CN104280419A - Method for testing material heat conductivity coefficient through transient plane heat source method - Google Patents

Method for testing material heat conductivity coefficient through transient plane heat source method Download PDF

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Publication number
CN104280419A
CN104280419A CN201310270344.XA CN201310270344A CN104280419A CN 104280419 A CN104280419 A CN 104280419A CN 201310270344 A CN201310270344 A CN 201310270344A CN 104280419 A CN104280419 A CN 104280419A
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China
Prior art keywords
test
probe
coefficient
heat conductivity
bridge
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Application number
CN201310270344.XA
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Chinese (zh)
Inventor
任静
张金花
段恺
王永艳
崔新阳
朱剑飞
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北京中建建筑科学研究院有限公司
北京市建设工程质量第六检测所有限公司
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Priority to CN201310270344.XA priority Critical patent/CN104280419A/en
Publication of CN104280419A publication Critical patent/CN104280419A/en

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Abstract

The invention relates to a method for testing a material heat conductivity coefficient through a transient plane heat source method; the method is achieved through a testing device, and the testing device mainly comprises a probe, an electrical bridge testing system, and a data acquisition and analysis system; in the electrical bridge testing system, a power supply for supplying power for an electrical bridge is regulated in the range of 0-20 V, and the maximum current does not exceed 1 A. The method can measure various samples such as bulk samples, uniaxial anisotropic samples, thin sheet samples and thin film samples, and is high in control accuracy, short in detection period, and accurate in testing results.

Description

A kind of method of Adsorbent By Using Transient Plane Source Technique test material coefficient of heat conductivity
Technical field
The invention belongs to material property detection field, mainly utilize flat heat source method of testing to detect structure material coefficient of heat conductivity and thermal diffusion coefficient.Concrete grammar is, by probe placement in the middle of two samples, applies constant dc to probe, after probe heat release, sample interior produces dynamic temperature field, and detecting head surface produces temperature rise simultaneously, and resistance of now popping one's head in increases, make bridge test system Central Plains balanced bridge unbalance, produce potential change amount.By the variable quantity of record test period not electrical quantity in the same time, calculate temperature and to rise in value time dependent function.By to the matching of function curve and the coefficient of heat conductivity and the thermal diffusion coefficient that calculate sample.
Background technology
Thermal diffusion coefficient and coefficient of heat conductivity are one of main thermal physical property parameters, at present in the various method of testings set up, roughly can be summarized as steady state method and Transient Method according to its characteristics of heat transfer.
Steady state method refer to when Temperature Distribution on sample to be tested reach stable after, when namely Temperature Distribution is time-independent stable temperature field in sample, carry out the method for the coefficient of heat conductivity of Calculating material by measuring the parameters such as the heat that flows through sample and thermograde.It utilizes in steady heat transfer process, and the equilibrium condition that rate of heat transfer equals rate of heat dispation carrys out heat conducting coefficient measuring.Steady state method have clear principle, model simple, accurately can directly obtain the advantages such as thermal conductivity absolute value, and be suitable for the measurement of wider warm area; Shortcoming is that experiment condition is harsh, Measuring Time is longer; In steady state method, in order to obtain hot-fluid accurately, needing the adiabatic condition of strict guarantee test macro, setting up compensating heater and increasing Insulation, to reduce edge thermal loss; Steady state method is mainly used in the coefficient of heat conductivity measuring solid material in addition, and it can be run into very large difficulty for studying wet stock, because sample can cause the change of water capacity owing to ensureing certain temperature field for a long time, this will cause the measurement result of coefficient of heat conductivity incorrect.
Along with the development of new material, the requirement of test speed is improved greatly, and because the diversity of new material, the parameter that traditional method obtains accurately can not reflect the character of material, traditional model can not accurately reflect the process that will study, therefore widespread use Transient Method.Transient Method refers to that in experiment measuring process, specimen temperature changes in time, by measuring some the some situation of temperature variation and parameter of some other needs in sample, thus determine the method for sample coefficient of heat conductivity, its starting point analyzed is non-Steady Heat-Conduction Differential Equation of Hollow.Main Basis Adsorbent By Using Transient Plane Source Technique test of the present invention.In transient unbalanced response, the Temperature Distribution in sample is time dependent Unsteady Temperature Field, by the speed of test sample temperature variation, just can measure the thermal diffusivity of sample, thus obtain the coefficient of heat conductivity of sample.Owing to adopting the material with thermal resistance simultaneously as thermal source and temperature sensor, transient state flat heat source technology can cover larger thermal conductivity scope, thus can be applicable to various dissimilar material simultaneously.
Summary of the invention
The object of this invention is to provide one and can measure several samples as bulk sample, uniaxial anisotropy sample, chip sample, film sample, and control accuracy is high, sense cycle is short, test result accurately material thermal conductivity and thermal diffusion coefficient proving installation and realized the method for Adsorbent By Using Transient Plane Source Technique test material coefficient of heat conductivity by this device.
The object of the invention is to be achieved through the following technical solutions:
Proving installation of the present invention mainly comprises (see Fig. 1) such as probe, bridge test system, data acquisition and analytic systems;
Described probe inside is double-spiral structure, and resistance value is between 1Q-50Q, and etched by 10 (± 2) μm thick sheet metal and form, the insulation film that both sides are 7 μm-100 μm by thickness wraps up, and diameter D is between 4mm-100mm.Sheet metal selects nickel and the molybdenum of high, the good stability of temperature coefficient of resistivity; Insulation film should select polyimide, mica, aluminium nitride and aluminium oxide etc. can ignore the material of thermal capacity according to serviceability temperature.The temperature measuring equipment of probe accurately can respond to the temperature information of sample.The width of double-spiral structure spiral line source should be equal with its spacing, and probe diameter is that the double-stranded spacing between 4mm-15mm should be (0.2 ± 0.03) mm; The double-stranded spacing of other diameters probe should be (0.35 ± 0.05) mm.
During test, probe is sandwiched in the middle of two panels sample, form the structure of similar sandwich, by the direct current of constant output on probe, due to the increase of temperature, the resistance of probe changes, thus produces voltage drop at probe two ends, by being recorded in the change of voltage and current in a period of time, the hot-fluid information in probe and sample comparatively accurately can be obtained.
Described bridge test system (see Fig. 2), the power supply of electric bridge should regulate within the scope of (0-20) V, and maximum current is no more than 1A.In bridge system probe and lead-in wire and resistance Rs be in series, wherein the initial resistivity value (Ro+RL) of Rs resistance value and probe and lead-in wire thereof is close, and remains unchanged in test process.Digital voltmeter is connected between two elements, and resistance should be greater than probe resistance and Rs resistance value and 100 times, resolution should reach 6.5 numerical digits, is the integral multiple that power cycle changes.
Described data acquisition and analytic system can show, automatically gather, analyze each electrical quantity, time parameter, and m-temperature rise curve figure when can simulate, finally calculate test result, this system comprises test operation and data analysis software.Measuring sonde resistance variation with temperature in testing, determines that the thermal diffusion coefficient of sample and the computation process of coefficient of heat conductivity are completed automatically by software.Needed to cast out the data corresponding to some times before process data; thickness and the sample of casting out number a little and probe protective seam are relevant with the size of the thermal contact resistance of probe; take the circumstances into consideration to choose according to actual conditions; but the number of point can not be less than 100, to ensure the generality of thermal diffusion coefficient and coefficient of heat conductivity.To be rised in value by sample surface temperature in least square fitting measuring process the linear relationship (see Fig. 3) of time dependent function and dimensionless characteristic time function, finally draw coefficient of heat conductivity.
Accompanying drawing explanation
Fig. 1 is total system structure sketch, wherein 1-main frame (comprising bridge circuit, out-put supply, computing machine and digital voltmeter); 2-specimen mounting; 3-sample bin; 4-pops one's head in; 5-sample; 6-radiator valve
Fig. 2 is bridge test system diagram, wherein RS-resistance in series; The all-in resistance of RL-probe lead wire; R0-pops one's head in initial resistance; △ R-pops one's head in the resistance increased in testing; △ U-potential change amount; W-pot
Fig. 3 is temperature increment and linearly graph of a relation.
Embodiment
According to embodiment, the present invention is described in further detail below.
Balanced bridge: balanced bridge voltage should make system power be not more than 1mA, and after bridge balance, bridge test system digits voltage table reading is zero.
Apply thermal pulse: according to total testing time and output power, constant direct current is applied to probe, in sample, produces thermal pulse, voltage when heating initial by testing transient, divided by bridge system all-in resistance (i.e. R s+ R l+ R o), obtain now by the electric current I 0 of probe, and in this test process, pot sliding contact should not adjust.
Gather unbalance voltage: in total testing time, record unbalance voltage, i.e. potential change amount △ U with reasonable time interval scan, and times of collection should be greater than 100 times.

Claims (7)

1. the method for an Adsorbent By Using Transient Plane Source Technique test material coefficient of heat conductivity, it realizes the method by proving installation, this proving installation mainly comprises probe, bridge test system, data acquisition and analytic system, it is characterized in that, in described bridge test system, the power supply of electric bridge regulates within the scope of 0-20V, and maximum current is no more than 1A.
2. the method for Adsorbent By Using Transient Plane Source Technique test material coefficient of heat conductivity according to claim 1, it is characterized in that, in bridge test system, probe and lead-in wire and resistance Rs be in series, wherein the initial resistivity value Ro+RL of Rs resistance value and probe and lead-in wire thereof is close, and remains unchanged in test process, digital voltmeter is connected between two elements, and resistance be greater than probe resistance and Rs resistance value and 100 times, resolution reaches 6.5 numerical digits, is the integral multiple that power cycle changes.
3. the method for Adsorbent By Using Transient Plane Source Technique test material coefficient of heat conductivity according to claim 1, it is characterized in that, probe inside is double-spiral structure, resistance value is between 1Q-50Q, etched by 10 (± 2) μm thick sheet metal and form, the insulation film that both sides are 7 μm-100 μm by thickness wraps up, and diameter D is between 4mm-100mm.
4. the method for Adsorbent By Using Transient Plane Source Technique test material coefficient of heat conductivity according to claim 1, it is characterized in that, described data acquisition and analytic system can show, automatically gather, analyze each electrical quantity, time parameter, and m-temperature rise curve figure when can simulate, final calculating test result, this system comprises test operation and data analysis software.
5. the method for Adsorbent By Using Transient Plane Source Technique test material coefficient of heat conductivity according to claim 1, it is characterized in that, balanced bridge voltage makes system power be not more than 1mA, and after bridge balance, bridge test system digits voltage table reading is zero.
6. the method for Adsorbent By Using Transient Plane Source Technique test material coefficient of heat conductivity according to claim 1, it is characterized in that, according to total testing time and output power, constant direct current is applied to probe, thermal pulse is produced, voltage when heating initial by testing transient, divided by bridge system all-in resistance (i.e. RS+RL+RO) in test sample, obtain now by the electric current 10 of probe, and in this test process, pot sliding contact should not adjust.
7. the method for Adsorbent By Using Transient Plane Source Technique test material coefficient of heat conductivity according to claim 1, it is characterized in that, in total testing time, data acquisition and analytic system are with reasonable time interval scan and record unbalance voltage, i.e. potential change amount △ U, and times of collection is greater than 100 times.
CN201310270344.XA 2013-07-01 2013-07-01 Method for testing material heat conductivity coefficient through transient plane heat source method CN104280419A (en)

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Cited By (7)

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CN104749212A (en) * 2015-03-25 2015-07-01 广东博威尔电子科技有限公司 Automatic tester based on FPGA (Field Programmable Gate Array) for thermoelectric material
CN105738408A (en) * 2016-01-29 2016-07-06 青岛理工大学 Method for quickly measuring heat conductivity coefficient of semiconductor film
CN104749214B (en) * 2015-04-03 2017-06-06 哈尔滨工业大学 A kind of constant temperature hot bath device that liquid thermal conductivity factor is measured based on Adsorbent By Using Transient Plane Source Technique
CN107192734A (en) * 2017-01-22 2017-09-22 东南大学 The sensor and its test device of a kind of utilization Adsorbent By Using Transient Plane Source Technique test rock mass thermal conductivity
WO2019136885A1 (en) * 2018-01-09 2019-07-18 中国计量大学 Steady-state test method for heat-conducting property in the direction along plane of sheet material
CN111044558A (en) * 2018-10-12 2020-04-21 天津大学 High-temperature probe and preparation method and application thereof
CN111443106A (en) * 2020-05-15 2020-07-24 中南大学 Method and system for testing equivalent thermal conductivity coefficient of heterogeneous material

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CN101788513A (en) * 2010-03-25 2010-07-28 上海海洋大学 Measurement device of thermal conductivity of materials and method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104749212A (en) * 2015-03-25 2015-07-01 广东博威尔电子科技有限公司 Automatic tester based on FPGA (Field Programmable Gate Array) for thermoelectric material
CN104749214B (en) * 2015-04-03 2017-06-06 哈尔滨工业大学 A kind of constant temperature hot bath device that liquid thermal conductivity factor is measured based on Adsorbent By Using Transient Plane Source Technique
CN105738408A (en) * 2016-01-29 2016-07-06 青岛理工大学 Method for quickly measuring heat conductivity coefficient of semiconductor film
CN107192734A (en) * 2017-01-22 2017-09-22 东南大学 The sensor and its test device of a kind of utilization Adsorbent By Using Transient Plane Source Technique test rock mass thermal conductivity
WO2019136885A1 (en) * 2018-01-09 2019-07-18 中国计量大学 Steady-state test method for heat-conducting property in the direction along plane of sheet material
CN111044558A (en) * 2018-10-12 2020-04-21 天津大学 High-temperature probe and preparation method and application thereof
CN111044558B (en) * 2018-10-12 2020-09-29 天津大学 High-temperature probe and preparation method and application thereof
CN111443106A (en) * 2020-05-15 2020-07-24 中南大学 Method and system for testing equivalent thermal conductivity coefficient of heterogeneous material

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Application publication date: 20150114