KR20200139853A - Organic light emitting display device - Google Patents

Abstract

Provided is an organic light emitting display device which comprises: a substrate including an opening area, a peripheral area surrounding the opening area, and a display area surrounding the peripheral area, and having a first groove having an extended lower portion formed in the peripheral area and an opening formed in the opening area; a light emitting structure disposed in the display area on the substrate; a blocking structure disposed in the peripheral area on the substrate and surrounding the opening; and an organic insulating pattern covering the blocking structure in the peripheral area on the substrate and having a first color. Accordingly, visibility of the organic light emitting display device can be improved.

Description

Organic light emitting display device {ORGANIC LIGHT EMITTING DISPLAY DEVICE}

The present invention relates to an organic light emitting display device. More specifically, the present invention relates to an organic light emitting display device including a substrate having an opening formed therein.

Flat panel displays are used as a display device to replace a cathode ray tube display device due to characteristics such as light weight and thinness. Representative examples of such a flat panel display include a liquid crystal display and an organic light emitting display.

The organic light emitting diode display may include a display area in which an image is displayed and a non-display area in which a gate driver, a data driver, wires, and a functional module (eg, a camera module, a motion detection sensor, etc.) are disposed. Recently, an organic light emitting display device has been developed in which an opening is formed in a part of the display area and the functional module is disposed in the opening. In addition, blocking patterns for blocking moisture, moisture, etc. that may penetrate into the display area adjacent to the functional module may be formed outside the portion where the functional module is disposed. Furthermore, a window member may be disposed on the uppermost portion of the organic light emitting diode display, and a black matrix may be disposed on a bottom surface of the window member to overlap the blocking patterns. Here, the black matrix may be disposed to prevent the blocking patterns from being visually recognized by a user of the OLED display. However, when the black matrix is disposed under the window member, the manufacturing cost due to the addition of the alignment process between the black matrix and the blocking patterns and the addition of the black matrix may increase, and the step difference of the black matrix may be increased. May cause adhesion failure.

An object of the present invention is to provide an organic light emitting display device including a substrate having an opening formed therein.

However, the present invention is not limited by the above object, and may be variously extended without departing from the spirit and scope of the present invention.

In order to achieve the object of the present invention described above, the organic light emitting display device according to exemplary embodiments of the present invention includes an opening area, a peripheral area surrounding the opening area, and a display area surrounding the peripheral area, A substrate having a first groove formed in the peripheral region and an opening formed in the opening region, a light emitting structure disposed in the display region on the substrate, and disposed in the peripheral region on the substrate, and surrounding the opening It may include a blocking structure and an organic insulating pattern having a first color and covering the blocking structure in the peripheral region on the substrate.

In example embodiments, the organic insulating pattern may be disposed in the first groove.

In example embodiments, the organic insulating pattern may block or absorb light incident from the outside.

In example embodiments, the first color of the organic insulating pattern may be black.

In example embodiments, the organic insulating pattern may not overlap the light emitting structure.

In example embodiments, a functional module may be further included in the opening of the substrate.

In example embodiments, the functional module may include a camera module, a face recognition sensor module, a pupil recognition sensor module, an acceleration sensor module, a geomagnetic sensor module, a proximity sensor module, an infrared sensor module, and an illuminance sensor module.

In example embodiments, a side surface of the organic insulating pattern positioned at a boundary between the peripheral region and the opening region may directly contact the functional module.

In example embodiments, the first groove may surround the opening.

In example embodiments, the first groove may be positioned between the blocking structure and the opening when the organic light emitting display device is viewed in a cross-sectional direction.

In example embodiments, the first groove may have a planar shape of a ring when the organic light emitting display device is viewed in a planar direction.

In example embodiments, the substrate is a first organic film layer, a first barrier layer disposed on the first organic layer, a second organic layer disposed on the first barrier layer, and having a trench in the peripheral area. A second barrier layer disposed on the film layer and the second organic layer, and having a protrusion protruding from the trench to the inside of the trench, and having an opening defined by the protrusion may include a second barrier layer.

In example embodiments, the protrusion of the second barrier layer faces the first protrusion and the first protrusion positioned adjacent to the opening of the substrate, and in a direction from the opening region to the peripheral region. It may include a second protrusion positioned spaced apart from the first protrusion.

In example embodiments, the trench of the second organic film layer, the protrusion of the second barrier layer, and the opening of the second barrier layer may be defined as a first groove in which the lower portion of the substrate is extended.

In example embodiments, the light emitting structure may include a lower electrode, an emission layer disposed on the lower electrode, and an upper electrode disposed on the emission layer.

In example embodiments, the emission layer may extend in a direction from the display area to the peripheral area on the substrate, and the emission layer may be short-circuited at a portion in which the first groove is formed.

In example embodiments, the upper electrode may extend in a direction from the display area to the peripheral area on the substrate, and the upper electrode may be short-circuited at a portion in which the first groove is formed.

In example embodiments, each of the emission layer and the upper electrode may be disposed in at least a part of the inside of the first groove.

In example embodiments, each of the emission layer and the upper electrode may be disposed on the blocking structure.

In example embodiments, a thin film encapsulation structure disposed on the light emitting structure and a touch screen structure disposed in the display area on the thin film encapsulation structure may further be included.

In example embodiments, the thin film encapsulation structure includes a first thin film encapsulation layer including an inorganic material, a second thin film encapsulation layer disposed on the first thin film encapsulation layer and including an organic material, and the second thin film. It is disposed on the encapsulation layer and may include a third thin film encapsulation layer including an inorganic material.

In example embodiments, each of the first thin film encapsulation layer and the third thin film encapsulation layer extends in a direction from the display area to the peripheral area on the substrate, and is continuously in the portion where the first groove is formed. Can be placed.

In example embodiments, the touch screen structure includes a first insulating layer disposed in the display area on the third thin film encapsulation layer, a touch screen electrode disposed on the first insulating layer, and the touch screen electrode. A second insulating layer disposed, a touch screen connecting electrode disposed on the second insulating layer, and a protective insulating layer disposed on the touch screen connecting electrode may be included.

In example embodiments, the first insulating layer may extend in a direction from the display area to the peripheral area on the second thin film encapsulation layer, and may be continuously disposed in a portion where the first groove is formed.

In example embodiments, the first thin film encapsulation layer, the third thin film encapsulation layer, the first insulating layer, and the first insulating layer are disposed on the blocking structure, and the first insulating layer and the first insulating layer are disposed. The organic insulating pattern may be disposed between the 2 insulating layers.

In example embodiments, the second insulating layer may contact an upper surface of the first insulating layer in the display area, and may contact an upper surface of the organic insulating pattern in the peripheral area.

In example embodiments, the substrate further includes a second groove formed between the first groove and the opening of the substrate, wherein at least one lower portion extends, and the first groove surrounds the second groove. It can be wrapped.

In example embodiments, the substrate may further include at least one third groove surrounding the first groove.

In example embodiments, the third groove may surround the blocking structure.

In example embodiments, a polarizing layer disposed on the display area and a peripheral area on the substrate, and a window member disposed on the polarizing layer may further be included.

In example embodiments, the polarizing layer may have an opening overlapping the opening of the substrate.

In example embodiments, an adhesive layer disposed between the polarizing layer and the window member may be further included.

Since the organic light emitting display device according to the exemplary embodiments includes the organic insulating pattern having the first color, the organic light emitting display device includes first to third grooves, a blocking structure, and first to third grooves. It is possible to prevent the user from visually recognizing the light emitting layer and the upper electrode disposed inside each of the elements. Accordingly, the visibility of the organic light emitting display device may be improved.

However, the effects of the present invention are not limited to the above-described effects, and may be variously extended without departing from the spirit and scope of the present invention.

1 is a perspective view illustrating an organic light emitting display device according to exemplary embodiments of the present invention.
2 is a plan view illustrating the organic light emitting display device of FIG. 1.
3 and 4 are perspective views illustrating an opening formed in the organic light emitting display device of FIG. 1.
5 is a partially enlarged plan view illustrating an enlarged area "A" of the organic light emitting diode display of FIG. 2.
6 is a block diagram illustrating an external device electrically connected to the organic light emitting display device of FIG. 1.
7 is a cross-sectional view of the organic light emitting diode display of FIG. 5 taken along line II′.
8 is a plan view illustrating a touch screen structure included in the organic light emitting display device of FIG. 7.
9 to 19 are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to exemplary embodiments of the present invention.

Hereinafter, organic light-emitting displays according to exemplary embodiments of the present invention and a method of manufacturing the organic light-emitting display device will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same or similar reference numerals are used for the same or similar components.

1 is a perspective view illustrating an organic light emitting display device according to exemplary embodiments of the present invention, FIG. 2 is a plan view illustrating the organic light emitting display device of FIG. 1, and FIGS. 3 and 4 are It is a perspective view for explaining the formed opening, FIG. 5 is a partially enlarged plan view showing an enlarged area "A" of the organic light emitting display device of FIG. It is a block diagram for explanation.

1, 2, and 5, the organic light emitting display device 100 may include a substrate (eg, the substrate 110 of FIG. 7), a functional module 700, an organic insulating pattern 490, and the like. have. Here, a first groove 930, a second groove 950, and a third groove 970 may be formed in the substrate.

As shown in FIG. 2, the organic light emitting display device 100 may include a display area 10, an opening area 20, a peripheral area 30, and a pad area 40. Here, the peripheral region 30 may substantially surround the opening region 20, and the display region 10 may substantially surround the peripheral region 30. In example embodiments, the first groove 930, the second groove 950, and the third groove 970 may be located in the peripheral region 30, and the first groove 930 and the second groove An organic insulating pattern 490 may be disposed in the peripheral region 30 on the 950 and the third groove 970. In addition, the functional module 700 may be disposed in the opening area 20, and the organic insulating pattern 490 may surround the functional module 700. Optionally, the display area 10 may not completely surround the peripheral area 30.

However, although the shape of each of the opening area 20 and the peripheral area 30 of the present invention has been described as having a circular planar shape, the shape is not limited thereto. For example, the shape of each of the opening area 20 and the peripheral area 30 is a triangular planar shape, a rhombus planar shape, a polygonal planar shape, a square planar shape, a track-type planar shape, or an elliptical planar shape. You can have it.

3 and 4, the organic light emitting diode display 100 may have a first surface S1 on which an image is displayed and a second surface S2 opposite to the first surface S1. In addition, the organic light emitting display device 100 may include an opening 910 formed in the opening area 20. In example embodiments, the functional module 700 may be disposed in the opening 910. The pad area 40 may be located on one side of the display area 10. The organic light-emitting display device 100 may further include a plurality of pad electrodes, and the pad electrodes may be disposed in the pad area 40 on the substrate. The pad electrodes may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, and the like. These may be used alone or in combination with each other. In other exemplary embodiments, the pad electrodes may have a multilayer structure including a plurality of layers. The pad electrodes may be electrically connected to the external device 101 (see FIG. 6). In other example embodiments, the organic light emitting display device 100 may further include a bending area positioned between the display area 10 and the pad area 40. For example, the bending area may be bent in a first direction D1 parallel to the top surface of the organic light emitting display device 100, and the pad area 40 is formed on the bottom surface of the organic light emitting display device 100. It can also be located in

As illustrated in FIG. 6, the external device 101 and the organic light emitting display device 100 may be electrically connected through a flexible printed circuit board FPCB. For example, one side of the flexible printed circuit board may directly contact the pad electrodes, and the other side of the flexible printed circuit board may directly contact the external device 101. For example, the external device 101 may generate a data signal, a gate signal, a light emission control signal, a gate initialization signal, an initialization voltage, a power voltage, and the like. The external device 101 may provide the data signal, the gate signal, the emission control signal, the gate initialization signal, the initialization voltage, the power voltage, and the like to the organic light emitting display device 100 through the pad electrode. . In addition, a driving integrated circuit may be mounted on the flexible printed circuit board. Optionally, the driving integrated circuit may be mounted on the organic light emitting display device 100 adjacent to the pad electrode 470.

Referring back to FIGS. 1, 2, and 5, the display area 10 may include a plurality of sub-pixel areas (not shown). The plurality of sub-pixel areas may be entirely arranged in the display area 10 in a matrix form. A sub-pixel circuit (for example, the semiconductor device 250 of FIG. 7) may be disposed in each of the sub-pixel regions of the display region 10, and an organic light emitting diode (for example, FIG. The light emitting structure 200 of 7 may be disposed. An image may be displayed on the display area 10 through the sub-pixel circuit and the organic light emitting diode.

For example, first, second, and third sub-pixel circuits may be disposed in the sub-pixel regions, and first, second, and third organic light emitting diodes on the first to third sub-pixel circuits Can be placed. The first sub-pixel circuit may be connected to a first organic light-emitting diode capable of emitting red light, the second sub-pixel circuit may be connected to a second organic light-emitting diode capable of emitting green light, and the third sub-pixel circuit The pixel circuit may be connected to a third organic light emitting diode capable of emitting blue light.

In example embodiments, the first organic light emitting diode may be disposed to overlap with the first sub-pixel circuit, the second organic light emitting diode may be disposed to overlap with the second sub-pixel circuit, and 3 The organic light emitting diode may be disposed to overlap the third sub-pixel circuit. Optionally, the first organic light-emitting diode may be disposed to overlap with a part of the first sub-pixel circuit and a part of a sub-pixel circuit different from the first sub-pixel circuit, and the second organic light-emitting diode It may be disposed to overlap with a part of the sub-pixel circuit and a part of a sub-pixel circuit different from the second sub-pixel circuit, and the third organic light emitting diode may include a part of the third sub-pixel circuit and the third sub-pixel circuit. It may be disposed to overlap with a part of another sub-pixel circuit.

In other words, the first to third organic light emitting diodes are an RGB stripe method in which rectangles of the same size are sequentially arranged, and an S-stripe including a blue organic light emitting diode having a relatively large area. It may be arranged using a method, a WRGB method further including a white organic light emitting diode, a pentile method arranged in a repeating form of RG-GB, or the like.

In addition, at least one driving transistor, at least one switching transistor, at least one capacitor, and the like may be disposed in each of the plurality of sub-pixel regions.

However, although the shape of the display area 10 of the present invention has been described as having a rectangular planar shape, the shape is not limited thereto. For example, the shape of the display area 10 may have a triangular planar shape, a rhombus planar shape, a polygonal planar shape, a circular planar shape, a track-shaped planar shape, or an elliptical planar shape.

Referring again to FIGS. 2 and 5, the functional module 700 may be disposed in the opening 910. For example, the functional module 700 includes a camera module capable of capturing (or recognizing) an image of an object, a face recognition sensor module for detecting a user's face, a pupil recognition sensor module for detecting a user's pupils, and An acceleration sensor module and a geomagnetic sensor module that determines the movement of the light-emitting display device 100, a proximity sensor module and an infrared sensor module that detects proximity to the organic light-emitting display device 100, and brightness when left in a pocket or bag It may include an illuminance sensor module for measuring the degree of. In other exemplary embodiments, a vibration module indicating an incoming alarm, a speaker module outputting sound, and the like may be disposed in the opening 910.

A first groove 930, a second groove 950, and a third groove 970 may be located in the substrate positioned in the peripheral area 30. The second groove 950 may surround the functional module 700 (or the opening 910), the first groove 930 may surround the second groove 950, and the third groove 970 May surround the first groove 930. In other words, the first groove 930, the second groove 950, and the third groove 970 may be located apart from each other, and the diameter may be increased in order. In example embodiments, each of the first groove 930, the second groove 950, and the third groove 970 may have a planar shape of a ring. The first groove 930, the second groove 950, and the third groove 970 may function as a blocking pattern for blocking moisture and moisture permeation paths. In example embodiments, each of the first groove 930, the second groove 950, and the third groove 970 may have a shape in which the lower portion is extended (eg, an inverted step structure).

The organic insulating pattern 490 may be disposed to surround the functional module 700 in the peripheral region 30. In addition, the organic insulating pattern 490 may overlap with the first groove 930, the second groove 950, and the third groove 970, and the first groove 930, the second groove 950, and each of the It can be located inside of. The organic insulating pattern 490 may have a first color. For example, in order to prevent the first groove 930, the second groove 950, and the third groove 970 from being visually recognized by the user of the organic light emitting display device 100, the organic insulating pattern 490 is Can have 1 color. In other words, the organic insulating pattern 490 may block or absorb light incident from the outside, and the first color may be an opaque color (eg, black).

The organic light emitting display device 100 according to the exemplary embodiments of the present invention includes the organic insulating pattern 490 having the first color, and thus the first to third organic light emitting display devices 100 It is possible to prevent the grooves 930, 950, and 970 from being visually recognized.

Although it has been described that the organic light emitting display device 100 of the present invention includes one functional module 700 and one organic insulating pattern 490, the configuration of the present invention is not limited thereto. For example, in other exemplary embodiments, the organic light emitting display device 100 may include at least two functional modules 700 and at least two organic insulating patterns 490, and organic insulating patterns Each of 490 may surround each of the functional modules 700. In addition, first to third grooves 930, 950, and 970 having an expanded lower portion may be positioned under each of the organic insulating patterns 490.

7 is a cross-sectional view of the organic light-emitting display device of FIG. 5 taken along line II′, and FIG. 8 is a plan view illustrating a touch screen structure included in the organic light-emitting display device of FIG. 8.

7 and 8, the organic light emitting display device 100 includes a substrate 110, a semiconductor device 250, a planarization layer 270, a light emitting structure 200, a pixel defining layer 310, a thin film encapsulation structure ( 450), a touch screen structure 380, an organic insulating pattern 490, a functional module 700, a polarizing layer 430, an adhesive layer 590, a window member 600, and the like. Here, the substrate 110 may include a first organic film layer 111, a first barrier layer 112, a second organic film layer 113, and a second barrier layer 114. As the organic light-emitting display device 100 has the display area 10, the opening area 20, the peripheral area 30, and the pad area 40, the substrate 110 also has the display area 10 and the opening area ( 20), may be divided into a peripheral area 30 and a pad area 40. In addition, the semiconductor device 250 may include an active layer 130, a gate insulating layer 150, a gate electrode 170, an interlayer insulating layer 190, a source electrode 210 and a drain electrode 230, and , The light emitting structure 200 may include a lower electrode 290, a light emitting layer 330, and an upper electrode 340. Moreover, the thin film encapsulation structure 450 may include a first thin film encapsulation layer 451, a second thin film encapsulation layer 452 and a third thin film encapsulation layer 453, and the touch screen structure 380 is An insulating layer 390, a plurality of first touch screen electrodes 382, a plurality of second touch screen electrodes 384, a plurality of touch screen connection electrodes 386, a second insulating layer 395 and protection An insulating layer 410 may be included.

In example embodiments, the substrate 110 may further include first to third grooves 930, 950, and 970 formed in the peripheral region 30, and the first to third grooves 930 Each of the light emitting layer 330 and the upper electrode 340 may be spaced apart from each other within each of the 950 and 970. In other words, each of the light emitting layer 330 and the upper electrode 340 may be short-circuited inside each of the first to third grooves 930, 950, and 970. Accordingly, the organic light emitting display device 100 includes the light emitting layer 330 and the upper electrode 340 shorted in each of the first to third grooves 930, 950, and 970, thereby reducing moisture, moisture, etc. Penetration into the semiconductor device 250 and the light emitting structure 200 may be blocked. Further, the substrate 110 may include an opening 910 formed in the opening region 20, and a functional module 700 may be disposed in the opening 910 (see FIG. 18 ).

The first organic film layer 111 may be provided. The first organic film layer 111 may include an organic material having flexibility. For example, the first organic film layer 111 may include a random copolymer or a block copolymer. In addition, the first organic film layer 111 may have high transparency, a low coefficient of thermal expansion, and a high glass transition temperature. Since the first organic film layer 111 contains an imide group, it may have excellent heat resistance, chemical resistance, abrasion resistance, and electrical properties. In example embodiments, the first organic film layer 111 may include polyimide.

The first barrier layer 112 may be entirely disposed on the first organic film layer 111. The first barrier layer 112 may block moisture penetrating through the first organic film layer 111. The first barrier layer 112 may include an inorganic material having flexibility. In example embodiments, the first barrier layer 112 may include silicon oxide or silicon nitride. For example, the first barrier layer 112 is silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), silicon oxycarbide (SiOxCy), silicon carbonitride (SiCxNy), aluminum oxide (AlOx) , Aluminum nitride (AlNx), tantalum oxide (TaOx), hafnium oxide (HfOx), zirconium oxide (ZrOx), titanium oxide (TiOx), and the like.

The second organic film layer 113 may be entirely disposed on the first barrier layer 112. In example embodiments, the second organic film layer 113 may have first, second, and third trenches in the peripheral area 30. In other words, each of the first to third portions of the second organic film layer 113 positioned in the peripheral region 30 may be partially removed. For example, the first part may correspond to a part where the first groove 930 is located, the second part may correspond to a part where the second groove 950 is located, and the third part May correspond to a portion where the third groove 970 is located. Here, a width of each of the first to third trenches is defined as a first width W1 (see FIG. 11). Optionally, a part of the second organic film layer 113 positioned in the peripheral region 30 may be completely removed so that the second organic film layer 113 may have an opening in the peripheral region 30. In this case, the upper surface of the first barrier layer 112 may be exposed through the opening.

The second organic film layer 113 may include an organic material having flexibility. For example, the second organic layer 112 may include a random copolymer or a block copolymer. In example embodiments, the second organic film layer 113 may include polyimide.

The second barrier layer 114 may be entirely disposed on the second organic film layer 113. In example embodiments, the second barrier layer 114 may have first, second, and third openings in the peripheral region 30. In other words, the second barrier layer 114 includes first and second protrusions 116 and 117 (or tips) protruding inward of each of the first to third trenches on the first to third trenches. And may have the first to third openings defined by the first and second protrusions 116 and 117. For example, the first protrusion 116 may be located on the right side of each of the first to third openings, and the second protrusion 117 may be located on the left side of each of the first to third openings. have. In other words, the second protrusion 117 may face the first protrusion 116 and may be spaced apart from the first protrusion 116. Here, a width of each of the first to third openings of the second barrier layer 114 may have a second width W2 smaller than a width of the first width W1 (see FIG. 11 ). In addition, a space positioned under each of the first and second protrusions 116 and 117 may be defined as first and second spaces 118 and 119 (see FIG. 12 ). The first to third trenches of the second organic film layer 113, first and second protrusions 116 and 117 of the second barrier layer 114, and a first of the second barrier layer 114 The first to third openings may be defined as first to third grooves 930, 950, and 970 whose lower portions are formed in the substrate 110 located in the peripheral region 30. For example, each of the first to third grooves 930, 950, and 970 whose lower portion is extended may have an under-cut shape. Each of the first to third grooves 930, 950, and 970 may function as a blocking pattern capable of blocking moisture and/or moisture penetrating from the opening area 20 to the display area 10. In other exemplary embodiments, a plurality of grooves may be further formed between the first groove 930 and the second groove 950, and adjacent to the boundary between the display area 10 and the peripheral area 30. A plurality of grooves may be further formed between the positioned light emitting structure 200 and the third groove 970.

In exemplary embodiments of the present invention, since the organic light emitting display device 100 includes the first to third grooves 930, 950, and 970, a relatively large number of the first to the first to third grooves are expanded. Because of the three grooves 930, 950, and 970, the light emitting layer 330 and the upper electrode 340 can be easily short-circuited. In addition, by arranging a relatively large number of the first to third grooves 930, 950, and 970 whose lower portion is extended in the peripheral region 30, external impact or stress during the manufacturing process is displayed from the opening region 20. When it is transmitted to the substrate 110 in the direction toward the region 10, the amount of impact may be reduced by a relatively large number of the first to third grooves 930, 950, and 970 whose lower portions are expanded. Moreover, the first to third grooves 930, 950, and 970 with a relatively large number of lower portions are disposed in the peripheral region 30, so that the first thin film encapsulation layer 451 and the substrate are formed in the peripheral region 30. The contact area of the 110 may be relatively increased, and accordingly, the separation of the first thin film encapsulation layer 451 from the substrate 110 may be prevented.

The second barrier layer 114 may block moisture penetrating through the second organic film layer 113. The second barrier layer 114 may include an inorganic material having flexibility. In example embodiments, the second barrier layer 114 may include silicon oxide or silicon nitride.

Accordingly, the substrate 110 including the first organic film layer 111, the first barrier layer 112, the second organic film layer 113, and the second barrier layer 114 may be disposed.

However, although it has been described that the substrate 110 has four layers, the configuration of the present invention is not limited thereto. For example, in other exemplary embodiments, the substrate 110 may include a single layer or at least two layers.

In other exemplary embodiments, the substrate 110 may include a transparent or opaque material. For example, the substrate 110 is a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a fluorine-doped quartz substrate, a soda-lime glass substrate, an alkali-free (non-alkali) substrate. alkali) glass substrates, etc. may be included.

A buffer layer (not shown) may be disposed on the substrate 110 (eg, the second barrier layer 114). For example, the buffer layer may be entirely disposed in the display area 10 on the substrate 110. Optionally, it may be disposed in the peripheral region 30 on the substrate 110. In this case, the buffer layer may include an opening overlapping the opening of the second barrier layer 114. The buffer layer can prevent the diffusion of metal atoms or impurities from the substrate 110 to the semiconductor device 250 and the light emitting structure 200, and can substantially control the transfer rate of heat during the crystallization process for forming the active layer. As a result, a uniform active layer can be obtained. In addition, when the surface of the substrate 110 is not uniform, the buffer layer may serve to improve the flatness of the surface of the substrate 110. Depending on the type of substrate 110, two or more buffer layers may be provided on the substrate 110 or the buffer layer may not be disposed. For example, the buffer layer may include an organic material or an inorganic material.

The active layer 130 may be disposed in the display area 10 on the substrate 110. The active layer 130 may include an oxide semiconductor, an inorganic semiconductor (eg, amorphous silicon, poly silicon), an organic semiconductor, or the like. The active layer 130 may have source and drain regions.

A gate insulating layer 150 may be disposed on the active layer 130. The gate insulating layer 150 may cover the active layer 130 in the display area 10 on the substrate 110 and may not be disposed in the peripheral area 30. That is, the gate insulating layer 150 may be disposed only in the display area 10 on the substrate 110. For example, the gate insulating layer 150 may sufficiently cover the active layer 130 on the substrate 110 and may have a substantially flat top surface without generating a step around the active layer 130. Optionally, the gate insulating layer 150 may cover the active layer 130 on the substrate 110 and may be disposed along the profile of the active layer 130 with a uniform thickness. The gate insulating layer 150 may include a silicon compound, a metal oxide, or the like. Optionally, the gate insulating layer 150 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or may include different materials.

The gate electrode 170 may be disposed in the display area 10 on the gate insulating layer 150. The gate electrode 170 may be disposed on a portion of the gate insulating layer 150 where the active layer 130 is positioned below. The gate electrode 170 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. For example, the gate electrode 170 is gold (Au), silver (Ag), aluminum (Al), tungsten (W), copper (Cu), platinum (Pt), nickel (Ni), titanium (Ti), Palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir) ), alloys containing aluminum, aluminum nitride (AlN), alloys containing silver, tungsten nitride (WN), alloys containing copper, alloys containing molybdenum, titanium nitride (TiN), chromium nitride (CrN) ), tantalum nitride (TaN), strontium ruthenium oxide (SrRuO), zinc oxide (ZnO), indium tin oxide (ITO), tin oxide (SnO), indium oxide (InO), gallium oxide (GaO), indium zinc oxide ( IZO), and the like. These may be used alone or in combination with each other. Optionally, the gate electrode 170 may have a multilayer structure including a plurality of layers.

An interlayer insulating layer 190 may be disposed on the gate electrode 170. The interlayer insulating layer 190 may cover the gate electrode 170 in the display area 10 on the gate insulating layer 150 and may not be disposed in the peripheral area 30. That is, the interlayer insulating layer 190 may be disposed only in the display area 10 on the gate insulating layer 150. For example, the interlayer insulating layer 190 may sufficiently cover the gate electrode 170 on the gate insulating layer 150 and may have a substantially flat top surface without generating a step around the gate electrode 170. . Optionally, the interlayer insulating layer 190 covers the gate electrode 170 on the gate insulating layer 150 and may be disposed along the profile of the gate electrode 170 with a uniform thickness. The interlayer insulating layer 190 may include a silicon compound, a metal oxide, or the like. Optionally, the interlayer insulating layer 190 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or may include different materials.

The source electrode 210 and the drain electrode 230 may be disposed in the display region 10 on the interlayer insulating layer 190. The source electrode 210 may be connected to the source region of the active layer 130 through a contact hole formed by removing the first portion of the gate insulating layer 150 and the interlayer insulating layer 190, and the drain electrode 230 The drain region of the active layer 130 may be connected through a contact hole formed by removing the second portion of the silver gate insulating layer 150 and the interlayer insulating layer 190. The source electrode 210 and the drain electrode 230 may each include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, and the like. These may be used alone or in combination with each other. In other exemplary embodiments, each of the source electrode 210 and the drain electrode 230 may have a multilayer structure including a plurality of layers. Accordingly, the semiconductor device 250 including the active layer 130, the gate insulating layer 150, the gate electrode 170, the interlayer insulating layer 190, the source electrode 210 and the drain electrode 230 is disposed. Can be.

However, although it has been described that the semiconductor device 250 has an upper gate structure, the configuration of the present invention is not limited thereto. For example, the semiconductor device 250 may have a lower gate structure, a double gate structure, or the like.

In addition, although it has been described that the organic light emitting display device 100 includes one semiconductor element, the configuration of the present invention is not limited thereto. For example, the organic light emitting display device 100 may include at least one semiconductor device and at least one storage capacitor.

A planarization layer 270 may be disposed on the interlayer insulating layer 190, the source electrode 210, and the drain electrode 230. The planarization layer 270 may cover the source electrode 210 and the drain electrode 230 in the display region 10 on the interlayer insulating layer 190, and may not be disposed in the peripheral region 30. That is, the planarization layer 270 may be disposed only in the display area 10 on the interlayer insulating layer 190. For example, the planarization layer 270 may be disposed to have a relatively thick thickness in the display area 10, and in this case, the planarization layer 270 may have a substantially flat top surface, and such a planarization layer 270 A planarization process may be added to the planarization layer 270 in order to implement a flat top surface of ). Optionally, the planarization layer 270 may be disposed along the profile of the source electrode 210 and the drain electrode 230 with a uniform thickness in the display region 10 on the interlayer insulating layer 190. The planarization layer 270 may be made of an organic material or an inorganic material. In example embodiments, the planarization layer 270 may include an organic material.

The lower electrode 290 may be disposed in the display area 10 on the planarization layer 270. The lower electrode 290 may be connected to the drain electrode 230 through a contact hole formed by removing a part of the planarization layer 270, and the lower electrode 290 may be electrically connected to the semiconductor device 250. The lower electrode 290 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other. In other exemplary embodiments, the lower electrode 290 may have a multilayer structure including a plurality of layers.

The pixel defining layer 310 may be disposed in the display area 10 on the planarization layer 270 and may not be disposed in the peripheral area 30. That is, the pixel defining layer 310 may be disposed only in the display area 10 on the planarization layer 270. For example, the pixel defining layer 310 may cover both sides of the lower electrode 290 and expose a portion of the upper surface of the lower electrode 290. The pixel defining layer 310 may be made of an organic material or an inorganic material. In example embodiments, the pixel defining layer 310 may include an organic material.

The blocking structure 550 may be disposed between the first groove 930 and the third groove 970 on the substrate 110 located in the peripheral region 30. In other words, the first groove 930 and the second groove 950 may be located between the blocking structure 550 and the functional module 700, and the third groove 930 and the second groove 950 may be located between the blocking structure 550 and the light emitting structure 200. The groove 970 may be located. In addition, on the blocking structure 550, the light emitting layer 330, the upper electrode 340, the first thin film encapsulation layer 451, the third thin film encapsulation layer 453, the first insulating layer 390, and the organic insulating pattern 490 ) And the second insulating layer 395 may be positioned in order. The blocking structure 550 may surround the opening 910 (or the functional module 700). For example, the blocking structure 550 may have a planar shape of a ring. In example embodiments, the blocking structure 550 may serve to block leakage of the second thin film encapsulation layer 452. Optionally, blocking structures may be further disposed between the first groove 930 and the third groove 970. The blocking structure 550 may include an organic material or an inorganic material. In example embodiments, the blocking structure 550 may include an organic material.

The emission layer 330 is disposed on the pixel defining layer 310 and the lower electrode 290 in the display area 10 and may extend in the first direction D1, and may be formed on the substrate 110 and the blocking structure 550. It may be disposed in the peripheral area 30. In example embodiments, the light emitting layer 330 may be partially disposed inside each of the first to third grooves 930, 950, and 970, and the first to third grooves 930, 950, 970) It may be spaced apart from each other in a depth direction (eg, a direction from the second barrier layer 114 to the first organic film layer 111) at a portion where each is positioned. That is, the emission layer 330 may be short-circuited in the peripheral area 30. In other words, the emission layer 330 may be separated from the peripheral area 30 by the first and second spaces 118 and 119.

For example, when each of the first to third grooves 930, 950, and 970 does not have the first and second protrusions 116 and 117, the emission layer 330 may have first to third grooves ( 930, 950, 970 may be continuously disposed in the formed portion, and the light emitting layer 330 may be used as a moisture and/or moisture permeation path. In other words, a part of the light emitting layer 330 (for example, the side end of the light emitting layer 330) may be exposed in the opening area 20, and the moisture and/or moisture may be exposed to the exposed part of the light emitting layer 330. Can be penetrated. In this case, the moisture and/or moisture may damage the semiconductor device 250 and the light emitting structure 200 disposed in the display area 10 adjacent to the peripheral area 30. Meanwhile, in example embodiments of the present invention, since the organic light emitting display device 100 has the first to third grooves 930, 950, and 970 whose lower portions are extended, the first to third grooves The light emitting layer 330 may be separated inside each of the 930, 950, and 970. That is, the light-emitting layer 330 is separated from the inside of each of the first to third grooves 930, 950, and 970, so that the moisture permeable path of the light-emitting layer 330 may be blocked. Accordingly, even if the emission layer 330 is disposed in the peripheral region 30, pixel defects of the organic light emitting display device 100 may not occur.

The emission layer 330 includes an organic light emission layer EML, a hole injection layer HIL, a hole transport layer HTL, an electron transport layer ETL, and an electron injection layer. EIL) and the like may have a multi-layered structure. In example embodiments, an organic emission layer (EML), a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL) may be disposed in the peripheral region 30. . In other exemplary embodiments, a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL) excluding the organic emission layer (EML) are disposed in the peripheral region 30. May be.

The organic emission layer EML of the emission layer 330 may be formed using at least one of emission materials capable of emitting different color lights (ie, red light, green light, blue light, etc.) according to sub-pixels. Alternatively, the organic emission layer EML of the emission layer 330 may emit white light as a whole by stacking a plurality of light-emitting materials capable of generating different color lights such as red light, green light, and blue light. In this case, a color filter may be disposed on the emission layer 330 disposed on the lower electrode 290. The color filter may include at least one of a red color filter, a green color filter, and a blue color filter. Optionally, the color filter may include a yellow color filter, a cyan color filter, and a purple color filter. The color filter may include a photosensitive resin or a color photoresist.

The upper electrode 340 is disposed to overlap on the emission layer 330 of the display area 10, may extend in the first direction D1, and may be disposed in the peripheral area 30 on the emission layer 330. In example embodiments, the upper electrode 340 may be partially disposed inside each of the first to third grooves 930, 950, and 970, and the first to third grooves 930, 950 , 970) may be spaced apart from each other in the depth direction. That is, it may be short-circuited in the peripheral region 30 of the upper electrode 340. In other words, the upper electrode 340 may be separated from the peripheral region 30 by the first and second spaces 118 and 119.

For example, when each of the first to third grooves 930, 950, and 970 does not have the first and second protrusions 116, 117, the upper electrode 340 is formed of the first to third grooves. (930, 950, 970) may be continuously disposed in the formed portion, and the upper electrode 340 may be used as a moisture and/or moisture permeation path. In other words, a part of the upper electrode 340 (for example, a side end of the upper electrode 340) may be exposed in the opening area 20, and the moisture and moisture are exposed to the exposed part of the upper electrode 340. /Or moisture may penetrate. In this case, the moisture and/or moisture may damage the semiconductor device 250 and the light emitting structure 200 disposed in the display area 10 adjacent to the peripheral area 30. Meanwhile, in exemplary embodiments of the present invention, since the organic light emitting display device 100 has the first to third grooves 930, 950, and 970 whose lower portions are extended, the first to third grooves The upper electrode 340 may be separated inside each of the 930, 950, and 970. That is, the upper electrode 340 is separated from the inside of each of the first to third grooves 930, 950, and 970, so that the moisture permeable path of the upper electrode 340 may be blocked. Accordingly, even if the upper electrode 340 is disposed in the peripheral region 30, pixel defects of the organic light emitting display device 100 may not occur.

The upper electrode 340 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other. In other exemplary embodiments, the upper electrode 340 may have a multilayer structure including a plurality of layers.

Accordingly, the light emitting structure 200 including the lower electrode 290, the light emitting layer 330, and the upper electrode 340 may be disposed.

A capping layer (not shown) may be disposed on the upper electrode 340. The capping layer may be disposed to overlap on the upper electrode 340 of the display area 10, may extend in the first direction D1, and may be disposed in the peripheral area 30 on the upper electrode 340. In example embodiments, the capping layer may be partially disposed inside each of the first to third grooves 930, 950, and 970, and the first to third grooves 930, 950, and 970 ) It may be spaced apart from each other in the depth direction. That is, the capping layer may be short-circuited in the peripheral region 30. In other words, the capping layer may be separated from the peripheral area 30 by the first and second spaces 118 and 119.

For example, when each of the first to third grooves 930, 950, and 970 does not have the first and second protrusions 116 and 117, the capping layer is formed by the first to third grooves 930 , 950, 970) may be continuously disposed in the formed portion, and the capping layer may be used as a moisture and/or moisture permeation path. In other words, a part of the capping layer (for example, a side end of the capping layer) may be exposed in the opening region 20, and the moisture and/or moisture may penetrate into the exposed part of the capping layer. I can. In this case, the moisture and/or moisture may damage the semiconductor device 250 and the light emitting structure 200 disposed in the display area 10 adjacent to the peripheral area 30. Meanwhile, in example embodiments of the present invention, since the organic light emitting display device 100 has the first to third grooves 930, 950, and 970 whose lower portions are extended, the first to third grooves (930, 950, 970) The capping layer may be separated from each other. That is, the capping layer is separated from the inside of each of the first to third grooves 930, 950, and 970, so that the moisture permeable path of the capping layer may be blocked. Accordingly, even if the capping layer is disposed in the peripheral region 30, pixel defects of the organic light emitting display device 100 may not occur.

The capping layer may protect the light emitting structure 200 and may include an organic material or an inorganic material. In exemplary embodiments, the capping layer is a triamine derivative, an arylenediamine derivative, 4,4'-N,N'-dicarbazole-biphenyl (4,4'-bis( N-carbazolyl)-1,1'-biphenyl CBP), tris-8-hydroxyquinoline aluminum Alq3, and the like.

The first thin film encapsulation layer 451 may be disposed in the display area 10 and the peripheral area 30 on the upper electrode 340. The first thin film encapsulation layer 451 covers the upper electrode 340 in the display area 10 and may be disposed along the profile of the upper electrode 340 with a uniform thickness, and may extend to the peripheral area 30. I can. In the peripheral area 30, the first thin film encapsulation layer 451 may be disposed along the profile of the upper electrode 340. In other words, the first thin film encapsulation layer 451 may be continuously disposed in a portion in which each of the first to third grooves 930, 950, and 970 is formed. In example embodiments, the first thin film encapsulation layer 451 may completely cover each of the first to third grooves 930, 950, and 970. In other words, the first thin film encapsulation layer 451 may cover the first and second protrusions 116 and 117, may be disposed in the first and second spaces 118 and 119, and the first The light emitting layer 330 and the upper electrode 340 disposed inside each of the third grooves 930, 950, and 970 may be completely covered. That is, the first thin film encapsulation layer 451 may directly contact the second organic film layer 113 in the first and second spaces 118 and 119. The first thin film encapsulation layer 451 may prevent the light emitting structure 200 from deteriorating due to penetration of moisture or oxygen. In addition, the first thin film encapsulation layer 451 may also perform a function of protecting the light emitting structure 200 from external impact. The first thin film encapsulation layer 451 may include inorganic materials having flexibility.

A second thin film encapsulation layer 452 may be disposed in a portion of the display region 10 and the peripheral region 30 on the first thin film encapsulation layer 451. In example embodiments, the second thin film encapsulation layer 452 may fill the interior of the third groove 970, and may not be disposed inside each of the first groove 930 and the second groove 950. I can. Optionally, the second thin film encapsulation layer 452 may be disposed only in the display area 10. The second thin film encapsulation layer 452 may improve the flatness of the organic light emitting display device 100 and may protect the light emitting structure 200. The second thin film encapsulation layer 452 may include organic materials having flexibility.

The third thin film encapsulation layer 453 may be disposed in the display area 10 on the second thin film encapsulation layer 452 and the peripheral area 30 on the first thin film encapsulation layer 451. The third thin film encapsulation layer 453 may be disposed along the profile of the second thin film encapsulation layer 452 to a uniform thickness while covering the second thin film encapsulation layer 452 in the display area 10, and the peripheral area It can be extended to (30). In the peripheral region 30, the third thin film encapsulation layer 453 may have a uniform thickness and may be disposed along the profile of the first thin film encapsulation layer 451. In other words, the third thin film encapsulation layer 453 may be continuously disposed in the portion where the first to third grooves 930, 950, and 970 are respectively formed. The third thin film encapsulation layer 453 together with the first thin film encapsulation layer 451 may prevent the light emitting structure 200 from deteriorating due to penetration of moisture or oxygen. In addition, the third thin film encapsulation layer 453 may also perform a function of protecting the light emitting structure 200 together with the first thin film encapsulation layer 451 and the second thin film encapsulation layer 452 from external impact. The third thin film encapsulation layer 453 may include inorganic materials having flexibility.

Accordingly, a thin film encapsulation structure 450 including the first thin film encapsulation layer 451, the second thin film encapsulation layer 452 and the third thin film encapsulation layer 453 may be disposed. Optionally, the thin film encapsulation structure 450 may be arranged in a five-layer structure stacked with first to fifth thin film encapsulation layers or a seven-layer structure stacked with first to seventh thin film encapsulation layers.

A first insulating layer 390 may be disposed in the display area 10 and the peripheral area 30 on the third thin film encapsulation layer 453. The first insulating layer 390 covers the third thin film encapsulation layer 453 in the display area 10 and may be disposed along the profile of the third thin film encapsulation layer 453 with a uniform thickness, and the peripheral area ( 30) can be extended. In the peripheral area 30, the first insulating layer 390 may have a uniform thickness and may be disposed along the profile of the third thin film encapsulation layer 453. In other words, the first insulating layer 390 may be continuously disposed in a portion where the first to third grooves 930, 950, and 970 are formed. The first insulating layer 390 may include an organic material or an inorganic material. Optionally, the first insulating layer 390 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or may include different materials.

An organic insulating pattern 490 may be disposed in the peripheral region 30 on the first insulating layer 390. In example embodiments, the organic insulating pattern 490 may be disposed only in the peripheral region 30, may cover the blocking structure 550, and may not overlap the light emitting structure 200. Optionally, the organic insulating pattern 490 may be disposed on a part of the display area 10, but does not overlap the light emitting structure 200.

The organic insulating pattern 490 may surround the functional module 700 and may have a planar shape of a ring. The organic insulating pattern 490 may overlap the first groove 930, the second groove 950, and the third groove 970, and the inside of each of the first groove 930, the second groove, and the groove 950 Can be located in The organic insulating pattern 490 may block or absorb light incident from the outside, and may be an opaque color (eg, black).

The organic insulating pattern 490 may be disposed to have a relatively thick thickness in the peripheral region 30 on the first insulating layer 390. In this case, the organic insulating pattern 490 may have a substantially flat top surface, In order to implement such a flat top surface of the organic insulating pattern 490, a planarization process may be added to the organic insulating pattern 490. Optionally, the organic insulating pattern 490 may be disposed along the profile of the first insulating layer 390 to have a uniform thickness in the display area 10 on the first insulating layer 390. The organic insulating pattern 490 may be made of an organic material or an inorganic material. In exemplary embodiments, the organic insulating pattern 490 is a photoresist, a polyacryl-based resin, a polyimide-based resin, and a polyamide-based resin. resin), siloxane-based resin, acrylic-based resin, epoxy-based resin, and the like. In addition, the organic insulating pattern 490 may further include a light blocking material to have a black color. The light-shielding materials are carbon black, titanium nitride oxide, titanium black, phenylene black, aniline black, cyanine black, and nigro. Nigrosine acid black, black resin, etc. may be included.

For example, in a conventional organic light emitting diode display, the first to third grooves 930, 950, and 970, the blocking structure 550, and the first to third grooves 930, 950, 970 In order to prevent the disposed light emitting layer 330 and the upper electrode 340 from being visually recognized by a user, a black matrix may be included that overlaps the peripheral region 30. The black matrix may be disposed between the adhesive layer 590 and the window member 600. When the black matrix is disposed, the addition of an alignment process for accurately disposing the black matrix in the peripheral region 30 and manufacturing cost may be increased by adding the black matrix, and the adhesive layer due to the step difference of the black matrix Poor adhesion of 590 may occur.

The organic light emitting display device 100 according to exemplary embodiments of the present invention includes first to third grooves 930, 950, and 970, a blocking structure 550, and first to third grooves 930, 950. , 970) The light emitting layer 330 and the upper electrode 340 disposed inside each include an organic insulating pattern 490 having an opaque color that can prevent the user from being recognized, and the alignment process is not added. As a result, the manufacturing cost of the organic light emitting display device 100 may be relatively reduced. In addition, since the step difference does not occur due to the black matrix, an adhesion failure of the adhesive layer 590 may not occur.

First touch screen electrodes 382 and second touch screen electrodes 384 may be disposed in the display area 10 on the first insulating layer 390. As shown in FIG. 8, each of the first touch screen electrodes 382 may extend in the second direction D2 and may be disposed to be spaced apart from each other in the first direction D1. The second touch screen electrodes 384 may be disposed to be spaced apart from each other in the second direction D2 between two adjacent first touch screen electrodes 382 among the first touch screen electrodes 382. For example, each of the first and second touch screen electrodes 382 and 384 is a carbon nano tube CNT, a transparent conductive oxide, indium tin oxide ITO, and indium It may contain indium gallium zinc oxide IGZO, zinc oxide ZnO, graphene, Ag nano-wire AgNW, copper (Cu), chromium (Cr), etc. have.

A second insulating layer 395 may be disposed in the display area 10 on the first touch screen electrodes 382 and the second touch screen electrodes 384. The second insulating layer 395 covers the first and second touch screen electrodes 382 and 384 in the display area 10, and the first and second touch screen electrodes 382 and 384 have a uniform thickness. It can be arranged along the profile and can extend into the peripheral area 30. In the peripheral area 30, the second insulating layer 395 may be disposed along the profile of the organic insulating pattern 490. In other words, the second insulating layer 395 may contact the upper surface of the first insulating layer 390 in the display region 10 and the upper surface of the organic insulating pattern 490 in the peripheral region 30. have. The second insulating layer 395 may include an organic material or an inorganic material. Optionally, the second insulating layer 395 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or may include different materials.

Touch screen connection electrodes 386 may be disposed in the display area 10 on the second insulating layer 395. As shown in FIG. 8, the touch screen connection electrodes 386 connect two second touch screen electrodes 384 adjacent to each other in the first direction D1 among the second touch screen electrodes 384 through a contact hole. It can be electrically connected through. For example, it may include the same material as the touch screen connection electrodes 386 and the first and second touch screen electrodes 382 and 384. Optionally, the touch screen connection electrodes 386 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other.

A protective insulating layer 410 may be disposed in the display area 10 and the peripheral area 30 on the second insulating layer 395 and the touch screen connection electrodes 386. The protective insulating layer 410 may be disposed on the second insulating layer 395 to have a relatively thick thickness. In this case, the protective insulating layer 410 may have a substantially flat top surface. Optionally, the protective insulating layer 410 covers the touch screen connection electrodes 386 and the conductive pattern 400 with a uniform thickness in the display area 10 and the peripheral area 30 on the second insulating layer 395. And may be disposed along the profile of the touch screen connection electrodes 386 and the conductive pattern 400. The protective insulating layer 410 may be made of an organic material or an inorganic material. In example embodiments, the protective insulating layer 410 may include an organic material.

Accordingly, the first insulating layer 390, the first touch screen electrodes 382, the second touch screen electrodes 384, the second insulating layer 395, the touch screen connection electrodes 386, and protective insulation A touch screen structure 380 including a layer 410 may be disposed.

A polarizing layer 430 may be disposed on the touch screen structure 380. The polarization layer 430 may overlap the display area 10 and the peripheral area 30 on the substrate 110. In other words, the polarizing layer 430 may have an opening exposing the opening region 20. The polarization layer 430 may include a linear polarization film and a λ/4 phase retardation film. The λ/4 phase retardation film may be disposed on the protective insulating layer 410. The λ/4 phase retardation film may change the phase of light. For example, the λ/4 phase retardation film converts light vibrating up and down or light vibrating left and right into right circularly polarized light or left circularly polarized light, and light vibrating right or left circularly polarized light vertically or horizontally. It can be converted to light. The λ/4 phase retardation film may include a birefringent film including a polymer, an alignment film of a liquid crystal polymer, a film including an alignment layer of a liquid crystal polymer, and the like.

A linearly polarizing film may be disposed on the λ/4 phase retardation film. The linearly polarized film may selectively transmit light. For example, the linearly polarizing film may transmit light vibrating vertically or light vibrating left and right. In this case, the linearly polarizing film may have a horizontal line pattern or a vertical line pattern. When the linearly polarized film includes a horizontal line pattern, the linearly polarized film may block light vibrating vertically and transmit light vibrating left and right. When the linearly polarized film has a vertical line pattern, the linearly polarized film may block light vibrating left and right, and transmit light vibrating vertically. Light transmitted through the linearly polarized film may pass through the λ/4 phase retardation film. As described above, the λ/4 phase retardation film may change the phase of light. For example, when light vibrating up and down and left and right passes through the linearly polarizing film, the linearly polarized film having a horizontal line pattern may transmit light vibrating left and right. When the light vibrating left and right passes through the λ/4 phase delay film, the light vibrating left and right may be converted into left circularly polarized light. The light having the left circularly polarized light may be reflected by the upper electrode 340 in the display area 10, and the light may be converted into right circularly polarized light. When the right circularly polarized light passes through the λ/4 phase retardation film, the light may be converted into light vibrating vertically. Here, the vertically vibrating light cannot pass through the linearly polarized film having a horizontal line pattern. Accordingly, the light may be extinguished by the linearly polarized film and the λ/4 phase retardation film. For example, the linearly polarizing film may include an iodine-based material, a material containing dye, and a polyene-based material. In other exemplary embodiments, the polarizing layer 430 may be disposed under the touch screen structure 380.

The functional module 700 may be disposed in the opening area 20. In exemplary embodiments, the functional module 700 includes a side surface of the substrate 110, a side surface of the light emitting layer 330, a side surface of the upper electrode 340, and the boundary between the peripheral area 30 and the opening area 20. Side of the first thin film encapsulation layer 451, the side of the third thin film encapsulation layer 453, the side of the first insulating layer 390, the side of the organic insulating pattern 490, the side of the second insulating layer 395 , It may contact the side surface of the protective insulating layer 410 and the side surface of the polarizing layer 430.

For example, the functional module 700 includes a camera module, a face recognition sensor module, a pupil recognition sensor module, an acceleration sensor module and a geomagnetic sensor module, a proximity sensor module and an infrared sensor module, an illuminance sensor module, a vibration module, a speaker module, and the like. Can include.

An adhesive layer 590 may be disposed on the polarization layer 430 and the display area 10, the peripheral area 30, and the opening area 20 on the functional module 700. In other words, the adhesive layer 590 may be entirely disposed on the substrate 110. The adhesive layer 590 may be disposed to adhere the window member 600 to the polarization layer 430. For example, the adhesive layer 590 is acrylic-based adhesives, silicone-based adhesives, urethane-based adhesives, rubber-based adhesives, vinyl It may include an optical transparent adhesive (optical clear adhesive OCA), pressure sensitive adhesive (pressure sensitive adhesive PSA), including the ether-based adhesives (vinyl ether-based adhesives) and the like. In other exemplary embodiments, the adhesive layer 590 may have an opening exposing the opening region 20. In this case, the window member 600 and the functional module 700 may directly contact each other.

The window member 600 may be disposed in the display area 10, the opening area 20, and the peripheral area 30 on the adhesive layer 590. In other words, the window member 600 may be entirely disposed on the substrate 110. The window member 600 may protect the polarizing layer 430, the touch screen structure 380, the light emitting structure 200, the semiconductor device 250, and the like. The window member 600 may include a plurality of layers. For example, the window member 600 may include protective coating layers, base film layers, etc. made of an organic material or an inorganic material. The protective coating layer may be disposed on the base film layer, and the protective coating layer may have a hardness of the protective coating layer greater than that of the base film layer in order to protect the base film layer. The base film layer is polyimide, polyethylene terephthalate PET, polyethylene naphthalene PEN, polypropylene PP, polycarbonate PC, polystyrene PS, Polysulfone PSul, polyethylene PE, polyphthalamide PPA, polyethersulfone PES, polyarylate PAR, polycarbonate oxide PCO, modified polyphenyl Ren oxide (modified polyphenylene oxide MPPO), urethane (urethane), thermoplastic polyurethane (thermoplastic poly urethane TPU), and the like. In addition, the protective coating layer may include an acrylic material, an epoxy material, or the like. In other exemplary embodiments, the window member 600 may have a single layer.

As such, the organic light emitting display device 100 illustrated in FIG. 7 may be provided.

As the organic light emitting display device 100 according to the exemplary embodiments includes the organic insulating pattern 490 having the first color, the organic light emitting display device 100 includes first to third grooves ( 930, 950, 970), blocking structure 550, and the light emitting layer 330 and the upper electrode 340 disposed inside each of the first to third grooves 930, 950, 970 are prevented from being visually recognized by the user can do. Accordingly, visibility of the organic light emitting display device 100 may be improved.

9 to 19 are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to exemplary embodiments of the present invention.

Referring to FIG. 9, a rigid glass substrate 105 may be provided. The first organic film layer 111 may be formed on the glass substrate 105. The first organic film layer 111 may be formed entirely on the glass substrate 105 and may be formed using an organic material having flexibility such as polyimide.

The first barrier layer 112 may be entirely formed on the first organic film layer 111. The first barrier layer 112 may block moisture penetrating through the first organic film layer 111. The first barrier layer 112 may be formed using an inorganic material having flexibility such as silicon oxide or silicon nitride. For example, the first barrier layer 112 includes silicon oxide, silicon nitride, silicon oxynitride, silicon oxycarbide, silicon carbonitride, aluminum oxide, aluminum nitride, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc. can do.

A second organic film layer 113 may be formed on the first barrier layer 112. The second organic film layer 113 may be formed entirely on the first barrier layer 112 and may be formed using an organic material having flexibility such as polyimide.

The second barrier layer 114 may be entirely formed on the second organic film layer 113. The second barrier layer 114 may block moisture penetrating through the second organic film layer 113. The second barrier layer 114 may be formed using an inorganic material having flexibility, such as silicon oxide or silicon nitride.

Accordingly, the substrate 110 including the first organic film layer 111, the first barrier layer 112, the second organic film layer 113, and the second barrier layer 114 may be formed. The substrate 110 may be divided into a display area 10, an opening area 20, and a peripheral area 30.

Since the substrate 110 is thin and flexible, the substrate 110 may be formed on the rigid glass substrate 105 to support formation of an upper structure (eg, a semiconductor device and a light emitting structure). For example, after forming the upper structure on the substrate 110, the glass substrate 105 may be removed. In other words, because of the flexible physical properties of the first organic film layer 111, the first barrier layer 112, the second organic film layer 113, and the second barrier layer 114, the first organic film layer 111 , It may be difficult to directly form the upper structure on the first barrier layer 112, the second organic film layer 113 and the second barrier layer 114. In consideration of this point, by forming the upper structure using the glass substrate 105 and then removing the glass substrate 105, the first organic film layer 111, the first barrier layer 112, the second The organic film layer 113 and the second barrier layer 114 may be used as the substrate 110.

A buffer layer (not shown) may be formed on the substrate 110. The buffer layer may be formed entirely on it. The buffer layer may prevent diffusion of metal atoms or impurities from the substrate 110, and a substantially uniform active layer may be obtained by controlling a heat transfer rate during a crystallization process for forming the active layer. In addition, when the surface of the substrate 110 is not uniform, the buffer layer may serve to improve the flatness of the surface of the substrate 110. Depending on the type of substrate 110, two or more buffer layers may be provided on the substrate 110 or the buffer layer may not be formed. For example, the buffer layer may be formed of an organic material or an inorganic material.

The active layer 130 may be formed in the display area 10 on the substrate 110. The active layer 130 may be formed using an oxide semiconductor, an inorganic semiconductor, or an organic semiconductor. The active layer 130 may have source and drain regions.

A gate insulating layer 150 may be formed on the active layer 130. The gate insulating layer 150 may cover the active layer 130 in the display area 10 on the substrate 110, and is in a first direction D1, which is a direction from the display area 10 to the opening area 20. Can be extended. That is, the gate insulating layer 150 may be entirely formed on the substrate 110. For example, the gate insulating layer 150 may sufficiently cover the active layer 130 on the substrate 110 and may have a substantially flat top surface without generating a step around the active layer 130. Optionally, the gate insulating layer 150 may cover the active layer 130 on the substrate 110 and may be formed along the profile of the active layer 130 with a uniform thickness. The gate insulating layer 150 may be formed using a silicon compound, a metal oxide, or the like. Optionally, the gate insulating layer 150 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or may include different insulating materials.

A gate electrode 170 may be formed in the display area 10 on the gate insulating layer 150. The gate electrode 170 may be formed on a portion of the gate insulating layer 150 where the active layer 130 is positioned below. The gate electrode 170 may be formed of a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. For example, the gate electrode 170 is made of gold, silver, aluminum, tungsten, copper, platinum, nickel, titanium, palladium, magnesium, calcium, lithium, chromium, tantalum, molybdenum, scandium, neodymium, iridium, and aluminum. Alloy containing, aluminum nitride, alloy containing silver, tungsten nitride, alloy containing copper, alloy containing molybdenum, titanium nitride, chromium nitride, tantalum nitride, strontium ruthenium oxide, zinc oxide, indium tin oxide, Tin oxide, indium oxide, gallium oxide, indium zinc oxide, and the like may be included. These may be used alone or in combination with each other. Optionally, the gate electrode 170 may have a multilayer structure including a plurality of layers.

An interlayer insulating layer 190 may be formed on the gate electrode 170. The interlayer insulating layer 190 may cover the gate electrode 170 in the display region 10 on the gate insulating layer 150 and may extend on the gate insulating layer 150 in the first direction D1. That is, the interlayer insulating layer 190 may be entirely formed on the gate insulating layer 150. For example, the interlayer insulating layer 190 may sufficiently cover the gate electrode 170 on the gate insulating layer 150 and may have a substantially flat top surface without generating a step around the gate electrode 170. . Optionally, the interlayer insulating layer 190 covers the gate electrode 170 on the gate insulating layer 150 and may be formed along the profile of the gate electrode 170 with a uniform thickness. The interlayer insulating layer 190 may be formed using a silicon compound, a metal oxide, or the like. Optionally, the interlayer insulating layer 190 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or may include different insulating materials.

Referring to FIG. 10, a source electrode 210 and a drain electrode 230 of the display region 10 on the interlayer insulating layer 190 may be formed. The source electrode 210 may be connected to the source region of the active layer 130 through a contact hole formed by removing the first portion of the gate insulating layer 150 and the interlayer insulating layer 190, and the drain electrode 230 The drain region of the active layer 130 may be connected through a contact hole formed by removing the second portion of the silver gate insulating layer 150 and the interlayer insulating layer 190. The source electrode 210 and the drain electrode 230 may be formed of a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like, respectively. These may be used alone or in combination with each other. In other exemplary embodiments, each of the source electrode 210 and the drain electrode 230 may have a multilayer structure including a plurality of layers. Accordingly, a semiconductor device 250 including the active layer 130, the gate insulating layer 150, the gate electrode 170, the interlayer insulating layer 190, the source electrode 210 and the drain electrode 230 is formed. Can be.

A planarization layer 270 may be formed on the interlayer insulating layer 190, the source electrode 210, and the drain electrode 230. The planarization layer 270 may cover the source electrode 210 and the drain electrode 230 in the display region 10 on the interlayer insulating layer 190, and may not be formed in the peripheral region 30. That is, the planarization layer 270 may be formed only in the display area 10 on the interlayer insulating layer 190. For example, the planarization layer 270 may be formed to have a relatively thick thickness in the display area 10. In this case, the planarization layer 270 may have a substantially flat top surface, and the planarization layer 270 A planarization process may be added to the planarization layer 270 in order to implement a flat top surface of ). Optionally, the planarization layer 270 may be formed along the profiles of the source electrode 210 and the drain electrode 230 with a uniform thickness in the display region 10 on the interlayer insulating layer 190. The planarization layer 270 may be formed using an organic material.

The lower electrode 290 may be formed in the display area 10 on the planarization layer 270. The lower electrode 290 may be connected to the drain electrode 230 through a contact hole formed by removing a part of the planarization layer 270, and the lower electrode 290 may be electrically connected to the semiconductor device 250. The lower electrode 290 may be formed of a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other. In other exemplary embodiments, the lower electrode 290 may have a multilayer structure including a plurality of layers.

Referring to FIG. 11, after the lower electrode 290 is formed, the gate insulating layer 150 and the interlayer insulating layer 190 positioned in the peripheral region 30 may be removed. After the gate insulating layer 150 and the interlayer insulating layer 190 located in the peripheral region 30 are removed, the lower part is extended to the substrate 110 located in the peripheral region 30 through a laser or dry etching process. First to third grooves 930, 950, and 970 may be formed. Each of the first to third grooves 930, 950, and 970 may have an under-cut shape. For example, it is formed in the second organic film layer 113 and formed in the first, second and third trenches and the second barrier layer 114 having a first width W1 and having a first width W1 First, second, and third openings having a smaller second width W2 may be defined as the under-cut shape. Optionally, it is formed in the second organic film layer 113 and formed in the first, second and third openings having a first width W1 and the second barrier layer 114 and is formed in the first width W1. First, second, and third openings having a small second width W2 may be defined as the under-cut shape. In this case, the upper surface of the first barrier layer 112 may be exposed through the first to third openings of the second organic film layer 113.

The first to third openings of the second barrier layer 114 protrude to the inside of each of the first to third trenches on the first to third trenches of the second organic film layer 113. First and second protrusions 116 and 117 may be defined.

For example, the first protrusion 116 may be located adjacent to the boundary between the peripheral region 30 and the opening region 20, and the second protrusion 117 may face the first protrusion 116, , It may be located spaced apart from the first protrusion 116. In addition, a space positioned under each of the first and second protrusions 116 and 117 may be defined as first and second spaces 118 and 119 (see FIG. 12 ). Accordingly, the first to third trenches of the second organic film layer 113, first and second protrusions 116 and 117 of the second barrier layer 114, and the second barrier layer 114 The first to third openings of may be defined as first to third grooves 930, 950, and 970 whose lower portions are formed in the substrate 110 positioned in the peripheral area 30. In other exemplary embodiments, a plurality of grooves may be formed by being spaced apart from the second groove 950 in the first direction D1, or opposite to the first direction D1 from the third groove 970 A plurality of grooves may be formed by being spaced apart in the direction.

Referring to FIG. 12, the pixel defining layer 310 may be formed in the display area 10 on the planarization layer 270 and may not be formed in the peripheral area 30. That is, the pixel defining layer 310 may be formed only in the display area 10 on the planarization layer 270. For example, the pixel defining layer 310 may cover both sides of the lower electrode 290 and expose a portion of the upper surface of the lower electrode 290. The pixel defining layer 310 may be formed using an organic material.

A blocking structure 550 may be formed between the first groove 930 and the third groove 970 on the substrate 110 located in the peripheral region 30. The blocking structure 550 may surround the opening area 20. For example, the blocking structure 550 may have a planar shape of a ring. Optionally, blocking structures may be further formed between the first groove 930 and the third groove 970. The blocking structure 550 may be formed using an organic material. For example, the blocking structure 550 and the pixel defining layer 310 may be simultaneously formed using the same material. In other exemplary embodiments, the blocking structure 550 may include a lower blocking structure and an upper blocking structure. In this case, the lower blocking structure and the planarization layer 270 may be simultaneously formed using the same material, and the upper blocking structure and the pixel defining layer 310 may be formed simultaneously using the same material.

The emission layer 330 is formed on the pixel defining layer 310 and the lower electrode 290 in the display area 10 and extends in the first direction D1, and is formed on the substrate 110 and the blocking structure 550. It may be formed in the peripheral area 30. In example embodiments, the light emitting layer 330 may be partially formed inside each of the first to third grooves 930, 950, and 970, and the first to third grooves 930, 950, 970) It may be spaced apart from each other in the depth direction. That is, the emission layer 330 may be short-circuited to the peripheral region 30. In other words, the emission layer 330 may be separated from the peripheral area 30 by the first and second spaces 118 and 119.

The emission layer 330 may have a multilayer structure including an organic emission layer (EML), a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). In example embodiments, an organic emission layer (EML), a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL) may be formed in the peripheral region 30. . In other exemplary embodiments, a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL) excluding the organic emission layer (EML) are formed in the peripheral region 30. May be.

The organic emission layer EML of the emission layer 330 may be formed using at least one of emission materials capable of emitting different color lights (ie, red light, green light, blue light, etc.) according to sub-pixels. Alternatively, the organic emission layer EML of the emission layer 330 may emit white light as a whole by stacking a plurality of light-emitting materials capable of generating different color lights such as red light, green light, and blue light. In this case, a color filter may be formed on the emission layer 330 formed on the lower electrode 290. The color filter may include at least one of a red color filter, a green color filter, and a blue color filter. Optionally, the color filter may include a yellow color filter, a cyan color filter, and a purple color filter. The color filter may be formed using a photosensitive resin or a color photoresist.

The upper electrode 340 is formed to overlap on the emission layer 330 of the display area 10, extends in the first direction D1, and may be formed in the peripheral area 30 on the emission layer 330. In example embodiments, the upper electrode 340 may be partially formed inside the first to third grooves 930, 950, and 970, and the first to third grooves 930, 950, 970) It may be spaced apart from each other in the depth direction. That is, it may be short-circuited in the peripheral region 30 of the upper electrode 340. In other words, the upper electrode 340 may be separated from the peripheral region 30 by the first and second spaces 118 and 119.

The upper electrode 340 may be formed of a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other. In other exemplary embodiments, the upper electrode 340 may have a multilayer structure including a plurality of layers.

Accordingly, the light emitting structure 200 including the lower electrode 290, the light emitting layer 330, and the upper electrode 340 may be formed.

A capping layer (not shown) may be formed on the upper electrode 340. The capping layer may be formed to overlap on the upper electrode 340 of the display area 10, extend in the first direction D1, and may be formed in the peripheral region 30 on the upper electrode 340. In example embodiments, the capping layer may be partially formed inside each of the first to third grooves 930, 950, and 970, and the first to third grooves 930, 950, and 970 ) It may be spaced apart from each other in the depth direction. That is, the capping layer may be short-circuited in the peripheral region 30. In other words, the capping layer may be separated from the peripheral area 30 by the first and second spaces 118 and 119. The capping layer may protect the light emitting structure 200. In exemplary embodiments, the capping layer includes an organic material such as triamine derivative, arylenediamine derivative, 4,4'-N,N'-dicarbazole-biphenyl, tris-8-hydroxyquinoline aluminum, etc. Can be formed using.

Referring to FIG. 13, a first thin film encapsulation layer 451 may be formed in the display area 10 and the peripheral area 30 on the upper electrode 340. The first thin film encapsulation layer 451 covers the upper electrode 340 in the display area 10 and may be formed along the profile of the upper electrode 340 with a uniform thickness, and may extend to the peripheral area 30. I can. In the peripheral area 30, the first thin film encapsulation layer 451 may be formed along the profile of the upper electrode 340. In other words, the first thin film encapsulation layer 451 may be continuously formed at a portion in which each of the first to third grooves 930, 950, and 970 is formed. In example embodiments, the first thin film encapsulation layer 451 may completely cover each of the first to third grooves 930, 950, and 970. In other words, the first thin film encapsulation layer 451 may cover the first and second protrusions 116 and 117, may be formed in the first and second spaces 118 and 119, and the first The light emitting layer 330 and the upper electrode 340 formed inside each of the third grooves 930, 950, and 970 may be completely covered. That is, the first thin film encapsulation layer 451 may directly contact the second organic film layer 113 in the first and second spaces 118 and 119. The first thin film encapsulation layer 451 may prevent the light emitting structure 200 from deteriorating due to penetration of moisture or oxygen. In addition, the first thin film encapsulation layer 451 may also perform a function of protecting the light emitting structure 200 from external impact. The first thin film encapsulation layer 451 may be formed using inorganic materials having flexibility.

A second thin film encapsulation layer 452 may be formed in a portion of the display region 10 and the peripheral region 30 on the first thin film encapsulation layer 451. In example embodiments, the second thin film encapsulation layer 452 may fill the interior of the third groove 970, and may not be formed inside each of the first groove 930 and the second groove 950. I can. The second thin film encapsulation layer 452 may improve the flatness of the organic light emitting display device 100 and may protect the light emitting structure 200. The second thin film encapsulation layer 452 may be formed using organic materials having flexibility.

Referring to FIG. 14, a third thin film encapsulation layer 453 may be formed in the display region 10 on the second thin film encapsulation layer 452 and the peripheral region 30 on the first thin film encapsulation layer 451. The third thin film encapsulation layer 453 may be formed along the profile of the second thin film encapsulation layer 452 to a uniform thickness while covering the second thin film encapsulation layer 452 in the display area 10, and the peripheral area It can be extended to (30). In the peripheral region 30, the third thin film encapsulation layer 453 may have a uniform thickness and may be formed along the profile of the first thin film encapsulation layer 451. In other words, the third thin film encapsulation layer 453 may be continuously formed in a portion in which each of the first to third grooves 930, 950, and 970 is formed. The third thin film encapsulation layer 453 together with the first thin film encapsulation layer 451 may prevent the light emitting structure 200 from deteriorating due to penetration of moisture or oxygen. In addition, the third thin film encapsulation layer 453 may also perform a function of protecting the light emitting structure 200 together with the first thin film encapsulation layer 451 and the second thin film encapsulation layer 452 from external impact. The third thin film encapsulation layer 453 may be formed using inorganic materials having flexibility.

Accordingly, a thin film encapsulation structure 450 including the first thin film encapsulation layer 451, the second thin film encapsulation layer 452 and the third thin film encapsulation layer 453 may be formed. Optionally, the thin film encapsulation structure 450 may be formed in a five-layer structure stacked with first to fifth thin film encapsulation layers or a seven-layer structure stacked with first to seventh thin film encapsulation layers.

A first insulating layer 390 may be formed in the display area 10 and the peripheral area 30 on the third thin film encapsulation layer 453. The first insulating layer 390 may be formed along the profile of the third thin film encapsulation layer 453 to a uniform thickness while covering the third thin film encapsulation layer 453 in the display area 10. 30) can be extended. In the peripheral area 30, the first insulating layer 390 may have a uniform thickness and may be formed along the profile of the third thin film encapsulation layer 453. In other words, the first insulating layer 390 may be continuously formed at a portion in which the first to third grooves 930, 950, and 970 are respectively formed. The first insulating layer 390 may be formed using an organic material or an inorganic material. Optionally, the first insulating layer 390 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or may include different materials.

Referring to FIG. 15, an organic insulating pattern 490 may be formed in the peripheral region 30 on the first insulating layer 390. In example embodiments, the organic insulating pattern 490 may be formed only in the peripheral region 30, may cover the blocking structure 550, and may not overlap the light emitting structure 200. In addition, the organic insulating pattern 490 may surround the opening region 20 and may have a planar shape of a ring. The organic insulating pattern 490 may overlap the first groove 930, the second groove 950, and the third groove 970, and the inside of each of the first groove 930, the second groove, and the groove 950 Can be located in The organic insulating pattern 490 may block or absorb light incident from the outside, and may be an opaque color (eg, black). The organic insulating pattern 490 may be formed to have a relatively thick thickness in the peripheral region 30 on the first insulating layer 390, in this case, the organic insulating pattern 490 may have a substantially flat top surface, In order to implement such a flat top surface of the organic insulating pattern 490, a planarization process may be added to the organic insulating pattern 490. Optionally, the organic insulating pattern 490 may be formed along the profile of the first insulating layer 390 to have a uniform thickness in the display area 10 on the first insulating layer 390. The organic insulating pattern 490 may be formed using an organic material such as a photoresist, a polyacrylic resin, a polyimide resin, a polyamide resin, a siloxane resin, an acrylic resin, or an epoxy resin. In addition, the organic insulating pattern 490 may further include a light blocking material to have a black color. The light-shielding material may be formed using carbon black, titanium oxynitride, titanium black, phenylene black, aniline black, cyanine black, nigrosine black, black resin, or the like.

Referring to FIG. 16, first touch screen electrodes 382 and second touch screen electrodes 384 may be formed in the display area 10 on the first insulating layer 390 (see FIG. 8 ). Each of the first touch screen electrodes 382 may extend in the second direction D2 and may be formed to be spaced apart from each other in the first direction D1. The second touch screen electrodes 384 may be formed to be spaced apart from each other in the second direction D2 between two adjacent first touch screen electrodes 382 among the first touch screen electrodes 382. For example, each of the first and second touch screen electrodes 382 and 384 is carbon nanotube, transparent conductive oxide, indium tin oxide, indium gallium zinc oxide, zinc oxide, graphene, silver nanowire, copper, chromium It can be formed using the like.

A second insulating layer 395 may be formed in the display area 10 on the first and second touch screen electrodes 382 and 384. The second insulating layer 395 covers the first and second touch screen electrodes 382 and 384 in the display area 10, and the first and second touch screen electrodes 382 and 384 have a uniform thickness. It may be formed along the profile, and may extend into the peripheral region 30. In the peripheral area 30, the second insulating layer 395 may be formed along the profile of the organic insulating pattern 490. In other words, the second insulating layer 395 may contact the upper surface of the first insulating layer 390 in the display region 10 and the upper surface of the organic insulating pattern 490 in the peripheral region 30. have. The second insulating layer 395 may be formed using an organic material or an inorganic material. Optionally, the second insulating layer 395 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or may include different materials.

Referring to FIG. 17, touch screen connection electrodes 386 may be formed in the display area 10 on the second insulating layer 395 (see FIG. 8 ). The touch screen connection electrodes 386 may electrically connect two second touch screen electrodes 384 adjacent in the first direction D1 among the second touch screen electrodes 384 through a contact hole. For example, it may be formed using the same material as the touch screen connection electrodes 386 and the first and second touch screen electrodes 382 and 384. Optionally, the touch screen connection electrodes 386 may be formed using a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in combination with each other.

A protective insulating layer 410 may be formed in the display area 10 and the peripheral area 30 on the second insulating layer 395 and the touch screen connection electrodes 386. The protective insulating layer 410 may be formed on the second insulating layer 395 to have a relatively thick thickness, and in this case, the organic insulating pattern 490 may have a substantially flat top surface. Optionally, the protective insulating layer 410 covers the touch screen connection electrodes 386 and the conductive pattern 400 with a uniform thickness in the display area 10 and the peripheral area 30 on the second insulating layer 395. And may be formed along the profile of the touch screen connection electrodes 386 and the conductive pattern 400. The protective insulating layer 410 may be formed using an organic material.

Accordingly, the first insulating layer 390, the first touch screen electrodes 382, the second touch screen electrodes 384, the second insulating layer 395, the touch screen connection electrodes 386, and protective insulation The touch screen structure 380 including the layer 410 may be formed.

A polarizing layer 430 may be formed on the touch screen structure 380. The polarizing layer 430 may be entirely formed on the substrate 110. The polarization layer 430 may include a linear polarization film and a λ/4 phase retardation film. The λ/4 phase retardation film may be formed on the protective insulating layer 410. The λ/4 phase retardation film may change the phase of light. For example, the λ/4 phase retardation film converts light vibrating up and down or light vibrating left and right into right circularly polarized light or left circularly polarized light, and light vibrating right or left circularly polarized light vertically or horizontally. It can be converted to light. The λ/4 phase delay film may be formed using a birefringent film including a polymer, an alignment film of a liquid crystal polymer, a film including an alignment layer of a liquid crystal polymer, or the like.

A linearly polarized film may be formed on the λ/4 phase retardation film. The linearly polarized film may selectively transmit light. For example, the linearly polarizing film may transmit light vibrating vertically or light vibrating left and right. In this case, the linearly polarizing film may have a horizontal line pattern or a vertical line pattern. The linearly polarized film may be formed using an iodine-based material, a dye-containing material, or a polyene-based material.

After the polarization layer 430 is formed, a laser may be irradiated to the opening area 20 on the polarization layer 430. Optionally, another etching process may be performed to expose the opening region 20 on the glass substrate 105.

18, 19, and 7, an opening 910 may be formed in the opening area 20 by the laser irradiation, and a functional module 700 may be formed in the opening 910. In exemplary embodiments, the functional module 700 includes a side surface of the substrate 110, a side surface of the light emitting layer 330, a side surface of the upper electrode 340, and the boundary between the peripheral area 30 and the opening area 20. Side of the first thin film encapsulation layer 451, the side of the third thin film encapsulation layer 453, the side of the first insulating layer 390, the side of the organic insulating pattern 490, the side of the second insulating layer 395 , It may contact the side surface of the protective insulating layer 410 and the side surface of the polarizing layer 430. For example, the functional module 700 includes a camera module, a face recognition sensor module, a pupil recognition sensor module, an acceleration sensor module and a geomagnetic sensor module, a proximity sensor module and an infrared sensor module, an illuminance sensor module, a vibration module, a speaker module, and the like. Can include.

An adhesive layer 590 may be formed on the polarization layer 430 and the display area 10, the peripheral area 30, and the opening area 20 on the functional module 700. In other words, the adhesive layer 590 may be entirely formed on the substrate 110. For example, the adhesive layer 590 may be formed using an optically transparent adhesive, a pressure sensitive adhesive including an acrylic adhesive, a silicone adhesive, a urethane adhesive, a rubber adhesive, a vinyl ether adhesive, or the like. In other exemplary embodiments, after the adhesive layer 590 is formed on the polarizing layer 430, a laser may be irradiated to the opening area 20 on the adhesive layer 590. In this case, the adhesive layer 590 may have an opening exposing the opening region 20.

A window member 600 may be formed in the display area 10, the opening area 20, and the peripheral area 30 on the adhesive layer 590. In other words, the window member 600 may be formed entirely on the substrate 110. The window member 600 may protect the polarizing layer 430, the touch screen structure 380, the light emitting structure 200, the semiconductor device 250, and the like. The window member 600 may include a plurality of layers. For example, the window member 600 may be formed using protective coating layers or base film layers made of an organic material or an inorganic material. The protective coating layer may be formed on the base film layer, and the protective coating layer may have a hardness of the protective coating layer greater than that of the base film layer in order to protect the base film layer. The base film layer is polyimide, polyethylene terephthalate, polyethylene naphthalene, polypropylene, polycarbonate, polystyrene, polysulfone, polyethylene, polyphthalamide, polyethersulfone, polyarirate, polycarbonate oxide, modified polyphenyl It may include ene oxide, urethane, thermoplastic polyurethane, and the like. In addition, the protective coating layer may include an acrylic material, an epoxy material, or the like. In other exemplary embodiments, the window member 600 may have a single layer.

After the window member 600 is formed, the glass substrate 105 may be separated from the substrate 110. Accordingly, the organic light emitting display device 100 shown in FIG. 7 may be manufactured.

In a conventional method of manufacturing an organic light emitting diode display, the interior of each of the first to third grooves 930, 950, and 970, the blocking structure 550, and the first to third grooves 930, 950, and 970 In order to prevent the light emitting layer 330 and the upper electrode 340 formed in the upper electrode 340 from being visually recognized by the user, a black matrix may be formed in a portion overlapping with the peripheral region 30. The black matrix may be formed between the adhesive layer 590 and the window member 600. When the black matrix is formed, the addition of an alignment process for accurately forming the black matrix in the peripheral region 30 and the manufacturing cost by the addition of the black matrix may increase, and the adhesive layer due to the step difference of the black matrix Poor adhesion of 590 may occur.

In a method of manufacturing an organic light-emitting display device according to exemplary embodiments of the present invention, first to third grooves 930, 950, 970, blocking structure 550, and first to third grooves 930 An organic insulating pattern 490 having an opaque color may be formed to prevent the light emitting layer 330 and the upper electrode 340 formed inside each of 950 and 970 from being visually recognized by a user. Accordingly, since the black matrix is not additionally formed and the alignment process is not added, the manufacturing cost of the organic light emitting display device may be relatively reduced. In addition, since the step difference due to the black matrix does not occur, a defective adhesion of the adhesive layer 590 may not occur.

In the foregoing, the description has been made with reference to exemplary embodiments of the present invention, but those of ordinary skill in the art, the present invention within the scope not departing from the spirit and scope of the present invention described in the following claims. It will be understood that various modifications and changes can be made.

The present invention can be applied to various display devices that may include an organic light emitting display device. For example, the present invention is applicable to numerous display devices such as display devices for vehicles, ships and aircraft, portable communication devices, display devices for exhibition or information transmission, medical display devices, and the like.

10: display area 20: opening area
30: peripheral area 40: pad area
100: organic light emitting display device 101: external device
105: glass substrate 110: substrate
111: first organic film layer 112: first barrier layer
113: second organic film layer 114: second barrier layer
116: first protrusion 117: second protrusion
118: first space 119: second space
130: active layer 150: gate insulating layer
170: gate electrode 190: interlayer insulating layer
200: display panel 210: source electrode
230: drain electrode 250: semiconductor element
270: planarization layer 290: lower electrode
200: light emitting structure 310: pixel defining layer
330: emission layer 340: upper electrode
380: touch screen structure 382: first touch screen electrodes
384: second touch screen electrodes 386: touch screen connection electrodes
390: first insulating layer 395: second insulating layer
410: protective insulating layer 450: thin film encapsulation structure
451 first thin film encapsulation layer 452: second thin film encapsulation layer
453: third thin film encapsulation layer 490: organic insulating pattern
550: blocking structure 700: functional module
910: opening 930: first groove
950: second groove 970: third groove
590: adhesive layer 600: window member

Claims (32)

A substrate including an opening region, a peripheral region surrounding the opening region, and a display region surrounding the peripheral region, the substrate having a lower portion extended first groove formed in the peripheral region and an opening formed in the opening region;
A light emitting structure disposed in the display area on the substrate;
A blocking structure disposed in the peripheral area on the substrate and surrounding the opening; And
An organic light-emitting display device comprising an organic insulating pattern having a first color and covering the blocking structure in the peripheral area on the substrate. The organic light-emitting display device of claim 1, wherein the organic insulating pattern is disposed in the first groove. The organic light-emitting display device of claim 1, wherein the organic insulating pattern blocks or absorbs light incident from the outside. The organic light-emitting display device of claim 3, wherein the first color of the organic insulating pattern is black. The organic light emitting display device of claim 1, wherein the organic insulating pattern does not overlap the light emitting structure. The method of claim 1,
The organic light emitting diode display device further comprising a functional module disposed in the opening of the substrate. The organic method of claim 6, wherein the functional module comprises a camera module, a face recognition sensor module, a pupil recognition sensor module, an acceleration sensor module, a geomagnetic sensor module, a proximity sensor module, an infrared sensor module, and an illuminance sensor module. Light-emitting display device. The organic light-emitting display device of claim 6, wherein a side surface of the organic insulating pattern positioned at a boundary between the peripheral area and the opening area directly contacts the functional module. The organic light-emitting display device of claim 1, wherein the first groove surrounds the opening. The organic light emitting display device of claim 1, wherein the first groove is positioned between the blocking structure and the opening when the organic light emitting display device is viewed in a cross-sectional direction. The organic light-emitting display device of claim 1, wherein the first groove has a planar shape of a ring when the organic light-emitting display device is viewed in a planar direction. The method of claim 1, wherein the substrate,
A first organic film layer;
A first barrier layer disposed on the first organic layer;
A second organic film layer disposed on the first barrier layer and having a trench in the peripheral area; And
And a second barrier layer disposed on the second organic layer, having a protruding portion protruding from the trench inwardly of the trench, and having an opening defined by the protruding portion. The method of claim 12, wherein the protrusion of the second barrier layer,
A first protrusion positioned adjacent to the opening of the substrate; And
And a second protrusion facing the first protrusion and spaced apart from the first protrusion in a direction from the opening area to the peripheral area. The organic method of claim 12, wherein the trench of the second organic film layer, the protrusion of the second barrier layer, and the opening of the second barrier layer are defined as a first groove in which the lower portion of the substrate is expanded. Light-emitting display device. The method of claim 1, wherein the light emitting structure,
Lower electrode;
A light emitting layer disposed on the lower electrode; And
An organic light-emitting display device comprising: an upper electrode disposed on the emission layer. The organic light-emitting display device of claim 15, wherein the emission layer extends in a direction from the display area to the peripheral area on the substrate, and the emission layer is short-circuited at a portion in which the first groove is formed. . The organic light-emitting display device of claim 15, wherein the upper electrode extends in a direction from the display area to the peripheral area on the substrate, and the upper electrode is short-circuited at a portion in which the first groove is formed. The organic light-emitting display device of claim 15, wherein each of the emission layer and the upper electrode is disposed in at least a part of the first groove. The organic light-emitting display device of claim 15, wherein each of the emission layer and the upper electrode is disposed on the blocking structure. The method of claim 1,
A thin film encapsulation structure disposed on the light emitting structure; And
And a touch screen structure disposed in the display area on the thin film encapsulation structure. The method of claim 20, wherein the thin film encapsulation structure,
A first thin film encapsulation layer comprising an inorganic material;
A second thin film encapsulation layer disposed on the first thin film encapsulation layer and comprising an organic material; And
And a third thin film encapsulation layer disposed on the second thin film encapsulation layer and comprising an inorganic material. The method of claim 21, wherein each of the first thin film encapsulation layer and the third thin film encapsulation layer extends in a direction from the display area to the peripheral area on the substrate, and is continuously disposed in a portion where the first groove is formed. An organic light-emitting display device comprising: The method of claim 21, wherein the touch screen structure,
A first insulating layer disposed in the display area on the third thin film encapsulation layer;
A touch screen electrode disposed on the first insulating layer;
A second insulating layer disposed on the touch screen electrode;
A touch screen connection electrode disposed on the second insulating layer; And
And a protective insulating layer disposed on the touch screen connection electrode. The organic method of claim 23, wherein the first insulating layer extends in a direction from the display area to the peripheral area on the second thin film encapsulation layer, and is continuously disposed in a portion where the first groove is formed. Light-emitting display device. The method of claim 23, wherein the first thin film encapsulation layer, the third thin film encapsulation layer, the first insulating layer, and the first insulating layer are disposed on the blocking structure, and the first insulating layer and the second insulating layer are formed. The organic light emitting display device, wherein the organic insulating pattern is disposed between layers. The organic light-emitting display device of claim 23, wherein the second insulating layer contacts an upper surface of the first insulating layer in the display area and the upper surface of the organic insulating pattern in the peripheral area. The method of claim 1, wherein the substrate,
At least one lower portion formed between the first groove and the opening of the substrate further comprises a second groove extending,
The organic light-emitting display device according to claim 1, wherein the first groove surrounds the second groove. The method of claim 1, wherein the substrate,
The organic light emitting diode display device further comprising at least one third groove surrounding the first groove. The organic light emitting diode display of claim 28, wherein the third groove surrounds the blocking structure. The method of claim 1,
A polarizing layer disposed in the display area and the peripheral area on the substrate; And
The organic light emitting diode display device further comprising a window member disposed on the polarizing layer. The organic light-emitting display device of claim 30, wherein the polarizing layer has an opening overlapping the opening of the substrate. The method of claim 30,
The organic light emitting diode display device further comprising an adhesive layer disposed between the polarizing layer and the window member.

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