CN114111098B - Temperature compensation heat dissipation system for semiconductor refrigerating device - Google Patents
Temperature compensation heat dissipation system for semiconductor refrigerating device Download PDFInfo
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- CN114111098B CN114111098B CN202111388955.5A CN202111388955A CN114111098B CN 114111098 B CN114111098 B CN 114111098B CN 202111388955 A CN202111388955 A CN 202111388955A CN 114111098 B CN114111098 B CN 114111098B
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- cooling
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- heat dissipation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a temperature compensation heat dissipation system for a semiconductor refrigeration device, which comprises: the mounting bracket, the inside of mounting bracket is provided with mounting groove and the inside of mounting groove is provided with the mounting panel, mutual gomphosis between mounting panel and the mounting groove, the surface of mounting panel is provided with a plurality of groups mount pad. The lower part of the mounting seat is provided with the cooling column, the cooling column is in a spiral structure, the upper connecting port of the cooling column extends to the upper part of the mounting seat, the left side of the mounting frame is provided with the first cooling box, the right side of the mounting frame is provided with the second cooling box, the upper parts of the first cooling box and the second cooling box are respectively provided with a connecting pipe, the connecting pipes are connected with the connecting ports at the upper parts of the cooling column, the upper parts of the two groups of mounting seats are connected with the two groups of cooling columns, and the cooling column and the heating part of the cooling equipment at the lower part of the mounting plate are subjected to heat exchange reaction by introducing cooling liquid, so that the heating part of the cooling equipment is rapidly cooled.
Description
Technical Field
The invention relates to the technical field of temperature compensation heat dissipation systems, in particular to a temperature compensation heat dissipation system for a semiconductor refrigerating device.
Background
Semiconductors refer to materials that have electrical conductivity properties at normal temperatures that are intermediate between conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, etc., and diodes are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and an economic point of view. Most electronic products, such as computers, mobile phones or digital recorders, have a core unit that is very closely related to semiconductors. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., silicon being one of the most influential applications of various semiconductor materials.
At present, most of the existing heat dissipation systems only have a single cooling mechanism, temperature compensation cannot be performed, and supercooling or overheating easily causes operation obstacle of a refrigerating device. Therefore, a new solution is needed.
Disclosure of Invention
The invention aims to provide a temperature compensation heat dissipation system for a semiconductor refrigeration device, which solves the problems that the existing heat dissipation system is mainly provided with a single cooling mechanism, cannot perform temperature compensation and is easy to cause operation obstacle of the refrigeration device due to supercooling or overheating.
In order to achieve the above purpose, the present invention provides the following technical solutions: a temperature compensated heat dissipation system for a semiconductor refrigeration device, comprising: the mounting bracket, the inside of mounting bracket is provided with mounting groove and mounting groove is provided with the mounting panel, mutual gomphosis between mounting panel and the mounting groove, the surface of mounting panel is provided with a plurality of groups mount pad and the lower part of mount pad extends to the mounting groove inside, the lower part of mount pad is provided with cooling column and the upper portion that the upper portion connecting block of cooling column extends to the mount pad, the left side of mounting bracket is provided with first cooling tank and right side and is provided with the second cooling tank, be provided with back flow and first cooling tank and second cooling tank between first cooling tank and the second cooling tank and be linked together through the back flow, the upper portion of first cooling tank and second cooling tank all is provided with between connecting pipe and the upper portion connector of connecting pipe and cooling column and is connected, links to each other two sets of be provided with auxiliary pipeline and link to each other between the cooling column through auxiliary pipeline between the connecting port of cooling column, the inner bottom of mounting groove is provided with cooling tube and cooling tube extends to outside, the both ends of cooling tube are provided with water inlet and delivery port and connector are provided with the second cooling tank, be connected with the connecting port between a plurality of cooling panel and the cooling panel, the cooling panel is provided with a plurality of sets of cooling panel and is connected with between the cooling panel and the cooling panel, and the cooling panel is formed by a plurality of sets of cooling panel and is connected with the cooling panel.
As a preferred embodiment of the invention, the cooling column is arranged in a spiral structure, and cooling devices are arranged on two sides of the cooling column, and the cooling devices are fixedly connected with the mounting plate.
As a preferred embodiment of the present invention, a clamping groove is provided in the mounting groove, a sliding rod is provided in the clamping groove, and clamping blocks are provided at both ends of the mounting plate, and are sleeved on the sliding rod and are engaged with the clamping groove.
As a preferred embodiment of the present invention, the surface of the sliding rod is provided with a buffer column, the upper end surface of the buffer column is in contact with the clamping block, and the mounting plate is connected with the sliding rod in a telescopic manner through the buffer column.
As a preferred implementation mode of the invention, the two sides of the mounting frame are provided with the exhaust holes which are arranged in a strip-shaped structure, and the exhaust holes are provided with a plurality of groups which are distributed at equal intervals and the openings of the exhaust holes are downward.
As a preferred embodiment of the invention, the cooling pipes are arranged in a U-shaped structure and distributed in a serpentine shape.
As a preferred implementation mode of the invention, the connector comprises a fixed seat, a threaded column is arranged on the side face of the fixed seat, a plurality of groups of strip-shaped grooves are arranged in the threaded column and distributed at equal intervals, a knob is arranged on the surface of the threaded column, a fixed sleeve is arranged on the side face of the knob, and the knob and the fixed sleeve are connected with the threaded column through threads.
Compared with the prior art, the invention has the following beneficial effects:
according to the cooling device, the mounting groove is formed in the mounting frame, the mounting plate is arranged in the mounting groove, the mounting plates are arranged on the surfaces of the mounting plates, the mounting seats are in cylindrical structure, the mounting seats are embedded with through holes in the mounting plates, the cooling columns are arranged at the lower parts of the mounting seats and are in spiral structure, the upper connecting ports of the cooling columns extend to the upper parts of the mounting seats, the first cooling box is arranged on the left side of the mounting frame, the second cooling box is arranged on the right side of the mounting frame, connecting pipes are arranged on the upper parts of the first cooling box and the second cooling box, the connecting pipes are connected with connecting ports in the upper parts of the cooling columns, the upper parts of the two groups of the mounting seats are connected with auxiliary pipelines and are connected with the two groups of cooling columns, the cooling columns and the cooling equipment heating parts at the lower parts of the mounting plates are enabled to perform heat exchange reaction through the cooling liquid, the cooling pipes are arranged at the inner bottoms of the mounting grooves, the water inlets and the water outlets are arranged at the two ends of the cooling pipes, the water inlets and the water outlets are respectively arranged at the outer parts of the water inlets and the water outlets, the water inlets and the water outlets are respectively connected with an external device, the water inlets and the water outlets are respectively connected with the external device, the cooling device is used for cooling liquid and the temperature compensation, the cooling liquid is conveniently cooled through the cooling plate and the cooling plate is arranged at the bottom of the cooling plate or the cooling device, and the cooling device is convenient to form a cooling channel or heat channel, and the cooling channel is convenient, and the cooling channel is arranged, and the cooling channel is formed and the cooling channel is convenient.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic side view of the present invention;
FIG. 4 is a schematic view of the bottom structure of the present invention;
FIG. 5 is a schematic view of the internal structure of the present invention;
FIG. 6 is a schematic diagram of the internal side view structure of the present invention;
FIG. 7 is a schematic view of the internal top view structure of the present invention;
fig. 8 is a schematic view of a connector structure according to the present invention.
In the figure, 1, a mounting rack; 2. a mounting groove; 3. a mounting plate; 4. a first cooling tank; 5. a second cooling tank; 6. a mounting base; 7. a connecting pipe; 8. an exhaust hole; 9. a heat dissipation plate; 10. a return pipe; 11. a clamping groove; 12. a clamping block; 13. a connector; 14. an auxiliary pipe; 15. a slide bar; 16. a heat dissipation channel; 17. a dividing groove; 18. a cooling column; 19. a cooling device; 20. a cooling tube; 21. a buffer column; 22. a water inlet; 23. a water outlet; 24. a fixing seat; 25. a threaded column; 26. a bar-shaped groove; 27. fixing the sleeve; 28. and (5) a knob.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-8, the present invention provides a technical solution: a temperature compensated heat dissipation system for a semiconductor refrigeration device, comprising: the installation frame 1, the inside of installation frame 1 is provided with mounting groove 2 and mounting groove 2 is provided with mounting panel 3 in the inside, the mutual gomphosis between mounting panel 3 and the mounting groove 2, the surface of mounting panel 3 is provided with a plurality of groups of mount pad 6 and the lower part of mount pad 6 extends to mounting groove 2 inside, the lower part of mount pad 6 is provided with cooling column 18 and the upper portion connecting block of cooling column 18 extends to the upper portion of mount pad 6, the left side of installation frame 1 is provided with first cooling tank 4 and right side and is provided with second cooling tank 5, be provided with back flow 10 and first cooling tank 4 and second cooling tank 5 are linked together through back flow 10 between first cooling tank 4 and the second cooling tank 5, the upper portion of first cooling tank 4 and second cooling tank 5 all is provided with connecting pipe 7 and is connected between the upper connecting port of connecting pipe 7 and cooling column 18, link to each other two groups be provided with auxiliary pipeline 14 and link to each other between the cooling column 18 through auxiliary pipeline 14 between the connecting port of cooling column 18, be provided with cooling column 18 in 1's inside mounting groove 2 and be provided with first cooling tank 4 and right side and be provided with second cooling tank 5, be provided with back flow 10 and first cooling tank 4 and second cooling tank 5 are linked together through back flow 10 between the mounting panel 4 and the mounting panel 2, the upper portion of connecting pipe 7 and the upper portion of second cooling tank 5 are provided with connecting pipe 7 and connecting pipe 18 are connected to the upper portion of connecting pipe 7, the mounting panel 7 is provided with cooling column 18, the connecting port 3 is provided with cooling tank 1 and connecting port 3 is connected to the connecting port 1, the upper portion that links to each other two sets of mount pad 6 is provided with auxiliary pipe 14 and connects two sets of cooling post 18, makes cooling post 18 and the cooling device 19 portion that generates heat of mounting panel 3 lower part take place the heat exchange reaction through letting in coolant liquid to make the portion that generates heat of cooling device 19 fast cooling down, the interior bottom of mounting groove 2 is provided with cooling tube 20 and cooling tube 20 extends to mounting bracket 1 outside, the both ends of cooling tube 20 are provided with water inlet 22 and delivery port 23 and water inlet 22 and delivery port 23's outside is provided with connector 13, connector 13 is connected with outside supply system, is provided with cooling tube 20 and cooling tube 20's both ends are provided with water inlet 22 and delivery port 23 in the interior bottom of mounting groove 2, and water inlet 22 and delivery port 23's outside all installs connector 13, and water inlet 22 and delivery port 23 are connected with external device respectively, are in its inside coolant liquid that is used for temperature compensation to regulate and control inside temperature, thereby avoid inside supercooling or overheated, the bottom of mounting bracket 1 is provided with heating panel 9 and is provided with a plurality of groups and is equidistant distribution, and is provided with 9 the cooling panel 17 and cooling panel 17 are provided with the cooling panel 16 and the cooling panel is formed between the cooling panel 16 and the cooling panel is divided into a plurality of groups and is formed between cooling panel 16 and cooling panel form the cooling channel and is formed between the cooling panel and cooling panel 16.
Further improved, as shown in fig. 5: the cooling column 18 is in a spiral structure, cooling equipment 19 is arranged on two sides of the cooling column, the cooling equipment 19 is fixedly connected with the mounting plate 3, the cooling column 18 is in a hollow structure, the air contact area is increased, and the heat exchange effect is improved.
Further improved, as shown in fig. 6: the inside of mounting groove 2 is provided with draw-in groove 11 and draw-in groove 11's inside is provided with slide bar 15, the both ends of mounting panel 3 are provided with fixture block 12 and fixture block 12 cup joints and intermeshes each other between slide bar 15 surface ratio and draw-in groove 11, and this kind of setting makes things convenient for mounting panel 3's installation and guaranteed the stability of just installing, convenient to detach.
Further improved, as shown in fig. 6: the surface of slide bar 15 is provided with buffer post 21 and contacts each other between the up end of buffer post 21 and the fixture block 12, mounting panel 3 passes through telescopic connection between buffer post 21 and the slide bar 15, and this kind of setting has improved the cushioning performance of mounting panel 3.
Further improved, as shown in fig. 1: the both sides of mounting bracket 1 are provided with exhaust hole 8 and exhaust hole 8 are the setting of strip structure, exhaust hole 8 are provided with a plurality of groups and are equidistant distribution and exhaust hole 8's opening downwards, and exhaust hole 8's setting makes things convenient for the circulation of air, and the opening simultaneously downwards can effectively avoid the entering of dust.
Further improved, as shown in fig. 7: the cooling pipes 20 are arranged in a U-shaped structure and distributed in a serpentine shape, and the contact area and the heat exchange time are arranged, so that the temperature control is convenient.
Further improved, as shown in fig. 8: the connector 13 includes fixing base 24 and fixing base 24's side is provided with screw thread post 25, the inside of screw thread post 25 is provided with bar groove 26 and bar groove 26 is provided with a plurality of groups and is equidistant distribution, the surface of screw thread post 25 is provided with knob 28 and knob 28's side is provided with fixed sleeve 27, all hang with screw thread post 25 between threaded connection with knob 28 and fixed cover, insert the terminal shrink of screw thread post 25 with pipeline internal rotation fixed sleeve 27 messenger screw thread post 25 to it is tight fixed to press from both sides the pipeline, be convenient for install and dismantle.
According to the invention, the mounting groove 2 is formed in the mounting frame 1, the mounting plate 3 is arranged in the mounting groove 2, a plurality of groups of mounting seats 6 are arranged on the surface of the mounting plate 3, the mounting seats 6 are in a cylindrical structure, the mounting seats 6 and through holes in the mounting plate 3 are embedded with each other, the cooling columns 18 are arranged at the lower part of the mounting seat 6, the cooling columns 18 are in a spiral structure, an upper connecting port of the cooling columns 18 extends to the upper part of the mounting seat 6, a first cooling box 4 is arranged at the left side of the mounting frame 1, a second cooling box 5 is arranged at the right side of the mounting frame 1, connecting pipes 7 are arranged at the upper parts of the first cooling box 4 and the second cooling box 5, the connecting pipes 7 are connected with connecting ports in the upper parts of the cooling columns 18, an auxiliary pipeline 14 is arranged at the upper parts of the two groups of the mounting seats 6, the auxiliary pipeline 14 is connected with the two groups of the cooling columns 18, and the cooling columns 18 are in a heat exchange reaction with the cooling equipment 19 at the lower part of the mounting plate 3 through cooling liquid, so that the heating parts of the cooling equipment 19 are rapidly cooled down, a cooling pipe 20 is arranged at the inner bottom of the mounting frame 2, a water inlet 22 and a water outlet 23 are arranged at the two ends of the cooling pipe 20 and a water outlet 23 are respectively, and a cooling plate 23 are arranged at the inner side of the cooling box and the cooling box, or the cooling plate is conveniently connected with the cooling plate and the cooling plate at the inner side of the cooling box, the cooling device through the cooling device, the cooling device is arranged at the temperature and the cooling plate inside the cooling device, the cooling device is or the cooling device is arranged at the bottom and the cooling channel and the cooling device, and the cooling channel and the cooling device is convenient temperature-down device is arranged.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A temperature compensation heat dissipation system for a semiconductor refrigeration device is characterized in that: comprising the following steps: the installation rack (1), the inside of installation rack (1) is provided with mounting groove (2) and the inside of mounting groove (2) is provided with mounting panel (3), the mutual gomphosis between mounting panel (3) and mounting groove (2), the surface of mounting panel (3) is provided with a plurality of groups mount pad (6) and the lower part of mount pad (6) extends to the inside of mounting groove (2), the lower part of mount pad (6) is provided with the upper portion that cooling column (18) upper portion connecting block extends to mount pad (6), the left side of installation rack (1) is provided with first cooling tank (4) and right side is provided with second cooling tank (5), be provided with back flow (10) and first cooling tank (4) and second cooling tank (5) are linked together through back flow (10), the upper portion of first cooling tank (4) and second cooling tank (5) all is provided with connecting pipe (7) and upper portion connecting block of cooling column (18) extends to the upper portion of mount pad (6), be connected between two groups of auxiliary cooling column (14) through linking to each other between two auxiliary cooling column (14) connecting ports (14), the inner bottom of the mounting groove (2) is provided with a cooling pipe (20) and the cooling pipe (20) extends to the outside of the mounting frame (1), two ends of the cooling pipe (20) are provided with a water inlet (22) and a water outlet (23) and the outside of the water inlet (22) and the water outlet (23) is provided with a connector (13), the connector (13) is connected with an external supply system, the bottom of the mounting frame (1) is provided with a plurality of groups of radiating plates (9) and the radiating plates (9) are distributed at equal intervals, the middle part of the plurality of groups of radiating plates (9) is provided with a partition groove (17) and a plurality of groups of radiating plates (9) form a radiating channel (16), the inside of the mounting groove (2) is provided with a clamping groove (11) and the inside of the clamping groove (11) is provided with a sliding rod (15), two ends of the mounting plate (3) are provided with clamping blocks (12) and the clamping blocks (12) are sleeved on the surface of the sliding rod (15) and are mutually embedded with the clamping groove (11), the connector (13) comprises a fixing seat (24) and the side face (24) is provided with a plurality of screw thread grooves (25) and the thread grooves (26) are distributed in the middle part of the fixing seat (25), the surface of screw thread post (25) is provided with knob (28) and the side of knob (28) is provided with fixed sleeve (27), all be connected with screw thread post (25) between knob (28) and the fixed cover string.
2. A temperature compensated heat dissipation system for a semiconductor refrigeration device as set forth in claim 1 wherein: the cooling column (18) is arranged in a spiral structure, cooling equipment (19) is arranged on two sides of the cooling column, and the cooling equipment (19) is fixedly connected with the mounting plate (3).
3. A temperature compensated heat dissipation system for a semiconductor refrigeration device as set forth in claim 1 wherein: the surface of the sliding rod (15) is provided with a buffer column (21), the upper end face of the buffer column (21) is in contact with the clamping block (12), and the mounting plate (3) is in telescopic connection with the sliding rod (15) through the buffer column (21).
4. A temperature compensated heat dissipation system for a semiconductor refrigeration device as set forth in claim 1 wherein: the two sides of the mounting frame (1) are provided with vent holes (8) and the vent holes (8) are arranged in a strip-shaped structure, and the vent holes (8) are provided with a plurality of groups and are distributed at equal intervals, and the openings of the vent holes (8) are downward.
5. A temperature compensated heat dissipation system for a semiconductor refrigeration device as set forth in claim 1 wherein: the cooling pipes (20) are arranged in a U-shaped structure and distributed in a serpentine shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111388955.5A CN114111098B (en) | 2021-11-22 | 2021-11-22 | Temperature compensation heat dissipation system for semiconductor refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111388955.5A CN114111098B (en) | 2021-11-22 | 2021-11-22 | Temperature compensation heat dissipation system for semiconductor refrigerating device |
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| Publication Number | Publication Date |
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| CN114111098A CN114111098A (en) | 2022-03-01 |
| CN114111098B true CN114111098B (en) | 2023-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111388955.5A Active CN114111098B (en) | 2021-11-22 | 2021-11-22 | Temperature compensation heat dissipation system for semiconductor refrigerating device |
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Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020117291A1 (en) * | 2000-05-25 | 2002-08-29 | Kioan Cheon | Computer having cooling apparatus and heat exchanging device of the cooling apparatus |
| US6861861B2 (en) * | 2002-07-24 | 2005-03-01 | Lg Electronics Inc. | Device for compensating for a test temperature deviation in a semiconductor device handler |
| CN204335279U (en) * | 2015-01-28 | 2015-05-13 | 讯凯国际股份有限公司 | Liquid-cooling type radiator structure |
| CN106383562A (en) * | 2016-11-09 | 2017-02-08 | 娄晓东 | Chilling plate water-cooling radiating device |
| CN210532733U (en) * | 2018-01-09 | 2020-05-15 | 张奇 | Radiator for semiconductor refrigerating device |
| CN208607576U (en) * | 2018-07-06 | 2019-03-15 | 长沙职业技术学院 | It is a kind of double cooling from cooling-down type computer host box |
| CN108735694A (en) * | 2018-07-20 | 2018-11-02 | 苏州华安普新能源科技有限公司 | A kind of intelligence cooling system |
| CN209622465U (en) * | 2018-11-12 | 2019-11-12 | 成都华气厚普机电设备股份有限公司 | A kind of gas cooling device and with refrigerating function plus hydrogen machine |
| CN211650806U (en) * | 2019-12-16 | 2020-10-09 | 杭州澳凌制冷设备有限公司 | Semiconductor refrigerating device |
| CN211831645U (en) * | 2020-04-13 | 2020-10-30 | 天津新科易创科技有限公司 | PLC gateway capable of automatically radiating |
| CN214148522U (en) * | 2021-01-22 | 2021-09-07 | 深圳艾米高制冷科技有限公司 | Cooling device for water chilling machine |
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2021
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