CN104020188A - Unfavorable conductor heat conduction coefficient measuring device and unfavorable conductor heat condution coefficient measuring method - Google Patents
Unfavorable conductor heat conduction coefficient measuring device and unfavorable conductor heat condution coefficient measuring method Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000004020 conductor Substances 0.000 title claims abstract description 32
- 238000010438 heat treatment Methods 0.000 claims abstract description 53
- 239000000463 material Substances 0.000 claims abstract description 50
- 238000007781 pre-processing Methods 0.000 claims abstract description 14
- 238000012545 processing Methods 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims description 93
- 238000009529 body temperature measurement Methods 0.000 claims description 10
- 238000005259 measurement Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 6
- 238000012360 testing method Methods 0.000 abstract description 14
- 238000002474 experimental method Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Abstract
The invention discloses an unfavorable conductor heat conduction coefficient measuring device and an unfavorable conductor heat conduction coefficient measuring method. The measuring device comprises a heating disc (5), a heat radiating disc (6), temperature sensors (1/2), a signal preprocessing unit (3) and a data processing unit (4), wherein a to-be-measured material (7) is arranged between the heating disc (5) and the heat radiating disc (6), the heating disc 5 is arranged on the upper part of the to-be-measured material 7, the heat radiating disc 6 is arranged on the lower part of the to-be-measured material 7, the temperature sensor (1) and the temperature sensor (2) are respectively arranged in small holes in the heating disc (5) and the heat radiating disc (6), the two temperature sensors are respectively connected with the signal preprocessing unit (3), and the signal preprocessing unit (3) is connected with the data processing unit. By combining a humanized interface and a programmable measure-control module, the unfavorable conductor heat conduction coefficient can be accurately measured and controlled through a special measuring method, the whole test process is displayed in a digital display way and in a curve manner, the test data and experiment result in the test process are automatically stored. The unfavorable conductor heat conduction coefficient measuring device has the advantages of simplicity and rapidness in application and high accuracy.
Description
Technical Field
The present invention relates to a thermal conductivity measuring device and a measuring method thereof, and more particularly, to a thermal conductivity measuring device and a measuring method thereof for poor conductors.
Background
Thermal conductivity is a physical quantity that characterizes the thermal conductivity properties of a substance, and is related to the composition and structure of the material and generally needs to be determined accurately by experimental methods. The measurement of the heat conductivity coefficient of a poor conductor by a steady state method is a common test method in the test of the heat conductivity of materials in the actual engineering and the experimental teaching of colleges and universities. However, the traditional thermal conductivity measuring instrument needs to continuously measure the output voltage of the temperature sensor, the recording time is long, the workload is large, the repetitive work is more, and the working efficiency and the learning interest of students are influenced. Especially, the temperature rise and the time are not easy to be synchronously and accurately measured by manually recording and processing data, so that a larger method error is generated, and therefore, the traditional measuring means needs to be improved.
Disclosure of Invention
In order to overcome the defects in the prior art, one of the purposes of the invention is to provide a measuring device and a measuring method for the thermal conductivity of a poor conductor, which can accurately measure and control the thermal conductivity of the poor conductor by combining a human-based interface with a programmable measurement and control module through a special measuring method, display the whole test process in a digital display and curve mode, automatically store test data and test results of the test process, and have the advantages of simple and fast use and high accuracy.
In order to achieve the above and other purposes, the invention provides a measuring device for the heat conductivity of a poor conductor, which comprises a heating plate (5), a heat dissipation plate (6), a temperature measurement sensor (1/2), a signal preprocessing unit (3) and a data processing unit (4), wherein a material to be measured is arranged between the heating plate (7) and the heat dissipation plate (6), the heating plate (5) is arranged at the upper part of the material to be measured (7), the heat dissipation plate (6) is arranged at the lower part of the material to be measured (7), the temperature measurement sensor (1) and the temperature measurement sensor (2) are respectively arranged in small holes of the heating plate (5) and the heat dissipation plate (6), the two temperature measurement sensors are respectively connected with the signal preprocessing unit (3), and the signal preprocessing unit (3) is connected with the data processing.
Further, the material (7) to be measured is processed into a circular sheet with the same diameter as the heating disc (5) and the heat dissipation disc (6).
Furthermore, the heating plate (5) adopts PID automatic temperature control, and during measurement, a PID temperature control meter can enable the temperature of the heating plate to automatically reach a set value.
In order to achieve the above object, the present invention further provides a method for measuring thermal conductivity of a poor conductor, comprising the steps of:
measuring and obtaining parameters of a material to be measured, a heat dissipation plate and a heating plate;
step two, installing a material to be measured, a heating disc and a heat dissipation disc, arranging the material to be measured between the heating disc and the heat dissipation disc, respectively arranging two temperature measurement sensors in small holes of the heating disc and the heat dissipation disc, and enabling the temperature measurement sensors to be in good contact with the material to be measured;
setting the constant temperature of the heating plate, and recording the temperature theta of the upper surface and the lower surface of the material to be measured when the heat transfer reaches a stable state1And theta2；
Removing the material to be tested, heating the heat dissipation plate, and when the temperature of the heat dissipation plate is higher than the temperature theta of the lower surface of the material to be tested2When the temperature is higher than a plurality of degrees centigrade, the heating disc is removed, all the surfaces of the heat dissipation disc are exposed in the air, the heat dissipation disc is naturally cooled, the temperature of the heat dissipation disc is collected every n seconds until the temperature is reduced to the lower surface temperature theta of the material to be measured2The following temperature values are used as a theta-t cooling rate curve of the heat dissipation plate, and the curve is in theta2The slope of (A) is the steady state temperature theta of the heat-dissipating plate2The rate of heat dissipation at;
step five, according to the steady-state temperature theta of the heat dissipation disc2The heat dissipation rate of the sample is calculated by using a heat conductivity coefficient calculation formula to obtain the heat conductivity coefficient lambda of the sample.
Further, in the step one, the measured parameter includes the thickness h of the material to be measured0And the diameter D, the thickness h and the radius R of the heat dissipation disc and the mass m of the heat dissipation disc.
Further, in the fourth step, the material to be tested is removed, the heat dissipation plate is heated, and when the temperature of the heat dissipation plate is higher than the temperature theta of the lower surface of the material to be tested2When the temperature is higher than about 10 ℃, the heating disc is removed, all the surfaces of the heat dissipation disc are exposed to the air, the heat dissipation disc is naturally cooled, and the temperature of the heat dissipation disc is collected every 30 seconds until the temperature is reduced to theta2The following 10 ℃ value is taken as the theta-t cooling rate curve of the heat dissipation plate, and the curve is at theta2The slope of (A) is the steady state temperature theta of the heat-dissipating plate2The rate of heat dissipation.
Further, in the third step, the stable state is when the temperatures of the upper and lower surfaces of the material to be measured are not changed.
Further, the heat conductivity coefficient calculation formula is:
wherein，For the heat-dissipating disc at steady-state temperature theta2Heat dissipation rate of (h)0The thickness of the material to be measured, D the diameter of the material to be measured, h and R the thickness and radius of the heat dissipation plate, m the mass of the heat dissipation plate, and c the specific heat capacity of the heat dissipation plate.
Compared with the prior art, the device and the method for measuring the heat conductivity coefficient of the poor conductor have the advantages that the material to be measured is arranged between the heating plate and the heat dissipation plate, the two temperature measurement sensors are arranged in the small holes of the heating plate and the heat dissipation plate, the two temperature measurement sensors are respectively connected with the signal preprocessing unit 3 through the conducting wires, the signal preprocessing unit 3 is connected with the data processing unit 4 through the cable, the heat conductivity coefficient of the poor conductor is accurately measured and controlled by combining the human interface and the programmable measurement and control module through a special measuring method, the whole test process of the test is displayed in a digital display and curve mode, and the test data and the test result of the test process are automatically stored.
Drawings
FIG. 1 is a schematic diagram of a steady state method for measuring thermal conductivity;
FIG. 2 is a schematic structural diagram of a poor conductor thermal conductivity measurement apparatus according to the present invention;
FIG. 3 is a diagram illustrating an example of a poor conductor thermal conductivity measurement apparatus according to the present invention;
FIG. 4 is a flowchart illustrating the steps of a method for measuring the thermal conductivity of a poor conductor according to the present invention.
Detailed Description
Other advantages and capabilities of the present invention will be readily apparent to those skilled in the art from the present disclosure by describing the embodiments of the present invention with specific embodiments thereof in conjunction with the accompanying drawings. The invention is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the spirit and scope of the present invention.
Before the present invention is introduced, the steady state method for measuring the thermal conductivity is briefly introduced:
in 1898, c.h.lees first measured the thermal conductivity of poor conductors using the plate method. In the experiment, the sample is made into a flat plate shape, the upper end face of the sample is fully contacted with a stable uniform heating body, and the lower end face of the sample is contacted with a uniform heat radiation body. Because the side area of flat sample is much less than the flat area, can think that the heat only transmits along upper and lower direction is perpendicular, and the heat that transversely is dispelled by the side can be ignored, can think that only has temperature gradient in the sample on the direction of perpendicular sample plane, and in the coplanar, everywhere temperature is the same.
When the steady state is set, the temperatures of the upper and lower planes of the sample are respectively theta1、θ2The heat Δ Q through the sample over time Δ t, according to the fourier transfer equation, is:
where λ is the thermal conductivity of the sample, h0Is the thickness of the sample, S is the planar area of the sample, and the sample is disc-shaped in the experiment and has a diameter D.
FIG. 1 is a schematic diagram of the measurement of thermal conductivity by the steady state method, when the heat transfer reaches the steady state, the theta of the upper and lower surfaces of the sample1And theta2In this case, the heat flow transferred by the heating plate through the sample is considered to be equal to the heat dissipation amount of the heat dissipation plate to the surrounding environment. Therefore, the temperature can be stabilized at the stable temperature theta by the heat dissipation plate2Heat flow is obtained from the heat dissipation rateWherein m is the mass of the heat dissipation plate, and c is the specific heat capacity of the heat dissipation plate.
In reaching steady state, the top surface of the plate is not exposed to air, and the cooling rate of the object is proportional to its heat dissipation surface area, so the expression for the heat dissipation rate of the plate at steady state should be area corrected:
wherein R is the radius of the heat dissipation disc, and h is the thickness of the heat dissipation disc.
The thermal conductivity of the sample obtained by the above two formulas (1) and (2) is:
fig. 2 is a schematic structural diagram of a device for measuring thermal conductivity of a poor conductor according to the present invention. As shown in fig. 2, the present invention provides a device for measuring thermal conductivity of a poor conductor, comprising: heating plate 5, heat dissipation plate 6, temperature sensor 1/2, signal preprocessing unit 3 and data processing unit 4.
Preferably, the material 7 to be detected is processed into a circular sheet with the same diameter as the heating disc 5 and the heat dissipation disc 6, the heating disc 5 can be an upper copper disc which is heated to a set temperature by a heating device and automatically keeps constant temperature, and the heat dissipation disc dissipates heat by a lower copper disc; the temperature measuring sensors 1 and 2 are respectively arranged in the small holes of the heating plate 5 and the radiating plate 6, the two temperature measuring sensors are respectively connected with the signal preprocessing unit 3 through leads, and the signal preprocessing unit 3 is connected with the data processing unit 4 through a cable. FIG. 3 is a diagram illustrating an example of a thermal conductivity measuring apparatus for poor conductors according to the present invention. In a preferred embodiment of the present invention, the measuring device for measuring the thermal conductivity of the poor conductor is disposed on a testing jig.
FIG. 4 is a flowchart illustrating the steps of a method for measuring the thermal conductivity of a poor conductor according to the present invention. As shown in fig. 3, the method for measuring the thermal conductivity of a poor conductor of the present invention comprises the following steps:
step 401, measuring and obtaining parameters of the material to be measured, the heat dissipation plate and the heating plate, including the thickness h of the material to be measured0Diameter D, thickness h and radius R of the heat dissipation disc, and mass m of the heat dissipation disc, specifically, measuring thickness h of the material to be measured by using a vernier0And the diameter D, the thickness h and the radius R of the heat dissipation disc, and the mass m of the heat dissipation disc is weighed by a balance.
Step 402, installing the material to be measured, the heating plate and the heat dissipation plate, placing the material to be measured between the heating plate and the heat dissipation plate, placing the two temperature sensors in the small holes of the heating plate and the heat dissipation plate, and enabling the temperature sensor 1/2 to be in good contact with the material to be measured.
Step 403, setting the constant temperature of the heating plate, in the preferred embodiment of the present invention, the heating plate adopts PID automatic temperature control, the heating plate PID automatic temperature control, and the PID temperature control meter will make the temperature of the heating plate automatically reach the set value. Theta on the upper and lower surfaces of the sample (material to be measured) when the heat transfer reaches a steady state1And theta2Without change, the computer prompts "Heat transfer to Steady State" and records θ1And theta2The value is obtained.
Step 404, removing the sample, heating the heat dissipation plate, and when the temperature of the heat dissipation plate is higher than the temperature theta of the lower surface of the sample2When the temperature is higher than about 10 ℃, the heating disc is removed, all surfaces of the heat dissipation disc are exposed to the air, the heat dissipation disc is naturally cooled, and the computer (data processing unit) collects the temperature of the heat dissipation disc once every 30 seconds until the temperature is reduced to theta2The following 10 ℃ values. Drawing a curve of the cooling rate theta-t of the copper plate2The slope of the copper plate is the steady-state temperature theta of the copper plate2The rate of heat dissipation.
Step 405, according to the steady state temperature theta of the heat dissipation plate2The heat dissipation rate, the thickness, the radius, the mass and other parameters of the heat dissipation disc and the sample disc are calculated by utilizing a heat conductivity coefficient calculation formula to calculate the heat conductivity coefficient lambda of the sample. Wherein, the heat conductivity coefficient calculation formula is as follows:
wherein,for the heat-dissipating disc at steady-state temperature theta2The rate of heat dissipation.
In conclusion, the device and the method for measuring the heat conductivity coefficient of the poor conductor can be used in various field environments, are simple, convenient and quick to use and have high accuracy.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Therefore, the scope of the invention should be determined from the following claims.
Claims (8)
1. The utility model provides a bad conductor coefficient of heat conductivity measuring device which characterized in that: this measuring device includes heating plate (5), heat dissipation dish (6), temperature sensor (1/2), signal preprocessing unit (3) and data processing unit (4), the material to be measured is put (7) between heating plate 5 and the heat dissipation dish 6, heating plate 5 sets up in the material 7 upper portion that awaits measuring, heat dissipation dish 6 sets up in the material 7 lower part that awaits measuring, in the aperture of heating plate (5) and heat dissipation dish (6) is arranged respectively in temperature sensor (1) and temperature sensor (2), two temperature sensor are connected with signal preprocessing unit (3) respectively, signal preprocessing unit (3) link to each other with data processing unit (4).
2. The apparatus of claim 1, wherein the thermal conductivity of the poor conductor is measured by: the material (7) to be measured is processed into a circular sheet with the same diameter as the heating disc (5) and the heat dissipation disc (6).
3. The apparatus of claim 3, wherein the heat conductivity of the poor conductor is measured by: the heating plate (5) adopts PID automatic temperature control, and during measurement, the PID temperature control meter can enable the temperature of the heating plate to automatically reach a set value.
4. A method for measuring the thermal conductivity of a poor conductor comprises the following steps:
measuring and obtaining parameters of a material to be measured, a heat dissipation plate and a heating plate;
step two, installing a material to be measured, a heating disc and a heat dissipation disc, arranging the material to be measured between the heating disc and the heat dissipation disc, respectively arranging two temperature measurement sensors in small holes of the heating disc and the heat dissipation disc, and enabling the temperature measurement sensors to be in good contact with the material to be measured;
setting the constant temperature of the heating plate, and recording the temperature theta of the upper surface and the lower surface of the material to be measured when the heat transfer reaches a stable state1And theta2；
Removing the material to be tested, heating the heat dissipation plate, and when the temperature of the heat dissipation plate is higher than the temperature theta of the lower surface of the material to be tested2When the temperature is higher than a plurality of degrees centigrade, the heating disc is removed, all the surfaces of the heat dissipation disc are exposed in the air, the heat dissipation disc is naturally cooled, the temperature of the heat dissipation disc is collected every n seconds until the temperature is reduced to the lower surface temperature theta of the material to be measured2The following temperature values are used as a theta-t cooling rate curve of the heat dissipation plate, and the curve is in theta2The slope of (A) is the steady state temperature theta of the heat-dissipating plate2The rate of heat dissipation at;
step five, according to the steady-state temperature theta of the heat dissipation disc2The heat dissipation rate of the sample is calculated by using a heat conductivity coefficient calculation formula to obtain the heat conductivity coefficient lambda of the sample.
5. The method of claim 4, wherein the method further comprises: in step one, the measured parameter includes the thickness h of the material to be measured0And the diameter D, the thickness h and the radius R of the heat dissipation disc and the mass m of the heat dissipation disc.
6. The method of claim 5, wherein the step of measuring the thermal conductivity of the poor conductor comprises: in the fourth step, the material to be tested is removed, the heat dissipation plate is heated, and when the temperature of the heat dissipation plate is higher than the temperature theta of the lower surface of the material to be tested2When the temperature is higher than about 10 ℃, the heating disc is removed, all the surfaces of the heat dissipation disc are exposed to the air, the heat dissipation disc is naturally cooled, and the temperature of the heat dissipation disc is collected every 30 seconds until the temperature is reduced to theta2The following 10 ℃ value is taken as the theta-t cooling rate curve of the heat dissipation plate, and the curve is at theta2The slope of (A) is the steady state temperature theta of the heat-dissipating plate2The rate of heat dissipation.
7. The method of claim 6, wherein the step of measuring the thermal conductivity of the poor conductor comprises: in the third step, the stable state is when the temperatures of the upper and lower surfaces of the material to be tested are not changed.
8. The method of claim 4, wherein the thermal conductivity is calculated by the following formula:
wherein,for the heat-dissipating disc at steady-state temperature theta2Heat dissipation rate of (h)0The thickness of the material to be measured, D the diameter of the material to be measured, h and R the thickness and radius of the heat dissipation plate, m the mass of the heat dissipation plate, and c the specific heat capacity of the heat dissipation plate.
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| CN201410273409.0A CN104020188A (en) | 2014-06-18 | 2014-06-18 | Unfavorable conductor heat conduction coefficient measuring device and unfavorable conductor heat condution coefficient measuring method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105136844A (en) * | 2015-07-22 | 2015-12-09 | 上海理工大学 | Heat conductivity coefficient measurement apparatus and measurement method thereof |
| CN108872306A (en) * | 2018-07-23 | 2018-11-23 | 内蒙古科技大学 | A kind of solar energy measurement material thermal conductivity experiment instrument and its measurement method |
| CN110988027A (en) * | 2019-12-17 | 2020-04-10 | 中国石油大学(北京) | Testing device and testing method for shale heat conduction parameters |
| CN111595901A (en) * | 2020-06-10 | 2020-08-28 | 北京科技大学 | Device and method for measuring heat conductivity coefficient of refractory material |
| CN113484362A (en) * | 2021-08-30 | 2021-10-08 | 清华大学 | Method for correcting heat transfer area of heat conductivity coefficient tester |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105136844A (en) * | 2015-07-22 | 2015-12-09 | 上海理工大学 | Heat conductivity coefficient measurement apparatus and measurement method thereof |
| CN105136844B (en) * | 2015-07-22 | 2017-09-12 | 上海理工大学 | Heat conductivity measuring device and its measuring method |
| CN108872306A (en) * | 2018-07-23 | 2018-11-23 | 内蒙古科技大学 | A kind of solar energy measurement material thermal conductivity experiment instrument and its measurement method |
| CN108872306B (en) * | 2018-07-23 | 2020-08-11 | 内蒙古科技大学 | Experimental instrument for measuring material heat conductivity coefficient by solar energy and measuring method thereof |
| CN110988027A (en) * | 2019-12-17 | 2020-04-10 | 中国石油大学(北京) | Testing device and testing method for shale heat conduction parameters |
| CN111595901A (en) * | 2020-06-10 | 2020-08-28 | 北京科技大学 | Device and method for measuring heat conductivity coefficient of refractory material |
| CN113484362A (en) * | 2021-08-30 | 2021-10-08 | 清华大学 | Method for correcting heat transfer area of heat conductivity coefficient tester |
| CN113484362B (en) * | 2021-08-30 | 2021-11-09 | 清华大学 | Method for correcting heat transfer area of heat conductivity coefficient tester |
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Application publication date: 20140903 |