CN114100709A - Temperature control device for micro-fluidic chip and working method thereof - Google Patents

Temperature control device for micro-fluidic chip and working method thereof Download PDF

Info

Publication number
CN114100709A
CN114100709A CN202111351795.7A CN202111351795A CN114100709A CN 114100709 A CN114100709 A CN 114100709A CN 202111351795 A CN202111351795 A CN 202111351795A CN 114100709 A CN114100709 A CN 114100709A
Authority
CN
China
Prior art keywords
temperature
temperature control
voltage
microfluidic chip
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111351795.7A
Other languages
Chinese (zh)
Inventor
孙浩
熊凌鹄
东辉
余勇健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhou University
Original Assignee
Fuzhou University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhou University filed Critical Fuzhou University
Priority to CN202111351795.7A priority Critical patent/CN114100709A/en
Publication of CN114100709A publication Critical patent/CN114100709A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00Heating or cooling apparatus; Heat insulating devices
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/20Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/18Means for temperature control
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/18Means for temperature control
    • B01L2300/1833Means for temperature control using electrical currents in the sample itself
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/18Means for temperature control
    • B01L2300/1838Means for temperature control using fluid heat transfer medium
    • B01L2300/1844Means for temperature control using fluid heat transfer medium using fans
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/18Means for temperature control
    • B01L2300/1894Cooling means; Cryo cooling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • Hematology (AREA)
  • General Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Control Of Temperature (AREA)

Abstract

The invention relates to a temperature control device for a micro-fluidic chip and a working method thereof. The system comprises a semiconductor cooler (TEC), a heat dissipation device (heat sink), a fan and a temperature control development module connected with a temperature sensor. The temperature control development module consists of a switch switching power supply, a voltage-boosting and voltage-reducing power supply voltage-stabilizing module and a temperature controller, the temperature controller is connected with a temperature sensor, a TEC and a fan, the output form can be converted according to the type of an external power supply, and the output direct-current voltage is adjusted by setting the temperature and acquiring the data of the temperature in real time and applying a PID algorithm. The temperature control development module is connected with a computer or an instrument display through an RS-232 interface, can directly adjust the target temperature or edit a corresponding temperature function, and reads temperature information from corresponding display equipment. The invention can provide a portable heat source temperature control device for the microfluidic chip, can adapt to constant temperature and variable temperature scenes such as LAMP reaction and PCR reaction, and has the characteristics of visualization, quick response, simple and convenient operation and the like.

Description

Temperature control device for micro-fluidic chip and working method thereof
Technical Field
The invention relates to a temperature control device for a micro-fluidic chip and a working method thereof.
Background
The micro-fluidic chip is a main platform for realizing the micro-fluidic technology, and the device can centralize basic operation units of sample preparation, reaction, separation, detection and the like on a chip with small scale for carrying out. In some of the above-mentioned operations, a specific external temperature environment is required for the implementation, such as PCR reaction and LAMP reaction, which requires a portable temperature control device matched with the reaction. Compared with other temperature control devices, the device adopts a semiconductor refrigeration element (TEC) to achieve temperature response faster than a conventional thermocouple, can change the direction of a heat pump according to current input, and is also provided with a set of temperature control development modules which can simultaneously adapt to alternating current and direct current power supplies and dynamically adjust voltage to set temperature according to a PID algorithm in real time. Meanwhile, two data observation and operation channels are provided according to the interface, and an application prospect is provided for a visual and economical temperature control device.
Disclosure of Invention
The invention aims to provide a temperature control device for a microfluidic chip and a working method thereof, which have the advantages of quick response and simple and convenient operation, can be compatible with different types of power supplies through a temperature control development module, and enable a refrigeration/heating element to achieve the set temperature and have the functions of visualization and editing.
In order to achieve the purpose, the technical scheme of the invention is as follows: a temperature control device for a microfluidic chip comprises a temperature control development module, a refrigeration/heat execution element, a personal computer or a user instrument display, wherein the refrigeration/heat execution element is connected with the temperature control development module and is used for adjusting the temperature of the microfluidic chip; the refrigeration/heat execution element comprises a semiconductor refrigerator, a heat dissipation device and a fan which are sequentially arranged from top to bottom, and the semiconductor refrigerator, the heat dissipation device and the fan are bonded into a whole through heat-conducting silica gel; the semiconductor refrigerator utilizes the Peltier effect to rapidly form temperature difference on the upper surface and the lower surface of the semiconductor refrigerator, then the heat exchange is accelerated through the heat dissipation device by the fan, and the temperature control development module can adjust the temperature of the other end by changing the rotating speed of the fan or adjust the temperature difference of the two ends by changing the input voltage of the semiconductor refrigerator to realize temperature control.
In an embodiment of the invention, the temperature control development module comprises a switch switching power supply, a voltage stabilizing module of a buck-boost power supply and a temperature controller; the switching power supply can convert externally input 110V or 220V alternating current voltage into 12V direct current voltage and provide short circuit, overload and overvoltage protection; the voltage-boosting and voltage-reducing power supply voltage-stabilizing module can convert input direct-current voltage into output voltage in real time according to signals of the temperature controller, and the temperature controller applies a PID algorithm according to comparison between data of the semiconductor refrigerator upper surface temperature sensor and target temperature and dynamically adjusts the input voltage of the semiconductor refrigerator.
In an embodiment of the present invention, the temperature control development module may use a 110V or 220V ac power supply as its external input, or may use a dc power supply including a battery or a charger as its external input.
In one embodiment of the invention, the temperature control development module can be connected with a personal computer or a user instrument display through an RS-232 interface; the temperature control development module can directly adjust the target temperature and read temperature information from corresponding display equipment, and a personal computer or a user instrument display can edit a corresponding temperature function by using related software and draw a trend curve of the temperature changing along with time.
The invention also provides a working method of the temperature control device for the microfluidic chip based on the temperature control device, the temperature sensor on the upper surface of the semiconductor refrigerator collects the temperature of the microfluidic chip in real time, and when the temperature of the microfluidic chip is inconsistent with the target temperature, the temperature control development module adjusts the temperature of the other end by changing the rotating speed of the fan or adjusts the temperature difference between the two ends by changing the input voltage of the semiconductor refrigerator to realize temperature control, so that the temperature of the microfluidic chip reaches the target temperature; meanwhile, the required target temperature can be set through a personal computer or a user instrument display, and the temperature of the microfluidic chip can be displayed in real time through the personal computer or the user instrument display, and a corresponding temperature curve can be drawn.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, the TEC is used for accelerating the response speed of the temperature, the direction of the heat pump can be changed according to the current input, the matched temperature control development module can be compatible with different types of power supplies, the PID algorithm is used for adjusting the voltage to the set temperature in real time, and meanwhile, the TEC is connected with a personal computer or a user instrument to integrate observation and control, so that the device is simplified, and an application prospect is provided for a visual and economical temperature control device.
Drawings
FIG. 1 is a functional block diagram of an embodiment of the present invention;
FIG. 2 is a functional block diagram of an embodiment of the present invention;
FIG. 3 is an infrared thermal imager temperature image in actual use of an embodiment of the invention;
fig. 4 is a temperature plot result of an example of the present invention implementing dynamic adjustment.
Detailed Description
The technical scheme of the invention is specifically explained below with reference to the accompanying drawings.
The invention relates to a temperature control device for a microfluidic chip, which comprises a temperature control development module, a refrigeration/heat execution element, a personal computer or a user instrument display, wherein the refrigeration/heat execution element is connected with the temperature control development module and is used for adjusting the temperature of the microfluidic chip; the refrigeration/heat execution element comprises a semiconductor refrigerator, a heat dissipation device and a fan which are sequentially arranged from top to bottom, and the semiconductor refrigerator, the heat dissipation device and the fan are bonded into a whole through heat-conducting silica gel; the semiconductor refrigerator utilizes the Peltier effect to rapidly form temperature difference on the upper surface and the lower surface of the semiconductor refrigerator, then the heat exchange is accelerated through the heat dissipation device by the fan, and the temperature control development module can adjust the temperature of the other end by changing the rotating speed of the fan or adjust the temperature difference of the two ends by changing the input voltage of the semiconductor refrigerator to realize temperature control.
The invention also provides a working method of the temperature control device for the microfluidic chip based on the temperature control device, the temperature sensor on the upper surface of the semiconductor refrigerator collects the temperature of the microfluidic chip in real time, and when the temperature of the microfluidic chip is inconsistent with the target temperature, the temperature control development module adjusts the temperature of the other end by changing the rotating speed of the fan or adjusts the temperature difference between the two ends by changing the input voltage of the semiconductor refrigerator to realize temperature control, so that the temperature of the microfluidic chip reaches the target temperature; meanwhile, the required target temperature can be set through a personal computer or a user instrument display, and the temperature of the microfluidic chip can be displayed in real time through the personal computer or the user instrument display, and a corresponding temperature curve can be drawn.
The following are specific examples of the present invention.
In a first embodiment, as shown in fig. 1, a temperature control device for a microfluidic chip includes a cooling/heating actuator, a temperature control development module, a temperature sensor, a personal computer or a user instrument display, a power supply for powering the device, a plurality of wires, and a serial communication interface.
In this example, the cooling/heating actuator includes a semiconductor cooler (TEC), a heat sink (heat sink) and a fan, which are stacked up and down in sequence and bonded by a heat conductive silicone adhesive to form a whole, the TEC uses the Peltier effect of the semiconductor to rapidly form a temperature difference between the upper and lower surfaces thereof, the TEC has 127 pairs of PN junctions, and can realize a temperature difference of 60 ℃ between the upper and lower plates, and then accelerate heat exchange by the fan through the heat sink, so that the rotation speed of the fan can be changed to adjust the temperature of the other end, thereby realizing temperature adjustment of the cooling/heating end, and also realizing temperature control by changing the temperature difference between the upper and lower plates through input voltage adjustment.
In this example, the temperature control development module comprises a switch switching power supply, a voltage-boosting and voltage-reducing power supply voltage-stabilizing module and a temperature controller which are connected into a whole through leads, wherein the switch switching power supply can convert an externally input 220V alternating current voltage into a 12V direct current voltage and provide short circuit, overload and overvoltage protection; the voltage stabilizing module of the voltage boosting and reducing power supply can convert the input direct-current voltage into the output voltage in real time according to the signal of the temperature controller, and the temperature controller dynamically adjusts the input voltage of the temperature boosting and reducing power supply by applying a PID algorithm according to the comparison between the data of the surface temperature sensor on the TEC and the target temperature.
In the second embodiment, as shown in fig. 2 to 3, the temperature control device functional modules can be integrated in a box of 20cm × 20cm, only two leads are needed to be externally arranged, one of the two leads is an RS232PC serial port connected with a personal computer, and the output curve can be adjusted at will by using corresponding temperature control editing software; the other is connected with an external power supply, and can be a 220V alternating current power supply or a direct current power supply below 12V.
In this example, as shown in fig. 2, when only a constant temperature output is required (e.g., 62.5 ℃), the set temperature value may be edited by a personal computer, or a temperature may be set on a user meter, which can display the current temperature; an infrared thermal imager can also be used, as shown in fig. 3, the chip is fixed on the upper end of the TEC plate, and the actual temperature display result is close to the sensor result.
In the third embodiment, as shown in fig. 4, if a complex temperature signal needs to be output, a personal computer needs to be connected to the temperature controller through an RS232 serial port, and then the corresponding PID parameters are edited in the temperature control software.
In this example, taking PCR as an example, the process requires a temperature cycle of 40 cycles of 15s at 95 ℃ and 30s at 60 ℃, as shown in fig. 4, and the temperature can be adjusted automatically according to the setting by adjusting the parameters such as the operation values and auxiliary variables in the PID editing software.
The above are preferred embodiments of the present invention, and all changes made according to the technical scheme of the present invention that produce functional effects do not exceed the scope of the technical scheme of the present invention belong to the protection scope of the present invention.

Claims (5)

1. A temperature control device for a microfluidic chip is characterized by comprising a temperature control development module, a refrigeration/heat execution element, a personal computer or a user instrument display, wherein the refrigeration/heat execution element is connected with the temperature control development module and is used for adjusting the temperature of the microfluidic chip; the refrigeration/heat execution element comprises a semiconductor refrigerator, a heat dissipation device and a fan which are sequentially arranged from top to bottom, and the semiconductor refrigerator, the heat dissipation device and the fan are bonded into a whole through heat-conducting silica gel; the semiconductor refrigerator utilizes the Peltier effect to rapidly form temperature difference on the upper surface and the lower surface of the semiconductor refrigerator, then the heat exchange is accelerated through the heat dissipation device by the fan, and the temperature control development module can adjust the temperature of the other end by changing the rotating speed of the fan or adjust the temperature difference of the two ends by changing the input voltage of the semiconductor refrigerator to realize temperature control.
2. The temperature control device for the microfluidic chip according to claim 1, wherein the temperature control development module comprises a switching power supply, a voltage stabilizing module of a buck-boost power supply, and a temperature controller; the switching power supply can convert externally input 110V or 220V alternating current voltage into 12V direct current voltage and provide short circuit, overload and overvoltage protection; the voltage-boosting and voltage-reducing power supply voltage-stabilizing module can convert input direct-current voltage into output voltage in real time according to signals of the temperature controller, and the temperature controller applies a PID algorithm according to comparison between data of the semiconductor refrigerator upper surface temperature sensor and target temperature and dynamically adjusts the input voltage of the semiconductor refrigerator.
3. The temperature control device for the microfluidic chip as claimed in claim 1 or 2, wherein the temperature control development module can use 110V or 220V ac power supply as its external input, and can also use dc power supply including battery or charger as its external input.
4. The temperature control device for the microfluidic chip as claimed in claim 1, wherein the temperature control development module can be connected to a personal computer or a user instrument display through an RS-232 interface; the temperature control development module can directly adjust the target temperature and read temperature information from corresponding display equipment, and a personal computer or a user instrument display can edit a corresponding temperature function by using related software and draw a trend curve of the temperature changing along with time.
5. The operating method of the temperature control device for the microfluidic chip according to any one of claims 1 to 4, wherein the temperature sensor on the upper surface of the semiconductor refrigerator collects the temperature of the microfluidic chip in real time, and when the temperature of the microfluidic chip is inconsistent with a target temperature, the temperature control development module adjusts the temperature of the other end by changing the rotation speed of the fan or adjusts the temperature difference between the two ends by changing the input voltage of the semiconductor refrigerator to control the temperature so that the temperature of the microfluidic chip reaches the target temperature; meanwhile, the required target temperature can be set through a personal computer or a user instrument display, and the temperature of the microfluidic chip can be displayed in real time through the personal computer or the user instrument display, and a corresponding temperature curve can be drawn.
CN202111351795.7A 2021-11-16 2021-11-16 Temperature control device for micro-fluidic chip and working method thereof Pending CN114100709A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111351795.7A CN114100709A (en) 2021-11-16 2021-11-16 Temperature control device for micro-fluidic chip and working method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111351795.7A CN114100709A (en) 2021-11-16 2021-11-16 Temperature control device for micro-fluidic chip and working method thereof

Publications (1)

Publication Number Publication Date
CN114100709A true CN114100709A (en) 2022-03-01

Family

ID=80396620

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111351795.7A Pending CN114100709A (en) 2021-11-16 2021-11-16 Temperature control device for micro-fluidic chip and working method thereof

Country Status (1)

Country Link
CN (1) CN114100709A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070166204A1 (en) * 2005-10-05 2007-07-19 Dongqing Li Disposable reactor module and detection system
JP2009109314A (en) * 2007-10-30 2009-05-21 Olympus Corp Semiconductor device and its inspecting method
CN111650168A (en) * 2020-06-24 2020-09-11 深圳市国赛生物技术有限公司 Full-automatic micro-fluidic analyzer
CN213189043U (en) * 2020-09-25 2021-05-14 中惠创智(深圳)无线供电技术有限公司 Wireless power supply's refrigeration cup
CN214620235U (en) * 2020-09-30 2021-11-05 珠海莲腾清洁能源有限公司 Intelligent temperature control cooling equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070166204A1 (en) * 2005-10-05 2007-07-19 Dongqing Li Disposable reactor module and detection system
JP2009109314A (en) * 2007-10-30 2009-05-21 Olympus Corp Semiconductor device and its inspecting method
CN111650168A (en) * 2020-06-24 2020-09-11 深圳市国赛生物技术有限公司 Full-automatic micro-fluidic analyzer
CN213189043U (en) * 2020-09-25 2021-05-14 中惠创智(深圳)无线供电技术有限公司 Wireless power supply's refrigeration cup
CN214620235U (en) * 2020-09-30 2021-11-05 珠海莲腾清洁能源有限公司 Intelligent temperature control cooling equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
熊凌鹄等: "纸基芯片温控系统仿真与分析", 《液压与气动》 *

Similar Documents

Publication Publication Date Title
US20120096871A1 (en) Dynamic switching thermoelectric thermal management systems and methods
CN204787473U (en) Drive of two -stage high frequency canalis haemalis refrigerator direct current and initiative temperature control system
CN1181420C (en) High-precision temperature control circuit for thermoelectric cooler
KR900011123A (en) Solid starter mounted on motor terminal box
CN107655959A (en) A kind of controllable thermoelectrochemistry battery testing platform of electrode temperature and its method
CN216499443U (en) Temperature control device for micro-fluidic chip
CN110244798A (en) A kind of adaptive temperature control system of laser indication device
CN114100709A (en) Temperature control device for micro-fluidic chip and working method thereof
CN108666855A (en) Laser crystal bilateral temperature regulating device
CN208423445U (en) Power stability type solid state laser
CN108323136B (en) Heat dissipation cabinet
CN116578138A (en) Two-stage temperature control device suitable for optical chip
CN2630912Y (en) High-precision temperature control circuit for thermoelectric refrigerator
CN2814557Y (en) Semiconductor thermoelectric effect teaching demonstration instrument
CN110109494A (en) The control method and control device of thermoelectric cooler
CN112923600A (en) Semiconductor thermoelectric material refrigeration platform
CN111648987B (en) Dynamic rotating speed adjusting device of cooling fan
CN108255211A (en) A kind of TEC refrigerating plants
CN110631288B (en) Dynamic adjustable refrigerating and heating device for experiment and semiconductor refrigerating plate
CN204272566U (en) A kind of active dynamic temperature control heat abstractor of multimedia all-in-one machine
US20080218140A1 (en) Control apparatus for cooler
Boubaris et al. Implementation of current and ventilation control for enhanced TEC performance
Kamasi et al. Comparison between two-stage and three-stage Peltier thermoelectric coolers driven by pulse width modulation
CN106406382A (en) Constant temperature metal bathing device
CN106908161A (en) A kind of method and system of quick realization temperature tactilely-perceptible on a large scale

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20220301