CN106189973A - A kind of fast curable type epoxy impregnation glue and preparation method thereof - Google Patents
A kind of fast curable type epoxy impregnation glue and preparation method thereof Download PDFInfo
- Publication number
- CN106189973A CN106189973A CN201610599371.5A CN201610599371A CN106189973A CN 106189973 A CN106189973 A CN 106189973A CN 201610599371 A CN201610599371 A CN 201610599371A CN 106189973 A CN106189973 A CN 106189973A
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- China
- Prior art keywords
- type epoxy
- component
- curable type
- fast curable
- glue
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of fast curable type epoxy impregnation glue, it is that 1:0.5 0.7 combine with B component according to composition by weight ratio by component A, described component A is as follows according to composition by weight: bisphenol A type epoxy resin 100 parts, silane coupler 0.5 2 parts, thixotropic agent 15 parts, described B component is as follows according to composition by weight: 100 parts of modified polyamine firming agent.It is slow that the present invention solves Conventional epoxy dipping adhesive curing speed in fiber composite material repairing reinforcing engineering, requires time for the most by force long technical barrier.The fast curable type epoxy impregnation glue that the present invention provides, supports the use with fiber cloth, it is possible to base material is implemented rapid rush-repair and reinforces.This dipping glue reactivity is big, and solidification 4h tested for tensile strength reaches 40MPa, is just drawing adhesion strength to reach 2.56MPa, is meeting GB50728 related request, and colloid wet and heat ageing resistant performance is good, can life-time service.
Description
Technical field
The present invention relates to epoxy impregnation glue technical field, particularly relate to a kind of fast curable type epoxy impregnation glue and preparation side thereof
Method.
Background technology
In Reinforcement of Engineering Structure, fiber composite material reinforcement technique is common reinforcement technique, and skill reinforced by fiber composite material
Art is typically with supporting adhesive and fiber cloth is pasted on body structure surface, plays the effect of structural strengthening and seismic hardening.
In fiber composite material reinforcement technique, adhesive is the tie that ruggedized construction base material and carbon cloth are treated in link, leaching
The stain glue quality to base material Yu carbon cloth effect of impregnation, the quality of dipping adhesive curing performance, the power of cementitiousness, often determine
Determine the success or failure of fiber composite material strengthening construction.Conventional structural fortification is to impregnating adhesive curing speed and colloid in the short time
Interior key property, without obvious hard requirement, requires nothing more than the dipping colloidality after solidifying seven days and can meet respective standard requirement, at present
Most domestic product all meets standard-required；Can be in some rush repair reinforcing engineerings, due to the restriction of external condition, gesture
The curing performance of dipping glue must be proposed the highest requirement, often require that dipping glue the most just has well
Key property, and domestic major part conventional dipping glue product cannot meet requirement, mainly shows themselves in that dipping adhesive curing speed
Slowly, dipping glue requires time for the most by force long.
Summary of the invention
The invention aims to solve shortcoming present in prior art, and a kind of fast curable type epoxy impregnation proposed
Glue and preparation method thereof.
To achieve these goals, present invention employs following technical scheme:
A kind of fast curable type epoxy impregnation glue, is that 1:0.5-0.7 combine with B component according to composition by weight ratio by component A,
Described component A is as follows according to composition by weight: bisphenol A type epoxy resin 100 parts, silane coupler 0.5-2 part, thixotropic agent 1-5
Part, described B component is as follows according to composition by weight: 100 parts of modified polyamine firming agent.
Preferably, the epoxide number of described bisphenol A type epoxy resin is 0.48-0.54.
Preferably, described modified polyamine firming agent is for still to have fine ability to cure under the conditions of 5 DEG C, and active hydrogen equivalent weight is
The modified polyamine firming agent of 100-160.
Preferably, described silane coupler is selected from gamma-aminopropyl-triethoxy-silane (KH-550), γ-glycidyl ethers
At least one in propyl-triethoxysilicane (KH-560), γ-oxypropyl trimethyl silane (KH-570).
The preparation method of a kind of fast curable type epoxy impregnation glue that the present invention also provides for, comprises the steps:
The preparation of S1:A component, by bisphenol A type epoxy resin, silane coupler, thixotropic agent mixing and stirring；
The preparation of S2:B component, obtains modified polyamine firming agent；
S3: component A and B component are stirred, i.e. prepares fast curable type epoxy impregnation glue.
It is slow that the present invention solves Conventional epoxy dipping adhesive curing speed in fiber composite material repairing reinforcing engineering, needs the most by force
The technical barrier of time length.The fast curable type epoxy impregnation glue that the present invention provides, supports the use with fiber cloth, it is possible to implement base material
Rapid rush-repair is reinforced.This dipping glue reactivity is big, and solidification 4h tested for tensile strength reaches 40MPa, is just drawing adhesion strength to reach
2.56MPa, meets GB50728 related request, and colloid wet and heat ageing resistant performance is good, can life-time service.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with specific embodiment, to this
Invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, not
For limiting the present invention.
Embodiment 1
A kind of fast curable type epoxy impregnation glue, is that 1:0.5 combine with B component according to composition by weight ratio by component A, described
Component A is as follows according to composition by weight: bisphenol A type epoxy resin 100 parts, silane coupler 0.5 part, thixotropic agent 1 part, described B group
Part is as follows according to composition by weight: 100 parts of modified polyamine firming agent.
The epoxide number of described bisphenol A type epoxy resin is 0.48-0.54.
Described modified polyamine firming agent is for still to have fine ability to cure under the conditions of 5 DEG C, and active hydrogen equivalent weight is 100-160
Modified polyamine firming agent.
Described silane coupler is selected from gamma-aminopropyl-triethoxy-silane (KH-550), γ-glycidyl ethers propyl group three second
At least one in TMOS (KH-560), γ-oxypropyl trimethyl silane (KH-570).
The preparation method of a kind of fast curable type epoxy impregnation glue that the present invention also provides for, comprises the steps:
The preparation of S1:A component, by bisphenol A type epoxy resin, silane coupler, thixotropic agent mixing and stirring；
The preparation of S2:B component, obtains modified polyamine firming agent；
S3: component A and B component are stirred, i.e. prepares fast curable type epoxy impregnation glue.
Embodiment 2
A kind of fast curable type epoxy impregnation glue, is that 1:0.6 combine with B component according to composition by weight ratio by component A, described
Component A is as follows according to composition by weight: bisphenol A type epoxy resin 100 parts, silane coupler 1 part, thixotropic agent 3 parts, described B component
As follows according to composition by weight: 100 parts of modified polyamine firming agent.
The epoxide number of described bisphenol A type epoxy resin is 0.48-0.54.
Described modified polyamine firming agent is for still to have fine ability to cure under the conditions of 5 DEG C, and active hydrogen equivalent weight is 100-160
Modified polyamine firming agent.
Described silane coupler is selected from gamma-aminopropyl-triethoxy-silane (KH-550), γ-glycidyl ethers propyl group three second
At least one in TMOS (KH-560), γ-oxypropyl trimethyl silane (KH-570).
The preparation method of a kind of fast curable type epoxy impregnation glue that the present invention also provides for, comprises the steps:
The preparation of S1:A component, by bisphenol A type epoxy resin, silane coupler, thixotropic agent mixing and stirring；
The preparation of S2:B component, obtains modified polyamine firming agent；
S3: component A and B component are stirred, i.e. prepares fast curable type epoxy impregnation glue.
Embodiment 3
A kind of fast curable type epoxy impregnation glue, is that 1:0.7 combine with B component according to composition by weight ratio by component A, described
Component A is as follows according to composition by weight: bisphenol A type epoxy resin 100 parts, silane coupler 2 parts, thixotropic agent 5 parts, described B component
As follows according to composition by weight: 100 parts of modified polyamine firming agent.
The epoxide number of described bisphenol A type epoxy resin is 0.48-0.54.
Described modified polyamine firming agent is for still to have fine ability to cure under the conditions of 5 DEG C, and active hydrogen equivalent weight is 100-160
Modified polyamine firming agent.
Described silane coupler is selected from gamma-aminopropyl-triethoxy-silane (KH-550), γ-glycidyl ethers propyl group three second
At least one in TMOS (KH-560), γ-oxypropyl trimethyl silane (KH-570).
The preparation method of a kind of fast curable type epoxy impregnation glue that the present invention also provides for, comprises the steps:
The preparation of S1:A component, by bisphenol A type epoxy resin, silane coupler, thixotropic agent mixing and stirring；
The preparation of S2:B component, obtains modified polyamine firming agent；
S3: component A and B component are stirred, i.e. prepares fast curable type epoxy impregnation glue.
Dipping glue obtained by three embodiments of the present invention carries out performance detection by GB50728-2011 related request, detection
Data are shown in Table one
Table one
It is slow that the present invention solves Conventional epoxy dipping adhesive curing speed in fiber composite material repairing reinforcing engineering, early requires time for by force
Long technical barrier.The fast curable type epoxy impregnation glue that the present invention provides, supports the use with fiber cloth, it is possible to implement base material quickly
Repairing is reinforced.This dipping glue reactivity is big, and solidification 4h tested for tensile strength reaches 40MPa, is just drawing adhesion strength to reach
2.56MPa, meets GB50728 related request, and colloid wet and heat ageing resistant performance is good, can life-time service.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention is not limited thereto,
Any those familiar with the art in the technical scope that the invention discloses, according to technical scheme and
Inventive concept equivalent or change in addition, all should contain within protection scope of the present invention.
Claims (5)
1. a fast curable type epoxy impregnation glue, it is characterised in that: it is to be 1:0.5-with B component according to composition by weight ratio by component A
0.7 combines, and described component A is as follows according to composition by weight: bisphenol A type epoxy resin 100 parts, silane coupler 0.5-2
Part, thixotropic agent 1-5 part, described B component is as follows according to composition by weight: 100 parts of modified polyamine firming agent.
One the most according to claim 1 fast curable type epoxy impregnation glue, it is characterised in that: described bisphenol type epoxy tree
The epoxide number of fat is 0.48-0.54.
One the most according to claim 1 fast curable type epoxy impregnation glue, it is characterised in that: described modified polyamine firming agent is
Still having fine ability to cure under the conditions of 5 DEG C, active hydrogen equivalent weight is the modified polyamine firming agent of 100-160.
One the most according to claim 1 fast curable type epoxy impregnation glue, it is characterised in that: described silane coupler is selected from
Gamma-aminopropyl-triethoxy-silane (KH-550), γ-glycidyl ethers propyl-triethoxysilicane (KH-560), γ-propyl group three
At least one in methyl-monosilane (KH-570).
5. the preparation method of the fast curable type epoxy impregnation glue described in a claim 1, it is characterised in that: comprise the steps:
The preparation of S1:A component, by bisphenol A type epoxy resin, silane coupler, thixotropic agent mixing and stirring；
The preparation of S2:B component, obtains modified polyamine firming agent；
S3: component A and B component are stirred, i.e. prepares fast curable type epoxy impregnation glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610599371.5A CN106189973B (en) | 2016-07-28 | 2016-07-28 | A kind of fast curable type epoxy impregnation glue and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610599371.5A CN106189973B (en) | 2016-07-28 | 2016-07-28 | A kind of fast curable type epoxy impregnation glue and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106189973A true CN106189973A (en) | 2016-12-07 |
| CN106189973B CN106189973B (en) | 2019-06-07 |
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| CN201610599371.5A Active CN106189973B (en) | 2016-07-28 | 2016-07-28 | A kind of fast curable type epoxy impregnation glue and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106867437A (en) * | 2017-02-28 | 2017-06-20 | 卡本复合材料（天津）有限公司 | A kind of 2:1 consolidates anchorage glue and preparation method thereof soon |
| CN107586526A (en) * | 2017-09-02 | 2018-01-16 | 绵阳凤面科技有限公司 | A kind of fast curable type epoxy impregnation glue and preparation method thereof |
| CN107936894A (en) * | 2017-12-07 | 2018-04-20 | 遂宁市明川零贰零科技有限公司 | A kind of fast curable type epoxy impregnation glue and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104789178A (en) * | 2015-04-10 | 2015-07-22 | 大连理工大学 | Modified bisphenol-A epoxy resin inserted bar glue in complete underwater environment and preparation method |
-
2016
- 2016-07-28 CN CN201610599371.5A patent/CN106189973B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104789178A (en) * | 2015-04-10 | 2015-07-22 | 大连理工大学 | Modified bisphenol-A epoxy resin inserted bar glue in complete underwater environment and preparation method |
Non-Patent Citations (1)
| Title |
|---|
| 贺曼罗: "《环氧树脂胶粘剂》", 30 April 2004, 中国石化出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106867437A (en) * | 2017-02-28 | 2017-06-20 | 卡本复合材料（天津）有限公司 | A kind of 2:1 consolidates anchorage glue and preparation method thereof soon |
| CN107586526A (en) * | 2017-09-02 | 2018-01-16 | 绵阳凤面科技有限公司 | A kind of fast curable type epoxy impregnation glue and preparation method thereof |
| CN107936894A (en) * | 2017-12-07 | 2018-04-20 | 遂宁市明川零贰零科技有限公司 | A kind of fast curable type epoxy impregnation glue and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN106189973B (en) | 2019-06-07 |
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Effective date of registration: 20200525 Address after: 300 380 C1, C2 Workshops, No. 1 Shengda Road, Xiqing Economic and Technological Development Zone, Tianjin Patentee after: Carbo Technology Group Co.,Ltd. Address before: 301739 Tianjin District of Wuqing City Heng Yuan Road No. 1 Keihin Industrial Zone Patentee before: Carbon Composites(Tianjin)Co.,Ltd |
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Denomination of invention: A fast curing epoxy impregnant and its preparation method Effective date of registration: 20210118 Granted publication date: 20190607 Pledgee: Tianjin Zhongguancun Science and Technology Financing Guarantee Co.,Ltd. Pledgor: Carbo Technology Group Co.,Ltd. Registration number: Y2021120000002 |
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Date of cancellation: 20220927 Granted publication date: 20190607 Pledgee: Tianjin Zhongguancun Science and Technology Financing Guarantee Co.,Ltd. Pledgor: Carbo Technology Group Co.,Ltd. Registration number: Y2021120000002 |