CN114122900A

CN114122900A - Laser device

Info

Publication number: CN114122900A
Application number: CN202010878774.XA
Authority: CN
Inventors: 周伯禹; 田新团
Original assignee: Qingdao Hisense Laser Display Co Ltd
Current assignee: Qingdao Hisense Laser Display Co Ltd
Priority date: 2020-08-27
Filing date: 2020-08-27
Publication date: 2022-03-01

Abstract

The application discloses laser belongs to the technical field of photoelectricity. The laser includes: a pipe shell, one side of which is opened; the light-emitting components are positioned in the accommodating space of the tube shell; the sealing cover plate is annular and comprises an inner edge part, an outer edge part and a wave structure connecting the inner edge part and the outer edge part, the wave shape of the wave structure extends from the outer edge part to the inner edge part, and the outer edge part is fixed with the side of the opening of the pipe shell; and the edge of the light-transmitting sealing layer is fixed with the inner edge part. The problem that the preparation yield of laser instrument is lower has been solved in this application. The application is used for light emission.

Description

Laser device

Technical Field

The application relates to the field of photoelectric technology, in particular to a laser.

Background

With the development of the optoelectronic technology, the laser is widely used.

As shown in fig. 1, the laser 00 includes an envelope 001, a plurality of light emitting elements 002, a sealing cover 003, and a light-transmitting sealing layer 004. Wherein, one side of the tube shell 001 has an opening, and the plurality of light emitting components 002 are located in the accommodating space of the tube shell 001. Sealed apron 003 is the sunken cyclic annular panel beating part of inward flange, and the outward flange of sealed apron 003 welds in the opening place side of tube through parallel seal welding technique, and the edge of printing opacity sealing layer 004 is fixed with the inward flange of sealed apron 003.

When carrying out parallel seal to sealed apron and tube, the junction of sealed apron and tube can send great heat, and then the tube thermal expansion produces great stress, and this stress can be transmitted to the printing opacity sealing layer through sealed apron, leads to the printing opacity sealing layer to break more easily. Therefore, the production yield of the laser is low.

Disclosure of Invention

The application provides a laser, can solve the lower problem of preparation yield of laser. The technical scheme is as follows: the laser includes:

the pipe shell is provided with an opening on one surface;

the light-emitting components are positioned in the accommodating space of the tube shell;

a sealing cover plate having a ring shape, the sealing cover plate including an inner edge portion and an outer edge portion, and a wave structure connecting the inner edge portion and the outer edge portion, the wave of the wave structure extending from the outer edge portion toward the inner edge portion, the outer edge portion being fixed to the side of the opening of the tube case;

a light transmissive sealing layer having an edge fixed to the inner edge portion.

The beneficial effect that technical scheme that this application provided brought includes at least:

in the laser provided by the application, stress generated by the tube shell and the sealing cover plate when being heated can enable the waveform structure in the tube shell and the sealing cover plate to generate certain shrinkage deformation, so that the sealing cover plate can absorb more stress, and the stress transmitted from the sealing cover plate to the light-transmitting sealing layer is smaller; and even if the wave-shaped structure expands when heated, the deformation amount of the wave-shaped structure towards the light-transmitting sealing layer can be ensured to be smaller. Therefore, the risk of breakage of the light-transmitting sealing layer under the action of stress generated by thermal expansion of the sealing cover plate can be reduced, and the preparation yield of the laser is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser provided in the related art;

fig. 2 is a schematic structural diagram of a laser provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of another laser provided in an embodiment of the present application;

fig. 4 is a schematic structural diagram of another laser provided in an embodiment of the present application;

FIG. 5 is a schematic structural diagram of another laser provided in an embodiment of the present application;

FIG. 6 is a schematic structural diagram of a sealing cover plate according to an embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of another sealing cover plate provided in the embodiments of the present application;

fig. 8 is a schematic structural diagram of another laser provided in an embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

With the development of the optoelectronic technology, the application of the laser is more and more extensive, for example, the laser can be applied to the aspects of welding process, cutting process, laser projection and the like. The following embodiments of the present application provide a laser, can reduce the risk that the printing opacity sealing layer breaks in the laser, improve the preparation yield of laser.

Fig. 2 is a schematic structural diagram of a laser provided in an embodiment of the present application, fig. 3 is a schematic structural diagram of another laser provided in an embodiment of the present application, and fig. 2 may be a schematic structural diagram of a section a-a' of the laser shown in fig. 3. As shown in fig. 2, the laser 10 may include: an envelope 101, a plurality of light emitting components 102, a sealing cover plate 103 and a light transmissive sealing layer 104.

One surface of package 101 is open, and the plurality of light emitting elements 102 are located in the accommodating space of package 101. The sealing cover plate 103 has a ring shape, and the sealing cover plate 103 includes an inner edge portion W1 and an outer edge portion W2, and a wave structure W3 connecting the inner edge portion W1 and the outer edge portion W2. The waveform of the waveform structure W3 extends from the outer edge portion W2 toward the inner edge portion W1, and the outer edge portion W2 is fixed to the opening side of the case 101. The edge of the light-transmitting sealant 104 is fixed to the inner edge portion W1.

The thickness of the outer edge portion W2 of the sealing cover plate 103 in the embodiment of the present application, which is thinner than the predetermined thickness threshold, may be smaller than the predetermined thickness threshold, and the outer edge portion W2, which is W2 may be fixed to the opening side of the package 101 by a parallel sealing technique. Alternatively, the sealing cover plate 103 may be a sheet metal part, and the thickness of each position of the sealing cover plate 103 is the same or approximately the same. The sealing cover plate 103 may be manufactured by a sheet metal process, for example, an annular plate-shaped structure may be stamped, so that a proper position in the plate-shaped structure is bent, recessed or raised, so as to obtain the sealing cover plate provided in the embodiment of the present application.

As shown in fig. 2, the housing 101 may include a bottom plate 1011 and a circular side wall portion 1012 fixed to the bottom plate 1011, wherein the bottom plate 1011 and the side wall portion 1012 enclose the accommodating space of the housing 101. The opening in the side wall portion 1012 away from the base 1011 is the opening in the housing 101. The outer edge portion W2 of the sealing cover 103 may be secured to the surface of the side wall portion 1012 remote from the base 1011 by a parallel sealing technique. Alternatively, bottom plate 1011 and side wall portion 1012 in case 101 may be of an integral structure, or may be of separate structures, and are welded together to form case 101.

Note that, when the outer edge portion W2 of the sealing cover 103 is fixed to the package 101 by the parallel sealing technique, the sealing cover 103 is first placed on the side of the opening of the package 101, and the outer edge portion W2 of the sealing cover 103 overlaps the surface of the side wall portion 1012 of the package 101 away from the bottom plate 1011. The outer edge portion W2 is then heated by a sealing device to weld the outer edge portion W2 to the side wall portion of the package 101. Alternatively, the translucent sealing layer 104 may be fixed to the sealing cover plate 103 before the sealing cover plate 103 is fixed to the package 101, for example, the edge of the translucent sealing layer 104 may be fixed to the inner edge portion W1 of the sealing cover plate 103 by a sealing adhesive. The sealant may include glass frit, low temperature glass solder, epoxy sealant or other sealant glues. The sealing glue can coat the side surface of the light-transmitting sealing layer so as to ensure the pasting reliability of the light-transmitting sealing layer.

When parallel sealing is performed, the package 101 and the sealing cap 103 thermally expand, and thus generate large stress. Under the action of the stress, the wave-shaped structure W3 in the sealing cover plate 103 is equivalently squeezed by the inner edge portion W1 and the outer edge portion W2, and then the wave-shaped structure W3 is similar to a compression spring and contracts and deforms, so that the wave-shaped structure W3 can absorb more stress, a certain buffering effect is achieved, and the stress transmitted to the light-transmitting sealing layer 104 is smaller. Even if the sealing cover plate 103 expands by heat to deform toward the light-transmitting sealing layer 104, the wavy structure W3 can contract to some extent under the force generated by heat, so that the deformation amount of the sealing cover plate 103 toward the light-transmitting sealing layer 104 is small, the light-transmitting sealing layer 104 is squeezed less, and the risk of cracking of the light-transmitting sealing layer is reduced. In addition, the wave-shaped structure can absorb more stress, so that the limit value of stress damage of the sealing cover plate can be improved, the adaptability of the sealing cover plate and the light-transmitting sealing layer to higher parallel sealing welding temperature is greatly enhanced, the requirement on the preparation condition of the laser is reduced, the requirement on the condition of the use environment of the laser is lower, and the application range of the laser can be enlarged. When the parallel sealing is finished and the sealing cover plate is not heated any more, the temperature of the pipe shell and the sealing cover plate can be reduced, and the wave-shaped structure in the pipe shell and the sealing cover plate can be restored (namely, the shape when the wave-shaped structure is not pressed by the inner edge part W1 and the outer edge part W2 is equivalent to the free height of the compression spring).

In summary, in the laser provided in the embodiment of the present application, stress generated when the tube shell and the sealing cover plate are heated can cause the waveform structure therein to generate a certain shrinkage deformation, so that the sealing cover plate can absorb more stress, and the stress transmitted from the sealing cover plate to the light-transmitting sealing layer is smaller; and even if the wave-shaped structure expands when heated, the deformation amount of the wave-shaped structure towards the light-transmitting sealing layer can be ensured to be smaller. Therefore, the risk of breakage of the light-transmitting sealing layer under the action of stress generated by thermal expansion of the sealing cover plate can be reduced, and the preparation yield of the laser is improved.

In addition, because the expanded area of the wave-shaped structure is larger, heat generated in the fixing process of the sealing cover plate and the tube shell can be absorbed and dissipated by the wave-shaped structure, the heat transferred to the light-transmitting sealing layer can be reduced, the deformation amount of the light-transmitting sealing layer due to thermal expansion is reduced, and the risk that the light-transmitting sealing layer is broken or separated from the sealing cover plate is reduced.

In the embodiment of the present application, the light emitting assembly 102 may include a light emitting chip, a heat sink, and a reflective prism. The heat sink may be disposed on the bottom plate 1011 of the package 101, the light emitting chip may be disposed on the heat sink, the heat sink is used to assist the light emitting chip in dissipating heat, and the reflection prism may be located on the light emitting side of the light emitting chip. Light emitted from the light emitting chip may be directed to the reflective prism, and then reflected on the reflective prism to be emitted through the light transmissive sealing layer 104. For example, the plurality of light emitting chips may all emit light of the same color, or different light emitting chips in the plurality of light emitting chips may emit light of different colors, which is not limited in this embodiment of the application. The light emitted by the light emitting chip can be laser. The light emitting chip can generate a large amount of heat during operation, the heat is transmitted to the bottom plate 1011 through the heat sink, and then is transmitted to the sealing cover plate 103 through the side wall part 1012 of the tube shell 101, at the moment, the effect of the heat on the sealing cover plate is the same as the effect of the heat generated by parallel sealing welding on the sealing cover plate, and the waveform structure in the sealing cover plate 103 can also generate certain shrinkage deformation under the effect of the heat so as to absorb stress. After the light-emitting chip stops working and is cooled, the wave-shaped structure can be restored to the original state so as to release stress.

In the embodiment of the present application, the package 101, the sealing cover plate 103, and the light-transmitting sealing layer 104 may form a closed space, so that the light emitting element 102 may be located in the closed space, and the light emitting element 102 is prevented from being corroded by water and oxygen. Since the risk of cracking of the light-transmitting sealing layer 104 is reduced, the sealing effect of the sealed space can be ensured, and the life of the light-emitting component can be further prolonged.

The material of this tube shell in this application embodiment can be copper, for example oxygen-free copper, and the material of this printing opacity sealing layer can be glass, and the material of this sealed apron can be stainless steel. Because the thermal expansion coefficient of the stainless steel is larger than that of the glass and smaller than that of the oxygen-free copper, the difference of the thermal expansion coefficients of all connected parts is small, the stress transmitted to the sealing cover plate and the sealing glass by the oxygen-free copper pipe shell due to thermal expansion can be properly relieved, and the preparation yield of the laser is further improved.

It should be noted that, the coefficient of heat conductivity of copper is great, and the material of tube in this application embodiment is copper, so can guarantee that the light emitting component who sets up on the bottom plate of tube can conduct through the tube fast at the heat that the during operation produced, and then very fast giveaway, avoids heat to gather the damage to light emitting component. Optionally, the material of the package may be one or more of aluminum, aluminum nitride and silicon carbide. The material of the sealing cover plate in the embodiment of the present application may also be other kovar materials, such as iron-nickel-cobalt alloy or other alloys. The material of the light-transmitting sealing layer may also be other materials with light-transmitting and high reliability, such as resin materials.

In this application embodiment, the printing opacity sealing layer can be directly fixed with sealed apron, and perhaps the laser instrument can also include the carriage, and the printing opacity sealing layer can be fixed with the carriage earlier, and then the carriage is fixed with sealed apron again. For example, the supporting frame may be a frame shaped like a Chinese character 'mu', so that the middle region of the light-transmitting sealing layer may be supported by the supporting frame, and the setting firmness of the light-transmitting sealing layer may be improved. Optionally, a brightness enhancement film may be attached to at least one of the surface close to the substrate and the surface far from the substrate of the light-transmitting sealing layer to improve the light-emitting brightness of the laser.

In the embodiment of the present application, the waveform of the waveform structure W3 in the sealing cover plate 103 may be in a wave shape or a wave-fold shape, that is, the section of the waveform structure W3 is in a wave shape or a wave-fold line, and the section is perpendicular to the surface of the opening of the case 101. If this wave structure is the wave, then wave crest and the trough department of this wave structure are circular-arc, so can avoid when tube and sealed apron receive thermal energy, the stress of this wave crest and trough department is too concentrated, reduces the risk that sealed apron damaged under the stress. If the corrugated structure is in a corrugated shape, the corrugated structure can be more similar to the structure of the compression spring, and further, when the pipe shell and the sealing cover plate are subjected to thermal expansion, the corrugated structure can be more easily subjected to compression deformation so as to release stress more easily. Optionally, the waveform of the waveform structure W3 may have 2-3 wave periods. It should be noted that, the wave periods in the waveform of the waveform structure may be the same or different, for example, the portions between two adjacent peaks or troughs in the waveform may be the same or different. The waveform may also have a wave period of four, five or more. Alternatively, the waveform may be a triangular wave, a sawtooth wave, a sine wave, or the like.

For example, fig. 2 illustrates the waveform as a wave-fold shape, the waveform as a triangular wave, and the waveform as 3 wave periods. As shown in fig. 2, the waveform may include three axisymmetric v-shaped substructures connected in sequence, each v-shaped substructure is composed of two plate-shaped structures connected, and the three v-shaped substructures may have identical shapes and sizes. Alternatively, the plurality of v-shaped substructures may have the same shape but different sizes, or may have different shapes, such as different included angles between two plate-shaped structures composing different v-shaped substructures.

With continued reference to fig. 2, the wave-shaped structure W3 and the inner edge portion W1 of the sealing cover plate 103 are recessed toward the interior of the tube housing 101 relative to the outer edge portion W2, i.e., the distance between the wave-shaped structure W3 and the bottom plate 1011 is smaller than the distance between the outer edge portion W2 and the bottom plate 1011, and the distance between the inner edge portion W1 and the bottom plate 1011 is also smaller than the distance between the outer edge portion W2 and the bottom plate 1011. In the embodiment of the present application, one structure is recessed toward the interior of the case 101 relative to the other structure, that is, the distance between the one structure and the bottom plate 1011 is smaller than the distance between the other structure and the bottom plate 1011; one structure protrudes outward from package 101 relative to the other structure, i.e., the distance between the one structure and base 1011 is greater than the distance between the other structure and base 1011. When the sealing cover plate 103 and the package 101 are fixed by the parallel sealing technique, after the sealing cover plate 103 is placed on the package 103, the sealing device like a roller is required to roll on the outer edge portion W2 of the sealing cover plate 103, and the wavy structure W3 and the inner edge portion W1 are recessed into the package 101 relative to the outer edge portion W2 in the embodiment of the present invention, so that the influence of the sealing device contacting the wavy structure W3 and the inner edge portion W1 on the wavy structure W3 and the inner edge portion W1 during rolling can be avoided.

As shown in fig. 2, both the inner edge portion W1 and the outer edge portion W2 of the sealing cover plate 103 may be annular plate-like structures with flat surfaces, and alternatively, the inner edge portion W1 and the outer edge portion W2 may be parallel. The wave structure W3 may be flush with the inner edge portion W1, as the peaks of the waves in the wave structure W3 are flush with the inner edge portion W1. Alternatively, the inner edge portion W1 may be flush with any plane between the wave crests and the wave troughs in the wave-shaped structure W3, which is not limited in the embodiments of the present application.

With continued reference to fig. 2, the sealing cover 103 may further include a first connection portion L1 for connecting the wave-shaped structure W3 and the outer edge portion W2, the first connection portion L1 is a plate-shaped structure, and the plate-shaped structure may be perpendicular to the inner edge portion W1 and the outer edge portion W2. When the side wall portion 1012 of the package 101 is expanded by heat, the expanded side wall portion 1012 can transmit stress to the wave-shaped structure W3 by pressing the first connection portion L1, and the direction of the force applied by the side wall portion 1012 to the wave-shaped structure W3 is parallel to the propagation direction of the wave-shape of the wave-shaped structure W3, so that the wave-shaped structure W3 can be easily compressed and deformed to absorb the stress. In this way, there may be a bent structure between the outer edge portion W2 and the wave-shaped structure W3, such as the bent structure includes a connection portion between the outer edge portion W2 and the first connection portion L1, and a connection portion between the first connection portion L1 and the wave-shaped structure W3. When the package 101 and the sealing cover plate 103 expand due to heat, the bent structure may deform in the bending direction to absorb part of the stress, which may further reduce the stress transmitted to the light-transmissive sealing layer 104. Therefore, the presence of the first connection portion L1 connecting the wavy structure W3 with the outer edge portion W2 can improve the stress absorbing effect of the sealing cover plate 103. Optionally, the bending part of the bending structure may have a chamfer or a fillet to avoid too much concentration of stress at the bending part.

Alternatively, the sealing cover plate may not include a plate-like structure for connecting the wave structure with the outer edge portion, but may directly connect the wave structure with the outer edge portion, in which case the wave structure is used for connecting the outer edge portion with the inner edge portion. In this case, an angle between the wavy center line of the wavy structure and the outer edge portion may be an obtuse angle, and an angle between the wavy center line of the wavy structure and the inner edge portion may be an acute angle. Therefore, when the side wall part of the tube shell is heated and expanded to extrude the sealing cover plate, the force applied to the sealing cover plate can be decomposed to the propagation direction of the waveform structure, and then the component force in the direction can make the waveform structure similar to a compression spring to be compressed and deformed so as to absorb partial stress.

In an alternative embodiment, the inner edge portion of the sealing cover plate may also be recessed relative to the wave structure into the envelope. Fig. 4 is a schematic structural diagram of another laser provided in an embodiment of the present application. As shown in fig. 4, the wavy structure W3 and the inner edge portion W1 of the sealing cover plate 103 are recessed toward the inside of the tube case 101 with respect to the outer edge portion W2, and the inner edge portion W1 is also recessed toward the inside of the tube case 101 with respect to the wavy structure W3. Only the inner edge portion W1 of the laser in fig. 4 is recessed into the package 101 with respect to the wave structure W3 with respect to the laser in fig. 2, and for the description of other portions, reference may be made to the description of fig. 2, and the description of the embodiments of the present application will not be repeated.

When the sealing cover plate 103 and the translucent sealing layer 104 are fixed to each other, the sealant needs to be applied to the inner edge portion W1 of the sealing cover plate 103, and the translucent sealing layer 104 covers the inner edge portion W1, and the edge of the translucent sealing layer 104 is in close contact with the sealant. The inner edge part W1 is recessed towards the inside of the case 101 relative to the wave-shaped structure W3, and the height difference between the wave-shaped structure W3 and the inner edge part W1 can ensure that the sealant is only located at the inner edge part W1, so that the influence of the sealant flowing to the wave-shaped structure W3 on the contraction deformation effect of the wave-shaped structure W3 is avoided.

Optionally, the wave-shaped structure W3 is recessed toward the inside of the package 101 with respect to the inner edge portion W1. Still alternatively, the wave formation W3 may be flush with the outer edge portion W2, e.g. the highest peaks in the wave of the wave formation W3 are flush with the outer edge portion W2, the inner edge portion W1 being recessed inwardly of the envelope 101 relative to the outer edge portion W2 and the wave formation W3.

In another alternative embodiment, the wave-like structure in the sealing cover plate may comprise adjacent first and second portions in the direction from the inner edge portion to the outer edge portion, at least one of the first and second portions being wave-like, and the first portion being convex outwardly of the cartridge relative to the second portion and the inner edge portion. In this way, both the first portion and the second portion may be recessed towards the inside of the envelope with respect to the outer edge portion. Alternatively, the second portion may be recessed towards the inside of the envelope relative to the inner edge portion. Because the first part is close to the inner edge part and is convex relative to the inner edge part, when the sealant is arranged on the inner edge part, the height difference between the first part and the inner edge part can limit the position of the sealant and prevent the sealant from flowing to other positions. The first part and the second part are both sunken towards the inner part of the tube shell relative to the outer edge part, so that the first part and the second part are far away from the sealing equipment during parallel sealing, and the influence or damage of the sealing equipment on the first part and the second part is avoided.

Fig. 5 is a schematic structural diagram of another laser provided in an embodiment of the present application, fig. 6 is a schematic structural diagram of a sealing cover plate provided in an embodiment of the present application, fig. 7 is a schematic structural diagram of another sealing cover plate provided in an embodiment of the present application, fig. 6 is a schematic structural diagram of an interface b-b' of the sealing cover plate shown in fig. 7, and the laser shown in fig. 5 includes the sealing cover plate 104 shown in fig. 6 or fig. 7. As shown in fig. 5 to 7, the wave-shaped structure W3 in the sealing cover plate 104 includes a first portion B1 and a second portion B2 adjacent to each other in the direction from the inner edge portion W1 to the outer edge portion W2, at least one of the first portion B1 and the second portion B2 is wave-shaped, and the first portion B1 is convex outward of the case 101 with respect to the second portion B2 and the inner edge portion W2.

Fig. 5-7 illustrate that the first portion B1 can have a rectangular (or n-shaped) configuration, and the second portion B2 has a wavy shape. The first part B1 includes a second connecting portion L2, a third connecting portion L3 and a fourth connecting portion L4 connected in sequence, and the second connecting portion L2 and the fourth connecting portion L4 are perpendicular to the third connecting portion L3. The second link L2 is connected to the inner edge portion W1 and the fourth link L4 is connected to the second portion B2; the second link portion L2, the third link portion L3, and the fourth link portion L4 are each a flat annular plate-shaped structure, and the third link portion L3 may be parallel to the inner edge portion W1. So this sealed apron can include more structure of buckling, if the structure of buckling can include the coupling part of second connecting portion and third connecting portion to and the coupling part of third connecting portion and fourth connecting portion, when tube and sealed apron receive the thermal energy, these structures of buckling can take place certain deformation along the direction of buckling to absorb partial stress, further promoted the absorption effect of sealed apron to stress. Optionally, an included angle between the second connection portion and the third connection portion may also be an obtuse angle or an acute angle, an included angle between the fourth connection portion and the third connection portion may also be an obtuse angle or an acute angle, and the third connection portion may also be not parallel to the inner edge portion. The first portion may also be in an arch shape or other shapes, and the embodiments of the present application are not limited thereto.

Alternatively, the first portion may be corrugated and the second portion may be flat. If the third connecting part in the first part is in a wave shape, the second connecting part and the fourth connecting part are in flat plate-shaped structures; or any two of the second connecting part, the third connecting part and the fourth connecting part are in a wave shape or all three of the connecting parts are in a wave shape. Optionally, both the first portion and the second portion may be in a waveform, and the embodiment of the present application is not limited.

Alternatively, with continued reference to fig. 5 and 6, the second portion B2 of the wave form W3 is recessed relative to the inner edge portion W1 into the package 101, e.g., the peaks of the wave form in the second portion B2 are recessed relative to the inner edge portion W1 into the package 101. In an alternative example, the second portion of the wave structure may also be flush with the inner edge portion, e.g. the peaks of the waves in the second portion are flush with the inner edge portion. In another alternative, it is also possible that the inner edge portion is recessed towards the inside of the tube shell in relation to the second part of the wave-shaped structure, e.g. the inner edge portion is recessed towards the inside of the tube shell in relation to the wave troughs of the wave-shaped structure in the second part.

Fig. 8 is a schematic structural diagram of another laser provided in an embodiment of the present application. As shown in fig. 8, on the basis of fig. 2, the laser 10 may further include: a collimating lens group 105, the collimating lens group 105 is located on a side of the light-transmissive sealing layer 104 far from the package 101. For example, the edge of the collimating lens assembly 105 may be attached to the outer edge portion W2 of the sealing cover 103 and fixed to the outer edge portion W2 by an adhesive material. Thus, the collimator set 105 can be supported by the sidewall 1012 of the housing 101, ensuring the reliability of the collimator set 105. Optionally, the collimating lens assembly 105 may also be located between the sealing cover plate 104 and the bottom plate 1011 of the package 101, which is not limited in the embodiment of the present application.

The collimating lens group 105 is used for collimating and emitting light emitted from the light emitting component (e.g. light reflected by a reflecting prism in the light emitting component). It should be noted that, collimating the light, that is, converging the light, makes the divergence angle of the light smaller, and is closer to the parallel light. The collimating lens group 105 may include a plurality of collimating lenses, the plurality of collimating lenses may correspond to the plurality of light emitting assemblies 102 in the laser one-to-one, and light emitted by each light emitting assembly may be emitted to the corresponding collimating lens, and then emitted after being collimated by the collimating lens.

For example, as shown in fig. 8, a plurality of collimating lenses in the collimating lens group 105 may be integrally formed, one side of the collimating lens group 105 away from the bottom plate 1011 of the tube shell 101 may have a plurality of convex arc surfaces bending towards one side away from the bottom plate 1011, and a portion where each convex arc surface is located may be used as one collimating lens, and thus may be regarded as a collimating lens group including a plurality of collimating lenses. This collimating lens can be the convex lens of plano-convex form, and this collimating lens can have a convex arc face and a plane, and this convex arc face and plane can be two relative faces, and this plane can be on a parallel with the face of bottom plate 1011, and is close to bottom plate 1011 and sets up. Each of the convex curved surfaces of the collimator lens group 105 may be a convex curved surface in one collimator lens. Optionally, in the embodiment of the present application, a radius of curvature of the collimating lens in the collimating lens group (that is, a radius of curvature of the convex arc surface in the collimating lens) may range from 1 mm to 4.5 mm.

Alternatively, the plurality of light emitting elements in the laser may include a plurality of rows and columns of light emitting chips arrayed on the bottom plate of the package. The distance between the adjacent light emitting chips in the first direction may be 2-4 mm, for example, 3 mm, and the first direction may be a light emitting direction of the light emitting chips. In a second direction perpendicular to the first direction, the distance between adjacent light emitting chips may be in a range of 3 to 6 mm, for example, may be 4 mm.

With continued reference to fig. 2-5 and 8, sidewall portion 1012 of package 101 may have a plurality of openings on opposite sides thereof, and laser 10 may further include: conductive pins 106, and conductive pins 106 may extend into package 101 through openings in sidewall portions 1012, respectively, to be secured to package 101. The conductive pins 106 may be electrically connected to electrodes of the light emitting chips in the light emitting assembly 102 to transmit an external power to the light emitting chips, so as to excite the light emitting chips to emit light. Alternatively, the aperture of the opening may be 1.2 mm, and the diameter of the conductive pin 106 may be 0.55 mm.

Alternatively, in the embodiment of the present application, when assembling the laser, a ring-shaped solder structure (e.g., a ring-shaped glass bead) may be first placed in the opening on the sidewall portion of the package, and the conductive pin may be passed through the solder structure and the opening where the solder structure is located. Then, the side wall part is placed on the periphery of the bottom plate, the annular silver-copper solder is placed between the bottom plate and the tube shell, then the structure of the bottom plate, the side wall part and the conductive pins is placed in a high-temperature furnace for sealing and sintering, and the bottom plate, the side wall part, the conductive pins and the solder can be integrated after sealing, sintering and curing, so that the air tightness of the opening of the side wall part is realized. The light-transmitting sealing layer may be fixed to the sealing cover plate, for example, an edge of the light-transmitting sealing layer is adhered to an inner edge of the sealing cover plate, so as to obtain the upper cover assembly. Then, the light-emitting component can be welded on the bottom plate in the accommodating space of the tube shell, then the upper cover component is welded on the surface of the side wall part of the tube shell far away from the bottom plate by adopting a parallel seal welding technology, and finally the collimating lens group is fixed on one side of the upper cover component far away from the bottom plate through epoxy glue, so that the laser device is assembled. It should be noted that the above-mentioned assembling process is only an exemplary process provided in the embodiment of the present application, the welding process adopted in each step may also be replaced by another process, and the sequence of each step may also be adapted to be adjusted, which is not limited in the embodiment of the present application.

In the above embodiments of the present application, the bottom plate and the side wall portion of the case are two separate structures that need to be assembled. Alternatively, the bottom plate and the side wall portion may be integrally formed. So can avoid bottom plate and lateral wall portion because the bottom plate that the thermal expansion coefficient of bottom plate and lateral wall portion is different to lead to produces the fold when high temperature welding, and then can guarantee the flatness of bottom plate, guarantee light-emitting component and set up the reliability on the bottom plate, and guarantee that the light that light-emitting chip sent is according to predetermined luminous angle outgoing, improve the luminous effect of laser instrument.

It should be noted that in the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" means two or more unless expressly limited otherwise. "substantially" means within an acceptable error range, within which a person skilled in the art can solve the technical problem to substantially achieve the technical result. In the drawings, the size of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. Like reference numerals refer to like elements throughout.

The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A laser, characterized in that the laser comprises:

the pipe shell is provided with an opening on one surface;

2. The laser of claim 1, wherein the waveform is wavy or undulated.

3. The laser of claim 2, wherein the waveform has 2-3 wave periods.

4. The laser of claim 1, wherein the wave structure and the inner edge portion are recessed relative to the outer edge portion into the package.

5. The laser according to claim 1 or 4, wherein said inner edge portion is recessed toward the inside of said package with respect to said corrugated structure.

6. The laser according to claim 1 or 4,

the wave structure includes a first portion and a second portion adjacent to each other in a direction from the inner edge portion to the outer edge portion, at least one of the first portion and the second portion is formed in a wave shape, and the first portion is protruded toward the outside of the case with respect to the second portion and the inner edge portion.

7. The laser of claim 6, wherein the second portion is recessed into the package relative to the inner edge portion.

8. The laser of any one of claims 1 to 4, wherein the package is made of copper, the sealing cover is made of stainless steel, and the light-transmitting sealing layer is made of glass.

9. A laser device according to any one of claims 1 to 4, characterized in that the outer edge portion is fixed to the side of the package where the opening is located by means of a parallel seal welding technique.

10. The laser of any one of claims 1 to 4, wherein the sealing cover plate is a sheet metal part.