CN114125199A

CN114125199A - EEPROM for camera module and camera module

Info

Publication number: CN114125199A
Application number: CN202010906650.8A
Authority: CN
Inventors: 程亦隆
Original assignee: Galaxycore Shanghai Ltd Corp
Current assignee: Galaxycore Shanghai Ltd Corp
Priority date: 2020-09-01
Filing date: 2020-09-01
Publication date: 2022-03-01

Abstract

The utility model provides a EEPROM, the module of making a video recording for the module of making a video recording, wherein, in the EEPROM for the module of making a video recording, the module of making a video recording includes sensor chip and electric capacity at least, electric capacity is the rectangle when overlooking, EEPROM includes the chip main part and is located the welding contact of chip main part bottom, the chip main part is the rectangle when overlooking, the broadside of chip main part with length difference between the broadside of electric capacity is in predetermineeing the deviation scope. This an EEPROM for making a video recording the module effectively reduces the size of making a video recording the module.

Description

EEPROM for camera module and camera module

Technical Field

The invention relates to the technical field of chips, in particular to an EEPROM (electrically erasable programmable read-only memory) for a camera module and the camera module.

Background

Along with the rapid development of the mobile phone, the relative ratio of the area of the screen to the area of the front panel of the mobile phone, namely the screen occupation ratio, is more and more limited, the battery is large, so that the space of other components is extruded, the size of a camera module (also called a fixed focus module) of the mobile phone is more and more limited, and the sizes of a front-shooting module and a rear-shooting module are required to be as small as possible.

Except an image sensor, other components in the mobile phone camera module comprise a capacitor, a resistor, a motor drive and a charged Erasable Programmable Read-Only Memory (EEPROM for short), and the EEPROM can burn certain information to improve the consistency of the whole batch of modules, so that the modules can achieve higher image quality at a mobile phone end. In the auto-focusing module, due to the inherent size of a Voice Coil Motor (VCM) Motor, also called as a Voice Coil Motor, the placement of components is relatively spare. The camera module is in the condition of limit swing, and the biggest bottleneck is in EEPROM due to no need of motor drive.

Disclosure of Invention

The invention solves the technical problem of how to provide an EEPROM for a camera module, thereby effectively reducing the size of the camera module.

In order to solve the above technical problem, an embodiment of the present invention provides an EEPROM for a camera module, where the camera module at least includes a sensor chip and a capacitor, the capacitor is rectangular in a top view, the EEPROM includes a chip main body and a solder contact located at a bottom of the chip main body, the chip main body is rectangular in a top view, and a length difference between a wide side of the chip main body and a wide side of the capacitor is within a preset deviation range.

Optionally, the length of the wide side of the chip main body is equal to the length of the wide side of the capacitor.

Optionally, the solder contact includes a plurality of ball-shaped solder contacts.

Optionally, the plurality of spherical welding contacts are sequentially arranged along a central axis of the chip main body parallel to the long edge.

Optionally, the plurality of spherical bonding contacts are arranged in a staggered manner with respect to a central axis of the chip body parallel to the long side.

Optionally, the welding contact includes a plurality of strip-shaped welding contacts.

Optionally, the plurality of strip-shaped welding contacts are sequentially arranged in parallel and are parallel to the wide side of the chip main body.

The embodiment of the invention also provides a camera module, which comprises a sensor chip, a capacitor and an idle area, wherein the size of the idle area is matched with that of any EEPROM for the camera module, and the idle area is used for setting the EEPROM.

Optionally, the free area includes a pad corresponding to each solder contact point of the EEPROM.

The embodiment of the invention also provides a camera module which comprises a sensor chip, a capacitor and any one of the EEPROMs for the camera module.

Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:

according to the EEPROM for the camera module, the length-width ratio of the EEPROM is increased, so that the wide side of the EEPROM is close to the wide side of the capacitor, the EEPROM can be placed at the position where the capacitor is placed, the limitation of the EEPROM on the size of the module is reduced, and the size of the camera module after the EEPROM is increased is effectively reduced.

Furthermore, a plurality of spherical welding contacts of the EEPROM are arranged in a staggered mode relative to a central axis of the chip main body, wherein the central axis is parallel to the long edge. At the moment, the welding contacts form a triangular relation, the stability between the contacts is higher, the displacement of the EEPROM after welding caused by the spherical welding contacts can be effectively avoided, and the stability of the chip after welding is improved. And each solder ball is independently arranged, so that the wiring of other devices is not hindered.

Furthermore, a plurality of welding contacts of the EEPROM are set as welding rods, so that the displacement of the welded chip caused by the arc-shaped contact surface of the welding ball can be effectively avoided, and the stability of the welded chip is improved.

Drawings

Fig. 1 provides a top view of a first camera module in the prior art;

FIG. 2 provides a top view of a second camera module of the prior art;

FIG. 3 provides a top view of a third prior art camera module;

fig. 4 provides a top view of a camera module in an embodiment of the invention;

FIG. 5 is a top view of a prior art arrangement of solder contacts of an EEPROM;

FIG. 6 is a bottom view of a prior art arrangement of solder contacts of an EEPROM;

FIG. 7 is a side view of a prior art arrangement of solder contacts of an EEPROM;

FIG. 8 is a schematic view of a ball bond contact in accordance with an embodiment of the present invention;

FIG. 9 is a top view of a solder contact distribution for an EEPROM in an embodiment of the invention;

FIG. 10 is a top plan view of another EEPROM solder contact arrangement in an embodiment of the invention;

FIG. 11 is a bottom view of another EEPROM solder contact layout in an embodiment of the present invention;

FIG. 12 is a side view of another EEPROM solder contact layout in an embodiment of the present invention;

fig. 13 is a schematic diagram illustrating a distribution of strip solder contacts of an EEPROM according to an embodiment of the present invention.

Detailed Description

As background art says, the size limitation of the current camera module (also called fixed focus module) mainly lies in the limitation of the EEPROM size, and the current three kinds of camera modules are: since the image sensor has no built-in One Time Programmable (OTP) memory, or the built-in OTP memory is small, the EEPROM can be placed only by enlarging the area of the module.

The low-pixel (picture capacity is 5M, 8M and 13M) fixed focus module and the image sensor are internally provided with the OTP, when the capacity is large enough, the OTP can replace the EEPROM to burn the module information, but the OTP is different from the EEPROM and cannot be erased after being written, the writing speed is slow, the burning efficiency of a module factory is reduced, and the module is possibly scrapped due to poor burning. Therefore, in the using process, a mobile phone manufacturer can also add an EEPROM in the fixed focus module to improve the storage capacity.

The high-pixel (picture capacity is 16M, 20M, 24M, 32M) fixed focus module adopts an image sensor stack scheme, and the size of the image sensor is reduced as much as possible to match with peripheral components, so that the cost of the image sensor is greatly improved, and a stack chip is easier to heat, thereby causing the image quality to be reduced.

For the conventional camera module listed above, if an EEPROM is required to be added, the placement of the EEPROM can be seen in fig. 1 to 3, and fig. 1 to 3 provide top views of three camera modules in the prior art. In fig. 1 to 3, taking the image sensor chip GC5035 (also shown in fig. 103) as an example, when only GC5035103 and 6 capacitors (shown in fig. 102) are packaged, the length and width of the packaged image module (101 in fig. 1) are 5.17 millimeters (mm) and 4.73mm, respectively, and the arrangement of the capacitors and the image sensor chip is as shown in fig. 1. When the GC5035103 is packaged with 6 capacitors (shown in fig. 102) and the EEPROM 202, the arrangement is as shown in fig. 2, and the length and width of the packaged camera module (i.e. 201 in fig. 2) are 5.72mm and 4.73mm, respectively, for the specific dimensions shown in fig. 2. When the GC5035103 is packaged with 7 capacitors (shown in fig. 102) and the EEPROM 202, the arrangement is as shown in fig. 3, and the length and width of the packaged camera module (i.e. 301 in fig. 3) are 4.37mm and 6.48mm, respectively, for the specific dimensions shown in fig. 3. It should be noted that, the length and width of the chip are accurate to two digits after the decimal point, and there may be measurement errors due to omitting some digits.

According to the attached drawings 1 to 3, as for the existing camera module, if an EEPROM is added, because the current standard size of the EEPROM is not matched with the sizes of other devices in the current camera module, the EEPROM can be placed only by enlarging the area of the module.

Therefore, it is desirable to provide an EEPROM for a camera module to effectively reduce the size of the camera module after the EEPROM is increased.

In order to solve the above problem, an embodiment of the present invention provides an EEPROM for a camera module, where the camera module at least includes a sensor chip and a capacitor, the capacitor is rectangular in a top view, the EEPROM includes a chip main body and a solder contact located at a bottom of the chip main body, the chip main body is rectangular in a top view, and a length difference between a wide side of the chip main body and a wide side of the capacitor is within a preset deviation range.

By the method, the size of the EEPROM can be matched with that of the capacitor, so that the camera module can be used for placing the EEPROM at the position where the capacitor is placed or at the vacant position near the capacitor, the size of the module does not need to be additionally increased, and the size of the camera module is effectively reduced.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

The embodiment of the invention provides an EEPROM (electrically erasable programmable read-only memory) for a camera module, wherein the camera module at least comprises a sensor chip and a capacitor, the capacitor is rectangular in overlook, the EEPROM comprises a chip main body and a welding contact positioned at the bottom of the chip main body, the chip main body is rectangular in overlook, and the length difference between the wide side of the chip main body and the wide side of the capacitor is within a preset deviation range.

In this embodiment, set up EEPROM's chip main part into the rectangle that is close with the electric capacity width to when encapsulating sensor chip, electric capacity, EEPROM's occupation width is close with the electric capacity, thereby further reduces the size of the module of making a video recording after the encapsulation.

Optionally, the preset deviation range is used for limiting the width of the chip body of the EEPROM and the width of the capacitor, and may be specifically limited according to the manufacturing process of the EEPROM and the size requirement of the camera module. When the preset deviation range is smaller than the length difference between the wide side of the chip main body of the existing EEPROM and the wide side of the capacitor, the size of the camera module can be reduced. The predetermined deviation range may be a specific value, such as 0.05mm, 0.1mm, 0.5mm, etc., or may be a relative ratio, such as a specific ratio of the smaller of the long side and the wide side (e.g., 1%, 3%, 5%, etc.).

Optionally, the length of the wide side of the chip main body is equal to the length of the wide side of the capacitor. The term "equal" herein includes that both are completely equal to each other and that the error between both is within the tolerance range allowed by the processing.

Referring to fig. 4, fig. 4 is a schematic diagram illustrating placement of devices in the camera module according to an embodiment of the present invention; in this embodiment, also taking the camera sensor chip GC5035 in fig. 1 to 3 as an example, when the EEPROM 402 is made into a rectangle instead of a conventional approximate square, and the wide side of the EEPROM 402 is close to the wide side of the capacitor, the EEPROM 402 and the capacitor can be arranged in the manner shown in fig. 4 when they are combined, so as to effectively save space. The length and width of the camera module 401 after being packaged in fig. 4 are 5.21mm and 4.95mm, respectively, which are smaller than the size of the conventional camera module in fig. 1 to 3.

In the embodiment, the aspect ratio of the EEPROM is increased, so that the wide side of the EEPROM is close to the wide side of the capacitor, and the EEPROM can be placed at the position where the capacitor is placed, thereby reducing the limitation of the EEPROM on the size of the module, and effectively reducing the size of the camera module after the EEPROM is increased.

Referring to fig. 5 to 7, fig. 5 to 7 are a top view, a bottom view and a side view of a soldering contact distribution of an EEPROM in the prior art, respectively; the EEPROM may include four solder contacts corresponding to four pins of a supply voltage VCC, a common ground VSS, a clock signal SCL, and a data signal SDA.

Referring to table 1, table 1 shows the values of the relevant parameters for this class of EEPROM and one example of EEPROM (Typ), where the units of the respective dimensions are millimeters (mm):

TABLE 1

Reference numerals	Minimum (Min)	Example value (Typ)	Maximum value (Max)
				A	0.250	0.275	0.300
A1	0.1875	0.200	0.2125
				A2	0.0425	0.050	0.0575
A3	0.02	0.025	0.03
				b		0.160
D	0.610	0.630	0.670
				E	0.600	0.620	0.660
e	-	0.400	-
				e 1	-	0.400	-
F	-	0.110	-
				G	-	0.115	-

In one embodiment, the solder contacts comprise a number of ball-shaped solder contacts (also referred to as solder balls).

After the EEPROM is designed to be rectangular, the EEPROM can be connected with a welding plate through a plurality of welding contacts at the bottom of the chip main body so as to be connected into the camera module. The solder contact may be a solder ball as shown in fig. 8, and the contact surface of the solder ball with the solder plate is an arc-shaped contact surface as shown in fig. 8.

Optionally, the plurality of spherical welding contacts are sequentially arranged along a central axis of the chip main body parallel to the long edge. For example, uniformly aligned along a central axis parallel to the long sides.

Referring to fig. 9, fig. 9 is a top view of a solder contact distribution of an EEPROM in an embodiment of the present invention; i.e. the welding contacts may be arranged in sequence according to the central axis parallel to the long sides as shown in fig. 9. In this case, the length of the wide side of the EEPROM should be the shortest.

Optionally, the EEPROM may include four welding contacts corresponding to four pins of the power supply voltage VCC, the common ground terminal VSS, the clock signal SCL, and the data signal SDA.

Optionally, the plurality of spherical bonding contacts are arranged in a staggered manner with respect to a central axis of the chip body parallel to the long side. Further, for two welding contacts which are adjacent in position or arranged continuously, one welding contact is located on one side of the central axis, and the other welding contact is located on the other side of the central axis.

Referring to fig. 10 to 12, fig. 10 to 12 are a top view, a bottom view and a side view of solder contact distribution of another EEPROM in the embodiment of the present invention, respectively; the EEPROM may include four solder contacts corresponding to four pins of a supply voltage VCC, a common ground VSS, a clock signal SCL, and a data signal SDA.

Referring to table 2, table 2 shows the values of the relevant parameters for this class of EEPROM and one of the EEPROM instances (Typ), where the units of the respective dimensions are millimeters (mm):

TABLE 2

Reference numerals	Minimum (Min)	Example value (Typ)	Maximum value (Max)
				A	0.220	0.245	0.270
A1	0.1575	0.170	0.1825
				A2	0.0425	0.050	0.0575
A3	0.02	0.025	0.03
				b		0.150
D	1.090	1.110	1.150
				E	0.300	0.320	0.360
e	-	0.300	-
				e 1	-	0.3195	-
e 2	-	0.110	-

In combination with the length (see D in table 1 or 2) and the width (see E in table 1 or 2) of the EEPROM in table 1 and table 2, it can be seen that the difference between the size of the existing EEPROM and the size of the EEPROM provided in the present embodiment is.

It should be noted that the number and arrangement sequence of the solder contacts of the EEPROM include, but are not limited to, the situations shown in fig. 5 to fig. 12.

In this embodiment, a plurality of solder contacts of the EEPROM are staggered from top to bottom with respect to a central axis of the chip body parallel to the long side as shown in fig. 10 and 11. At the moment, the welding contacts form a triangular relation, the stability between the contacts is higher, the displacement of the EEPROM after welding caused by the spherical welding contacts can be effectively avoided, and the stability of the chip after welding is improved. And each solder ball is independently arranged, so that the wiring of other devices is not hindered.

In one embodiment, the welding contacts comprise a number of strip-shaped welding contacts (also called electrodes).

Referring to fig. 13, fig. 13 is a schematic diagram illustrating distribution of strip-shaped welding contacts of an EEPROM according to an embodiment of the present invention, and a welding rod is shaded. The welding rods are distributed along the long edge in sequence.

Alternatively, the plurality of welding wires may be parallel to the broad side of the chip body.

A plurality of welding contacts of the EEPROM are arranged into welding rods, so that the displacement of a welded chip caused by the arc-shaped contact surface of a welding ball can be effectively avoided, and the stability of the welded chip is improved.

Optionally, the mode of accessing the EEPROM into the camera module in the present invention may be implemented by Surface Mount Technology (SMT).

That is, a camera module for placing the EEPROM in any of the above embodiments may be provided, and an empty area for placing the EEPROM is formed in the camera module, so that the EEPROM is accessed to the camera module when necessary, thereby improving the data storage capability of the camera module. The free area and the EEPROM are in a corresponding rectangle shape, and the size of the free area can be slightly larger than that of the EEPROM for ensuring welding.

And the bonding pads corresponding to the welding contact points of the EEPROM can be further arranged in the idle area so as to facilitate the welding of the welding contact points of the EEPROM.

A camera module including the EEPROM of any of the above embodiments may also be provided, i.e., the EEPROM is directly packaged into the camera module. One device distribution of the camera module is shown in fig. 4.

It should be understood that the term "and/or" herein is merely one type of association relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" in this document indicates that the former and latter related objects are in an "or" relationship.

The "plurality" appearing in the embodiments of the present application means two or more.

The descriptions of the first, second, etc. appearing in the embodiments of the present application are only for illustrating and differentiating the objects, and do not represent the order or the particular limitation of the number of the devices in the embodiments of the present application, and do not constitute any limitation to the embodiments of the present application.

The term "connect" in the embodiments of the present application refers to various connection manners, such as direct connection or indirect connection, to implement communication between devices, which is not limited in this embodiment of the present application.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. The utility model provides a EEPROM for making a video recording the module, the module of making a video recording includes sensor chip and electric capacity at least, the electric capacity is the rectangle when overlooking, EEPROM includes the chip main part and is located the welding contact of chip main part bottom, its characterized in that, the chip main part is the rectangle when overlooking, the broadside of chip main part with length difference between the broadside of electric capacity is in presetting the deviation within range.

2. The EEPROM of claim 1, wherein the width of the chip body is equal to the length of the width of the capacitor.

3. The EEPROM of claim 1, wherein said solder contact comprises a plurality of ball solder contacts.

4. The EEPROM of claim 3, wherein the plurality of ball bonding contacts are arranged in sequence along a central axis of the chip body parallel to the long sides.

5. The EEPROM of claim 3, wherein the plurality of ball bonding contacts are staggered with respect to a central axis of the chip body parallel to the long side.

6. The EEPROM of claim 1, wherein the solder contact comprises a plurality of bar-shaped solder contacts.

7. The EEPROM of claim 6, wherein the plurality of strip-shaped solder contacts are arranged in parallel in sequence and parallel to the broad side of the chip body.

8. A camera module, characterized in that the camera module comprises a sensor chip, a capacitor and a free area, the size of the free area matches with the size of the EEPROM for camera module as claimed in any one of claims 1 to 7, the free area is used for setting the EEPROM.

9. The camera module of claim 8, wherein said free area comprises pads corresponding to respective solder contacts of said EEPROM.

10. A camera module, characterized in that the camera module comprises a sensor chip, a capacitor and the EEPROM of any of claims 1 to 7 for camera module.