CN114103088B

CN114103088B - Conductive film attaching method and device

Info

Publication number: CN114103088B
Application number: CN202111435791.7A
Authority: CN
Inventors: 黄奕宏; 方明登; 秦超; 尹国伟; 韩宁宁; 庄庆波; 张新明
Original assignee: Huizhou Shenkeda Intelligent Equipment Co ltd
Current assignee: Huizhou Shenkeda Intelligent Equipment Co ltd
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2022-07-08
Anticipated expiration: 2041-11-26
Also published as: CN114103088A

Abstract

The embodiment of the invention discloses a conducting film attaching method and conducting film attaching equipment, which are applied to the technical field of conducting film attaching and can solve the problem of accurately attaching a conducting film on a liquid crystal display and a metal back plate. The method comprises the following steps: attaching the first edge of the first part of the conductive film to the upper surface of the first edge of the metal back plate to obtain the primarily attached conductive film, wherein the first edge of the first part of the conductive film is an edge far away from the second part; attaching the first part of the initially attached conductive film to the upper surface of the first edge of the metal back plate to obtain a prepressed conductive film; and attaching the third part of the pre-pressed conductive film to the upper surface of the first edge of the display module, and attaching the second part of the pre-pressed conductive film to the side wall of the first edge of the display module to obtain the conductive film group.

Description

Conductive film attaching method and device

Technical Field

The embodiment of the invention relates to the technical field of conductive film attachment, in particular to a conductive film attachment method and conductive film attachment equipment.

Background

Liquid crystal displays are widely used in various electronic products, such as mobile phones, computer monitors, and the like. In order to prevent the housing of the liquid crystal display from static charge and to make the liquid crystal display have a low weight, the housing of the liquid crystal display is generally made of plastic. The liquid crystal display device accumulates stored static charges on its surface during the production and operation, and the plastic housing cannot discharge the accumulated static charges. Therefore, the metal back plate is attached to the back surface of the liquid crystal display, and the liquid crystal display and the metal back plate are electrically connected and conducted through the conductive film, so that static charges can be released in time.

When the metal back plate is attached to the back surface of the liquid crystal display, a step is generally formed between the metal back plate and the liquid crystal display, so that a part of the conductive film is located at the step formed by the liquid crystal display and the metal back plate. Therefore, when the attaching pressure head attaches the conductive film to the liquid crystal display and the metal back plate, if the length of the conductive film reserved at the step is large, the conductive film is prone to form wrinkles at the step or on the metal back plate close to the step or on the liquid crystal display close to the step in the attaching process, and if the length of the conductive film reserved at the step is small, the conductive film part attached to the liquid crystal display and the conductive film part attached to the metal back plate are prone to be pulled mutually in the attaching process, and accordingly the conductive film is prone to be torn and failed to be attached; therefore, how to accurately attach the conductive film to the lcd and the metal back plate is a problem that needs to be solved.

Disclosure of Invention

The embodiment of the invention provides a conductive film attaching method and conductive film attaching equipment, which are used for solving the problem of accurately attaching a conductive film on a liquid crystal display and a metal back plate in the prior art.

In a first aspect, a conductive film attaching method is provided, and is applied to a conductive film attaching apparatus, where the conductive film attaching apparatus is used to attach a conductive film to a display module provided with a metal back plate, a first edge of the metal back plate exceeds a first edge of the display module, the conductive film includes a first portion, a second portion, and a third portion, which are sequentially arranged, and the method includes: attaching the first edge of the first part of the conductive film to the upper surface of the first edge of the metal back plate to obtain the primarily attached conductive film, wherein the first edge of the first part of the conductive film is an edge far away from the second part;

attaching the first part of the primarily attached conductive film to the upper surface of the first edge of the metal back plate to obtain a pre-pressed conductive film;

and attaching the third part of the pre-pressed conductive film to the upper surface of the first edge of the display module, and attaching the second part of the pre-pressed conductive film to the side wall of the first edge of the display module to obtain the conductive film group.

As an optional implementation manner, in the first aspect of the embodiments of the present invention, the attaching the first edge of the first portion of the conductive film to the upper surface of the first edge of the metal back plate to obtain the initially attached conductive film includes:

and adsorbing the conductive film through an adsorption head, and attaching the first edge of the first part of the conductive film to the upper surface of the first edge of the metal back plate to obtain the primarily attached conductive film.

As an optional implementation manner, in the first aspect of the embodiment of the present invention, after the attaching the third portion of the pre-pressed conductive film to the upper surface of the first edge of the display module and attaching the second portion of the pre-pressed conductive film to the sidewall of the first edge of the display module to obtain the conductive film group, the method further includes:

shooting the conductive film group to obtain a first image;

detecting whether the attaching position of the conductive film in the conductive film group is qualified or not according to the first image and a standard image, wherein the standard image is used for indicating the standard attaching position of the conductive film;

when the attaching position of the conductive film in the conductive film group is qualified, moving the conductive film group to a material waiting plate;

and when the attaching position of the conductive film in the conductive film group is unqualified, moving the conductive film group to a waste tray.

extruding and attaching the first edge of the first part of the conductive film and the upper surface of the first edge of the metal back plate through a primary attaching pressure head to obtain the primarily attached conductive film;

laminating the first part of the conductive film after the initial pasting and the upper surface of the first edge of the metal back plate to obtain the conductive film after the pre-pressing, and the method comprises the following steps:

extruding and attaching the first part of the initially attached conductive film and the upper surface of the first edge of the metal back plate through a prepressing pressure head to obtain the prepressed conductive film;

will the third part of the conductive film after the pre-compaction with the upper surface at the first border of display module assembly is laminated, and will the second part of the conductive film after the pre-compaction with the lateral wall at the first border of display module assembly is laminated, obtains the conductive film group, includes:

and extruding and laminating the third part of the pre-pressed conductive film and the upper surface of the first edge of the display module through a pressure maintaining pressure head, and extruding and laminating the second part of the pre-pressed conductive film and the side wall of the first edge of the display module to obtain the conductive film group.

As an optional implementation manner, in the first aspect of the embodiment of the present invention, the method further includes:

detecting a deformation amount of a target indenter, the target indenter including: any one of the primary sticking pressure head, the pre-pressing pressure head and the pressure maintaining pressure head;

and when the deformation is larger than a preset value, outputting prompt information, wherein the prompt information is used for prompting the target pressure head to be replaced.

detecting the bonding pressure of a target pressure head in real time;

and when the laminating pressure reaches a preset pressure value, controlling the target pressure head to stop extruding and laminating.

As an optional implementation manner, in the first aspect of the embodiment of the present invention, the controlling, when the bonding pressure reaches a preset pressure value, the target pressure head to stop the extrusion bonding by using a cylinder is performed by:

when the laminating pressure reaches the preset pressure value, the target pressure head is controlled to stop extruding and laminating by adjusting the air inflow and the air outflow of the air cylinder.

shooting the display module to obtain a second image;

determining the position of the display module according to the second image;

and attaching the first edge of the first part of the conductive film to the upper surface of the first edge of the metal back plate under the condition that the display module is detected to be positioned at the preset position, so as to obtain the initially attached conductive film.

As an optional implementation manner, in the first aspect of the embodiment of the present invention, after determining the position of the display module according to the second image, the method further includes:

determining the angle to be adjusted and the displacement to be adjusted of the display module under the condition that the display module is not located at the preset position;

and adjusting the display module to the preset position according to the angle to be adjusted and the displacement to be adjusted.

In a second aspect, a conductive film attaching apparatus is provided, the conductive film attaching apparatus is used for attaching a conductive film to a display module provided with a metal back plate, a first edge of the metal back plate exceeds a first edge of the display module, the conductive film includes a first portion, a second portion and a third portion which are sequentially arranged, and the conductive film attaching apparatus includes:

the initial attaching device is used for attaching the first edge of the first part of the conductive film to the upper surface of the first edge of the metal back plate to obtain the initially attached conductive film, and the first edge of the first part of the conductive film is an edge far away from the second part;

the prepressing device is used for attaching the first part of the initially attached conductive film to the upper surface of the first edge of the metal back plate to obtain a prepressed conductive film;

and the pressure maintaining device is used for attaching the third part of the pre-pressed conductive film to the upper surface of the first edge of the display module, and attaching the second part of the pre-pressed conductive film to the side wall of the first edge of the display module to obtain the conductive film group.

Compared with the prior art, the embodiment of the invention has the following beneficial effects:

in the embodiment of the invention, the edge of the first part of the conductive film, which is far away from the second part, is attached to the upper surface of the first edge of the metal back plate by the conductive film attaching equipment, so that the edge of the conductive film is attached to the metal back plate firstly, and then the first part of the conductive film is integrally attached to the metal back plate, so that the attachment length of the conductive film and the metal back plate can reach the preset attachment length, the conductive film and the metal back plate can be fully connected and conducted, the attachment precision is higher, and the attachment quality of the conductive film and the metal back plate is improved. And finally, the third part of the conductive film is attached to the upper surface of the first edge of the display module, and the second part of the conductive film is attached to the side wall of the first edge of the display module, so that the conductive film can electrically conduct the metal back plate and the upper surface of the first edge of the display module, and the static electricity on the upper surface of the first edge of the display module is released through the metal back plate in time. The conductive film is firstly attached to the metal back plate, and the second part and the third part of the conductive film are in a suspended state, so that the first part of the conductive film can be prevented from being torn due to pulling when being attached to the metal back plate, and the first part can be prevented from being wrinkled when being attached due to the fact that the length of the second part exceeds the preset length; then the conducting film is laminated with the upper surface of the first border of the display module group again, and the laminating has been accomplished to the first part of conducting film this moment, from this, not only can prevent that the third part of conducting film from receiving the pulling and tearing when laminating with the display module group, still can prevent to make the fold appear when laminating because of the length of second part surpasss preset length, has further improved the laminating quality of conducting film and display module group.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a first schematic view of a conductive film attaching method according to an embodiment of the present invention;

fig. 2 is a schematic flow chart of a conductive film attaching method according to an embodiment of the present invention;

fig. 3 is a second schematic view of a conductive film attaching method according to an embodiment of the present invention;

fig. 4 is a third schematic view of a scenario of a conductive film attaching method according to an embodiment of the present invention;

fig. 5 is a first schematic structural diagram of a conductive film attaching apparatus according to an embodiment of the present invention;

fig. 6 is a fourth schematic view of a conductive film attaching method according to an embodiment of the present invention;

fig. 7 is a second schematic structural diagram of a conductive film attaching apparatus according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a conductive film attaching apparatus according to a third embodiment of the present invention;

fig. 9 is a fourth schematic structural diagram of a conductive film attaching apparatus according to an embodiment of the present invention;

fig. 10 is a scene schematic diagram of a conductive film attaching method according to an embodiment of the present invention;

fig. 11 is a schematic structural diagram of a conductive film attaching apparatus according to an embodiment of the present invention;

fig. 12 is a sixth schematic structural view of a conductive film attaching apparatus according to an embodiment of the present invention;

fig. 13 is a seventh schematic structural diagram of a conductive film attaching apparatus according to an embodiment of the present invention;

fig. 14 is a schematic structural diagram eight of a conductive film attaching apparatus according to an embodiment of the present invention;

fig. 15 is a schematic structural diagram nine of a conductive film attaching apparatus according to an embodiment of the present invention;

fig. 16 is a schematic structural diagram ten of a conductive film attaching apparatus according to an embodiment of the present invention;

fig. 17 is an eleventh schematic structural diagram of a conductive film attaching apparatus according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terms "first" and "second," and the like, in the description and in the claims of the present invention are used for distinguishing between different objects and not for describing a particular order of the objects. For example, the first image and the second image, etc. are for distinguishing different images, not for describing a specific order of the images.

The terms "comprises," "comprising," and any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

It should be noted that, in the embodiments of the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "such as" in an embodiment of the present invention is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present relevant concepts in a concrete fashion.

In the related art, liquid crystal displays are widely used in various electronic products, such as mobile phones, computer monitors, and the like. In order to prevent the housing of the liquid crystal display from static charge and to make the liquid crystal display have a low weight, the housing of the liquid crystal display is generally made of plastic. The liquid crystal display device accumulates stored static charges on its surface during the production and operation, and the plastic housing cannot discharge the accumulated static charges. Therefore, the metal back plate is attached to the back surface of the liquid crystal display, and the liquid crystal display and the metal back plate are electrically connected and conducted through the conductive film, so that static charges can be released in time.

The conductive film is a metal foil or conductive cloth with a high-conductivity back adhesive, the conductive back adhesive and a conductive base material form a complete conductor, and the complete conductor can be bonded with any metal surface to form electric lap joint and electric sealing of gaps.

When attaching the metal back plate to the back surface of the liquid crystal display, as shown in fig. 1, the first edge of the metal back plate 12 is usually beyond the first edge of the liquid crystal display 11, that is, the upper surface 121 of the first edge of the metal back plate and the upper surface 111 of the first edge of the liquid crystal display form a step, and then the attaching press head attaches the conductive film 13 to the upper surface 111 of the first edge of the liquid crystal display and the upper surface 121 of the first edge of the metal back plate to electrically connect and conduct the liquid crystal display 11 and the metal back plate 12.

In the process of attaching the conductive film 13, the attaching press head attaches the conductive film 13 to the upper surface 111 of the first edge of the liquid crystal display and the upper surface 121 of the first edge of the metal back plate at the same time. However, because there is a height difference between the metal back plate 12 and the liquid crystal display 11, a part of the conductive film 13 may be located at the step formed by the liquid crystal display 11 and the metal back plate 12, and then the part of the conductive film 13 located at the step formed by the liquid crystal display 11 and the metal back plate 12 may be attached to the sidewall 112 of the first edge of the display module; thus, when the length of the conductive film 13 at the step is reserved to be large, the conductive film 13 is easily caused to form wrinkles at the step or on the metal back plate 12 close to the step or on the liquid crystal display 11 close to the step in the attaching process; when the length of the conductive film 13 reserved at the step is small, the portion of the conductive film 13 attached to the liquid crystal display 11 and the portion of the conductive film 13 attached to the metal back plate 12 are easily pulled by each other during the attachment of the conductive film 13, thereby causing the tearing attachment failure of the conductive film 13. Therefore, the above attaching method can make the attaching power of the conductive film 13 and the liquid crystal display 11 low.

In order to solve the above problems, embodiments of the present invention provide a conductive film attaching method and apparatus, in which an edge of a first portion of a conductive film, which is far from a second portion, is attached to an upper surface of a first edge of a metal back plate, so that the edge of the conductive film is attached to the metal back plate first, and then the first portion of the conductive film is integrally attached to the metal back plate, thereby ensuring that the attachment length of the conductive film and the metal back plate reaches a preset attachment length, so as to ensure that the conductive film and the metal back plate can be fully connected and conducted, and the conductive film attaching method and apparatus have high attachment accuracy, and improve the attachment quality of the conductive film and the metal back plate. And finally, the third part of the conductive film is attached to the upper surface of the first edge of the display module, and the second part of the conductive film is attached to the side wall of the first edge of the display module, so that the conductive film can electrically conduct the metal back plate and the upper surface of the first edge of the display module, and the static electricity on the upper surface of the first edge of the display module is released through the metal back plate in time. The conductive film is firstly attached to the metal back plate, and the second part and the third part of the conductive film are in a suspended state, so that the first part of the conductive film can be prevented from being torn due to pulling when being attached to the metal back plate, and the first part can be prevented from being wrinkled when being attached due to the fact that the length of the second part exceeds the preset length; then the conducting film is laminated with the upper surface of the first border of the display module group again, and the laminating has been accomplished to the first part of conducting film this moment, from this, not only can prevent that the third part of conducting film from receiving the pulling and tearing when laminating with the display module group, still can prevent to make the fold appear when laminating because of the length of second part surpasss preset length, has further improved the laminating quality of conducting film and display module group.

As shown in fig. 2, an embodiment of the present invention provides a conductive film attaching method, which may include the following steps:

step 201, attaching the first edge of the first portion of the conductive film to the upper surface of the first edge of the metal back plate to obtain the initially attached conductive film.

In an embodiment of the present invention, the conductive film may include a first portion, a second portion, and a third portion that are sequentially arranged, and the conductive film attaching apparatus may sequentially attach the three portions of the conductive film in sequence.

In the embodiment of the present invention, as shown in fig. 3 and 4, the conductive film attaching apparatus is used for attaching the conductive film 13 to the display module 11 provided with the metal back plate 12, the first edge of the metal back plate 12 exceeds the first edge of the display module 11, and the conductive film 13 includes a first portion 131, a second portion 132 and a third portion 133 which are sequentially arranged. As shown in fig. 5, the conductive film attaching apparatus may include a preliminary attaching device 51, where the preliminary attaching device 51 is configured to attach a first edge of the first portion of the conductive film to an upper surface of the first edge of the metal back plate, so as to obtain a preliminarily attached conductive film, and as shown in fig. 6, a first edge 1311 of the first portion 131 of the conductive film 13 is an edge far from the second portion 132 of the conductive film 13; that is, the initial attaching device is used to attach only one edge of the conductive film 13 to the metal back plate 12, so that the following steps can be performed to fix the conductive film 13 and the metal back plate 12 together after the attachment.

Optionally, as shown in fig. 7, the preliminary attaching device 51 includes a preliminary attaching station 511, a conductive film preliminary attaching device 512, and a preliminary attaching jig 513, where the preliminary attaching jig 513 is used to fix the display module and carry the display module to move to the preliminary attaching station 511, the preliminary attaching station 511 is used to place the display module to which the conductive film is to be attached and the preliminary attaching jig 513 carrying the display module, and the preliminary attaching station 511 may be disposed at a position close to the feeding area of the conductive film.

Optionally, as shown in fig. 5 and 7, a display module conveying device 54 is further disposed in the conductive film attaching apparatus, and the display module conveying device 54 can convey the display module to which the conductive film is to be attached to the preliminary attaching jig 513 from the feeding area.

The display module conveying device can be a horizontal guide rail or a gantry rail, a linear motor can be arranged on the horizontal guide rail or the gantry guide rail, a carrying mechanical arm or a jig is arranged on the linear motor, a vacuum chuck can be arranged on the carrying mechanical arm, and the vacuum chuck can adsorb the display module so as to carry the display module; can set up the absorption hole on the tool, the absorption hole intercommunication has evacuating device, can be fixed the display module assembly through with the absorption hole evacuation, and linear motor drive tool removes and conveys in order to drive the display module assembly.

Further, the fixing manner of the primary attaching jig to the display module at least can include but is not limited to the following implementation manners:

the implementation mode is as follows: the surface of the first sticking jig can be provided with an adsorption hole, the side of the first sticking jig can be provided with an air exhaust hole, the air exhaust hole is communicated with the adsorption hole, and the air exhaust hole is connected with a vacuumizing device, so that air in the adsorption hole can be exhausted by the vacuumizing device, the display module can be fixedly adsorbed by the adsorption hole, the vacuum adsorption fixing mode is realized without additionally arranging a fixing piece, and the occupied space of the first sticking jig is reduced.

The implementation mode two is as follows: just paste and be provided with stopper and fender position piece on the tool, stopper and fender position piece set up relatively, and the display module assembly can be located stopper and keep off between the position piece, and seted up waist type hole on the stopper, just paste the threaded hole on the tool, and the bolt fastening that the stopper accessible passed waist type hole and threaded hole in proper order is just pasting on the tool. Specifically, unscrew the bolt and can slide the regulation to the stopper to adjust the stopper and keep off the distance between the position piece, so that place display module assembly between stopper and fender position piece, screw up the bolt and can fix the stopper and paste the tool just, thereby fix display module assembly and paste the tool just, simple structure easily realizes.

Through the two optional implementation modes, the display module can be fixed on the primary sticking jig, so that the display module is prevented from moving on the primary sticking jig, and the condition that the display module fails to be stuck with the conductive film due to the fact that the display module moves on the primary sticking jig is avoided.

Alternatively, as shown in fig. 7 and 8, the conductive film primary bonding device 512 may include a primary bonding driving device 5121, a primary bonding pressure head 5122, and a primary bonding adsorption head 5123, where the primary bonding driving device 5121 is configured to drive the primary bonding pressure head 5122 and the primary bonding adsorption head 5123 to move, so that the primary bonding adsorption head 5123 adsorbs the conductive film, and the primary bonding pressure head 5122 presses and bonds the first edge of the first portion of the conductive film and the upper surface of the first edge of the metal back plate.

Wherein, paste drive arrangement just can be used for controlling just pasting the removal of adsorption head and the pressure head of pasting just. Before removing, can shoot just pasting the position of adsorption head, just pasting pressure head and conducting film through industry camera, when just pasting the position mismatch of adsorption head, just pasting pressure head and conducting film, just pasting drive arrangement just can control just pasting the adsorption head and just pasting the pressure head and remove just to remove to adsorbing with the position that the conducting film matches.

Further, as shown in fig. 8, the primary pasting driving device may include a four-axis robot 51211, a first cylinder 51212 is connected to a distal end of a mechanical arm of the four-axis robot 51211, a telescopic arm of the first cylinder 51212 is connected to a distal end of the mechanical arm, and XY alignment platforms 51215 are disposed on two sides of the first cylinder 51212 parallel to the YZ plane. Therefore, the XY alignment platform 51215 enables the four-axis robot 51211 to drive the preliminary adsorption head 5123 and the preliminary pressure head 5122 to move in the X-axis and Y-axis directions, so that the preliminary adsorption head 5123 and the preliminary pressure head 5122 can move along the X-axis and Y-axis directions in a large and accurate manner. One surface of the XY alignment platform 51215, which is far away from the first cylinder 51212, is connected with the second cylinder 51213, and the telescopic arm of the second cylinder 51213 is connected with the primary attachment adsorption head 5123. Therefore, the primary attaching adsorption head 5123 can move slightly and accurately along the Y axis by extending or shortening the telescopic arm of the second air cylinder 51213, so that the primary attaching adsorption head 5123 can accurately adsorb the conductive film from the feeding area, and the conductive film can be moved to the primary attaching station. The side face of the first cylinder 51212 parallel to the XY plane is connected with an installation plate, the installation plate is provided with a third cylinder 51214, and a telescopic arm of the third cylinder 51214 is connected with the primary attaching pressure head 5122, so that the primary attaching pressure head 5122 can be driven to slightly and accurately move along the Y-axis direction through extension or shortening of the telescopic arm of the third cylinder 51214, and the first edge of the first part of the conductive film can be accurately attached to the upper surface of the first edge of the metal back plate by the primary attaching pressure head 5122.

Optionally, during the process of moving the conductive film, the positions of the conductive film and the display module need to be shot by an industrial camera to obtain a second image; according to the second image, the position of the display module can be determined in real time, and if the display module is located at the preset position, the conductive film primary adhering device can directly adhere the first edge of the first part of the conductive film to the upper surface of the first edge of the metal back plate; if the display module is not located at the preset position, the initial pasting jig driving device can determine the angle to be adjusted and the displacement to be adjusted according to the second image, and then drives the display module to move to the preset position according to the angle to be adjusted and the displacement to be adjusted.

Further, paste tool drive arrangement just and paste drive arrangement structure similar just, paste tool drive arrangement just and can be provided with XXY counterpoint platform, this XXY counterpoint platform can carry out the rotation in X direction, the small removal of Y direction and the XY plane to pasting the tool just.

Further, the preliminary sticking jig is moved and rotated in the process of driving the preliminary sticking jig through the preliminary sticking jig, after the angle to be adjusted and the displacement to be adjusted are determined, the number of revolutions of a motor in the XXY alignment platform can be determined to control the movement and the rotation of the preliminary sticking jig.

It should be noted that, if the first attaching jig needs to rotate in an angle and move in a straight direction, the first attaching jig driving device needs to adjust the rotation of the first attaching jig in the XY plane, and then slightly move the first attaching jig in the X direction and/or the Y direction, so that the first attaching jig driving device is prevented from being jammed.

Optionally, as shown in fig. 9, a preliminary bonding rubber pad 51221 may be disposed on the preliminary bonding pressure head 5122, and the preliminary bonding rubber pad 51221 may extrude the conductive film to bond the conductive film, so that the preliminary bonding pressure head 5122 is in soft contact with the conductive film, and the preliminary bonding pressure head 5122 may gradually deform when extruding and pressing the conductive film, thereby avoiding extrusion damage of the preliminary bonding pressure head 5122 to the conductive film. The primary pressure head 5122 and the primary rubber pad 51221 may be connected by adhesion or may be integrally formed. First head 5122 is pasted including just pasting 51222, just pasting 51222 is located just pasting the cushion 51221, and just pasting 51222 is the plane, just be provided with just pasting adsorption hole 51223 on pasting 51222, just pasting adsorption hole 51223 and being connected with evacuating device just, so that just pasting adsorption hole 51223 can the evacuation adsorb the conductive film, simple structure easily realizes, and can make just pasting the one end that adsorption head 5123 adsorbs the conductive film from this, just paste the other end that head 5122 adsorbs the conductive film, make the conductive film can be in the tiling state all the time at the removal in-process, so that laminate conductive film and metal backplate mutually.

Optionally, the preliminary bonding device may include one preliminary bonding jig, or may include at least two preliminary bonding jigs, and each preliminary bonding jig may be fixed with one display module; the same reason corresponds, and paste the device just can include that one pastes adsorption head just and a pressure head just, also can include that at least two paste adsorption head just and two at least pressure heads just. Therefore, the initial pasting device can initially paste one conductive film and one display module, and also can initially paste at least two conductive films and at least two display modules simultaneously, so that the pasting efficiency of the conductive films and the display modules can be improved.

Optionally, as shown in fig. 7, the primary attaching device 51 further includes a first alignment detection device 514, a first control unit, and a first monitoring device 515. The first alignment detection device 514 is used for determining position information of the conductive film and position information of the display module, and providing data support for the attachment of the conductive film and the display module, and the first control unit can control the motion track of the primary attachment driving device 5121 according to the position information of the conductive film and the position information of the display module, and adjust the position of the conductive film in time. The first control unit can also control the XXY alignment platform to adjust the position of the preliminary bonding fixture 513, so as to adjust the position of the display module. Therefore, the first edge of the first part of the conductive film can be attached to the upper surface of the first edge of the metal back plate. First monitoring device 515 is used for making a video recording the laminating state of the pressfitting state of pasting pressure head and conducting film just and the first border of the first part of conducting film and the laminating state of the upper surface at the first border of metal backplate, for the staff provides the image reference, so that in time adjust the motion parameter of pasting drive arrangement 5121 just, in order to prevent just pasting the pressure head and interfering with display module's first border, can also in time monitor the deformation volume of pasting the pressure head just simultaneously, so that the staff can in time change the pressure head that just pastes that the deformation volume surpasss the scope of predetermineeing. Therefore, the use of the first alignment detection device 514, the first control unit and the first monitoring device 515 improves the automation degree of the conductive film attaching apparatus, and saves manpower.

Step 202, attaching the first part of the initially attached conductive film to the upper surface of the first edge of the metal back plate to obtain the pre-pressed conductive film.

In the embodiment of the present invention, as shown in fig. 5, the conductive film attaching apparatus may further include a pre-pressing device 52, the pre-pressing device 52 is located downstream of the initial attaching device 51, the pre-pressing device 52 is configured to attach the first portion of the initially attached conductive film to the upper surface of the first edge of the metal back plate, so as to obtain the pre-pressed conductive film, as shown in fig. 10, the whole first portion 131 of the conductive film 13 is already attached to the metal back plate 12, and at this time, the second portion and the third portion of the conductive film 13 are in an unadhered state.

The pre-pressing device is used for bonding the whole first part of the conductive film to the metal back plate.

As shown in fig. 5, the fact that the prepressing device 52 is located downstream of the initial attaching device 51 means that the initial attaching device 51 is controlled first and then the prepressing device 52 is controlled in the conductive film attaching method for attaching the conductive film to the display module, and does not mean that the prepressing device 52 is located below or behind the initial attaching device 51 in the conductive film attaching apparatus.

Optionally, as shown in fig. 5 and 11, a display module conveying device 54 is further disposed in the conductive film attaching apparatus, and the display module conveying device 54 can convey the initially attached conductive film from the initial attaching device 51 to the pre-pressing device 52.

Optionally, as shown in fig. 11, the pre-pressing device 52 includes a pre-pressing station 521, a conductive film pre-pressing device 522 and a pre-pressing jig 523, where the pre-pressing jig 523 is used to fix the display module and carry the display module to move to the pre-pressing station 521, and the pre-pressing station 521 is used to place the display module to which the conductive film is primarily attached and the pre-pressing jig 523 for carrying the display module.

Further, the fixing manner of the pre-pressing jig to the display module at least can include but is not limited to the following implementation manners:

the implementation mode is as follows: the surface of pre-compaction tool can be provided with the absorption hole, and the side of pre-compaction tool can be provided with the aspirating hole, aspirating hole and absorption hole intercommunication, and the aspirating hole is connected with evacuating device, and accessible evacuating device takes out the downthehole gas of absorption from this to make the absorption hole can adsorb display module assembly fixedly, this vacuum adsorption fixed mode need not additionally to set up the mounting, has reduced the occupation space of pre-compaction tool.

The implementation mode two is as follows: be provided with stopper and fender position piece on the pre-compaction tool, stopper and fender position piece set up relatively, and the display module assembly can be located between stopper and the fender position piece, and has seted up waist type hole on the stopper, set up threaded hole on the pre-compaction tool, and the bolt fastening that the stopper accessible passed waist type hole and threaded hole in proper order is on the pre-compaction tool. Specifically, unscrew the bolt and can slide the regulation to the stopper to adjust the stopper and keep off the distance between the position piece, so that place display module assembly between stopper and fender position piece, screw up the bolt and can fix the stopper on pre-compaction tool, thereby fix display module assembly on pre-compaction tool, simple structure easily realizes.

Through two optional implementation methods, all can fix the display module assembly on the pre-compaction tool to prevent that the display module assembly from removing on the pre-compaction tool, avoided because of the display module assembly removes the condition that leads to display module assembly and conductive film pre-compaction to fail on the pre-compaction tool.

Alternatively, as shown in fig. 12, the conductive film pre-pressing device 522 may include a pre-pressing driving device 5221 and a pre-pressing ram 5222, where the pre-pressing driving device 5221 is configured to drive the pre-pressing ram 5222 to move, so that the pre-pressing ram 5222 presses and attaches the entire first portion of the conductive film to the upper surface of the first edge of the metal back plate.

Wherein the pre-pressing driving device can be used for controlling the movement of the pre-pressing pressure head. Before removing, can shoot the position of pre-compaction pressure head and conducting film through industry camera, when the position of pre-compaction pressure head and conducting film is not matchd, pre-compaction drive arrangement just can control the pre-compaction pressure head and remove to carrying out the extrusion laminating with the position that the conducting film matches.

Optionally, during the process of moving the conductive film, the positions of the conductive film and the display module need to be shot by an industrial camera to obtain a third image; according to the third image, the position of the display module can be determined in real time, and if the display module is located at the preset position, the conductive film prepressing device can be used for directly attaching the whole first part of the conductive film to the upper surface of the first edge of the metal back plate; if the display module is not located at the preset position, the pre-pressing jig driving device can determine to-be-adjusted angles and to-be-adjusted displacements according to the third image, and then drives the display module to move to the preset position according to the to-be-adjusted angles and to-be-adjusted displacements.

Wherein, pre-compaction tool adjusting device is used for adjusting the position of display module assembly, pre-compaction tool adjusting device's output and pre-compaction tool fixed connection, make pre-compaction tool adjusting device can adjust the position of pre-compaction tool, so that fix the position of the display module assembly on the pre-compaction tool and can obtain the adjustment, thereby can compensate because of the position error who removes display module assembly to the pre-compaction station production from pasting the station just, so that the pre-compaction pressure head can be comparatively accurate with the whole and metal backplate of the first part of conductive film extrude the laminating.

Further, pre-compaction tool adjusting device includes XXY and counterpoints the platform, and XXY counterpoints the surface of platform and is connected with pre-compaction tool bottom plate, and the one side and the pre-compaction tool fixed connection that XXY counterpoints the platform are kept away from to the pre-compaction tool bottom plate to counterpoint platform fixed connection with XXY, simple structure easily realizes. Threaded holes are formed in the periphery of the bottom plate of the pre-pressing jig, through holes are correspondingly formed in the pre-pressing jig, and the bolts sequentially penetrate through the through holes and the threaded holes to fix the pre-pressing jig on the bottom plate of the pre-pressing jig, so that the pre-pressing jig is easy to install and detach.

It should be noted that, in the process of moving and rotating the pre-pressing jig by the pre-pressing jig driving device, after determining the angle to be adjusted and the displacement to be adjusted, it may be determined that the rotation number of the motor in the XXY alignment platform has controlled the movement and rotation of the pre-pressing jig.

It should be noted that, if the pre-pressing jig needs to rotate at an angle and move in a straight direction, the driving device of the pre-pressing jig needs to adjust the rotation of the pre-pressing jig in the XY plane, and then the pre-pressing jig needs to move in the X direction and/or the Y direction, so that the pre-pressing jig driving device is prevented from being jammed.

Further, as shown in fig. 13, the pre-pressing ram 5222 includes a pre-pressing ram base 52221 and a pre-pressing ram body 52222, the pre-pressing ram base 52221 and the ram mounting plate are fixedly connected, a countersunk through hole is formed in the ram mounting plate, a threaded hole is formed in the pre-pressing ram base 52221, the pre-pressing ram base 52221 is fixedly connected with the ram mounting plate through a bolt sequentially penetrating through the countersunk through hole and the threaded hole, and the pre-pressing ram 5222 can be conveniently disassembled and assembled. One surface of the pre-pressing ram base 52221, which is far away from the ram mounting plate, is fixedly connected with the pre-pressing ram body 52222, and the pre-pressing ram base 52221 and the pre-pressing ram body 52222 may be integrally formed or may be fixedly connected by bonding. The pre-pressing ram body 52222 includes a pre-pressing rubber pad 52224 and a pre-pressing surface 52223, the pre-pressing surface 52223 is a plane and can make the pre-pressing ram 5222 fully contact and press the first portion of the conductive film, and the pre-pressing ram body 52222 and the pre-pressing rubber pad 52224 can be adhesively connected or integrally formed, the pre-pressing surface 52223 is located on the pre-pressing rubber pad 52224, so that the pre-pressing ram 5222 can deform during the bonding process between the pre-pressing surface 52223 and the first portion of the conductive film, and the extrusion force of the pre-pressing ram 5222 formed when the first portion of the conductive film is integrally bonded with the metal back plate is buffered.

Optionally, the pre-pressing device may include one pre-pressing jig, or may include at least two pre-pressing jigs, and each pre-pressing jig may be fixed with one display module; correspondingly, the prepressing device can comprise one prepressing pressure head, and can also comprise at least two prepressing pressure heads. Therefore, the pre-compaction device can carry out the pre-compaction to a conducting film and a display module assembly, also can carry out the pre-compaction simultaneously to two at least conducting films and two at least display module assemblies to can improve the laminating efficiency of conducting film and display module assembly.

Optionally, as shown in fig. 11, the pre-pressing device 52 further includes a second alignment detection device 524, a second control unit, and a second monitoring device 525. The second alignment detection device 524 is configured to determine position information of the conductive film and position information of the display module, and provide data support for the attachment of the conductive film and the display module, and the second control unit can control a movement trajectory of the pre-pressing driving device according to the position information of the conductive film and the position information of the display module, and adjust the position of the conductive film in time. The second control unit can also control the XXY alignment stage to adjust the position of the pre-pressing jig 523, so as to adjust the position of the display module. Therefore, the first edge of the first part of the conductive film can be attached to the upper surface of the first edge of the metal back plate. The second monitoring device 525 is used for monitoring the pressing state of the pre-pressing pressure head and the conductive film, the attaching state of the first edge of the first part of the conductive film and the upper surface of the first edge of the metal back plate through camera shooting, provides image reference for workers, and timely adjusts the motion parameters of the pre-pressing driving device, so that the pre-pressing pressure head is prevented from interfering with the first edge of the display module, and meanwhile, the deformation quantity of the pre-pressing pressure head can be timely monitored, so that the workers can timely replace the pre-pressing pressure head with the deformation quantity exceeding the preset range. Therefore, the second alignment detection device 524, the second control unit and the second monitoring device 525 are used to improve the automation degree of the conductive film attaching apparatus and save manpower.

And 203, attaching the third part of the pre-pressed conductive film to the upper surface of the first edge of the display module, and attaching the second part of the pre-pressed conductive film to the side wall of the first edge of the display module to obtain a conductive film group.

In the embodiment of the present invention, as shown in fig. 5, the conductive film attaching apparatus may further include a pressure maintaining device 53, the pressure maintaining device 53 is located downstream of the pre-pressing device 52, and the pressure maintaining device 53 is configured to attach the third portion of the conductive film to the upper surface of the first edge of the display module, and attach the second portion of the conductive film to the sidewall of the first edge of the display module.

The first part of the conductive film is adhered to the metal back plate by the initial adhering device, the whole first part of the conductive film is adhered to the metal back plate by the pre-pressing device, the whole second part of the conductive film is adhered to the side wall of the first edge of the display module by the pressure maintaining device, and the whole third part of the conductive film is adhered to the upper surface of the first edge of the display module.

As shown in fig. 5, the fact that the pressurizer 53 is located downstream of the prepressing device 52 means that the prepressing device 52 is controlled first and then the pressurizer 53 is controlled in the conductive film bonding method for bonding the conductive film and the display module, and does not mean that the pressurizer 53 is located below or behind the prepressing device 52 in the conductive film bonding apparatus.

Optionally, as shown in fig. 5, a display module conveying device 54 is further disposed in the conductive film attaching apparatus, and the display module conveying device 54 can convey the pre-pressed conductive film from the pre-pressing device 52 to the pressure maintaining device 53.

Optionally, as shown in fig. 14, the pressure maintaining device 53 includes a pressure maintaining station 531, a conductive film pressure maintaining device 532, and a pressure maintaining jig 533, where the pressure maintaining jig 533 is used to fix the display module and carry the display module to move to the pressure maintaining station 531, and the pressure maintaining station 531 is used to place the display module pre-pressed with the conductive film and the pressure maintaining jig 533 used to support the display module.

Optionally, pressurize tool and pre-compaction tool can be same tool, and the display module assembly of accomplishing the pre-compaction like this can directly move to the pressurize station through the pre-compaction tool on to the removal route of display module assembly has been simplified, has improved the attached efficiency of conducting film with the display module assembly.

Further, the fixing manner of the pressure maintaining jig to the display module at least can include but is not limited to the following implementation manners:

the implementation mode is as follows: the surface of pressurize tool can be provided with the absorption hole, and the side of pressurize tool can be provided with the aspirating hole, aspirating hole and absorption hole intercommunication, and the aspirating hole is connected with evacuating device, and accessible evacuating device takes the downthehole gas of absorption out from this to make the absorption hole can adsorb display module assembly fixedly, this vacuum adsorption fixed mode need not additionally to set up the mounting, has reduced the occupation space of pressurize tool.

The implementation mode two is as follows: be provided with stopper and fender position piece on the pressurize tool, stopper and fender position piece set up relatively, and the display module assembly can be located between stopper and the fender position piece, and has seted up waist type hole on the stopper, set up threaded hole on the pre-compaction tool, and the bolt fastening that the stopper accessible passed waist type hole and screw hole in proper order is on the pressurize tool. Specifically, unscrew the bolt and can slide the regulation to the stopper to adjust the stopper and keep off the distance between the position piece, so that place display module assembly between stopper and fender position piece, screw up the bolt and can fix the stopper on the pressurize tool, thereby fix display module assembly on the pressurize tool, simple structure easily realizes.

Through the two optional implementation modes, the display module can be fixed on the pressure maintaining jig, so that the display module is prevented from moving on the pressure maintaining jig, and the condition that the pressure maintaining of the display module and the conductive film fails due to the fact that the display module moves on the pressure maintaining jig is avoided.

Optionally, as shown in fig. 15, the conductive film pressure maintaining device 532 may include a pressure maintaining driving device 5321 and a pressure maintaining ram 5322, where the pressure maintaining driving device 5321 is configured to drive the pressure maintaining ram 5322 to move, so that the pressure maintaining ram 5322 attaches the third portion of the pre-pressed conductive film to the upper surface of the first edge of the display module, and attaches the second portion of the pre-pressed conductive film to the sidewall of the first edge of the display module, so as to obtain the conductive film group.

Wherein, pressurize drive arrangement can be used for controlling the removal of pressurize pressure head. Before removing, can shoot the position of pressurize pressure head and conducting film through industry camera, when the position of pressurize pressure head and conducting film is not matchd, pressurize drive arrangement just can control the pressurize pressure head and remove to carrying out the extrusion laminating with the position that the conducting film matches.

Optionally, during the process of moving the conductive film, the positions of the conductive film and the display module need to be shot by an industrial camera to obtain a fourth image; according to the fourth image, the position of the display module can be determined in real time, if the display module is located at the preset position, the conductive film pressure maintaining device can directly attach the third part of the pre-pressed conductive film to the upper surface of the first edge of the display module, and attach the second part of the pre-pressed conductive film to the side wall of the first edge of the display module; if the display module is not located at the preset position, the pressure maintaining jig driving device can determine the angle to be adjusted and the displacement to be adjusted according to the fourth image, and then drives the display module to move to the preset position according to the angle to be adjusted and the displacement to be adjusted.

Wherein, pressurize tool adjusting device is used for adjusting the position of display module assembly, pressurize tool adjusting device's output and pressurize tool fixed connection, make pressurize tool adjusting device can adjust the position of pressurize tool, so that the position of fixing the display module assembly on the pressurize tool can obtain the adjustment, thereby can compensate because of the position error who removes display module assembly to the pressurize station production from the pre-compaction station, so that the pressurize pressure head can be comparatively accurate laminate the third part of the conductive film after the pre-compaction with the upper surface at the first border of display module assembly, and laminate the second part of the conductive film after the pre-compaction with the lateral wall at the first border of display module assembly.

Further, pressurize tool adjusting device includes XXY and counterpoints the platform, and XXY counterpoints the surface of platform and is connected with the pressurize tool bottom plate, and the one side and the pressurize tool fixed connection that XXY counterpointed the platform are kept away from to the pressurize tool bottom plate to counterpoint platform fixed connection with XXY, simple structure easily realizes. Threaded holes are formed in the periphery of the pressure maintaining jig base plate, through holes are correspondingly formed in the pressure maintaining jig, and bolts sequentially penetrate through the through holes and the threaded holes to fix the pressure maintaining jig on the pressure maintaining jig base plate, so that the pressure maintaining jig is easy to install and detach.

It should be noted that, in the process of moving and rotating the pressure holding jig by the pressure holding jig driving device, after determining the angle to be adjusted and the displacement to be adjusted, the number of revolutions of the motor in the XXY alignment platform may be determined to control the movement and rotation of the pressure holding jig.

It should be noted that, if the pressure maintaining jig needs to rotate at an angle and move in a straight direction at the same time, the driving device of the pressure maintaining jig needs to adjust the rotation of the pressure maintaining jig in the XY plane, and then perform the small movement in the X direction and/or the Y direction on the pressure maintaining jig, so that the pressure maintaining jig driving device can be prevented from being jammed.

Further, as shown in fig. 16, the pressure maintaining ram 5322 includes a pressure maintaining ram base 53221 and a pressure maintaining ram body 53222, and the pressure maintaining ram base 53221 is fixedly connected to the telescopic arm of the pressure maintaining ram cylinder through a ram mounting plate, so that the pressure maintaining ram 5322 is easy to disassemble and assemble. The pressure maintaining pressure head body 53222 comprises a pressure maintaining rubber gasket 53226, a first horizontal pressure maintaining surface 53223 and a second horizontal pressure maintaining surface 53224 which are parallel to each other, wherein a height difference exists between the first horizontal pressure maintaining surface 53223 and the second horizontal pressure maintaining surface 53224, the first horizontal pressure maintaining surface 53223 is connected through a vertical pressure maintaining surface 53225, the first horizontal pressure maintaining surface 53223 is used for pressing a first part of the conductive film, the vertical pressure maintaining surface 53225 is used for pressing a second part of the conductive film, and the second horizontal pressure maintaining surface 53224 is used for pressing a third part of the conductive film. Therefore, when the second horizontal pressure maintaining surface 53224 presses the third part of the conductive film, the first horizontal pressure maintaining surface 53223 presses the first part of the conductive film, so that the first part of the conductive film is prevented from being tilted, and the vertical pressure maintaining surface 53225 presses the second part of the conductive film, so that the second part of the conductive film is prevented from being wrinkled. The pressure maintaining pressure head body 53222 and the pressure maintaining rubber pad 53226 can be connected in an adhesive manner or integrally formed, and the first horizontal pressure maintaining surface 53223, the second horizontal pressure maintaining surface 53224 and the vertical pressure maintaining surface 53225 are all located on the pressure maintaining rubber pad 53226, so that the pressure maintaining pressure head 5322 can deform in the process of attaching the first horizontal pressure maintaining surface 53223, the second horizontal pressure maintaining surface 53224 and the vertical pressure maintaining surface 53225 to the conductive film, and the extrusion force formed by the pressure maintaining pressure head 5322 when the conductive film is attached to the display module can be buffered.

Optionally, the pressure maintaining device may include one pressure maintaining jig, or may include at least two pressure maintaining jigs, and each pressure maintaining jig may be fixed with one display module; correspondingly, the pressure maintaining device can comprise one pressure maintaining pressure head and also can comprise at least two pressure maintaining pressure heads. Therefore, the pressurizer can carry out the pressurize to a conducting film and a display module assembly, also can carry out the pressurize simultaneously to two at least conducting films and two at least display module assemblies to can improve the laminating efficiency of conducting film and display module assembly.

Optionally, as shown in fig. 14, the pressure holding device 53 further includes a third alignment detection device 534, a third control unit, and a third monitoring device 535. The third alignment detection device 534 is used for determining the position information of the conductive film and the position information of the display module, and providing data support for the attachment of the third part of the conductive film and the upper surface of the first edge of the display module, and the third control unit can control the moving track of the pressure maintaining jig adjusting device according to the position information of the conductive film and the position information of the display module, and adjust the position of the display module in time, so that the pressure maintaining pressure head can be accurately aligned and pressed on the third part of the conductive film. The third monitoring device 535 is used for monitoring the pressing state of the pressure maintaining pressure head and the third part of the conductive film and the laminating state of the conductive film and the display module, and providing video and image reference for the working personnel, so as to adjust the motion parameters of the pressure maintaining driving device in time, so as to prevent the interference of the pressure maintaining pressure head and the first edge of the display module, and meanwhile, the deformation amount of the pressure maintaining pressure head can be monitored in time, so that the working personnel can replace the pressure maintaining pressure head of which the deformation amount exceeds the preset range in time. Therefore, the third alignment detection device 534, the third control unit and the third monitoring device 535 are used to improve the automation degree of the conductive film attaching apparatus, and save manpower.

Optionally, before the conductive film attaching device initially attaches the conductive film and the display module, the conductive film can be obtained from the film tearing strip.

Illustratively, as shown in fig. 5, a conductive film peeling device 55 may be provided in the conductive film attaching apparatus, the conductive film peeling device 55 being located upstream of the primary attaching device 51, the conductive film peeling device 55 being used for peeling the conductive film from the carrier tape. Thus, the conductive film can be automatically peeled off by the conductive film peeling device 55, and the peeling speed is high and the peeling effect is good.

The conducting film stripping device is located in a feeding area of the conducting film, the film carrying belt with the conducting film is placed into the conducting film stripping device, the conducting film stripping device can strip the conducting film out of the film carrying belt, then the conducting film is placed into a conducting film tray through a primary adhering adsorption head and a primary adhering pressure head on the four-axis robot, and preparation is made for primary adhering of the conducting film and the display module.

Optionally, after the conductive film attaching device maintains the pressure of the conductive film and the display module, the obtained conductive film group can be detected, and the conductive film group is moved to the corresponding area according to the detection result.

Wherein, the mode that the attached equipment of conducting film detected the conducting film group specifically can include: shooting the conductive film group to obtain a first image; detecting whether the attaching position of the conductive film in the conductive film group is qualified or not according to the first image and a standard image, wherein the standard image is used for indicating the standard attaching position of the conductive film; when the attaching position of the conductive film in the conductive film group is qualified, moving the conductive film group to a material waiting plate; and when the attaching position of the conductive film in the conductive film group is unqualified, moving the conductive film group to a waste tray.

For example, as shown in fig. 5, a detection device 56 may be disposed in the conductive film attaching apparatus, the detection device 56 is located downstream of the pressure maintaining device 53, the detection device 56 is configured to detect whether the attaching position of the conductive film in the conductive film group is qualified, when the attaching position of the conductive film in the conductive film group is qualified, the conductive film group enters the material waiting tray 564, and when the attaching position of the conductive film in the conductive film group is unqualified, the conductive film group enters the waste tray 565. From this, can carry out automated inspection to the laminating quality between conducting film and the display module assembly through detection device 56 to can carry out automatic sorting with qualified conducting film group and unqualified conducting film group, it is fast and detection effect is better.

Further, as shown in fig. 17, the detection device 56 includes a detection station 561, a conductive film detection device 562, and a detection fixture 563, where the detection station 561 is configured to place a conductive film group for pressure maintaining; conducting film detection device 562 includes the industry camera, and this industry camera can be located the top of detecting station 561, and this industry camera is used for shooing the positional information of display module assembly and the positional information of conducting film, and it is high to detect the precision, has improved and has detected the qualification rate.

For example, as shown in fig. 17, the conductive film group subjected to pressure maintaining may be transferred from the pressure maintaining station to the detecting station 561 by the display module transferring device 54, that is, the conductive film group may be transferred from the pressure maintaining jig to the detecting jig 563, and the detecting jig 563 fixes the conductive film group and locates the conductive film group on the detecting station 561, so that the conductive film detecting device 562 performs a photo detection on the conductive film group. The conductive film detection device 562 is positioned above the conductive film group, and a lens in the conductive film detection device 562 faces the front surface of the conductive film group, so that the conductive film detection device 562 can detect the position of the conductive film in the conductive film group and detect the bonding quality of the conductive film and the display module; when the attachment position of the conductive film in the conductive film group is qualified, the conductive film group enters the material waiting tray 564 through the display module conveying device 54, and when the attachment position of the conductive film in the conductive film group is unqualified, the conductive film group enters the waste tray 565 through the display module conveying device 54.

Optionally, in the first device of pasting of this attached equipment of conducting film, in pre-compaction device and the pressurizer, all be provided with the pressure head, be the first pressure head that pastes respectively, pre-compaction pressure head and pressurize pressure head, in the attached equipment use of conducting film, also need carry out the life-span to above-mentioned pressure head and detect the deformation volume of target pressure head promptly, if the deformation volume of target pressure head is greater than and predetermines the deformation volume, explain then this target pressure head has certain deformation, attached equipment of conducting film just needs output warning information then this moment, change this target pressure head in order to indicate the staff, this target pressure head is in the first pressure head that pastes, in pre-compaction pressure head and the pressurize pressure head arbitrary.

Optionally, in the initial sticking device, the pre-pressing device and the pressure maintaining device of the conductive film sticking equipment, pressure head detection devices are arranged, and are used for detecting the size of a target pressure head, warning information can be sent out when the size of the target pressure head is larger than a preset value, so that a worker is prompted to replace the target pressure head in time, the situation that the target pressure head exceeds an extrusion range when the conductive film is extruded due to the fact that the deformation amount of the target pressure head exceeds the preset range is prevented, and the conductive film which does not need to be extruded is extruded to cause sticking failure is avoided.

Further, pressure head detection device can set up the below at the target pressure head, and be located the station one side of placing the target pressure head, camera lens among the pressure head detection device is towards the attached plane of target pressure head and conducting film, with the detection of shooing to the front of target pressure head, the target pressure head can be portable to pressure head detection device directly over before carrying out the pressfitting or after the pressfitting to the conducting film, thereby can make pressure head detection device shoot the detection to the front of target pressure head, and the deformation volume of time monitoring target pressure head, thereby in time change the target pressure head that the deformation volume surpassed the default, with the pressfitting quality of assurance target pressure head to the conducting film.

Optionally, when the conductive film and the display module are pressed through the target pressure head, the bonding pressure of the target pressure head can be detected in real time; if the laminating pressure reaches the preset pressure value, the target pressure head can be controlled to stop pressing the conductive film and the display module.

Wherein, in the pressure head, pre-compaction pressure head and the pressurize pressure head of pasting the pressure head at the beginning of the attached equipment of conducting film, all be provided with pressure sensor, can confirm the laminating pressure of current pressure head in real time through pressure sensor.

Furthermore, in the conductive film attaching equipment, each pressure head is communicated with the four-axis robot, the four-axis robot can drive the pressure heads to move in multiple directions, and the tail ends of mechanical arms of the four-axis robot are communicated with the air cylinder, so that if the attaching pressure of a target pressure head reaches a preset pressure value, the air inflow and the air outflow of the air cylinder can be adjusted, and the target pressure head is controlled to stop pressing the conductive film and the display module; that is, reduce the air input, increase air output, the tolerance in the cylinder reduces like this, and atmospheric pressure reduces, and the target pressure head just stops descending promptly so stops the target pressure head and stops to carry out the pressfitting to conducting film and display module assembly.

The embodiment of the invention provides a conductive film attaching method and conductive film attaching equipment, wherein the conductive film attaching equipment firstly attaches the edge of the first part of the conductive film, which is far away from the second part, to the upper surface of the first edge of a metal back plate, so that the edge of the conductive film is firstly attached to the metal back plate, and then the first part of the conductive film is integrally attached to the metal back plate, therefore, the attachment length of the conductive film and the metal back plate can be ensured to reach the preset attachment length, the conductive film and the metal back plate can be ensured to be fully connected and conducted, the attachment precision is higher, and the attachment quality of the conductive film and the metal back plate is improved. And finally, the third part of the conductive film is attached to the upper surface of the first edge of the display module, and the second part of the conductive film is attached to the side wall of the first edge of the display module, so that the conductive film can electrically conduct the metal back plate and the upper surface of the first edge of the display module, and the static electricity on the upper surface of the first edge of the display module is timely released through the metal back plate. The conductive film is firstly attached to the metal back plate, and the second part and the third part of the conductive film are in a suspended state, so that the first part of the conductive film can be prevented from being torn due to pulling when being attached to the metal back plate, and the first part can be prevented from being wrinkled when being attached due to the fact that the length of the second part exceeds the preset length; then the conducting film is laminated with the upper surface of the first border of the display module group again, and the laminating has been accomplished to the first part of conducting film this moment, from this, not only can prevent that the third part of conducting film from receiving the pulling and tearing when laminating with the display module group, still can prevent to make the fold appear when laminating because of the length of second part surpasss preset length, has further improved the laminating quality of conducting film and display module group.

In various embodiments of the present invention, it should be understood that the sequence numbers of the above-mentioned processes do not imply a necessary order of execution, and the order of execution of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated units, if implemented as software functional units and sold or used as a stand-alone product, may be stored in a computer accessible memory. Based on such understanding, the technical solution of the present invention, which is a part of or contributes to the prior art in essence, or all or part of the technical solution, can be embodied in the form of a software product, which is stored in a memory and includes several requests for causing a computer device (which may be a personal computer, a server, a network device, or the like, and may specifically be a processor in the computer device) to execute part or all of the steps of the above-described method of each embodiment of the present invention.

It will be understood by those skilled in the art that all or part of the steps in the methods of the embodiments described above may be implemented by hardware instructions of a program, and the program may be stored in a computer-readable storage medium, where the storage medium includes Read-Only Memory (ROM), Random Access Memory (RAM), Programmable Read-Only Memory (PROM), Erasable Programmable Read-Only Memory (EPROM), One-time Programmable Read-Only Memory (OTPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Compact Disc Read-Only Memory (CD-ROM), or other Memory, such as a magnetic disk, or a combination thereof, A tape memory, or any other medium readable by a computer that can be used to carry or store data.

Claims

1. The conductive film attaching method is characterized by being applied to conductive film attaching equipment, wherein the conductive film attaching equipment is used for attaching a conductive film to a display module provided with a metal back plate, a first edge of the metal back plate exceeds a first edge of the display module, the conductive film comprises a first part, a second part and a third part which are sequentially arranged, and the method comprises the following steps of:

attaching the first edge of the first part of the conductive film to the upper surface of the first edge of the metal back plate to obtain the primarily attached conductive film, wherein the first edge of the first part of the conductive film is an edge far away from the second part;

attaching the first part of the initially attached conductive film to the upper surface of the first edge of the metal back plate to obtain a pre-pressed conductive film;

extruding and attaching the third part of the pre-pressed conductive film and the upper surface of the first edge of the display module through a pressure maintaining pressure head, and extruding and attaching the second part of the pre-pressed conductive film and the side wall of the first edge of the display module to obtain a conductive film group;

the pressure maintaining pressure head comprises a first horizontal pressure maintaining surface and a second horizontal pressure maintaining surface which are parallel to each other, wherein a height difference is formed between the first horizontal pressure maintaining surface and the second horizontal pressure maintaining surface, and the first horizontal pressure maintaining surface and the second horizontal pressure maintaining surface are connected through a vertical pressure maintaining surface.

2. The method of claim 1, wherein the attaching the first edge of the first portion of the conductive film to the upper surface of the first edge of the metal back plate to obtain the initially attached conductive film comprises:

3. The method according to claim 1, wherein after attaching the third portion of the pre-pressed conductive film to the upper surface of the first edge of the display module and attaching the second portion of the pre-pressed conductive film to the sidewall of the first edge of the display module to obtain the conductive film set, the method further comprises:

shooting the conductive film group to obtain a first image;

and when the attachment position of the conductive film in the conductive film group is unqualified, moving the conductive film group to a waste tray.

4. The method of claim 1,

attaching the first edge of the first part of the conductive film to the upper surface of the first edge of the metal back plate to obtain the initially attached conductive film, and the method comprises the following steps:

the attaching the first part of the primarily attached conductive film to the upper surface of the first edge of the metal back plate to obtain the pre-pressed conductive film includes:

and extruding and attaching the first part of the initially attached conductive film and the upper surface of the first edge of the metal back plate through a prepressing pressure head to obtain the prepressed conductive film.

5. The method of claim 4, further comprising:

6. The method according to claim 4 or 5, characterized in that the method further comprises:

detecting the bonding pressure of a target pressure head in real time;

7. The method according to claim 6, wherein the target ram is communicated with a cylinder, and the controlling of the target ram to stop the extrusion bonding when the bonding pressure reaches a preset pressure value comprises:

and when the laminating pressure reaches the preset pressure value, controlling the target pressure head to stop extruding and laminating by adjusting the air input and the air output of the air cylinder.

8. The method of claim 1, wherein the attaching the first edge of the first portion of the conductive film to the upper surface of the first edge of the metal back plate to obtain the initially attached conductive film comprises:

shooting the display module to obtain a second image;

determining the position of the display module according to the second image;

9. The method of claim 8, wherein after determining the position of the display module according to the second image, the method further comprises:

determining the angle to be adjusted and the displacement to be adjusted of the display module under the condition that the display module is detected not to be located at the preset position;

10. The utility model provides an attached equipment of conducting film, its characterized in that, attached equipment of conducting film is used for the attached display module assembly that is equipped with the metal backplate of conducting film, the first border of metal backplate surpasss the first border of display module assembly, the conducting film is including the first part, second part and the third part that arrange in proper order, attached equipment of conducting film includes:

the pressure maintaining device is used for extruding and attaching the third part of the pre-pressed conductive film and the upper surface of the first edge of the display module through a pressure maintaining pressure head, and extruding and attaching the second part of the pre-pressed conductive film and the side wall of the first edge of the display module to obtain a conductive film group;