CN106661194A - Epoxy resin composition for carbon-fiber-reinforced composite material, resin sheet, prepreg, carbon-fiber-reinforced composite material - Google Patents
Epoxy resin composition for carbon-fiber-reinforced composite material, resin sheet, prepreg, carbon-fiber-reinforced composite material Download PDFInfo
- Publication number
- CN106661194A CN106661194A CN201580037761.7A CN201580037761A CN106661194A CN 106661194 A CN106661194 A CN 106661194A CN 201580037761 A CN201580037761 A CN 201580037761A CN 106661194 A CN106661194 A CN 106661194A
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- China
- Prior art keywords
- epoxy resin
- reinforced composite
- carbon
- fiber
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 116
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 116
- 239000000203 mixture Substances 0.000 title claims abstract description 58
- 229920005989 resin Polymers 0.000 title claims abstract description 55
- 239000011347 resin Substances 0.000 title claims abstract description 55
- 239000000463 material Substances 0.000 title claims abstract description 48
- 239000003733 fiber-reinforced composite Substances 0.000 title claims abstract description 21
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 33
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 7
- 239000000835 fiber Substances 0.000 claims description 45
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 31
- 229910052799 carbon Inorganic materials 0.000 claims description 30
- 239000002131 composite material Substances 0.000 claims description 28
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 11
- 239000004917 carbon fiber Substances 0.000 claims description 11
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 11
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 125000003277 amino group Chemical class 0.000 claims 1
- 239000011342 resin composition Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 34
- -1 diaminourea hexichol Sulfone Chemical class 0.000 description 29
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 25
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
- 239000002585 base Substances 0.000 description 18
- 230000015572 biosynthetic process Effects 0.000 description 15
- 238000003786 synthesis reaction Methods 0.000 description 15
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 12
- 239000004744 fabric Substances 0.000 description 9
- 150000002989 phenols Chemical class 0.000 description 9
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 8
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 8
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 8
- 239000005011 phenolic resin Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 7
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinyl group Chemical group C1(O)=CC(O)=CC=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 7
- 239000002966 varnish Substances 0.000 description 7
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 229940106691 bisphenol a Drugs 0.000 description 6
- 239000000460 chlorine Substances 0.000 description 6
- 229910052801 chlorine Inorganic materials 0.000 description 6
- WVDDGKGOMKODPV-UHFFFAOYSA-N hydroxymethyl benzene Natural products OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 6
- RDOXTESZEPMUJZ-UHFFFAOYSA-N methyl phenyl ether Natural products COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 239000003814 drug Substances 0.000 description 5
- 229940079593 drug Drugs 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 150000002924 oxiranes Chemical class 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- MLPVBIWIRCKMJV-UHFFFAOYSA-N 2-ethylaniline Chemical compound CCC1=CC=CC=C1N MLPVBIWIRCKMJV-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004567 concrete Substances 0.000 description 4
- 238000006068 polycondensation reaction Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000000930 thermomechanical effect Effects 0.000 description 4
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- KZTYYGOKRVBIMI-UHFFFAOYSA-N S-phenyl benzenesulfonothioate Natural products C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 150000005205 dihydroxybenzenes Chemical class 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 238000001802 infusion Methods 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000009417 prefabrication Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- ALLIZEAXNXSFGD-UHFFFAOYSA-N 1-methyl-2-phenylbenzene Chemical group CC1=CC=CC=C1C1=CC=CC=C1 ALLIZEAXNXSFGD-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- JECYUBVRTQDVAT-UHFFFAOYSA-N 2-acetylphenol Chemical compound CC(=O)C1=CC=CC=C1O JECYUBVRTQDVAT-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- TXFPEBPIARQUIG-UHFFFAOYSA-N 4'-hydroxyacetophenone Chemical compound CC(=O)C1=CC=C(O)C=C1 TXFPEBPIARQUIG-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical class C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000010426 asphalt Substances 0.000 description 2
- CJPQIRJHIZUAQP-MRXNPFEDSA-N benalaxyl-M Chemical compound CC=1C=CC=C(C)C=1N([C@H](C)C(=O)OC)C(=O)CC1=CC=CC=C1 CJPQIRJHIZUAQP-MRXNPFEDSA-N 0.000 description 2
- 150000001555 benzenes Chemical class 0.000 description 2
- IMHDGJOMLMDPJN-UHFFFAOYSA-N biphenyl-2,2'-diol Chemical group OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000003490 calendering Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000006735 epoxidation reaction Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000009969 flowable effect Effects 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000004780 naphthols Chemical class 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000012783 reinforcing fiber Substances 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
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- QYYZXEPEVBXNNA-QGZVFWFLSA-N (1R)-2-acetyl-N-[4-(1,1,1,3,3,3-hexafluoro-2-hydroxypropan-2-yl)phenyl]-5-methylsulfonyl-1,3-dihydroisoindole-1-carboxamide Chemical compound C(C)(=O)N1[C@H](C2=CC=C(C=C2C1)S(=O)(=O)C)C(=O)NC1=CC=C(C=C1)C(C(F)(F)F)(C(F)(F)F)O QYYZXEPEVBXNNA-QGZVFWFLSA-N 0.000 description 1
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- CMZYGFLOKOQMKF-UHFFFAOYSA-N 1-(3,5-dimethylphenyl)-3,5-dimethylbenzene Chemical group CC1=CC(C)=CC(C=2C=C(C)C=C(C)C=2)=C1 CMZYGFLOKOQMKF-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- UIMPAOAAAYDUKQ-UHFFFAOYSA-N 1-methoxy-4-(4-methoxyphenyl)benzene Chemical group C1=CC(OC)=CC=C1C1=CC=C(OC)C=C1 UIMPAOAAAYDUKQ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
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- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
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- PNWSHHILERSSLF-UHFFFAOYSA-N 4-methylbenzene-1,3-dicarboxylic acid Chemical class CC1=CC=C(C(O)=O)C=C1C(O)=O PNWSHHILERSSLF-UHFFFAOYSA-N 0.000 description 1
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- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 1
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- 241001614291 Anoplistes Species 0.000 description 1
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- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical class [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- 239000004150 EU approved colour Substances 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical compound O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- BULOCEWDRJUMEL-UHFFFAOYSA-N benzene formaldehyde Chemical compound C=O.C1=CC=CC=C1.C=O BULOCEWDRJUMEL-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000002520 cambial effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 229940113088 dimethylacetamide Drugs 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- SXZIXHOMFPUIRK-UHFFFAOYSA-N diphenylmethanimine Chemical compound C=1C=CC=CC=1C(=N)C1=CC=CC=C1 SXZIXHOMFPUIRK-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000004002 naphthaldehydes Chemical class 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 229940006093 opthalmologic coloring agent diagnostic Drugs 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- FTDXCHCAMNRNNY-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1 FTDXCHCAMNRNNY-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- ZWLUXSQADUDCSB-UHFFFAOYSA-N phthalaldehyde Chemical compound O=CC1=CC=CC=C1C=O ZWLUXSQADUDCSB-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- XDOBJOBITOLMFI-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical class CC1=CC=CC=C1.O=C1NC(=O)C=C1 XDOBJOBITOLMFI-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007613 slurry method Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
Abstract
The invention discloses an epoxy resin composition for a carbon-fiber-reinforced composite material, a resin sheet, a prepreg, and a carbon-fiber-reinforced composite material. The purpose of the present invention is to provide an epoxy resin composition for a carbon-fiber-reinforced composite material, and a superior prepreg, a superior resin sheet, and a superior carbon-fiber-reinforced composite material that use the resin composition. When used as an epoxy resin composition for a carbon-fiber-reinforced composite material, the epoxy resin composition can be cured to provide a carbon-fiber-reinforced composite material that demonstrates high heat resistance and dimensional stability as well as high toughness and rigidity. This epoxy resin composition for a carbon-fiber-reinforced composite material contains as essential components an epoxy resin represented by general formula (1) and a curing agent. (In the formula as shown in the description, the ratio ((a)/(b)) of (a) and (b) is 1-3, G represents a glycidyl group, and n represents the number of repetitions and is 0-5).
Description
Technical field
The present invention relates to a kind of composition epoxy resin for being suitable for carbon fibre reinforced composite and use the epoxy
The resin sheet of resin combination, prepreg, make its carbon fibre reinforced composite obtained from solidification.
Background technology
Epoxy resin is solidified by using various curing agent, forms usual engineering properties, resistance to water, chemical-resistant, resistance to
The excellent solidfied material such as hot, electrical properties, and it is wide to be applied to adhesive, coating, plywood, moulding material, founding materials etc.
In general field.Wherein, especially in the field of fibre reinforced composites, using epoxy resin and curing agent as matrix resin
And be infiltrated in reinforcing fiber and solidify it, it is possible thereby to the characteristics such as lightweight, high intensity are given, therefore in airframe
In computer purposes such as the housing (shell) with component, the blade of windmill, automobile exterior panel and chip tray or notebook computer etc.
Extensively application, and its demand just increases year by year.
In recent years, as described above, the range of application of carbon fibre reinforced composite (CFRP) expands, various shapes are gradually available for
The formed body of shape.In this case it is necessary to be carried out to these complicated shapes by the single base material of laminating or multiple base materials
Shaping.
It is assumed that above-mentioned formed body is used under the harsh environment of automobile or aircraft equitemperature environment, according to the thickness of the CFRP
Or shape, easily occur it is larger by and carbon fiber line swell increment the strain that causes of difference.Specifically, for example thickness compared with
The part of thickness and the part of thinner thickness, line swell increment is different, and due to pulling each other, therefore the stress of inside easily stores
Product.Therefore, crack or the problems such as stripping with carbon fiber.
In addition, generally in the reinforced fiber plastics such as CFRP, the difference of the linear expansion coefficient of the resin of its fiber and solidification matrix
Greatly, especially in the case of carbon fiber, line is expanded to negative, and the line expansion strain caused by temperature cycles becomes big.
As can be seen here, in order that the line expansion change of resin itself is as little as possible and be resistant to the stress, it is desirable to strong
The high matrix resin of degree/obdurability.
Conventionally, there is known with the phenol resol resins with biphenyl backbone, by by benzene obtained from its epoxidation
Phenol phenolic resin varnish type epoxy resin and curing agent for neccessary composition electronic part encapsulation composition epoxy resin (for example, specially
Sharp document 1).However, in the patent document 1, though describe the heat resistance of electronic part encapsulation epoxy composite, anti-flammability
It is excellent, but with regard to reducing the specific resin composition of line expansion characteristics without any record, and with regard to carbon fiber reinforced plastic
The serviceability of material purposes is also silent on.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2013-43958 publications
The content of the invention
Invent problem to be solved
The problem of the present invention is in view of above-mentioned problem of the prior art point, there is provided a kind of carbon fibre reinforced composite is used
Composition epoxy resin and excellent prepreg, resin sheet, the carbon fibre reinforced composite of the resin combination are used,
The epoxy resin composition for carbon-fiber-reinforced composite material is in the epoxy composite as carbon fibre reinforced composite
During thing, using the teaching of the invention it is possible to provide show that high-fire resistance, dimensional stability and high tenacity, rigid fibre reinforced are multiple as its solidfied material
Condensation material.
Means for solving the problem
The present inventor etc. has made intensive studies to the problems referred to above, as a result finds, containing the phenol phenol with ad hoc structure
The composition epoxy resin of Novolac type epoxy resin and curing agent is as offer high-fire resistance and low linear expansion is excellent
The excellent composition epoxy resin of the epoxy resin composition for fiber-reinforced composite material of resin cured matter, so as to complete this
Invention.
That is, the present invention is provided：
(1) a kind of epoxy resin composition for carbon-fiber-reinforced composite material, wherein, the carbon fibre reinforced composite
With the epoxy resin and curing agent represented by composition epoxy resin with following formulas (1) as neccessary composition,
(in formula, (a) ratio of (b) is (a)/(b)=1～3, and G represents glycidyl, and n is repeat number and for 0～5)；
(2) epoxy resin composition for carbon-fiber-reinforced composite material described in (1) as described above, wherein, above-mentioned curing agent
For amine curing agent；
(3) epoxy resin composition for carbon-fiber-reinforced composite material described in (1) or (2) as described above, it also contains it
Its epoxy resin；
(4) a kind of resin sheet, it uses above-mentioned (1) and uses to the carbon fibre reinforced composite any one of (3)
Composition epoxy resin；
(5) a kind of prepreg, it passes through to use above-mentioned (1) to the carbon fibre reinforced composite any one of (3)
Resin sheet described in composition epoxy resin or above-mentioned (4) is infiltrated in carbon fiber and obtains；
(6) a kind of carbon fibre reinforced composite, it is by the way that the prepreg solidification described in above-mentioned (5) is obtained.
Invention effect
According to the present invention it is possible to provide a kind of epoxy resin composition for carbon-fiber-reinforced composite material, used the ring
The resin sheet of epoxy resin composition, prepreg, carbon fibre reinforced composite, the carbon fibre reinforced composite asphalt mixtures modified by epoxy resin
The solidfied material of oil/fat composition shows low linear expansion coefficient (excellent dimensional stability), high-fire resistance and high tenacity, rigidity.
Description of the drawings
Fig. 1 is the thermo-mechanical analysis figure of the carbon fibre reinforced composite obtained by embodiment 5.
Fig. 2 is the thermo-mechanical analysis figure of the carbon fibre reinforced composite obtained by comparative example 3.
Specific embodiment
The epoxy resin composition for carbon-fiber-reinforced composite material of the present invention is illustrated.
The present invention epoxy resin composition for carbon-fiber-reinforced composite material (hereinafter referred to as " and the present invention epoxy resin
Composition ") containing the epoxy resin represented by following formulas (1) as neccessary composition.
(in formula, (a) ratio of (b) is (a)/(b)=1～3, and G represents glycidyl, and n is repeat number and for 0～5).
The epoxy resin represented by above-mentioned formula (1) used in the present invention, can pass through Japanese Unexamined Patent Publication 2011-252037
Number publication, Japanese Unexamined Patent Publication 2008-156553 publications, Japanese Unexamined Patent Publication 2013-043958 publications, International Publication WO2012/
053522nd, the method described in WO2007/007827 is synthesized, as long as having the structure of above-mentioned formula (1), it is possible to use arbitrarily
The epoxy resin of method synthesis.
Wherein, in the present invention, the ratio especially with above-mentioned formula (a) and above-mentioned formula (b) is (a)/(b)=1～3
Epoxy resin.When the structure of () is more a, heat resistance is improved, but correspondingly not only its water absorption character is deteriorated, and is become fragile and be hardened.Cause
This, the multifunctional rate being set as in above range.
The softening point (ring and ball method) of the epoxy resin for being used is preferably 50 DEG C～150 DEG C, more preferably 52 DEG C～
100 DEG C, particularly preferably 52 DEG C～95 DEG C.When softening point is less than 50 DEG C, sometimes tacky violent, operating difficulties and in productivity ratio
Aspect produces problem.In addition, being the temperature of close forming temperature, it is possible to cannot be true in the case that softening point is more than 150 DEG C
Mobility during shaping is protected, thus it is not preferred.
The epoxide equivalent of the epoxy resin for being used is preferably 180g/eq.～350g/eq..Particularly preferably 190g/eq.
～300g/eq..In the case where epoxide equivalent is less than 180g/eq., functional group is excessive, therefore the solidfied material after solidifying is inhaled sometimes
Water rate is uprised and easily become fragile.In the case where epoxide equivalent is more than 350g/eq., it is believed that softening point become very large or
Person's epoxidation is not thoroughly carried out, it is possible to which chlorine dose becomes very many, therefore not preferred.
It should be noted that the chlorine dose of the epoxy resin used in the present invention is preferably in terms of total chlorine (Hydrolyze method)
200ppm～1500ppm, particularly preferably 200ppm～900ppm.According to the standard of JPCA, the chlorine dose of epoxy monomer is expected
Less than 900ppm.It is additionally, when chlorine dose is more, it is possible to correspondingly produce impact to electrical reliability therefore not preferred.In chlorine dose
In the case of less than 200ppm, excessive purification procedures in need, the tendency so as to produce problem in terms of productivity ratio, therefore not
It is preferred that.
It should be noted that the melt viscosity at 150 DEG C of the epoxy resin used in the present invention is preferably
0.05Pas～5Pas, particularly preferably 0.05Pas～2.0Pas.When viscosity is high, it is possible to produce in terms of mobility
Problem is produced in terms of raw problem, and the flowable or embeddability in pressurization.In the case of less than 0.05Pas, molecule
Amount is too small, therefore sometimes heat resistance is not enough.
(a) and the ratio of (b) are (a)/(b)=1～3 in above-mentioned formula (1).That is, it is characterised by that more than half is isophthalic two
The glycidol ether form of phenol structure.The ratio is important to the precipitation of crystal and the raising of heat resistance, and preferably (a)/(b) surpasses
Cross 1.In addition, by making (a)/(b) be less than 3, the amount of the glycidol ether form of resorcinol structure is limited, it is possible thereby to change
Kind water absorption rate and obdurability.
In above-mentioned formula (1), n is repetitive, is 0～5.Control to make prepreg or resin sheet by making n less than 5
When flowable or mobility.In the case where it is more than 5, problem is not only produced in terms of mobility, and in a solvent
Dissolubility aspect also produce problem.
Epoxy resin used in present invention dissolubility in a solvent is important.For example, and with same bone
In the case of the epoxy resin of the biphenyl aralkyl-type of frame, with regard to these resins, it is also desirable to methyl ethyl ketone or toluene, the third two
Dissolubility in alcohol monomethyl ether equal solvent.
Dissolubility particularly in methyl ethyl ketone is important, and is required at 5 DEG C, 2 months under the conditions of room temperature etc.
Below crystal is not separated out.Also relevant with the ratio of above-mentioned (a)/(b), when (a) value is big, crystal is easily separated out, therefore (a)/(b) is
More than 1 is important.
The curing agent that can be used in composition epoxy resin as the present invention, can enumerate for example：Amine curing agent,
Acid anhydride type curing agent, amide-type curing agent and phenols curing agent etc..Wherein, amine curing agent can balancedly take into account epoxy resin
The low linear expansion of composition and the heat resistance of resin cured matter, therefore preferably.
As the amine curing agent preferably comprised in the present invention, can enumerate：MDA, diaminourea hexichol
Sulfone, IPD, naphthylenediamine, aniline novolaks, o ethyl aniline novolaks, by aniline and xylylene dichlorides
Anline resin obtained from reaction, by aniline and substituted biphenyl class (4,4 '-bis- (chloromethyls) -1,1 '-biphenyl and 4,4 '-bis-
(methoxy) -1,1 '-biphenyl etc.) or substituted benzene base class (double (chloromethyl) benzene of 1,4-, 1,4- pair (methoxy)
Benzene and Isosorbide-5-Nitrae-bis- (hydroxymethyl) benzene etc.) etc. polycondensation obtained from anline resin etc., but be not limited to these.
Particularly from from the aspect of obdurability and heat resistance, optimization aromatic amines, wherein, for 3,3 '-two
ADP sulfone, 4,4 '-DADPS, aniline novolaks, o ethyl aniline novolaks, by aniline and dichloromethane
Anline resin obtained from the reaction of base benzene, by aniline and substituted biphenyl class (4,4 '-bis- (chloromethyls) -1,1 '-biphenyl and 4,
4 '-bis- (methoxies) -1,1 '-biphenyl etc.) or substituted benzene base class (double (chloromethyl) benzene of 1,4-, the double (methoxyl groups of 1,4-
Methyl) benzene and Isosorbide-5-Nitrae-bis- (hydroxymethyl) benzene etc.) etc. polycondensation obtained from for anline resin, its opposing flexure or stress
From the aspect of intensity height, the elastic modelling quantity that can be improved according to its crosslink density under high temperature, the intensity from raising as CFRP
It is also preferred that, additionally, from from the aspect of heat resistance preferably.
In addition, enumerating the example of other curing agent that can contain.
As acid anhydride type curing agent, can enumerate：Phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, maleic acid
Acid anhydride, tetrabydrophthalic anhydride, methyl tetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride and first
Base hexahydrophthalic anhydride etc..
As amide-type curing agent, can enumerate：Dicyandiamide or the polyamides synthesized by linolenic dimer and ethylenediamine
Polyimide resin etc..
As phenols curing agent, can enumerate：Polyatomic phenol (bisphenol-A, Bisphenol F, bisphenol S, bisphenol fluorene, terpene diphenol, 4,
4 '-dihydroxybiphenyl, 2,2 '-dihydroxybiphenyl, 3,3 ', 5,5 '-tetramethyl-(1,1 '-biphenyl) -4,4 '-glycol, to benzene two
Phenol, resorcinol, naphthalenediol, three (4- hydroxy phenyls) methane and 1,1,2,2- tetra- (4- hydroxy phenyls) ethane etc.)；By phenols
(phenol, alkyl substituted phenol, naphthols, alkyl-substituted naphthaline phenol, dihydroxy benzenes and dihydroxy naphthlene etc.) and aldehydes (formaldehyde, acetaldehyde, benzene
Formaldehyde, parahydroxyben-zaldehyde, salicylaldhyde and furfural etc.), ketone (parahydroxyacet-ophenone and o-hydroxyacetophenone etc.) or
Phenol resin obtained from the condensation of dienes (dicyclopentadiene and three dicyclopentadienes etc.)；Joined with replacing by above-mentioned phenols
Benzene class (4,4 '-bis- (chloromethyls) -1,1 '-biphenyl and 4,4 '-bis- (methoxies) -1,1 '-biphenyl etc.) or substituted-phenyl
The polycondensation of class (double (methoxy) benzene of double (chloromethyl) benzene of 1,4-, 1,4- and double (hydroxymethyl) benzene of 1,4- etc.) etc. and obtain
Phenol resin；The modified product of above-mentioned phenols and/or above-mentioned phenol resin；The halo phenols such as tetrabromobisphenol A and brominated phenolic resin.
In addition, as imidazole curing agent, can enumerate：BF3- amine complex, guanidine derivatives etc..
In the composition epoxy resin of the present invention, the usage amount of curing agent is excellent relative to the equivalent of epoxy radicals 1 of epoxy resin
Elect 0.7 equivalent～1.2 equivalent as.Be relative to the equivalent of epoxy radicals 1 less than 0.7 equivalent in the case of or more than 1.2 equivalents
In the case of, being possible to solidify becomes incomplete and cannot obtain good solidification physical property.
In addition, in the composition epoxy resin of the present invention, can as needed coordinate curing accelerator.Can also be by making
Gelation time is adjusted with curing accelerator.As the example of the curing accelerator that can be used, can enumerate：2- methyl miaows
The imidazoles such as azoles, 2- ethyl imidazol(e)s, 2-ethyl-4-methylimidazole；2- (dimethylamino methyl) phenol, 1,8- diazabicyclos
The tertiary amines such as [5.4.0] 11 carbon -7- alkene；The phosphines such as triphenylphosphine；The metallic compounds such as tin octoate.Relative to epoxy resin
100 weight portions, can use as needed the curing accelerator of 0.01 weight portion～5.0 weight portion.
In the composition epoxy resin of the present invention, the epoxy resin represented by above-mentioned formula (1) can be used alone, and also may be used
To coordinate other epoxy resin and and with more than two kinds.As can be with other asphalt mixtures modified by epoxy resin of the epoxy resin of formula (1)
The concrete example of fat, can enumerate：Phenols (phenol, alkyl substituted phenol, aromatic series fortified phenol, naphthols, alkyl-substituted naphthaline phenol,
Dihydroxy benzenes, alkyl replace dihydroxy benzenes, dihydroxy naphthlene etc.) (formaldehyde, acetaldehyde, alkyl aldehydes, benzaldehyde, alkyl take with various aldehyde
For benzaldehyde, hydroxy benzaldehyde, naphthaldehyde, glutaraldehyde, OPA, crotonaldehyde, cinnamic acid etc.) condensation polymer；Phenols with
Various diolefin compounds (dicyclopentadiene, terpenes, VCH, norbornadiene, vinyl norbornene, four
Hydrogen indenes, divinylbenzene, divinyl biphenyls, diisopropenyl biphenyl, butadiene, isoprene etc.) polymer；Phenols with
The condensation polymer of ketone (acetone, methyl ethyl ketone, methyl iso-butyl ketone (MIBK), acetophenone, benzophenone etc.)；Joined with replacing by phenols
Benzene class (4,4 '-bis- (chloromethyls) -1,1 '-biphenyl and 4,4 '-bis- (methoxies) -1,1 '-biphenyl etc.) or substituted-phenyl
The polycondensation of class (double (methoxy) benzene of double (chloromethyl) benzene of 1,4-, 1,4- and double (hydroxymethyl) benzene of 1,4- etc.) etc. and obtain
Phenol resin；Bisphenols and condensation polymer, alcohols of various aldehyde etc. are carried out into glycidol ethers obtained from Glycidyl
Epoxy resin；With 4- vinyl -1- cyclohexene diepoxide or 3,4- epoxycyclohexyl-methyl -3,4 '-epoxycyclohexyl first
Acid esters etc. for representative alicyclic epoxy resin；With four glycidyl group MDA (TGDDM) or three-glycidyl
Base para-aminophenol etc. for representative glycidyl amine epoxy resin；Glycidyl ester epoxy resin etc., but, as long as
The epoxy resin being usually used, is not limited to these.
With other epoxy resin and in the case of using, the epoxy resin of above-mentioned formula (1) institute in whole epoxy resin
The ratio for accounting for is preferably more than 30 weight %, more than particularly preferably 40 weight %.The ratio of the epoxy resin of above-mentioned formula (1)
During less than 30 weight %, the physical property such as high-fire resistance, dimensional stability, obdurability, resistance to water cannot be obtained sometimes.
In the composition epoxy resin of the present invention, can also as needed coordinate known additive.As can use
Additive concrete example, can enumerate：Polybutadiene and its modified product, the modified product of acrylonitrile copolymer, polyphenylene oxide,
Polystyrene, polyethylene, polyimides, fluorine resin, maleimide compound, cyanate compound, Silica hydrogel, silicon
Oil and silica, aluminum oxide, calcium carbonate, silica flour, aluminium powder, graphite, talcum, clay, iron oxide, titanium oxide, nitridation
The surface conditioning agent of the packing materials such as the inorganic filling materials such as aluminium, asbestos, mica, glass powder, silane coupler, releasing agent,
The colouring agents such as carbon black, phthalocyanine blue, phthalocyanine green.
In addition, in the composition epoxy resin of the present invention, can as needed coordinate known maleimide chemical combination
Thing.As the concrete example of the maleimide compound that can be used, can enumerate：4,4'- dimaleoyl imino hexichol first
Alkane, many phenylmethane maleimides, meta-phenylene bismaleimide, 2,2 '-bis- [4- (4- maleimide phenoxyls)
Phenyl] propane, 3,3 '-dimethyl -5,5 '-diethyl -4,4 '-dimaleoyl imino diphenyl-methane, 4- methyl isophthalic acids, 3- Asias benzene
Double (the 3- of base BMI, 4,4 '-dimaleoyl imino diphenyl ether, 4,4 '-dimaleoyl imino diphenyl sulphone (DPS), 1,3-
Maleimide phenoxyl) benzene, double (4- maleimide phenoxyls) benzene of 1,3- etc., but it is not limited to these.These horses
Carry out imide analog compounds can be used alone, it is also possible to and use two or more.When coordinating maleimide compound, according to
Need to coordinate curing accelerator, it is possible to use the radical polymerization such as above-mentioned curing accelerator or organic peroxide, azo-compound
Close initiator etc..
Organic solvent can be added in the composition epoxy resin of the present invention and the composition of varnish shape is made (below,
Referred to as varnish).As the solvent for being used, can enumerate for example：Gamma-butyrolacton class, 1-METHYLPYRROLIDONE, N, N- diformazans
The amide solvents such as base formamide, DMAC N,N' dimethyl acetamide, N, N- methylimidazole alkanones；The sulfone class such as sulfolane；Diethyl two
Diethylene glycol dimethyl ether, diethylene glycol diethyl ether, propane diols, propylene glycol monomethyl ether, propylene glycol monomethyl ether monoacetate, propylene glycol monobutyl ether
Deng ether solvent；The ketones solvents such as methyl ethyl ketone, methyl iso-butyl ketone (MIBK), cyclopentanone, cyclohexanone；The fragrance such as toluene, dimethylbenzene
Same clan's solvent.Solvent can be in resulting varnish the solid point concentration in addition to solvent be usually 10 weight %～80 weights
Use in the range of amount %, preferably 20 weight %～70 weight %.
Resin sheet, prepreg to the present invention, carbon fibre reinforced composite are illustrated.
The composition epoxy resin of the present invention can be coated the one or two sides of supporting base material and be used as resin sheet.Make
For coating process, can enumerate for example：Casting；Using pump or extruder etc. resin is extruded and utilized from nozzle or die orifice and scraped
The method that knife adjusts thickness；The method for carrying out calendering processing using roller and adjusting thickness；Sprayed using sprayer unit etc.
Method etc..It should be noted that cambial operation can be in the temperature model of the thermal decomposition that can avoid composition epoxy resin
Carry out while enclosing lower heating.Furthermore it is possible to implement calendering process, grinding process etc. as needed.As supporting base material, can be with
Enumerate for example：Porous substrate comprising paper, cloth, non-woven fabrics etc., polyethylene, polypropylene, polyethylene terephthalate, polyester
The appropriate thin paper shape thing (Bao Leaf bodies such as the plastic foils such as film or sheet material, net, foaming body, metal forming and their duplexer)
Deng, but it is not limited to these.Thickness is not particularly limited in supporting base material, is suitably determined according to purposes.
Lowering viscousity and it can be soaked by the way that the composition epoxy resin and/or resin sheet of the present invention added into heat fusing
Ooze in fiber base material, thus obtain the prepreg of the present invention.
Alternatively, it is also possible to by make the composition epoxy resin of varnish shape be infiltrated in fiber base material and be thermally dried and
Obtain the prepreg of the present invention.Above-mentioned prepreg is cut into into desired shape and is laminated, be then pressed in utilization
Shape method or autoclave forming process, sheet material winding (sheet winding) forming process etc. make ring while applying pressure to sandwich
Epoxy resin composition is heating and curing, it is hereby achieved that the carbon fibre reinforced composite of the present invention.Alternatively, it is also possible in preimpregnation
Laminated copper foil or organic film during the stacking of material.
Additionally, the manufacturing process of the carbon fibre reinforced composite of the present invention can utilize in addition to the method described above known
Method is formed and obtained.Following resin transfer molding technology (RTM methods) can also for example be used：Carbon fiber base material is (logical
Often use carbon fibre fabric) cut, be laminated, figuration and make prefabrication (infiltration resin before preliminary forming body), by prefabrication
Be configured in shaping dies and close mould, resin by injection and make it be infiltrated in prefabrication, and solidified, then open mould
Tool, takes out formed products.
Alternatively, it is also possible to use as a kind of of RTM methods, such as VaRTM methods, SCRIMP (Seeman ' s
Composite Resin Infusion Molding Process, western graceful composite resin infiltration is molded) method, Japan
(Controlled Atmospheric Pressure Resin Infusion, can for the CAPRI that special table 2005-527410 is recorded
Governor pressure resin penetration forming technique) method etc., the CAPRI methods are that resin feed trough is exhausted to subatmospheric pressure
Power, using circulation compression, and controls net forming pressure, thus more suitably controls resin molding process, especially VaRTM methods.
In addition it is also possible to make with the following method：With the membrane stack method that resin sheet (film) clamps fiber base material；Or in order to improve
Infiltration and make the method that the resin of powder is attached to reinforcing-fiber substrate；Make during fiber base material mixed with resin is made
With the manufacturing process (Powder Impregnated Yarn, powder infusion yarn) of fluidized bed or fluid slurry method；Make resin fibre
The mixed method for being woven in fiber base material.
As carbon fiber, can enumerate：The carbon fibers such as acrylic compounds, pitch class, artificial silk class, wherein, preferably use drawing
Stretch the carbon fiber of the high acrylic compounds of intensity.These fibers can also be used in mixed way two or more.As the form of carbon fiber,
It is not particularly limited, for example, can uses long fibre, tow, fabric, pad, knitted fabric, the woven stripe for pulling together in one direction
With (Group み New-York), be cut into chopped fiber of length less than 10mm etc..Long fibre described herein refers to that substantial more than 10mm connects
Continuous chopped fiber or fibre bundle.In addition, chopped fiber refers to the fibre bundle for cutting into the length less than 10mm.Especially requiring ratio
In intensity, the purposes higher than elastic modelling quantity, fibre bundle is best suitable for along the arrangement that single direction is pulled together, but the cloth of processing ease
The arrangement of (fabric) shape also is adapted for.
Embodiment
It is exemplified below synthesis example and embodiment and further specifically describes the feature of the present invention.Material shown below,
Process content, process step etc., can suitably be changed without departing from the spirit and scope of the invention.Therefore, the present invention
Scope should restrictively not explained by concrete example shown below.
Epoxide equivalent
It is measured using the method described in JIS K-7236, unit is g/eq..
Softening point
Using being measured according to the method for JIS K-7234, unit for DEG C.
Synthesis example 1
In the flask of thermometer, condenser pipe, agitator is installed, 316 parts of phenol, 158 parts of resorcinol are added, and risen
, to 100 DEG C, then with 2 hour substeps addition 4,201 parts of 4 '-dichloride methyl biphenyl, and it is little to react 5 again at the same temperature for temperature
When.Then, 160 DEG C are warming up to, 4 is made, 4 '-dichloride methyl biphenyl total overall reaction.Therebetween, generated HC1 is captured simultaneously using alkali
It is distilled off.After reaction terminates, using rotary evaporator, at 180 DEG C and under reduced pressure by unreacting phenol and unreacted
Resorcinol is distilled off, and resulting in 266 parts of phenol resin (P-1).The hydroxyl equivalent of resulting phenol resin (P-1) is
137g/eq., softening point is 94 DEG C, and ICI viscosity is 470mPas, and it is 64% that dihydric phenol imports ratio.
Synthesis example 2
In the flask for possessing agitator, reflux condensing tube, agitating device, implementing to add synthesis example while nitrogen is purged
266 parts of resulting phenol resin (P-1), 719 parts of epichlorohydrin, 72 parts of methyl alcohol, 21 parts of water in 1, and it is warming up to 75 DEG C.Next,
Add 83 parts of laminar NaOH with 90 minutes substeps, the reaction of 75 minutes has then been carried out at 75 DEG C again.Reaction knot
Shu Houjin water-fillings are washed, and using rotary evaporator, are distilled excessive epichlorohydrin equal solvent at 140 DEG C and under reduced pressure from organic layer
Remove.Add 750 parts of methyl iso-butyl ketone (MIBK) in residue and dissolve, and be warming up to 75 DEG C.Add 30% hydrogen-oxygen under agitation
Change 52 parts of sodium water solution and carried out 1 hour reacting, washing is then carried out to organic layer becomes neutral up to washings, using rotation
Turn evaporimeter, be distilled off methyl iso-butyl ketone (MIBK) equal solvent at 180 DEG C and under reduced pressure from resulting organic layer, thus
338 parts of epoxy resin (EP1) is arrived.The epoxide equivalent of resulting epoxy resin (EP1) is 209g/eq., and softening point is 71
DEG C, the viscosity at 150 DEG C is 370mPas, and the importing ratio of 2 yuan of glycidyl substituted-phenyls is 68%.
Embodiment 1, comparative example 1
Using epoxy resin (EP1) resulting in synthesis example 2 and the epoxy resin (EP2, the Japanese chemical drug system that compare
Make, bisphenol A type epoxy resin, RE-310S), utilize and the same amount of methyl ethyl ketone of epoxy resin, to relative to epoxy resin
Using Ahew be calculated as 1 equivalent curing agent and relative to epoxy resin weight as 1phr as curing accelerator
Catalyst be diluted, and mixed at room temperature, then coated using 100 microns of applicator (applicator)
Polyimides (UPIlex), then circulate nitrogen 5 minutes at 120 DEG C, while being dried using hot-air drier, respectively obtains
Resin sheet.The thickness for having used the resin sheet of the invention of epoxy resin (EP1) resulting in synthesis example 2 is average 32 μ
M, the comparison resin sheet for having used the epoxy resin for comparing is semi-solid, it is impossible to determine thickness.Obtained by confirming
The resin sheet of the present invention can be dissolved in tetrahydrofuran, and it is before curing.
Embodiment 2～4, comparative example 2
Respectively using 21 parts of epoxy resin (EP1) resulting in synthesis example 2 and epoxy resin (EP2, the day compared
This chemical drug is manufactured, bisphenol A type epoxy resin, RE-310S) 18 parts, make to be calculated as 1 equivalent with Ahew relative to epoxy resin
Curing agent melt at 140 DEG C in aluminium cup, while being stirred and making it uniform, then add the weight relative to epoxy resin
Measure and as the catalyst of curing accelerator and stirred for 1phr, and cool down.Thus, resin plate has been obtained.
Resulting resin plate is put in 180 DEG C of baking oven with being fitted into the state of aluminium cup, 10 is heated at 180 DEG C as former state
Hour, so as to obtain the formed body and formed body (the curing agent H- in table 2 for comparing of the composition epoxy resin of the present invention
1：The manufacture of bright and chemical conversion industry (Co., Ltd.), phenol resol resins).From resulting resin plate cut out 2mm ×
The sample for evaluation of 10mm × 5mm, is determined using following projects and method to its characteristic.Measurement result is shown in into table 1
With table 2.
Heat resistance, dimensional stability (line expansion rate of change)：TMA (thermomechanical measuring device, TA Instruments,
TMA-Q400EM, 2 DEG C/min of programming rate)
Elastic modelling quantity (DMA)
Measurement of Dynamic Viscoelasticity instrument：TA-instruments, DMA-2980
Temperature of the measurement scope：- 30 DEG C～280 DEG C
Programming rate：2 DEG C/min
Test chip size：The test film for cutting into 5mm × 50mm is used
Tg：The peak point of the Tan- δ during DMA is determined is used as Tg.
Table 1
The epoxy resin of EP1 synthesis examples 2
EP2 bisphenol A type epoxy resins, Japanese chemical drug manufacture, RE-310S
The resin described in synthesis example 1 described in the synthesis Japanese Unexamined Patent Publication 2009-001783 of amines 1
According to table 1 it has been confirmed that using composition epoxy resin compared to comparing, in the epoxy resin group for having used the present invention
Line expansion change is little in the case of compound, therefore excellent in dimensional stability.
Table 2
Even if according to table 2 it has been confirmed that the composition epoxy resin of the present invention and the Ahew with same degree
Other curing agent compare, be also that, with high-fire resistance, and water absorption rate is low, and the high material of the elastic modelling quantity under high temperature.
Embodiment 5, comparative example 3
Respectively using 6.8 parts of epoxy resin (EP1) resulting in synthesis example 2 and epoxy resin (EP2, the day compared
This chemical drug is manufactured, bisphenol A type epoxy resin, RE-310S) 6.5 parts, it is calculated as 1 with Ahew using relative to epoxy resin
The curing agent of equivalent, and be stirred in aluminium cup, so that resin concentration as solvent using 6.7 parts of methyl ethyl ketone (MEK)
Mode for 60 weight % has made uniform resin varnish.Impregnated in 150 μm of thickness, the carbon cloth of 18 pieces/inch of line density
In prepared resin varnish, then solvent is set to volatilize under the drying condition of table 3, so as to make prepreg.Next,
Apply the load 10 minutes of 10kg at 175 DEG C in hot plate press and make prepreg precuring, 2 are then carried out at 160 DEG C little
When solidify afterwards, at 180 DEG C carry out 6 hours solidify afterwards, resulting in carbon fibre reinforced composite (CFRP).From resulting
CFRP cut out the square sample for evaluations of 4mm × l6mm, and carried out the measure of heat resistance using following methods.To determine
As a result it is shown in table 3.
Heat resistance, dimensional stability (line expansion rate of change)：TMA (thermomechanical measure fills, TA Instruments,
TMA-Q400EM, 2 DEG C/min of programming rate)
Table 3
EP1：The epoxy resin of synthesis example 2
EP2：Bisphenol A type epoxy resin, Japanese chemical drug manufacture, RE-310S
Amines 1：The resin described in synthesis example 1 described in synthesis Japanese Unexamined Patent Publication 2009-001783
Carbon cloth 1：Plain weave carbon cloth, goods number (PL140-N)
According to table 3 it has been confirmed that compared to using the CFRP that prepared with composition epoxy resin is compared, by the present invention
Composition epoxy resin and carbon fibers and the line expansion change of carbon fibre reinforced composite (CFRP) for preparing is little, because
This excellent in dimensional stability.
The present invention is illustrated in detail with reference to specific mode, but it is aobvious and easy to those skilled in the art
See, can make various changes and modifications without departing from the spirit and scope of the present invention.
It should be noted that Japanese patent application (Japanese Patent Application 2014- of the application based on the proposition on the 1st of August in 2014
157631) Japanese patent application (Japanese Patent Application 2015-14980) proposed with January 29th, 2015, by reference it is quoted
It is overall.In addition, whole reference cited herein is herein as being integrally incorporated.
Industrial applicability
The carbon fibre reinforced composite manufactured using the composition epoxy resin of the present invention is light weight, and to from outer
The impact in portion has excellent patience, therefore, it can be preferred for fuselage, main wing, empennage, rotor blade, fairing, rectification
The aircraft components such as cover, door, seat and interior material；The spacecraft component such as engine casing and main wing；Agent structure and antenna
Deng artificial satellite component；The automobile components such as outside plate, chassis, aerodynamics component and seat；The track such as agent structure and seat
Vehicle component；The substantial amounts of building materials such as the ship structural component such as hull and seat.
Claims (6)
1. a kind of epoxy resin composition for carbon-fiber-reinforced composite material, wherein, the carbon fibre reinforced composite ring
Epoxy resin and curing agent represented by epoxy resin composition with following formulas (1) as neccessary composition,
In formula, (a) ratio of (b) is (a)/(b)=1～3 for the ratio of (a) (b), and G represents glycidyl, and n is repeat number
And for 0～5.
2. epoxy resin composition for carbon-fiber-reinforced composite material as claimed in claim 1, wherein, the curing agent is amine
Class curing agent.
3. the epoxy resin composition for carbon-fiber-reinforced composite material as described in claim 1 or claim 2, it also contains
Other epoxy resin.
4. a kind of resin sheet, it uses the carbon fibre reinforced composite any one of claim 1 to claim 3
Use composition epoxy resin.
5. a kind of prepreg, it is by by the carbon fibre reinforced composite any one of claim 1 to claim 3
Carbon fiber is infiltrated in the resin sheet described in composition epoxy resin or claim 4 and obtain.
6. a kind of carbon fibre reinforced composite, it is by the way that the prepreg solidification described in claim 5 is obtained.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014157631 | 2014-08-01 | ||
| JP2014-157631 | 2014-08-01 | ||
| JP2015-014980 | 2015-01-29 | ||
| JP2015014980A JP2016035038A (en) | 2014-08-01 | 2015-01-29 | Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, carbon-fiber-reinforced composite material |
| PCT/JP2015/071628 WO2016017747A1 (en) | 2014-08-01 | 2015-07-30 | Epoxy resin composition for carbon-fiber-reinforced composite material, resin sheet, prepreg, carbon-fiber-reinforced composite material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106661194A true CN106661194A (en) | 2017-05-10 |
| CN106661194B CN106661194B (en) | 2019-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580037761.7A Active CN106661194B (en) | 2014-08-01 | 2015-07-30 | Epoxy resin composition for carbon-fiber-reinforced composite material, resin sheet, prepreg, carbon fibre reinforced composite |
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| Country | Link |
|---|---|
| JP (1) | JP2016035038A (en) |
| KR (2) | KR20170040121A (en) |
| CN (1) | CN106661194B (en) |
| TW (1) | TWI651360B (en) |
| WO (1) | WO2016017747A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108081700A (en) * | 2017-08-31 | 2018-05-29 | 镇江春环密封件集团有限公司 | Carbon fiber is segmented wound composite thick cyclinder |
| CN113248275A (en) * | 2021-07-02 | 2021-08-13 | 杭州幄肯新材料科技有限公司 | Light carbon fiber/carbon cylinder thermal field material with graphite coating coated on surface and preparation method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7243092B2 (en) * | 2018-09-10 | 2023-03-22 | 株式会社レゾナック | Epoxy resins, epoxy resin compositions, cured epoxy resins and composite materials |
| CN109608668A (en) * | 2018-12-03 | 2019-04-12 | 北京化工大学 | A kind of preparation of carbon fiber/graphene oxide/epoxy prepreg and carbon fibre composite |
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| JPH07292066A (en) * | 1994-04-28 | 1995-11-07 | Nippon Kayaku Co Ltd | Epoxy resin, epoxy resin composition, and cured product thereof |
| JP2004189811A (en) * | 2002-12-10 | 2004-07-08 | Toho Tenax Co Ltd | Woven fabric prepreg |
| CN103897143A (en) * | 2012-12-28 | 2014-07-02 | 明和化成株式会社 | Epoxy resin as well as preparation method and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130101863A1 (en) * | 2010-04-21 | 2013-04-25 | Mitsubishi Gas Chemical Company, Inc. | Heat curable composition |
| JP5754731B2 (en) * | 2011-08-25 | 2015-07-29 | 明和化成株式会社 | Epoxy resin, method for producing epoxy resin, and use thereof |
| CN102964775B (en) * | 2012-10-16 | 2015-09-16 | 广东生益科技股份有限公司 | A kind of compositions of thermosetting resin and uses thereof |
-
2015
- 2015-01-29 JP JP2015014980A patent/JP2016035038A/en active Pending
- 2015-07-30 KR KR1020167033345A patent/KR20170040121A/en not_active Application Discontinuation
- 2015-07-30 CN CN201580037761.7A patent/CN106661194B/en active Active
- 2015-07-30 KR KR1020217036875A patent/KR102354077B1/en active IP Right Grant
- 2015-07-30 WO PCT/JP2015/071628 patent/WO2016017747A1/en active Application Filing
- 2015-07-31 TW TW104124883A patent/TWI651360B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07292066A (en) * | 1994-04-28 | 1995-11-07 | Nippon Kayaku Co Ltd | Epoxy resin, epoxy resin composition, and cured product thereof |
| JP2004189811A (en) * | 2002-12-10 | 2004-07-08 | Toho Tenax Co Ltd | Woven fabric prepreg |
| CN103897143A (en) * | 2012-12-28 | 2014-07-02 | 明和化成株式会社 | Epoxy resin as well as preparation method and application thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108081700A (en) * | 2017-08-31 | 2018-05-29 | 镇江春环密封件集团有限公司 | Carbon fiber is segmented wound composite thick cyclinder |
| CN113248275A (en) * | 2021-07-02 | 2021-08-13 | 杭州幄肯新材料科技有限公司 | Light carbon fiber/carbon cylinder thermal field material with graphite coating coated on surface and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016035038A (en) | 2016-03-17 |
| CN106661194B (en) | 2019-11-05 |
| KR20170040121A (en) | 2017-04-12 |
| KR20210141764A (en) | 2021-11-23 |
| TW201609948A (en) | 2016-03-16 |
| TWI651360B (en) | 2019-02-21 |
| KR102354077B1 (en) | 2022-01-24 |
| WO2016017747A1 (en) | 2016-02-04 |
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