CN106867437A - A kind of 2:1 consolidates anchorage glue and preparation method thereof soon - Google Patents
A kind of 2:1 consolidates anchorage glue and preparation method thereof soon Download PDFInfo
- Publication number
- CN106867437A CN106867437A CN201710111728.5A CN201710111728A CN106867437A CN 106867437 A CN106867437 A CN 106867437A CN 201710111728 A CN201710111728 A CN 201710111728A CN 106867437 A CN106867437 A CN 106867437A
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- Prior art keywords
- parts
- anchorage
- component
- glue
- agent
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/60—Amines together with other curing agents with amides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Consolidate anchorage glue and preparation method thereof soon the invention provides a kind of., by A, B component is with 2 for anchorage glue of consolidating soon of the invention:1 mass ratio is mixed, and wherein component A is by bisphenol A type epoxy resin, diluent, toughener, thixotropic agent, coupling agent, filler component；B component is by modified alicyclic ring amine hardener, modified polyamine curing agent, polyamide curing agent, thixotropic agent, coupling agent, filler composition.It is of the invention that anchorage glue is 2 admittedly soon:1 anchorage glue, fast with curing rate, it is high to be fully cured intensity, good fluidity, and is difficult trickling, and thixotropy is good, the advantages of easy construction.
Description
Technical field
The present invention relates to sqtructural adhesive field, more particularly to a kind of 2:1 consolidates anchorage glue and preparation method thereof soon.
Background technology
Adhesive mainly unsaturated-resin glue on current anchor tool system, unsaturated-resin glue has curing rate
Hurry up, the early strong time is short, the advantages of cohesive force is preferable, but unsaturated-resin glue when using smell it is big, the colloid quality after solidification is crisp
Firmly, toughness is not enough, and weather resisteant, and heat resistant performance is poor.
Epoxyn has excellent processing performance, mechanical property, adhesive property, and good weatherability, shrinkage factor
It is low, cheap, it is widely used in the engineering field such as national defence, civilian.It is early but ordinary epoxy resin adhesive hardening time is long
The strong time is long, therefore the anchor device structure glue of consolidating soon of exploitation good endurance is very important.
The content of the invention
For a variety of deficiencies of the domestic existing anchorage glue on rapid solidification techniques, the present invention provides a kind of 2:1 consolidates anchor soon
Tool glue and preparation method thereof.
To achieve the above object, the present invention is adopted the following technical scheme that:
The present invention provides a kind of 2:1 consolidates anchorage glue soon, it is characterised in that by component A, B component is with 2:1 mass ratio mixing
Uniformly form.
Described component A is made up of following raw materials according in parts by weight：By 100 parts of bisphenol type epoxy tree of weight portion meter
Fat, 8~10 parts of diluent, 3~6 parts of toughener, 1~2 part of coupling agent, 5~10 parts of thixotropic agent, 150~300 parts
Filler.
Described B component is made up of following raw materials according in parts by weight：20~40 parts of modified alicyclic ring amine hardener, 30~
40 parts of modified polyamine curing agent, 20~50 parts of polyamide curing agents, 2~4 parts of coupling agent, 2~4 parts of thixotropic agent, 130~
150 parts of filler.
The epoxide number of described bisphenol A type epoxy resin is 0.48~0.54.
Described curing agent is modified alicyclic ring amine hardener, modified polyamine curing agent, polyamide curing agent compounding use.
Described diluent is reactive diluent carbon { HYPERLINK " http://km.ncmchem.com/product/
ProductList.doC0=2594 | | 1＆currentindex=-1 " t " _ blank " } (AGE), 1,4- HYPERLINK "
http://baike.so.com/doc/5429583-7567423.html " t " _ blank " } diglycidyl ether (622), benzyl
At least one in base glycidol ether (692).
Described toughener is selected from least one in liquid carboxyl end group nitrile rubber, QS-BE.
Described coupling agent is selected from gamma-aminopropyl-triethoxy-silane (KH-550), the γ-ethoxy of glycidyl ethers propyl group three
At least one in base silane (KH-560).
Described thixotropic agent is selected from specific surface area in 150~250m2/ g, pH value is 4.0~7.0 hydrophobicity gas phase dioxy
SiClx.
Described filler is 1000 mesh active micro silicon powders.
Described a kind of 2:The preparation method of 1 fast anchorage glue admittedly, it is characterised in that：
(1) preparation of component A
By 100 parts of bisphenol A type epoxy resin, 8~10 parts of diluent, 3~6 parts of toughener, 1~2 of weight portion meter
The coupling agent, 5~10 parts of thixotropic agent mixing and stirring of part, add 150~300 parts of filler mixing and stirring, i.e.,
Component A is obtained.
(2) preparation of B component
By the modified alicyclic ring amine hardener of 20~40 parts of weight portion meter, 30~40 parts of modified polyamine curing agent, 20~50 parts
Polyamide curing agent, 2~4 parts of coupling agent, 2~4 parts of thixotropic agent mixing and stirring, add 130~150 parts of filler
Mixing and stirring, that is, be obtained B component.
(3) by A, B component presses 2:1 weight be obtained anchor device structure glue than mixing and stirring.
Emphasis of the invention mainly has at following 2 points：
1. modified alicyclic ring amine hardener, modified polyamine curing agent, polyamide curing agent compounding are employed, it is low with viscosity,
Curing rate is fast, and intensity is high, and cementability is strong, the features such as normal temperature cure degree is high.
2. 1000 mesh number filler active micro silicon powders are used, possesses good temperature tolerance, acid-alkali-corrosive-resisting, low bulk, chemical property
Stabilization, the excellent performance such as hardness is big.And products material cost can be substantially reduced, extends product service life.
Specific implementation method
The present invention is further explained with reference to some embodiments, it should be appreciated that following examples are intended to explanation, no
Should be taken as limiting
Embodiment 1
The preparation of component A：By the bisphenol A type epoxy resin of 100 parts of weight portion meter, 8 parts of diluent, 5 parts of toughener,
2 parts of coupling agent, 6 parts of thixotropic agent mixing and stirring adds 190 parts of filler mixing and stirring.
The preparation of B component：By 30 parts of modified alicyclic ring amine hardener, 35 parts of modified polyamine curing agent, 35 of weight portion meter
The polyamide curing agent, 3 parts of coupling agent, 3 parts of thixotropic agent mixing and stirring of part, the filler mixing for adding 150 parts are stirred
Mix uniform.
A, B component are pressed 2:1 weight be obtained anchor device structure glue than mixing and stirring.
Embodiment 2
The preparation of component A：By the bisphenol A type epoxy resin of 100 parts of weight portion meter, 8 parts of diluent, 5 parts of toughener,
2 parts of coupling agent, 6 parts of thixotropic agent mixing and stirring adds 190 parts of filler mixing and stirring.
The preparation of B component：By 35 parts of modified alicyclic ring amine hardener, 30 parts of modified polyamine curing agent, 35 of weight portion meter
The polyamide curing agent, 3 parts of coupling agent, 3 parts of thixotropic agent mixing and stirring of part, the filler mixing for adding 150 parts are stirred
Mix uniform.
A, B component are pressed 2:1 weight be obtained anchor device structure glue than mixing and stirring.
Embodiment 3
The preparation of component A：By the bisphenol A type epoxy resin of 100 parts of weight portion meter, 8 parts of diluent, 5 parts of toughener,
2 parts of coupling agent, 6 parts of thixotropic agent mixing and stirring adds 190 parts of filler mixing and stirring.
The preparation of B component：By 30 parts of modified alicyclic ring amine hardener, 30 parts of modified polyamine curing agent, 40 of weight portion meter
The polyamide curing agent, 3 parts of coupling agent, 3 parts of thixotropic agent mixing and stirring of part, the filler mixing for adding 150 parts are stirred
Mix uniform.
A, B component are pressed 2:1 weight be obtained anchor device structure glue than mixing and stirring.
Steel bonding glue obtained by three embodiments of the invention carries out performance detection by GB 50728-2011 related requests, examines
Survey data and be shown in Table one.
Table one
Claims (9)
1. one kind 2:1 consolidates anchorage glue soon, it is characterised in that by component A, B component is with 2:1 mass ratio is mixed；
Wherein：
Described component A is made up of following raw materials according in parts by weight：
100 parts of bisphenol A type epoxy resin；
8~10 parts of diluent；
3~6 parts of toughener；
1~2 part of coupling agent；
5~10 parts of thixotropic agent；
150~300 parts of filler；
Described B component is made up of following raw materials according in parts by weight：
20~40 parts of modified fatty amine curing agent；
30~40 parts of modified polyamine curing agent；
20~50 parts of polyamide curing agent；
2~4 parts of coupling agent；
2~4 parts of thixotropic agent；
130~150 parts of filler.
2. according to claim 12:1 consolidates anchorage glue soon, it is characterised in that the epoxy of described bisphenol A type epoxy resin
Be worth is 0.48~0.54.
3. according to claim 12:1 consolidates anchorage glue soon, it is characterised in that described curing agent is that modified aliphatic cyclic amine is consolidated
Agent, modified polyamine curing agent, polyamide curing agent compounding use, low with viscosity, curing rate is fast, and intensity is high, is bonded energy
Power is strong, the features such as normal temperature cure degree is high.
4. according to claim 12:1 consolidates anchorage glue soon, it is characterised in that described diluent is reactive diluent carbon
{HYPERLINK"http://km.ncmchem.com/product/ProductList.doC0=2594 | | 1＆
Currentindex=-1 " t " _ blank " } (AGE), 1,4- { HYPERLINK " http://baike.so.com/doc/
5429583-7567423.html " t " _ blank " } diglycidyl ether (622), in benzyl glycidyl ether (692) at least
It is a kind of.
5. according to claim 12:1 consolidates anchorage glue soon, it is characterised in that described toughener is selected from liquid liquid carboxylic end
At least one in base nitrile rubber, QS-BE.
6. according to claim 12:1 consolidates anchorage glue soon, it is characterised in that described coupling agent is selected from γ-aminopropyl three
At least one in Ethoxysilane (KH-550), γ-glycidyl ethers propyl-triethoxysilicane (KH-560).
7. according to claim 12:1 consolidates anchorage glue soon, it is characterised in that described thixotropic agent exists selected from specific surface area
150~250m2/ g, pH value is 4.0~7.0 hydrophobicity aerosil.
8. according to claim 12:1 consolidates anchorage glue soon, it is characterised in that described filler is that 1000 mesh activated silicas are micro-
Powder.
9. 2 according to claim 1,2,3,4,5,6,7,8:The preparation method of 1 fast anchorage glue admittedly, it is characterised in that：
(1) preparation of component A
By the bisphenol A type epoxy resin of 100 parts of weight portion meter, 8~10 parts of diluent, 3~6 parts of toughener, 1~2 part
Coupling agent, 5~10 parts of thixotropic agent mixing and stirring, add 150~300 parts of filler mixing and stirring, that is, A is obtained
Component；
(2) preparation of B component
By 20~40 parts of modified alicyclic ring amine hardener, 30~40 parts of modified polyamine curing agent, 20~50 parts of polyamides of weight portion meter
Amine hardener, 2~4 parts of coupling agent, 2~4 parts of thixotropic agent mixing and stirring, add 130~150 parts of filler mixing
Stir, that is, B component is obtained；
(3) by A, B component presses 2:1 weight be obtained anchor device structure glue than mixing and stirring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710111728.5A CN106867437A (en) | 2017-02-28 | 2017-02-28 | A kind of 2:1 consolidates anchorage glue and preparation method thereof soon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710111728.5A CN106867437A (en) | 2017-02-28 | 2017-02-28 | A kind of 2:1 consolidates anchorage glue and preparation method thereof soon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106867437A true CN106867437A (en) | 2017-06-20 |
Family
ID=59168140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710111728.5A Pending CN106867437A (en) | 2017-02-28 | 2017-02-28 | A kind of 2:1 consolidates anchorage glue and preparation method thereof soon |
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|---|---|
| CN (1) | CN106867437A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109111887A (en) * | 2018-09-29 | 2019-01-01 | 沈阳建筑大学 | A kind of microwave hot melt type ring oxygen resin adhesive and its application |
| CN112358837A (en) * | 2020-11-16 | 2021-02-12 | 大连新晶联科技有限公司 | Special room temperature curing epoxy resin A/B adhesive for bonding mutual inductor body |
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| CN105062396A (en) * | 2015-08-21 | 2015-11-18 | 卡本复合材料（天津）有限公司 | Double-component high-strength building epoxy structural adhesive and preparing method thereof |
| CN106189973A (en) * | 2016-07-28 | 2016-12-07 | 卡本复合材料（天津）有限公司 | A kind of fast curable type epoxy impregnation glue and preparation method thereof |
| CN106221635A (en) * | 2016-08-27 | 2016-12-14 | 卡本复合材料（天津）有限公司 | A kind of 2:1 injection epoxy anchoring adhesive and preparation method thereof |
-
2017
- 2017-02-28 CN CN201710111728.5A patent/CN106867437A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105062396A (en) * | 2015-08-21 | 2015-11-18 | 卡本复合材料（天津）有限公司 | Double-component high-strength building epoxy structural adhesive and preparing method thereof |
| CN106189973A (en) * | 2016-07-28 | 2016-12-07 | 卡本复合材料（天津）有限公司 | A kind of fast curable type epoxy impregnation glue and preparation method thereof |
| CN106221635A (en) * | 2016-08-27 | 2016-12-14 | 卡本复合材料（天津）有限公司 | A kind of 2:1 injection epoxy anchoring adhesive and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 北京粘接学会: "《胶粘剂技术与应用手册》", 31 December 1991, 宇航出版社 * |
| 马长福: "《简明粘接技术手册》", 31 July 2012, 上海科学技术文献出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109111887A (en) * | 2018-09-29 | 2019-01-01 | 沈阳建筑大学 | A kind of microwave hot melt type ring oxygen resin adhesive and its application |
| CN112358837A (en) * | 2020-11-16 | 2021-02-12 | 大连新晶联科技有限公司 | Special room temperature curing epoxy resin A/B adhesive for bonding mutual inductor body |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170620 |
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| WD01 | Invention patent application deemed withdrawn after publication |