CN114049845A - Bonding method of display and display - Google Patents
Bonding method of display and display Download PDFInfo
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- CN114049845A CN114049845A CN202111390671.XA CN202111390671A CN114049845A CN 114049845 A CN114049845 A CN 114049845A CN 202111390671 A CN202111390671 A CN 202111390671A CN 114049845 A CN114049845 A CN 114049845A
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- electrodes
- adhesive layer
- conductive adhesive
- anisotropic conductive
- display
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
Abstract
The application relates to a binding method of a display and the display, wherein the binding method of the display comprises the following steps: coating an anisotropic conductive adhesive layer on a plurality of first electrodes of the display panel, wherein the anisotropic conductive adhesive layer is colloid and is filled with a plurality of conductive particles; moving the plurality of second electrodes of the driving chip to one side of the plurality of first electrodes, and aligning the plurality of first electrodes with the plurality of second electrodes one by one; the anisotropic conductive adhesive layer is heated to spontaneously aggregate the plurality of conductive particles in the anisotropic conductive adhesive layer in respective regions corresponding to the respective first electrodes. This application heats through the anisotropic conductive adhesive layer with the form for the colloid, makes a plurality of conductive particles spontaneous gathering in the anisotropic conductive adhesive layer, makes a plurality of first electrodes and a plurality of second electrode one-to-one electricity be connected, can reduce the short circuit risk, promotes the effect of switching on between first electrode and the second electrode, avoids conductive particles's waste simultaneously, practices thrift conducting material.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a bonding method for a display and a display.
Background
The current flat panel display generally includes a display panel and an external circuit, where a driving chip is disposed on the external circuit, and the driving chip is connected to an Outer Lead Bonding (OLB) region of the display panel through a Bonding process, so as to transmit a driving signal to the display panel. The drive chip and the OLB region of the display panel can be electrically connected through an Anisotropic Conductive Film (ACF).
In the related art, the anisotropic conductive adhesive layer mainly includes a base layer and conductive particles. Wherein, the base layer is mainly used for adhesion and is made of solid material; the conductive particles mainly function as a conductor. The conductive particles are mostly high polymer plastic powder with nickel plating and gold plating on the surface, the center is a plastic ball, and the outer surface of the plastic ball is plated with nickel and gold. The outer surface of the anisotropic conductive adhesive layer can be further provided with an insulating layer which is used for wrapping the anisotropic conductive adhesive layer to play an insulating role; in the bonding process of the display panel, the anisotropic conductive adhesive layer between the outer pin of the display panel and the driving chip can be hot-pressed by using the pressing equipment, so that the extruded conductive particles form electric connection between the outer pin and the driving chip. In practical applications, the anisotropic conductive adhesive layer allows the outer leads of the display panel to be electrically connected to the driving chip in a direction perpendicular to the direction of the anisotropic conductive adhesive layer, and allows the outer leads to be insulated in a direction parallel to the direction of the anisotropic conductive adhesive layer.
However, as the high resolution requirement of the display panel increases, the pitches of the external pins and the driving chip pins become smaller and smaller, and the risk of short circuit in the direction parallel to the ACF layer increases; meanwhile, although the larger the number of the conductive particles or the larger the volume of the conductive particles, the smaller the on-resistance in the direction perpendicular to the direction of the ACF layer, the better the conduction effect, the excessive or oversized conductive particles may cause mutual contact between electrodes in the direction parallel to the direction of the ACF layer during the pressing process, thereby forming a short circuit, and causing the display panel to function abnormally; in addition, the entire ACF layer is provided with conductive particles, and the conductive particles cause material waste at the intervals between the metal pins.
Disclosure of Invention
In view of this, the present application provides a bonding method for a display and a display, which can reduce the risk of short circuit between first electrodes and between second electrodes, improve the conduction effect between the first electrodes and the second electrodes, avoid the waste of conductive particles, and save conductive materials.
According to an aspect of the present application, a method for bonding a display is provided, where the display includes a display panel, a driving chip, and an anisotropic conductive adhesive layer, the display panel is provided with a plurality of first electrodes, the driving chip is provided with a plurality of second electrodes, and the method for bonding a display includes: coating an anisotropic conductive adhesive layer on a plurality of first electrodes of the display panel, wherein the anisotropic conductive adhesive layer is colloid and is filled with a plurality of conductive particles; moving the plurality of second electrodes of the driving chip to one side of the plurality of first electrodes, and aligning the plurality of first electrodes with the plurality of second electrodes one by one; and heating the anisotropic conductive adhesive layer to spontaneously gather a plurality of conductive particles in the anisotropic conductive adhesive layer in each region corresponding to each first electrode, so that the plurality of first electrodes are electrically connected with the plurality of second electrodes one by one, and the bonding between the display panel and the driving chip is realized.
Further, the anisotropic conductive adhesive layer is disposed between the plurality of first electrodes and the plurality of second electrodes, and is attached to the plurality of first electrodes and the plurality of second electrodes.
Furthermore, the center of each conductive particle is spherical, and the outer surface of the center of each conductive particle is plated with a metal layer or an alloy layer.
Further, the metal layer is made of gold, silver, copper or tin, and the alloy layer is made of gold-silver alloy or tin-silver-copper alloy.
Further, the material adopted by the colloid comprises resin materials or carbonates, wherein the resin materials comprise acrylic resin, vinyl resin or epoxy resin.
Further, the first electrodes are insulated from each other or the second electrodes are insulated from each other.
Further, the sizes of the first electrodes are equal, and the sizes of the regions corresponding to the first electrodes are equal to the sizes of the first electrodes.
Further, the plurality of first electrodes are uniformly arranged, and the distance between any two adjacent first electrodes in the plurality of first electrodes is 5 micrometers to 150 micrometers.
Further, the heating temperature for heating the anisotropic conductive adhesive layer is between 90 ℃ and 300 ℃.
According to another aspect of the present application, a display is provided, where the display includes a display panel, a driving chip, and an anisotropic conductive adhesive layer, where the display panel is provided with a plurality of first electrodes, and the driving chip is provided with a plurality of second electrodes, the anisotropic conductive adhesive layer is coated on the plurality of first electrodes of the display panel, the anisotropic conductive adhesive layer is a colloid, and the anisotropic conductive adhesive layer is filled with a plurality of conductive particles; the plurality of second electrodes of the driving chip are positioned on one side of the plurality of first electrodes, and the plurality of first electrodes are aligned with the plurality of second electrodes one by one; the plurality of conductive particles in the anisotropic conductive adhesive layer are spontaneously gathered in respective regions corresponding to the respective first electrodes, and the plurality of conductive particles in the anisotropic conductive adhesive layer are used for electrically connecting the plurality of first electrodes and the plurality of second electrodes one by one.
Through heating the anisotropic conductive adhesive layer of form for the colloid, make a plurality of conductive particles in the anisotropic conductive adhesive layer are spontaneous gathering corresponding to each in each region of first electrode, and then make a plurality of first electrodes with a plurality of second electrode electricity one by one is connected, can reduce the short circuit risk between each first electrode and between each second electrode according to the aspect of this application, promotes the effect of switching on between first electrode and the second electrode, avoids conductive particle's waste simultaneously, practices thrift conducting material.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic diagram illustrating bonding of a display panel and an external circuit in the related art.
Fig. 2 is a schematic diagram illustrating a display panel and an external circuit after being bonded together in the related art.
Fig. 3 is a schematic diagram illustrating bonding of a display panel and an external circuit according to an embodiment of the disclosure.
Fig. 4 is a schematic diagram illustrating a bonding process between a display panel and an external circuit according to an embodiment of the disclosure.
Fig. 5 is a schematic diagram illustrating a bonding process between a display panel and an external circuit according to an embodiment of the disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other suitable relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials. In some instances, methods, means, elements and circuits that are well known to those skilled in the art have not been described in detail so as not to obscure the present application.
Fig. 1 is a schematic diagram illustrating bonding of a display panel and an external circuit in the related art.
As shown in fig. 1, in the related art, from a top view, a plurality of first electrodes are disposed on a display panel 11, a driving chip 12 is disposed on an external circuit, and a plurality of second electrodes are disposed on the driving chip. For example, the first electrode 13 and the second electrode 17 may be two adjacent first electrodes, and the second electrode 14 and the second electrode 18 may be two adjacent electrodes.
In practical applications, a plurality of first electrodes on the display panel need to correspond to a plurality of second electrodes on the driving chip one by one, and the corresponding first electrodes are electrically connected to the second electrodes, for example, the first electrodes 13 are electrically connected to the second electrodes 14, the first electrodes 17 are electrically connected to the second electrodes 18, and the first electrodes 17 and the second electrodes 13 are insulated from each other.
Specifically, referring to fig. 1, first, an ACF layer 15 may be disposed on a row of first electrodes of the display panel, and the ACF layer may be filled with a plurality of conductive particles, for example, the conductive particle 16 may be any one of the conductive particles in the ACF layer. Then, the driving chip is moved to a position right above the display panel, so that the plurality of second electrodes are exactly aligned with the plurality of first electrodes, and the ACF layer is located between the plurality of first electrodes and the plurality of second electrodes. And finally, carrying out hot pressing on the ACF layer by using pressing equipment, so that the extruded conductive particles form electric connection between the corresponding first electrode and the second electrode.
Fig. 2 is a schematic diagram illustrating a display panel and an external circuit after being bonded together in the related art.
As shown in fig. 2, in the related art, from a front view, after the ACF layer is laminated, the conductive particles may be arranged between two adjacent first electrodes or between two adjacent second electrodes along a direction parallel to a direction of the anisotropic conductive adhesive layer. For example, in fig. 2, the conductive particles between the first electrode 13 and the first electrode 17 short-circuit the first electrode 13 and the first electrode 17. As the distance between the first electrodes or the distance between the second electrodes becomes smaller, the risk of short circuit increases in the direction parallel to the direction of the ACF layer; meanwhile, the larger the number of conductive particles or the larger the volume of the conductive particles, the risk of short circuit also increases.
In view of this, the present application provides a bonding method for a display, where the display includes a display panel, a driving chip, and an anisotropic conductive adhesive layer, where the display panel is provided with a plurality of first electrodes, the driving chip is provided with a plurality of second electrodes, and the bonding method for a display includes: coating an anisotropic conductive adhesive layer on a plurality of first electrodes of the display panel, wherein the anisotropic conductive adhesive layer is colloid and is filled with a plurality of conductive particles; moving the plurality of second electrodes of the driving chip to one side of the plurality of first electrodes, and aligning the plurality of first electrodes with the plurality of second electrodes one by one; and heating the anisotropic conductive adhesive layer to spontaneously gather a plurality of conductive particles in the anisotropic conductive adhesive layer in each region corresponding to each first electrode, so that the plurality of first electrodes are electrically connected with the plurality of second electrodes one by one, and the bonding between the display panel and the driving chip is realized.
Through heating the anisotropic conductive adhesive layer of form for the colloid, make a plurality of conductive particles spontaneous gathering in the anisotropic conductive adhesive layer is corresponding to each in each region of first electrode, and then make a plurality of first electrodes with a plurality of second electrode electricity one by one is connected, and this application can reduce the short circuit risk between each first electrode and between each second electrode, promotes the effect of switching on between first electrode and the second electrode, avoids conductive particle's waste simultaneously, practices thrift conducting material.
Fig. 3 is a schematic diagram illustrating bonding of a display panel and an external circuit according to an embodiment of the disclosure.
As shown in fig. 3, in the embodiment of the present invention, from a top view, the display panel 31 is provided with a plurality of first electrodes, the external circuit is provided with the driving chip 32, and the driving chip is provided with a plurality of second electrodes. For example, the first electrode 33 and the second electrode 37 may be two adjacent first electrodes, and the second electrode 34 and the second electrode 38 may be two adjacent electrodes. The anisotropic conductive adhesive layer is colloid, and a plurality of conductive particles are filled in the anisotropic conductive adhesive layer.
Because this application embodiment is with a plurality of conductive particles packing in the colloid, compare in the prior art adopt solid form's anisotropic conductive adhesive layer, can be right anisotropic conductive adhesive layer heats the back, will a plurality of conductive particles in the anisotropic conductive adhesive layer are spontaneous the gathering in each region corresponding to each first electrode, thereby make a plurality of first electrodes with a plurality of second electrodes electricity one by one realizes display panel with bonding between the drive chip. Meanwhile, the ACF layer can avoid the short circuit phenomenon between electrodes in the direction parallel to the trend of the ACF layer, the utilization rate of the conductive particles is improved, and the ACF layer is suitable for display products with small spacing and high resolution.
Wherein, upon heating the anisotropic conductive adhesive layer, the plurality of conductive particles in the anisotropic conductive adhesive layer spontaneously aggregate in each region corresponding to each of the first electrodes, depending on the nature of the colloid and the conductive particles themselves, thereby eliminating the need for manual or mechanical intervention. This phenomenon of spontaneously collecting a plurality of conductive particles in an anisotropic conductive adhesive layer in each fixed region may also be referred to as a self-assembly method. It can be understood that based on the inventive concept of the embodiment of the present application, in practical applications, the anisotropic conductive adhesive layer may also be replaced with other possible materials, so that the first electrode and the corresponding second electrode can be better conducted; meanwhile, the inventive concept of the embodiment of the present application can also be transplanted to other industrial fields, such as the field of chip manufacturing, and the application scenario of the anisotropic conductive adhesive layer is not limited in the present application.
Furthermore, the center of each conductive particle is spherical, and the outer surface of the center of each conductive particle is plated with a metal layer or an alloy layer. For example, the central outer surface of all the conductive particles may be plated with a metal layer, or the central outer surface of a part of the conductive particles may be plated with a metal layer, and the central outer surface of another part of the conductive particles may be plated with an alloy layer. That is, the plurality of conductive particles may be mixed with conductive particles having a metal layer plated on the outer surface or with conductive particles having an alloy layer plated on the outer surface. Of course, the outer surface of each of the conductive particles may be coated with other layers, and the specific structure of the conductive particles is not limited in the present application.
Further, the metal layer is made of gold (Au), silver (Ag), copper (Cu) or tin (Sn), and the alloy layer is made of gold-silver alloy (Au-Ag) or tin-silver-copper alloy (Sn-Ag-Cu). It should be understood by those skilled in the art that the materials listed above for the metal layer and the alloy layer in the conductive particles are exemplary, and the application is not limited to the materials for the metal layer and the alloy layer in the conductive particles.
Further, the material adopted by the colloid comprises resin materials or carbonates, wherein the resin materials comprise acrylic resin, vinyl resin or epoxy resin. For example, the epoxy resin may include a bisphenol a type epoxy resin. It is understood that many materials such as the resin-based material or the carbonate-based material may be in a colloidal form, and the present application is not limited to the material used for the colloid, as long as the conductive particles can be easily mixed in the colloid and can be aggregated in a self-assembly manner.
Further, the anisotropic conductive adhesive layer is disposed between the plurality of first electrodes and the plurality of second electrodes, and is attached to the plurality of first electrodes and the plurality of second electrodes. For example, the anisotropic conductive adhesive layer may be attached to the plurality of first electrodes first, and then attached to the plurality of second electrodes; alternatively, the anisotropic conductive adhesive layer may be attached to the plurality of second electrodes first, and then attached to the plurality of first electrodes. It is to be understood that the application is not limited to the attaching sequence of the anisotropic conductive adhesive layer to the plurality of first electrodes and the plurality of second electrodes.
Further, the first electrodes are insulated from each other or the second electrodes are insulated from each other. For example, in fig. 3, the first electrode 33 and the first electrode 37 are insulated from each other, the second electrode 34 and the second electrode 38 are insulated from each other, and the first electrode 33 and the second electrode 34 and the first electrode 37 and the second electrode 38 are electrically connected by conductive particles. In an initial stage, the plurality of first electrodes of the display panel and the plurality of second electrodes of the driving chip are in a separated state, that is, the display panel and the driving chip are not in contact with each other.
Further, the sizes of the first electrodes are equal, and the sizes of the regions corresponding to the first electrodes are equal to the sizes of the first electrodes. That is, the shape and area of each of the first electrodes may be the same. Referring to fig. 3, the size of each region corresponding to each of the first electrodes may be an orthographic projection of the first electrode on the anisotropic conductive adhesive layer.
Further, the sizes of the first electrodes may not be equal. For example, the size of the first electrode at the edge position may be smaller than the size of the first electrode at the center position. When the sizes of the first electrodes may not be equal, the anisotropic conductive adhesive layer may be provided with non-uniformly distributed conductive particles according to specific conditions. For example, the number of conductive particles disposed at the edge position may be smaller than the number of conductive particles disposed at the center position. Of course, it is also possible to coat less anisotropic conductive adhesive layer at the edge position and more conductive adhesive layer at the center position.
Further, for the plurality of second electrodes, the size of each of the second electrodes may be equal, and the size of each region corresponding to each of the second electrodes is equal to the size of each of the second electrodes. Since each of the first electrodes is electrically connected to the corresponding second electrode in the embodiment of the present application, the size of each of the first electrodes may be equal to the size of the corresponding second electrode. Of course, in the case where the sizes of the respective second electrodes are not equal to each other, the anisotropic conductive adhesive layer may be applied with reference to the case of the first electrode. It is to be understood that the application of the anisotropic conductive adhesive layer to each first electrode or each second electrode is not limited.
Further, the plurality of first electrodes are uniformly arranged, and the distance between any two adjacent first electrodes in the plurality of first electrodes is 5 micrometers to 150 micrometers. Since the embodiment of the present application spontaneously gathers the plurality of conductive particles in the anisotropic conductive adhesive layer in the respective regions corresponding to the respective first electrodes after heating the anisotropic conductive adhesive layer, the pitch of the plurality of first electrodes is narrower than that which can be set in the related art, for example, the distance between any two adjacent first electrodes in the plurality of first electrodes is 5 micrometers to 150 micrometers. It is to be understood that 5 microns to 150 microns in the embodiments of the present application are exemplary, and the present application is equally applicable to the case where the spacing between adjacent first electrodes is wider. The distance between any two adjacent first electrodes in the plurality of first electrodes or the distance between any two adjacent second electrodes in the plurality of second electrodes is not limited in the present application.
Further, the heating temperature for heating the anisotropic conductive adhesive layer is between 90 ℃ and 300 ℃. In practical application, the anisotropic conductive adhesive layer can be heated by various methods such as baking. The conductive particles in the colloid have no fluidity before the anisotropic conductive adhesive layer is heated. As the heating of the anisotropic conductive adhesive layer proceeds, the conductive particles in the adhesive spontaneously move to the region corresponding to each of the first electrode or the second electrode, i.e., the anisotropic conductive adhesive layer is actually a moving medium of the conductive particles. It can be understood that the heating temperatures corresponding to various heating methods are different, and the heating temperature when the anisotropic conductive adhesive layer is heated is not limited in the present application.
Fig. 4 is a schematic diagram illustrating a bonding process between a display panel and an external circuit according to an embodiment of the disclosure.
As shown in fig. 4, in an embodiment of the present application, the step of bonding the display panel to the external circuit may include steps S11, S12, and S13. Wherein the content of the first and second substances,
step S11: coating an anisotropic conductive adhesive layer on a plurality of first electrodes of the display panel, wherein the anisotropic conductive adhesive layer is colloid and is filled with a plurality of conductive particles;
step S12: moving the plurality of second electrodes of the driving chip to one side of the plurality of first electrodes, and aligning the plurality of first electrodes with the plurality of second electrodes one by one;
step S13: and heating the anisotropic conductive adhesive layer to spontaneously gather a plurality of conductive particles in the anisotropic conductive adhesive layer in each region corresponding to each first electrode, so that the plurality of first electrodes are electrically connected with the plurality of second electrodes one by one, and the bonding between the display panel and the driving chip is realized.
In step S12, the first electrodes of the display panel may be overlapped with the second electrodes of the corresponding driving chips one by one. In step S13, the conductive particles in the colloid spontaneously move to the regions corresponding to the respective first electrodes or second electrodes by heating the anisotropic conductive adhesive layer. For example, the conductive particles in fig. 4 may spontaneously move to a region corresponding to the second electrode 34. In step S13, the anisotropic conductive adhesive layer may be further hot pressed by a pressing device, so that the pressed conductive particles form an electrical connection between the corresponding first electrode and the second electrode.
It should be noted that after the anisotropic conductive adhesive layer is heated, the plurality of conductive particles in the anisotropic conductive adhesive layer may spontaneously form a plurality of liquid domains as shown in fig. 4, for example, 41 in fig. 4 may be one of the liquid domains, and the liquid domain may be formed by melting the conductive particles of the metal.
Fig. 5 is a schematic diagram illustrating a bonding process between a display panel and an external circuit according to an embodiment of the disclosure.
As shown in fig. 5, in another embodiment of the present application, the step of bonding the display panel to the external circuit may include steps S11, S12 and S13. Wherein the content of the first and second substances,
step S11: coating an anisotropic conductive adhesive layer on a plurality of first electrodes of the display panel, wherein the anisotropic conductive adhesive layer is colloid and is filled with a plurality of conductive particles;
step S22: heating the anisotropic conductive adhesive layer to spontaneously aggregate the plurality of conductive particles in the anisotropic conductive adhesive layer in respective regions corresponding to the respective first electrodes;
step S23: and moving the plurality of second electrodes of the driving chip to one side of the plurality of first electrodes, and aligning the plurality of first electrodes with the plurality of second electrodes one by one, so that the plurality of first electrodes are electrically connected with the plurality of second electrodes one by one, and bonding between the display panel and the driving chip is realized.
Referring to fig. 5, in step S23, the plurality of second electrodes of the driving chip may be attached to the first electrodes of the display panel one by one, that is, the plurality of second electrodes of the driving chip may overlap the first electrodes of the display panel one by one. Of course, the plurality of second electrodes of the driving chip may be attached to the first electrode of the display panel in a staggered manner, that is, the plurality of second electrodes of the driving chip may not be completely overlapped with the first electrode of the display panel one by one, but may be partially overlapped.
It should be noted that the embodiment of fig. 4 and the embodiment of fig. 5 may be replaced with each other. Preferably, the arrangement can be made using the embodiment in fig. 4. It is understood that other steps may be provided based on the inventive concepts of the present application and that the present application is not limited thereto.
In addition, after the anisotropic conductive adhesive layer is heated, the plurality of conductive particles in the anisotropic conductive adhesive layer may spontaneously form a plurality of liquid domains as shown in fig. 5, for example, 51 in fig. 5 may be one of the liquid domains, and the liquid domains may be formed by melting the conductive particles of the metal. The liquid block in fig. 5 may have the same shape as the liquid block in fig. 4, or may have a different shape. It is to be understood that the shapes of the liquid block in fig. 4 and 4 are exemplary, and the present application is not limited to the shapes of the liquid block.
Further, the display panel may include an outer lead attaching region, and the plurality of first electrodes may be disposed in the outer lead attaching region. Conductive adhesive with conductive particles is coated on the outer pin attaching area, and the conductive particles are gathered on respective metal bonding pads in the attaching area of the drive chip and the outer pin of the display panel in a self-assembly mode in a heating state, so that metal conduction of the drive chip and the outer pin attaching area of the display panel is realized, and no conductive particles are left among the metal bonding pads. As the conductive particles are spontaneously gathered on the metal bonding pads, the number of the conductive particles on the metal bonding pads is large, the resistance between the driving chip and the display panel is reduced, and the metal bonding pads do not have the conductive particles in the transverse direction, so that the risk of conduction in the transverse direction is avoided. Meanwhile, the non-conductive area between the metal pads is free of conductive particles, so that the waste of the conductive particles is avoided. Therefore, the embodiment of the application can be applied to the driving chip and the display panel of the fine-pitch bonding pad.
To sum up, this application embodiment heats through the anisotropic conductive adhesive layer with the form is the colloid, makes a plurality of conductive particles in the anisotropic conductive adhesive layer are gathered corresponding to each voluntarily in each region of first electrode, and then make a plurality of first electrodes with a plurality of second electrode electricity one by one is connected, can reduce the short circuit risk between each first electrode and between each second electrode, promotes the effect of switching on between first electrode and the second electrode, avoids conductive particles's waste simultaneously, practices thrift conductive material to reduce cost is particularly useful for the display of high resolution.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The bonding method of the display and the display provided by the embodiment of the application are described in detail above, a specific example is applied in the description to explain the principle and the implementation of the application, and the description of the embodiment is only used to help understand the technical scheme and the core idea of the application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. The bonding method of the display is characterized in that the display comprises a display panel, a driving chip and an anisotropic conductive adhesive layer, a plurality of first electrodes are arranged in the display panel, a plurality of second electrodes are arranged in the driving chip, and the bonding method of the display comprises the following steps:
coating an anisotropic conductive adhesive layer on a plurality of first electrodes of the display panel, wherein the anisotropic conductive adhesive layer is colloid and is filled with a plurality of conductive particles;
moving the plurality of second electrodes of the driving chip to one side of the plurality of first electrodes, and aligning the plurality of first electrodes with the plurality of second electrodes one by one;
and heating the anisotropic conductive adhesive layer to spontaneously gather a plurality of conductive particles in the anisotropic conductive adhesive layer in each region corresponding to each first electrode, so that the plurality of first electrodes are electrically connected with the plurality of second electrodes one by one, and the bonding between the display panel and the driving chip is realized.
2. A method for bonding a display according to claim 1, wherein the anisotropic conductive adhesive layer is disposed between and attached to the first and second electrodes.
3. A bonding method for display device according to claim 1, wherein the center of each of said conductive particles is spherical in shape, and the outer surface of the center of each of said conductive particles is plated with a metal or alloy layer.
4. A bonding method for display device according to claim 3, wherein the metal layer is made of gold, silver, copper or tin, and the alloy layer is made of gold-silver alloy or tin-silver-copper alloy.
5. A method for bonding a display according to claim 1, wherein the colloid is made of a material including a resin material or a carbonate, wherein the resin material includes an acrylic resin, a vinyl resin or an epoxy resin.
6. A method for bonding a display according to claim 1, wherein each of the first electrodes is insulated from each other or each of the second electrodes is insulated from each other.
7. A method for bonding a display according to claim 1, wherein each of the first electrodes is equal in size, and each area corresponding to each of the first electrodes is equal in size to each of the first electrodes.
8. A bonding method for a display according to claim 1, wherein the plurality of first electrodes are uniformly arranged, and the distance between any two adjacent first electrodes in the plurality of first electrodes is 5 to 150 micrometers.
9. A bonding method for display device according to claim 1, wherein the heating temperature for heating the anisotropic conductive adhesive layer is between 90 ℃ and 300 ℃.
10. A display is characterized in that the display comprises a display panel, a driving chip and an anisotropic conductive adhesive layer, wherein a plurality of first electrodes are arranged in the display panel, a plurality of second electrodes are arranged in the driving chip,
an anisotropic conductive adhesive layer is coated on a plurality of first electrodes of the display panel, the anisotropic conductive adhesive layer is colloid, and a plurality of conductive particles are filled in the anisotropic conductive adhesive layer;
the plurality of second electrodes of the driving chip are positioned on one side of the plurality of first electrodes, and the plurality of first electrodes are aligned with the plurality of second electrodes one by one;
the plurality of conductive particles in the anisotropic conductive adhesive layer are spontaneously gathered in respective regions corresponding to the respective first electrodes, and the plurality of conductive particles in the anisotropic conductive adhesive layer are used for electrically connecting the plurality of first electrodes and the plurality of second electrodes one by one.
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