CN211831645U - PLC gateway capable of automatically radiating - Google Patents
PLC gateway capable of automatically radiating Download PDFInfo
- Publication number
- CN211831645U CN211831645U CN202020534438.9U CN202020534438U CN211831645U CN 211831645 U CN211831645 U CN 211831645U CN 202020534438 U CN202020534438 U CN 202020534438U CN 211831645 U CN211831645 U CN 211831645U
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- Prior art keywords
- cooling
- shell
- plc gateway
- water pipeline
- blowing
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000001816 cooling Methods 0.000 claims abstract description 52
- 230000007246 mechanism Effects 0.000 claims abstract description 38
- 238000007664 blowing Methods 0.000 claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- 238000007789 sealing Methods 0.000 claims description 10
- 230000007774 longterm Effects 0.000 abstract description 4
- 238000004804 winding Methods 0.000 abstract 1
- 238000005057 refrigeration Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a PLC gateway capable of automatically radiating, which comprises a shell and a main circuit board arranged inside the shell, wherein a first radiating mechanism and a second radiating mechanism are symmetrically arranged in the shell, and the first radiating mechanism and the second radiating mechanism have the same structure; first heat dissipation mechanism is including blowing subassembly and cooling module, cooling module includes parallel arrangement's roof and bottom plate and is cooling column and the cooling box and the miniature water pump of fixed mounting at the shell inner wall that the annular array arranged between the two, the annular array arranges the outside of cooling column is equipped with the grid post that the annular was arranged, be equipped with first water service pipe between cooling column and the grid post, just first water service pipe spiral winding is on the lateral wall of cooling column. The utility model discloses be provided with automatic heat abstractor in the PLC gateway, when the temperature risees, cool down in the PLC gateway automatically, guarantee PLC gateway long-term work does not cause the damage to electron device in it.
Description
Technical Field
The utility model relates to a technical field of PLC gateway, in particular to can automatic radiating PLC gateway.
Background
The PLC control system is a novel industrial control device of a generation formed by introducing micro-electronic skills, computer skills, automatic control skills and communication skills on the basis of a traditional sequence controller, aims to replace sequence control functions of relays, execution logic, timing, counting and the like, and establishes a flexible long-distance control system, a PLC Gateway is formed by connecting a PLC and a Gateway, and is named as a Wtblnet iot Gateway which is a Tongbo-Pai Siemens PLC protocol Gateway, and is an industrial intelligent Gateway of an embedded network operation system which supports a single net port/two net ports/five net ports, supports a 4G/3G/WIFI/PPPOE/wired network, is embedded with an industrial control protocol, and supports skills of long-distance custom configuration, long-distance arrangement, Gateway state monitoring and the like.
Because of present PLC gateway usage, then need the PLC gateway can long-term operation, reduce the possibility of shutting down, guarantee the smooth and easy nature of work, to electron device, produce the heat easily at long-term operational aspect, if produce a large amount of heats in the PLC gateway and can not in time dispel the heat, cause the damage to electron device in the PLC gateway easily.
SUMMERY OF THE UTILITY MODEL
To the weak point that exists among the prior art, the utility model aims at providing a can be automatic radiating PLC gateway is provided with automatic heat abstractor in, when the temperature rose in the PLC gateway, automatically to cooling down in the PLC gateway, guarantee PLC gateway long-term work does not lead to the fact the damage to electron device in it.
In order to achieve the above objects and other advantages according to the present invention, there is provided a PLC gateway capable of automatically dissipating heat, including a housing and a main circuit board disposed inside the housing, wherein a first heat dissipation mechanism and a second heat dissipation mechanism are symmetrically mounted in the housing, and the first heat dissipation mechanism and the second heat dissipation mechanism have the same structure;
the first heat dissipation mechanism comprises a blowing assembly and a cooling assembly, the cooling assembly comprises a top plate and a bottom plate which are arranged in parallel, cooling columns which are arranged between the top plate and the bottom plate in an annular array mode, a cooling box and a micro water pump which are fixedly installed on the inner wall of the shell, grid columns which are arranged in an annular array mode are arranged on the outer sides of the cooling columns, a first water pipeline is arranged between the cooling columns and the grid columns, the first water pipeline is spirally wound on the outer side wall of the cooling column, and arc-shaped clamping grooves matched with the first water pipeline are formed in the side walls, contacting with the first water pipeline, of the cooling columns and the grid columns and used for fixing the first water pipeline; the blowing assembly comprises a blowing box arranged on the bottom plate, a blowing fan and a controller for controlling the blowing fan to work are arranged in the blowing box, and the blowing fan is used for blowing air to an internal space formed by annularly arranging the cooling columns.
Preferably, one end of the first water pipeline penetrates through the cooling box and is connected with the second water pipeline of the second heat dissipation mechanism through a sealing connection pipe sleeve, and a sealing rubber ring is arranged at the joint of the sealing connection pipe sleeve and the first water pipeline and the joint of the sealing connection pipe sleeve and the second water pipeline.
Preferably, the other end of the first water passage pipe is connected with the other end of the second water passage pipe through a micro water pump.
Preferably, the cooling box is provided with a plurality of air outlets, and the inner wall of one side of the shell is provided with heat dissipation holes.
Preferably, be equipped with the spliced pole that is used for being connected with the shell inner wall on the roof, the spliced pole top is equipped with the external screw thread, seted up on the shell roof with spliced pole assorted spread groove, spliced pole and spread groove threaded connection.
Preferably, a temperature sensor is fixedly connected to the outer wall of the side, close to the main circuit board, of the blowing box, the temperature sensor is used for detecting the temperature in the shell, and the temperature sensor is electrically connected with the controller and used for transmitting a temperature signal to the controller.
Compared with the prior art, the utility model, its beneficial effect is: through being provided with cooling module, can be with the water cooling in the water service pipeline, through setting up the subassembly of blowing to fan through blowing in the subassembly blows off air conditioning, reduces the temperature in the shell from this, and when temperature sensor in the shell detected the temperature and risees in addition, the fan that control is blown begins work, makes the temperature in the shell keep normal room temperature, can realize automatic heat dissipation.
Drawings
Fig. 1 is a schematic structural view illustrating a connection between a first heat dissipation mechanism and a housing in a PLC gateway capable of automatically dissipating heat according to the present invention;
fig. 2 is a schematic cross-sectional structure diagram of a first heat dissipation mechanism in the PLC gateway capable of automatically dissipating heat according to the present invention;
fig. 3 is a schematic structural diagram of the connection between the first heat dissipation mechanism and the second heat dissipation mechanism in the PLC gateway capable of automatically dissipating heat according to the present invention;
fig. 4 is the utility model relates to a but first heat dissipation mechanism is connected with the roof in automatic radiating PLC gateway structural schematic.
In the figure: 1. a housing; 101. a cooling tank; 102. a micro water pump; 103. an air outlet; 104. heat dissipation holes; 2. a circuit board; 3. a first heat dissipation mechanism; 4. a second heat dissipation mechanism; 301. cooling the column; 302. grid columns; 303. a first water passage; 304. a second water through pipe; 305. connecting columns; 306. connecting grooves; 307. a top plate; 308. a base plate; 309. an arc-shaped clamping groove; 401. a blower fan; 402. a blowing box; 5. a temperature sensor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, a PLC gateway capable of automatically dissipating heat includes a housing 1 and a main circuit board 2 disposed inside the housing 1, wherein a first heat dissipation mechanism 3 and a second heat dissipation mechanism 4 are symmetrically mounted in the housing 1, and the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4 have the same structure; the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4 can accelerate the heat dissipation in the housing 1 when working simultaneously,
the first heat dissipation mechanism 3 comprises a blowing assembly and a cooling assembly, the cooling assembly comprises a top plate 307 and a bottom plate 308 which are arranged in parallel, a cooling column 301 which is arranged between the top plate and the bottom plate in an annular array mode, a cooling box 101 and a micro water pump 102 which are fixedly installed on the inner wall of the shell 1, water in a water pipeline is refrigerated through the cooling box 101, a semiconductor refrigeration sheet can be used for refrigerating the water in the water pipeline in the cooling box 101, the semiconductor refrigeration sheet is a solid sheet piece, any refrigerant is not needed, no pollution source and no rotating part exist, no rotation effect is generated, no sliding part exists, no vibration and noise exist during working, the service life is long, and the installation is easy; the control components related to the semiconductor refrigeration chip can be installed inside the cooling box 101, and the semiconductor refrigeration chip is a common technical means for those skilled in the art, and will not be described herein again.
the first water passing pipe 303 and the second water passing pipe 304 are in interference fit with arc-shaped clamping grooves 309 formed in the cooling column 301 and the grid column 302, so that the first water passing pipe 303 and the second water passing pipe 304 can be stably fixed between the cooling column 301 and the grid column 302.
The blowing assembly comprises a blowing box 402 arranged on the bottom plate 308, a blowing fan 401 and a controller for controlling the blowing fan 401 to work are arranged in the blowing box 402, and the blowing fan 401 is used for blowing air to an internal space formed by annularly arranging the cooling columns 301.
The inner space that will arrange the formation through the subassembly of blowing to cooling column 301 annular is bloied, and cold wind sees through grid post 302 and blows out the diffusion to inside the shell 1, and the fan 401 of blowing blows the air after will refrigerating for in cold air blows to shell 1, make the temperature in the shell 1 descend rapidly.
Preferably, one end of the first water pipe 303 penetrates through the cooling box 101 and is connected with the second water pipe 304 of the second heat dissipation mechanism 4 through a sealing connection sleeve, and a sealing rubber ring is arranged at the joint of the sealing connection sleeve and the first water pipe 303 and the second water pipe 304.
Preferably, the other end of the first water passage pipe 303 is connected to the other end of the second water passage pipe 304 through a micro-water pump 102, and the micro-water pump 102 is used for supplying power to the cooling water circulation.
Preferably, the cooling box 101 is provided with a plurality of air outlets 103, and the inner wall of one side of the housing 1 is provided with heat dissipation holes 104.
Preferably, the top plate 307 is provided with a connecting column 305 for connecting with the inner wall of the housing 1, the top end of the connecting column 305 is provided with an external thread, the top wall of the housing 1 is provided with a connecting groove 306 matched with the connecting column 305, the connecting column 305 is in threaded connection with the connecting groove 306, and therefore the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4 can be conveniently installed inside the housing 1.
Preferably, the temperature sensor 5 is fixedly connected to the outer wall of the side, close to the main circuit board 2, of the blowing box 402, the temperature sensor 5 is used for detecting the temperature in the casing 1, the temperature sensor 5 is electrically connected with the controller and used for transmitting a temperature signal to the controller, and when the temperature sensor 5 detects temperature rise, the blowing fan 401 is controlled to start working, so that the temperature in the casing 1 is kept at a normal room temperature, and automatic heat dissipation can be realized.
The working principle is as follows: firstly, the connecting column 305 on the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4 is in threaded connection with the connecting groove 306, so that the first heat dissipation mechanism 3 and the second heat dissipation mechanism 4 are fixed in the shell 1, when the temperature sensor 5 in the shell 1 detects that the temperature in the shell 1 exceeds a set value, the controller controls the blowing fan 401 in the blowing box 402 to start working, the internal space formed by the annular arrangement of the cooling columns 301 is blown, cold air is blown out through the grid columns 302 and diffused into the shell 1, and the temperature in the shell 1 is rapidly reduced. When the temperature sensor 5 detects that the temperature rises, the blowing fan 401 can be automatically controlled to start working, so that the temperature in the shell 1 is kept at a normal room temperature, and automatic heat dissipation can be realized.
The number of apparatuses and the scale of the process described here are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be apparent to those skilled in the art.
While the embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in all kinds of fields of application suitable for this invention, and further modifications may be readily made by those skilled in the art, and the invention is therefore not limited to the specific details and illustrations shown and described herein, without departing from the general concept defined by the claims and their equivalents.
Claims (6)
1. A PLC gateway capable of automatically radiating is characterized by comprising a shell and a main circuit board arranged in the shell, wherein a first radiating mechanism and a second radiating mechanism are symmetrically arranged in the shell, and the first radiating mechanism and the second radiating mechanism have the same structure;
the first heat dissipation mechanism comprises a blowing assembly and a cooling assembly, the cooling assembly comprises a top plate and a bottom plate which are arranged in parallel, cooling columns which are arranged between the top plate and the bottom plate in an annular array mode, a cooling box and a micro water pump which are fixedly installed on the inner wall of the shell, grid columns which are arranged in an annular array mode are arranged on the outer sides of the cooling columns, a first water pipeline is arranged between the cooling columns and the grid columns, the first water pipeline is spirally wound on the outer side wall of the cooling column, and arc-shaped clamping grooves matched with the first water pipeline are formed in the side walls, contacting with the first water pipeline, of the cooling columns and the grid columns and used for fixing the first water pipeline; the blowing assembly comprises a blowing box arranged on the bottom plate, a blowing fan and a controller for controlling the blowing fan to work are arranged in the blowing box, and the blowing fan is used for blowing air to an internal space formed by annularly arranging the cooling columns.
2. The PLC gateway capable of automatically dissipating heat according to claim 1, wherein one end of the first water pipeline penetrates through the cooling box and is connected with the second water pipeline of the second heat dissipating mechanism through a sealing connection pipe sleeve, and a sealing rubber ring is arranged at the joint of the sealing connection pipe sleeve and the first water pipeline and the second water pipeline.
3. The PLC gateway capable of automatically dissipating heat according to claim 2, wherein the other end of the first water passage pipe is connected to the other end of the second water passage pipe by a micro water pump.
4. The PLC gateway capable of automatically dissipating heat according to claim 1, wherein the cooling box is provided with a plurality of air outlets, and the inner wall of one side of the housing is provided with heat dissipating holes.
5. The PLC gateway capable of automatically dissipating heat according to claim 1, wherein the top plate is provided with a connecting column for connecting with the inner wall of the housing, the top end of the connecting column is provided with an external thread, the top wall of the housing is provided with a connecting groove matched with the connecting column, and the connecting column is in threaded connection with the connecting groove.
6. The PLC gateway capable of automatically dissipating heat according to claim 1, wherein a temperature sensor is fixedly connected to an outer wall of the blowing box on a side close to the main circuit board, the temperature sensor is used for detecting the temperature in the housing, and the temperature sensor is electrically connected with the controller and is used for transmitting a temperature signal to the controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020534438.9U CN211831645U (en) | 2020-04-13 | 2020-04-13 | PLC gateway capable of automatically radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020534438.9U CN211831645U (en) | 2020-04-13 | 2020-04-13 | PLC gateway capable of automatically radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211831645U true CN211831645U (en) | 2020-10-30 |
Family
ID=73142602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020534438.9U Expired - Fee Related CN211831645U (en) | 2020-04-13 | 2020-04-13 | PLC gateway capable of automatically radiating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211831645U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114111098A (en) * | 2021-11-22 | 2022-03-01 | 上海凯矜新材料科技有限公司 | Temperature compensation cooling system for semiconductor refrigerating device |
-
2020
- 2020-04-13 CN CN202020534438.9U patent/CN211831645U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114111098A (en) * | 2021-11-22 | 2022-03-01 | 上海凯矜新材料科技有限公司 | Temperature compensation cooling system for semiconductor refrigerating device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201030 |