CN101915778A - Apparatus and method for measuring thermal coefficients by adopting guarded thermal plate method - Google Patents
Apparatus and method for measuring thermal coefficients by adopting guarded thermal plate method Download PDFInfo
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- CN101915778A CN101915778A CN 201010228968 CN201010228968A CN101915778A CN 101915778 A CN101915778 A CN 101915778A CN 201010228968 CN201010228968 CN 201010228968 CN 201010228968 A CN201010228968 A CN 201010228968A CN 101915778 A CN101915778 A CN 101915778A
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Abstract
The invention relates to an apparatus and a method for measuring thermal coefficients by adopting a guarded thermal plate method. The apparatus mainly comprises a main part, a cold source measuring and controlling system, a thermal source measuring and controlling system, an intelligent measuring apparatus, a computer transmitter, a semiconductor refrigerating power supply and a voltage-stabilized source, wherein the main part comprises a thermal plate, a cold plate and a test piece pressing system, the thermal plate comprises a back guard thermal plate, a main heating plate and a guard heating plate, the main heating plate comprises a main heater and a metal equalizing-heating plate, the guard heating plate comprises a guard heater and a metal equalizing-heating plate, the cold plate comprises an aluminum plate, a semiconductor refrigerator and a water cooling system; the cold source measuring and controlling system and the thermal source measuring and controlling system respectively provide a cold source of the cold plate and a thermal source of the back guard thermal plate and comprise two sets of precise thermostatic water baths with same structure; each precise thermostatic water bath comprises a refrigerating loop, a water bath, a water pump, a stirring system, a heating temperature-controlling system, a water temperature display, and the like; and the semiconductor refrigerating power supply is independent of the main part, the cold source measuring and controlling system and the thermal source measuring and controlling system, thereby the measurement accuracy of a thermal coefficient measuring apparatus is improved.
Description
Technical field
The present invention relates to a kind of instrument and method of heat conducting coefficient measuring, relate in particular to a kind of instrument and method of protective heat plate method heat conducting coefficient measuring.
Background technology
Coefficient of heat conductivity is one of insulation material thermophysical property, is the important indicator of differentiating material heat-insulating property quality.In recent years, country more and more paid attention to building energy conservation.And accurately measure the insulation material coefficient of heat conductivity the correct use building thermal insulation material and the use energy consumption of saving buildings are played key effect.Therefore, accurately measure this parameter and seem particularly important.
The method of measuring the building materials coefficient of heat conductivity can be divided into two big classes: steady state method and unstable state method.The various forms of two class methods all respectively has characteristics and applicable elements, and different materials can select for use diverse ways to measure according to self characteristics and service condition.According to the method that the steady heat conduction principle is set up, very ripe at home and abroad.At the end of the eighties, China has formulated a series of national standards with reference to international standard.Protective heat plate method thermal conductivity measuring apparatus also formally puts into production.Yet, index and measurement range that the instrument of domestic production now can not be up to state standards and be proposed.And a protective heat plate method of import thermal conductivity measuring apparatus price is too expensive.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of instrument and method of protective heat plate method heat conducting coefficient measuring, can be with simple structure and the high-precision mensuration coefficient of heat conductivity of method.
For solving the problems of the technologies described above, the critical piece of protective heat plate method thermal conductivity measuring apparatus of the present invention is: main part, low-temperature receiver TT﹠C system, thermal source TT﹠C system, intelligent measuring apparatus, computing machine transmission, semiconductor refrigerating power supply and stabilized voltage supply.Main part is made up of hot plate, cold drawing, test specimen pressing system, hot plate by the back of the body guarded hot plate, main heating plate, protect heating plate and form, main hot plate is made up of primary heater and metal soaking plate, protect heating plate by protecting well heater and the metal soaking plate is formed, cold drawing is made up of aluminium sheet, semiconductor cooler, cooling water system; The thermal source of back of the body guarded hot plate and the low-temperature receiver of cold drawing are provided, are made up of the exact constant temperature tank that two nested structures are identical, Water Tank with Temp.-controlled is made up of refrigerating circuit, tank, water pump, stirring system, heating temperature-controlling system, water temperature display etc.; The semiconductor refrigerating power supply is independent of outside main part, low-temperature receiver TT﹠C system and the thermal source TT﹠C system.
A kind of preferred as above-mentioned protective heat plate method thermal conductivity measuring apparatus, described cooling water system has comprised a cover Water Tank with Temp.-controlled, provide stable cooling water flow by Water Tank with Temp.-controlled, when test needed the cold drawing temperature to be set in more than 5 ℃, directly the adjusting by the Water Tank with Temp.-controlled temperature realized the temperature of cold drawing is controlled; When test needs the cold drawing temperature to be set in below 5 ℃, control the cold drawing temperature with semiconductor cooler, this moment, Water Tank with Temp.-controlled played the semiconductor cooler cooling effect.
As other optimal ways of described thermal conductivity measuring apparatus, sample to be tested is made into 300mm * 300mm, and thickness is greater than 15mm, less than 50mm, and sample thermal resistance 〉=0.1m
2K/w; Hot plate, cold drawing are of a size of 300mm * 300mm; Back of the body guarded hot plate adopts the thick aluminium sheet of 40mm to be processed into, and back of the body guarded hot plate provides stable thermal source by the exact constant temperature tank, and temperature stability is better than ± and 0.005 ℃, the liquid frid of spirality reverse flow is adopted in the thermostatted water turnover; The metal soaking plate adopts brass sheet to make and carries out the blacking processing, and its radiance is greater than 0.8; Flatness main, that protect soaking plate is 0.04mm, and irregularity degree is less than 0.025%; Main, protect well heater and adopt the corrosion of 0.1mm Hou De Opinions-Pictures Copper Foil to form, adopt the prepreg insulation; Cold drawing plate face carries out oxidation processes, and the flatness of plate face is 0.04mm, and irregularity degree is less than 0.025%; Hot and cold plate temperature is measured and is adopted 8 P
t1000 platinum sensors, 6 of hot plates, 2 of cold drawings are except selecting high-end P
tOutside 1000 platinum sensors, also alternative P
t1000 platinum resistance are screened with high-precision thermostatic oil bath is strict, and wherein the temperature resolution of oil groove reaches 0.0001 degree.
Coefficient of heat conductivity assay method of the present invention may further comprise the steps:
Measure sample thickness, after finishing sample and installing, at first, open alternating current steady voltage plug,, must wait the output gauge outfit of voltage stabilizer to point to 220V because the output of alternating current steady voltage plug has time delay, could open the total power switch on main frame right side, at this moment the gauge outfit energising work of cold and heat source TT﹠C system.Their temperature displayed are respectively the water temperature in two tanks, then open the power supply of intelligent measuring apparatus and two water pumps.Look the height of the design temperature of hot and cold plate, determine the unlatching of two tunnel refrigerating circuit power supplys, be higher than environment temperature more than 5 ℃, need not open as set point temperatures; Otherwise then open; Then the thickness d of sample is imported intelligent measuring apparatus.Instrument enters the measurement state automatically, automatic heating-cooling process, and temperature automatically controlled, follow the tracks of temperature control.After observing back of the body guarded hot plate and reaching temperature controlling point, under the situation of not having refrigeration, the temperature control degree of stability should be better than ± 0.002 ℃ in; Having under the situation of refrigeration, degree of stability should be better than ± 0.005 ℃ in.When cold, back of the body guarded hot plate temperature tend towards stability, observe main heating plate and guarded hot plate temperature and the tracking situation of carrying on the back the guarded hot plate temperature again.Less than ± 0.002 ℃, upper and lower fluctuation is less than ± 1% in the coefficient of heat conductivity one hour as the temperature difference of three plates, and experiment can finish, and prints experimental result.
Under the not high condition of testing element precision level, circuital current (comprising control circuit) is very little to the overall accuracy influence of instrument, but in the process that improves the instrument temperature test, the high more circuital current of the precision of temperature and power test is big more to the overall precision influence of conductometer.Particularly in whole thermal conductivity measuring apparatus, refrigeration unit power is maximum, and its operation has fatal influence to the precision of instrument.Therefore in order to reduce the influence of refrigeration unit circuit to the test components and parts, the present invention independently divides refrigeration unit out, for the precision that improves thermal conductivity measuring apparatus provides a good solution.
With described thermal conductivity measuring apparatus the insulation material of several unlike materials has been carried out actual measurement work, the experimental data repeatability that obtains is relatively good, experimental result has reached index that national standard proposed and measurement range, the manufacture level that instrument is described can reach requirement of actual application, and the flow process of detection also is rational.Experimental result shows that this thermal conductivity measuring apparatus has the value of applying.
Description of drawings
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Fig. 1 is a protective heat plate method thermal conductivity measuring apparatus structural representation.
Fig. 2 is the low-temperature receiver structural representation.
Embodiment
As shown in Figure 1, thermal conductivity measuring apparatus is mainly by parts such as main part, low-temperature receiver TT﹠C system 1, thermal source TT﹠C system 2, intelligent measuring apparatus 3, computing machine transmission 4, semiconductor refrigerating power supply 5 and stabilized voltage supplys 6.
(1) main part is made up of hot plate 7, cold drawing 8, test specimen pressing system.Hot plate 7 and cold drawing 8 are hardware core parts of instrument, and fundamental purpose is to make to detect time necessary and the space reaches steady state (SS), and make hot plate and cold drawing rational in infrastructure, and manufacturing process is accurate and reliable, and this influence to instrument performance is very big.Hot plate, cold drawing are of a size of 300mm * 300mm.
Hot plate 7 by the back of the body guarded hot plate, main heating plate, protect heating plate and form.Back of the body guarded hot plate adopts the thick aluminium sheet of 40mm to be processed into, provide stable thermal source by the exact constant temperature tank again, require temperature stability be better than ± 0.005 ℃, the liquid frid of spirality reverse flow is adopted in the thermostatted water turnover, this design can make the temperature homogeneity of plate face reach effect preferably.The thermal source of back of the body guarded hot plate and low-temperature receiver are made up of two cover exact constant temperature tanks.
Main hot plate is made up of primary heater and metal soaking plate, protects heating plate by protecting well heater and the metal soaking plate is formed.The size and the test specimen thickness proportion relation of main, guarded hot plate, and with edge thermal loss E
eWith unbalanced error E
gRelevant, therefore, must take all factors into consideration when designing main guarded hot plate, make error E
eWith unbalanced error sum E=E
e+ E
gMinimum.The problem of relevant this respect had been done extensive work both at home and abroad, for this this instrument designs according to the size that GB 10294 recommends.Soaking plate adopts brass sheet to make and carries out the blacking processing, and its radiance is greater than 0.8.Flatness main, that protect soaking plate is 0.04mm, and irregularity degree is less than 0.025%.
Main, protect well heater and adopt the corrosion of 0.1mm Hou De Opinions-Pictures Copper Foil to form, adopt the prepreg insulation, this technology not only guarantees to have between soaking plate and the well heater good electrical isolation but also thermo-contact is preferably arranged.Well heater main, guarded hot plate is controlled by intelligent measuring apparatus, follows the tracks of the temperature of back of the body guarded hot plate, and the temperature of three blocks of plates is consistent, and temperature gap is controlled in ± 0.001 ℃.
Cold drawing 8 is made up of aluminium sheet, semiconductor cooler, cooling water system.The plate face carries out oxidation processes, and the flatness of plate face is 0.04mm, and irregularity degree is less than 0.025%.Cooling water system mainly comprises another set of Water Tank with Temp.-controlled, provides stable cooling water flow by Water Tank with Temp.-controlled.When test needed the cold drawing temperature to be set in more than 5 ℃, directly the adjusting by the Water Tank with Temp.-controlled temperature just can realize the temperature of cold drawing is controlled; When test needs the cold drawing temperature to be set in below 5 ℃, control the cold drawing temperature with semiconductor cooler, this moment, tank played the semiconductor cooler cooling effect.
For adapting to the measurement of different-thickness sample, cold drawing is removable on worktable, and cold side is equipped with hold down gag, contacts with the tight of sample to guarantee hot and cold plate.The thickness of sample is answered≤50mm.
Hot and cold plate temperature is measured and is adopted P
t1000 platinum sensors, totally 8.6 of hot plates, 2 of cold drawings are aspect the use of temperature sensor, except selecting high-end P
tOutside 1000 platinum sensors, also alternative P
t1000 platinum resistance are screened with high-precision thermostatic oil bath is strict, and wherein the temperature resolution of oil groove reaches 0.0001 degree.
(2) cold and heat source TT﹠C system
The thermal source of back of the body guarded hot plate and the low-temperature receiver of cold drawing are provided, form by the exact constant temperature tank that two nested structures are identical.The structural representation of one cover is as shown in Figure 2:
It is made up of refrigerating circuit, tank 9, water pump 10, stirring system 11, heating temperature-controlling system 12, water temperature display 13 etc.
The setting of temperature and control are all finished by temperature-controlling system, open total power switch, and the temperature control instrument of thermal source promptly starts, after instrument is flashed " 888888 " several seconds, the numerical value that occurs is the temperature in the thermal source tank, if do not carry out new setting, and setting that the instrument acquiescence is last and beginning temperature control.
The low-temperature receiver of cold drawing comes given by two cover TT﹠C system.When the control of cold drawing temperature more than 5 ℃, directly by bosh, provide a stable low-temperature receiver.Be lower than this temperature, provide low-temperature receiver by semiconductor cooler, the recirculated water of tank plays the effect of cooling at this moment.Open total power switch, the temperature control instrument of low-temperature receiver promptly starts, and shows the current temperature value in the tank and the design temperature of tank, and what the start back was shown is last design temperature, as will changing design temperature, as long as by add, the subtrahend key.
(3) intelligent measuring apparatus
Intelligent measuring apparatus adopts microcomputer system, and for the accuracy that guarantees to measure, each electronic component all passes through selected.Instrument has 8 tunnel temperature survey passages, and main heating plate well heater DC voltage, electric current, power measurement are arranged; Two road P.I.D regulating systems are arranged, respectively master, guarded hot plate are carried out temperature control.Power measurement is by realizations such as advanced standard resistance and triode amplifiers.After the tester set cold and hot plate target temperature, instrument entered the measurement state automatically, and the data of each collection are carried out computing; Calculate the medial temperature of leading, protecting, carry on the back hot plate through the backstage, cold drawing medial temperature, heat flow density, test specimen thermal resistance, parameters such as coefficient of heat conductivity.Divide two screens to show by 5 cun color LCD screens.In the measuring process of instrument after start, master, the survey of guarded hot plate, temperature control carry out synchronously.Main guarded hot plate is cheated the temperature of following the tracks of back of the body guarded hot plate eventually according to the P.I.D adjusting parameter of self, realizes full automatic temperature control process.After instrument reaches thermal equilibrium state, the printing test result.
(4) semiconductor refrigerating power supply
When test specimen cold drawing temperature is set in below 5 ℃, need with semiconductor cooler and semiconductor refrigerating power supply.Adopt semiconductor cooler, power supply is relatively independent, adopts independent stabilized voltage supply, and refrigeration work consumption is not less than 1000W.
Semiconductor refrigerating power supply top gauge outfit is an observing and controlling temperature table, and the bottom gauge outfit is a reometer, the unit ampere.In order to prevent when temperature automatically controlled, the semiconductor cooler electric current changes and the interference that brings, adopts manual temperature control, promptly gives a constant refrigeration electric current.As want cooling rate fast, and can strengthen export ratio at any time, reduce export ratio more immediately.In order to prevent to thermometric interference, can only use manually to set the cold drawing temperature.
Under the not high condition of testing element precision level, circuital current (comprising control circuit) is very little to the overall accuracy influence of instrument, but in the process that improves the instrument temperature test, the high more circuital current of the precision of temperature and power test is big more to the overall precision influence of conductometer.Particularly in whole thermal conductivity measuring apparatus, refrigeration unit power is maximum, and its operation has fatal influence to the precision of instrument.Therefore in order to reduce the influence of refrigeration unit circuit to the test components and parts, the present invention independently divides refrigeration unit out, for the precision that improves thermal conductivity measuring apparatus provides a good solution.
(5) notebook computer
Measure situation for clear demonstration, show, and be convenient to the electronics file with the computing machine liquid crystal display.
(6) 220V AC voltage regulator
For guaranteeing the stability of Alternating Current Power Supply, can get rid of the fluctuation interference that some AC network is brought.
The instrument important technological parameters:
1. measurement range: sample thermal resistance 〉=0.1m
2K/w
2. hot plate temperature: 10 ℃～60 ℃
3. cold drawing temperature :-20 ℃～40 ℃
4. specimen size: 300mm * 300mm * (15～50) mm
5. supply voltage: exchange 200V ± 20V; 50HZ
6. environmental baseline: 20 ℃ ± 10 ℃; Relative humidity＜80%
7. measuring error: the medial temperature of mensuration is measured thermal property and can be accurate to≤± 2% (temperature difference is between 15 ℃～30 ℃) during near room temperature.In whole measurement ranges of device≤± 5% (the test specimen medial temperature is minimum at-5 ℃; The highest 50 ℃; The temperature difference is between 15 ℃～30 ℃).
This instrument is single test specimen formula protective heat plate device.One side of heating unit is made a constant-heat source with the liquid frid of spirality reverse flow, is controlled to be zero all the time with master, the temperature difference of protecting the heating unit surface, makes its no type of thermal communication mistake.So just guaranteed that the center metering units sets up the one dimension hot-fluid, to the accurate measurement of metering units primary heater power and the accurate measurement of hot and cold surface temperature, input specimen thickness d can record the thermal resistance of test specimen
And coefficient of heat conductivity
Wherein, R represents the test specimen thermal resistance; Δ T represents the temperature difference of test specimen cold surface and hot surface; A represents the test specimen useful area; The Q representative is by the power of test specimen useful area; D represents specimen thickness.
Requirement and installation to sample:
1. make one of 300mm * 300mm sample, thickness is greater than 15mm, less than 50mm.For hard material, the specimen surface irregularity degree, should less than thickness ± 2%.
2. when measuring compressible sample, be encased inside the pillar (as making) of four small bore low thermal conductivities at the periphery of sample, with the compression of restriction sample of bamboo chopsticks.
3. use vernier caliper, measure the thickness of sample, at least one point of every limit, four limits have been surveyed and have been averaged, as the thickness d of sample.
4. sample is installed: open the muff on the main frame, mobile cold drawing is put into sample, and near hot plate, mobile cold drawing makes sample contact with hot and cold plate with sample, and tighten leading screw one circle this moment again, and sample and hot and cold plate are combined closely.The stay-warm case that closes, sample installs.
Measure sample thickness, after finishing sample and installing, at first, open alternating current steady voltage plug,, must wait the output gauge outfit of voltage stabilizer to point to 220V because the output of alternating current steady voltage plug has time delay, could open the total power switch on main frame right side, at this moment the gauge outfit energising work of cold and heat source TT﹠C system.Their temperature displayed are respectively the water temperature in two tanks, then open the power supply of intelligent measuring apparatus and two water pumps.Look the height of the design temperature of hot and cold plate, determine the unlatching of two tunnel refrigerating circuit power supplys, be higher than environment temperature more than 5 ℃, need not open as set point temperatures; Otherwise then open; Then the thickness d of sample is imported intelligent measuring apparatus.Instrument enters the measurement state automatically, automatic heating-cooling process, and temperature automatically controlled, follow the tracks of temperature control.After observing back of the body guarded hot plate and reaching temperature controlling point, under the situation of not having refrigeration, the temperature control degree of stability should be better than ± 0.002 ℃ in; Having under the situation of refrigeration, degree of stability should be better than ± 0.005 ℃ in.When cold, back of the body guarded hot plate temperature tend towards stability, observe main heating plate and guarded hot plate temperature and the tracking situation of carrying on the back the guarded hot plate temperature again.As the temperature difference of three plates less than ± 0.002 ℃, and upper and lower fluctuation.Upper and lower fluctuation is less than ± 1% in the coefficient of heat conductivity one hour, and experiment can finish, and prints experimental result.
Be appreciated that under the prerequisite that does not deviate from inner characteristic of the present invention, the present invention also can have various deformation, be not limited in the concrete structure of above-mentioned embodiment, and should in the claim restricted portion, do the understanding of broad sense.In a word, the present invention should comprise those conspicuous to those skilled in the art conversion or substitute.
Claims (11)
1. protective heat plate method thermal conductivity measuring apparatus, it is characterized in that: comprise main part, low-temperature receiver TT﹠C system, thermal source TT﹠C system, intelligent measuring apparatus, computing machine transmission, semiconductor refrigerating power supply and stabilized voltage supply, main part is made up of hot plate, cold drawing, test specimen pressing system; Hot plate by the back of the body guarded hot plate, main heating plate, protect heating plate and form; Main hot plate is made up of primary heater and metal soaking plate, protects heating plate by protecting well heater and the metal soaking plate is formed; Cold drawing is made up of aluminium sheet, semiconductor cooler, cooling water system; The thermal source of back of the body guarded hot plate and the low-temperature receiver of cold drawing are provided, are made up of the exact constant temperature tank that two nested structures are identical, Water Tank with Temp.-controlled is made up of refrigerating circuit, tank, water pump, stirring system, heating temperature-controlling system, water temperature display etc.; The semiconductor refrigerating power supply is independent of outside main part, low-temperature receiver TT﹠C system and the thermal source TT﹠C system.
2. thermal conductivity measuring apparatus as claimed in claim 1, it is characterized in that, described cooling water system has comprised a cover Water Tank with Temp.-controlled, provide stable cooling water flow by Water Tank with Temp.-controlled, when test needed the cold drawing temperature to be set in more than 5 ℃, directly the adjusting by the Water Tank with Temp.-controlled temperature realized the temperature of cold drawing is controlled; When test needs the cold drawing temperature to be set in below 5 ℃, control the cold drawing temperature with semiconductor cooler, this moment, Water Tank with Temp.-controlled played the semiconductor cooler cooling effect.
3. thermal conductivity measuring apparatus as claimed in claim 1 or 2 is characterized in that sample to be tested is made into 300mm * 300mm, and thickness is greater than 15mm, less than 50mm, and sample thermal resistance 〉=0.1m
2K/w.
4. thermal conductivity measuring apparatus as claimed in claim 3 is characterized in that described hot plate, cold drawing are of a size of 300mm * 300mm.
5. thermal conductivity measuring apparatus as claimed in claim 3 is characterized in that, described back of the body guarded hot plate adopts the thick aluminium sheet of 40mm to be processed into.
6. thermal conductivity measuring apparatus as claimed in claim 5 is characterized in that, described back of the body guarded hot plate provides stable thermal source by the exact constant temperature tank, temperature stability is better than ± and 0.005 ℃, the liquid frid of spirality reverse flow is adopted in the thermostatted water turnover.
7. thermal conductivity measuring apparatus as claimed in claim 3 is characterized in that, described metal soaking plate adopts brass sheet to make and carries out the blacking processing, and its radiance is greater than 0.8.Flatness main, that protect soaking plate is 0.04mm, and irregularity degree is less than 0.025%.
8. thermal conductivity measuring apparatus as claimed in claim 3 is characterized in that, described master, protects well heater and adopts the corrosion of 0.1mm Hou De Opinions-Pictures Copper Foil to form, and adopts the prepreg insulation.
9. thermal conductivity measuring apparatus as claimed in claim 3 is characterized in that, described cold drawing plate face carries out oxidation processes, and the flatness of plate face is 0.04mm, and irregularity degree is less than 0.025%.
10. thermal conductivity measuring apparatus as claimed in claim 3 is characterized in that, described hot and cold plate temperature is measured and adopted 8 P
t1000 platinum sensors, 6 of hot plates, 2 of cold drawings are except selecting high-end P
tOutside 1000 platinum sensors, also alternative P
t1000 platinum resistance are screened with high-precision thermostatic oil bath is strict, and wherein the temperature resolution of oil groove reaches 0.0001 degree.
11. method of utilizing the described thermal conductivity measuring apparatus of claim 1 to measure the sample coefficient of heat conductivity, it is characterized in that may further comprise the steps: measure sample thickness, after finishing the sample installation, at first, open alternating current steady voltage plug, because the output of alternating current steady voltage plug has time delay, must wait the output gauge outfit of voltage stabilizer to point to 220V, could open the total power switch on main frame right side, the gauge outfit energising work of cold and heat source TT﹠C system at this moment, their temperature displayed are respectively the water temperature in two tanks; Then open the power supply of intelligent measuring apparatus and two water pumps, look the height of the design temperature of hot and cold plate, determine the unlatching of two tunnel refrigerating circuit power supplys, be higher than environment temperature more than 5 ℃, need not open, otherwise then open as set point temperatures; Then the thickness d of sample is imported intelligent measuring apparatus; Instrument enters the measurement state automatically, automatic heating-cooling process, and temperature automatically controlled, follow the tracks of temperature control; After observing back of the body guarded hot plate and reaching temperature controlling point, under the situation of not having refrigeration, the temperature control degree of stability should be better than ± 0.002 ℃ in; Having under the situation of refrigeration, degree of stability should be better than ± 0.005 ℃ in; When cold, back of the body guarded hot plate temperature tend towards stability, observe the tracking situation of main heating plate and guarded hot plate temperature and back of the body guarded hot plate temperature again, less than ± 0.002 ℃, upper and lower fluctuation is less than ± 1% in the coefficient of heat conductivity one hour as the temperature difference of three plates, experiment can finish, and prints experimental result.
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| CN103675017A (en) * | 2012-09-12 | 2014-03-26 | 北京中建建筑科学研究院有限公司 | Testing device and method for thermal conductivity coefficient of material |
| CN103983659A (en) * | 2014-04-25 | 2014-08-13 | 北京工业大学 | A method and a device for determining a relative coefficient of thermal conductivity of a variable physical component |
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| CN109142431A (en) * | 2018-07-19 | 2019-01-04 | 芜湖籁余新能源科技有限公司 | A kind of Guarded hot plate heat conductivity measuring device |
| CN114047223A (en) * | 2021-11-09 | 2022-02-15 | 中国航空工业集团公司北京长城计量测试技术研究所 | Two sample coefficient of heat conductivity measuring device of steady state method |
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