CN219320361U - Circuit board assembly test fixture - Google Patents

Circuit board assembly test fixture Download PDF

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Publication number
CN219320361U
CN219320361U CN202320271899.5U CN202320271899U CN219320361U CN 219320361 U CN219320361 U CN 219320361U CN 202320271899 U CN202320271899 U CN 202320271899U CN 219320361 U CN219320361 U CN 219320361U
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China
Prior art keywords
pcb
circuit board
board assembly
pad
test
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CN202320271899.5U
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Chinese (zh)
Inventor
张旭
哈小荣
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Shaanxi Baocheng Aviation Instrument Co Ltd
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Shaanxi Baocheng Aviation Instrument Co Ltd
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Priority to CN202320271899.5U priority Critical patent/CN219320361U/en
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Abstract

The utility model provides a circuit board subassembly test fixture is equipped with the circuit board subassembly that is supported on the circuit board I between PCB board I and PCB board II, be equipped with the spring test needle that corresponds with the input pad and the output pad position on the circuit board subassembly that is tested on the PCB board II, and spring test needle upper end and input pad and the output pad switch-on the PCB board II, and through adjusting the fixed height of PCB board II on PCB board I, make spring test needle and input pad and the output pad contact on the circuit board subassembly that is tested, the welding has the RF radio frequency connecting wire of shielding layer welding on the GND pad on the input pad and the output pad of PCB board II. According to the utility model, the tested circuit board assembly is tested after the +6V, -6V direct current power supply and the pulse signal are input through the test fixture, so that the test wire is prevented from being welded on the tested circuit board assembly, the test efficiency is improved, the hidden quality trouble caused by the test wire welded on the tested circuit board is avoided, the product quality is ensured, the test efficiency is greatly improved, and the production period is saved.

Description

Circuit board assembly test fixture
Technical Field
The utility model belongs to the technical field of circuit board testing, and particularly relates to a circuit board assembly testing clamp.
Background
After the assembly of some circuit board components is completed, testing is needed, so that the following requirements are met: input signal: 1) +6V DC power supply, -6V DC power supply; 2) Pulse signals (frequency 10Hz, pulse width 100ns, amplitude 1V, negative pulse); and (3) outputting a signal: 1) When the signal input end is not connected with the pulse signal, the signal output end tests the direct-current voltage signal; 2) The signal input end is connected with the pulse signal, and the signal output end is used for testing the peak value of the pulse signal; during testing, a +6V-6V direct current power supply is connected to a power supply input pad on the circuit board assembly, and an output direct current voltage signal is tested at the position of an output signal pad; the pulse signal input pad is connected with a negative pulse signal, the peak-to-peak value of the output pulse signal is tested at the position of the output signal pad, and the testing process has the following defects: 1) Before each circuit board assembly is tested, 11 input and output signal wires (11) are needed to be welded for testing, the operation is complex and tedious, and the production period is severely restricted; 2) The bonding pads on the circuit board assembly are required to be welded with test wires and disassembled after the test, and the bonding pads on the circuit board are repeatedly welded, so that the reliability of the product is affected; 3) Each circuit board assembly is welded with a test line manually, the consistency of the quality of welding spots is poor, and the accuracy and consistency of test results can be affected during testing, so that improvement is needed for the problems.
Disclosure of Invention
The utility model solves the technical problems that: the utility model provides a circuit board subassembly test fixture adopts the structure that sets up PCB board one and highly adjustable connection in PCB board two of PCB board one top, after the spring test needle on adjusting PCB board two highly to PCB board two contacts with the input pad and the output pad of being supported on the survey line circuit board subassembly on PCB board one, by the RF radio frequency link group that PCB board two and put through with spring test needle is connected with test equipment, through test fixture switching input +6V, -6V DC power supply, test to being surveyed the circuit board subassembly behind the pulse signal, avoid the dress welding test line on being surveyed circuit board subassembly, improve test efficiency, avoided the quality hidden danger that the dress welding test line brought on being surveyed the circuit board, guarantee product quality, improve test efficiency by a wide margin simultaneously, production cycle has been practiced thrift.
The utility model adopts the technical scheme that: the circuit board assembly test fixture comprises a first PCB and a second PCB which is arranged above the first PCB in parallel and connected with the first PCB in a height-adjustable mode as a whole, a tested circuit board assembly supported on the first PCB is arranged between the first PCB and the second PCB, a spring test needle corresponding to the positions of an input pad and an output pad on the tested circuit board assembly is arranged on the second PCB, the upper end of the spring test needle is communicated with the input pad and the output pad on the second PCB, and the spring test needle is contacted with the input pad and the output pad on the tested circuit board assembly by adjusting the fixed height of the second PCB on the first PCB, and RF (radio frequency) connecting wire groups are welded on the input pad and the output pad of the second PCB.
The first four corners of the PCB are provided with first copper studs, the upper ends of the first copper studs are connected with second PCB through locking nuts, and the heights of the second PCB are adjusted through rotating the locking nuts until the lower ends of the spring test pins are in contact with input pads and output pads on the tested circuit board assembly.
Further, a copper stud II, the upper end of which penetrates out of four corners of the tested circuit board assembly respectively, is arranged on the first board surface of the PCB, and the step surface of the upper end of the copper stud II is contacted with the bottom surface of the tested circuit board assembly to position the tested circuit board assembly.
Further, the RF radio frequency connecting line group comprises four input lines, four output lines, two positive and negative 6V power lines and a ground line.
Compared with the prior art, the utility model has the advantages that:
1. according to the technical scheme, the first PCB and the second PCB which is connected with the first PCB in a height-adjustable mode through the first copper stud and the locking nut are adopted, and conditions are provided for the height adjustment of the second PCB, so that a spring test needle at the bottom of the second PCB is ensured to reliably contact with an input bonding pad and an output bonding pad on a tested circuit board assembly;
2. according to the technical scheme, on the premise that a spring test pin is reliably contacted with an input bonding pad and an output bonding pad on a tested circuit board assembly, an RF radio frequency connecting wire set which is arranged on a PCB and is communicated with the spring test pin is connected with test equipment, the tested circuit board assembly is tested after a +6V, -6V direct current power supply and a pulse signal are input through a test fixture in a switching mode, the welding of a test wire on the tested circuit board assembly is avoided, and the test efficiency is improved;
3. according to the technical scheme, the quality hidden trouble caused by the welding test line on the tested circuit board is avoided, the product quality is guaranteed, the test efficiency is greatly improved, the production period is saved, and the test connection requirements of the tested circuit boards of different models are met.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model.
Detailed Description
The technical solution in the embodiments of the present utility model will be clearly and completely described in the following with reference to fig. 1 in the embodiments of the present utility model, and it is obvious that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The inclusion of an element as defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
The circuit board assembly test fixture, as shown in fig. 1, comprises a first PCB 1 and a second PCB 2 which is arranged above the first PCB 1 in parallel and is connected with the first PCB 1 in a height-adjustable mode into a whole, a tested circuit board assembly 6 which is supported on the first PCB 1 is arranged between the first PCB 1 and the second PCB 2, a spring test needle 3 which corresponds to the positions of an input pad and an output pad on the tested circuit board assembly 6 is arranged on the second PCB 2, the upper end of the spring test needle 3 is communicated with the input pad and the output pad on the second PCB 2, the spring test needle 3 is in contact with the input pad and the output pad on the tested circuit board assembly 6 through adjusting the fixed height of the second PCB 2 on the first PCB 1, an RF radio frequency connection wire group 8 is welded on the input pad and the output pad of the second PCB 2, and specifically, the RF radio frequency connection wire group 8 comprises four input wires, two power wires and a grounding wire of plus or minus 6V, and a shielding layer of four input wires and a shielding layer of the four output wires and a GND (ground wire) of the second PCB 2, and interference signal welding can be avoided.
The connection structure with adjustable PCB board two 2 and PCB board one height is specifically as follows: copper studs 5 are arranged at four corners of the first PCB 1, the upper end of each copper stud 5 is connected with the second PCB 2 through a lock nut 7, and the height of the second PCB 2 is adjusted through rotating the lock nut 7 until the lower end of a spring test needle 3 is contacted with an input bonding pad and an output bonding pad on a tested circuit board assembly 6; in the structure, on the premise that the spring test needle 3 is reliably contacted with an input pad and an output pad on the tested circuit board assembly 6, the RF radio frequency connecting wire group 8 which is arranged on the PCB 2 and is communicated with the spring test needle 3 is connected with test equipment (digital multimeter and oscilloscope), positive and negative 6V power wires and grounding wires in the RF radio frequency connecting wire group 8 in the test fixture are switched to input +6V, -6V direct current power or four input wires and four output wires in the RF radio frequency connecting wire group 8 to connect pulse signals, then the tested circuit board assembly 6 is tested, the test wires are prevented from being welded on the tested circuit board assembly 6, and the test efficiency is improved; the PCB I1 and the PCB II 2 which is connected with the PCB I1 in a height-adjustable way through the copper stud I5 and the lock nut 7 are adopted to provide conditions for the height adjustment of the PCB II 2, so that the spring test needle 3 at the bottom of the PCB II 2 is ensured to reliably contact with an input pad and an output pad on the tested circuit board assembly 6;
the supporting structure of the tested circuit board assembly 6 on the first PCB board 1 is specifically as follows: the first PCB board 1 is provided with a second copper stud 4, the upper ends of which respectively penetrate through four corners of the tested circuit board assembly 6, and the step surface of the upper end of the second copper stud 4 is contacted with the bottom surface of the tested circuit board assembly 6 to position the tested circuit board assembly 6.
The specific scheme is as follows:
1) According to the PCB file coordinates of the tested circuit board assembly 6, a first PCB 1 and a second PCB 2 are manufactured, and the position coordinates of an input bonding pad and an output bonding pad on the tested circuit board assembly 6 are guaranteed to be consistent;
2) A first copper stud 5 (M3X50+6) is arranged on the first PCB 1 and used for connecting the first PCB 1 with a second PCB 2, and a second copper stud 4 (M3X20+6) is arranged on the first PCB 1 and used for installing a tested circuit board assembly 6;
3) The method comprises the steps that a spring test needle 3 (P100-D-180 g) positioned at the bottom of a second PCB 2 is welded at the positions of an input bonding pad and an output bonding pad on the second PCB 2, a clamp of the first PCB 1 and the second PCB 2 is pressed tightly by adjusting a lock nut 7 on a first copper stud 5, and then the spring test needle 3 is contacted with the input bonding pad and the output bonding pad on a tested circuit board assembly 6;
4) And the positions of the input bonding pad and the output bonding pad on the PCB II 2 are welded with the RF radio frequency connecting wire group 8, and shielding layers of four input lines and four output lines in the RF radio frequency connecting wire group 8 are welded on the GND bonding pad of the PCB II 2, so that signal interference distortion is avoided.
The technical scheme avoids the hidden quality trouble caused by the welding of the test line on the tested circuit board 6, ensures the product quality, greatly improves the test efficiency, saves the production period and meets the test connection requirements of the tested circuit boards 6 with different models.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (4)

1. Circuit board subassembly test fixture, its characterized in that: the device comprises a first PCB (1) and a second PCB (2) which is arranged above the first PCB (1) in parallel and is connected with the first PCB (1) in a height-adjustable mode, a tested circuit board assembly (6) supported on the first PCB (1) is arranged between the first PCB (1) and the second PCB (2), a spring test needle (3) corresponding to the input pad and the output pad on the tested circuit board assembly (6) is arranged on the second PCB (2), the upper end of the spring test needle (3) is communicated with the input pad and the output pad on the second PCB (2), and the fixed height of the second PCB (2) on the first PCB (1) is adjusted to enable the spring test needle (3) to be in contact with the input pad and the output pad on the tested circuit board assembly (6), and an RF radio frequency connection wire set (8) is welded on the input pad and the output pad of the second PCB (2).
2. The circuit board assembly test fixture of claim 1, wherein: the four corners of the first PCB (1) are provided with first copper studs (5), the upper ends of the first copper studs (5) are connected with the second PCB (2) through lock nuts (7), and the heights of the second PCB (2) are adjusted to the lower ends of the spring test pins (3) through rotating the lock nuts (7), so that the lower ends of the spring test pins are in contact with input pads and output pads on the tested circuit board assembly (6).
3. The circuit board assembly test fixture of claim 1, wherein: the PCB board I (1) is provided with copper studs II (4) with upper ends penetrating out of four corners of the tested circuit board assembly (6) respectively, and the step surface at the upper end of the copper studs II (4) is contacted with the bottom surface of the tested circuit board assembly (6) to position the tested circuit board assembly (6).
4. A circuit board assembly test fixture according to claim 1 or 2 or 3, wherein: the RF radio frequency connecting line group (8) comprises four input lines, four output lines, two positive and negative 6V power lines and a ground line.
CN202320271899.5U 2023-02-21 2023-02-21 Circuit board assembly test fixture Active CN219320361U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320271899.5U CN219320361U (en) 2023-02-21 2023-02-21 Circuit board assembly test fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320271899.5U CN219320361U (en) 2023-02-21 2023-02-21 Circuit board assembly test fixture

Publications (1)

Publication Number Publication Date
CN219320361U true CN219320361U (en) 2023-07-07

Family

ID=87031577

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320271899.5U Active CN219320361U (en) 2023-02-21 2023-02-21 Circuit board assembly test fixture

Country Status (1)

Country Link
CN (1) CN219320361U (en)

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