CN114062254A - Blind hole binding force test fixture and test method thereof - Google Patents
Blind hole binding force test fixture and test method thereof Download PDFInfo
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- CN114062254A CN114062254A CN202111326327.4A CN202111326327A CN114062254A CN 114062254 A CN114062254 A CN 114062254A CN 202111326327 A CN202111326327 A CN 202111326327A CN 114062254 A CN114062254 A CN 114062254A
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- blind hole
- line group
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- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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Abstract
The invention relates to a blind hole bonding force test fixture and a test method thereof, and the blind hole bonding force test fixture comprises a PCB and a drawing line group, wherein one end of the drawing line group is horizontally welded on a blind hole bonding pad of the PCB, the drawing line group consists of a plurality of drawing lines, the drawing lines are fixed together in a welding mode, during testing, the drawing line group is pulled up vertically by force, and the condition of the bottom of a pulled blind hole is observed by a magnifier to judge whether the blind hole bonding force is qualified. The test fixture has higher defective product detection rate, can greatly reduce the risk of defective missed detection, and avoids causing great loss for companies.
Description
Technical Field
The invention relates to a blind hole binding force, in particular to a blind hole binding force test jig and a test method thereof.
Background
The reliability of the blind holes of the HDI (High Density interconnect) product is crucial, the influence degree of the functional abnormality is High, the range is wide, and the mass blind hole abnormal machine withdrawal is frequent at the market end in the industry, so that the damage to PCB factories and customers is large. At present, HCT (High current test) is mostly adopted in the blind hole bonding force detection industry, but the HCT has the defects of low efficiency, independent design of a test strip, incapability of detecting blind holes in a plate and the like, so that the blind hole bonding force detection method has certain limitation.
Disclosure of Invention
In order to overcome the defects, the invention provides a blind hole bonding force test fixture, wherein a drawing line group is manufactured by using waste test needles and is welded on a blind hole bonding pad of a PCB, the blind hole bonding force is judged by drawing off the drawing line group, and the blind hole bonding force test fixture is simple and quick to operate and has high detectable rate.
The technical scheme adopted by the invention for solving the technical problem is as follows:
the utility model provides a blind hole cohesion test fixture, includes the PCB board and draws the group, draw the one end of group weld horizontally on the blind hole pad of PCB board, just draw the group and constitute by a plurality of drawing lines, be in the same place through welded mode is fixed between a plurality of drawing lines, during the test, pull out the group hard vertically upwards, observe the blind hole bottom condition of drawing off with the magnifying glass and judge whether blind hole cohesion is qualified.
Preferably, the drawing line group consists of 2-4 drawing lines, and the drawing lines are waste test needles.
Preferably, the plurality of drawing lines are welded together through tin soldering, after a solder resist layer is coated on the blind hole pad, tin is taken from a tin wire by utilizing electric iron, one end of the drawing line group is welded on the blind hole pad, and the other end of the drawing line group is a free end.
The invention also provides a blind hole bonding force testing method, which comprises the following steps:
step 1: selecting a test object: designing a dense blind hole pad on the edge of the PCB for testing, or taking a point in the dense blind hole pad area in the PCB for testing;
step 2: manufacturing a drawing line group: preparing a plurality of drawing lines, taking tin from a tin wire by utilizing the heated electric ferrochrome, and welding the plurality of drawing lines together to form a drawing line group;
and step 3: manufacturing a jig: uniformly coating the soldering flux on the surface of a blind hole bonding pad to be tested by using a cotton swab, taking tin from a tin wire by using the heated electric soldering iron, welding one end of a drawing line group on the surface of the blind hole bonding pad, and taking the other end of the drawing line group as a free end;
and 4, step 4: pulling off the drawing wire group: after the welding part of the drawing line group and the welding pad is cooled, the other end of the drawing line group is pulled upwards by force, and the drawing line group is pulled out of the blind hole welding pad quickly;
and 5: and aligning the pulled blind hole bonding pad by using a magnifier, observing the state of the bottom of the blind hole, and judging whether the bonding force of the blind hole is qualified according to an observation result.
Preferably, in the step 2, 2 to 4 drawing lines are prepared, and 2 to 4 drawing lines are used to form a drawing line group, wherein the drawing lines are waste test needles.
Preferably, in the steps 2 and 3, the heating temperature of the electric ferrochrome is 260-300 ℃.
Preferably, in the step 5, a magnifying glass of 40 times is aligned with the position of the pulled-off blind hole pad to observe the state of the bottom of the blind hole, and the standard for judging whether the bonding force of the blind hole is qualified is as follows: if the copper layer at the bottom of the blind hole is completely pulled to be empty, the bonding force of the blind hole is qualified; otherwise, longitudinal slicing observation of the blind hole is needed, if the copper layer at the bottom of the blind hole is smoothly separated from the copper layer on the inner layer, the bonding force of the blind hole is unqualified, and otherwise, the blind hole is judged to be qualified.
The invention has the beneficial effects that: the simple test fixture is manufactured by using the drawing line group, is suitable for all HDI products, can be applied to blind holes at any position in a board, and is wide in application range and high in practicability.
Drawings
FIG. 1 is a schematic structural diagram of a test fixture according to the present invention;
FIG. 2 is a schematic structural view of a PCB board according to the present invention;
FIG. 3 is a schematic structural diagram of a pull wire group according to the present invention;
FIG. 4 is a photograph showing the disconnection of copper in a blind via according to the test results of the present invention;
FIG. 5 is a photograph showing the peeling of the inner copper layer in the test results of the present invention;
FIG. 6 is a photograph of the copper residue in a blind via according to the test results of the present invention;
FIG. 7 is a photograph showing the fracture of the inner copper layer in the test results of the present invention;
FIG. 8 is a photograph showing the inner copper layer pulled up according to the test results of the present invention;
FIG. 9 is a photograph showing the smooth separation of the copper layer at the bottom of the via from the copper layer at the inner layer according to the test results of the present invention;
in the figure: 10-PCB board, 11-blind hole pad and 20-drawing line group.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
As shown in fig. 1-3, a blind hole bonding force test fixture comprises a PCB 10 and a drawing line group 20, wherein one end of the drawing line group is horizontally welded on a blind hole pad 11 of the PCB, the drawing line group is composed of a plurality of drawing lines, the drawing lines are fixed together in a welding mode, during testing, the drawing line group 20 is pulled upwards by force vertically, and a magnifier is used for observing the condition of the bottom of a pulled blind hole to judge whether the bonding force of the blind hole is qualified. The simple test fixture is manufactured by using the drawing line group, is suitable for all HDI products, can be applied to blind holes at any position in a board, and is wide in application range and high in practicability.
As shown in fig. 3, the drawing line group is composed of 2-4 drawing lines, and the drawing lines are waste test needles. The waste test needles are used for manufacturing the drawing line group, the waste is recycled, and the manufacturing cost is low.
The plurality of drawing lines are welded together through tin, after a solder resist layer is coated on the blind hole welding pad, tin is taken from a tin wire by utilizing the electric iron, one end of the drawing line group 20 is welded on the blind hole welding pad, and the other end of the drawing line group is a free end. During testing, the other end of the pull wire group 20 is pulled vertically upwards, so that one end of the pull wire group is separated from the PCB.
A blind hole bonding force testing method comprises the following steps:
step 1: selecting a test object: designing a dense blind hole pad on the edge of the PCB 10 for testing, or taking a point in the dense blind hole pad area in the PCB for testing;
step 2: manufacturing a drawing line group: preparing a plurality of drawing lines, taking tin from a tin wire by utilizing the heated electric ferrochrome, and welding the plurality of drawing lines together to form a drawing line group 20;
and step 3: manufacturing a jig: uniformly coating the soldering flux on the surface of a blind hole pad to be tested by using a cotton swab, taking tin from a tin wire by using the heated electric soldering iron, welding one end of a drawing wire group 20 on the surface of the blind hole pad, and taking the other end of the drawing wire group as a free end;
and 4, step 4: pulling off the drawing wire group: after the welding part of the drawing line group and the bonding pad is cooled, the other end of the drawing line group is pulled upwards by force, and the drawing line group 20 is pulled out from the blind hole bonding pad 11 rapidly;
and 5: and aligning the pulled blind hole bonding pad by using a magnifier, observing the state of the bottom of the blind hole, and judging whether the bonding force of the blind hole is qualified according to an observation result.
In the step 2, 2-4 drawing lines are prepared, and 2-4 drawing lines are used for forming a drawing line group, wherein the drawing lines are waste test needles. Can recycle the waste, and does not increase the test cost.
In the steps 2 and 3, the heating temperature of the electric ferrochrome is 260-300 ℃. Further, the heating temperature of the electric iron is 280 ℃.
In step 5, a magnifying glass of 40 times is aligned with the position of the pulled-off blind hole pad to observe the state of the bottom of the blind hole, and the standard for judging whether the bonding force of the blind hole is qualified is as follows: if the copper layer at the bottom of the blind hole is completely pulled to be empty, the bonding force of the blind hole is qualified; otherwise, longitudinal slicing observation of the blind hole is needed, if the copper layer at the bottom of the blind hole is smoothly separated from the copper layer on the inner layer, the bonding force of the blind hole is unqualified, and otherwise, the blind hole is judged to be qualified.
Example (b): researchers have adopted a large number of experiments to verify the validity of the test fixture and the test method, wherein the following tables 2 and 3 are the test results of 20 selected groups of experiments, wherein 10 groups of the test results of blind hole tension adopting the invention are that the blind hole bonding force is qualified, and the other 10 groups of the test results are unqualified and are compared with the traditional HCT test results;
the judgment standard of the blind hole tension test is as follows: after pulling off the drawing line group, the state of the bottom of the blind hole is observed by aligning the position of the pulled blind hole bonding pad with a magnifying lens of 40 times, and the standard for judging whether the bonding force of the blind hole is qualified is as follows: if the copper layer at the bottom of the blind hole is completely pulled to be empty, namely the copper at the bottom of the blind hole and the copper at the inner layer are both pulled off, the bonding force of the blind hole is qualified; otherwise, longitudinal slicing observation of the blind hole is needed, if the copper layer at the bottom of the blind hole is flatly separated from the inner layer copper, the bonding force of the blind hole is unqualified, if the copper layer at the bottom of the blind hole is not flatly separated from the inner layer copper, the blind hole is judged to be qualified, and the test results have various conditions as shown in the following table 1 and figures 4-9.
Table 1: test phenomenon and conclusion correspondence table
Table 2: blind hole tension test failure group
Table 3: blind hole tension test qualified set
Wherein, the same group of blind hole tension tests in tables 2 and 3 and the traditional HCT test adopt samples with the same standard, and according to the test results in table 2, in 10 groups of tests, the test result of the blind hole tension of the invention is NG which is unqualified, but only 2 groups of blind hole tension passing one HCT test are unqualified, and other 8 groups of HCT pass 2 times or more than 2 times to test the test product as unqualified product, therefore, the detection rate of the blind hole tension abnormity of the invention is greatly higher than that of the HCT test, and the invention has practicability;
according to the test results in table 3, in 10 sets of tests, the blind hole tensile force test result of the present invention is OK, i.e. qualified, and the test result passes 10 HCT tests, which proves that the blind hole tensile force test result of the present invention is very reliable.
It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. The utility model provides a blind hole cohesion test fixture which characterized in that: including PCB board (10) and drawing group (20), the one end of drawing the group weld horizontally in on the blind hole pad (11) of PCB board, just draw the group and constitute by a plurality of drawing lines, be in the same place through welded mode is fixed between a plurality of drawing lines, during the test, pull out group (20) with vertical upwards pulling hard, whether qualified is judged to the blind hole cohesion with the blind hole bottom condition that the magnifying glass observation was pulled out.
2. The blind hole bonding force testing jig according to claim 1, wherein: the drawing line group (20) is composed of 2-4 drawing lines, and the drawing lines are waste test needles.
3. The blind hole bonding force testing jig according to claim 2, wherein: the drawing lines are welded together through tin, after a solder resist layer is coated on the blind hole welding pad, tin is taken from a tin wire by utilizing the electric soldering iron, one end of the drawing line group (20) is welded on the blind hole welding pad, and the other end of the drawing line group is a free end.
4. A blind hole bonding force testing method using the testing jig of any one of claims 1 to 3, characterized in that: the method comprises the following steps:
step 1: selecting a test object: designing a dense blind hole pad on the edge of the PCB (10) for testing, or taking a point in the dense blind hole pad area in the PCB for testing;
step 2: manufacturing a drawing line group: preparing a plurality of drawing lines, taking tin from a tin wire by utilizing the heated electric ferrochrome, and welding the plurality of drawing lines together to form a drawing line group (20);
and step 3: manufacturing a jig: uniformly coating the soldering flux on the surface of a blind hole bonding pad to be tested by using a cotton swab, taking tin from a tin wire by using the heated electric soldering iron, welding one end of a drawing line group (20) on the surface of the blind hole bonding pad, and taking the other end of the drawing line group as a free end;
and 4, step 4: pulling off the drawing wire group: after the welding part of the drawing line group and the welding pad is cooled, the other end of the drawing line group is pulled upwards by force, and the drawing line group (20) is pulled out from the blind hole welding pad (11) rapidly;
and 5: and aligning the pulled blind hole bonding pad by using a magnifier, observing the state of the bottom of the blind hole, and judging whether the bonding force of the blind hole is qualified according to an observation result.
5. The blind hole bonding force testing method according to claim 4, wherein: in the step 2, 2-4 drawing lines are prepared, and 2-4 drawing lines are used for forming a drawing line group, wherein the drawing lines are waste test needles.
6. The blind hole bonding force testing method according to claim 4, wherein: in the steps 2 and 3, the heating temperature of the electric ferrochrome is 260-300 ℃.
7. The blind hole bonding force testing method according to claim 4, wherein: in the step 5, a magnifying glass of 40 times is aligned with the position of the pulled-off blind hole pad to observe the state of the bottom of the blind hole, and the standard for judging whether the bonding force of the blind hole is qualified is as follows: if the copper layer at the bottom of the blind hole is completely pulled to be empty, the bonding force of the blind hole is qualified; otherwise, longitudinal slicing observation of the blind hole is needed, if the copper layer at the bottom of the blind hole is smoothly separated from the copper layer on the inner layer, the bonding force of the blind hole is unqualified, and otherwise, the blind hole is judged to be qualified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111326327.4A CN114062254A (en) | 2021-11-10 | 2021-11-10 | Blind hole binding force test fixture and test method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111326327.4A CN114062254A (en) | 2021-11-10 | 2021-11-10 | Blind hole binding force test fixture and test method thereof |
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| CN114062254A true CN114062254A (en) | 2022-02-18 |
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| CN202111326327.4A Pending CN114062254A (en) | 2021-11-10 | 2021-11-10 | Blind hole binding force test fixture and test method thereof |
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