CN114047223A - Two sample coefficient of heat conductivity measuring device of steady state method - Google Patents
Two sample coefficient of heat conductivity measuring device of steady state method Download PDFInfo
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- CN114047223A CN114047223A CN202111319753.5A CN202111319753A CN114047223A CN 114047223 A CN114047223 A CN 114047223A CN 202111319753 A CN202111319753 A CN 202111319753A CN 114047223 A CN114047223 A CN 114047223A
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 230000001681 protective effect Effects 0.000 claims abstract description 21
- 238000005259 measurement Methods 0.000 claims abstract description 20
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 7
- 230000008569 process Effects 0.000 claims abstract description 5
- 238000003466 welding Methods 0.000 claims description 11
- 238000004364 calculation method Methods 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 6
- 230000035945 sensitivity Effects 0.000 claims description 5
- 230000004907 flux Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 238000004458 analytical method Methods 0.000 claims description 2
- 238000012360 testing method Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
Abstract
The invention discloses a device for measuring the heat conductivity coefficient of a double sample by a steady state method, and belongs to the technical field of material thermophysical property testing. The device comprises a metering hot plate, a protective hot plate, an annular thermopile, a cold plate, a heat insulating layer, a temperature equalizing plate and a constant temperature module. The lead wire penetrates through the constant temperature device before entering the device from room temperature, the temperature of the lead wire is kept consistent with the temperature inside the device, the influence of the external temperature difference of the device is reduced, and the heat leakage of a system is reduced; by adopting a method for measuring the temperature difference in each direction on two sides of the gap based on the thermopile, the heat leakage in each direction of the system is analyzed, and the temperature control precision is improved; a set of temperature-equalizing plate capable of measuring the temperature uniformity of the heating components is adopted, so that the problem of the temperature uniformity of each heating component of the device is solved. The invention is suitable for the field of heat conductivity coefficient test, and is used for reducing the heat leakage influence in the test process and improving the measurement accuracy.
Description
Technical Field
The invention relates to a technology for measuring a heat conductivity coefficient in thermophysical properties of a material, in particular to a device for measuring the heat conductivity coefficient of a double sample by a steady state method, and belongs to the technical field of thermophysical property testing of materials.
Background
The heat conductivity coefficient in the thermophysical property of the material is a physical quantity reflecting the heat conductivity of the material, and directly reflects the quality of the heat conductivity of the material. The measurement method of the thermal conductivity is divided into a steady state method and a transient state method. The steady-state method has a long measurement time but has high measurement accuracy, including a heat flow meter method and a protective hot plate method. The protective hot plate method is the method for measuring the highest accuracy of the heat conductivity coefficient at present, and measures the heat conductivity coefficient of a solid material by measuring parameters such as the size of axial one-dimensional heat flow of a sample, the temperature gradient of the upper surface and the lower surface of the sample and the like.
At present, the following problems generally exist in the commercially available steady-state method heat conductivity coefficient measuring device: because a gap exists between the metering hot plate and the protecting hot plate, the temperature difference of each point between the two plates cannot be accurately measured by simply adopting a common temperature sensor, so that the temperature control is inaccurate, the radial heat leakage of the device is serious, and the device deviates from one-dimensional heat conduction, thereby influencing the accuracy of heat conductivity coefficient measurement; in addition, as the protective hot plate method measuring device has more leads, including temperature control thermocouples, temperature measuring thermocouples, heating wires and the like, which are led out to the room temperature environment from the inside of the high temperature measuring device, heat leakage of the device can be caused, the measurement of the heating amount of the metering hot plate of the device is influenced, and the measurement accuracy of the heat conductivity coefficient is poor; the core test component of the measuring device adopting the protection hot plate method comprises a metering hot plate, a protection hot plate, a cold plate and the like, the largest diameter of the components reaches 300-600 mm, and the premise of accurately measuring the heat conductivity coefficient is that the temperature inside each plate is uniformly distributed, so that the heat flow is only transmitted along the axial direction of a sample, but the problem of the temperature uniformity of the heating component is not considered in the measuring device on the market at present, and a method and a measure for measuring the temperature uniformity are lacked.
Disclosure of Invention
The invention provides a device for measuring the heat conductivity coefficient of a double sample by a steady state method, aiming at solving the problems that the temperature uniformity is not considered in the measurement of the existing protective hot plate method and the measurement accuracy is poor, and aiming at effectively reducing the heat leakage influence and improving the measurement accuracy.
The purpose of the invention is realized by the following technical scheme:
according to the invention, the constant temperature module is introduced, and the lead wire firstly passes through the constant temperature device before entering the device from room temperature, so that the temperature is kept consistent with the temperature inside the device, the influence of the external temperature difference of the device is reduced, and the heat leakage of the system is reduced; by adopting a method for measuring the temperature difference in each direction on two sides of the gap based on the thermopile, the heat leakage in each direction of the system is analyzed, and the temperature control precision is improved; a set of temperature-equalizing plate capable of measuring the temperature uniformity of the heating components is adopted, so that the problem of the temperature uniformity of each heating component of the device is solved.
The invention discloses a device for measuring the heat conductivity of a double sample by a steady state method.
The protective hot plate is positioned around the metering hot plate and is positioned at the same horizontal plane with the metering hot plate. In order to prevent the heat from radially losing, the protection hot plate always keeps the same temperature with the metering hot plate; meanwhile, in order to accurately obtain the heating power of the metering hot plate, the protective hot plate cannot be in contact with the metering hot plate, and heat conduction cannot exist, so that rectangular grooves which are the same in number and are uniformly distributed are formed in the outer edge of the metering hot plate and the inner edge of the protective hot plate, and a gap is formed.
The annular thermopile is formed by sequentially connecting the cold ends and the hot ends of a plurality of thermocouples into an annular shape, and the surface of the annular thermopile is subjected to insulation treatment; the welding spot is fixedly arranged in the center of the rectangular groove; the gaps between the thermopiles and the separation seams are filled with heat conduction materials, so that heat conduction is facilitated, output signals can be increased, errors are reduced, and measurement accuracy is improved.
And after accurately measuring the temperature difference of each direction on the two sides of the separation joint, the annular thermopile establishes a separation joint heat leakage analysis theoretical model. The calculation of the heat leakage of the gap is determined by the pressure drop of the thermopile passing through the gap and the number of welding spots. The heating power of the metering hot plate minus the heat leakage of the gap is the one-dimensional heat flow passing through the axial direction of the tested sample. The heat leakage amount calculation formula is as follows:
Qgap＝Sgap(SnΔfTgap)＝SgapVgap
here Q isgapHeat leakage from finger slit SgapRepresents the heat flow sensitivity coefficient and has the unit of W.mu.V-1S represents the Seebeck coefficient of the thermopile in μ V.K-1N is the thermocouple logarithm of the thermopile reverse string, i.e. the number of welding points, Delta TgapDifference in temperature of points on both sides of finger space joint, VgapRefers to the voltage drop of the thermopile.
The constant temperature module is internally provided with a heating wire and a temperature control sensor, the temperature is consistent with that of the metering hot plate, and a thermocouple, a thermopile and a lead wire of the heating wire which are led out from the constant temperature module are connected with the acquisition system.
The temperature equalizing plate is tightly attached to each heating component and is respectively used for measuring the temperature uniformity of the protection hot plate, the metering hot plate and the upper and lower cold plates, wherein the temperature equalizing plate for protecting the hot plate respectively measures the temperature of each point inside and outside the protection plate; the temperature of each point at the upper, left, right and central positions is measured by the temperature equalizing plates of the metering hot plate and the metering cold plate respectively.
The working process of the invention is as follows:
the temperature that sets up the measurement hot plate, protection hot plate and constant temperature module is unanimous, turn on switch and heat up, reach balanced state after, open the voltage value that collection system gathered the thermopile output, utilize the seebeck coefficient of the number of welding spots and thermopile, obtain the difference in temperature of parting joint both sides, and then introduce the heat flux sensitivity coefficient, calculate the parting joint heat leakage, then subtract parting joint heat leakage with the heating power of measurement hot plate, obtain the one-dimensional heat flow value of being tested a kind axial direction, further participate in the calculation of coefficient of heat conductivity.
Has the advantages that:
1. aiming at the problem of radial heat conduction of a heat conductivity coefficient measuring device, the invention adopts a method for measuring the temperature difference in each direction on two sides of a gap based on a thermopile to analyze the heat leakage in each direction of the system and improve the measuring precision of the device;
2. aiming at the heat leakage of the system of the heat conductivity coefficient measuring device, the constant temperature module is adopted, so that the lead wire firstly passes through the constant temperature device before entering the device from room temperature, the lead wire is heated to the temperature inside the system, the influence of the temperature difference outside the device is reduced, and the heat leakage of the system is reduced;
3. aiming at the problem of temperature uniformity of the heating assemblies, the temperature uniformity problem of each heating assembly of the device is solved by adopting the temperature-equalizing plate capable of measuring the temperature uniformity of the heating assemblies.
Drawings
FIG. 1 is a block diagram of a metering hot plate, protective hot plate of the present invention;
FIG. 2 is a schematic view of an annular thermopile of the present invention;
FIG. 3 is a schematic view of a vapor chamber;
wherein FIG. a is a metering hot/cold plate vapor chamber; FIG. b is a protective hot plate vapor chamber;
FIG. 4 is a steady state method dual sample thermal conductivity measurement device;
wherein the reference numbers:
1-a heat insulating layer; 2-constant temperature module; 3-protective hot plate; 4-metering hot plate; 5-a ring thermopile; 6-protection hot plate temperature equalizing plate; 7-measuring a hot plate temperature-equalizing plate; 8-cold plate temperature equalization plate; 9-cold plate.
Detailed Description
As shown in fig. 1, fig. 2, fig. 3, and fig. 4, the device for measuring the thermal conductivity of a double sample by a steady state method disclosed by the present invention includes a metering hot plate 4, a protective hot plate 3, an annular thermopile 5, a heat insulating layer 1, a constant temperature module 2, a protective hot plate temperature equalization plate 6, a metering hot plate temperature equalization plate 7, a cold plate temperature equalization plate 8, and a cold plate 9.
The measuring hot plate 4 and the protective hot plate 3 are made of red copper, and the outer edge of the measuring hot plate 4 is provided with 11 rectangular grooves which are evenly distributed along the circumference near the partition seam, as shown in figure 1. The inner edge of the protective hot plate 3 is provided with 11 rectangular grooves which are uniformly distributed along the circumference near the partition seam and are distributed in a staggered way with the rectangular grooves on the metering hot plate 4, as shown in figure 1. In the working process, the temperature of the protection hot plate 3 is kept consistent with that of the metering hot plate 4, and the annular thermopile 5 is adopted to measure the temperature difference of two sides of the gap in all directions.
The annular thermopile 5 is formed by welding 22 cold ends and hot ends of E-type thermocouples into 22 measuring points in sequence, and is in an annular shape as shown in FIG. 2. The surface of the annular thermopile 5 is subjected to insulation treatment by using high-temperature-resistant magnesium oxide, and 22 welding spots are fixedly arranged at the center of the rectangular groove in sequence; the gap between the annular thermopile 5 and the rectangular groove is filled with heat-conducting silicone grease with better heat-conducting property; the positive and negative leads of the annular thermopile 5 are led out from the groove on the protective hot plate 3, enter the constant temperature module 2 positioned in the device, and are led out by the constant temperature module 2 to be connected with an external acquisition system of the device so as to acquire the voltage drop signal of the annular thermopile 5.
The constant temperature module 2 is internally provided with a heating wire and a temperature control sensor, and the temperature is consistent with the temperature of the metering hot plate. The lead wire penetrates through the constant temperature device before entering the device from room temperature, so that the lead wire is heated to the temperature inside the device, the influence of the temperature difference outside the device is reduced, and the heat leakage of the system is reduced; and the lead wires of the thermocouple, the thermopile and the heating wire led out of the constant temperature module are connected with the acquisition system.
The temperature equalizing plate is made of 4 copper plates, the thickness of the temperature equalizing plate is 6mm, the upper surface of the temperature equalizing plate is provided with a groove, and the E-type thermocouple is filled with heat-conducting silicone grease and then fixed in the groove. The temperature equalizing plate is tightly attached to each heating component and is respectively used for temperature uniformity measurement of the protection hot plate, the metering hot plate and the upper and lower cold plates. 6E-type thermocouples are designed on a groove on a temperature equalizing plate 6 of the protective hot plate, and the temperature of each point inside and outside the protective plate is measured respectively; 4E-type thermocouples are designed on the grooves of the metering hot plate temperature equalizing plate 7 and the grooves of the cold plate temperature equalizing plate 8, and the temperature values of points at the upper, left, right and central positions are measured respectively, so that the temperature uniformity of the heating assembly is evaluated and examined.
The working process of the embodiment:
the temperature that sets up measurement hot plate 4, protection hot plate 3 and constant temperature module 2 is unanimous, turn on switch and heat up, reach balanced state after, turn on the voltage value that collection system gathered the thermopile output, utilize the seebeck coefficient of the number of welding points and thermopile, obtain the difference in temperature of parting joint both sides, and then introduce the heat flux sensitivity coefficient, calculate the parting joint heat leakage, then subtract parting joint heat leakage with the heating power of measurement hot plate, obtain the one-dimensional heat current value of being tested appearance axial direction, further participate in the calculation of coefficient of heat conductivity.
The device for measuring the heat conductivity of the double samples by the steady state method is suitable for accurately measuring the heat conductivity of the double-sample solid material within the temperature range of room temperature to 700 ℃, and compared with the existing measuring device, the device can quickly measure the temperature difference of two sides of a gap in all directions, analyze radial heat leakage and accurately calculate one-dimensional heat flow. The device can also reduce the system heat leakage, effectively solves the problems that the temperature difference between the metering hot plate and the protection hot plate is inaccurate to measure and the measurement uncertainty caused by heat leakage of the separation seam and the lead is large, and improves the measurement precision of the instrument.
The above detailed description is intended to illustrate the objects, aspects and advantages of the present invention, and it should be understood that the above detailed description is only exemplary of the present invention and is not intended to limit the scope of the present invention, and any modifications, equivalents, improvements and the like within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (3)
1. The utility model provides a two sample coefficient of heat conductivity measuring device of steady state method which characterized in that: comprises a metering hot plate, a protective hot plate, a cold plate, an annular thermopile, a constant temperature module, a temperature equalizing plate and the like;
the protective hot plate is positioned around the metering hot plate and is positioned on the same horizontal plane with the metering hot plate; the protective hot plate and the metering hot plate can not be in contact with each other and can not have heat conduction, so that the outer edge of the metering hot plate and the inner edge of the protective hot plate are provided with rectangular grooves which are the same in number and are uniformly distributed to form a gap;
the annular thermopile is formed by sequentially connecting the cold ends and the hot ends of a plurality of thermocouples into an annular shape, and the surface of the annular thermopile is subjected to insulation treatment; the welding spot is fixedly arranged in the center of the rectangular groove; the gap between the thermopile and the gap is filled with heat conduction material;
a heating wire and a temperature control sensor are arranged in the constant temperature module, the temperature is consistent with that of the metering hot plate, and a thermocouple, a thermopile and a lead wire of the heating wire led out of the constant temperature module are connected with an acquisition system;
the temperature equalizing plate is tightly attached to each heating component and is respectively used for measuring the temperature uniformity of the protection hot plate, the metering hot plate and the upper and lower cold plates, wherein the temperature equalizing plate for protecting the hot plate respectively measures the temperature of each point inside and outside the protection plate; the temperature of each point at the upper, left, right and central positions is measured by the temperature equalizing plates of the metering hot plate and the metering cold plate respectively.
2. The device for measuring the thermal conductivity of the double samples by the steady state method according to claim 1, wherein: after accurately measuring the temperature difference of each direction on the two sides of the separation joint, the annular thermopile establishes a separation joint heat leakage analysis theoretical model; the calculation of the heat leakage of the gap is determined by the pressure drop of the thermopile passing through the gap and the quantity of welding points; the heating power of the metering hot plate minus the heat leakage of the gap is the one-dimensional heat flow passing through the axial direction of the tested sample; the heat leakage amount calculation formula is as follows:
Qgap＝Sgap(SnΔTgap)＝SgapVgap
here Q isgapHeat leakage from finger slit SgapRepresents the heat flow sensitivity coefficient with the unit of W.mu V-1And S represents the Seebeck coefficient of the thermopile in units of μ V.K-1N is the thermocouple logarithm of the thermopile reverse string, i.e. the number of welding points, Delta TgapDifference in temperature of points on both sides of finger space joint, VgapRefers to the voltage drop of the thermopile.
3. The device for measuring the thermal conductivity of the double samples by the steady state method according to claim 1, wherein: the working process of the invention is that,
the temperature that sets up the measurement hot plate, protection hot plate and constant temperature module is unanimous, turn on switch and heat up, reach balanced state after, open the voltage value that collection system gathered the thermopile output, utilize the seebeck coefficient of the number of welding spots and thermopile, obtain the difference in temperature of parting joint both sides, and then introduce the heat flux sensitivity coefficient, calculate the parting joint heat leakage, then subtract parting joint heat leakage with the heating power of measurement hot plate, obtain the one-dimensional heat flow value of being tested a kind axial direction, further participate in the calculation of coefficient of heat conductivity.
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| CN202111319753.5A CN114047223A (en) | 2021-11-09 | 2021-11-09 | Two sample coefficient of heat conductivity measuring device of steady state method |
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| CN202111319753.5A CN114047223A (en) | 2021-11-09 | 2021-11-09 | Two sample coefficient of heat conductivity measuring device of steady state method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115201261A (en) * | 2022-07-07 | 2022-10-18 | 广东墨睿科技有限公司 | Thermal simulation test equipment |
| CN116048153A (en) * | 2022-11-10 | 2023-05-02 | 沪东中华造船(集团)有限公司 | Measuring device and measuring method for comprehensive heat conductivity coefficient of heat insulation module in enclosure system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6142662A (en) * | 1998-06-16 | 2000-11-07 | New Jersey Institute Of Technology | Apparatus and method for simultaneously determining thermal conductivity and thermal contact resistance |
| CN101806761A (en) * | 2010-04-02 | 2010-08-18 | 上海理工大学 | Instrument for measuring thermal conductivity coefficient of one-dimensional plane by using properties of graphite material |
| CN101915778A (en) * | 2010-07-19 | 2010-12-15 | 中国建筑科学研究院 | Apparatus and method for measuring thermal coefficients by adopting guarded thermal plate method |
| CN110927209A (en) * | 2019-12-03 | 2020-03-27 | 南京玻璃纤维研究设计院有限公司 | Device and method for measuring effective heat conductivity coefficient of vacuum insulation panel by using protective heat plate method |
| CN111220652A (en) * | 2019-11-21 | 2020-06-02 | 中国航空工业集团公司北京长城计量测试技术研究所 | High-temperature heat conductivity coefficient measuring device based on protection hot plate method |
-
2021
- 2021-11-09 CN CN202111319753.5A patent/CN114047223A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6142662A (en) * | 1998-06-16 | 2000-11-07 | New Jersey Institute Of Technology | Apparatus and method for simultaneously determining thermal conductivity and thermal contact resistance |
| CN101806761A (en) * | 2010-04-02 | 2010-08-18 | 上海理工大学 | Instrument for measuring thermal conductivity coefficient of one-dimensional plane by using properties of graphite material |
| CN101915778A (en) * | 2010-07-19 | 2010-12-15 | 中国建筑科学研究院 | Apparatus and method for measuring thermal coefficients by adopting guarded thermal plate method |
| CN111220652A (en) * | 2019-11-21 | 2020-06-02 | 中国航空工业集团公司北京长城计量测试技术研究所 | High-temperature heat conductivity coefficient measuring device based on protection hot plate method |
| CN110927209A (en) * | 2019-12-03 | 2020-03-27 | 南京玻璃纤维研究设计院有限公司 | Device and method for measuring effective heat conductivity coefficient of vacuum insulation panel by using protective heat plate method |
Non-Patent Citations (1)
| Title |
|---|
| 张云川: "高温防护热板法导热系数测定仪的研究", 《中国优秀硕士学位论文全文数据库工程科技Ⅱ辑》, no. 3, 15 March 2017 (2017-03-15), pages 030 - 321 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115201261A (en) * | 2022-07-07 | 2022-10-18 | 广东墨睿科技有限公司 | Thermal simulation test equipment |
| CN116048153A (en) * | 2022-11-10 | 2023-05-02 | 沪东中华造船(集团)有限公司 | Measuring device and measuring method for comprehensive heat conductivity coefficient of heat insulation module in enclosure system |
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