2009-001783
Carbon cloth 1: plain weave carbon cloth, goods number (PL140-N)
It, will be of the invention according to table 3 it has been confirmed that compared to the CFRP for comparing and being prepared with composition epoxy resin has been used
Composition epoxy resin and carbon fibers and the line expansion variation of carbon fibre reinforced composite (CFRP) for preparing is small, because
This excellent in dimensional stability.
The present invention is illustrated in detail referring to specific mode, but aobvious and easy to those skilled in the art
See, can make various changes and modifications without departing from the spirit and scope of the present invention.
It should be noted that Japanese patent application (the Japanese Patent Application 2014- that the application was proposed based on August 1st, 2014
157631) Japanese patent application (Japanese Patent Application 2015-14980) proposed on January 29th, 2015, quotes it by reference
It is whole.In addition, whole references cited herein are incorporated herein as a whole.
Industrial applicability
The carbon fibre reinforced composite manufactured using composition epoxy resin of the invention is light weight, and to from outer
There is excellent patience therefore can be preferred for fuselage, main wing, empennage, rotor blade, fairing, rectification for the impact in portion
The aircraft components such as cover, door, seat and interior material；The spacecrafts component such as engine casing and main wing；Main structure and antenna
Equal artificial satellites component；The automobile components such as outside plate, chassis, aerodynamics component and seat；The tracks such as main structure and seat
Vehicle component；The a large amount of building materials such as the ship structural components such as hull and seat.
Claims (5)
1. a kind of epoxy resin composition for carbon-fiber-reinforced composite material, wherein the carbon fibre reinforced composite ring
Epoxy resin composition is using epoxy resin represented by the following general formula (1) and amine curing agent as neccessary composition, the amine-type cure
Agent is the anline resin of two functions as obtained from the polycondensation of aniline and substituted biphenyl class or substituted benzene base class or more, and phase
For 1 equivalent of epoxy group of the epoxy resin, the usage amount of the amine curing agent is 0.7 equivalent~1.2 equivalents,
In formula, the ratio of (a) (b) is that the ratio of (a) (b) is that (a)/(b)=1~3, G indicates glycidyl, and n is repeat number
It and is 0~5.
2. epoxy resin composition for carbon-fiber-reinforced composite material as described in claim 1 also contains other asphalt mixtures modified by epoxy resin
Rouge.
3. a kind of resin sheet, it uses the carbon fibre reinforced composite asphalt mixtures modified by epoxy resin described in claim 1 or claim 2
Oil/fat composition.
4. a kind of prepreg, by by carbon fibre reinforced composite asphalt mixtures modified by epoxy resin described in claim 1 or claim 2
Oil/fat composition or resin sheet as claimed in claim 3 are infiltrated in carbon fiber and obtain.
5. a kind of carbon fibre reinforced composite is obtained by solidifying prepreg as claimed in claim 4.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014157631 | 2014-08-01 | ||
| JP2014-157631 | 2014-08-01 | ||
| JP2015-014980 | 2015-01-29 | ||
| JP2015014980A JP2016035038A (en) | 2014-08-01 | 2015-01-29 | Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, carbon-fiber-reinforced composite material |
| PCT/JP2015/071628 WO2016017747A1 (en) | 2014-08-01 | 2015-07-30 | Epoxy resin composition for carbon-fiber-reinforced composite material, resin sheet, prepreg, carbon-fiber-reinforced composite material |
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| Publication Number | Publication Date |
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| CN106661194A CN106661194A (en) | 2017-05-10 |
| CN106661194B true CN106661194B (en) | 2019-11-05 |
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| JP (1) | JP2016035038A (en) |
| KR (2) | KR20170040121A (en) |
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| CN108081700B (en) * | 2017-08-31 | 2020-11-17 | 镇江春环密封件集团有限公司 | Carbon fiber sectional winding composite thick-wall cylinder |
| JP7243092B2 (en) * | 2018-09-10 | 2023-03-22 | 株式会社レゾナック | Epoxy resins, epoxy resin compositions, cured epoxy resins and composite materials |
| CN109608668A (en) * | 2018-12-03 | 2019-04-12 | 北京化工大学 | A kind of preparation of carbon fiber/graphene oxide/epoxy prepreg and carbon fibre composite |
| CN113248275B (en) * | 2021-07-02 | 2022-04-22 | 杭州幄肯新材料科技有限公司 | Light carbon fiber/carbon cylinder thermal field material with graphite coating coated on surface and preparation method thereof |
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| CN103897143A (en) * | 2012-12-28 | 2014-07-02 | 明和化成株式会社 | Epoxy resin as well as preparation method and application thereof |
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| JP3476027B2 (en) * | 1994-04-28 | 2003-12-10 | 日本化薬株式会社 | Manufacturing method of epoxy resin |
| JP2004189811A (en) * | 2002-12-10 | 2004-07-08 | Toho Tenax Co Ltd | Woven fabric prepreg |
| JP6085172B2 (en) * | 2010-04-21 | 2017-02-22 | 三菱瓦斯化学株式会社 | Thermosetting composition |
| JP5754731B2 (en) * | 2011-08-25 | 2015-07-29 | 明和化成株式会社 | Epoxy resin, method for producing epoxy resin, and use thereof |
| CN102964775B (en) * | 2012-10-16 | 2015-09-16 | 广东生益科技股份有限公司 | A kind of compositions of thermosetting resin and uses thereof |
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| KR20210141764A (en) | 2021-11-23 |
| JP2016035038A (en) | 2016-03-17 |
| CN106661194A (en) | 2017-05-10 |
| TW201609948A (en) | 2016-03-16 |
| KR20170040121A (en) | 2017-04-12 |
| WO2016017747A1 (en) | 2016-02-04 |
| KR102354077B1 (en) | 2022-01-24 |
| TWI651360B (en) | 2019-02-21 |
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