CN114094031A - Display panel, manufacturing method and display device - Google Patents
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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Abstract
The application provides a display panel, a manufacturing method of the display panel and a display device, wherein the display panel comprises a hole digging area and a blocking area, the blocking area is arranged around the periphery of the blocking area, the blocking area comprises a substrate, a plurality of insulating isolation columns, a light emitting layer and a cathode layer, the insulating isolation columns are formed on the substrate and arranged at intervals, the light emitting layer is located between the insulating isolation columns, and the cathode layer is formed on one side, far away from the substrate, of the insulating isolation columns. In the display panel of this application, through the design of insulating barrier column, the GDSH that can avoid digging hole district electrochemical corrosion to lead to is bad to, can avoid transmitting water oxygen, resist the bad emergence of GDSH.
Description
Technical Field
The present disclosure relates to the field of display, and in particular, to a display panel, a method for manufacturing the display panel, and a display device.
Background
In order to ensure the reliability of the package and prevent the ingress of water and oxygen from the AA hole region, usually, an isolation pillar/trench is designed in the AA hole region to block the EL material. However, this design makes the separation column form a "bridge," and establishes a current path of "cathode-separation column (Al) -cathode", which results in electrochemical corrosion under the combined action of a small amount of water vapor and electricity at the edge of the AA hole, and thus GDSH (water vapor oxidation in the open pore region due to cracks, scratches, top damage, etc. caused by packaging or external force).
Disclosure of Invention
In view of the above, the present application provides a display panel, a method for manufacturing the display panel, and a display device.
The display panel of the embodiment of the application comprises a hole digging area and a blocking area, wherein the blocking area is arranged around the periphery of the blocking area, the blocking area comprises a substrate, a plurality of insulation isolation columns, a light emitting layer and a cathode layer, the insulation isolation columns and the light emitting layer are arranged on the same layer and are multiple in the same layer, the insulation isolation columns are formed on the substrate and are arranged at intervals, the light emitting layer is located between the insulation isolation columns, and the cathode layer is formed on one side of the substrate away from the insulation isolation columns.
In some embodiments, the insulating isolation pillar forms an opening facing a first direction, and the light emitting layer partially extends into the opening.
In some embodiments, the insulating isolation pillar includes an inorganic layer forming an opening facing a first direction, and the light emitting layer partially extends into the opening.
In some embodiments, the insulating isolation pillar further includes a planarization layer and/or a pixel definition layer, the planarization layer or the pixel definition layer being formed on the inorganic layer.
In some embodiments, the display panel further includes a gate layer formed on the substrate and between the insulation isolation pillars, and the cathode layer is formed on the gate layer.
In some embodiments, the base includes a base substrate, a buffer layer, a first insulating layer, and a second insulating layer sequentially stacked in a second direction.
The display device according to the embodiment of the present application includes the display panel described above.
The method for manufacturing the display panel comprises the following steps:
providing a substrate;
forming an inorganic layer and a plurality of gate layers arranged at intervals on the substrate;
masking the inorganic layer to form a mask layer;
carrying out dry etching treatment on the inorganic layer to form isolation columns arranged at intervals;
removing the mask layer through a stripping process;
removing the gate layer by wet etching treatment of the gate layer to obtain an insulating isolation column;
forming a light emitting layer on the substrate; and
and forming a cathode layer on the insulation isolation column.
In some embodiments, after the removing the mask layer by the lift-off process to obtain the insulating isolation pillar, the manufacturing method further includes:
forming a pixel defining layer or a planarization layer on the inorganic layer.
The method for manufacturing the display panel comprises the following steps:
providing a substrate;
forming an inorganic layer and a plurality of gate layers arranged at intervals on the substrate;
masking the inorganic layer to form a mask layer;
carrying out dry etching treatment on the inorganic layer to form isolation columns arranged at intervals;
removing the mask layer through a stripping process;
forming a pixel defining layer or a planarization layer on the inorganic layer to form the insulating spacers
Performing wet etching treatment on the inorganic layer to remove and form an opening;
forming a light emitting layer on the gate layer, the light emitting layer at least partially protruding into the opening; and
and forming a cathode layer on the insulation isolation column.
In the display panel, the display device and the manufacturing method of the display panel, the design that the insulating isolation columns are arranged on the periphery of the middle of the hole digging area enables the hole digging area to be capable of isolating electric signals, so that the defect of GDSH caused by electrochemical corrosion of the hole digging area is improved, and the insulating isolation columns can isolate water and oxygen and resist the defect of GDSH.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic plan view of a display panel according to an embodiment of the present application.
Fig. 2 is a partial cross-sectional schematic view of a barrier region of an embodiment of the present application.
Fig. 3 is a schematic partial cross-sectional view of a barrier region of an embodiment of the present application.
Fig. 4 is a schematic partial cross-sectional view of a barrier region of an embodiment of the present application.
Fig. 5 is a schematic flow chart illustrating a method for manufacturing a display panel according to an embodiment of the present application.
Fig. 6 is a schematic view of a scene of a method for manufacturing a display panel according to an embodiment of the present application.
Fig. 7 is a schematic flow chart illustrating a method for manufacturing a display panel according to an embodiment of the present invention.
Fig. 8 is a schematic flow chart illustrating a method for manufacturing a display panel according to an embodiment of the present invention.
Fig. 9 is a schematic view of a scene of a method for manufacturing a display panel according to an embodiment of the present application.
Description of the main element symbols:
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The following disclosure provides many different embodiments or examples for implementing different features of the application. To simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.
In the reliability test with water vapor participation of the OLED display screen, GDSH (water vapor oxidation of an opening area caused by defects of cracks, scratches, top damages and the like caused by packaging or external force) can occur in a certain running (electrifying) time, and GDSH defect does not occur in a storage test (power-off reliability test with water vapor participation) in the same time. According to the difference of reliability results in the power-on and power-off states, the situation that the conventional metal isolation column cannot completely block the conduction of electricity is judged, and a conduction mode of cathode-isolation column (Al) -isolation column is formed, so that an AA hole area is electrified. On the other hand, some chemical substances of Pol (polaroid) in the AA Hole area migrate along the AA Hole section under the action of water vapor; under the action of an AA hole area electric field, water vapor and chemical substances generate electrochemical reaction between an evaporation material (EV layer) and an encapsulation film layer (EN layer) of the OLED screen, so that the encapsulation fails, and further the poor GDSH is caused.
Referring to fig. 1 and fig. 2, a display panel 100 is provided. The display panel 100 of the embodiment of the application includes a hole digging region 20 and a blocking region 10, the blocking region 10 is disposed around a periphery of the hole digging region 20, the blocking region 10 includes a substrate 12, a plurality of insulating isolation pillars 14, a light emitting layer 16 and a cathode layer 18, the plurality of insulating isolation pillars 14 are formed on the substrate and disposed at intervals, the light emitting layer 16 is located between the insulating isolation pillars 14, and the cathode layer 18 is formed on one side of the insulating isolation pillars 14 away from the substrate 12.
In the display panel 100 of the present application, by the design of disposing the insulating isolation pillars 14 in the barrier region 10, the barrier region 10 can isolate the electrical signal of the dug hole region 20, thereby improving the GDSH failure caused by the electrochemical corrosion of the dug hole region 20, and isolating the dug hole region 20 from transmitting water and oxygen to resist the GDSH failure.
Specifically, the display panel 100 may be an Organic Light Emitting Diode (OLED) display panel 100, and the OLED has the characteristics of self-luminescence, no need of a backlight source, high contrast, thin thickness, wide viewing angle, fast response speed, applicability to a flexible panel, wide use temperature range, simple structure and manufacturing process, and the like.
Specifically, the display panel 100 includes a blocking region 10, a hole digging region 20 and a display region 30, the blocking region 10 is formed between the display region 30 and the hole digging region 20, and the blocking region 10 is used for blocking the display region 30 and the hole digging region 20 to prevent the display region 30 from having poor GDSH due to the water and oxygen entering the display region 30 from the hole digging region 20. Wherein the cutout 20 may be circular, square, or other regular or irregular patterns.
The base 12 may include a base substrate, a buffer layer, a first insulating layer, and a second insulating layer, which are sequentially stacked.
The light-emitting layer 16 may be made of an organic light-emitting material. The plurality of light emitting layers 16 may be disposed on the substrate 12 at intervals along the first direction. The first direction is a direction parallel to the substrate 12, and the second direction is perpendicular to the first direction, that is, the second direction is perpendicular to the substrate 12.
The light emitting layer 16 and the insulating spacers 14 are located at the same layer, and the insulating spacers 14 have a thickness greater than that of the light emitting layer 16, so that the cathode layer 18 can be better separated from the light emitting layer 16. For example, in some embodiments, the thickness of the insulating isolation pillars 14 is not less than the sum of the film thicknesses of the light emitting layer 16 and the cathode layer 18. For example, the thickness of the insulating spacers 14 is 1 micron to 10 microns perpendicular to the substrate 12. It can be understood that, because the insulating isolation column 14 is disposed on the film layer where the light emitting layer 16 is located, and the thickness of the insulating isolation column is not less than the sum of the thicknesses of the film layers of the light emitting layer 16 and the cathode layer 18, for example, the thickness of the insulating isolation column 14 is thicker than the thickness of the cathode layer 18, at this time, the light emitting layer 16 and the cathode layer 18 can be isolated, and when the display panel 100 is collided, a certain supporting function can be played, so that the cathode layer 18 and the light emitting layer 16 can be protected, the oxidation of the cathode layer by external water and oxygen can be prevented, the hole digging region 20 is prevented from entering the display region 30, and the display region 30 is prevented from having poor GDSH.
Referring to fig. 2-4, further, the cross-sectional shape of the insulating isolation pillar 14 in the direction perpendicular to the substrate 12 is one or more of the following shapes: is in a T-shaped or umbrella-shaped pattern. Of course, other irregular patterns of the insulating isolation pillars 14 with a width at the upper bottom larger than that at the lower bottom may be provided as required, that is, any structure is available to facilitate the disconnection of the cathode material. For example, an inverted structure having a wide top and a narrow bottom may be provided. Of course, the material of the cathode layer 18 disposed above the insulating isolation pillars 14 may be removed as needed so as not to affect the entire cathode layer 18, and this is not limited herein. The width of the cross-sectional shape of the insulating isolation pillars 14 may be set according to actual needs, for example, the distance between the edge of the opening and the light-emitting layer 16 and the cathode layer 18.
The material of the insulating isolation pillar 14 may be selected as needed, and is not limited herein. Moreover, the process of manufacturing the insulating isolation pillar 14 may be the insulating isolation pillar 14 manufactured separately, or may be manufactured together with other films to simplify the manufacturing process.
Referring further to fig. 3 and 4, in some embodiments, the insulating spacers 14 form openings 141 facing the first direction, and the light emitting layer 16 partially extends into the openings 141.
It should be noted that the first direction is perpendicular to the second direction, where the first direction may be a horizontal direction and the second direction is a vertical direction.
In this way, the light-emitting layer 16 can be isolated from the cathode layer 18 by the light-emitting layer 16 at least partially extending into the opening 141, and the light-emitting layer 16 and the cathode layer 18 are prevented from being connected during the formation process.
Further, in some embodiments, the insulating isolation pillar 14 includes an inorganic layer 142, the inorganic layer 142 forms an opening 141 facing the first direction, and the light emitting layer 16 partially protrudes into the opening 141.
The inorganic layer 142 may be made of a non-conductive insulating material, and the inorganic layer 142 may include, but is not limited to, an interlayer dielectric ILD, a second insulating layer GI2, and the like. For example, in the present application, the inorganic layer 142 may be an interlayer dielectric ILD. Also, the opening 141 formed by the inorganic layer 142 may be obtained by an etching process.
Referring to fig. 3 and 4, in some embodiments, the insulating spacers 14 further include a planarization layer PLN and/or a pixel definition layer PDL, and the planarization layer PLN or the pixel definition layer PDL is formed on the inorganic layer 142.
In some embodiments, the display panel 100 further includes a gate layer 13 formed on the substrate 12 and between the insulating isolation pillars 14, and the cathode layer 18 is formed on the gate layer 13.
The embodiment of the present application also provides a display device, which includes the display panel 100 of the above embodiment.
In the display device of the present application, the electrical signal of the dug hole region 20 can be isolated by the design of the insulating isolation pillars 14 in the isolation region 10, so that the GDSH defect caused by the electrochemical corrosion of the dug hole region 20 can be improved, and the GDSH defect of the display region caused by the transmission of water and oxygen to the display region 30 by the dug hole region 20 can be avoided.
The display device may be, for example, any of various types of computer system apparatuses that are mobile or portable and perform wireless communication. Specifically, the display device may be a mobile phone or a smart phone (e.g., an iPhone-based phone), a Portable game device (e.g., Nintendo DS, PlayStation Portable, game Advance, iPhone), a tablet computer, a Portable internet device, a data storage device, etc., and the display device 100 may also be other wearable devices (e.g., a smart band, a smart watch, AR glasses, VR glasses, etc.). The display panel 100 may be a display screen, and the display panel 100 may be a dug-hole screen.
In some cases, the display device may perform a variety of functions (e.g., playing music, displaying video, storing pictures, and receiving and sending telephone calls). The display device may be a portable device such as a cellular telephone, media player, other handheld device, wrist watch device, earpiece device or other compact portable device, if desired.
Referring to fig. 5, a method for manufacturing a display panel 100 according to an embodiment of the present invention includes:
01, providing a substrate;
02, forming an inorganic layer and a plurality of gate layers arranged at intervals on a substrate;
03, performing mask treatment on the inorganic layer to form a mask layer;
04, carrying out dry etching treatment on the inorganic layer to form isolation columns arranged at intervals;
05, removing the mask layer through a stripping process;
06, carrying out wet etching treatment on the grid layer to obtain an insulating isolation column;
07 forming a light emitting layer on a substrate; and
and 08, forming a cathode layer on the insulation isolation column.
In this way, in the manufacturing method of the embodiment, before the display panel 100 is formed, the light emitting layer 16 is disposed at the position where the gate layer 13 is etched, and the cathode layer 18 is disposed on the insulating isolation pillar 14, so that the light emitting layer 16 can be isolated from the cathode layer 18 by the insulating isolation pillar 14, thereby isolating an electrical signal, improving the occurrence of poor GDSH caused by electrochemical corrosion of the hole digging region 20, and the insulating isolation pillar 14 can prevent water and oxygen from being transmitted from the hole digging region 20 to the display region 30, thereby preventing the display panel 100 from having a GDSH phenomenon. In addition, a new mask is not needed, and the manufacturing process is simple.
Referring to fig. 6, the base 12 may include a substrate, a buffer layer, a first insulating layer, and a second insulating layer, which are sequentially stacked.
The gate layer 13 may include a first gate layer and/or a second gate layer. For example, in the present embodiment, the gate layer may be a second gate layer. The gate layer 13 is a pattern as a transition.
The mask layers 15 and the gate electrode layers 13 are alternately arranged in the first direction, and partially overlap in the second direction. The mask layer 15 serves to prevent portions of the inorganic layer 142 corresponding to the second direction from being etched. That is, at step 04, in the second direction, a region of the inorganic layer 142 corresponding to the mask layer 15 may remain, while the remaining region is etched, so as to form the insulating isolation pillars 14, and each of the insulating isolation pillars 14 corresponds to the mask layer 15 in the second direction.
The dry etching is a technique of etching a thin film by using plasma. When the gas is present in the form of a plasma, it has two characteristics: on one hand, the chemical activity of the gases in the plasma is much stronger than that of the gases in a normal state, and the gases can react with the materials more quickly by selecting proper gases according to the difference of the etched materials, so that the aim of etching removal is fulfilled; on the other hand, the electric field can be used for guiding and accelerating the plasma, so that the plasma has certain energy, and when the plasma bombards the surface of the etched object, atoms of the etched object material can be knocked out, thereby achieving the purpose of etching by using physical energy transfer.
Wet etching is a technique of immersing an etching material in an etching solution to perform etching. In step 06, the gate electrode layer 13 is treated by wet etching so that the gate electrode layer 13 is dissolved in a wet etching solution, thereby allowing the inorganic layer 142 to form the insulating isolation pillars 14.
In step 07, a light-emitting layer 16 is formed in the etched region of the gate electrode layer 13. In this way, the light emitting layer 16 can partially extend into the opening 141 of the insulating isolation pillar 14, thereby preventing the subsequent light emitting layer 16 from being connected to the cathode layer 18.
Referring to fig. 7, in some embodiments, before step 06, the manufacturing method further includes:
09, a pixel defining layer or a planarization layer is formed on the inorganic layer.
As such, the insulating isolation pillar 14 may be composed of the inorganic layer 142 and the pixel defining layer PDL, or the insulating isolation pillar 14 may be composed of the inorganic layer 142 and the planarization layer PLN.
Referring to fig. 8 and fig. 9, an embodiment of the present invention further provides a method for manufacturing a display panel 100, including:
10, providing a substrate;
20, forming an inorganic layer and a plurality of gate layers arranged at intervals on a substrate;
30, carrying out mask treatment on the inorganic layer to form a mask layer;
40, carrying out dry etching treatment on the inorganic layer to form isolation columns arranged at intervals;
50, removing the mask layer through a stripping process;
and 60, forming a pixel defining layer or a planarization layer on the inorganic layer to form the insulating isolation pillars.
70, carrying out wet etching treatment on the inorganic layer to form an opening;
80 forming a light emitting layer on the gate layer, the light emitting layer at least partially protruding into the opening;
and 90, forming a cathode layer on the insulation isolation columns.
In this way, in the manufacturing method of the embodiment, before the display panel 100 is formed, the light emitting layer 16 is disposed at the position where the inorganic layer 142 is etched before the display panel 100 is formed, and the cathode layer 18 is disposed on the insulating isolation pillar 14 before the display panel 100 is formed, so that the light emitting layer 16 can be isolated from the cathode layer 18 by the insulating isolation pillar 14, thereby isolating an electrical signal, and improving the occurrence of poor GDSH caused by electrochemical corrosion of the hole digging region 20, and the insulating isolation pillar 14 can prevent water and oxygen from being transmitted from the hole digging region 20 to the display region 30, thereby preventing the display panel 100 from having a GDSH phenomenon. In addition, a new mask is not needed, and the manufacturing process is simple.
In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A display panel is characterized by comprising a hole digging area and a blocking area, wherein the blocking area is arranged around the periphery of the blocking area and comprises a substrate, a plurality of insulating isolation columns, a light emitting layer and a cathode layer, the insulating isolation columns and the light emitting layer are arranged on the same layer, the insulating isolation columns are formed on the substrate and arranged at intervals, the light emitting layer is located between the insulating isolation columns, and the cathode layer is formed on one side, far away from the substrate, of the insulating isolation columns.
2. The display panel according to claim 1, wherein the insulating spacers form an opening facing a first direction, and the light emitting layer partially protrudes into the opening.
3. The display panel according to claim 2, wherein the insulating spacers comprise an inorganic layer forming an opening facing a first direction, and wherein the light emitting layer partially protrudes into the opening.
4. The display panel according to claim 3, wherein the insulating spacers further comprise a planarization layer and/or a pixel definition layer, and wherein the planarization layer or the pixel definition layer is formed on the inorganic layer.
5. The display panel of claim 1, further comprising a gate layer formed on the substrate and between the insulating isolation pillars, wherein the cathode layer is formed on the gate layer.
6. The display panel according to claim 1, wherein the base includes a base substrate, a buffer layer, a first insulating layer, and a second insulating layer, which are sequentially stacked in the second direction.
7. A display device characterized by comprising the display panel according to any one of claims 1 to 6.
8. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a substrate;
forming an inorganic layer and a plurality of gate layers arranged at intervals on the substrate;
masking the inorganic layer to form a mask layer;
carrying out dry etching treatment on the inorganic layer to form isolation columns arranged at intervals;
removing the mask layer through a stripping process;
performing wet etching treatment on the gate layer to obtain an insulating isolation column;
forming a light emitting layer on the substrate; and
and forming a cathode layer on the insulation isolation column.
9. The method of claim 8, wherein after the removing the mask layer by a lift-off process, the method further comprises:
a pixel defining layer or a planarization layer is formed on the inorganic layer.
10. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a substrate;
forming an inorganic layer and a plurality of gate layers arranged at intervals on the substrate;
masking the inorganic layer to form a mask layer;
carrying out dry etching treatment on the inorganic layer to form isolation columns arranged at intervals;
removing the mask layer through a stripping process;
forming a pixel defining layer or a planarization layer on the inorganic layer to form the insulating isolation pillar;
performing wet etching treatment on the inorganic layer to remove and form an opening;
forming a light emitting layer on the gate layer, the light emitting layer at least partially protruding into the opening; and
and forming a cathode layer on the insulation isolation column.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2024051074A1 (en) * | 2022-09-08 | 2024-03-14 | 合肥维信诺科技有限公司 | Display panel and display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904208A (en) * | 2019-03-19 | 2019-06-18 | 京东方科技集团股份有限公司 | Organic light emitting display and preparation method thereof, display device |
| CN110783491A (en) * | 2019-11-26 | 2020-02-11 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| CN110854304A (en) * | 2019-11-20 | 2020-02-28 | 云谷（固安）科技有限公司 | Preparation method of display panel |
| CN110890475A (en) * | 2019-11-28 | 2020-03-17 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| KR20200139853A (en) * | 2019-06-04 | 2020-12-15 | 삼성디스플레이 주식회사 | Organic light emitting display device |
| CN112802770A (en) * | 2021-01-14 | 2021-05-14 | 合肥维信诺科技有限公司 | Etching amount detection method and display panel mother board |
-
2021
- 2021-11-19 CN CN202111376425.9A patent/CN114094031A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904208A (en) * | 2019-03-19 | 2019-06-18 | 京东方科技集团股份有限公司 | Organic light emitting display and preparation method thereof, display device |
| KR20200139853A (en) * | 2019-06-04 | 2020-12-15 | 삼성디스플레이 주식회사 | Organic light emitting display device |
| CN110854304A (en) * | 2019-11-20 | 2020-02-28 | 云谷（固安）科技有限公司 | Preparation method of display panel |
| CN110783491A (en) * | 2019-11-26 | 2020-02-11 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| CN110890475A (en) * | 2019-11-28 | 2020-03-17 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| CN112802770A (en) * | 2021-01-14 | 2021-05-14 | 合肥维信诺科技有限公司 | Etching amount detection method and display panel mother board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024051074A1 (en) * | 2022-09-08 | 2024-03-14 | 合肥维信诺科技有限公司 | Display panel and display device |
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