CN111844961A - Heat-insulation sound-absorbing board and preparation method thereof - Google Patents

Heat-insulation sound-absorbing board and preparation method thereof Download PDF

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Publication number
CN111844961A
CN111844961A CN202010646802.5A CN202010646802A CN111844961A CN 111844961 A CN111844961 A CN 111844961A CN 202010646802 A CN202010646802 A CN 202010646802A CN 111844961 A CN111844961 A CN 111844961A
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fiber
sound
layer
resin
panel layer
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Inventor
余启勇
董会娜
吕多军
龚祥明
刘光亚
姚栋嘉
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Gongyi Van Research Yihui Composite Material Co Ltd
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Gongyi Van Research Yihui Composite Material Co Ltd
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Priority to CN202010646802.5A priority Critical patent/CN111844961A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/10—Next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/77—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with silicon or compounds thereof
    • D06M11/79—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with silicon or compounds thereof with silicon dioxide, silicic acids or their salts
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M13/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with non-macromolecular organic compounds; Such treatment combined with mechanical treatment
    • D06M13/50—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with non-macromolecular organic compounds; Such treatment combined with mechanical treatment with organometallic compounds; with organic compounds containing boron, silicon, selenium or tellurium atoms
    • D06M13/51—Compounds with at least one carbon-metal or carbon-boron, carbon-silicon, carbon-selenium, or carbon-tellurium bond
    • D06M13/513—Compounds with at least one carbon-metal or carbon-boron, carbon-silicon, carbon-selenium, or carbon-tellurium bond with at least one carbon-silicon bond
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
    • D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
    • D06M15/37—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D06M15/53—Polyethers
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    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
    • D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
    • D06M15/37—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D06M15/55—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/20—All layers being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B32B2262/0269—Aromatic polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/10—Properties of the layers or laminate having particular acoustical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2419/00—Buildings or parts thereof
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M2101/00—Chemical constitution of the fibres, threads, yarns, fabrics or fibrous goods made from such materials, to be treated
    • D06M2101/02—Natural fibres, other than mineral fibres
    • D06M2101/04—Vegetal fibres

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  • Engineering & Computer Science (AREA)
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  • Chemical & Material Sciences (AREA)
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  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention belongs to the technical field of heat insulation and sound absorption, and discloses a heat insulation and sound absorption board and a preparation method thereof. The heat-insulation sound-absorbing board consists of a first panel layer, a second panel layer and a core material layer, wherein the core material layer is positioned between the first panel layer and the second panel layer; the core material layer consists of a wood felt, aerogel and an expandable microsphere foaming agent, wherein the aerogel and the expandable microsphere foaming agent are filled in the wood felt; the first panel layer and the second panel layer are fiber reinforced resin matrix composite sheets, and are integrally formed between the first panel layer and the core material layer and between the second panel layer and the core material layer. The heat-insulation sound-absorbing board prepared by the invention improves the traditional wood sandwich sound-absorbing board, overcomes the defects of low strength, poor corrosion resistance, poor fire resistance and the like, and obtains a novel heat-insulation sound-absorbing structure which integrates excellent high, medium and low frequency absorption characteristics, mechanical property, safety, heat insulation and high temperature performance.

Description

Heat-insulation sound-absorbing board and preparation method thereof
Technical Field
The invention belongs to the technical field of heat insulation and sound absorption, and particularly relates to a heat insulation and sound absorption board and a preparation method thereof.
Background
With the development of modern industry, noise pollution has become one of the non-negligible environmental pollution problems, which seriously affects the work, study and rest of people. Sound-absorbing materials are widely used in many practical engineering fields, especially in open or large closed environments, as one of the effective measures for reducing noise and improving sound environment.
The most of the heat-insulating and sound-absorbing materials used at present are organic synthetic materials and organic and inorganic mineral materials, such as mineral wool, foamed plastics, fiber cotton felt, foam glass, foam metal, wood plates and the like. Although the sound absorption materials have good sound absorption performance in a medium-frequency range and a high-frequency range, the sound absorption materials also have a plurality of problems respectively, mineral fiber materials represented by ultrafine glass wool have the defects of high density, high brittleness, serious water absorption, easiness in vibration and droop, poor heat insulation performance, thicker paving, high material loss and the like, and the materials are easy to form dust dissipation to pollute the environment and cause lung diseases due to the brittleness of the fibers in construction engineering, so that the energy-saving standard cannot be met by using the materials; common organic foams such as polystyrene foam, polyurethane foam and the like have poor flame retardance, corrosion resistance and aging resistance, high combustion density and release a large amount of toxic and harmful gases; the foam glass has lower strength, poor connectivity of a cellular structure and poor sound absorption effect; the wood board is used as the sound absorption board core material on some architectural decorations, but the wood board has the defects of poor moisture resistance, flame retardance, mechanical property and the like, and the wood board mainly absorbs medium-high frequency sound waves and has weaker absorption capacity on low frequencies due to larger holes.
Therefore, there is an urgent need to develop a novel heat insulation and sound absorption structure which integrates excellent high, medium and low frequency absorption characteristics, mechanical properties, safety, heat insulation and high temperature performance.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a heat-insulating sound-absorbing board and a preparation method thereof.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the heat-insulation sound-absorbing board consists of a first panel layer, a second panel layer and a core material layer, wherein the core material layer is positioned between the first panel layer and the second panel layer; the core material layer consists of a wood felt, aerogel and an expandable microsphere foaming agent, wherein the aerogel and the expandable microsphere foaming agent are filled in the wood felt; the first panel layer and the second panel layer are fiber reinforced resin matrix composite sheets, and are integrally formed between the first panel layer and the core material layer and between the second panel layer and the core material layer.
Preferably, the fiber in the fiber reinforced resin-based composite sheet is one of glass fiber, carbon fiber, quartz fiber, high silica fiber, aluminum silicate fiber, mullite fiber, silicon carbide fiber, silicon nitride fiber, alumina fiber, boron nitride fiber, basalt fiber, brucite fiber, attapulgite fiber, boron fiber, aramid fiber, polyimide fiber and ultrahigh molecular weight polyethylene fiber, and the resin is one of epoxy resin, phenolic resin, benzoxazine resin, unsaturated polyester, vinyl ester resin, silicon resin and cyanate ester resin. The fiber reinforced resin matrix composite sheet can be obtained by commercial products or prepared according to the prior art.
Preferably, the aerogel is silica aerogel, titania aerogel or carbon aerogel.
A preparation method of the heat-insulation sound-absorbing board comprises the following steps:
(1) grinding and uniformly mixing the resin, the curing agent, the diluent, the accelerator and the coupling agent to obtain slurry A;
(2) sequentially adding the expandable microsphere foaming agent and the aerogel powder into the slurry A, and stirring and mixing uniformly at 30-60 ℃ to obtain slurry B;
(3) pressing and molding the wood fiber to obtain a wood felt, and then placing the wood felt into the slurry B for dipping treatment;
(4) respectively coating a layer of fiber cloth on the upper surface and the lower surface of the wood felt after impregnation, and drying and curing to obtain the heat-insulating sound-absorbing board;
wherein, the mass ratio of resin, curing agent, diluting agent, accelerating agent, coupling agent, expandable microsphere foaming agent and aerogel powder is (30-60) = (6-10): (3-10): (2-4): (1-2): (10-30): (20-50);
and (3) the resin in the step (1) and the fiber in the fiber cloth in the step (4) correspond to the resin and the fiber in the fiber reinforced resin matrix composite sheet respectively.
Preferably, in the step (2), the aerogel powder is subjected to wetting treatment with ethanol in advance (the addition amount of the ethanol is based on wetting and drenching of the aerogel powder, preferably, the mass ratio of the aerogel powder to the ethanol is = 1: 1-3), and then the aerogel powder is added into the slurry A.
Preferably, the curing agent is ethylenediamine, polyethylene polyamine, m-xylylenediamine, 593 curing agent, methyl ethyl ketone peroxide, cyclohexanone peroxide or benzoyl peroxide; the diluent is one or more of polypropylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, beta-methyl epichlorohydrin, ethylene glycol diglycidyl ether, dodecyl glycidyl ether, epoxypropane butyl ether and ethylene-base cyclohexane dioxide; the accelerant is a cobalt accelerant system or N, N dimethylaniline; the coupling agent is KH550 or KH 560.
Preferably, the polyethylene polyamine is diethylenetriamine or triethylenetetramine.
Preferably, the diameter of the wood fiber is more than or equal to 10 cm, and the length-diameter ratio is more than or equal to 1000.
Preferably, in the step (3), the pressure for compression molding is 20-50 Mpa, and the temperature is 120-; dipping for 12-24 h.
Preferably, in the step (4), the drying and curing temperature is 90-150 ℃, the pressure is 2-5 Mpa, and the time is 20 min-2 h.
Has the advantages that:
(1) the heat-insulation sound-absorbing board prepared by the invention improves the traditional wood sandwich sound-absorbing board, overcomes the defects of low strength, poor corrosion resistance, poor fire resistance and the like, and obtains a novel heat-insulation sound-absorbing structure which integrates excellent high, medium and low frequency absorption characteristics, mechanical property, safety, heat insulation and high temperature performance;
(2) The aerogel and the expandable microspheres are added simultaneously, so that the heat insulation performance of the board is improved, and meanwhile, the microporous structure of the board and the pore structure of the wood material are matched with each other to form a network pore framework, so that the board can well attenuate sound waves of various frequency bands, and the absorption efficiency of the sound waves is improved;
(3) according to the invention, the surface of the wood felt is coated with the fiber cloth, the fiber cloth and resin can be cured and molded to obtain the fiber reinforced resin matrix composite sheet, the fiber reinforced resin matrix composite sheet is used as a panel layer of the heat-insulation and sound-absorption board, the mechanical property, the corrosion resistance and the fire resistance of the board are greatly improved, and the large-scale preparation of the heat-insulation and sound-absorption board can be widely applied to the fields of buildings, decorations and the like.
Detailed Description
The present invention will be further described with reference to the following specific examples. It should be understood that the following examples are illustrative only and are not intended to limit the scope of the present invention.
Example 1
The heat-insulation sound-absorbing board consists of a first panel layer, a second panel layer and a core material layer, wherein the core material layer is positioned between the first panel layer and the second panel layer; the core material layer is composed of a wood felt, silica aerogel and expandable microsphere foaming agent EM406 (produced by Nippon oil pharmaceutical Co., Ltd., average diameter of 20 μm), wherein the silica aerogel and the expandable microsphere foaming agent EM406 are filled in the wood felt; the first panel layer and the second panel layer are glass fiber reinforced epoxy resin-based composite sheets, and are integrally formed between the first panel layer and the core material layer and between the second panel layer and the core material layer.
The preparation method comprises the following steps:
(1) grinding and uniformly mixing the epoxy resin, the curing agent, the diluent, the accelerator and the coupling agent to obtain slurry A; the curing agent is ethylenediamine; the diluent is polypropylene glycol diglycidyl ether; the accelerant is a cobalt accelerant system; the coupling agent is KH 550;
(2) wetting the silica aerogel powder by using ethanol, sequentially adding the expandable microsphere foaming agent EM406 and the wetted silica aerogel powder into the slurry A, and stirring and mixing uniformly at 50 ℃ to obtain slurry B;
(3) pressing wood fibers (with the diameter of 12 cm and the length-diameter ratio of 1100) into a wood felt under the conditions of 50 Mpa and the temperature of 120 ℃, and then putting the wood felt into the slurry B for immersion treatment for 15 hours;
(4) respectively coating a layer of glass fiber cloth on the upper surface and the lower surface of the wood felt after impregnation, and drying and curing at 100 ℃ for 30 min under the pressure of 2Mpa to obtain the heat-insulating sound-absorbing board;
wherein, the mass ratio of the epoxy resin, the curing agent, the diluent, the accelerator, the coupling agent, the expandable microsphere foaming agent and the silicon dioxide aerogel powder is 40: 6: 3: 2: 1: 15: 25;
The density of the heat-insulating sound-absorbing board prepared by the embodiment is 0.58 g/cm3Heat transferThe coefficient is 0.026W/(m.K), the average sound absorption coefficient in the low frequency range of 80-300Hz is 0.9, the average sound absorption coefficient in the medium frequency range of 300-4000 Hz is 0.85, and the average sound absorption coefficient in the high frequency range of 1000-4000Hz is 1.2.
Example 2
The heat-insulation sound-absorbing board consists of a first panel layer, a second panel layer and a core material layer, wherein the core material layer is positioned between the first panel layer and the second panel layer; the core material layer is composed of a wood felt, titanium dioxide aerogel and an expandable microsphere foaming agent EHM401 (produced by Nippon grease pharmaceutical Co., Ltd., average diameter is 60 μm), wherein the titanium dioxide aerogel and the expandable microsphere foaming agent EHM401 are filled in the wood felt; the first panel layer and the second panel layer are aramid fiber reinforced epoxy resin-based composite sheets, and are integrally formed between the first panel layer and the core material layer and between the second panel layer and the core material layer.
The preparation method comprises the following steps:
(1) grinding and uniformly mixing the epoxy resin, the curing agent, the diluent, the accelerator and the coupling agent to obtain slurry A; the curing agent is diethylenetriamine; the diluent is neopentyl glycol diglycidyl ether; the accelerant is N, N dimethylaniline; the coupling agent is KH 560;
(2) Wetting the titanium dioxide aerogel powder by using ethanol, sequentially adding the expandable microsphere foaming agent EHM401 and the wetted titanium dioxide aerogel powder into the slurry A, and uniformly stirring and mixing at 30 ℃ to obtain slurry B;
(3) pressing wood fibers (the diameter is 15 cm, the length-diameter ratio is 1200) into a wood felt under the conditions of 40 Mpa and the temperature of 180 ℃, and then putting the wood felt into the slurry B for dipping treatment for 20 hours;
(4) respectively coating a layer of aramid fiber cloth on the upper surface and the lower surface of the wood felt after impregnation, and drying and curing at 110 ℃ for 20 min under the pressure of 3Mpa to obtain the heat-insulating sound-absorbing board;
wherein, the mass ratio of the epoxy resin, the curing agent, the diluent, the accelerator, the coupling agent, the expandable microsphere foaming agent and the titanium dioxide aerogel powder is 30: 8: 5: 3: 1.5: 10: 20;
the density of the heat-insulating sound-absorbing board prepared in the example is 0.59 g/cm3The heat conductivity coefficient is 0.028W/(m.K), the average sound absorption coefficient in the frequency range of 80-300Hz at low frequency is 0.95, the average sound absorption coefficient in the frequency range of 300-1000Hz at medium frequency is 0.93, and the average sound absorption coefficient in the frequency range of 1000-4000Hz at high frequency is 1.2.
Example 3
The heat-insulation sound-absorbing board consists of a first panel layer, a second panel layer and a core material layer, wherein the core material layer is positioned between the first panel layer and the second panel layer; the core material layer consists of a wood felt, carbon aerogel and an expandable microsphere foaming agent TEP-160 (produced by Nippon oil pharmaceutical Co., Ltd., average diameter of 80 μm), wherein the carbon aerogel and the expandable microsphere foaming agent TEP-160 are filled in the wood felt; the first panel layer and the second panel layer are glass fiber reinforced phenolic resin composite sheets, and are integrally formed between the first panel layer and the core material layer and between the second panel layer and the core material layer.
The preparation method comprises the following steps:
(1) grinding and uniformly mixing the phenolic resin, the curing agent, the diluent, the accelerator and the coupling agent to obtain slurry A; the curing agent is 593 curing agent; the diluent is ethylene glycol diglycidyl ether; the accelerant is N, N dimethylaniline; the coupling agent is KH 560;
(2) wetting carbon aerogel powder by using ethanol, sequentially adding an expandable microsphere foaming agent TEP-160 and the wetted carbon aerogel powder into the slurry A, and stirring and uniformly mixing at 60 ℃ to obtain slurry B;
(3) Pressing wood fibers (the diameter is 20 cm, the length-diameter ratio is 2000) into a wood felt under the conditions of 20 Mpa and the temperature of 250 ℃, and then putting the wood felt into the slurry B for dipping treatment for 24 hours;
(4) respectively coating a layer of glass fiber cloth on the upper surface and the lower surface of the wood felt after impregnation, and drying and curing at 140 ℃ for 1 h under the pressure of 5Mpa to obtain the heat-insulating sound-absorbing board;
wherein, the mass ratio of the epoxy resin, the curing agent, the diluent, the accelerator, the coupling agent, the expandable microsphere foaming agent and the carbon aerogel powder is 60: 10: 4: 2: 30: 50;
the density of the heat-insulating sound-absorbing board prepared by the embodiment is 0.60 g/cm3The heat conductivity coefficient is 0.032W/(m.K), the average sound absorption coefficient in the frequency range of 80-300Hz at low frequency is 1.1, the average sound absorption coefficient in the frequency range of 300-1000Hz at medium frequency is 0.9, and the average sound absorption coefficient in the frequency range of 1000-4000Hz at high frequency is 1.3.

Claims (10)

1. A thermal insulation acoustic board which is characterized in that: the heat-insulation sound-absorbing board consists of a first panel layer, a second panel layer and a core material layer, wherein the core material layer is positioned between the first panel layer and the second panel layer; the core material layer consists of a wood felt, aerogel and an expandable microsphere foaming agent, wherein the aerogel and the expandable microsphere foaming agent are filled in the wood felt; the first panel layer and the second panel layer are fiber reinforced resin matrix composite sheets, and are integrally formed between the first panel layer and the core material layer and between the second panel layer and the core material layer.
2. The insulating and sound-absorbing panel as claimed in claim 1, wherein: the fiber in the fiber reinforced resin-based composite sheet is one of glass fiber, carbon fiber, quartz fiber, high silica fiber, aluminum silicate fiber, mullite fiber, silicon carbide fiber, silicon nitride fiber, alumina fiber, boron nitride fiber, basalt fiber, brucite fiber, attapulgite fiber, boron fiber, aramid fiber, polyimide fiber and ultrahigh molecular weight polyethylene fiber, and the resin is one of epoxy resin, phenolic resin, benzoxazine resin, unsaturated polyester, vinyl ester resin, silicon resin and cyanate ester resin.
3. The insulating and sound-absorbing panel as claimed in claim 1, wherein: the aerogel is silicon dioxide aerogel, titanium dioxide aerogel or carbon aerogel.
4. A method for producing the heat-insulating sound-absorbing sheet according to any one of claims 1 to 3, characterized by comprising the steps of:
(1) grinding and uniformly mixing the resin, the curing agent, the diluent, the accelerator and the coupling agent to obtain slurry A;
(2) sequentially adding the expandable microsphere foaming agent and the aerogel powder into the slurry A, and stirring and mixing uniformly at 30-60 ℃ to obtain slurry B;
(3) Pressing and molding the wood fiber to obtain a wood felt, and then placing the wood felt into the slurry B for dipping treatment;
(4) respectively coating a layer of fiber cloth on the upper surface and the lower surface of the wood felt after impregnation, and drying and curing to obtain the heat-insulating sound-absorbing board;
wherein, the mass ratio of resin, curing agent, diluting agent, accelerating agent, coupling agent, expandable microsphere foaming agent and aerogel powder is (30-60) = (6-10): (3-10): (2-4): (1-2): (10-30): (20-50);
and (3) the resin in the step (1) and the fiber in the fiber cloth in the step (4) correspond to the resin and the fiber in the fiber reinforced resin matrix composite sheet respectively.
5. The process for the preparation of the thermal insulating and acoustic panel according to claim 4, characterized in that: in the step (2), the aerogel powder is wetted by ethanol in advance, and then added into the slurry A.
6. The process for the preparation of the thermal insulating and acoustic panel according to claim 4, characterized in that: the curing agent is ethylenediamine, polyethylene polyamine, m-xylylenediamine, 593 curing agent, methyl ethyl ketone peroxide, cyclohexanone peroxide or benzoyl peroxide; the diluent is one or more of polypropylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, beta-methyl epichlorohydrin, ethylene glycol diglycidyl ether, dodecyl glycidyl ether, epoxypropane butyl ether and ethylene-base cyclohexane dioxide; the accelerant is a cobalt accelerant system or N, N dimethylaniline; the coupling agent is KH550 or KH 560.
7. The process for the preparation of the thermal insulating and acoustic panel according to claim 6, characterized in that: the polyethylene polyamine is diethylenetriamine or triethylene tetramine.
8. The process for the preparation of the thermal insulating and acoustic panel according to claim 4, characterized in that: the diameter of the wood fiber is more than or equal to 10 cm, and the length-diameter ratio is more than or equal to 1000.
9. The process for the preparation of the thermal insulating and acoustic panel according to claim 4, characterized in that: in the step (3), the pressure of the compression molding is 20-50 Mpa, and the temperature is 120-250 ℃; dipping for 12-24 h.
10. The process for the preparation of the thermal insulating and acoustic panel according to claim 4, characterized in that: in the step (4), the temperature for drying and curing is 90-150 ℃, the pressure is 2-5 Mpa, and the time is 20 min-2 h.
CN202010646802.5A 2020-07-07 2020-07-07 Heat-insulation sound-absorbing board and preparation method thereof Pending CN111844961A (en)

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Application publication date: 20201030