CN114100709A - Temperature control device for micro-fluidic chip and working method thereof - Google Patents
Temperature control device for micro-fluidic chip and working method thereof Download PDFInfo
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- CN114100709A CN114100709A CN202111351795.7A CN202111351795A CN114100709A CN 114100709 A CN114100709 A CN 114100709A CN 202111351795 A CN202111351795 A CN 202111351795A CN 114100709 A CN114100709 A CN 114100709A
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- 238000000034 method Methods 0.000 title abstract description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract description 10
- 238000005057 refrigeration Methods 0.000 claims description 11
- 230000005679 Peltier effect Effects 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000000087 stabilizing effect Effects 0.000 claims description 3
- 238000011017 operating method Methods 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 230000004044 response Effects 0.000 abstract description 4
- 238000012800 visualization Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L7/00—Heating or cooling apparatus; Heat insulating devices
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1833—Means for temperature control using electrical currents in the sample itself
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1838—Means for temperature control using fluid heat transfer medium
- B01L2300/1844—Means for temperature control using fluid heat transfer medium using fans
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1894—Cooling means; Cryo cooling
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- Hematology (AREA)
- General Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Control Of Temperature (AREA)
Abstract
The invention relates to a temperature control device for a micro-fluidic chip and a working method thereof. The system comprises a semiconductor cooler (TEC), a heat dissipation device (heat sink), a fan and a temperature control development module connected with a temperature sensor. The temperature control development module consists of a switch switching power supply, a voltage-boosting and voltage-reducing power supply voltage-stabilizing module and a temperature controller, the temperature controller is connected with a temperature sensor, a TEC and a fan, the output form can be converted according to the type of an external power supply, and the output direct-current voltage is adjusted by setting the temperature and acquiring the data of the temperature in real time and applying a PID algorithm. The temperature control development module is connected with a computer or an instrument display through an RS-232 interface, can directly adjust the target temperature or edit a corresponding temperature function, and reads temperature information from corresponding display equipment. The invention can provide a portable heat source temperature control device for the microfluidic chip, can adapt to constant temperature and variable temperature scenes such as LAMP reaction and PCR reaction, and has the characteristics of visualization, quick response, simple and convenient operation and the like.
Description
Technical Field
The invention relates to a temperature control device for a micro-fluidic chip and a working method thereof.
Background
The micro-fluidic chip is a main platform for realizing the micro-fluidic technology, and the device can centralize basic operation units of sample preparation, reaction, separation, detection and the like on a chip with small scale for carrying out. In some of the above-mentioned operations, a specific external temperature environment is required for the implementation, such as PCR reaction and LAMP reaction, which requires a portable temperature control device matched with the reaction. Compared with other temperature control devices, the device adopts a semiconductor refrigeration element (TEC) to achieve temperature response faster than a conventional thermocouple, can change the direction of a heat pump according to current input, and is also provided with a set of temperature control development modules which can simultaneously adapt to alternating current and direct current power supplies and dynamically adjust voltage to set temperature according to a PID algorithm in real time. Meanwhile, two data observation and operation channels are provided according to the interface, and an application prospect is provided for a visual and economical temperature control device.
Disclosure of Invention
The invention aims to provide a temperature control device for a microfluidic chip and a working method thereof, which have the advantages of quick response and simple and convenient operation, can be compatible with different types of power supplies through a temperature control development module, and enable a refrigeration/heating element to achieve the set temperature and have the functions of visualization and editing.
In order to achieve the purpose, the technical scheme of the invention is as follows: a temperature control device for a microfluidic chip comprises a temperature control development module, a refrigeration/heat execution element, a personal computer or a user instrument display, wherein the refrigeration/heat execution element is connected with the temperature control development module and is used for adjusting the temperature of the microfluidic chip; the refrigeration/heat execution element comprises a semiconductor refrigerator, a heat dissipation device and a fan which are sequentially arranged from top to bottom, and the semiconductor refrigerator, the heat dissipation device and the fan are bonded into a whole through heat-conducting silica gel; the semiconductor refrigerator utilizes the Peltier effect to rapidly form temperature difference on the upper surface and the lower surface of the semiconductor refrigerator, then the heat exchange is accelerated through the heat dissipation device by the fan, and the temperature control development module can adjust the temperature of the other end by changing the rotating speed of the fan or adjust the temperature difference of the two ends by changing the input voltage of the semiconductor refrigerator to realize temperature control.
In an embodiment of the invention, the temperature control development module comprises a switch switching power supply, a voltage stabilizing module of a buck-boost power supply and a temperature controller; the switching power supply can convert externally input 110V or 220V alternating current voltage into 12V direct current voltage and provide short circuit, overload and overvoltage protection; the voltage-boosting and voltage-reducing power supply voltage-stabilizing module can convert input direct-current voltage into output voltage in real time according to signals of the temperature controller, and the temperature controller applies a PID algorithm according to comparison between data of the semiconductor refrigerator upper surface temperature sensor and target temperature and dynamically adjusts the input voltage of the semiconductor refrigerator.
In an embodiment of the present invention, the temperature control development module may use a 110V or 220V ac power supply as its external input, or may use a dc power supply including a battery or a charger as its external input.
In one embodiment of the invention, the temperature control development module can be connected with a personal computer or a user instrument display through an RS-232 interface; the temperature control development module can directly adjust the target temperature and read temperature information from corresponding display equipment, and a personal computer or a user instrument display can edit a corresponding temperature function by using related software and draw a trend curve of the temperature changing along with time.
The invention also provides a working method of the temperature control device for the microfluidic chip based on the temperature control device, the temperature sensor on the upper surface of the semiconductor refrigerator collects the temperature of the microfluidic chip in real time, and when the temperature of the microfluidic chip is inconsistent with the target temperature, the temperature control development module adjusts the temperature of the other end by changing the rotating speed of the fan or adjusts the temperature difference between the two ends by changing the input voltage of the semiconductor refrigerator to realize temperature control, so that the temperature of the microfluidic chip reaches the target temperature; meanwhile, the required target temperature can be set through a personal computer or a user instrument display, and the temperature of the microfluidic chip can be displayed in real time through the personal computer or the user instrument display, and a corresponding temperature curve can be drawn.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, the TEC is used for accelerating the response speed of the temperature, the direction of the heat pump can be changed according to the current input, the matched temperature control development module can be compatible with different types of power supplies, the PID algorithm is used for adjusting the voltage to the set temperature in real time, and meanwhile, the TEC is connected with a personal computer or a user instrument to integrate observation and control, so that the device is simplified, and an application prospect is provided for a visual and economical temperature control device.
Drawings
FIG. 1 is a functional block diagram of an embodiment of the present invention;
FIG. 2 is a functional block diagram of an embodiment of the present invention;
FIG. 3 is an infrared thermal imager temperature image in actual use of an embodiment of the invention;
fig. 4 is a temperature plot result of an example of the present invention implementing dynamic adjustment.
Detailed Description
The technical scheme of the invention is specifically explained below with reference to the accompanying drawings.
The invention relates to a temperature control device for a microfluidic chip, which comprises a temperature control development module, a refrigeration/heat execution element, a personal computer or a user instrument display, wherein the refrigeration/heat execution element is connected with the temperature control development module and is used for adjusting the temperature of the microfluidic chip; the refrigeration/heat execution element comprises a semiconductor refrigerator, a heat dissipation device and a fan which are sequentially arranged from top to bottom, and the semiconductor refrigerator, the heat dissipation device and the fan are bonded into a whole through heat-conducting silica gel; the semiconductor refrigerator utilizes the Peltier effect to rapidly form temperature difference on the upper surface and the lower surface of the semiconductor refrigerator, then the heat exchange is accelerated through the heat dissipation device by the fan, and the temperature control development module can adjust the temperature of the other end by changing the rotating speed of the fan or adjust the temperature difference of the two ends by changing the input voltage of the semiconductor refrigerator to realize temperature control.
The invention also provides a working method of the temperature control device for the microfluidic chip based on the temperature control device, the temperature sensor on the upper surface of the semiconductor refrigerator collects the temperature of the microfluidic chip in real time, and when the temperature of the microfluidic chip is inconsistent with the target temperature, the temperature control development module adjusts the temperature of the other end by changing the rotating speed of the fan or adjusts the temperature difference between the two ends by changing the input voltage of the semiconductor refrigerator to realize temperature control, so that the temperature of the microfluidic chip reaches the target temperature; meanwhile, the required target temperature can be set through a personal computer or a user instrument display, and the temperature of the microfluidic chip can be displayed in real time through the personal computer or the user instrument display, and a corresponding temperature curve can be drawn.
The following are specific examples of the present invention.
In a first embodiment, as shown in fig. 1, a temperature control device for a microfluidic chip includes a cooling/heating actuator, a temperature control development module, a temperature sensor, a personal computer or a user instrument display, a power supply for powering the device, a plurality of wires, and a serial communication interface.
In this example, the cooling/heating actuator includes a semiconductor cooler (TEC), a heat sink (heat sink) and a fan, which are stacked up and down in sequence and bonded by a heat conductive silicone adhesive to form a whole, the TEC uses the Peltier effect of the semiconductor to rapidly form a temperature difference between the upper and lower surfaces thereof, the TEC has 127 pairs of PN junctions, and can realize a temperature difference of 60 ℃ between the upper and lower plates, and then accelerate heat exchange by the fan through the heat sink, so that the rotation speed of the fan can be changed to adjust the temperature of the other end, thereby realizing temperature adjustment of the cooling/heating end, and also realizing temperature control by changing the temperature difference between the upper and lower plates through input voltage adjustment.
In this example, the temperature control development module comprises a switch switching power supply, a voltage-boosting and voltage-reducing power supply voltage-stabilizing module and a temperature controller which are connected into a whole through leads, wherein the switch switching power supply can convert an externally input 220V alternating current voltage into a 12V direct current voltage and provide short circuit, overload and overvoltage protection; the voltage stabilizing module of the voltage boosting and reducing power supply can convert the input direct-current voltage into the output voltage in real time according to the signal of the temperature controller, and the temperature controller dynamically adjusts the input voltage of the temperature boosting and reducing power supply by applying a PID algorithm according to the comparison between the data of the surface temperature sensor on the TEC and the target temperature.
In the second embodiment, as shown in fig. 2 to 3, the temperature control device functional modules can be integrated in a box of 20cm × 20cm, only two leads are needed to be externally arranged, one of the two leads is an RS232PC serial port connected with a personal computer, and the output curve can be adjusted at will by using corresponding temperature control editing software; the other is connected with an external power supply, and can be a 220V alternating current power supply or a direct current power supply below 12V.
In this example, as shown in fig. 2, when only a constant temperature output is required (e.g., 62.5 ℃), the set temperature value may be edited by a personal computer, or a temperature may be set on a user meter, which can display the current temperature; an infrared thermal imager can also be used, as shown in fig. 3, the chip is fixed on the upper end of the TEC plate, and the actual temperature display result is close to the sensor result.
In the third embodiment, as shown in fig. 4, if a complex temperature signal needs to be output, a personal computer needs to be connected to the temperature controller through an RS232 serial port, and then the corresponding PID parameters are edited in the temperature control software.
In this example, taking PCR as an example, the process requires a temperature cycle of 40 cycles of 15s at 95 ℃ and 30s at 60 ℃, as shown in fig. 4, and the temperature can be adjusted automatically according to the setting by adjusting the parameters such as the operation values and auxiliary variables in the PID editing software.
The above are preferred embodiments of the present invention, and all changes made according to the technical scheme of the present invention that produce functional effects do not exceed the scope of the technical scheme of the present invention belong to the protection scope of the present invention.
Claims (5)
1. A temperature control device for a microfluidic chip is characterized by comprising a temperature control development module, a refrigeration/heat execution element, a personal computer or a user instrument display, wherein the refrigeration/heat execution element is connected with the temperature control development module and is used for adjusting the temperature of the microfluidic chip; the refrigeration/heat execution element comprises a semiconductor refrigerator, a heat dissipation device and a fan which are sequentially arranged from top to bottom, and the semiconductor refrigerator, the heat dissipation device and the fan are bonded into a whole through heat-conducting silica gel; the semiconductor refrigerator utilizes the Peltier effect to rapidly form temperature difference on the upper surface and the lower surface of the semiconductor refrigerator, then the heat exchange is accelerated through the heat dissipation device by the fan, and the temperature control development module can adjust the temperature of the other end by changing the rotating speed of the fan or adjust the temperature difference of the two ends by changing the input voltage of the semiconductor refrigerator to realize temperature control.
2. The temperature control device for the microfluidic chip according to claim 1, wherein the temperature control development module comprises a switching power supply, a voltage stabilizing module of a buck-boost power supply, and a temperature controller; the switching power supply can convert externally input 110V or 220V alternating current voltage into 12V direct current voltage and provide short circuit, overload and overvoltage protection; the voltage-boosting and voltage-reducing power supply voltage-stabilizing module can convert input direct-current voltage into output voltage in real time according to signals of the temperature controller, and the temperature controller applies a PID algorithm according to comparison between data of the semiconductor refrigerator upper surface temperature sensor and target temperature and dynamically adjusts the input voltage of the semiconductor refrigerator.
3. The temperature control device for the microfluidic chip as claimed in claim 1 or 2, wherein the temperature control development module can use 110V or 220V ac power supply as its external input, and can also use dc power supply including battery or charger as its external input.
4. The temperature control device for the microfluidic chip as claimed in claim 1, wherein the temperature control development module can be connected to a personal computer or a user instrument display through an RS-232 interface; the temperature control development module can directly adjust the target temperature and read temperature information from corresponding display equipment, and a personal computer or a user instrument display can edit a corresponding temperature function by using related software and draw a trend curve of the temperature changing along with time.
5. The operating method of the temperature control device for the microfluidic chip according to any one of claims 1 to 4, wherein the temperature sensor on the upper surface of the semiconductor refrigerator collects the temperature of the microfluidic chip in real time, and when the temperature of the microfluidic chip is inconsistent with a target temperature, the temperature control development module adjusts the temperature of the other end by changing the rotation speed of the fan or adjusts the temperature difference between the two ends by changing the input voltage of the semiconductor refrigerator to control the temperature so that the temperature of the microfluidic chip reaches the target temperature; meanwhile, the required target temperature can be set through a personal computer or a user instrument display, and the temperature of the microfluidic chip can be displayed in real time through the personal computer or the user instrument display, and a corresponding temperature curve can be drawn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111351795.7A CN114100709A (en) | 2021-11-16 | 2021-11-16 | Temperature control device for micro-fluidic chip and working method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111351795.7A CN114100709A (en) | 2021-11-16 | 2021-11-16 | Temperature control device for micro-fluidic chip and working method thereof |
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| CN114100709A true CN114100709A (en) | 2022-03-01 |
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| CN202111351795.7A Pending CN114100709A (en) | 2021-11-16 | 2021-11-16 | Temperature control device for micro-fluidic chip and working method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070166204A1 (en) * | 2005-10-05 | 2007-07-19 | Dongqing Li | Disposable reactor module and detection system |
| JP2009109314A (en) * | 2007-10-30 | 2009-05-21 | Olympus Corp | Semiconductor device and its inspecting method |
| CN111650168A (en) * | 2020-06-24 | 2020-09-11 | 深圳市国赛生物技术有限公司 | Full-automatic micro-fluidic analyzer |
| CN213189043U (en) * | 2020-09-25 | 2021-05-14 | 中惠创智（深圳）无线供电技术有限公司 | Wireless power supply's refrigeration cup |
| CN214620235U (en) * | 2020-09-30 | 2021-11-05 | 珠海莲腾清洁能源有限公司 | Intelligent temperature control cooling equipment |
-
2021
- 2021-11-16 CN CN202111351795.7A patent/CN114100709A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070166204A1 (en) * | 2005-10-05 | 2007-07-19 | Dongqing Li | Disposable reactor module and detection system |
| JP2009109314A (en) * | 2007-10-30 | 2009-05-21 | Olympus Corp | Semiconductor device and its inspecting method |
| CN111650168A (en) * | 2020-06-24 | 2020-09-11 | 深圳市国赛生物技术有限公司 | Full-automatic micro-fluidic analyzer |
| CN213189043U (en) * | 2020-09-25 | 2021-05-14 | 中惠创智（深圳）无线供电技术有限公司 | Wireless power supply's refrigeration cup |
| CN214620235U (en) * | 2020-09-30 | 2021-11-05 | 珠海莲腾清洁能源有限公司 | Intelligent temperature control cooling equipment |
Non-Patent Citations (1)
| Title |
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| 熊凌鹄等: "纸基芯片温控系统仿真与分析", 《液压与气动》 * |
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Application publication date: 20220301 |