CN111175644A - Circuit board test auxiliary device, test system and test method - Google Patents
Circuit board test auxiliary device, test system and test method Download PDFInfo
- Publication number
- CN111175644A CN111175644A CN202010126711.9A CN202010126711A CN111175644A CN 111175644 A CN111175644 A CN 111175644A CN 202010126711 A CN202010126711 A CN 202010126711A CN 111175644 A CN111175644 A CN 111175644A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- testing
- test
- tested
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The invention relates to the field of electronic circuits, in particular to a circuit board test auxiliary device, a test system and a test method, which are characterized in that: the testing method selects the test points to be detected on the surface of the tested circuit board, and connects the test points to the wire connector or the standard grid bonding pad on the other side through the through hole of the double-sided circuit board through the corresponding connection point of the bridge circuit board and finally to the interface of the testing machine; before testing the circuit boards, the bridge circuit board and the tested circuit board are accurately aligned, a piece of micro-particle conductive cloth is placed between the bridge circuit board and the tested circuit board during testing, when the two circuit boards are tightly pressed by the pressing plate of the testing machine, the testing point of the tested circuit board passes through the micro-particle conductive cloth, and the bridge circuit board is connected to the testing platform to complete the testing of the testing platform on the open circuit, the short circuit and the insulation electrical performance of the tested circuit board. The invention reduces the testing cost and greatly improves the testing efficiency.
Description
Technical Field
The invention relates to the field of electronic circuits, in particular to a circuit board test auxiliary device, a circuit board test system and a circuit board test method.
Background
The circuit quality of the printed circuit board mainly comprises the correctness of the circuit, namely an open and break (O.S) test (open and break test), which can be usually completed by a needle bed testing machine and other machines (flying needle machine, AOI) and the like;
however, with the large-scale integrated circuit, surface mount device (SMT) mass usage, for example: the width and the spacing of the pads of the test points reach 4-6 mil (0.1 mm-0.15 mm), so that the fine test points cannot meet the detection requirements by using the traditional needle bed.
The current method for detecting the circuit board can only be solved by using an expensive flying probe tester or an automatic optical inspection machine (AOI); however, this test scheme takes a long time (about 1-10 minutes per board) and is not suitable for mass production by circuit board manufacturers.
Disclosure of Invention
The invention aims to provide a circuit board test auxiliary device, a test system and a test method, which change the traditional needle bed jig detection method which needs time, labor and capital waste, reduce the test cost and greatly improve the test efficiency.
In order to solve the technical problems, the technical scheme of the invention is as follows: a circuit board test assisting device, comprising: the bridge circuit board is a double-sided printed circuit board, one side of the bridge circuit board is provided with a contact point corresponding to the test point of the tested circuit board, and the other side of the bridge circuit board is provided with a connection point which is electrically connected with the contact point and is used for being matched and electrically connected with the test platform interface; the micro-particle conductive cloth is arranged between the bridging circuit board and the tested circuit board, when the bridging circuit board and the tested circuit board are stressed, the test point of the tested circuit board and the corresponding contact point on the bridging circuit board are conductive through the micro-particle conductive cloth, and the test point of the tested circuit board is connected to the bridging circuit board and output to the test platform interface.
According to the scheme, the contact point of one surface of the bridge circuit board corresponds to the test point of the tested circuit board, the contact pads distributed at the standard interval are arranged at the connection point of the other surface of the bridge circuit board, and the bridge circuit board corresponds to the interface of the universal test machine for the printed circuit board, namely the test bottom pins at the standard interval, so that the test platform can be used for testing when the test platform is the universal test machine for the printed circuit board.
According to the scheme, the contact point of one surface of the bridge circuit board corresponds to the test point of the tested circuit board, the connection point of the other surface of the bridge circuit board is a wire connector and corresponds to the interface of the special test machine for the printed circuit board, and the test platform can be used for testing when the test platform is the special test machine for the printed circuit board.
According to the scheme, the micro-particle conductive cloth is composed of silica gel and micro conductive particles, the front side and the back side of the micro-particle conductive cloth are conducted by the micro conductive particles, and the micro conductive particles are not conducted; the area of the micro-particle conductive cloth is larger than that of the circuit board to be tested.
According to the scheme, the tested circuit board is provided with the positioning hole, and the bridging circuit board is provided with the positioning piece matched with the positioning hole.
A circuit board testing system, comprising:
the circuit board testing auxiliary device; and
and the test platform is connected to the test point of the tested circuit board through the circuit board test auxiliary device and is used for carrying out electrical performance test on the tested circuit board.
A circuit board testing method is characterized by comprising the following steps:
step 1: manufacturing a bridge circuit board according to a tested circuit board, wherein the bridge circuit board is a double-sided printed circuit board, one side of the bridge circuit board is provided with a contact point corresponding to a test point of the tested circuit board, and the other side of the bridge circuit board is provided with a connection point which is electrically connected with the contact point and is used for being matched and electrically connected with a test platform interface;
step 2: the testing method comprises the steps of vertically placing a bridging circuit board and a tested circuit board, enabling a contact point of the bridging circuit board to correspond to a testing point of the tested circuit board, placing micro-particle conductive cloth between the bridging circuit board and the tested circuit board, enabling the testing point of the tested circuit board and the corresponding contact point on the bridging circuit board to be conductive through the micro-particle conductive cloth after the bridging circuit board and the tested circuit board are stressed, connecting the testing point of the tested circuit board to the bridging circuit board and outputting the testing point to a testing platform interface, and testing the tested circuit board by a testing platform.
According to the scheme, the step 1 specifically comprises the following steps: adopting circuit board test point selection software to generate a gerber file for manufacturing the double-sided bridge circuit board according to the gerber file of the tested circuit board, selecting points corresponding to the test points of the tested circuit board on the front side of the gerber file to form contact points, wherein the connection points are matched and electrically connected with a test platform interface on the back side of the gerber file, and the contact points are electrically connected to the connection points on the back side through circuits for output; and manufacturing the bridging circuit board according to the gerber file of the bridging circuit board and the PCB manufacturing process.
According to the scheme, the step 1 further comprises the following steps: the circuit board testing method comprises the steps that a positioning hole is formed in the edge of a tested circuit board, a positioning piece is arranged on the edge of a bridging circuit board, and when the positioning piece is located in the positioning hole, a testing point of the tested circuit board corresponds to a contact point of the bridging circuit board.
According to the scheme, the step 2 specifically comprises the following steps: when the tested circuit board is tested on a single side, the connecting point of the bridging circuit board is correspondingly connected to the interface of the testing platform, the micro-particle conductive cloth is placed on one side of the contact point of the bridging circuit board, the tested circuit board is fixed to enable the testing point to correspond to the contact point, and the testing platform carries out single-side testing on the tested circuit board.
According to the scheme, the step 2 specifically comprises the following steps: when the tested circuit board is subjected to double-sided testing, the double sides of the tested circuit board are both testing points, two bridge circuit boards are manufactured according to the step 1, the tested circuit board is positioned between the two bridge circuit boards, the connecting point of the two bridge circuit boards is correspondingly connected to the interface of the testing platform, the micro-particle conductive cloth is placed on one side of the contact point of the bridge circuit board, the tested circuit board is fixed to enable the testing point to correspond to the contact point, and the testing platform is used for carrying out double-sided testing on the tested circuit board.
The invention has the following beneficial effects: the invention selects the test points to be detected on the surface of the tested circuit board, and connects the test points to the wire connector or the standard grid bonding pad on the other side to the interface of the tester through the corresponding connection points of the bridge circuit board (through the through holes of the double-sided circuit board); before testing the circuit boards, the bridge circuit board and the tested circuit board are accurately aligned, a piece of micro-particle conductive cloth is placed between the bridge circuit board and the tested circuit board during testing, when the two circuit boards are tightly pressed by a pressing plate of a testing machine, the testing point of the tested circuit board passes through the micro-particle conductive cloth, and the bridge circuit board is connected to the testing platform to complete the testing of the testing platform on the electrical performances of the tested circuit board, such as opening, short circuit, insulation and the like; the testing method changes the traditional needle bed jig detection method which needs time, labor and capital waste, and particularly along with the batch application of high-density interconnected circuit boards, the cost for manufacturing the testing jig is very high, and the manufacturing period is quite long; by adopting the testing method, a manufacturer of circuit boards only needs to manufacture a bridging circuit board and purchase a piece of microparticle conductive cloth which can be used repeatedly, so that the requirement of detecting the high-density circuit board can be met by applying a special or general testing machine with low common price, the testing cost is reduced, and the testing efficiency is greatly improved.
Drawings
FIG. 1 is a schematic structural diagram of a single-side test system for a circuit board under test according to the present invention;
FIG. 2 is a schematic structural diagram of the test system of the present invention for performing double-sided testing on a circuit board under test.
Reference numerals:
1. a bridge circuit board; 1a, a lower bridge circuit board; 1b, an upper bridge circuit board; 101. a contact point; 101a, a lower contact point; 101b, an upper contact point; 102. a connection point; 102a, a lower connection point; 102b, an upper connection point; 103. a positioning member;
2. micro-particle conductive cloth; 2a, lower corpuscle conductive cloth; 2b, coating a micro-particle conductive cloth;
3. a circuit board to be tested; 301. testing points; 301a, a lower test point; 301b, an upper test point;
4. a test platform; 401. testing a bottom needle; 401a, testing a bottom needle; 401b, testing a bottom needle; 402, performing a chemical reaction; and (6) testing a press plate of the machine.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1 and 2, the present invention provides a circuit board testing assisting apparatus, a testing system and a testing method; the test auxiliary device comprises a bridging circuit board 1 and a microparticle conductive cloth 2; the test system comprises a test auxiliary device and a test platform 4, wherein the test platform 4 is connected to a test point 301 of the tested circuit board 3 through the circuit board test auxiliary device to test the electrical performance of the tested circuit board 3; the test platform 4 can be a printed circuit board universal test machine or a printed circuit board special test machine, a test interface of the printed circuit board universal test machine is a universal needle bed, a test bottom needle 401 is arranged on the universal needle bed, the distribution of the test bottom needle 401 is usually in a grid shape with standard spacing, and the standard spacing is 'single density 100mil and double density 50 mil'; the connection mode of the test interface of the special test machine for the printed circuit board and the bridge circuit board 1 is a 64-core oxhorn socket.
The bridge circuit board 1 is a double-sided printed circuit board, different tested circuit boards 3 are tested, the corresponding bridge circuit board 1 needs to be manufactured, contact points 101 corresponding to test points 301 of the tested circuit boards 3 are arranged on the front side of the bridge circuit board 1, and connection points 102 which are electrically connected to the contact points 101 and are used for being matched and electrically connected with interfaces of the test platform 4 are arranged on the back side of the bridge circuit board 1; the connection points 102 may be contact pads distributed at a standard pitch, which correspond to the test bottom pins 401 at a standard pitch of the universal tester for printed circuit boards, and may provide the test platform 4 for testing when the universal tester for printed circuit boards is used; the connection point 102 may also be configured as a connector including an outgoing line, one end of the outgoing line is connected to the connection point 102, the other end of the outgoing line is connected to the connector, and the connector is a 64-core ox horn socket, which can provide the test platform 4 for testing when the test platform is a tester dedicated to printed circuit boards.
The tested circuit board 3 is provided with a positioning hole, the bridging circuit board 1 is provided with a positioning part 103 matched with the positioning hole, the positioning part 103 can be a positioning pin, and when each tested circuit board 3 is tested, the positioning precision can be ensured only by placing the positioning hole on the positioning pin, so that the precision positioning of the contact point 101 and the test point 301 is realized.
The micro-particle conductive cloth 2 is arranged between the bridge circuit board 1 and the tested circuit board 3, when the bridge circuit board 1 and the tested circuit board 3 are stressed, the test point 301 of the tested circuit board 3 and the corresponding contact point 101 on the bridge circuit board 1 are conducted through the micro-particle conductive cloth 2, and the test point 301 of the tested circuit board 3 is connected to the bridge circuit board 1 and output to the interface of the test platform 4; the conductive fabric of corpuscle 2 is made up of silica gel and tiny conductive particle, the two sides of the conductive fabric of corpuscle 2 are conducted by tiny conductive particle, between the tiny conductive particle is non-conductive, tiny conductive particle is metal particle, do not receive vertical pressure to not conduct, the tiny conductive particle of the conductive fabric of corpuscle 2 is selected to be smaller, then can test the test pad of the thinner circuit board, the conductive fabric of corpuscle 2 adopts the conductive rubberized fabric product produced by Shin-Etsu company of Japan in this embodiment, its technical parameter refers to table 1 and table 2:
table 1: dimensions and tolerances
| Item | Unit of | Type AF | |
| Thickness of board | mm | 0.2±0.05，0.3±0.05， | |
| Diameter of | μm | 3～20 | |
| Length of | mm | 1.0～170.0 | |
| Width of | mm | 1.0～170.0 |
The size exceeds 170mm, and can be customized according to requirements;
table 2: basic properties
| Item | Unit of | Value of |
| Shore hardness A | HS(JIS A) | 65～73 |
| Compression set 1) | ％ | 30～35 |
| Contact resistance 2) | Ω/mm | ≦10 |
| Insulation resistance 3) | MΩ | ≦1×103 |
| Dielectric breakdown voltage | kV/mm | 23～27 |
| Working temperature range | ℃ | -25～85 |
1) expressed 3000 hours, measured at room temperature;
2) indicates that four terminals (current applied 1-10mA) were used, calculated as the minimum electrode connection area;
3) charging DC500V in the region between the smallest electrodes with a connection characteristic.
The invention also provides a circuit board testing method adopting the testing system, which comprises the steps of selecting the testing points 301 to be detected on the surface of the tested circuit board 3, enabling the contact points 101 and the connection points 102 of the bridge circuit board 1 to pass through the through holes of the double-sided circuit board, and connecting the testing points 301 to the testing interface of the testing platform 4 through the corresponding contact points 101 of the bridge circuit board 1 and the wire connectors or standard grid bonding pads on the other surface; before testing the circuit board 3 to be tested, the bridge circuit board 1 and the circuit board to be tested are accurately aligned, a piece of conductive micro-particle cloth 2 (conductive adhesive) is placed between the bridge circuit board 1 and the circuit board to be tested during testing, when the test machine pressing plate 402 of the test platform 4 tightly presses the circuit board 3 to be tested and the bridge circuit board 1, the test point 301 of the circuit board 3 to be tested passes through the conductive micro-particle cloth 2, and the bridge circuit board 1 is connected to the interface of the test platform 4 to complete the testing of electrical performances such as opening, short circuit, insulation and the like of the circuit board; the test method comprises the following specific steps:
step 1: manufacturing a bridge circuit board 1 according to a tested circuit board 3, wherein the bridge circuit board 1 is a double-sided printed circuit board, one side of the bridge circuit board 1 is provided with a contact point 101 corresponding to a test point 301 of the tested circuit board 3, and the other side of the bridge circuit board 1 is provided with a connection point 102 which is electrically connected with the contact point 101 and is used for being matched and electrically connected with an interface of a test platform 4;
step 1.1: software generates a corresponding test point 301 and an output mode; adopting the existing point selection software for the test points 301 of the printed circuit board, generating a gerber file for manufacturing the double-sided bridge circuit board 1 according to the gerber file of the tested circuit board 3, selecting points corresponding to the test points 301 of the tested circuit board 3 on the front side of the gerber file to form contact points 101, wherein the back side of the gerber file is a connection point 102 which is electrically connected with the interface of the test platform 4 in a matching way, the bridge circuit board 1 is a double-sided circuit board and is provided with a selection hole, and the contact points 101 are electrically connected to the connection point 102; the output mode can be divided into 2 different test platforms 4, namely test machines: the output mode matched with the special test machine for the printed circuit board is a 64-core oxhorn socket which is used for connecting an interface of the special test machine for the printed circuit board; when the output mode of the general test machine for the printed circuit board is used, the reverse connection point 102 of the bridge circuit board 1 outputs a standard matrix contact pad according to the distance (generally 100mil) of the general test bottom needle 401 corresponding to the general test machine, and is used for connecting a general needle bed of the general test machine, so that the circuit board of the high-density interconnection and tiny test point 301 can be tested by the single-density general needle bed;
step 1.2: manufacturing a bridge circuit board 1; manufacturing the bridge circuit board 1 according to the gerber file of the bridge circuit board 1 and the PCB manufacturing process; the surface of the bridge circuit board does not need to be subjected to processes of resistance welding, tin spraying and the like, so that the cost can be saved; in the implementation, the front of the bridge circuit board 1 selects a contact point 101 corresponding to a test point 301 of the tested circuit board 3, the back of the bridge circuit board 1 is provided with a connection point 102 which is electrically connected to the contact point 101 and is used for being matched and electrically connected with an interface of the test platform 4, and the output mode of the connection point 102 is a universal grid pad with a spacing of 100 mil;
step 1.3: precision positioning; because the positioning holes of the file for manufacturing the bridge circuit board 1 are consistent with the tested circuit board 3, only a plurality of positioning pins are required to be arranged at the positioning holes of the bridge circuit board 1, and the positioning holes of the tested circuit board 3 are placed on the positioning pins when each tested circuit board 3 is tested, so that the positioning accuracy can be ensured.
Step 2: placing the bridge circuit board 1 and the tested circuit board 3 up and down, enabling a contact point 101 of the bridge circuit board 1 to correspond to a test point 301 of the tested circuit board 3, placing a micro-particle conductive cloth 2 between the bridge circuit board 1 and the tested circuit board 3, conducting the test point 301 of the tested circuit board 3 and the corresponding contact point 101 on the bridge circuit board 1 through the micro-particle conductive cloth 2 after the bridge circuit board 1 and the tested circuit board 3 are stressed, connecting the test point 301 of the tested circuit board 3 to the bridge circuit board 1 and outputting the test point to a test platform 4 interface, and testing the tested circuit board 3 by the test platform 4;
two test embodiments are given below:
the first implementation mode comprises the following steps: the circuit board 3 to be tested is a single-side test, refer to fig. 1;
correspondingly connecting a connecting point 102 of a bridging circuit board 1 to an interface of a testing platform 4, placing a micro-particle conductive cloth 2 on one surface of a contact point 101 of the bridging circuit board 1, fixing a tested circuit board 3 to enable a testing point 301 of the tested circuit board to correspond to the contact point 101, and carrying out single-side testing on the tested circuit board 3 by the testing platform 4;
when the test platform 4 adopts a universal test machine for printed circuit boards, the connection point 102 of the bridge circuit board 1 is fixed on a universal test bottom needle 401 of the universal test machine or other manufactured universal arrays through a positioning device, and the connection point 102 is a contact pad; covering with the conductive cloth 2 of the corpuscle, placing the circuit board 3 to be tested, pressing the two circuit boards tightly by the pressing board 402 of the testing machine, and carrying out universal single-sided testing;
when the test platform 4 adopts a special test machine for the printed circuit board, the bridge circuit board 1 is fixed on a bottom plate of the special test machine through a positioning device, a connecting point 102 of the bridge circuit board 1 adopts a 64-core oxhorn socket (double-row 32-row or 64-row line) for connecting an interface board plug-in unit of the special test machine for the printed circuit board, and a press plate 402 of the test machine compresses the two circuit boards for special single-side test;
the second embodiment: the circuit board 3 to be tested is a double-sided test, see fig. 2;
the two sides of the tested circuit board 3 are both testing points 301, two bridge circuit boards 1 are manufactured according to the step 1, the two bridge circuit boards comprise a lower bridge circuit board 1a and an upper bridge circuit board 1b, and the tested circuit board 3 is positioned between the lower bridge circuit board 1a and the upper bridge circuit board 1 b; correspondingly connecting the connection points 102 of the two bridge circuit boards 1 to an interface of a test platform 4, placing the micro-particle conductive cloth 2 on one surface of the contact point 101 of the bridge circuit board 1, fixing the tested circuit board 3 to enable the test point 301 to correspond to the contact point 101, and carrying out double-sided test on the tested circuit board 3 by the test platform 4;
when the test platform 4 adopts a printed circuit board universal tester, a lower bridge circuit board 1a and an upper bridge circuit board 1b are manufactured, and a lower connection point 102a of the lower bridge circuit board 1a is fixed on a universal lower test bottom needle 401a of the universal tester or other manufactured universal arrays through a positioning device; covering the upper and lower corpuscle conductive cloths 2a, placing the circuit board 3 to be tested, and enabling the lower test point 301a of the circuit board 3 to correspond to the lower contact point 101a of the lower bridge circuit board 1 a; fixedly connecting an upper connecting point 102b of an upper bridging circuit board 1b to a universal upper testing bottom needle 401b of a universal testing machine or other manufactured universal arrays through a positioning device, placing upper corpuscle conductive cloth 2b, wherein both a lower connecting point 102a and an upper connecting point 102b are contact pads, and an upper testing point 301b of a tested circuit board 3 corresponds to an upper connecting point 101b of the upper bridging circuit board 1 b; the circuit board is pressed tightly by a press plate 402 of the testing machine, and universal double-sided testing is carried out;
when the test platform 4 adopts a special test machine for the printed circuit board, a lower bridge circuit board 1a and an upper bridge circuit board 1b are manufactured, a lower connecting point 102a of the lower bridge circuit board 1a is fixed on a lower base plate of the special test machine through a positioning device, a lower corpuscle conductive cloth 2a is covered, and a tested circuit board 3 is placed, so that a lower test point 301a of the tested circuit board 3 corresponds to a lower contact point 101a of the lower bridge circuit board 1 a; fixedly connecting an upper connecting point 102b of an upper bridging circuit board 1b to an upper movable plate of a special testing machine through a positioning device and placing an upper corpuscle conductive cloth 2b, so that an upper test point 301b of a tested circuit board 3 corresponds to an upper contact point 101b of the upper bridging circuit board 1b, and a lower connecting point 102a and the upper connecting point 102b are connected with an interface board plug-in unit of the special testing machine for the printed circuit board by using 64-core oxhorn sockets; the circuit board is pressed by the test machine platen 402 for general double-sided testing.
In this embodiment, the testing platform 4 is a CS-4000 high voltage universal testing machine manufactured by the nanjing gold pentacyclic electronic technology ltd, which has a set of universal needle beds: 192 test points 301 in the X direction and 128 test points 301 in the Y direction, total 24576 universal test bottom needles 401 with the distance of 100mil, and the tester has the functions of automatically learning network data, automatically testing, searching the test points 301 and the like;
the learning process of the circuit board network data comprises the following steps: positioning the reverse side of the bridging circuit board 1 by using positioning devices on four sides of a general needle bed, wherein the positioning devices can be positioning pins, a standard grid connection point 102 generated on the reverse side of the bridging circuit board 1 just corresponds to the general needle bed of a general testing machine, and the connection point 102 on the reverse side of the bridging circuit board 1 is connected with a testing bottom needle 401 of the general needle bed and can be connected to an interface of the testing machine when being pressed;
placing a micro-particle conductive cloth 2 on the front surface of a bridge circuit board 1, wherein the area of the micro-particle conductive cloth 2 is larger than that of a tested circuit board 3, positioning the tested circuit board 3 after the micro-particle conductive cloth is placed flatly according to a positioning piece 103, namely a positioning pin, and starting the learning function of a machine; at the moment, the pressing plate 402 of the universal testing machine moves downwards according to the set height, and presses the tested circuit board 3 and the bridge circuit board 1 to ensure that the two are firmly contacted; after the contact is reliable, the universal testing machine performs test network learning, namely, the communication relation among the test points 301 is recorded into a data network table and stored for later test;
the test process of the circuit board is as follows: according to the learning network data, the tested circuit board 3 is placed and positioned, the testing function of the universal testing machine is started, the pressing board 402 of the universal testing machine runs downwards to a proper position according to the set height, the testing machine automatically compares the testing result with the learning data, and the result which can be output is a good board (PASS) or a bad board: OPEN circuit (OPEN), SHORT circuit (SHORT), and poor insulation, etc., and can be printed to facilitate maintenance of the circuit board.
The foregoing is a more detailed description of the present invention that is presented in conjunction with specific embodiments, and the practice of the invention is not to be considered limited to those descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A circuit board test assisting device, comprising:
the bridge circuit board (1), the said bridge circuit board (1) is a double-sided printed circuit board, wherein one side has contact point (101) corresponding to test point (301) of the circuit board (3) to be tested, another side has connection point (102) that connects electrically to contact point (101) and is used for connecting electrically with the interface of the test platform (4) in a matching way;
the testing device comprises a bridging circuit board (1), a tested circuit board (3) and a micro-particle conductive cloth (2), wherein the micro-particle conductive cloth (2) is arranged between the bridging circuit board (1) and the tested circuit board (3), when the bridging circuit board (1) and the tested circuit board (3) are stressed, a testing point (301) of the tested circuit board (3) and a corresponding contact point (101) on the bridging circuit board (1) are conducted through the micro-particle conductive cloth (2), and the testing point (301) of the tested circuit board (3) is connected to the bridging circuit board (1) and output to an interface of a testing platform (4).
2. The circuit board test assisting apparatus according to claim 1, wherein: the contact points (101) on one surface of the bridge circuit board (1) correspond to the test points (301) of the tested circuit board (3), the connection points (102) on the other surface are contact pads distributed at a standard interval and correspond to an interface of a universal test machine for the printed circuit board, namely test bottom pins (401) at the standard interval, and a test platform (4) can be provided for testing when the universal test machine for the printed circuit board is used.
3. The circuit board test assisting apparatus according to claim 1, wherein: the contact point (101) on one side of the bridge circuit board (1) corresponds to the test point (301) of the tested circuit board (3), the connection point (102) on the other side is a wire connector and corresponds to an interface of a special testing machine for the printed circuit board, and the testing platform (4) can be provided for testing when the testing platform is the special testing machine for the printed circuit board.
4. The circuit board test assisting apparatus according to claim 1, wherein: the micro-particle conductive cloth (2) consists of silica gel and micro conductive particles, the front surface and the back surface of the micro-particle conductive cloth (2) are conducted by the micro conductive particles, and the micro conductive particles are not conducted; the area of the micro-particle conductive cloth (2) is larger than that of the tested circuit board (3).
5. A circuit board testing system, comprising:
the circuit board test aid of any one of claims 1-4; and
the test platform (4) is connected to the test point (301) of the tested circuit board (3) through the circuit board test auxiliary device to test the electrical performance of the tested circuit board (3).
6. A circuit board testing method is characterized by comprising the following steps:
step 1: manufacturing a bridge circuit board (1) according to a tested circuit board (3), wherein the bridge circuit board (1) is a double-sided printed circuit board, one side of the bridge circuit board is provided with a contact point (101) corresponding to a test point (301) of the tested circuit board (3), and the other side of the bridge circuit board is provided with a connection point (102) which is electrically connected to the contact point (101) and is used for being matched and electrically connected with an interface of a test platform (4);
step 2: the testing method comprises the steps that a bridging circuit board (1) and a tested circuit board (3) are placed up and down, a contact point (101) of the bridging circuit board (1) corresponds to a testing point (301) of the tested circuit board (3), micro-particle conductive cloth (2) is placed between the bridging circuit board (1) and the tested circuit board (3), after the bridging circuit board (1) and the tested circuit board (3) are stressed, the testing point (301) of the tested circuit board (3) and the corresponding contact point (101) on the bridging circuit board (1) are conducted through the micro-particle conductive cloth (2), the testing point (301) of the tested circuit board (3) is connected to the bridging circuit board (1) and output to an interface of a testing platform (4), and the testing platform (4) tests the tested circuit board (3).
7. The circuit board testing method according to claim 6, wherein: the step 1 specifically comprises the following steps:
adopting circuit board test point (301) point selection software, generating a gerber file for manufacturing the double-sided bridge circuit board (1) according to the gerber file of the tested circuit board (3), selecting points corresponding to the test points (301) of the tested circuit board (3) on the front side of the gerber file to form contact points (101), wherein the connection points (102) matched and electrically connected with the test platform (4) interface are arranged on the back side of the gerber file, and the contact points (101) are electrically connected to the connection points (102) on the back side through circuits for output;
and manufacturing the bridging circuit board (1) according to the PCB manufacturing process according to the gerber file of the bridging circuit board (1).
8. The circuit board testing method according to claim 6, wherein: the step 1 further comprises: a positioning hole is formed in the side portion of the tested circuit board (3), a positioning piece (103) is arranged on the side portion of the bridging circuit board (1), and when the positioning piece (103) is located in the positioning hole, a test point (301) of the tested circuit board (3) corresponds to a contact point (101) of the bridging circuit board (1).
9. The circuit board testing method according to claim 6, wherein: the step 2 specifically comprises the following steps: when the tested circuit board (3) is tested on a single side, the connection point (102) of the bridging circuit board (1) is correspondingly connected to the interface of the testing platform (4), the micro-particle conductive cloth (2) is placed on one side of the contact point (101) of the bridging circuit board (1), the tested circuit board (3) is fixed to enable the test point (301) of the tested circuit board to correspond to the contact point (101), and the testing platform (4) performs single-side testing on the tested circuit board (3).
10. The circuit board testing method according to claim 6, wherein: the step 2 specifically comprises the following steps: when the tested circuit board (3) is subjected to double-sided testing, the double sides of the tested circuit board (3) are both testing points (301), two bridging circuit boards (1) are manufactured according to the step 1, the tested circuit board (3) is positioned between the two bridging circuit boards (1), the connecting points (102) of the two bridging circuit boards (1) are correspondingly connected to the interface of the testing platform (4), the micro-particle conductive cloth (2) is placed on one side of the contact point (101) of the bridging circuit board (1), the tested circuit board (3) is fixed to enable the testing points (301) to correspond to the contact point (101), and the testing platform (4) is used for carrying out double-sided testing on the tested circuit board (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010126711.9A CN111175644A (en) | 2020-02-28 | 2020-02-28 | Circuit board test auxiliary device, test system and test method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010126711.9A CN111175644A (en) | 2020-02-28 | 2020-02-28 | Circuit board test auxiliary device, test system and test method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111175644A true CN111175644A (en) | 2020-05-19 |
Family
ID=70655035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010126711.9A Pending CN111175644A (en) | 2020-02-28 | 2020-02-28 | Circuit board test auxiliary device, test system and test method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111175644A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113109696A (en) * | 2021-04-12 | 2021-07-13 | 万安裕维电子有限公司 | Method for testing performance of PCB conductive hole |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1701468A (en) * | 2003-01-17 | 2005-11-23 | Jsr株式会社 | Anisotropic conductive connector and production method therefor and inspectioon unit for circuit device |
| CN101680912A (en) * | 2008-09-23 | 2010-03-24 | 陈涛 | Universal switching device of special testing machine for testing circuit board and universal fixture |
| CN103879119A (en) * | 2012-12-20 | 2014-06-25 | 深圳科诺桥科技有限公司 | Printed circuit board, high-filling-power electromagnetic shielding film and making method of film |
| CN205787004U (en) * | 2016-05-05 | 2016-12-07 | 联策科技股份有限公司 | A kind of printed circuit board test fixture and Signals Transfer Board thereof and cushion pad |
| CN208387024U (en) * | 2018-06-01 | 2019-01-15 | Oppo广东移动通信有限公司 | Printing apparatus for circuit board |
| CN110058148A (en) * | 2019-05-29 | 2019-07-26 | 深圳市凯码时代科技有限公司 | Switching circuit board, switching fixture framework and corresponding circuit switch method |
-
2020
- 2020-02-28 CN CN202010126711.9A patent/CN111175644A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1701468A (en) * | 2003-01-17 | 2005-11-23 | Jsr株式会社 | Anisotropic conductive connector and production method therefor and inspectioon unit for circuit device |
| CN101680912A (en) * | 2008-09-23 | 2010-03-24 | 陈涛 | Universal switching device of special testing machine for testing circuit board and universal fixture |
| CN103879119A (en) * | 2012-12-20 | 2014-06-25 | 深圳科诺桥科技有限公司 | Printed circuit board, high-filling-power electromagnetic shielding film and making method of film |
| CN205787004U (en) * | 2016-05-05 | 2016-12-07 | 联策科技股份有限公司 | A kind of printed circuit board test fixture and Signals Transfer Board thereof and cushion pad |
| CN208387024U (en) * | 2018-06-01 | 2019-01-15 | Oppo广东移动通信有限公司 | Printing apparatus for circuit board |
| CN110058148A (en) * | 2019-05-29 | 2019-07-26 | 深圳市凯码时代科技有限公司 | Switching circuit board, switching fixture framework and corresponding circuit switch method |
Non-Patent Citations (3)
| Title |
|---|
| 刘国富: "《SMT设备操作与维护》", 31 August 2015, 北京理工大学出版社 * |
| 曹惟诚 等: "《胶接技术手册》", 31 August 1988, 上海科学技术出版社 * |
| 谭志良: "《电磁脉冲防护理论与技术》", 31 May 2013, 国防工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113109696A (en) * | 2021-04-12 | 2021-07-13 | 万安裕维电子有限公司 | Method for testing performance of PCB conductive hole |
| CN113109696B (en) * | 2021-04-12 | 2023-08-08 | 万安裕维电子有限公司 | PCB conductive hole performance test method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106771987B (en) | Integrated circuit chip burn-in test device and test method based on sub-mother board | |
| JP3442137B2 (en) | Conductive contact unit | |
| JP2002139529A (en) | Electric resistance measuring connector, and electric resistance measuring device and measuring method for circuit board | |
| CN111175644A (en) | Circuit board test auxiliary device, test system and test method | |
| CN212625492U (en) | LED chip detection device | |
| CN100507502C (en) | Test board and test method | |
| CN113109696B (en) | PCB conductive hole performance test method | |
| CN213240339U (en) | Connecting device for electronic component test | |
| CN201327520Y (en) | Test tool for connector | |
| CN101769979A (en) | Connector test fixture | |
| CN114137395A (en) | Double-sided assembled hybrid integrated circuit testing device | |
| CN209640378U (en) | The adapter base structure of test fixture | |
| KR101999834B1 (en) | Test Apparatus | |
| CN108680773A (en) | A kind of test contact chip connector | |
| CN217385733U (en) | Microphone control module | |
| CN219320361U (en) | Circuit board assembly test fixture | |
| CN112394237A (en) | Device and method for testing constant current of inductive element | |
| CN217689281U (en) | High-low frequency mixed-loading vertical interconnection test module | |
| CN219302533U (en) | Visual quick detection device of probe card connectivity | |
| CN219369842U (en) | Spring type wire needle jig | |
| CN210514583U (en) | Test system of touch display screen | |
| CN219915687U (en) | Test board assembly and detection device | |
| CN215599334U (en) | Experimental fixture is lighted to paster LED lamp pearl | |
| CN113899953B (en) | Testing device for resistance of metal bipolar plate, automatic production line and method for bipolar plate | |
| CN110672998B (en) | Conduction and withstand voltage test method and conduction and withstand voltage test assembly of connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200519 |
|
| RJ01 | Rejection of invention patent application after publication |